D1912HKPC 20121204-S00003 No.A2162-1/11
http://onsemi.com
Semiconductor Components Industries, LLC, 2013
August, 2013 Ver1.0.1
LC717A10AJ
Overview
The LC717A10AJ is a high-performance and low-cost capacitance-digital-converter LSI for electrostatic capacitive
touch sensor, especially focused on usability.
It has 16 channels capacitance-sensor input. This makes it ideal for use in the products that need many switches.
Since the calibration function and the judgment of ON/OFF are automatically performed in LSI internal, it can make
development time more short. A detection result (ON/OFF) for each input can be read out by the serial interface (I2C
compatible bus or SPI).
Also, measurement value of each input can be read out as 8-bit digital data. Moreover, gain and other parameters can
be adjusted using serial interface.
Features
Detection system: Differential capacitance detection (Mutual capacitance type)
Input capacitance resolution: Can detect capacitance changes in the femto Farad order
Measurement interval (16 differential inputs): 30ms (Typ) (at initial configuration),
6ms (Typ) (at minimum interval configuration)
External components for measurement: Not required
Interface: I2C * compatible bus or SPI selectable.
Current consumption: 570μA (Typ) (VDD = 2.8V), 1.3mA (Typ) (VDD = 5.5V)
Supply voltage: 2.6V to 5.5V
Detection operations: Switch
Packages: SSOP30
Ordering number : ENA2162
CMOS LSI
Capacitance-Digital-Converter LSI
for Electrostatic Capacitive Touch
Sensors
* I2C Bus is a trademark of Philips Corporation.
LC717A10AJ
No.A2162-2/11
Specifications
Absolute Maximum Ratings at Ta = +25°C
Parameter Symbol Ratings (VSS = 0V) Unit Remarks
Supply voltage VDD -0.3 to +6.5 V
Input voltage VIN -0.3 to VDD+0.3 V *1
Output voltage VOUT -0.3 to VDD+0.3 V *2
Power dissipation Pd max 160 mW Ta = +105°C,
Mounted on a substrate *3
Storage temperature Tstg -55 to +125 °C
*1) Apply to Cin0 to 15, Cref, CrefAdd, nRST, SCL, SDA, SA0, SA1, SCK, SI, nCS
*2) Apply to Cdrv, SDA, SO, INTOUT
*3) Single-layer glass epoxy board (76.1×114.3×1.6t mm)
Recommended Operating Conditions
Parameter Symbol Conditions min typ max Unit Remarks
Operating supply voltage VDD 2.6 5.5 V
Supply ripple + noise Vpp ±20 mV *1
Operating temperature Topr -40 25 105 °C
*1) We recommend connecting large and small capacitance between VDD and VSS.
In this case, the small capacitance is equal to or more than 0.1μF, and layout nearby LSI.
Electrical Characteristics at VSS = 0V, VDD = 2.6 to 5.5V, Ta = -40 to +105°C
* Unless otherwise specified, the Cdrv drive frequency is fCDRV = 143kHz.
* Not tested at low temperature before shipment.
Parameter Symbol Conditions min typ max Unit Remarks
Capacitance detection resolution N 8 bit
Output nois e RM S NRMS minimum gain setting ±1.0 LSB *1 *3
Input offset capacitance
adjustment range CoffRANGE ±8.0 pF *1 *3
Input offset capacitance
adjustment resolution CoffRESO 8 bit
Cin offset drift CinDRIFT minimum gain setting ±8 LSB *1
Cin detection sensitivity CinSENSE minimum gain setting 0.04 0.12 LSB/fF *2
Cin pin leak current ICin Cin = Hi-Z ±25 ±500 nA
Cin allowable parasitic input
capacitance CinSUB Cin against VSS 30 pF *1 *3
Cdrv drive frequency fCDRV 100 143 186 kHz
Cdrv pin leak current ICDRV Cdrv = Hi-Z ±25 ±500 nA
nRST minimum pulse width tNRST 1 μs *1
Power-on reset time tPOR 20 ms *1
Power-on reset operation
condition: Hold time tPOROP 10 ms *1
Power-on reset operation
condition: Input voltage VPOROP 0.1 V *1
Power-on reset operation
condition: Power supply rise rate tVDD 0V to VDD 1 V/ms *1
Continued to the next page.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
C onditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
LC717A10AJ
No.A2162-3/11
Continued from the previous page.
