RoHS Compliant
SATA-Disk Module 4
SDM4 22P/180D Product Specifications
December 1st, 2011
Version 1.0
Apacer Technology Inc.
4th Fl., 75 Hsin Tai Wu Rd., Sec.1, Hsichih, New Taipei City, Taiwan 221
Tel: +886-2-2698-2888 Fax: + 886-2-2698-2889
www.apacer.com
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Features:
z Standard Serial ATA 2.6 (Gen. 2)
– Serial ATA 2.6 (Gen. 2)
– SATA II, 3.0 Gbps
– ATA-compatible command set
z Capacities
– 2, 4, 8, 16, 32, 64 GB
z Performance*
– Burst read/write: 300 MB/sec
– Sustained read: up to 165 MB/sec
– Sustained write: up to 150 MB/sec
z Intelligent endurance design
– Built-in hardware ECC, enabling up to
16/24 bit correction per 1K bytes
– Static wear-leveling sche me together
with dynamical block allocation to
significantly increase the lifespan of a
flash device and optimize the disk
performance
– Flash bad-block mana gement
– S.M.A.R.T.
– Power Failure Management
– ATA Secure Erase
– TRIM
z NAND Flash Type: SLC
z Zero power data retention
– No battery required for data storage
z Temperature ranges
– Operation: 0°C to 70°C (32 ~ 158°F)
– Extended: -40 ~ +85°C (-40° ~ 185°F)
– Storage: -40°C to 100°C (-40° ~ 212°F)
z Supply voltage
– 5.0 V ± 5%
z Power consumption (ty pical)*
– Active mode: 333 mA@5.0 V
– Idle mode: 95 mA@5.0 V
z Connector type
– 7-pin SATA signal connector
– 15-pin SATA power connector
z Form factor
– SATA Disk Module
– Dimension: 45.80x32.80x1.00**, unit: mm
z Shock & Vibration
– Shock: 50g (approx.)
– Vibration: 15g (approx.)
z RoHS compliant
*Varies from capacities. The values for performances and power consumptions presented are typical and may vary depending on flash configurations
or platform settings. The term idle refers to the standby state of the device.
**Excluding the thickness/height of chips and connector, only the thickne s s of the module is accounted.
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Table of Contents
1. GENERAL DESCRIPTION.................................................................................................... 3
1.1 PERFORMANCE-OPTIMIZED CONTROLLER............................................................................................................3
1.1.1 Power Management Unit (PMU)..................................................................................................................3
1.1.2 SRAM Buffer.............................................................................................................. ...................................3
2. FUNCTIONAL BLOCK DIAGRAM..................................................................................... 4
3. PIN ASSIGNMENTS................................................................................................................ 5
4. CAPACITY SPECIFICATION............................................................................................... 7
4.1 PERFORMANCE SPECIFICATION.............................................................................................................................7
4.1.1 ATA Mode Support .......................................................................................................................................7
4.1.2 Performance .................................................................................................................................................7
4.2 ENVIRONMENTAL SPECIFICATIONS.......................................................................................................................8
4.3 MEAN TIME BETWEEN FAILURES (MTBF)...........................................................................................................8
4.4 CERTIFICATION AND COMPLIANCE.......................................................................................................................8
5. FLASH MANAGEMENT....................................................................................................... 9
5.1 ERROR CORRECTION/DETECTION .........................................................................................................................9
5.2 BAD BLOCK MANAGEMENT .................................................................................................................................9
5.3 WEAR LEVELING ..................................................................................................................................................9
5.4 POWER FAILURE MANAGEMENT...........................................................................................................................9
5.5 ATA SECURE ERASE ............................................................................................................................................9
5.6 S.M.A.R.T..........................................................................................................................................................10
5.7 TRIM .................................................................................................................................................................10
6. SOFTWARE INTERFACE.................................................................................................. 11
6.1 COMMAND SET...................................................................................................................................................11
7. ELECTRICAL SPECIFICATION...................................................................................... 12
7.1 ELECTROSTATIC DISCHARGE .............................................................................................................................13
7.2 ELECTRICAL FAST TRANSIENT/BURST ...............................................................................................................13
8. PHYSICAL CHARACTERISTICS..................................................................................... 15
8.1 DIMENSIONS.......................................................................................................................................................15
9. PRODUCT ORDERING INFORMATION........................................................................ 16
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1. General Description
Apacer’s SATA-Disk Module 4 (SDM4) is a high-performance, embedded SSD designed to replace the
conventional SATA hard disk drive. SDM SSD can be plugged into a standard Serial ATA connectors
commonly found in desktops, IT-STB, industrial PC and thin client systems. Moreover, Apacer provides
an innovative way for design-in customers to strengthen the vibration-resistance between SDM4 and
mainboard.
