Part Number 900-532
Revision B December 2011
MatchPort b/g Pro
Integrat i on Gui de
MatchPort b/g Pro Integration Guide 2
Copyright and Tradema r k
© 2011 Lantronix. All rights reserved. No part of the contents of this book may be
transmitted or reproduced in any form or by any means without the written permission of
Lantronix. Pr in ted in the Un ited States of Am eric a.
MatchPort®, with its patent-pending technology, is a trademark of Lantronix. Ethernet i s a
trademark of XEROX Corporation. UNIX is a registered trademark of The Open Group.
Windows is a trademark of Microsoft Corp.
Contacts Lantronix Corporate Headquarters
167 Technology Drive
Irvine, CA 92618, USA
Phone: 949-453-3990
Fax: 949-450-7249
Technical Support
Online: www.lantronix.com/support
Email/Chat: www.lantronix.com/support
Sales Offices
For a current list of our domestic and international sales offices go to the Lantronix web
site at www.lantronix.com/about/contact/.
Disclai mer an d Revision s
Operation of this equipment in a residential area is likely to cause interference to other
devices, in which case the user, at his or her own expense, will be required to take
whatever measures may be required to correct the interference.
Note: This product has been designed to comply with the limits for a Class B
digital device pursuant to Part 15 of FCC and EN55022:1998 Rules when
properly enclosed and grounded. These limits are designed to provide
reasonable protection against radio interference in a residential installation. This
equipment generates, uses, and can radiate radio frequency energy, and if not
installed and used in accordance with this guide, may cause interference to radio
communications.
Changes or m odif icatio ns to this devic e not expl ic it ly appr oved b y Lantr on ix will void the
user's authority to operate this device.
Note: With the purchase of MatchPort b/g Pro, the OEM agrees to an OEM
firmware license agreement that grants the OEM a non-exclusive, royalt y-free
firmware license to use and distribute the binary firmware image provided, only to
the extent necessary to use the MatchPort b/g Pro hardware. For further details,
please see the MatchPort b/g Pro OEM firmware lice ns e agreeme nt .
Disclaimer This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses, and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
comm unic ations. However, there is no guarante e that i nter f erenc e will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one of the following measures:
MatchPort b/g Pro Integration Guide 3
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired
operation.
This device is intended only for OEM Integrators. The OEM integrator should be aware of
the following important issues .
Labeling o f th e End Product
The label on the end product incorporating the MatchPort b/g pro module must clearly
state that it contains an FCC-approved RF module. For example, "This product contains
an RF transmitter FCC ID: R68MPBGPRO and IC: 3867A-MPBGPRO."
RSS-GEN Sections 7.1.4 and 7.1.5 Statement for Devices with Detachable Antennas
This device has been designed to operate with the antennas listed in the Certificate, and
having a maximum gain of 5 dBi. Antennas not included in this list or having a gain
greater than 5 dBi are strictly prohibited for use with this device, unless system-level FCC
approval is gained. The required antenna impedance is 50 ohms.
To reduce potential radio interference to other users, the antenna type and its gain
should be so chosen that the equivalent isotropically radiated power (EIRP) is not more
than that required for successful communication.
Integration Note
a) This module is authorized under limited module approval specified to mobile host
equipment. So, the antenna must be installed such that 20cm is maintained between the
antenna and users.
b) The transmitter module may not be co-located with any other transmitter or antenna.
As long as the two conditions above are met, further transmitter testing will not be
required. However, the OEM integrator is still responsible for testing their end product for
any additional compliance requirements required with this module installed (for example,
digital device emission, PC peripheral requirements, etc.)
Note: In the event that these conditions cannot be met (for example certain
laptop configurations, general purpose PCMCIA or similar cards, or co-location
with another transmitter), then the FCC authorization is no longer considered
valid and the FCC ID cannot be used on the final product (including the
transmitter) and obtaining a separate FCC authorization.
Note: Changes or modifications to this device not explicitly approved by Lantronix will
void the user's authority to operate this device.
Revision Table
Date
Rev.
Comments
April 2008
A
Initial Releas e
December 2011 B Updated absol ute maximum ratings and recommended
supply voltage information.
