W24257CJ70LL - Winbond Electronics Corporation America

Preliminary W24257C

32K × 8 CMOS STATIC RAM

Publication Release Date: January 1999

- 1 - Revision A1

GENERAL DESCRIPTION

The W24257C is a slow speed, low power CMOS static RAM organized as 32768 × 8 bits that

operates on a single 5-volt power supply. This device is manufactured using Winbond's high

performance CMOS technology.

FEATURES

•Low power consumption:

−Active: 400 mW (max.)

−Standby: 250 µW (max.) (LL-version)

500 µW (max.) (L-version)

•Access time: 70/100 nS (max.)

•Single +5V power supply

•Fully static operation

•All inputs and outputs directly TTL compatible

•Three-state outputs

•Battery back-up operation capability

•Data retention voltage: 2V (min.)

•Available packages: 28-pin 600 mil DIP, 330

mil SOP, 300 mil skinny DIP and SOJ

PIN CONFIGURATION

A11

A10

I/O8

I/O7

I/O6

I/O5

I/O4

A13

VDD

A14

A12

I/O2

I/O3

I/O1

VSS

BLOCK DIAGRAM

A14

I/O1

I/O8

VDD

VSS

DATA I/O

DECODER

CONTROL

CORE

ARRAY

PIN DESCRIPTION

SYMBOL DESCRIPTION

A0−A14 Address Inputs

I/O1−I/O8 Data Inputs/Outputs

Chip Select Input

Write Enable Input

Output Enable Input

VDD Power Supply

VSS Ground

Preliminary W24257C

- 2 -

TRUTH TABLE

MODE I/O1

−

I/O8 VDD CURRENT

HX X Not Selected High Z ISB, ISB1

LH H Output Disable High Z IDD

L L HRead Data Out IDD

LXLWrite Data In IDD

DC CHARACTERISTICS

Absolute Maximum Ratings

PARAMETER RATING UNIT

Supply Voltage to VSS Potential -0.5 to +7.0 V

Input/Output to VSS Potential -0.5 to VDD +0.5 V

Allowable Power Dissipation 1.0 W

Storage Temperature -65 to +150 °C

Operating Temperature 0 to +70 °C

Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the

device.

Operating Characteristics

(VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C)

PARAMETER SYM. TEST CONDITIONS MIN. TYP. MAX. UNIT

Input Low Voltage VIL --0.5 -+0.8 V

Input High Voltage VIH -+2.2 -VDD +0.5 V

Input Leakage Current ILI VIN = VSS to VDD -2 -+2 µA

Output Leakage

Current ILO VI/O = VSS to VDD,

= VIH

(min.) or

= VIH (min.) or

= VIL (max.)

-2 -+ 2 µA

Output Low Voltage VOL IOL = +4.0 mA - - 0.4 V

Output High Voltage VOH IOH = -1.0 mA 2.4 - - V

Operating Power

Supply Current IDD

= VIL (min.),

I/O = 0 mA 70 - - 80 mA

Cycle = min.,

Duty = 100% 100 - - 70 mA

Standby Power

Supply Current ISB

= VIH (min.)

Cycle = min., Duty = 100% - - 3mA

ISB1

≥ VDD -0.2V LL - - 50 µA

L- - 100 µA

Note: Typical characteristics are at VDD = 5V, TA = 25° C.

Preliminary W24257C

Publication Release Date: January 1999

- 3 - Revision A1

CAPACITANCE

(VDD = 5V, TA = 25° C, f = 1 MHz)

PARAMETER SYM. CONDITIONS MAX. UNIT

Input Capacitance CIN VIN = 0V 6pF

Input/Output Capacitance CI/O VOUT = 0V 8pF

Note: These parameters are sampled but not 100% tested.

