Semiconductor Components Industries, LLC, 2003
December, 2003 − Rev. 2 1Publication Order Number:
MBRA120ET3/D
MBRA120ET3
Surface Mount
Schottky Power Rectifier
SMA Power Surface Mount Package
. . . employing the Schottky Barrier principle in a metal−to−silicon
power rectifier. Features epitaxial construction with oxide passivation
and metal overlay contact. Ideally suited for low voltage, high
frequency switching power supplies; free wheeling diodes and
polarity protection diodes.
Compact Package with J−Bend Leads Ideal for Automated Handling
Highly Stable Oxide Passivated Junction
Guardring for Over−Voltage Protection
Optimized for Low Leakage Current
Mechanical Characteristics:
Case: Molded Epoxy
Epoxy Meets UL94, VO at 1/8
Weight: 70 mg (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Polarity Band Indicates Cathode Lead
Available in 12 mm Tape, 5000 Units per 13 inch Reel
Device Meets MSL1 Requirements
ESD Ratings: Machine Model, C (>400 V)
Human Body Model, 3B (>8000 V)
Marking: B1E2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
20 V
Average Rectified Forward Current
(At Rated VR, TC = 125°C) IO1.0 A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
IFSM 40 A
Storage Temperature Tstg −55 to +150 °C
Operating Junction Temperature TJ−55 to +150 °C
Voltage Rate of Change
(Rated VR, TJ = 25°C) dv/dt 10,000 V/s
Device Package Shipping
ORDERING INFORMATION
MBRA120ET3 SMA 5000/Tape & Reel
SCHOTTKY BARRIER
RECTIFIER
1 AMPERE
20 VOLTS
SMA
CASE 403D
PLASTIC
MARKING
DIAGRAM
B1E2 = Device Code
B1E2
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For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
MBRA120ET3
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2
THERMAL CHARACTERISTICS
Characteristic Symbol 5 mm x 5 mm
(Note 2) 1 Inch x 1/2 inch
(Note 3) Unit
Thermal Resistance − Junction−to−Lead
Thermal Resistance − Junction−to−Ambient RθJL
RθJA 34
138 20
77 °C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 1), See Figure 2 VFTJ = 25°C TJ = 100°CV
(IF = 0.1 A)
(IF = 1.0 A)
(IF = 2.0 A)
0.455
0.530
0.595
0.360
0.455
0.540
Maximum Instantaneous Reverse Current, See Figure 4 IRTJ = 25°C TJ = 100°CA
(VR = 20 V)
(VR = 10 V)
(VR = 5.0 V)
10
1.0
0.5
1600
500
300
1. Pulse Test: Pulse Width 250 µs, Duty Cycle 2%.
2. Mounted on a Pad Size of 5 mm x 5 mm, PC Board FR4 (2 pads).
3. Mounted on a Pad Size of 1 inch x 1/2 inch, PC Board FR4 (2 pads).
150°C
0.1 0.30.20.1VF, INSTANTANEOUS VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage
Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current
1
10
0
864201210 20
IR, REVERSE CURRENT (A)
0.1 0.40.30.20.1 0.6
VF, INSTANTANEOUS VOLTAGE (VOLTS)
1
10
0 0.5
14 16 18
0.60.50.4 0.7 10.90.8
IF, INSTANTANEOUS FORWARD CURRENT (A)
0.90.80.7 1
IF, INSTANTANEOUS FORWARD CURRENT (A)
1E−08
1E−07
1E−06
1E−05
1E−04
1E−03
1E−02
VR, REVERSE VOLTAGE (VOLTS)
864201210 20
IR, REVERSE CURRENT (A)
14 16 18
1E−08
1E−07
1E−06
1E−05
1E−04
1E−03
1E−02
125°C
100°C
25°C
−40°C
150°C
100°C
25°C
150°C
125°C
100°C
75°C
25°C
150°C
100°C
25°C
MBRA120ET3
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3
0.8
12010060
020 160
TL, LEAD TEMPERATURE (°C)
Figure 5. Current Derating Figure 6. Forward Power Dissipation
Figure 7. Thermal Resistance
0.4
1.8
0
0.4
0
IO, AVERAGE FORWARD CURRENT (AMPS)
0.2
0.7
Figure 8. Typical Junction Capacitance
8040 140
0.6
0.2
1
1.20.60.2 1.6010.80.4 1.4
0.5
0.1
0.3
T, TIME (sec)
2120
VR, REVERSE VOLTAGE (VOLTS)
1000
100
10 8
R(T), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
64 10 14 16
TJ = 25°C
18 20
C, CAPACITANCE (pF)
0.6
PFO, AVERAGE POWER DISSIPATION (WATTS)
dc
SQUARE WAVE
IF, AVERAGE FORWARD CURRENT (AMPS)
1.4
1.6
1.2 SQUARE WAVE
dc
0.00010.00001
1
0.1
0.01
0.001 0.10.01 10 100 100010.001
D = 0.5
0.3
0.2
0.02
0.05
0.1
SINGLE PULSE
MBRA120ET3
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4
PACKAGE DIMENSIONS
SMA
CASE 403D−02
ISSUE A
SMA FOOTPRINT
mm
inches
0.157
4.0
0.0787
2.0
0.0787
2.0
S
A
DB
KJ
C
H
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.160 0.180 4.06 4.57
B0.090 0.115 2.29 2.92
C0.075 0.095 1.91 2.41
D0.050 0.064 1.27 1.63
H0.002 0.006 0.05 0.15
J0.006 0.016 0.15 0.41
K0.030 0.060 0.76 1.52
S0.190 0.220 4.83 5.59
POLARITY INDICATOR OPTIONAL
AS NEEDED
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D−01 OBSOLETE, NEW STANDARD IS
403D−02.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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MBRA120ET3/D
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