6N135, 6N136, ICPL4502, ICPL4503
ISOCOM COMPONENTS 2004 LTD
Unit 25B, Park View Road West, Park View Industrial Estate
Hartlepool, Cleveland, TS25 1PE, United Kingdom
Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581
e-mail : sales@isocom.co.uk
http://www.isocom.com
ISOCOM COMPONENTS ASIA LTD
Hong Kong Office,
Block A, 8/F, Wah Hing Industrial mansion,
36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong.
Tel : +852 2995 9217 Fax : +852 8161 6292
e-mail : sales@isocom.com.hk
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ISOCOM
COMPONENTS
DESCRIPTION
The 6N135, 6N136, ICPL4502 and ICPL4503 devices
each consists of an infrared emitting diode, optically
coupled to a high speed photo detector transistor.
A separate connection for the photodiode bias and
output-transistor collector increases the speed by
several orders of magnitude over conventional
phototransistor couplers by reducing the
base-collector capacitance of the input transistor.
FEATURES
• High speed 1Mbit/s
• High AC Isolation Voltage 5000Vrms
• Guaranteed performance from 0°C to 70°C
• Wide Operating temperature range
-55°C to 100°C
• Pb Free and RoHS Compliant
• UL File E91231
• VDE Approval Certificate No. 40044376
for 6N135 and 6N136, with suffix “V”
APPLICATIONS
• Line Receivers
• Telecommunication Equipments
• Power Transistor Isolation in Motor Drives
• Replacement of Low Speed Phototransistor
Optocouplers
• Feedback Loop in Switch Mode Power Supplies
• High Speed Logic Ground Isolation
• Home Appliances
ORDER INFORMATION
• Add G after PN for 10mm lead spacing
• Add SM after PN for Surface Mount
• Add SMT&R after PN for Surface Mount
Tape & Reel
.
6N135 / 6N136 ICPL4502 / ICPL4503
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
1 NC
2 Anode
3 Cathode
4 NC
5 GND
6 VO
7 VB (6N135,
6N136)
NC (ICPL4502,
ICPL4503)
8 VCC
Input
Forward Current 25mA
Peak Transient Current
(≤1μs pulse width, 300pps) 1A
Power dissipation 45mW
Reverse Voltage 5V
Forward Peak Current
(50% duty cycle, 1ms pulse width) 50mA
Output
Output Current 8mA
Peak Output Current 16mA
Power Dissipation 100mW
Supply Voltage -0.5V to 30V
Output Voltage -0.5V to 20V
Base Current
(6N135 and 6N136)
5mA
Emitter-Base Reverse Voltage
(6N135 and 6N136)
5V
Total Package
Isolation Voltage 5000VRMS
Operating Temperature -55 to 100 °C
Storage Temperature -55 to 125 °C
Lead Soldering Temperature (10s) 260°C
A 0.1μF bypass Capacitor shall be connected between VCC and GND.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Stresses exceeding the absolute maximum ratings can cause
permanent damage to the device.
Exposure to absolute maximum ratings for long periods of time
can adversely affect reliability.
6N135, 6N136, ICPL4502, ICPL4503
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COMPONENTS
ELECTRICAL CHARACTERISTICS (TA = 0°C to 70°C unless otherwise specified)
* Typical values at TA = 25°C
OUTPUT
Parameter Symbol Test Condition Min Typ.* Max Unit
Logic High
Output Current
IOH I
F = 0mA, VO = VCC = 5.5V,
TA = 25°C
0.001 0.5 μA
IF = 0mA, VO = VCC = 15V,
TA = 25°C
0.01 1
IF = 0mA, VO = VCC = 15V 50
Logic Low
Output Voltage
VOL 6N135
IF = 16mA, IO = 1.1mA,
VCC = 4.5V, TA = 25°C
0.18
0.4
IF = 16mA, IO = 0.8mA,
VCC = 4.5V,
0.5
6N136 / ICPL4502 / ICPL4503
IF = 16mA, IO = 3mA,