AC CHARACTERISTICS

AC Test Conditions

PARAMETER CONDITIONS

Input Pulse Levels 0.6V to 2.4V

Input Rise and Fall Times 5 nS

Input and Output Timing Reference Level 1.5V

Output Load CL = 100 pF, IOH/IOL = -1 mA/4 mA

AC Test Loads and Waveform

90% 90%

5 nS

10%

5 nS 10%

R1 1000 ohm

OUTPUT

660 ohm

5 pF R2

660 ohm

R1 1000 ohm

OUTPUT

100 pF

Including

Jig and

Scope

3.0V

Including

Jig and

Scope

)

(For TCLZ,,,,,

TOLZ TCHZ TOHZ TWHZ TOW

Preliminary W24257C

- 4 -

AC Characteristics, continued

(VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C)

Read Cycle

PARAMETER SYM. W24257C-70 W24257C-10 UNIT

MIN. MAX. MIN. MAX.

Read Cycle Time TRC 70 -100 -nS

Address Access Time TAA -70 -100 nS

Chip Select Access Time TACS -70 -100 nS

Output Enable to Output Valid TAOE -35 -50 nS

Chip Selection to Output in Low Z TCLZ*10 -10 -nS

Output Enable to Output in Low Z TOLZ*5-5-nS

Chip Deselection to Output in High Z TCHZ*-30 -35 nS

Output Disable to Output in High Z TOHZ*-30 -35 nS

Output Hold from Address Change TOH 10 -10 -nS

∗ These parameters are sampled but not 100% tested

Write Cycle

PARAMETER SYM. W24257C-70 W24257C-10 UNIT

MIN. MAX. MIN. MAX.

Write Cycle Time TWC 70 -100 -nS

Chip Selection to End of Write TCW 60 -80 -nS

Address Valid to End of Write TAW 60 -80 -nS

Address Setup Time TAS 0-0-nS

Write Pulse Width TWP 45 -60 -nS

Write Recovery Time

TWR 0-0-nS

Data Valid to End of Write TDW 30 -40 -nS

Data Hold from End of Write TDH 0-0-nS

Write to Output in High Z TWHZ*-30 -30 nS

Output Disable to Output in High Z TOHZ*-30 -30 nS

Output Active from End of Write TOW 0-0-nS

∗ These parameters are sampled but not 100% tested

Preliminary W24257C

Publication Release Date: January 1999

- 5 - Revision A1

TIMING WAVEFORMS

Read Cycle 1

(Address Controlled)

Address

TRC

TOH TOH

DOUT

Read Cycle 2

(Chip Select Controlled)

DOUT TCLZ

TACS CHZ

Read Cycle 3

(Output Enable Controlled)

Address

TRC

DOUT

TAA

TAOE

TOLZ

TOH

CLZTCHZ

TACS TOHZ

Preliminary W24257C

- 6 -

Timing Waveforms, continued

Write Cycle 1

Address

DOUT

DIN

TWC

TWR

TCW

TWP

TAS

TOHZ (1, 4)

TDW TDH

TAW

Write Cycle 2

(

= VIL Fixed)

Address

DOUT

DIN

TWC

TCW

TAS

TDH

TWR

TWP

TWHZ

(2) (3)

TOW

TOH

AWT

(1, 4)

Notes:

1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied.

2. The data output from DOUT are the same as the data written to DIN during the write cycle.

3. DOUT provides the read data for the next address.

4. Transition is measured ±500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.

Preliminary W24257C

Publication Release Date: January 1999

- 7 - Revision A1

DATA RETENTION CHARACTERISTICS

(TA = 0 to 70° C)

PARAMETER SYM. TEST CONDITIONS MIN. TYP. MAX. UNIT

VDD for Data Retention VDR

≥ VDD -0.2V 2.0 - - V

Data Retention Current IDDDR

≥ VDD -0.2V LL - - 20 µA

VDD = 3V L- - 50 µA

Chip Deselect to Data Retention Time TCDR See data retention 0- - nS

Operation Recovery Time TRwaveform TRC*- - nS

TRC* = Read Cycle Time

DATA RETENTION WAVEFORM

4.5V V>2V

DATA RETENTION MODE

4.5V

-0.2V

CS1 >VDD

VDD

TCDR

VIH VIH

ORDERING INFORMATION

PART NO. ACCESS

TIME (nS) OPERATING

CURRENT

MAX. (mA)

STANDBY

CURRENT

MAX. (mA)

