CY74FCT652T 8-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS032B - SEPTEMBER 1994 - REVISED OCTOBER 2001 D D D D D D D D D D Q OR SO PACKAGE (TOP VIEW) Function, Pinout, and Drive Compatible With FCT and F Logic Reduced VOH (Typically = 3.3 V) Version of Equivalent FCT Functions Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics Ioff Supports Partial-Power-Down Mode Operation Matched Rise and Fall Times Fully Compatible With TTL Input and Output Logic Levels 64-mA Output Sink Current 32-mA Output Source Current Independent Register for A and B Buses Multiplexed Real-Time and Stored Data Transfer 3-State Outputs CPAB SAB GAB A1 A2 A3 A4 A5 A6 A7 A8 GND 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC CPBA SBA GBA B1 B2 B3 B4 B5 B6 B7 B8 description The CY74FCT652T consists of bus transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal storage registers. GAB and GBA inputs control the transceiver functions. Select-control (SAB and SBA) inputs select either real-time or stored-data transfer. The circuitry used for select control eliminates the typical decoding glitch that occurs in a multiplexer during the transition between stored and real-time data. A low input level selects real-time data, and a high input level selects stored data. Data on the A or B data bus, or both, can be stored in the internal D-type flip-flops by low-to-high transitions of the appropriate clock (CPAB or CPBA) inputs, regardless of the select or enable levels of the control pins. When SAB and SBA are in the real-time transfer mode, it also is possible to store data without using the internal D-type flip-flops by simultaneously enabling GAB and GBA. In this configuration, each output reinforces its input. Thus, when all other data sources to the two sets of bus lines are at high impedance, each set of bus lines remains at its last state. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 CY74FCT652T 8-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS032B - SEPTEMBER 1994 - REVISED OCTOBER 2001 ORDERING INFORMATION SPEED (ns) ORDERABLE PART NUMBER TOP-SIDE MARKING Tape and reel 5.4 CY74FCT652CTQCT FCT652C Tube 5.4 CY74FCT652CTSOC Tape and reel 5.4 CY74FCT652CTSOCT Tape and reel 6.3 CY74FCT652ATQCT Tube 6.3 CY74FCT652ATSOC Tape and reel 6.3 CY74FCT652ATSOCT PACKAGE TA QSOP - Q SOIC - SO -40C to 85C QSOP - Q SOIC - SO FCT652C FCT652A FCT652A QSOP - Q Tape and reel 9 CY74FCT652TQCT FCT652 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUTS DATA I/O GAB GBA CPAB CPBA SAB L H H or L H or L L H OPERATION OR FUNCTION SBA A1-A8 B1-B8 X X Input Input Isolation X X Input Input Store A and B data X H H or L H H X X L X H or L X L L L L X X Input Unspecified X Input Output Unspecified Input X X X Output Input Store B in both registers X X L Output Input Real-time B data to A bus Store A, hold B Store A in both registers Hold A, store B L L X H or L X H Output Input H H X X L X Input Output Real-time A data to B bus Stored B data to A bus H H H or L X H X Input Output Stored A data to B bus H L H or L H or L H H Output Output Stored A data to B bus and Stored B data to A bus H = High logic level, L = Low logic level, X = Don't care, = Low-to-high transition Select control = L: clocks can occur simultaneously. Select control = H: clocks must be staggered in order to load both registers. The data output functions can be enabled or disabled by various signals at the GAB and GBA inputs. Data input functions always are enabled, i.e., data at the bus pins are stored on every low-to-high transition of the clock inputs. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 CY74FCT652T 8-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS 3 GAB L 21 GBA L 1 CPAB X 23 CPBA X 2 SAB X BUS B BUS A BUS A BUS B SCCS032B - SEPTEMBER 1994 - REVISED OCTOBER 2001 22 SBA L 3 GAB H 21 GBA H 21 GBA H X H 1 CPAB X 23 CPBA 2 22 SAB SBA X X X X X X X 2 SAB L 22 SBA X BUS B BUS A BUS A 3 GAB X L L 23 CPBA X REAL-TIME TRANSFER BUS A TO BUS B BUS B REAL-TIME TRANSFER BUS B TO BUS A 1 CPAB X STORE DATA FROM A AND/OR B 3 GAB H 21 GBA L 1 23 2 22 CPAB CPBA SAB SBA H or L H or L H H TRANSFER STORED DATA TO A AND/OR B Figure 1. Bus-Management Functions POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 CY74FCT652T 8-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS032B - SEPTEMBER 1994 - REVISED OCTOBER 2001 logic diagram (positive logic) GBA GAB CPBA SBA CPAB SAB 21 3 23 22 1 2 One of Eight Channels 1D C1 A1 4 20 1D C1 To Seven Other Channels 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 B1 CY74FCT652T 8-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS032B - SEPTEMBER 1994 - REVISED OCTOBER 2001 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA Package thermal impedance, JA (see Note 1): Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61C/W SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46C/W Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 135C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 2) MIN NOM MAX UNIT 4.75 5 5.25 V VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 V High-level output current -32 mA IOL TA Low-level output current 64 mA 85 C High-level input voltage 2 Operating free-air temperature -40 V NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 CY74FCT652T 8-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS032B - SEPTEMBER 1994 - REVISED OCTOBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VIK VCC = 4.75 V, VOH VCC = 4 4.75 75 V VOL Vhys VCC = 4.75 V, All inputs II IIH VCC = 5.25 V, VCC = 5.25 V, VIN = VCC VIN = 2.7 V IIL IOZH VCC = 5.25 V, VCC = 5.25 V, VIN = 0.5 V VOUT = 2.7 V IOZL IOS VCC = 5.25 V, VCC = 5.25 V, VOUT = 0.5 V VOUT = 0 V Ioff ICC VCC = 0 V, VCC = 5.25 V, ICC MIN IIN = -18 mA IOH = -32 mA TYP MAX UNIT -0.7 -1.2 V 2 IOH = -15 mA IOL = 64 mA 2.4 V 3.3 0.3 0.55 V 5 A 1 A 1 A 10 A 0.2 -10 A -225 mA 1 A 0.1 0.2 mA 0.5 2 mA 0.06 0.12 mA/ MHz 0.7 1.4 VIN = 3.4 V or GND VIN 0.2 V or VIN VCC - 0.2 V 1.2 3.4 2.8 5.6|| VIN = 3.4 V or GND 5.1 14.6|| 5 10 -60 VOUT = 4.5 V VIN 0.2 V, VIN VCC - 0.2 V VCC = 5.25 V, VIN = 3.4 V, f1 = 0, Outputs open ICCD VCC = 5.25 V, One input switching at 50% duty cycle, Outputs open, GAB or GBA = GND, VIN 0.2 V or VIN VCC - 0.2 V IC# VCC = 5.25 V, f0 = 10 MHz, MHz Outputs open,, GAB = GBA = GND, SAB = CPAB = GND, SBA = VCC One bit switching at f1 = 5 MHz at 50% duty cycle Eight bits switching at f1 = 5 MHz at 50% duty cycle V VIN 0.2 V or VIN VCC - 0.2 V Ci -120 mA pF Co 9 12 pF Typical values are at VCC = 5 V, TA = 25C. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND This parameter is derived for use in total power-supply calculations. # IC = ICC + ICC x DH x NT + ICCD (f0/2 + f1 x N1) Where: IC = Total supply current ICC = Power-supply current with CMOS input levels ICC = Power-supply current for a TTL high input (VIN = 3.4 V) DH = Duty cycle for TTL inputs high NT = Number of TTL inputs at DH ICCD = Dynamic current caused by an input transition pair (HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero f1 = Input signal frequency N1 = Number of inputs changing at f1 All currents are in milliamperes and all frequencies are in megahertz. || Values for these conditions are examples of the ICC formula. 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 CY74FCT652T 8-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS032B - SEPTEMBER 1994 - REVISED OCTOBER 2001 timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2) CY74FCT652T MIN MAX CY74FCT652AT MIN MAX CY74FCT652CT MIN MAX UNIT tw Pulse duration, clock high or low 6 5 5 ns tsu Setup time, before CPAB or CPBA A or B 4 2 2 ns th Hold time, after CPAB or CPBA A or B 2 1.5 1.5 ns switching characteristics over operating free-air temperature range (see Figure 2) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B B or A tPZH tPZL GAB or GBA A or B tPHZ tPLZ GAB or GBA A or B tPLH tPHL