Apacer’s SDM4-M has a built-in microcontroller with file management firmware that communicates with
SATA standard interface. This means SDM4 does not require additional or proprietary host software such
as Flash File System (FFS) and Memory Technology Driver (MTD). This product is well suited for
embedded flash storage applications offering new and expanded functionalities as well as more cost-
effective designs, better performance and increased reliability.
SDM4 Series is designed to work at 5 Volts and uses a standard SATA driver that complies with major
operating systems such as Microsoft’s Wind ows series.
Featuring technologies as Apacer-specific Wear-leveling algorithms, S.M.A.R.T, Enhanced Data Integrity,
Intelligent Power Failure Management, ATA Secure Erase, and TRIM, Apacer assures user s of a versatile
device on data storage.
This SDM4 SSD is designed to be rugged for industrial applications where harsh, demanding
environments are often encountered, and has gone through environmental testings such as shock, wide
temperature range and ESD. Our SSDs meet international standards and we specialized in customization
services in both hardware and systems.
Our customization services include:
y Product change notification (PCN)1
y Pre-installed software, custom softwa re imaging and ID strings2
y Customize packaging and labeling2
y Specified testing2
y Safety packaging, such as ESD protection pad, honeycomb-cut packing in sponge, or other types of
protection.
y Field Application Engineers in our overseas branches for technical support
1Usually notified by our sales representatives or product managers, instead of on packages.
2Depending on specified requests
1.1 Performance-Optimized Controller
The heart of SDM4 is the Flash controller, which translates standard SATA signals into the data and
controls of the flash media. The SATA and Flash Management controller are specifically designed to
attain high data throughput from the host to the flash.
1.1.1 Power Management Unit (PMU)
The power management unit (PMU) controls the power consumption of SDM4. It can dramatically extend
product battery life by leaving the idle part of the circuitry into sleep mode. The PMU has zero wake-up
latency.
1.1.2 SRAM Buffer
The Flash Controller performs as a SRAM buffer to optimize the host’s data transfer to and from the flash
media.
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2. Functional Block Diagram
SDM4 includes the SATA and Flash Management controllers, and flash media, as well as the SATA
standard interface. Figure 2-1 shows the functional block diagram.
Figure 2-1: Functional block diag ram
SATA
Controller Flash
Media
Serial ATA
Interface
Flash
Management
Controller
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3. Pin Assignments
SATA Connectors
Table 3-1: Signal segment Table 3-2: Power segment
Name Type Description Pin Signal/Description
S1 GND P1 Unused (3.3V)
S2 RxP + Differential Receive Signal P2 Unused (3.3V)
S3 RxN - Differential Receive Signal P3 Unused (3.3V)
S4 GND P4 Ground
S5 TxN - Differential Transmit Signal P5 Ground
S6 TxP + Differential Transmit Signal P6 Ground
S7 GND P7 5V
P8 5V
P9 5V
P10 Ground
P11 Reserved/Ground
P12 Ground
P13 Unused (12V)
P14 Unused (12V)
P15 Unused (12V)
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Figure 3-1 SATA Cable/Connector Connection Diagram
The connector on the left represents the Host with TX/RX differential pairs connected to a cable. The
connector on the right shows the Device with TX/RX differential pairs also connected to the cable. Notice
also the ground path connecting the shielding of the cable to the Cable Rece ptacle.
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4. Capacity Specification
Capacity specification of SDM4 is available as shown in Table 4-1. It lists the specific capacity and the
default numbers of heads, sectors and cylinders for each product line.
Table 4-1: Capacity specifications
Capacity Total bytes* Cylinders Heads Sectors Max LBA
2 GB 2,002,452,480 3,880 16 63 3,911,040
4 GB 3,011,420,160 5835 16 63 5,881,680
8 GB 7,012,196,352 15334 16 63 13,695,696
16 GB 16,013,942,784 16,383 16 63 31,277,232
32 GB 32,017,047,552 16,383 16 63 62,533,296
64 GB 63,351,106,560 16,383 16 63 123,732,736
*Display of total bytes varies from file systems, which means not all of the bytes can be used for storage.
4.1 Performance Specification
4.1.1 ATA Mode Support
SDM4 supports the following ATA operating modes:
z Supports up to PIO Mode-4
z Supports up to Multi-word DMA Mode-2
z Supports up to Ultra DMA Mode-5
4.1.2 Performance
Performances of SDM4 are listed bel ow in table 4-2.
