1. General description
The UBA2024 is a family of high-voltage monolithic Integrated Compact Fluorescent
Lamp (CFL) drivers for a large range of lamp powers. Specific versions are optimized for
230 V and 110 V mains supplies. The product family integrates full CFL controller
functionality with high voltage half-bridge transistors. All products in the UBA2024 family
are pin-to-pin compatible enabling a single application design covering a wide range of
power ratings .
The IC features a soft start function, an adjustable internal oscillator and an internal drive
function with a high-volt age level shifter for driving the half-bridge.
To guarantee an accurate 50 % duty cycle, the oscillator signal is passed through a divider
before being fed to the output drivers.
2. Features and benefits
The common feature set includes:
high power efficiency
a high integration level with low component counts enablin g sm all for m fact or
electronic ballast
integrated bootstrap diode
soft start function
minimum glow time control
integrated low-voltage supply
adjustable operating frequency as a result of the embedded oscillator
an accurate 50 % duty cycle provided by an embedded oscillator signal
integrated half-bridge power transistors
an internal drive function with a high -volta ge level shif ter up to 550 V (300 V for the
UBA2024BP and UBA2024BT)
3. Applications
Driver for any kind of half-bridge configured load up to 23 W, provided that the
maximum junction temperature is not exceeded
Designed for electronically self-ballasted CFL lamps
UBA2024
Half-bridge power IC for CFL lamps
Rev. 6.2 — 1 November 2010 Product data sheet
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Product data sheet Rev. 6.2 — 1 November 2010 2 of 17
NXP Semiconductors UBA2024
Half-bridge power IC for CFL lamps
4. Ordering information
[1] For this type number, RDS(on) = 9 Ω and ISAT = 900 mA.
[2] For this type number, RDS(on) = 6 Ω and ISAT = 1350 mA.
[3] For this type number, RDS(on) = 6.4 Ω and ISAT = 1200 mA.
[4] For this type number, RDS(on) = 2 Ω and ISAT = 2500 mA.
5. Block diagram
Tabl e 1. Ordering information
Type number Package
Name Description Version
UBA2024P[1] DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
UBA2024T[1] SO14 plastic small outl ine package; 14 leads; body width 3.9 mm SOT108-1
UBA2024AP[2] DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
UBA2024AT[3] SO14 plas tic small outline package; 14 leads; body width 3.9 mm SOT108-1
UBA2024BP[4] DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
UBA2024BT[4] SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
Fig 1. Block diagram
mdb029
SWEEP AND
GLOW TIME CONTROL
HIGH VOLTAGE
LEVEL SHIFTER
VDD CONTROL
HIGH SIDE
DRIVER
LOW SIDE
DRIVER
OSCILLATOR DIVIDE-BY-2 DEAD TIME
1,2,3,5,9,10,13 (2)
7 (8)
VDD
VDD(stop)
SW
RC
SGND
8 (1)
6* (7)**
(6) 4 HV
FS
HS
LS
OUT
PGND
(3) 11
(5) 14
(4) 12
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Product data sheet Rev. 6.2 — 1 November 2010 3 of 17
NXP Semiconductors UBA2024
Half-bridge power IC for CFL lamps
6. Pinning information
6.1 Pinning
6.2 Pin description
Fig 2. Pinni ng diagram SOT97-1 Fig 3. Pinning diagram SOT108-1
UBA2024P
UBA2024AP
UBA2024BP
SW RC
SGND V
DD
FS HV
PGND OUT
014aaa657
1
2
3
4
6
5
8
7
UBA2024T
UBA2024AT
UBA2024BT
SGND OUT
SGND SGND
SGND PGND
HV FS
SGND SGND
VDD SGND
RC SW
014aaa804
1
2
3
4
5
6
7 8
10
9
12
11
14
13
Table 2. Pin description
Symbol Pin SOT97-1 Pin SOT108-1 Description
SW 1 8 sweep timing input
SGND 2 1, 2, 3, 5, 9,
10, 13 signal ground
FS 3 11 high-side floating supply output
PGND 4 12 power ground
OUT 5 14 half-bridge ou tput
HV 6 4 high-voltage supply
VDD 7 6 internal low-voltage supply output
RC 8 7 internal oscillator input
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Product data sheet Rev. 6.2 — 1 November 2010 4 of 17
NXP Semiconductors UBA2024
Half-bridge power IC for CFL lamps
7. Functional description
7.1 Supply voltage
The UBA2024 does not require an external low-voltage supply as the ma ins supply
voltage appli ed to pin HV powers it. The IC derives it s own low supply voltage fr om this for
its internal circuitry.
