PIN CONNECTION
(Top View)
1. NC
2. Anode
3. Cathode
4. NC
5. GND
6. V
O
7. NC
8. V
CC
1234
8765
PS8802-1
1. Anode1
2. Cathode1
3. Cathode2
4. Anode2
5. GND
6. V
O
2
7. V
O
1
8. V
CC
PS8802-2
1234
8765
DESCRIPTION
The PS8802-1, -2 are optically coupled isolators containing a GaAlAs LED on the light emitting diode (input side)
and a PIN photodiode and a high-speed amplifier transistor on the output side on one chip.
The PS8802-1, -2 are designed specifically for high common mode transient immunity (CMR), the PS8802-2 is
suitable for high density applications.
FEATURES
• 40% reduction of mounting area (5-pin SOP × 2)
• High common mode transient immunity (CMH, CML = ±10 kV/
µ
s MIN.)
• High supply voltage (VCC = 35 V)
• High isolation voltage (BV = 2 500 Vr.m.s.)
• High-speed response (tPHL = 0.8
µ
s MAX., tPLH = 1.2
µ
s MAX.)
• Ordering number of tape product: PS8802-1-F3, F4: 1 500 pcs/reel
: PS8802-2-F3, F4: 1 500 pcs/reel
• Pb-Free product
• Safety standards
• UL approved: File No. E72422
• DIN EN60747-5-2 (VDE0884 Part2) approved No.40008347 (option)
APPLICATIONS
• Computer and peripheral manufactures
• General purpose inverter
• Substitutions for relays and pulse transformers
• Power supply
DATA SHEET
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
PHOTOCOUPLER
PS8802-1,-2
1 Mbps HIGH CMR ANALOG OUTPUT TYPE
8-PIN SSOP (SO-8)
HIGH-SPEED PHOTOCOUPLER
Document No. PN10418EJ04V0DS (4th edition)
Date Published November 2004 CP(K)
Printed in Japan
−NEPOC Series−
The mark shows major revised points.
NEC Compound Semiconductor Devices, Ltd. 2003, 2004
PACKAGE DIMENSIONS (UNIT: mm)
1.27
0.4+0.10
–0.05 0.25 M
0.1±0.1
3.95±0.1
6.0±0.2
0.5±0.3
0.15 +0.10
–0.05
5.21±0.25
3.27±0.2
0.10 S
MARKING EXAMPLE
No. 1 pin Mark
Initial of NEC
(Engraved mark)
PS8802-1 PS8802-2
No. 1 pin Mark
Initial of NEC
(Engraved mark)
Assembly Lot
N
8802-2
NL251
Week Assembled
Assembly Lot
N
8802-1
NL251
251
Year Assembled
(Last 1 Digit)
LN
Rank Code
In-house Code
(L: Pb-Free)
251
Year Assembled
(Last 1 Digit)
LN
Rank Code
In-house Code
(L: Pb-Free)
Week Assembled
Data Sheet PN10418EJ04V0DS
2
PS8802-1,-2
ORDERING INFORMATION
Part Number Order Number Solder Plating
Specification
Packing Style Safety Standard
Approval
Application
Part Number*1
PS8802-1 PS8802-1-A Pb-Free*2 20 pcs (Tape 20 pcs cut) Standard products PS8802-1
PS8802-1-F3 PS8802-1-F3-A Embossed Tape 1 500 pcs/reel (UL approved)
PS8802-1-F4 PS8802-1-F4-A
PS8802-2 PS8802-2-A 20 pcs (Tape 20 pcs cut) PS8802-2
PS8802-2-F3 PS8802-2-F3-A Embossed Tape 1 500 pcs/reel
PS8802-2-F4 PS8802-2-F4-A
PS8802-1-V PS8802-1-V-A 20 pcs (Tape 20 pcs cut) DIN EN60747-5-2 PS8802-1
PS8802-1-V-F3 PS8802-1-V-F3-A Embossed Tape 1 500 pcs/reel (VDE0884 Part2)
PS8802-1-V-F4 PS8802-1-V-F4-A Approved (Option)
PS8802-2-V PS8802-2-V-A 20 pcs (Tape 20 pcs cut) PS8802-2
PS8802-2-V-F3 PS8802-2-V-F3-A Embossed Tape 1 500 pcs/reel
PS8802-2-V-F4 PS8802-2-V-F4-A
*1 For the application of the Safety Standard, following part number should be used.
*2 With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your
nearby sales office.
Data Sheet PN10418EJ04V0DS 3
PS8802-1,-2
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Diode Forward Current IF 25 mA/ch
Reverse Voltage VR 5.0 V/ch
Power Dissipation*1 PD 45 mW/ch
Detector Supply Voltage VCC 35 V
Output Voltage VO 35 V/ch
Output Current IO 8.0 mA/ch
Power Dissipation*2 PC 100 mW/ch
Isolation Voltage*3 BV 2 500 Vr.m.s.