Parameter Symbol Conditions min typ max Unit Remarks
VIH High input 0.8VDD Pin input voltage
VIL Low input 0.2VDD V *1 *4
VOH High output
(IOH = +3mA ) 0.8VDD
Pin output voltage
VOL Low output
(IOL = -3mA) 0.2VDD V *5
SDA pin output voltage VOL I2C SDA Low output
(IOL = -3mA) 0.4 V
Pin leak current ILEAK ±1 μA *6
When initial setting and
non-touch
VDD = 2.8V 570 700 μA *1 *3
IDD
When initial setting and
non-touch
VDD = 5.5V 1.3 1.6 mA *1 *3
Current consumption
ISTBY During Sleep process 1 μA *3
*1) Design guarantee values (not tested before shipment)
*2) Measurements conducted using the test mode in the LSI
*3) Ta = +25°C
*4) Apply to nRST, SCL, SDA, SA0, SA1, SCK, SI, nCS
*5) Apply to Cdrv, SO, INTOUT
*6) Apply to nRST, SCL, SDA, SA0, SA1, SCK, SI, nCS
LC717A10AJ
No.A2162-4/11
I2C Compatible Bus Timing Characteristics at VSS = 0, VDD = 2.6 to 5.5V, Ta = -40 to +105°C
*Not tested at low temperature before shipment
Parameter Symbol Pin Name Conditions min typ max Unit Remarks
SCL clock frequency fSCL SCL 400 kHz
START condition hold time tHD;STA SCL
SDA 0.6 μs
SCL clock low period tLOW SCL 1.3 μs
SCL clock high period tHIGH SCL 0.6 μs
Repeated START condition
setup time tSU;STA SCL
SDA 0.6 μs *1
Data hold time tHD;DAT SCL
SDA 00.9 μs
Data setup time tSU;DAT SCL
SDA 100 μs *1
SDA, SCL rise/fall time tr / tf SCL
SDA 300 μs *1
STOP condition setup time tSU;STO SCL
SDA 0.6 μs
STOP-to-START bus release
time tBUF SCL
SDA 1.3 μs *1
*1) Design guarantee values (not tested before shipment)
SPI Bus Timing Characteristics at VSS = 0, VDD = 2.6 to 5.5V, Ta = -40 to +105°C
*Not tested at low temperature before shipment
Parameter Symbol Pin Name Conditions min typ max Unit Remarks
SCK clock frequency fSCK SCK 5 MHz
SCK clock Low time tLOW SCK 90 ns *1
SCK clock High time tHIGH SCK 90 ns *1
Input signal rise/fall time tr / tf nCS
SCK
SI
300 ns *1
nCS setup time tSU;NCS nCS
SCK 90 ns *1
SCK clock setup time tSU;SCK nCS
SCK 90 ns *1
Data setup time tSU;SI SCK
SI 20 ns *1
Data hold time tHD;SI SCK
SI 30 ns *1
nCS hold time tHD;NCS nCS
SCK 90 ns *1
SCK clock hold time tHD;SCK nCS
SCK 90 ns *1
nCS standby pulse width tCPH nCS 90 ns *1
Output high impedance time
from nCS tCHZ nCS
SO 80 ns *1
Output data determination time tv SCK
SO 80 ns *1
Output data hold time tHD;SO SCK
SO 0 ns *1
Output low impedance time
from SCK clock tCLZ SCK
SO 0 ns *1
*1) Design guarantee values (not tested before shipment)
LC717A10AJ
No.A2162-5/11
Power-on Reset (POR)
When power is turned on, power-on reset is enabled inside the LSI and its state is released after a certain power-on reset
time, tPOR. Power-on Reset operation condition; Power supply rise rate tVDD must be at least 1V/ms.
Since INTOUT pin changes from “High” to “Low” at the same time as the released of power-on reset, it is possible to
verify the timing of release of power-on reset externally.
During power-on reset, Cin, Cref and CrefAdd are unknown.
fig.1
I2C Compatible Bus Data Timing
fig.2
I2C Compatible Bus Communication Formats
Write format (data can be written into sequentially incremented addresses)
START Slave Addres s
Write=L
Register Ad dres s ( N )ACK ACK
Data written to Register Address (N)
ACK
Data written to Register Address (N+1)
ACK STOP
Slave Slave Slave Slave
fig.3
Read format (data can be read from sequentially incremented addresses)
START Slave Address
Write=L
Register A ddr ess ( N)ACK ACK
Data read from Register Address (N)
ACK
RESTART
Slave Address
Read=H
ACK
Data read from Regi ster Address (N+1)
ACK
Data read from Register Address (N+2)
NACK
STOP
Slave
Slave
Slave
Master Master
Master
fig.4
SDA
SCL
START
condition
tHD;STA
tLOW
tHI
G
H
tr
repeated START
condition STOP
condition
10%
tf
90% 10% 10%
90% 90%
tHD;DTA tSU;DTA
10% 10%
10%
90%
tSU;STA
90% 90%
tHD;STA
90%
10%
90%
10%
90%
10%
tSU;STO tBUF
START
condition
90%
POR
(LSI internal signal) RELEASE
tP
O
R
VDD
RESET
tVDD
INTOUT
VP
O
R
O
P
Cin,
Cref,
CrefAdd UNKNOWN
VALID
tP
O
R
O
P
UNKNOWN
UNKNOWN
UNKNOWN RESET RELEASE
tP
O
R
VALID
LC717A10AJ
No.A2162-6/11
I2C Compatible Bus Slave Address
Selection of two kinds of addresses is possible through the SA0 and SA1 terminals.