PACKAGE

W24257C-70LL 70 80 50 600 mil DIP

W24257C-70L 70 80 100 600 mil DIP

W24257C-10L 100 70 100 600 mil DIP

W24257CS70LL 70 80 50 330 mil SOP

W24257CS-70L 70 80 100 330 mil SOP

W24257CS-10L 100 70 100 330 mil SOP

W24257CK70LL 70 80 50 300 mil Skinny

W24257CK-70L 70 80 100 300 mil Skinny

W24257CK-10L 100 70 100 300 mil Skinny

W24257CJ70LL 70 80 50 300 mil SOJ

W24257CJ-70L 70 80 100 300 mil SOJ

W24257CJ-10L 100 70 100 300 mil SOJ

Notes:

1. Winbond reserves the right to make changes to its products without prior notice.

2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in

applications where personal injury might occur as a consequence of product failure.

Preliminary W24257C

- 8 -

BONDING PAD DIAGRAM

11 12 13 15 16 17 18 20

242526

A14A12A7

A0 I/O1 I/O2 I/O3 VSS VSS I/O5 I/O6 I/O7

A10

A11

A8WEVDDVDD

A4 A13

S-2 28

S-1

S-2

I/O4 I/O8

PAD NO. X Y

1-127.08 2785.05

2-377.73 2785.05

3-628.38 2785.05

4-879.03 2785.05

5-1129.68 2785.05

6-1380.33 2785.05

7-1686.51 2640.06

8-1682.01 -2645.91

9-1448.10 -2802.51

10 -1090.80 -2802.51

11 -877.32 -2807.28

12 -627.84 -2807.28

13 -349.56 -2807.28

14S-1 -155.52 -2781.00

14S-2 -7.02 -2771.64

15 249.21 -2807.28

16 498.69 -2807.28

17 776.97 -2807.28

18 1026.45 -2807.28

19 1304.73 -2807.28

20 1689.30 -2802.51

21 1686.51 -2520.90

22 1686.51 2644.74

23 1459.17 2785.05

24 1208.52 2785.05

25 957.87 2785.05

26 707.22 2785.05

27 456.57 2785.05

28S-1 205.92 2771.55

28S-2 21.42 2780.91

Note: For bare chip form (C.O.B.) applications, the substrate must be connected to VDD or left floating in the PCB layout.

Preliminary W24257C

Publication Release Date: January 1999

- 9 - Revision A1

PACKAGE DIMENSIONS

28-pin P-DIP

Seating Plane

1. Dimension D Max. & S include mold flash or

tie bar burrs.

2. Dimension E1 does not include interlead flash.

3. Dimension D & E1 include mold mismatch and

are determined at the mold parting line.

6. General appearance spec. should be based on

final visual inspection spec.

1.631.47

0.0640.058

Notes:

Symbol Min. Nom. Max. Max.Nom.Min.

Dimension in Inches Dimension in mm

0.060 1.52

0.210 5.33

0.010

0.150

0.016

0.155

0.018

0.160

0.022

3.81

0.41

0.25

3.94

0.46

4.06

0.56

0.008

0.120

0.670

0.010

0.130

0.014

0.140

0.20

3.05

0.25

3.30

0.36

3.56

0.540 0.5500.545 13.72 13.9713.84

17.02

15.24

14.99 15.49

0.6000.590 0.610

2.29 2.54 2.79

0.090 0.100 0.110

1.460 1.470 37.08 37.34

0 15

0.090 2.29

0.6500.630 16.00 16.51

4. Dimension B1 does not include dambar

protrusion/intrusion.

5. Controlling dimension: Inches.

150

Base Plane

28-pin P-DIP Skinny

1. Dimension D Max. & S include mold flash or

tie bar burrs.

2. Dimension E1 does not include interlead flash.

3. Dimension D & E1 include mold mismatch and

are determined at the mold parting line.

6. General appearance spec. should be based on

final visual inspection spec.

1.631.47

0.0640.058

Notes:

Symbol Min. Nom. Max. Max.Nom.Min.