7.2 Start-up state
With an increase of the supply voltage on pin HV, the IC enters the start-up state. In the
start-up state the high-side power tra n sisto r is not conducting and the low-side power
transistor is switched on. The internal circuit is reset and the capacitors on the boot strap
pin FS and low-voltage supply pin VDD are charged. Pins RC and SW are switched to
ground. The start-up state is defined until VDD = VDD(startup).
7.3 Sweep mode
The IC enters the sweep mode when the volt age on pin VDD > VDD(startup). The capacitor
on pin SW is charged b y ISW and the half-bridge circuit start s oscillating. The circuit enters
the start-up state again whe n th e vo ltage on pin V DD < VDD(stop).
The sweep time (tsweep) is determined by the charge current (Ich(sw)) and the external
capacitor (CSW). Typical the total sweep time set by CSW is:
(1)
During the sweep time the current flowing through the lamp electrodes performs some
preheating of the fila ments. See Figure 5.
7.4 Reset
A DC reset circuit is incorporated in the high-side driver. The high-side transistor is
switched off whe n the voltage on pin FS is be low the hig h-side lo ckou t vo ltage Vfloat(UVLO).
7.5 Oscillation
The oscillation is based upon the 555-timer function. A self oscillating circuit is made with
the external re sist or ROSC and the capacitor COSC (see Figure 4).
To realize an accurate 50 % duty cycle, an internal di vider is used. This reduces the bridge
frequency to half the oscillator frequency.
The output voltage of the bridge will change at the falling edge of the signal on pin RC.
The design equation for the half-bridge frequency is:
(2)
An overview of the oscillator signal, internal LS and HS drive signals and the output is
given in Figure 4.
tsweep CSW nF()10.3 ms×=
fosc 1
kR
OSC
×COSC
×
-----------------------------------------
=
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Product data sheet Rev. 6.2 — 1 November 2010 5 of 17
NXP Semiconductors UBA2024
Half-bridge power IC for CFL lamps
When entering the swe ep mode (VSW = 0 V), the bridge oscillator starts at 2.5 times the
nominal bridge frequency and sweeps down to the nominal freq uency (bridge), set by
ROSC and COSC. During the sweep mode th e amplitude of the RC oscillator on pin RC, will
swing between Vtrip(osc)low and VSW +0.4V
trip(osc)high. The amplitude of the RC oscillator
will continue to increase until VSW +0.4V
trip(osc)high =V
trip(osc)high, this determines the end
of the sweep time. The voltage on pin SW however will continue to rise until it reaches
supply voltage level.
During this continuous decrease in frequency, the circuit approache s the resonance
frequency of the load, and this causes a high voltage across the load, which ignites the
lamp. The sweep to resonance time should be much larger than the settling time of the
supply voltage on pin HV, to guarantee that the full high-voltage is present at the moment
of ignition. See Figure 5.
Fig 4. Oscillator, drivers and output signals
time
VRC
VOUT
0
HS
drive
LS
drive
0
0
half
bridge
0
time
time
time
014aaa65
8
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Product data sheet Rev. 6.2 — 1 November 2010 6 of 17
NXP Semiconductors UBA2024
Half-bridge power IC for CFL lamps
7.6 Non-overlap time
The non-overlap time is defined as the time when both MOSFETs are not conducting. The
non-overlap time is fixed internally.
Fig 5. Start-up frequency behavior
014aaa65
9
time
time
time
time
time
tsweep
VHV
VDD
VDD(startup)
VSW
VDD
0.6Vtrip(osc)high
fosc
2.5nom
Vlamp
Vign
VgloA
Vnom
0
0
0
0
0
nom
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Product data sheet Rev. 6.2 — 1 November 2010 7 of 17
NXP Semiconductors UBA2024
Half-bridge power IC for CFL lamps
8. Limiting values
[1] The maximum junction temperature must not be exceeded.