SA1 input SA0 input 7bit slave address Binary notation 8bit slave address
00101100b (Write) 0x2C Low Low 0x16
00101101b (Read) 0x2D
00101110b (Write) 0x2E Low High 0x17
00101111b (Read) 0x2F
00110000b (Write) 0x30 High Low 0x18
00110001b (Read) 0x31
00110010b (Write) 0x32 High High 0x19
00110011b (Read) 0x33
SPI Data Timing (SPI Mode 0 / Mode 3)
fig.5
SPI Communication Formats (Example of Mode 0)
Write format (data can be written into sequentially incremented addresses with preserving nCS = L)
nCS
SCK
SI
SO
76543210
Hi-Z Register Address(N)
Data written to Register Address(N) Data written to Register Address(N+1)
Write=L 7654321076543210
fig.6
Read format (data can be read from sequentially incremented addresses with preserving nCS = L)
Register Address(N)
Data read from Register Address(N) Data read from Register Address(N+1)
7
Read=H
76543210
Hi-Z
nCS
SCK
SI
SO 7654321076543210
fig.7
nCS
SCK
SI
SO
tSU;SI
VALID
Hi-Z
tr
tHD;SI
tSU;SCK tSU;NCS tHIGH t
LOW tf
tCPH
tHD;NCS tHD;SCK
tCLZ tHD;SO tCHZ
VALID
tV
LC717A10AJ
No.A2162-7/11
Package Dimensions [LC717A10AJ]
unit : mm (typ)
3421
Pin Assignment
Pin No. Pin Name Pin No. Pin Name
1 VDD 16 Cref
2 VSS 17 CrefAdd
3 Non Connect *1 18 Cdrv
4 Cin4 19 INTOUT
5 Cin5 20 SA1
6 Cin6 21 SCL/SCK
7 Cin7 22 SDA/SI
8 Cin8 23 SA0/SO
9 Cin9 24 nCS
10 Cin10 25 nRST
11 Cin11 26 Non Connect *1
12 Cin12 27 Cin0
13 Cin13 28 Cin1
14 Cin14 29 Cin2
15 Cin15 30 Cin3
*1) connect to GND when mounted
SANYO : SSOP30(225mil)
8.0
4.4
0.1 6.4
12
30
0.15
0.5
0.22
0.5
(0.5)
1.7 MAX
(1.5)
LC717A10AJ
No.A2162-8/11
Block Diagram
Cin0
VDD
VSS
INTOUT
Cin1
Cin2
Cin3
Cin4
Cin5
Cin6
Cin7
Cin8
Cin9
Cin10
Cin11
Cin12
Cin13
Cin14
Cin15
Cref
CrefAdd
Cdrv
nRST
nCS
SCL/SCK
SDA/SI
SA0/SO
SA1
MUX
MUX
1st
AMP A/D
CONVERTER
2nd
AMP
CONTROL
LOGIC
I
2
C/SPI
POR OSCILLATOR
LC717A10AJ is capacitance-digital-converter LSI capable of detecting changes in capacitance in the order of femto
Farads. It consists of an oscillation circuit that generates the system clock, a power-on reset circuit that resets the system
when the power is turned on, a multiplexer that selects the input channels, a two-stage amplifier that detects the changes
in the capacitance and outputs analog-amplitude values, a A/D converter that converts the analog-amplitude values into
digital data, an I2C compatible bus or a SPI that enables serial communication with external devices and a control logic
that controls the entire chip.
LC717A10AJ
No.A2162-9/11
Pin Functions
Pin Name I/O Pin Functions Pin Type
Cin0 I/O Capacitance sensor input
Cin1 I/O Capacitance sensor input
Cin2 I/O Capacitance sensor input
Cin3 I/O Capacitance sensor input
Cin4 I/O Capacitance sensor input
Cin5 I/O Capacitance sensor input
Cin6 I/O Capacitance sensor input
Cin7 I/O Capacitance sensor input
Cin8 I/O Capacitance sensor input
Cin9 I/O Capacitance sensor input
Cin10 I/O Capacitance sensor input
Cin11 I/O Capacitance sensor input
Cin12 I/O Capacitance sensor input
Cin13 I/O Capacitance sensor input
Cin14 I/O Capacitance sensor input
Cin15 I/O Capacitance sensor input
Cref I/O Reference capacitance inpu t
CrefAdd I/O Reference capacitance input for addition
RAMP
VDD
VSS Buffer
Cdrv O Output for capacitance sensor s driv e
INTOUT O Interrupt output
VDD
VSS
Buffer
SCL/SCK I Clock input (I2C)
/ Clock input (SPI)
nCS I Interface sele ction
/ Chip select inverting input (SPI)
nRST I External reset signal inverting input
SA1 I Slave address selection (I2C)
VDD
VSS
R
SDA/SI I/O Data input and output (I2C)
/ Data input (SPI)
VDD
VSS
R
Continued to the next page.