MatchPort b/g Pro Integration Guide 4
Contents
Contents ______________________________________________________________ 4
List of Figures __________________________________________________________ 5
List of Tables ___________________________________________________________ 5
1: Introduction 6
About the Integration Guide _______________________________________________ 6
Additional Documentation _________________________________________________ 6
2: Description and Specifications 7
MatchPort b/g Pro Block Diagram ___________________________________________ 7
MatchPort b/g Pro Pinouts _____________________________________________________ 9
Power and Ground ______________________________________________________ 9
Reset ________________________________________________________________ 10
Ethernet Connections ___________________________________________________ 10
Ethernet LED Con nec ti ons _______________________________________________ 11
Wireless LED Connections _______________________________________________ 11
Antenna Mating Connector _______________________________________________ 11
Antenna ______________________________________________________________ 12
Serial Input/Output _____________________________________________________ 13
Sample Layouts for RS485 Connectivity ____________________________________ 13
IO Configurable Pins (CPs) _______________________________________________ 15
BOOTP_EN# __________________________________________________________ 16
BOOTP enable ____________________________________________________________ 16
Diagnosti cs LED ___________________________________________________________ 16
Pin Connection Options ______________________________________________________ 16
Electrical Sp ec if ic a tio n s _________________________________________________ 17
Wireless Specifications __________________________________________________ 18
Technical Specifications _________________________________________________ 18
Dimensions ___________________________________________________________ 19
Recommended PCB Layout ______________________________________________ 21
Product Information Label ________________________________________________ 22
3: Demonstration Kit 23
Contents of the Kit______________________________________________________ 23
Demo Board Description _________________________________________________ 23
Serial Interfaces _______________________________________________________ 24
Power Supply _________________________________________________________ 24
General Control ________________________________________________________ 24
Configuration Switch Bank _______________________________________________ 25
Demo Board Layout ____________________________________________________ 27
Demo Board Schematics ________________________________________________ 28
A: Compliance 32
B: Warranty 33
MatchPort b/g Pro Integration Guide 5
List of Fi gures
Figure 2-1. MatchPort b/g Pro Block Diagram _____________________________________ 8
Figure 2-2. Connection Diagram to an RJ45 Jack ________________________________ 10
Figure 2-3. Recommended LED Connections ____________________________________ 11
Figure 2-4. Recommended LED Connections ____________________________________ 11
Figure 2-5. Reverse-SMA to U.FL (P/N 500-180-R) _______________________________ 12
Figure 2-6. U.FL to U.FL Cable (P/N 500-181-R) _________________________________ 12
Figure 2-7. R-SMA Antenna Connector Dimensions (not to scale)____________________ 12
Figure 2-8. Combined RS232/422 Transceiver ___________________________________ 13
Figure 2-9. Separate RS232/422 Transceivers ___________________________________ 14
Figure 2-10. Separate RS422 Transceivers for 2-Wire and 4-Wire Setups _____________ 15
Figure 2-11. BOO TP_EN# AP PLICATIO N CIRC UIT ______________________________ 17
Figure 2-12. Side V iews ____________________________________________________ 19
Figure 2-13. Top View ______________________________________________________ 20
Figure 2-14. Bottom View ___________________________________________________ 20
Figure 2-15. PCB Layout (Top View) __________________________________________ 21
Figure 2-16. Product Label __________________________________________________ 22
Figure 3-1. MatchPort Demo Board Layout ______________________________________ 27
Figure 3-2. Demo Board Block Diagram ________________________________________ 28
Figure 3-3. Schematic ______________________________________________________ 29
List of Tables
Table 2-1. RS 232 Con nec ti ons _______________________________________________ 13
Table 2-2. JP6 RS422/485 Connections on Demo board ___________________________ 13
Table 2-3. Absolute Maximum Ratings _________________________________________ 17
Table 2-4. Rec om mended Operating Cond it ions _________________________________ 17
Table 2-5. Wireless Specifications ____________________________________________ 18
Table 2-6. Spec if ic ations ____________________________________________________ 18
Table 3-1. RS-2 32 Signa ls on Seria l Port 1 _____________________________________ 24
Table 3-2. RS-422 4-Wire Connector on Serial Port 1 _____________________________ 24
Table 3-3. Demo Board JP1 Jumper Configuration _______________________________ 25
Table 3-4. Demo Board JP7 Jumper Configuration for CON1 _______________________ 25
Table 3-5. Demo Board JP8 Jumper Configuration for CON2 _______________________ 25
Table 3-6. Demo Board JP8 Jumper Configuration for CON2 _______________________ 25
Table 3-7. Demo Board JP5 Jumper Configuration _______________________________ 26
Table 3-8. Demo Board Configurable Pin Jumper Configurations ____________________ 26
MatchPort b/g Pro Integration Guide 6
1: Introduction
About the Integration Guide
This guide provides the information needed to integrate the MatchPort b/g Pro™ device
server within another product. The intended audiences are the engineers responsible for
integrating the MatchPort b/g Pro into their product.
Additional Documentation
The following guides are available on the product CD and the Lantronix Web site
(www.lantronix.com)
MatchPort b/g Pro User
Guide Provides information needed to configure, use,
and update the Match Port b/g Pr o firmware.
MatchPort b/g Pro
Command Reference Lists and explains MatchPort b/g Pro command
line and XML commands.
MatchPort
Demonstr ation Kit Quick
Start Gui d e
Provides information needed to configure, use,
and update the Match Por t demonstration kit.
MatchPort b/g Pro Integration Guide 7
2: Description and Specifications
The MatchPort b/g Pro embedded device server is a complete network-enabling solution
on a 1.75"x1.75" PCB. This miniature device server empowers original equipment
manufacturers (OEMs) to go to market quickly and easily with networking and web page
serving capabilities built into their products.
The MatchPort b/g Pro has the following features:
Power Supply: Single regulated 3.3V input required. On board step down
conversion. LC filtering to minimize noises and emissions on all supply lines.
Controller: A Lantronix DSTni-FX 32-bit microprocessor, running at 166 MHz
internal bus and 83 MHz external bus.
Memory: 64 Mbits Flash and 64 Mbits SDRAM.
Wireless LAN: 802.11bg compliant radio with U.FL connector for external
antenna. 802.11i and 802.1X security standards supported.
Ethernet: 10/100 Base TX with auto-negotiation and HP auto-MDIX. On- board
100-ohm terminations incl u ded. External RJ45 jack and 1:1 Ethernet magnetics
with a minimal numbers of discrete components required.
Network interface status indication: On board WLAN and Ethernet LED
drivers.
Serial Po rt s: Two full duplex s erial port s w ith hard war e flow control and modem
control handshaking signals. Stan dar d or customized baud rates up to 230 Kbps.
External level shifters for RS232. Port 1 can also be configured to drive RS422 or
RS485 level shifters.