9. Thermal characteristics
[1] In accordance with IEC 60747-1
Table 3. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VHV voltage on pin HV normal operation
UBA2024P - 373 V
UBA2024AP - 373 V
UBA2024T - 373 V
UBA2024AT - 373 V
UBA2024BP - 187 V
UBA2024BT - 187 V
mains transients during 0.5 s
UBA2024P - 550 V
UBA2024AP - 550 V
UBA2024T - 550 V
UBA2024AT - 550 V
UBA2024BP - 300 V
UBA2024BT - 300 V
VFS voltage on pin FS VHV VHV +14 V
VDD supply voltage low voltage; DC supply 0 14 V
IDD supply current low voltage; peak value is internally
limited; Tamb =25°C05mA
VPGND voltage on pin PGND referenced to SGND 1+1V
VRC voltage on pin RC IRC <1mA 0 V
DD V
VSW voltage on pin SW ISW <1mA 0 V
DD V
SR slew rate pin OUT; repetitive 4+4V/ns
Tjjunction temperature [1] 40 +150 °C
Tamb ambient temperature 40 +150 °C
Tstg storage temperature 55 +150 °C
Table 4. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-a) thermal resistance from junction to ambient in free air [1]
SO14 package 95 K/W
DIP8 package 95 K/W
Rth(j-c) thermal resistance from junction to case in free air [1]
SO14 package 8 K/W
DIP8 package 16 K/W
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Product data sheet Rev. 6.2 — 1 November 2010 8 of 17
NXP Semiconductors UBA2024
Half-bridge power IC for CFL lamps
10. Characteristics
Table 5. Characteristics
Tj = 25
°
C; all voltages are measured with respect to SGND; positive currents flow into the IC.
Symbol Parameter Conditions Min Typ Max Unit
High-voltage supply
VHV voltage on pin HV mains transients during 0.5 s; IHV < 30 μA
UBA2024P 0 - 550 V
UBA2024AP 0 - 550 V
UBA2024T 0 - 550 V
UBA2024AT 0 - 550 V
UBA2024BP 0 - 250 V
UBA2024BT 0 - 250 V
VFS voltage on pin FS mains transients during 0.5 s; IHV < 30 μA
UBA2024P 0 - 564 V
UBA2024AP 0 - 564 V
UBA2024T 0 - 564 V
UBA2024AT 0 - 564 V
UBA2024BP 0 - 264 V
UBA2024BT 0 - 264 V
Low-voltage supply
VDD supply voltage VHV =100V; R
osc =; VSW =V
DD;
VRC =0V 11.4 12.5 13.3 V
Start-up state
IHV current on pin HV VHV =100V; R
osc =; VSW =V
DD;
VRC =0V - - 0.39 mA
VDD(startup) start-up supply voltage 10 11 12 V
VDD(stop) stop supply voltage 8 8.5 9 V
VDD(hys) hysteresis of supply voltage 2 2.5 3 V
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Product data sheet Rev. 6.2 — 1 November 2010 9 of 17
NXP Semiconductors UBA2024
Half-bridge power IC for CFL lamps
Output stage
Ron on-state resistance HS transistor; VHV =310V; I
D= 100 mA
UBA2024P - 9.7 11 Ω
UBA2024T - 9.7 11 Ω
UBA2024AP - 6.5 7.4 Ω
UBA2024AT - 7.0 8.0 Ω
HS transistor; VHV =160V; I
D= 100 mA
UBA2024BP - 2.0 2.35 Ω
UBA2024BT - 2.0 2.35 Ω
LS transistor; ID= 100 mA
UBA2024P - 8.5 9.4 Ω
UBA2024T - 8.5 9.4 Ω
UBA2024AP - 5.7 6.3 Ω
UBA2024AT - 6.2 6.9 Ω
UBA2024BP - 2.3 2.55 Ω
UBA2024BT - 2.3 2.55 Ω
VFforward voltage HS; IF= 200 mA - - 2.0 V
LS; IF= 200 mA - - 2.0 V
bootstrap diode; IF= 1 mA 0.7 1.0 1.3 V
IDsat drain saturation current HS; VDS =30V; T
j 125 °C; VHV = 310 V
UBA2024P 900 - - mA
UBA2024AP 1350 - - mA
UBA2024T 900 - - mA
UBA2024AT 1200 - - mA
HS; VDS =30V; T
j 125 °C; VHV = 160 V
UBA2024BP 2500 - - mA
UBA2024BT 2500 - - mA
LS; VDS =30V; T
j125 °C
UBA2024P 900 - - mA
UBA2024AP 1350 - - mA
UBA2024T 900 - - mA
UBA2024AT 1200 - - mA
UBA2024BP 2500 - - mA
UBA2024BT 2500 - - mA
tno non-overlap time 1 1.35 1.7 μs
Vfloat(UVLO) undervoltage lockout
floating voltage 3.6 4.2 4.8 V
Table 5. Characteristics …continued
Tj = 25
°
C; all voltages are measured with respect to SGND; positive currents flow into the IC.