LC717A10AJ
No.A2162-10/11
Continued from the previous page.
Pin Name I/O Pin Functions Pin Type
SA0/SO I/O Slave address selection (I2C)
/ Data output (SPI)
VDD
VSS
R
Buffer
VDD Power supply (2.6V to 5.5V) *1
VSS Ground (Earth) *1 *2
*1) Inserting a high-valued capacitor and a low-valued capacitor in parallel between VDD and VSS is recommended.
In this case, the small-valued capacitor should be at least 0.1μF, and is mounted near the LSI.
*2) When VSS terminal is not grounded in battery-powered mobile equipment, detection sensitivity may be degraded.
Details of Pin Functions
Cin0 to Cin15
These are the capacitance-sensor-input pins. These pins are used by connecting them to the touch switch pattern.
Cin and the Cdrv wire patterns should be close to each other. By doing so, Cdrv and Cin patterns are capacitively
coupled. Therefore, LSI can detect capacitance change near each pattern as 8bit digital data.
However, if the shape of each pattern or the capacitively coupled value of Cdrv is not appropriate, it may not be able
to detect the capacitance change correctly.
In this LSI, there is a two-stage amplifier that detects the changes in the capacitance and outputs analog-amplitude
values. Cin0 to Cin15 are connected to the inverting input of the 1st amplifier.
During measurement process, channels other than the one being measured are all in “Low” condition.
Leave the unused terminals open.
Cref, CrefAdd
These are the reference-capacitance-input pins. These are used by connecting to the wire pattern like Cin pins or are
used by connecting any capacitance between this pin and Cdrv pin.
In this LSI, there is a two-stage amplifier that detects the changes in the capacitance and outputs analog-amplitude
values. Cref is connected to the non-inverting input of the 1st amplifier.
Due to the parasitic capacitance generated in the wire connections of Cin pins and their patterns, as well as the one
generated between the wire patterns of Cin and Cdrv pins, Cref may not detect capacitance change of each Cin pin
accurately. In this case, connect an appropriate capacitance between Cref and Cdrv to detect capacitance change
accurately.
However, if the difference between the parasitic capacitance of each Cin pin is extremely large, it may not detect
capacitance change of each Cin pin correctly.
CrefAdd can be used as additional terminal for Cref. Leave the CrefAdd open if not in used.
Cdrv
It is the output pin for capacitance sensors drive. It outputs the pulse voltage which is needed to detect capacitance at
Cin0 to Cin15.
Cdrv and Cin wire patterns should be close to each other so that they are capacitively coupled.
INTOUT
It is the interrupt-output pin.
It is used by connecting to a main microcomputer if necessary, and use as interrupt signal. (High Active)
Leave the terminal open if not in used.
SCL/SCK
Clock input (I2C) / Clock input (SPI)
It is the clock input pin of the I2C compatible bus or the SPI depending on the mode of operation.
LC717A10AJ
No.A2162-11/11
nCS
Interface selection / Chip-select-inverting input (SPI)
Selection of I2C compatible bus mode or SPI mode is through this terminal. After initialization, the LSI is
automatically in I2C compatible bus mode. To continually use I2C compatible bus mode, fix nCS pin to “High”. To
switch to SPI mode after LSI initialization, change the nCS input “High” “Low”. The nCS pin is used as the chip-
select-inverting input pin of SPI, and SPI mode is kept until LSI is again initialized.
nRST
It is the external-reset-signal-inverting-input pin. When nRST pin is “Low”, LSI is in reset state.
Each pin (Cin0 to 15, Cref, CrefAdd) is “Hi-Z” during reset state.
SDA/SI
Data input and output (I2C) / Data input (SPI)
It is the data input and output pin of the I2C compatible bus or the data input pin of the SPI depending on the mode of
operation.
SA0/SO
Slave address selection (I2C) / Data output (SPI)
It is the slave address selection pin of the I2C compatible bus or the data output pin of the SPI depending on the mode
of operation.
SA1
Slave address selection (I2C)
It is the slave address selection pin of the I2C compatible bus.
When SPI mode, connect to the SA1 pin to GND.
PS
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