Dimension in Inches Dimension in mm

0.060 1.52

0.175 4.45

0.010

0.125

0.016

0.130

0.018

0.135

0.022

3.18

0.41

0.25

3.30

0.46

3.43

0.56

0.008

0.120

0.370

0.010

0.130

0.014

0.140

0.20

3.05

0.25

3.30

0.36

3.56

0.293

0.2880.283 7.447.32

7.19

9.40

7.87

7.62 8.13

0.3100.300 0.320

2.29 2.54 2.790.090 0.100 0.110

1.388 1.400 35.26 35.56

0°15°

0.055 1.40

0.350

0.330 8.38 8.89

15°

0°

4. Dimension B1 does not include dambar

protrusion/intrusion.

5. Controlling dimension: Inches.

Base Plane

Mounting Plane

28 15

1 14

Preliminary W24257C

- 10 -

Package Dimensions, continued

28-pin SO Wide Body

28 15

Seating Plane

See Detail F

Detail F

1. Dimension D Max. & S include mold flash

or tie bar burrs.

2. Dimension b does not include dambar

protrusion/intrusion.

3. Dimension D & E include mold mismatch

and determined at the mold parting line.

0.250.20

0.0100.008

Notes:

Symbol Min. Nom. Max. Max.

Nom.

Min.

Dimension in Inches Dimension in mm

0.014 0.36

0.112 2.85

0.004

0.093

0.014

0.098

0.016

0.103

0.020

2.36

0.36

0.10

2.49

0.41

2.62

0.51

0.059

0.004

010

0.713

0.067

0.733

0.075 1.50

18.11

1.70

18.62

1.91

0.4770.4650.453 12.1211.8111.51

0.10

8.53

8.41

8.28

0.3360.3310.326

0.71 0.91 1.12

0.028 0.036 0.044

4. Controlling dimension: Inches.

5. General appearance spec should be based

on final visual inspection spec.

1.12 1.27 1.420.044 0.050 0.056

S1.19

0.047

28-pin Small Outline J Band

s1b

Seating Plane

EHE

1528

£c

0.360.20

0.014

0.008

Symbol Min. Nom. Max. Max.Nom.Min.

Dimension in Inches Dimension in mm

0.010 0.25

0.140 3.56

0.027

0.095

0.016

0.100

0.018

0.105

0.022

2.41

0.41

0.69

2.54

0.46

2.67

0.56

0.077

0.004

010

0.710

0.087

0.730

0.097 1.96

18.03

2.21

18.54

2.46

0.285

0.265

0.245 7.246.73

6.22

0.10

7.75

7.62

7.49

0.3050.300

0.295

8.31 8.56 8.81

0.327 0.337 0.347

1. Dimension D Max. & S include mold flash

or tie bar burrs.

2. Dimension b does not include dambar

protrusion/intrusion.

4. Controlling dimension: Inches.

5. General appearance spec. should be based

on final visual inspection spec.

Notes:

3. Dimension D & E include mold mismatch

and are determined at the mold parting line.

b10.810.710.66

0.0320.028

0.026

0.044 0.050 0.056 1.12 1.27 1.42

0.045 1.14

Preliminary W24257C

Publication Release Date: January 1999

- 11 - Revision A1

VERSION HISTORY

VERSION DATE PAGE DESCRIPTION

A1 Jan. 1999 -Initial Issued

Headquarters

No. 4, Creation Rd. III,

Science-Based Industrial Park,

Hsinchu, Taiwan

TEL: 886-3-5770066

FAX: 886-3-5796096

http://www.winbond.com.tw/

Voice & Fax-on-demand: 886-2-27197006

Taipei Office

11F, No. 115, Sec. 3, Min-Sheng East Rd.,

Taipei, Taiwan

TEL: 886-2-27190505

FAX: 886-2-27197502

Winbond Electronics (H.K.) Ltd.

Rm. 803, World Trade Square, Tower II,

123 Hoi Bun Rd., Kwun Tong,

Kowloon, Hong Kong

TEL: 852-27513100

FAX: 852-27552064

Winbond Electronics North America Corp.

Winbond Memory Lab.

Winbond Microelectronics Corp.

Winbond Systems Lab.

2727 N. First Street, San Jose,

CA 95134, U.S.A.

TEL: 408-9436666

FAX: 408-5441798

Note: All data and specifications are subject to change without notice.