Operating Ambient Temperature TA –55 to +100 °C
Storage Temperature Tstg –55 to +125 °C
*1 Reduced to 0.45 mW/°C at TA = 25°C or more.
*2 Reduced to 1.00 mW/°C at TA = 25°C or more.
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Data Sheet PN10418EJ04V0DS
4
PS8802-1,-2
ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Diode Forward Voltage VF IF = 16 mA 1.7 2.2 V
Reverse Current IR VR = 3 V 10
µ
A
Forward Voltage
Temperature Coefficient
∆
VF/
∆
TA IF = 16 mA −2.1 mV/°C
Terminal Capacitance Ct V = 0 V, f = 1 MHz 30 pF
Detector High Level Output Current IOH (1) IF = 0 mA, VCC = VO = 5.5 V 10 500 nA
High Level Output Current IOH (2) IF = 0 mA, VCC = VO = 30 V 100
µ
A
Low Level Output Voltage VOL IF = 16 mA, VCC = 4.5 V, IOL = 1.2 mA 0.1 0.4 V
High Level Supply Current
(PS8802-1)
ICCH IF = 0 mA, VO = open, VCC = 30 V 0.1 2
µ
A
High Level Supply Current
(PS8802-2)
0.2 4
Low Level Supply Current
(PS8802-1)
ICCL IF = 16 mA, VO = open, VCC = 30 V 100
Low Level Supply Current
(PS8802-2)
200
Coupled Current Transfer Ratio CTR IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 15 25 45 %
Input-Output
Isolation Resistance
RI-O VI-O = 1 kVDC, RH = 40 to 60% 1011 Ω
Insulation Resistance
(Input-Input), (PS8802-2)
RI-I VI-I = 1 kVDC, RH = 40 to 60% 1010
Input-Output
Isolation Capacitance
CI-O V = 0 V, f = 1 MHz 0.6 pF
Insulation Capacitance
(Input-Input), (PS8802-2)
CI-I 0.3
Propagation Delay Time
(H → L)*1 tPHL IF = 16 mA, VCC = 5 V, RL = 2.2 kΩ,
CL = 15 pF 0.3 0.8
µ
s
Propagation Delay Time
(L → H)*1 tPLH 0.6 1.2
Common Mode
Transient Immunity at
High Level Output*2
CMH IF = 0 mA, VCC = 5 V, RL = 4.1 kΩ,
VCM = 1.5 kV 10 kV/
µ
s
Common Mode
Transient Immunity at
Low Level Output*2
CML IF = 16 mA, VCC = 5 V, RL = 4.1 kΩ,
VCM = 1.5 kV −10
Data Sheet PN10418EJ04V0DS 5
PS8802-1,-2
*1 Test circuit for propagation delay time
Input
Output
50%
1.5 V
VOL
tPHL tPLH
(IF = 7.5 mA)
Pulse input (IF)
(PW = 1 s,
Duty cycle = 1/10)
VO (Monitor)
VCC = 5 V
Input
(Monitor)
0.1 F
CL = 15 pF
47 Ω
RL = 2.2 kΩ
PS8802-1
µ
µ
Pulse input (IF)
(PW = 1 s,
Duty cycle = 1/10)
VO (Monitor)
VCC = 5 V
Input
(Monitor) 0.1 F
CL = 15 pF
47 Ω
RL = 2.2 kΩ
PS8802-2
µ
µ
Remark CL is approximately 15 pF which includes probe and stray wiring capacitance.
*2 Test circuit for common mode transient immunity
I
F
V
O
(Monitor)
V
CC
= 5 V
0.1 F
R
L
= 4.1 kΩ
PS8802-1
V
CM
µ
C
L
= 15 pF
I
F
V
O
(Monitor)
V
CC
= 5 V
0.1 F
R
L
= 4.1 kΩ
PS8802-2
V
CM
SW
µ
C
L
= 15 pF
90%
10%
1.5 kV
0 V
V
OH
2 V
0.8 V
V
OL
V
CM
V
O
(I
F
= 0 mA)
V
O
(I
F
= 16 mA)
t
r
t
f
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. By-pass capacitor of 0.1
µ
F is used between VCC and GND near device. Also, ensure that the distance between
the leads of the photocoupler and capacitor is no more than 10 mm.
3. Avoid storage at a high temperature and high humidity.
Data Sheet PN10418EJ04V0DS
6
PS8802-1,-2
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)
50
30
20
10
0
40
25 50 75 100
Ambient Temperature TA (˚C)
Diode Power Dissipation PD (mW)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
120
100
60
20
0
80
40
25 50 75 100
Ambient Temperature TA (˚C)
Transistor Power Dissipation PC (mW)
TRANSISTOR POWER DISSIPATION vs.