CPAB or CPBA A or B tPLH tPHL SBA or SAB A or B POST OFFICE BOX 655303 CY74FCT652T CY74FCT652AT CY74FCT652CT MIN MAX MIN MAX MIN MAX 1.5 9 1.5 6.3 1.5 5.4 1.5 9 1.5 6.3 1.5 5.4 1.5 14 1.5 9.8 1.5 7.8 1.5 14 1.5 9.8 1.5 7.8 1.5 9 1.5 6.3 1.5 6.3 1.5 9 1.5 6.3 1.5 6.3 1.5 9 1.5 6.3 1.5 5.7 1.5 9 1.5 6.3 1.5 5.7 1.5 11 1.5 7.7 1.5 6.2 1.5 11 1.5 7.7 1.5 6.2 * DALLAS, TEXAS 75265 UNIT ns ns ns ns ns 7 CY74FCT652T 8-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS032B - SEPTEMBER 1994 - REVISED OCTOBER 2001 PARAMETER MEASUREMENT INFORMATION 7V From Output Under Test From Output Under Test Test Point CL = 50 pF (see Note A) Open TEST GND CL = 50 pF (see Note A) 500 S1 500 S1 Open 7V Open tPLH/tPHL tPLZ/tPZL tPHZ/tPZH 500 LOAD CIRCUIT FOR 3-STATE OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw tsu 3V 1.5 V Input 1.5 V th 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH tPHL 1.5 V 1.5 V VOL tPHL Out-of-Phase Output tPLZ 3.5 V 1.5 V tPZH VOH 1.5 V VOL 1.5 V 0V Output Waveform 1 (see Note B) tPLH 1.5 V 1.5 V tPZL VOH In-Phase Output 3V Output Control Output Waveform 2 (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 1.5 V VOH - 0.3 V VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. The outputs are measured one at a time with one input transition per measurement. Figure 2. Load Circuit and Voltage Waveforms 8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 24-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CY74FCT652ATQCT ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT652ATQCTE4 ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT652ATQCTG4 ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT652ATSOC ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT652ATSOCE4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT652ATSOCG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT652ATSOCT ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT652ATSOCTE4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT652ATSOCTG4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT652CTQCT ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT652CTQCTE4 ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT652CTQCTG4 ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT652CTSOC ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT652CTSOCE4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT652CTSOCG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT652CTSOCT ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT652CTSOCTE4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT652CTSOCTG4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT652TQCT ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT652TQCTE4 ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT652TQCTG4 ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) Lead/Ball Finish MSL Peak Temp (3) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 24-May-2007 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device CY74FCT652ATQCT Package Package Pins Type Drawing SSOP/ QSOP SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DBQ 24 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CY74FCT652ATSOCT SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 CY74FCT652CTQCT SSOP/ QSOP DBQ 24 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CY74FCT652CTSOCT SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 CY74FCT652TQCT SSOP/ QSOP DBQ 24 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CY74FCT652ATQCT SSOP/QSOP DBQ 24 2500 346.0 346.0 33.0 CY74FCT652ATSOCT SOIC DW 24 2000 346.0 346.0 41.0 CY74FCT652CTQCT SSOP/QSOP DBQ 24 2500 346.0 346.0 33.0 CY74FCT652CTSOCT SOIC DW 24 2000 346.0 346.0 41.0 CY74FCT652TQCT SSOP/QSOP DBQ 24 2500 346.0 346.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DLP(R) Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee(R) Solutions amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2009, Texas Instruments Incorporated