Preliminary W24257C 32K x 8 CMOS STATIC RAM GENERAL DESCRIPTION The W24257C is a slow speed, low power CMOS static RAM organized as 32768 x 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbond's high performance CMOS technology. FEATURES * * * * Low power consumption: - Active: 400 mW (max.) - Standby: 250 W (max.) (LL-version) 500 W (max.) (L-version) Access time: 70/100 nS (max.) Single +5V power supply Fully static operation PIN CONFIGURATION * * * * * All inputs and outputs directly TTL compatible Three-state outputs Battery back-up operation capability Data retention voltage: 2V (min.) Available packages: 28-pin 600 mil DIP, 330 mil SOP, 300 mil skinny DIP and SOJ BLOCK DIAGRAM VDD V SS A14 1 28 VDD A12 2 27 WE A0 . . A7 3 26 A13 A14 A6 4 25 A8 A5 5 24 A9 A4 6 23 A11 A3 7 22 OE A2 8 21 A10 A1 9 20 CS A0 10 19 I/O8 I/O1 11 18 I/O7 I/O2 12 17 I/O6 CS Chip Select Input I/O3 13 16 I/O5 WE Write Enable Input VSS 14 15 I/O4 OE VDD Output Enable Input VSS Ground DECODER CORE ARRAY CS OE CONTROL DATA I/O WE I/O1 . . I/O8 PIN DESCRIPTION SYMBOL Address Inputs A0-A14 I/O1-I/O8 -1- DESCRIPTION Data Inputs/Outputs Power Supply Publication Release Date: January 1999 Revision A1 Preliminary W24257C TRUTH TABLE CS H L L L OE X H L X WE X H H L MODE I/O1-I/O8 Not Selected Output Disable Read Write High Z High Z Data Out Data In VDD CURRENT ISB, ISB1 IDD IDD IDD DC CHARACTERISTICS Absolute Maximum Ratings PARAMETER Supply Voltage to VSS Potential Input/Output to VSS Potential Allowable Power Dissipation Storage Temperature RATING UNIT -0.5 to +7.0 -0.5 to VDD +0.5 1.0 -65 to +150 V V W C 0 to +70 C Operating Temperature Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device. Operating Characteristics (VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C) PARAMETER SYM. TEST CONDITIONS MIN. TYP. MAX. UNIT Input Low Voltage Input High Voltage Input Leakage Current VIL VIH ILI - -0.5 +2.2 -2 - +0.8 VDD +0.5 +2 V V A Output Leakage Current ILO -2 - +2 A Output Low Voltage Output High Voltage Operating Power Supply Current VOL VOH IDD 2.4 - - 0.4 80 V V mA - - 70 mA - - 3 mA LL - - 50 A L - - 100 A Standby Power Supply Current VIN = VSS to VDD VI/O = VSS to VDD, CS = VIH (min.) or OE = VIH (min.) or WE = VIL (max.) IOL = +4.0 mA IOH = -1.0 mA 70 CS = VIL (min.), I/O = 0 mA Cycle = min., 100 Duty = 100% ISB CS = VIH (min.) Cycle = min., Duty = 100% ISB1 CS VDD -0.2V Note: Typical characteristics are at VDD = 5V, TA = 25 C. -2- Preliminary W24257C CAPACITANCE (VDD = 5V, TA = 25 C, f = 1 MHz) PARAMETER SYM. CONDITIONS MAX. UNIT Input Capacitance CIN VIN = 0V 6 pF Input/Output Capacitance CI/O VOUT = 0V 8 pF Note: These parameters are sampled but not 100% tested. AC CHARACTERISTICS AC Test Conditions PARAMETER CONDITIONS Input Pulse Levels 0.6V to 2.4V Input Rise and Fall Times 5 nS Input and Output Timing Reference Level 1.5V Output Load CL = 100 pF, IOH/IOL = -1 mA/4 mA AC Test Loads and Waveform R1 1000 ohm 5V R1 1000 ohm 5V OUTPUT