Configurable IO Pins (CPs): Up to 7 pins are configurable as general purpose
I/Os.
Interfa ce Signals: 3.3V-level interface signals.
Temperature Range: Operates over an extended temperature range.
Matc hP ort b/g Pro Bloc k Dia gram
The following drawing is a block diagram of the MatchPort b/g Pro showing the
relationships of the components.
2: Description and Specifications
MatchPort b/g Pro Integration Guide 8
Figure 2-1. MatchPort b/g Pro Block Diagram
2: Description and Specifications
MatchPort b/g Pro Integration Guide 9
MatchPort b/g Pro Pinouts
There are two headers of 1x20, 2-mm pin spacing. The odd row header is designated as P1; pins
are numbered 1 to 39. The even row header is designated as P2; pins are numbered
2 to 40.
PIN #
NAME
Dir
Active level
FUNCTION
P1.1
RESETIN#
I
Low
Reset. Leave floating if not used.
P1.3
RSTTODFLT
I
Low
Reset to Defaults
P1.5
TX1
O
Transmit Data, por t 1
P1.7
RTS1
O
Request to Send, port 1
P1.9
RX1
I
Receive Data, port 1
P1.11
CTS1
I
Clear to Send, port 1
P1.13
CP1
IO
IO Configurable Pin 1
P1.15
CP2
IO
IO Configurable Pin 2
P1.17
CP3
IO
IO Configurable Pin 3
P1.19
CP4
IO
IO Configurable Pin 4
P1.21
TX2
O
Transmit Data, por t 2
P1.23
RTS2
O
Request to Send, port 2
P1.25
RX2
I
Receive Data input , port 2
P1.27
CTS2
I
Clear to Send input , port 2
P1.29
CP5
IO
IO Configurable Pin 5
P1.31
CP6
IO
IO Configurable Pin 6
P1.33
CP7
IO
IO Configurable Pin 7
P1.35
RSVD
Reserved. Do not connect
P1.37
S3.3V
I
3.3V Power Input
P1.39
GND
I
Ground
PIN #
NAME
Dir
Active level
FUNCTION
P2.2
GND
I
Ground
P2.4
RSVD
Reserved. Do not connect
P2.6
ETX+
O
PHY’s Differential Ethernet Transmit Data +
P2.8
ETX-
O
PHY’s Differential Ethernet Transmit Data -
P2.10
ETCT
Differential Ethernet Transmit Data Center Tap
P2.12
ERCT
Differential Ethernet Receive Data Center Tap
P2.14
ERX+
I
PHY’s Differential Ethernet Receive Data +
P2.16
ERX-
I
PHY’s Differential Ethernet Receive Data -
P2.18
E_LINKLED
O
Low
Ethernet Link LED.
P2.20
E_ACTLED
O
Low
Ethernet Activity LED.
P2.22
W_LINKLED
O
Low
Wireless LAN Link/Activity LED. Active low
P2.24
BOOTP_EN#
IO
Low
Network Boot and Boot Loader Enable.
P2.26
RSVD
Reserved. Do not connect
P2.28
RSVD
Reserved. Do not connect
P2.30
RSVD
Reserved. Do not connect
P2.32
RSVD
Reserved. Do not connect
P2.34
RSVD
Reserved. Do not connect
P2.36
RSVD
Reserved. Do not connect
P2.38
RSVD
Reserved. Do not connect
P2.40
RSVD
Reserved. Do not connect
Power and Ground
The MatchPort b/g Pro requires a regulated 3.3Vdc +/- 5% power input at P1.37 and
ground at pin P1.39.
2: Description and Specifications
MatchPort b/g Pro Integration Guide 10
Note: To minimize noises as well as voltage drops at the connection, We reco mmend
direct connection of 3.3V and ground on the MatchPort b/g Pro to 3.3V power and ground
planes of the target board in place of heavy trace routing.
Reset
The MatchPort b/g Pro reset pin RESETIN# is an input-only pin and connects to an 811-
type reset IC. This input is for a pushbutton switch type manual reset. If no external reset
control is desired, leave this pin floating.
Minimu m reset pulse is 2 ms.
There is an on board capacitor, 0.1uF to ground, at the RESETIN# to filter out transient
voltages. However, it is a good practice to have RESETIN# trace on the target board as
short as possible to avoid reset occurrences when transient voltages such as those
caused by ESD are present.
Ether ne t Conne c t ions
The MatchPort b/g Pro provides Ethernet interface transmit ETX and receive data ERX
connections from a PHY device. Thus, before presenting signals to the outside world
using an RJ45 jack, a 1:1 Ethernet Magnetics is needed to interface and to isolate the
unit. A recommended connection diagram to an RJ45 jack with integrated 1:1 Ethernet
magnetics is shown below.
Figure 2-2. Connection Diagram to an RJ45 Jack
We recommend a low capacitance TVS diode array such as a Semtech SRV05-4 at
ETX+, ETX-, ERX+, ERX- if frequent transient voltages are present.
2: Description and Specifications
MatchPort b/g Pro Integration Guide 11
Ether ne t LE D Connections
The E_LINKLED and E_ACTLED signals are driven by the PHY. They are active low.
Recommended connections on the target board are shown below.
Figure 2-3. Recommended LED Connections
Warning: The MatchPort b/g Pro has two 4.7K pull-ups on the E_LINKLED
and E_ACTLE D signals to set up the PHY’s LED Indicator Mode as Ethernet
Link and Activities at Power On Reset (POR). Do not connect these two
signals with any pull-down resistors as they may corrupt the logic level on
these two signals at POR, causing undesired operation.