Table 4-2: Performance (Standard)
Capacity
Performance
2 GB 4 GB 8 GB 16 GB 32 GB
Sustained read (MB/s) 75 80 80 85 85
Sustained write (MB/s) 26 50 50 80 80
Performance (High-speed)
Capacity
Performance
4 GB 8 GB 16 GB 32 GB 64 GB
Sustained read (MB/s) 150 160 160 160 165
Sustained write (MB/s) 50 100 95 145 150
Note: Results may differ from various flash configurations.
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4.2 Environmental Specifications
Environmental specification of SDM4 product family which follows the MIL-STD-202 and MIL-STD-810
standards is available as shown in Table 4-3.
Table 4-3 SDM4 environmental specific ations
Item Specification
operating temperature 0~70(℃)
Extended temperature -40 ~ +85(℃)
non-operating t emp. -40~100(℃)
humidity 10~95% R.H, non-condensing
operating vibration 10~2000(Hz), 15(G), sine wave, 1(hr)/per axis
non-operating vibration 20~2000(Hz), 7.7(Grms), random wave, 1(hr)/per axis
operating shock 50(G), 11(ms), half-sine wave
non-operating shock 1500(G), 0.5(ms), half-sine wave
4.3 Mean Time Between Failures (MTBF)
Mean Time Between Failures (MTBF) is predicted based on reliability data for the individual components
in SDM4. Although many component MTBFs are given in databases and often these values are not really
accurate, the prediction result for SDM4 i s more than 2 , 000,000 hours.
Notes about the MTBF:
The MTBF is predicated and calculated based on “Telcordia Tech nologies Special R eport, SR- 332, Iss ue
2” method.
4.4 Certification and Compliance
SDM4 complies with the following standards:
z CE – EN55022/55024
z FCC 47CFR Part15 Class B
z RoHS
z MIL-STD-202 and MIL-STD-810
z SATA II (SATA Rev. 2.6)
z Up to ATA/ATAPI-7 ( including S.M.A.R.T.)
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5. Flash Management
5.1 Error Correction/Detection
SDM4 implements a hardware ECC scheme, based on the BCH algorithm. It can detect and correct up to
16 bits or 24 bits error in 1K bytes.
5.2 Bad Block Management
Although bad blocks on the flash media are already identified by the flash manufacturer, they can also be
accumulated over time during operation. SDM4’s controller maintains a table that lists those normal
blocks with disk data, the free blocks for wear leveling, and bad blocks with errors. When a normal block
is detected broken, it is replaced with a free block and listed as a bad block. When a free block is
detected broken, it is then removed from the free block list and marked as a bad block.
During device operation, this ensures that newly accumulated bad blocks are transparent to the host. The
device will stop file write service once there are only two free blocks left such that the read function is still
available for copying the files from the disk into another.
5.3 Wear Leveling
The NAND flash devices are limited by a certain number of write cycles. When using a FAT-based file
system, frequent FAT table updates are required. If some area on the flash wears out faster than others, it
would significantly reduce the lifetime of the whole SSD, even if the erase counts of others are far from
the write cycle limit. Thus, if the write cycles can be distributed evenly across the media, the lifetime of the
media can be prolonged significantly. This scheme is called wear leveling.
Apacer’s wear-leveling scheme is achieved both via buffer management and Apacer-specific static wear
leveling. They both ensure that the lifetime of the flash media can be increased, and the disk access
performance is optimized as well.
5.4 Power Failure Management
The Low Power Detection on the controller initiates crucial data saving before the power supplied to the
device is too low. This feature prevents the device from crash and ensures data integrity during an
unexpected power-off.
5.5 ATA Secure Erase
Accomplished by the Secure Erase (SE) command, which added to the open ANSI standards that control
disk drives, “ATA Secure Erase” is built into the disk drive itself and thus far less susceptible to malicious
software attacks than external software utilities. It is a positive easy-to-use data destroy command,
amounting to electronic data shredding. Executing the command causes a drive to internally completely
erase all possible user data. This command is carried out within disk drives, so no additional software is
required. Once executed, neither data nor the erase counter on the device would be recoverable, which
blurs the accuracy of device lifespan. The process to erase will not be stopped until finished while
encountering power failure, and will be continued when power is back o n.
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5.6 S.M.A.R.T.
S.M.A.R.T. is an acronym for Self-Monitoring, Analysis and Reporting Technology, an open standard
allowing disk drives to automatically monitor their own health and report potential problems. It protects the
user from unscheduled downtime by monitoring and storing critical drive performance and calibration
parameters. Ideally, this should allow taking proactive actions to pre v ent impending drive failure.