OUTPUT 5 pF 100 pF Including Jig and Scope R2 660 ohm Including Jig and Scope R2 660 ohm (For TCLZ , TOLZ , TCHZ, TOHZ , TWHZ , TOW ) 3.0V 90% 10% 0V 90% 10% 5 nS 5 nS -3- Publication Release Date: January 1999 Revision A1 Preliminary W24257C AC Characteristics, continued (VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C) Read Cycle PARAMETER SYM. W24257C-70 W24257C-10 UNIT MIN. MAX. MIN. MAX. Read Cycle Time TRC 70 - 100 - nS Address Access Time TAA - 70 - 100 nS Chip Select Access Time TACS - 70 - 100 nS Output Enable to Output Valid TAOE - 35 - 50 nS Chip Selection to Output in Low Z TCLZ* 10 - 10 - nS Output Enable to Output in Low Z TOLZ* 5 - 5 - nS Chip Deselection to Output in High Z TCHZ* - 30 - 35 nS Output Disable to Output in High Z TOHZ* - 30 - 35 nS Output Hold from Address Change TOH 10 - 10 - nS These parameters are sampled but not 100% tested Write Cycle PARAMETER SYM. W24257C-70 W24257C-10 MIN. MAX. MIN. MAX. UNIT Write Cycle Time TWC 70 - 100 - nS Chip Selection to End of Write TCW 60 - 80 - nS Address Valid to End of Write TAW 60 - 80 - nS Address Setup Time TAS 0 - 0 - nS Write Pulse Width TWP 45 - 60 - nS TWR 0 - 0 - nS Data Valid to End of Write TDW 30 - 40 - nS Data Hold from End of Write TDH 0 - 0 - nS Write to Output in High Z TWHZ* - 30 - 30 nS Output Disable to Output in High Z TOHZ* - 30 - 30 nS Output Active from End of Write TOW 0 - 0 - nS Write Recovery Time CS, WE These parameters are sampled but not 100% tested -4- Preliminary W24257C TIMING WAVEFORMS Read Cycle 1 (Address Controlled) TRC Address TAA TOH TOH DOUT Read Cycle 2 (Chip Select Controlled) CS TACS TCHZ TCLZ DOUT Read Cycle 3 (Output Enable Controlled) T RC Address T AA OE T OH T AOE T OLZ CS T ACS D OUT T CHZ T OHZ TCLZ -5- Publication Release Date: January 1999 Revision A1 Preliminary W24257C Timing Waveforms, continued Write Cycle 1 TWC Address T WR OE TCW CS T AW WE T WP TAS TOHZ (1, 4) D OUT T DW TDH D IN Write Cycle 2 ( OE = VIL Fixed) T WC Address TWR TCW CS TAW WE T WP TAS TOH TWHZ (1, 4) D OUT TDW (2) (3) TOW TDH DIN Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. DOUT provides the read data for the next address. 4. Transition is measured 500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested. -6- Preliminary W24257C DATA RETENTION CHARACTERISTICS (TA = 0 to 70 C) PARAMETER SYM. TEST CONDITIONS VDD for Data Retention VDR CS VDD -0.2V Data Retention Current IDDDR CS VDD -0.2V VDD = 3V Chip Deselect to Data Retention Time TCDR See data retention Operation Recovery Time waveform TR MIN. TYP. MAX. UNIT 2.0 - - V LL - - 20 A L - - 50 A 0 - - nS TRC* - - nS TRC* = Read Cycle Time DATA RETENTION WAVEFORM DATA RETENTION MODE VDD 4.5V TCDR CS VDR > = 2V CS1 > = VDD -0.2V VIH 4.5V TR VIH ORDERING INFORMATION PART NO. STANDBY CURRENT MAX. (mA) PACKAGE ACCESS TIME (nS) OPERATING CURRENT MAX. (mA) W24257C-70LL 70 80 50 600 mil DIP W24257C-70L 70 80 100 600 mil DIP W24257C-10L 100 70 100 600 mil DIP W24257CS70LL 70 80 50 