VCC = 4.5V, TA = 25°C
0.25
0.4
IF = 16mA, IO = 2.4mA,
VCC = 4.5V
0.5
Logic Low
Supply Current
ICCL I
F = 16mA, VO = Open,
VCC = 15V
140 200 μA
Logic High
Supply Current
ICCH I
F = 0mA, VO = Open,
VCC = 15V, TA = 25°C
0.01 1 μA
IF = 0mA, VO = Open,
VCC = 15V
2
V
INPUT
Parameter Symbol Test Condition Min Typ.* Max Unit
Forward Voltage VF IF = 16mA 1.45 1.8 V
Reverse Voltage VR I
R = 10μA 5.0 V
Forward Voltage
Temperature Coefficient
ΔVF/ΔTA I
F = 16mA -1.9 mV/°C
6N135, 6N136, ICPL4502, ICPL4503
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COMPONENTS
ELECTRICAL CHARACTERISTICS (TA = 0°C to 70°C unless otherwise specified)
* Typical values at TA = 25°C
Parameter Symbol Test Condition Min Typ.* Max Unit
Current Transfer Ratio CTR 6N135
6N136 / ICPL4502 / ICPL4503
IF = 16mA, VO = 0.4V
VCC = 4.5V, TA = 25°C
7
19
50
50
%
6N135
6N136 / ICPL4502 / ICPL4503
IF = 16mA, VO = 0.5V
VCC = 4.5V
5
15
COUPLED
ISOLATION
Parameter Symbol Test Condition Min Typ.* Max Unit
Insulation Voltage VISO T
A = 25°C, RH = 40 % to 60%,
t = 1 min,
5000 VRMS
6N135, 6N136, ICPL4502, ICPL4503
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COMPONENTS
ELECTRICAL CHARACTERISTICS (TA = 0°C to 70°C unless otherwise specified)
* Typical values at TA = 25°C
Parameter Symbol Test Condition Min Typ.* Max Unit
Propagation Delay Time
to Logic Low
TPHL 6N135
RL = 4.1kΩ, TA = 25°C
RL = 4.1kΩ
0.35
1.5
2.0
μs
6N136 / ICPL4502 / ICPL4503
RL = 1.9kΩ, TA = 25°C
RL = 1.9kΩ
0.35
0.8
1.0
Propagation Delay Time
to Logic High
TPLH 6N135
RL = 4.1kΩ, TA = 25°C
RL = 4.1kΩ
0.5
1.5
2.0
μs
6N136 / ICPL4502 / ICPL4503
RL = 1.9kΩ, TA = 25°C
RL = 1.9kΩ
0.3
0.8
1.0
Common Mode Tran-
sient Immunity at Logic
High
CMH 6N135
IF = 0mA, VCM = 10Vp-p,
RL = 4.1kΩ, TA = 25°C
1000
V/μs
6N136 / ICPL4502
IF = 0mA, VCM = 10Vp-p,
RL = 1.9kΩ, TA = 25°C
1000
ICPL4503
IF = 0mA, VCM = 1500Vp-p,
RL = 1.9kΩ, TA = 25°C
15000 20000
Common Mode Tran-
sient Immunity at Logic
Low
CML 6N135
IF = 16mA, VCM = 10Vp-p,
RL = 4.1kΩ, TA = 25°C
1000 V/μs
6N136 / ICPL4502
IF = 16mA, VCM = 10Vp-p,
RL = 1.9kΩ, TA = 25°C
1000
ICPL4503
IF = 16mA, VCM = 1500Vp-p,
RL = 1.9kΩ, TA = 25°C
15000 20000
Switching Characteristics (TA = 0°C to 70°C, IF = 16mA, VCC = 5V unless otherwise specified)
6N135, 6N136, ICPL4502, ICPL4503
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COMPONENTS
Fig 1 Forward Current vs Forward Voltage
Fig 3 Normalized CTR vs Forward Current Fig 4 Normalized CTR vs TA
Fig 2 Output Current vs Output Voltage
Fig 5 Propagation Delay vs Load Resistance Fig 6 Propagation Delay vs TA
6N135, 6N136, ICPL4502, ICPL4503
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COMPONENTS
Switching Time Test Circuit
Fig 7 Logic High Output Current vs TA
6N135, 6N136, ICPL4502, ICPL4503
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COMPONENTS
Note:
Common mode transient immunity in logic high level is the maximum tolerable (positive) dVCM/dt on the leading edge of
the common mode pulse signal VCM, to assure that the output will remain in a logic high state (i.e., VO > 2.0V).
Common mode transient immunity in logic low level is the maximum tolerable (negative) dVCM/dt on the trailing edge of
the common mode pulse signal, VCM, to assure that the output will remain in a logic low state (i.e., VO < 0.8V).