Apacer SDM4 uses the standard SMART command B0h to read data from the drive for SMART feature
as the SATA Rev.2.6 ATA/ATAPI-7 specifications. Based on the SFF-8035i Rev. 2.0 specifications,
Apacer SMART defines vendor-specified SMART Attribute IDs (A0h, A1h, A2h, A3h, A4h-A5h) in SDM4.
They represent initial back block count, bad block count, spare block count, maximum erase count, and
average erase counts respectively. When the Apacer SMART Utility running on the host, it analyzes and
reports the disk status to the host before SDM4 is in critical condition.
5.7 TRIM
Made of millions of NAND flash cells, SSD can be written into groups called pages in 4K size generally,
but can only be erased in larger groups called blocks of 128 pages or 512KB. These stipulations are
partially the source of many performance issues. Until an address gets used again, the SSD has to keep
track of every last bit of data that’s written on it. The ATA-TRIM instruction tilts the balance in favor of the
SSD. TRIM addresses a major part of the performance degradation issue over time that plagues all SSDs.
A TRIM enabled drive running an OS with TRIM support will stay closer to its peak performance over time.
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6. Software Interface
6.1 Command Set
This section defines the software requirements and the format of the commands the host sends to SDM4.
Commands are issued to SDM4 by loading the required registers in the command block with the supplied
parameters, and then writing the command code to the Command regi ster.
Table 6-1: Command set
Code Command Code Command
E5h Check Power Mode F3h Securit
y
Erase Pre
p
are
06h Data Set Mana
g
ement F4h Securit
y
Erase Unit
90h Execute Device Dia
g
nostic F5h Securit
y
Freeze Lock
E7h Flush Cache F1h Securit
y
Set Password
EAh Flush Cache EXT F2h Securit
y
Unlock
ECh Identif
y
Device 70h Seek
E3h Idle EFh Set Features
E1h Idle Immediate C6h Set Multi
p
le Mode
91h Initialize Device Parameters E6h Slee
p
C8h Read DMA B0h SMART
25h Read DMA EXT E2h Standb
y
C4h Read Multi
p
le E0h Standb
y
Immediate
29h Read Multi
p
le EXT CAh Write DMA
20h Read Secto
r
35h Write DMA EXT
24h Read Sector EXT C5h Write Multi
p
le
40h Read Verif
y
Sectors 39h Write Multi
p
le E
X
T
42h Read Verif
y
Sectors EXT 30h Write Secto
r
10h Recalibrate 34h Write Sector EXT
F6h Securit
y
Disable Password
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7. Electrical Specification
Caution: Absolute Maximum Stress Ratings – Applied conditions greater than those listed under
“Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these conditions or conditions greater than those defined in
the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating
conditions may affect device reliability.
Table 7-1: Operating range
Range Ambient Temperature 5V
Standard 0°C to +70°C
Extended Temperature -40°C to 85°C 4.75-5.25V
Table 7-2: Absolute maximum power pin stress ratings
Parameter Symbol Conditions
Input Power VDD -0.3V min. to 6.5V max.
Voltage on any pin except VDD with respect to GND V -0.5V min. to VDD + 0.5V max.
Table 7-3: Recommended system powe r-up timing
Symbol Parameter Typical Maximum Units
TPU-READY1 Power-up to Ready Operation 200 1000 ms
TPU-WRITE1 Power-up to Write Operation 200 1000 ms
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
Table 7-4: Power consumption – Standard (typi cal)
Capacity
Mode 2 GB 4 GB 8 GB 16 GB 32 GB
Active
(mA) 187 224 233 220 230
Stand By
(mA) 71 72 72 75 75
Power consumption – High speed (typical)
Capacity
Mode 4 GB 8 GB 16 GB 32 GB 64 GB
Active
(mA) 255 333 324 280 300
Stand By
(mA) 85 95 95 77 80
Note: Power consumptions may vary depending on flash configurations and platforms
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7.1 Electrostatic Discharge
Electrostatic discharge
Item Amount of
Discharge Voltage Required
Criteria Complied To Criteria
(A,B,C)
Air Discharge 10
10
+8kV
-8kV
B
B
A
A
Contact
Discharge
25
25
+4kV
-4kV
B
B
A
A
Indirect
Discharge
(HCP)
25
25
+4kV
-4kV
B
B
A
A
Indirect
Discharge
(VCP Front)
25
25
+4kV
-4kV
B
B
A
A
Indirect
Discharge
(VCP Left)
25
25
+4kV
-4kV
B
B
A
A
Indirect
Discharge
(VCP Back)
25
25
+4kV
-4kV
B
B
A
A
Indirect
Discharge
(VCP Right)
25
25
+4kV
-4kV
B
B
A
A
7.2 Electrical Fast Transient/Burst
Electrical Fast Transient/Burst
Inject
Line Polarity Voltage
kV
Inject
Time
(Second)
Inject
Method Required
Criteria
Complied
to
Criteria
L-N-PE ± 1kV 60 Direct B A
Notes about 7.1 Electrostatic Discharge & 7.2 Electrical Fast Transient/Burst
The tests performed are from lowest level up to the highest level as required by standard, but only highest
level is shown on the report.