Wirel e s s LED Connec t ions
The W_LINKLED is driven by the Radio Module. Active low. Open drain. 10mA max.
Recommended connections on the target board are shown below.
The LED is activated when either the receiver or transmitter is active. With WLAN power
management disabled, the receiver is always active when the transmitter is not and thus
the LED alwa ys on when WLAN is the enab led inter f ac e. With W LAN power
management enabled, receiver and transmitter are turned on selectively and thus the
LED flickers.
Figure 2-4. Recommended LED Connections
Antenna Mating Connector
An antenna connection is made via the U.FL style connector on the MatchPort. Lantronix
offers two cable options, reverse-SMA to U.FL (P/N 500-180-R) or U.FL to U.FL (P/N
500-181-R).
2: Description and Specifications
MatchPort b/g Pro Integration Guide 12
Figure 2-5. Reverse-SMA to U.FL (P/N 500-180-R)
Figure 2-6. U.FL to U.FL Cable (P/N 500-181-R)
Note: The antenna cable is included in the MatchPort b/g Pro sample. For
production, it can be purchased from Lantronix or a cable supplier.
Figure 2-7. R-SMA Antenna Connector Dimensions (not to scale)
Antenna
The MatchPort b/g Pro has been FCC certified with a 5-dBi gain antenna for wireless
802.11b/g. It is for applications with antennas of equal gain or less. The following are two
of the recommended antennas with 2.15-dBi ga in and a link to their vendor. The y are
available from Lantronix as well.
Wanshih WSS003 (Lantronix part number 930-029-R)
Wanshih WSS002 (Lantronix part number 930-033-R)
www.wanshih.com
2: Description and Specifications
MatchPort b/g Pro Integration Guide 13
Serial Input/Output
The unit has two RS232 compatible serial ports supporting data rates up to 230 Kbps.
They include dedicated RTS and CTS hardware flow control signals. Configurable Pins
can be configured to function as DTR and/or DCD.
Serial Port 1 can also be conf igur ed for RS422/485. RTS is used as TX enable.
Configurable Pins can be configured to function as RS232/RS485 driver selection control
and/or half/full duplex driver selection.
The serial module interface employs 3.3V CMOS logic levels, requiring external level
shifters for full RS232/485/422 compliance The MatchPort Demo Board includes these
line drivers and DTE style DB9 connectors.
Table 2-1. RS232 Connections
MatchPort b/g Pro
DCE Connector
DTE Connector
Signal
(Logic)
Description
DB9
DB25
Signal
DB9
DB25
Signal
RXD1
Data In
2
3
RXD1
3
2
TXD1
TXD1
Data Out
3
2
TXD1
2
3
RXD1
RTS1
H/W Flow Control Output
7
4
RTS1
8
5
CTS1
CTS1
H/W Flow Control Input
8
5
CTS1
7
4
RTS1
CPx
Modem Control Inpu t
1
8
DCD
4
20
DTR
CPy
Modem Control Output
4
20
DTR
1
8
DCD
Note: CPx and CPy are any of the available CPs.
Table 2-2. JP6 RS422/485 Connections on Demo board
MatchPort
b/g Pro
Signal
(logic)
Description
RS485
Signal
JP6
Pin
DB25
4
Wire
DB25
2
Wire
DB9
4 wire
DB9
2 wire
TXD1 Data Out TX+485 4 14 14 7 7
TXD1 Data Out TX-485 3 15 15 3 3
RXD1 Data In RX+485 2 21 14 2 7
RXD1 Data In RX-485 1 22 15 8 3
RTS1 TX Enable
CP3 RS485 Select
CP4 RS485 2-wire
Sampl e Layouts for RS 48 5 Connec t ivity
Figure 2-8. Combined RS232/422 Transceiver
2: Description and Specifications
MatchPort b/g Pro Integration Guide 14
Figure 2-9. Separate RS232/422 Transceivers
2: Description and Specifications
MatchPort b/g Pro Integration Guide 15
Figure 2-10. Separate RS422 Transceivers for 2-Wire and 4-Wire Setups
To protect the MatchPort b/g Pro and circuitry on the target board against ESD at serial
ports, the selected transceiver(s) should have RS232/422/485 bus-pin ESD protection
(typically around 15 KV) either on-c h ip or by extern al d iod e arrays.
IO Configurable Pins (CPs)
There are up to seven CPs if no DTR or DCD is used on the serial ports. All CPs have
internal pull-up resistors, but the value differs. See table.
CPs can be configured for special functions, like DTR, DCD, RS232/RS485 selection or
as general purpose Input or Output (pollable/controllable via CLI or Web Manager). Fo r
more information see the User Guide.
PIN #
NAME
FUNCTION
P1.13
CP1
IO Configurable Pin 1
P1.15
CP2
IO Configurable Pin 2
P1.17
CP3
IO Configurable Pin 3
P1.19
CP4
IO Configurable Pin 4
P1.29
CP5
IO Configurable Pin 5
P1.31
CP6
IO Configurable Pin 6
P1.33
CP7
IO Configurable Pin 7
2: Description and Specifications
MatchPort b/g Pro Integration Guide 16
BOOTP_EN#
The BOOTP_EN# pin performs two functions simultaneously . It drives an optional
external diagnostics LED to indicate the status of the bootloader. It also serves as input
to enable booting from the network when no valid FW image is found in FLASH.