Symbol Parameter Conditions Min Typ Max Unit
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Product data sheet Rev. 6.2 — 1 November 2010 10 of 17
NXP Semiconductors UBA2024
Half-bridge power IC for CFL lamps
11. Electrostatic discharge
IFS current on pin FS VHV =310V; V
FS =12.2V
UBA2024P, UBA2024T 10 14 18 μA
UBA2024AP, UBA2024AT 10 14 18 μA
VHV =160V; V
FS =12.2V
UBA2024BP, UBA2024BT 10 14 18 μA
Internal oscillator
fosc oscillator frequency VSW = 0 V - 150 - kHz
VSW =V
DD - - 60 kHz
operating; nominal; ROSC =100kΩ;
COSC = 220 pF; VSW =V
DD
40.05 41.32 42.68 kHz
Δfosc/fosc relative oscillator frequency
variation ROSC = 100 kΩ; COSC = 220 pF;
20 °CTj+150 °C-2-%
kHhigh-level trip point factor 0.382 0.395 0.408
Vtrip(osc)high high oscillator trip voltage Vtrip(osc)high =k
H×VDD 4.58 4.94 5.29 V
kLlow-level trip point factor 0.030 0.033 0.038
Vtrip(osc)low low oscillator trip voltage Vtrip(osc)low =k
L×VDD 0.367 0.413 0.483 V
Kosc oscillator constant ROSC = 100 kΩ; COSC = 220 pF 1.065 1.1 1.35 V
Sweep function
Ich(sweep) sweep charge current VSW = 0 V 215 280 345 nA
tsweep sweep time CSW =33nF; V
DD = 12.2 V 0.28 0.35 0.45 s
Table 5. Characteristics …continued
Tj = 25
°
C; all voltages are measured with respect to SGND; positive currents flow into the IC.
Symbol Parameter Conditions Min Typ Max Unit
Table 6. ElectroStatic Discharge (ESD) overview
Model Class JEDEC classification criteria
ESDH (human body model) 1C pass at ESD pulse 1000 V
fail at ESD pulse 2000 V
ESDC (charged device model) C2 pass at ESD pulse 200 V
fail at ESD pulse 500 V
ESDM (machine model) B pass at 200 V ESD pulse < 400 V
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Product data sheet Rev. 6.2 — 1 November 2010 11 of 17
NXP Semiconductors UBA2024
Half-bridge power IC for CFL lamps
12. Application information
Fig 6. Schematic of 230 V standard compact fluorescent lamp application using UBA2024
001aan022
CBUF
4.7 μF
LFILT
1.8 mH
RFUS
33 Ω
D1
D3
D2
D4
CHB2
47 nF
11 W/150 mA
max. 550 V
3.1 mH
LLA
CHB1
47 nF
ROSC
110 kΩ
COSC
180 pF
CFS
10 nF
CDV
100 pF
CVDD
10 nF
CLA
UBA2024
SW
VDD
RC
SGND
HV
FS
OUT
PGND
CSW
33 nF
AC mains
supply
(230 V) CFL
1.5 nF
Fig 7. Schematic of 120 V standard compact fluorescent lamp application using UBA2024B
001aam620
D2
D3
D1
D4
ROSC
26.1 kΩ
CSW
470 nF
RSW
4.7 MΩ
COSC
1.2 nF
CFS
10 nF
CDVDT
820 pF
CHB1
150 nF
CBUS
33 μF
RFUS
4.7 Ω
CHB2
150 nF
LR
0.66 mH
LFILT maximum 300 V
1.5 mH
CVDD
10 nF
CRS
24 W/300 mA
10 nF
UBA2024B
PGND
OUT
FS
HV VDD
RC
SW
SGND
AC mains
supply
(120 V) CFL
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Product data sheet Rev. 6.2 — 1 November 2010 12 of 17
NXP Semiconductors UBA2024
Half-bridge power IC for CFL lamps
13. Package outline
Fig 8. Package outline SOT97-1 (DIP8)
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT97-1 99-12-27
03-02-13
UNIT A
max. 12 b1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.14
0.53
0.38
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05 0.2542.54 7.62 8.25
7.80
10.0
8.3 1.154.2 0.51 3.2
inches 0.068
0.045
0.021
0.015
0.014
0.009
1.07
0.89
0.042
0.035
0.39
0.36
0.26
0.24
0.14
0.12 0.010.1 0.3 0.32
0.31
0.39
0.33 0.0450.17 0.02 0.13
b2
050G01 MO-001 SC-504-8
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
pin 1 index
D
IP8: plastic dual in-line package; 8 leads (300 mil) SOT97
-1
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Product data sheet Rev. 6.2 — 1 November 2010 13 of 17
NXP Semiconductors UBA2024
Half-bridge power IC for CFL lamps
Fig 9. Package outline SOT108-1 (SO14)
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10
1.45
1.25 0.25 0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8 1.27 6.2
5.8
0.7
0.6
0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT108-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
7
8
1
14
y
076E06 MS-012
pin 1 index
0.069 0.010
0.004
0.057
0.049 0.01 0.019
0.014
0.0100
0.0075
0.35
0.34
0.16
0.15 0.05
1.05
0.041
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
99-12-27
03-02-19
0 2.5 5 mm
scale
S
O14: plastic small outline package; 14 leads; body width 3.9 mm SOT108
-1
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Product data sheet Rev. 6.2 — 1 November 2010 14 of 17
NXP Semiconductors UBA2024