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Meet criteria A: Operate as intended during a nd after the test
Meet criteria B: Operate as intended after the test
Meet criteria C: Loss/Error of function
Additional Information:
EUT stopped operation and could / could not be reset by operator at kV.
No false alarms or other malfun ctions were observed during or after the test.
The Contact discharges were applied at least total 200 discharges at a minimum of four test points.
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8. Physical Characteristics
8.1 Dimensions
Unit: ㎜
Tolerance: ± 0.25
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9. Product Ordering Information
9.1 Product Code Designations
A P SDM x x x x 4 5 A x – A X X
Flash Type
T: Toshiba
C: Micron
SATA Disk Module
Apacer Product Code
Capacities:
002G= 2GB
004G= 4GB
008G= 8GB
016G= 16GB
032G= 32GB
064G= 64GB
Form Factor
Solution Version
Configuration
N: Standard
D: Dual Channel
V
ersion Control
Apacer Brand
Temperature Range
Blank: Standard
W: Extended Temperature
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9.2 Valid Combinations
9.2.1 SDM4 22P/180D Standard type
Capacity Standard Extended Temperature
2GB APSDM002G45AN-AT APSDM002G45AN-ATW
4GB APSDM004G45AN-AT APSDM004G45AN-ATW
8GB APSDM008G45AN-AT APSDM008G45AN-ATW
16GB APSDM016G45AN-AC APSDM016G45AN-ACW
32GB APSDM032G45AN-AC APSDM032G45AN-ACW
9.2.2 SDM4 22P/180D High Speed type
Capacity Standard Extended Temperature
4GB APSDM004G45AD-AT APSDM004G45AD-ATW
8GB APSDM008G45AD-AT APSDM008G45AD-ATW
16GB APSDM016G45AD-AT APS DM01 6G45AD-ATW
32GB APSDM032G45AD-AC APSDM032G45AD-ACW
64GB APSDM064G45AD-AC APSDM064G45AD-ACW
Note: Valid combinations are those products in mass production or will be in mass production. Consult your Apacer
sales representative to confirm availability of valid combinations and to determine availability of new combinations.
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Revision History
Revision Date Description Remark
0.1 11/22/2011 Preliminary release
1.0 12/01/2011 Official release
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Global Presence
Taiwan (Headquarters)
Apacer Technology Inc.
4th Fl., 75 Hsin Tai Wu Rd., Sec.1
Hsichih, New Taipei City
Taiwan 221
R.O.C.
Tel: +886-2-2698-2888
Fax: +886-2-2698-2 889
amtsales@apacer.com
U.S.A.
Apacer Memory America, Inc.
386 Fairview Way, Suite102,
Milpitas, CA 95035
Tel: 1-408-518-8699
Fax: 1-408-935-9611
sa@apacerus.com
Japan
Apacer Technology Corp.
5F, Matsura Bldg., Shiba, Minato-Ku
Tokyo, 105-0014, Japan
Tel: 81-3-5419-2668
Fax: 81-3-5419-0018
jpservices@apacer.com
Europe
Apacer Technology B.V.
Science Park Eindhoven 5051 5692 EB Son,
The Netherlands
Tel: 31-40-267-0000
Fax: 31-40-267- 0000#6199
sales@apacer.nl
China
Apacer Electronic (Shanghai) Co., Ltd
1301, No.251,Xiaomuqiao Road, Shanghai,
200032, China
Tel: 86-21-5529-0222
Fax: 86-21-5206-6939
sales@apacer.com.cn
India
Apacer Technologies Pvt Ltd,
#1064, 1st Floor, 7th ‘A’ Main,
3rd Block Koramangala, Bang alore – 560 034
Tel: +91 80 4152 9061/62/63
Fax: +91 80 4170 02 15
sales_india@apacer.com