BOOTP enable
Holding BOOTP_EN# low (via switch or jumper) during and up to 10 seconds after a
reset allows booting the device with a FW image on a TFTP server only in case no valid
image is present on FLASH.
The MatchPort b/g Pro will issue a BOOTP request to acquire an IP address for itself, the
IP address of a TFTP server, and the filename of the FW image on the TFTP server.
Then it will fetch that file via TFTP, verify, and execute it.
Diagnostics LED
After supplying power to the unit or pressing and releasing the reset button, the
diagnostics LED turns on and stays on while the bootloader is running and does not
encounter any errors. After the bootloader loads firmware from serial, network or FLASH,
it turns off the LED right before handing over execution.
In case an error occurs during the bootloader operation, it will flash the LED. The pattern
will be pause, X * long flashes, Y * short flashes, pause, X long flashes, etc.
X is the first digit of the error number and Y the second.
Following are the currently implemented errors:
INVALID_BOOTLOADER_CHECKSUM 11
NO_FLASH_IMAGE_FOUND 12
BAD_FLASH_IMAGE_FOUND 13
BAD_COMMAND_PARAMETER 14
NO_BOOTP_RESPONSE 15
BAD_BOOTP_RESPONSE 16
NO_BOOTP_TFTP_IMAGE 17
RECEPTION_TIMEOUT 18
RECEPTION_OVERRUN 19
IMAGE_OVERSIZE 21
BAD_IMAGE_CHECKSUM 22
BAD_IMAGE_DESTINATION 23
INTERNAL_CODING_PROBLEM 24
Pin Connection Options
The circuit below is an example on how to correctly connect a switch (or permanent
jumper) and an LED to the BOOTP_EN# pin. The customer has the option of
implementing either the switch/resistor or the driver/LED or both or none.
The switch can be replaced by a jumper or hardwire. H aving the har d wire in plac e means
that if the firmware image in FLASH becomes corrupt, the MatchPort b/g Pro will
automatically send out BOOTP requests over the network. This could be a security risk.
The switch or jumper allows BOOTP requests to be sent only after manual intervention.
If no switch/jumper/hardwire is installed, network recovery is only possible by issuing
a!NL command over the serial port.
2: Description and Specifications
MatchPort b/g Pro Integration Guide 17
Figure 2-11. BOOTP_EN# APPLICATION CIRCUIT
Electrical Specifications
Caution: Stressing the device above the r ating listed in this table may cause
permanent damage to the MatchPor t b /g Pro. Exposure to Absolute Maximum
Rating conditions for extende d p eriods may affect the MatchPort b/g Pro's
reliability.
Table 2-3. Absolute Maximum Ratings
Parameter
Symbol
Min
Max
Units
Supply Voltage
VCC
3.135
3.6
Vdc
CP Voltage
VCP
-0.3
VCC +0.05
Vdc
Ethernet ETX+, ETX-, ERX+, ERX-
Voltage
V
ETH
0
V
CC
+0.3
Vdc
Operating Temperature
-40
70
oC
Storage Temperature
-40
85
oC
Table 2-4. Recommended Operating Conditions
Parameter
Symbol
Min
Typical
Max
Units
Supply Voltage
VCC
3.135
3.3
3.45
Vdc
Supply Voltage Ripples
VCC_PP
2
%
Supply Current _ Power Management
enabled
I
CC
245
mA
Supply Current _ Power Management
disabled
260 mA
Supply Current (Peak)
350
mA
Supply Reset Threshold
VRST
2.85
2.93
3.00
Vdc
CP Pull-ups, except CP5
RPU
100
Kohm
CP5 Pull-up
RPU
20
Kohm
CP, RX, CTS, BOOTP_EN#
Input Low Voltag e
V
CP_IL
0.8
Vdc
CP, RX, CTS, BOOTP_EN#
Input High Voltage
V
CP_IH
2
Vdc
(see note below )
CP, TX, RTS Output Low Voltage
(IOL = 4 mA)
VCP_OL 0.4 Vdc
CP, TX, RTS Output High Voltage
(IOH = -4 mA)
VCP_OH VCC -
0.4
Vdc
(see note below )
2: Description and Specifications
MatchPort b/g Pro Integration Guide 18
Parameter
Symbol
Min
Typical
Max
Units
E_LINKLED, E_ACTLED
Current Drive (sink)
I
ELED
12
mA
(see note below)
W_LINKLED
10
mA
Notes:
Do not connect a pull-down resistor on E_LINKLED and E_ACTLED.
All pins are not 5V-tolerant.
Wirel e s s Spec if ications
Refer to the following table for the MatchPort b/g Pro’s wireless specifications:
Table 2-5. Wireless Specifications
Category
IEEE 802.11b/g
Frequency Range
2.400 – 2.484 GHz
Output Power
14 +2.0/- 1.5 dBm 1, 2, 5.5, 11 Mbps
12 +/- 1.5 dBm 6, 9, ≥ 12 Mbps
Antenna Connector RF, U-FL TYPE
HIROSE PN = U_FL-R-SMT-10
Data Rates
1,2,5.5,11,6,9,12,18,24,36,48,54
Mbps
Radio Number of
Selectable
Subchannels
US 1-11
CA 1-11
JP 1-14
FR 10-13
SP 10-11
OT 1-13 (OT=Others)
Modulation
DSSS,DBPSK,DQPSK,CCK, OFDM,
16QAM, 64QAM
Security WEP, WPA, WPA 2/802.11i, EAP-
TLS, EAP-TTLS, PEAP, LEAP
Max imum Receive Lev el
-10 dBm (with PER < 8%)
Receiver Sensitivity
-69 dBm for 54 Mbps
-88 dBm for 11 Mbps
-85 dBm for 6 Mbps
-91 dBm for 1.0 Mbps
W_LINKLED Current
Max 10 mA
Technical Specifications
Table 2-6. Specifications
Category
MatchPort b/g Pro
CPU
Lantronix DSTni-FX 32-bit Microprocessor, 166 MHz internal bus, 83
MHz external bus
Memory
64 Mbits Flash and 64 Mbit s SDRAM
Firmware
Upgradeable via TFTP, FTP, and the Web
Configuration Pins
Up to 7 pins if no DTR or DCD is used on serial ports.