AMBIENT TEMPERATURE
100
0.01
0.1
10
1
1.4 1.8 2.0 2.41.0 1.2 1.6 2.2
Forward Voltage VF (V)
Forward Current IF (mA)
FORWARD CURRENT vs.
FORWARD VOLTAGE
TA = +100˚C
+50˚C
+25˚C
0˚C
–25˚C
80
20
0
40
60
70
50
10
30
0.5 5 10 501
VCC = 4.5 V,
VO = 0.4 V
Forward Current IF (mA)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
Current Transfer Ratio CTR (
%
)
1.6
0.0
1.2
0.4
1.4
1.0
0.8
0.6
0.2
0 50 100–50 –25 25 75
Ambient Temperature TA (˚C)
Normalized Current Transfer Raio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
Normalized to 1.0
at TA = 25˚C, IF = 16 mA,
VCC = 4.5 V, VO = 0.4 V
Ambient Temperature TA (˚C)
High Level Output Current IOH (nA)
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
10 000
10
0.1
1 000
100
50 100–25 0 25 75
VCC = VO = 30 V
VCC = VO = 5.5 V
1
IF = 0 mA
Remark The graphs indicate nominal characteristics.
Data Sheet PN10418EJ04V0DS 7
PS8802-1,-2
10
4
0
8
6
2
4 8 18 20162 6 10 12 14
20 mA
15 mA
10 mA
IF = 5 mA
25 mA
Output Voltage VO (V)
Output Current IO (mA)
OUTPUT CURRENT vs.
OUTPUT VOLTAGE
5
4
2
0
3
1
–50 0 50 100
–25 7525
Ambient Temperature TA (˚C)
NORMALIZED PROPAGATION DELAY TIME
vs. AMBIENT TEMPERATURE
Normalized Propagation Delay Time tPHL, tPLH
Normalized to 1.0
at TA = 25˚C,
IF = 16 mA, VCC = 5 V,
RL = 2.2 kΩ
tPLH
tPHL
Forward Current IF (mA)
PROPAGATION DELAY TIME vs.
FORWARD CURRENT
Propagation Delay Time tPHL, tPLH ( s)
µ
3.0
0
1.0
2.0
10 15 25
520
tPHL
tPLH
VCC = 5 V,
RL = 2.2 kΩ ,
CTR : 25
%
Load Resistance RL (Ω)
PROPAGATION DELAY TIME vs.
LOAD RESISTANCE
Propagation Delay Time tPHL, tPLH ( s)
µ
VCC = 5 V,
IF = 16 mA,
CTR : 25
%
tPLH
tPHL
10
1
0.1 10 k 100 k
1 k
Forward Current IF (mA)
Output Voltage VO (V)
OUTPUT VOLTAGE vs.
FORWARD CURRENT
6
5
4
2
0
3
1
12 16 20
4826
10 14 18
RL = 2.2 kΩ
5.6 kΩ
Remark The graphs indicate nominal characteristics.
Data Sheet PN10418EJ04V0DS
8
PS8802-1,-2
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Reel)
Packing: 1 500 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
φ
100±1.0
φ
2.0±0.5
11.9 to 15.4
Outer edge of
flange
17.5±1.0
13.5±1.0
13.0±0.2
φ
1.7±0.1
2.0±0.05
4.0±0.1
1.75±0.1
6.4±0.1
5.56±0.1
0.3±0.05
8.0±0.1
1.5
+0.1
–0
5.5±0.1
12.0±0.2
3.6±0.1
4.05 MAX.
Outline and Dimensions (Tape)
Taping Direction
PS8802-1-F3
PS8802-2-F3
PS8802-1-F4
PS8802-2-F4
Data Sheet PN10418EJ04V0DS 9
PS8802-1,-2
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
1.45
0.81.27
5.25
Data Sheet PN10418EJ04V0DS
10
PS8802-1,-2
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260°C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220˚C
180˚C
Package Surface Temperature T (˚C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260˚C MAX.
120˚C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
Data Sheet PN10418EJ04V0DS 11
PS8802-1,-2
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10418EJ04V0DS
12
PS8802-1,-2
M8E 00. 4 - 0110
The information in this document is current as of November, 2004. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
•
•
•
•
•
•
Data Sheet PN10418EJ04V0DS 13
PS8802-1,-2
Caution GaAs Products This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
TEL: +852-3107-7303
TEL: +886-2-8712-0478
TEL: +82-2-558-2120
FAX: +852-3107-7309
FAX: +886-2-2545-3859
FAX: +82-2-558-5209
NEC Electronics (Europe) GmbH http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc. http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279 0406
NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579
For further information, please contact
PS8802-1,-2