330 mil SOP W24257CS-70L 70 80 100 330 mil SOP W24257CS-10L 100 70 100 330 mil SOP W24257CK70LL 70 80 50 300 mil Skinny W24257CK-70L 70 80 100 300 mil Skinny W24257CK-10L 100 70 100 300 mil Skinny W24257CJ70LL 70 80 50 300 mil SOJ W24257CJ-70L 70 80 100 300 mil SOJ W24257CJ-10L 100 70 100 300 mil SOJ Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure. -7- Publication Release Date: January 1999 Revision A1 Preliminary W24257C BONDING PAD DIAGRAM 6 5 4 3 2 1 A4 A5 A6 A7 A12 A14 28 S-2 28 S-1 V DD V DD 27 26 25 24 23 WE A13 A8 A9 A11 7 22 A3 OE PAD NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14S-1 14S-2 15 16 17 18 19 20 21 22 23 24 25 26 27 28S-1 28S-2 Y X 21 8 A2 A10 9 A1 10 A0 11 I/O1 12 I/O2 13 I/O3 14 S-1 14 S-2 V SS V SS 15 I/O4 16 17 I/O5 I/O6 18 19 I/O7 I/O8 20 CS X -127.08 -377.73 -628.38 -879.03 -1129.68 -1380.33 -1686.51 -1682.01 -1448.10 -1090.80 -877.32 -627.84 -349.56 -155.52 -7.02 249.21 498.69 776.97 1026.45 1304.73 1689.30 1686.51 1686.51 1459.17 1208.52 957.87 707.22 456.57 205.92 21.42 Y 2785.05 2785.05 2785.05 2785.05 2785.05 2785.05 2640.06 -2645.91 -2802.51 -2802.51 -2807.28 -2807.28 -2807.28 -2781.00 -2771.64 -2807.28 -2807.28 -2807.28 -2807.28 -2807.28 -2802.51 -2520.90 2644.74 2785.05 2785.05 2785.05 2785.05 2785.05 2771.55 2780.91 Note: For bare chip form (C.O.B.) applications, the substrate must be connected to VDD or left floating in the PCB layout. -8- Preliminary W24257C PACKAGE DIMENSIONS 28-pin P-DIP Symbol A A1 A2 B B1 c D E E1 e1 L D 28 15 a E1 eA S Notes: 1 14 E S c A A2 A1 L Base Plane Seating Plane B e1 eA a B1 Dimension in Inches Dimension in mm Min. Nom. Max. Min. Nom. Max. 5.33 0.210 0.010 0.25 0.150 0.155 0.160 3.81 3.94 4.06 0.016 0.018 0.022 0.41 0.46 0.56 0.058 0.060 0.064 1.47 1.52 1.63 0.008 0.010 0.014 0.20 0.25 0.36 1.460 1.470 37.08 37.34 0.590 0.600 0.610 14.99 15.24 15.49 0.540 0.545 0.550 13.72 13.84 13.97 0.090 0.100 0.110 2.29 2.54 2.79 0.120 0.130 0.140 3.05 3.30 3.56 15 0 0.650 0.670 16.00 16.51 17.02 0 0.630 15 0.090 2.29 1. Dimension D Max. & S include mold flash or tie bar burrs. 2. Dimension E1 does not include interlead flash. 3. Dimension D & E1 include mold mismatch and are determined at the mold parting line. 4. Dimension B1 does not include dambar protrusion/intrusion. . 5. Controlling dimension: Inches. 6. General appearance spec. should be based on final visual inspection spec. 28-pin P-DIP Skinny Symbol A A1 A2 B B1 c D E E1 e1 L D 28 15 E1 1 14 a eA S Notes: E S A A2 A1 L c Base Plane Mounting Plane B B1 e1 a eA -9- Dimension in Inches Min. Nom. Max. Dimension in mm Min. Nom. 0.010 Max. 4.45 0.175 0.25 0.125 0.130 0.135 3.18 3.30 3.43 0.016 0.018 0.022 0.41 0.46 0.56 0.058 0.060 0.064 1.47 1.52 1.63 0.008 0.010 0.014 0.20 0.25 0.36 1.388 1.400 35.26 35.56 8.13 0.300 0.310 0.320 7.62 7.87 0.283 0.288 0.293 7.19 7.32 7.44 0.090 0.100 0.110 2.29 2.54 2.79 0.120 0.130 0.140 3.05 3.30 3.56 15 0 0.370 8.38 8.89 9.40 0 0.330 0.350 0.055 15 1.40 1. Dimension D Max. & S include mold flash or tie bar burrs. 