Common Mode Transient Immunity Test Circuit
6N135, 6N136, ICPL4502, ICPL4503
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COMPONENTS
6N136
IYWW
ORDER INFORMATION
DEVICE MARKING (Example : 6N136)
6N135, 6N136, ICPL4502, ICPL4503 (UL Approval)
After PN PN Description Packing quantity
None 6N135, 6N136,
ICPL4502, ICPL4503
Standard Dip8 45 pcs per tube
SM 6N135SM, 6N136SM,
ICPL4502SM, ICPL4503SM
Surface Mount 45 pcs per reel
SMT&R 6N135SMT&R,
6N136SMT&R,
ICPL4502SMT&R,
ICPL4503SMT&R
Surface Mount Tape & Reel 1000 pcs per reel
G 6N135G, 6N136G,
ICPL4502G, ICPL4503G
10mm Lead Spacing 45 pcs per tube
6N136 denotes Device Part Number
Y denotes 1 digit Year code
WW denotes 2 digit Week code
I denoted Isocom
6N135V, 6N136V (UL and VDE Approvals)
After PN PN Description Packing quantity
None 6N135V, 6N136V Standard Dip8 45 pcs per tube
SM 6N135VSM, 6N136VSM Surface Mount 45 pcs per reel
SMT&R 6N135VSMT&R,
6N136VSMT&R
Surface Mount Tape & Reel 1000 pcs per reel
G 6N135VG, 6N136VG 10mm Lead Spacing 45 pcs per tube
6N135, 6N136, ICPL4502, ICPL4503
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COMPONENTS
PACKAGE DIMENSIONS (mm)
DIP
G-Form
6N135, 6N136, ICPL4502, ICPL4503
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COMPONENTS
PACKAGE DIMENSIONS (mm)
RECOMMENDED PAD LAYOUT FOR SMD (mm)
SMD
6N135, 6N136, ICPL4502, ICPL4503
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COMPONENTS
TAPE AND REEL PACKAGING
Direction of feed from reel
Dimension No. A B D0 D1 E F
Dimension( mm) 10.4±0.1 10.0±0.1 1.5±0.1 1.5±0.1 1.75±0.1 7.5±0.1
Dimension No. P0 P1 P2 t W K
Dimension (mm) 4.0±0.1 12.0±0.1 2.0±0.1 0.4±0.1 16.0
±0.3 / -0.1 4.5±0.1
6N135, 6N136, ICPL4502, ICPL4503
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COMPONENTS
REFLOW SOLDERING TEMPERATURE PROFILE
(One Time Reflow Soldering is Recommended)
TIME (s)
TEMP (°C)
25°C
ts Preheat
60s – 120s
Tsmin
Tsmax
260°C
TL 217°C
Time 25°C to Peak Temperature
tP
TP - 5°C
TP
Max Ramp Up Rate
3°C/s
Max Ramp Down Rate
6°C/s
tL
200°C
150°C
Profile Details Conditions
Preheat
- Min Temperature (TSMIN)
- Max Temperature (TSMAX)
- Time TSMIN to TSMAX (ts)
150°C
200°C
60s - 120s
Soldering Zone
- Peak Temperature (TP)
- Liquidous Temperature (TL)
- Time within 5°C of Actual Peak Temperature (TP 5°C)
- Time maintained above TL (tL)
- Ramp Up Rate (TL to TP)
- Ramp Down Rate (TP to TL)
260°C
217°C
30s
60s - 100s
3°C/s max
6°C/s max
Average Ramp Up Rate (Tsmax to TP) 3°C/s max
Time 25°C to Peak Temperature 8 minutes max
6N135, 6N136, ICPL4502, ICPL4503
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COMPONENTS
NOTES :
- Isocom is continually improving the quality, reliability, function or design and Isocom
reserves the right to make changes without further notices.
- The products shown in this publication are designed for the general use in electronic
applications such as office automation equipment, communications devices, audio/visual
equipment, electrical application and instrumentation.
- For equipment/application where high reliability or safety is required, such as space applica-
tions, nuclear power control equipment, medical equipment, etc., please contact our sales
representatives.
- When requiring a device for any ”specific” application, please contact our sales for advice.
- The contents described herein are subject to change without prior notice.
- Do not immerse device body in solder paste.
DISCLAIMER
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COMPONENTS
__ ISOCOM is continually working to improve the quality and reliability of its products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent
electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,
when utilizing ISOCOM products, to comply with the standards of safety in making a safe
design for the entire system, and to avoid situations in which a malfunction or failure of such
ISOCOM products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that ISOCOM products are used within specified
operating ranges as set forth in the most recent ISOCOM products specifications.
__ The ISOCOM products listed in this document are intended for usage in general
electronics applications (computer, personal equipment, office equipment, measuring
equipment, industrial robotics, domestic appliances, etc.). These ISOCOM products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality
and/or reliability or a malfunction or failure of which may cause loss of human life or bodily
injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments,
airplane or spaceship instruments, transportation Instruments, traffic signal instruments,
combustion control instruments, medical Instruments, all types of safety devices, etc..
Unintended Usage of ISOCOM products listed in this document shall be made at the
customer’s own risk.
__ Gallium arsenide (GaAs) is a substance used in the products described in this document.
GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to
dissolve them. When disposing of the products, follow the appropriate regulations. Do not
dispose of the products with other industrial waste or with domestic garbage.
__ The products described in this document are subject to the foreign exchange and foreign
trade laws.
__ The information contained herein is presented only as a guide for the applications of our
products. No responsibility is assumed by ISOCOM Components for any infringements of
intellectual property or other rights of the third parties which may result from its use. No license
is granted by implication or otherwise under any intellectual property or other rights of
ISOCOM Components or others.
__ The information contained herein is subject to change without notice.