Reset Circuit RESETIN# is low active and push-button type. Mini mum RESETIN# pulse
width is 2 ms at IIL = -500 µA. Reset is also triggered if 3.3V at pin P1.37
drops below 2.93V typically.
Serial Interf ac e
CMOS (Asynchronous) 3.3V - level signals
Speed software selectable and customizable (300 bps to 230400 bps)
Serial Line Format s
7 or 8 data bits, 1-2 Stop bits, Parity: odd, even, none
Modem Control
DTR, DCD using CP s
2: Description and Specifications
MatchPort b/g Pro Integration Guide 19
Category
MatchPort b/g Pro
Flow Control
XON/XOFF (software), CTS/RTS (hardware), none
Network Interfaces
Ethernet 10/100 base TX with Auto Negotiation, and HP Auto MDIX
IEEE802.11bg, with IEEE802.11i/PSK/EAP security.
Protocols Supported
ARP, UDP, TCP, Telnet, ICMP, SNMP, DHCP, BOOTP,, HTTP, HTTPS,
SMTP, TFT P, FTP, SSL/TLS, SSH, LPD, PPP, Syslog, DNS, RSS, XML
Management
Internal web server, SNMP
Serial login, Telnet login (SSH optio nal), DeviceInstaller utility,
Internal Web Server Serves web pages. Either from built in web manager or custom pages in
onboard FLASH filesystem.
Custom storage
FLASH filesystem with 2.5 MB capacity
Security
Password protection, locking features
Average Power
Consumption (at
3.3V)
0.35 W with Radio and CPU Power Management enabled
0.9 W with Radio and CPU Power Management disabled
Weight
1 oz (28 g)
Cover Material
ABS
Temperature Operating range: -40°C to +70 °C (-40°F to +158°F)
Storage range: -40°C to +85°C (-40°F to 185°F)
Warranty
2-year limited warranty
Included Software Windows™ 98/NT/2000/XP-based Device Installer configuration software and
Windows™-based Com Port Redirector and Secure Com Port Redirector,
DeviceInstaller, and Web-Manager.
Dimensions
The MatchPort b/g Pro dimensions are shown in the following diagrams:
Figure 2-12. Side Views
2: Description and Specifications
MatchPort b/g Pro Integration Guide 20
Figure 2-13. Top View
Figure 2-14. Bottom View
2: Description and Specifications
MatchPort b/g Pro Integration Guide 21
Recommende d P CB Layout
The hole pattern and mounting dimensions for the MatchPort b/g Pro device server are
shown in the following drawing:
Figure 2-15. PCB Layout (Top View)
Note: If a socket is used for product development purpose only, two 2-mm, 20-pin sockets
spaced 1.42" apart can be used (e.g., Samtec P/N SMM-120-02-S-S-TR).
To optimize noise and cross-talk reduction, noise immunity, and impedance
matching on ETX+, ETX-, ERX+, ERX-, follow these guidelines when routing
traces on the target PCB:
− Route (ETX+, ETX-) pair as close to each other as possible, and far away
from ERX+, ERX- and other signals
− Route (ERX+, ERX-) pair as close to each other as possible, and far away
from ETX+, ETX- and other signals
− Set up PCB routing properties on each pair (ETX+, ETX-) and (ERX+, ERX-)
to achieve 100-ohm impedance.
− For EMI purposes, connect the metal housing (shield) of the RJ45 jack to
Power Ground or Earth Ground and do not allow floating.
If power ground and earth ground are to be separated, add ceramic
capacitors in the range of 1000 pF to 0.1 uF in a stitching pattern between
the two grounds to provide low impedance paths at high frequencies. The
voltage rating on the ceramic capacitors should be much higher than the
required isolation voltage between the two grounds.
Connect 3.3V and ground on the Match Por t b/g Pro directly to 3.3V power and
ground planes of the target board in place of heavy trace routing. This will
minimize noises as well as voltage drops du e to the tra c e.
Make the RESETIN# trace on the target board as short as possible to avoid reset
occurrences when transient voltages such as those caused by ESD are present.
2: Description and Specifications
MatchPort b/g Pro Integration Guide 22
Product Information Label
The product information label contains important information about y our specific unit,
such as its product ID (name), bar code, part number, and MAC address.
Figure 2-16. Product Label
MAC Address
Revision
Manufacturing Code
Part Number
MatchPort b/g Pro Integration Guide 23
3: Demonstration Kit
Using a MatchPort b/g Pro sample and the MatchPor t Demonstration Kit , you can get
familiar with the product and understand how to integrate the MatchPort b/g Pro into a
given produc t design.