2. Dimension E1 does not include interlead flash. 3. Dimension D & E1 include mold mismatch and are determined at the mold parting line. 4. Dimension B1 does not include dambar protrusion/intrusion. 5. Controlling dimension: Inches. 6. General appearance spec. should be based on final visual inspection spec. Publication Release Date: January 1999 Revision A1 Preliminary W24257C Package Dimensions, continued 28-pin SO Wide Body Symbol 28 A A1 A2 b c D E e HE L LE S y 15 e1 E HE L Detail F 14 1 b Dimension in Inches Dimension in mm Min. Nom. Max. Min. Nom. Max. 2.85 0.112 0.004 0.10 0.093 0.098 0.103 2.36 2.49 2.62 0.014 0.016 0.020 0.36 0.41 0.51 0.008 0.010 0.014 0.20 0.25 0.36 0.713 0.733 18.11 18.62 0.326 0.331 8.28 0.336 8.53 8.41 0.044 0.050 0.056 1.12 1.27 1.42 0.453 0.465 0.477 11.51 11.81 12.12 0.028 0.036 0.044 0.71 0.91 1.12 0.059 0.067 0.075 1.50 1.70 1.91 0.047 1.19 0.004 0.10 10 0 10 0 Notes: e1 D c A2 A S e LE A1 y See Detail F Seating Plane 1. Dimension D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimension D & E include mold mismatch . and determined at the mold parting line. 4. Controlling dimension: Inches. 5. General appearance spec should be based on final visual inspection spec. 28-pin Small Outline J Band Symbol 28 A A1 A2 b1 b c D E e e1 HE L S y 15 E 1 HE 14 Dimension in Inches Min. Nom. Max. Dimension in mm Min. Nom. 0.027 Max. 3.56 0.140 0.69 0.095 0.100 0.105 2.41 2.54 2.67 0.026 0.028 0.032 0.66 0.71 0.81 0.016 0.018 0.022 0.41 0.46 0.56 0.008 0.010 0.014 0.20 0.25 0.36 0.710 0.730 18.03 18.54 0.295 0.300 0.305 7.49 7.62 7.75 0.044 0.050 0.056 1.12 1.27 1.42 0.245 0.265 0.285 6.22 6.73 7.24 0.327 0.337 0.347 8.31 8.56 8.81 0.077 0.087 0.097 1.96 2.21 2.46 0.045 1.14 0.10 0.004 0 10 0 10 Notes: D c A2 s Seating Plane b b1 A L c e e1 A1 y - 10 - 1. Dimension D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimension D & E include mold mismatch and are determined at the mold parting line. 4. Controlling dimension: Inches. 5. General appearance spec. should be based on final visual inspection spec. Preliminary W24257C VERSION HISTORY VERSION DATE PAGE A1 Jan. 1999 - Headquarters DESCRIPTION Initial Issued Winbond Electronics (H.K.) Ltd. Rm. 803, World Trade Square, Tower II, No. 4, Creation Rd. III, 123 Hoi Bun Rd., Kwun Tong, Science-Based Industrial Park, Kowloon, Hong Kong Hsinchu, Taiwan TEL: 852-27513100 TEL: 886-3-5770066 FAX: 852-27552064 FAX: 886-3-5796096 http://www.winbond.com.tw/ Voice & Fax-on-demand: 886-2-27197006 Winbond Electronics North America Corp. Winbond Memory Lab. Winbond Microelectronics Corp. Winbond Systems Lab. 2727 N. First Street, San Jose, CA 95134, U.S.A. TEL: 408-9436666 FAX: 408-5441798 Taipei Office 11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-27190505 FAX: 886-2-27197502 Note: All data and specifications are subject to change without notice. - 11 - Publication Release Date: January 1999 Revision A1