Half-bridge power IC for CFL lamps
14. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
UBA2024 v.6.2 20101101 Product data sheet - UBA2024 v.5
Modifications: Figure 5 on page 6 has been changed.
The glow time section has been removed.
ESD values have been removed from Table 3 “Limiting values” on p age 7, added in to Table
6 “ElectroStatic Discharge (ESD) overvi ew” on page 10 and one error corrected.
Table 3 “Limiting values” on page 7: table notes 2 and 3 have been removed.
Table 5 “Characteristics” on page 8:
VDD supply voltage minimum value has been changed.
VF forward voltage HS maximum value has been changed.
KL low-level trip point factor maximum value has been chang ed.
Vtrip(osc)low low oscillator trip voltage maximum value has been changed.
Figure 6 on page 11 have been changed.
UBA2024 v.5 20100916 Product data sheet - UBA2024 v.4
UBA2024 v.4 20090917 Product data sheet - UBA2024 v.3
UBA2024 v.3 081016 Product data sheet - UBA2024 v.2
UBA2024 v.2 040203 Product data sheet - UBA2024 v.1
UBA2024 v.1 030813 Product data sheet - -
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Product data sheet Rev. 6.2 — 1 November 2010 15 of 17
NXP Semiconductors UBA2024
Half-bridge power IC for CFL lamps
15. Legal information
15.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full information se e the relevant full data
sheet, which is available on request via the local NXP Semicond uctors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre va il.
Product specificatio nThe information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warrant ies, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suit able for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environme ntal
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Se miconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Custo mers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party custo m er(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings onl y and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter m s and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or inte llectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
UBA2024 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 6.2 — 1 November 2010 16 of 17
NXP Semiconductors UBA2024
Half-bridge power IC for CFL lamps
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product i s automotive qualified,
the product is not suitable for automo tive use. It i s neit her qua lif ied nor test ed
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standards, custome r
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such au tomotive applicat ions, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y
liability, damages or failed product claims resulting from custome r design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
15.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respective ow ners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors UBA2024
Half-bridge power IC for CFL lamps
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 1 November 2010
Document identifier: UBA2024
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
17. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Functional description . . . . . . . . . . . . . . . . . . . 4
7.1 Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.2 Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.3 Sweep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.4 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.5 Oscillation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.6 Non-overlap time . . . . . . . . . . . . . . . . . . . . . . . 6
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
9 Thermal characteristics . . . . . . . . . . . . . . . . . . 7
10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 8
11 Electrostatic discharge . . . . . . . . . . . . . . . . . . 10
12 Application information. . . . . . . . . . . . . . . . . . 11
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14
15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
15.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
16 Contact information. . . . . . . . . . . . . . . . . . . . . 16
17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17