Contents of t he Kit
The MatchPort Demonstration Kit contains the following items:
MatchPort Demo Board
3.3V wall adaptor
RS-232 cable, DB9F/F, null modem
RJ45 Ethernet cable
Antenna 2.15 dBi gain
You must obtain a MatchPort b/g Pro sample separately for use with this
Demonstr ation Kit.
Note: For developing custom application firmware on the MatchPort b/g Pro,
Lantronix offers a MatchPort Plus Development board with a Background Debug
Mode (BDM) connector together with a Software Development Kit (SDK). Please
contact Lantronix for more details.
Demo Boar d De scr iption
The MatchPort Demo Board provides a test platform for the Lantronix MatchPort device
server products, including MatchPort b/g Pro. The demo board uses 3.3V power from the
wall adaptor same as that of MatchPort. The demo board has the following features
2 serial ports with RS232/RS422/RS485 Maxim MAX3160 transceivers. The
ports have DB9M connectors.
1 RJ45 with integrated 1:1 magnetics for Ethernet connection; auto-MDIX
compatible.
Access to all signals on the MatchPort via header pins for measurements and
connections to other places.
3: Demonstration Kit
MatchPort b/g Pro Integration Guide 24
Serial Interfaces
The demo board has RS-232/422/485 transceivers, one per port. However, note that only
Serial Port 1 supports RS232/RS422/485 on MatchPort b/g Pro. The table below lists the
RS232 signals and corresponding pins on the demo board. All signals are level-shifted by
the transceivers.
Table 3-1. RS-232 Signals on Serial Port 1
MatchPort Demo
PIN FUNCTION
DB9
Pin #
Serial Port 1
CON1
TX1_232 (Data Out)
3
RX1_232 (Data In)
2
CTS1_232 (HW Flow Control Input)
8
RTS1_232 (HW Flow Control Out put)
7
DCD1_232 (Modem Control Input)
1
DTR1_232 (Modem Control Output)
4
GND (Ground)
5
Table 3-x. RS-232 Signals on Serial Port 2
MatchPort Demo
PIN FUNCTION
DB9
Pin #
Serial Port 2
CON2
TX2_232 (Data Out)
3
RX2_232(Data In)
2
CTS2_232 (HW Flow Control Input)
8
RTS2_232 (HW Flow Control Out put)
7
DCD2_232 (Modem Control Input)
1
DTR2_232 (Modem Control Output)
4
GND (Ground)
5
Table 3-2. RS-422 4-Wire Connector on Serial Port 1
MatchPort Demo
PIN FUNCTION
DB9
Pin #
Serial Port 1
CON1
TX+485 (Data Out)
7
TX-485 (Data Out)
3
RX+485 (Data In)
2
RX-485 (Data In)
8
GND (Ground)
5
Power Supply
The demo board uses an external 3.3V regulated supply (included with kit).
Gener al Cont rol
The following tables denote the jumper options of the demo board for use with the
MatchPort b/g Pro.
3: Demonstration Kit
MatchPort b/g Pro Integration Guide 25
Configur a t ion Sw itch Ba nk
Table 3-3. De mo Board JP1 Jumper Conf igur atio n
JP1 pin/Signal
JP1 pin/Signal
Function
1/CP1
2/LED12
Jumper 1-2, CP1 Controls LED12
3/CP2
4/LED11
Jumper 3-4, CP2 Controls LED11
5/CP3
6/LED10
Jumper 5-6, CP3 Controls LED10
7/CP4
8/LED9
Jumper 7-8, CP4 Controls LED9
9/CP5
10/LED8
Jumper 9-10, CP5 Controls LED8
11/CP6
12/LED7
Jumper 11-12, CP6 Controls LED7
13/CP7
14/LED6
Jumper 13-14, CP7 Controls LED6
Table 3-4. Demo Board JP7 Jumper Configuration for CON1
JP7
pin/Signal
JP7
pin/Signal
Function
1/TXD1
2/TXA
Jumper 1-2, Send TXD to RS232/485 transceiver.
3/RTS1 4/RTSA Jumper 3-4, Send RTS to RS232/485 transceiver. In 485 mode RTS
controls transmit enable.
5/CP3 6/SEL4XXA Jumper 5-6, CP3 high selec ts 485 mode , low 232 mode. Pi n at
transceiver is pulled down to defaul t to 232 mode.
7/RXD1
8/RXA
Jumper 7-8, Receive RXD from RS232/485 transceiver.
9/CTS1
10/CTSA
Jumper 9-10, Receive CTS from RS232 transceiver.
11/CP4 12/HDPX4XXA Jumper 11-12. In 485 mod e, CP4 selects full duplex when low and
half-duplex when high. Pin at trans ceiver is pulled down to default to
full duplex .
13/CP1
14/DTRA
Jumper 13-14, CP1 drives DTR to RS232 transceiver.
15/CP2
16/DCDA
Jumper 15-16, CP2 receives DCD from RS232 transceiver.
Table 3-5. Demo Board JP8 Jumper Configuration for CON2
JP7
pin/Signal
JP7
pin/Signal
Function
1/TXD2
2/TXB
Jumper 1-2, Send TXD to RS232 transceiver.
3/RTS2
4/RTSB
Jumper 3-4, Send RTS to RS232 transceiver.
5/CP7
6/SEL4XXB
Do not add jumper since only RS232 is supported. Pin at
transceiver is pulled down to defaul t to 232 mode.
7/RXD2
8/RXB
Jumper 7-8, Receive RXD from RS232 transceiver.
9/CTS2
10/CTSB
Jumper 9-10, Receive CTS from RS232 transceiver.
11/RESERVED
on MatchPort
b/g Pro
12/HDPX4XXB
Do not add jumper since only RS232 is supported. Pin at
transceiver is pulled down to defaul t to 232 mode.
13/CP5
14/DTRB
Jumper 13-14, CP5 drives DTR to RS232 transceiver.
15/CP6
16/DCDB
Jumper 15-16, CP6 receives DCD from RS232
transceiver.
Table 3-6. Demo Board JP8 Jumper Configuration for CON2
JP7
pin/Signal
JP7
pin/Signal
Function
1/TXD2
2/TXB
Jumper 1-2, Send TXD to RS232 transceiver.
3/RTS2
4/RTSB
Jumper 3-4, Send RTS to RS232 transceiver.
5/CP7 6/SEL4XXB
Do not add jumper since only RS232 is supported. Pin at
transceiver is pulled down to default to 232 mode.
7/RXD2
8/RXB
Jumper 7-8, Receive RXD from RS232 transceiver.
9/CTS2
10/CTSB
Jumper 9-10, Receive CTS from RS232 transceiver.
11/RESERVED
on MatchPort
12/HDPX4XXB
Do not add jumper since only RS232 is supported. Pin at
transceiver is pulled down to default to 232 mode.
3: Demonstration Kit
MatchPort b/g Pro Integration Guide 26
JP7
pin/Signal
JP7
pin/Signal
Function
b/g Pro
13/CP5
14/DTRB
Jumper 13-14, CP5 drives DTR to RS232 transceiver.
15/CP6 16/DCDB Jumper 15-16, CP6 receives DCD from RS232
transceiver.
Note: CP allocation in the tables above is the most straightforward for this
specific board. However any CP can be assigned to any function. To reflect
actual CP use in the eventual product (in case different), jumpers can be
replaced with short wires to allow interchanging of connections.
Table 3-7. De mo Board JP5 Jumper Conf igur atio n
Pin/Signal
Pin/Signal
Function
1/3V3
2/3V3_UUT
Jumper 1-2, MatchPort module power supply.
Note: Jumper can be replaced with short wire to allow use of a current clamp or <50
milliohm resistor to allow use of voltmeter for current measurements.
If using CPs for any combination of the demo board configurations above, pleas e use the
appropriate CP function selection as shown in Table 3-3 to Table 3-7.
If assigning a CP for any function other than the serial port, remove the jumper for the
associated CP pin from JP7 to avoid conflict with the serial port function.
Table 3-8. Demo Board Configurable Pin Jumper Configurations
Configurable Pin
JP1 Function
JP7,JP8 Function
CP1
LED12
JP7, CON1 DTR
CP2
LED11
JP7, CON1 DCD
CP3
LED10
JP7, CON1 RS485/232 Select
CP4
LED9
JP7, CON1 RS485 Duplex Select
CP5
LED8
JP8, CON2 DTR
CP6
LED7
JP8, CON2 DCD
CP7
LED6
JP8, leave open
3: Demonstration Kit
MatchPort b/g Pro Integration Guide 27
Demo Boar d Layout
Figure 3-1. MatchPort Demo Board Layout
3: Demonstration Kit
MatchPort b/g Pro Integration Guide 28
Demo Boar d S c hemat ics
Figure 3-2. Demo Board Block Diag ram
3: Demonstration Kit
MatchPort b/g Pro Integration Guide 29
Figure 3-3. Schematic
3: Demonstration Kit
MatchPort b/g Pro Integration Guide 30
Figure 3 -3. Schematic, continued
3: Demonstration Kit
MatchPort b/g Pro Integration Guide 31
Figure 3 -3. Schematic, continued
MatchPort b/g Pro Integration Guide 32
A: Compliance
(According to ISO/IEC Guide 17050-1, 17050-2 and EN 45014)
Manufacturer’s Name & Address:
Lantronix 167 Technology Drive, Irvine, CA 92618 USA
Product Name Model: MatchPort b/g Pro Embedded Device Server
Conforms to the following standards or other normative documents:
Safety:
UL 60950-1
CAN/CSA-C22.2 No. 60950-1-03
EN 60950-1:2006, Low Voltage Directive (73/23/EEC)
EMC & Radio:
For purposes of certification, the MatchPort b/g pro was tested as a modular device.
CFR Title 47 FCC Part 15, Subpart B and C, Class B
FCC Module Approval
FCC Identifier: R68MPBGPRO
Industry Canada ICES-003 Issue 4 (2004), Class B
Industry Canada RSS-Gen Issue 2 (2007)
Industry Canada RSS-210 Issue 7 (2007)
Industr y Canad a Modu le A pprov al IC: 386 7A-MPBGPRO
EN 301 489-1 v1.6.1 (2006-07), EMC Directive (1999/5/EC)
EN 301 489-17 v.1.2.1 (2002-08), EMC Directive (1999/5/EC)
EN 300 328 v1.7.1 (2006-10), R&TTE Directive (1999/5/EC)
Australia / New Zealand AS/NZS CISPR 22 (2006), Class B
Australia / New Zealand AS/NZS 4771 (2000 + A1:2003)
EN55022: 2006
EN55024: 1998 + A1: 2001 + A2: 2003
EN61000-3-2: 2006
EN61000-3-3: 1995 + A1: 2001
Manufacturer’s Contact:
Director of Quality Assurance, Lantronix
167 Technology Drive, Irvine, CA 92618 USA
Tel: 949-453-3990
Fax: 949-450-7249
