PC910L0NSZ0F
Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC910L)
2. Approved by VDE, DIN EN60747-5-2(∗) (as an
option), file No. 40008898 (as model No. PC910L)
3. Package resin : UL flammability grade (94V-0)
(∗)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Features
■ Agency approvals/Compliance
1. High speed interfaces for computer peripherals
2. Programmable controllers
3. Inverter
■ Applications
High Speed 10Mb/s, High CMR
DIP 8 pin ∗OPIC
Photocoupler
1. DIP 8 pin package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. High speed response
(tPHL : TYP. 48 ns, tPLH : TYP. 50 ns)
4. Low input current drive (IFHL : MAX. 5 mA)
5. Instantaneous common mode rejection voltage
(CMH : MIN.10 kV/µs, CML : MIN. −10 kV/µs)
6. TTL and LSTTL compatible output
7. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
8. Lead-free and RoHS directive compliant
■ Description
PC910L0NSZ0F Series contains a LED optically
coupled to an OPIC chip.
It is packaged in a 8 pin DIP.
Input-output isolation voltage(rms) is 5.0kV, High
speed response (TYP. 10 Mb/s) and CMR is MIN.
10 kV/µs.
1Sheet No.: D2-A05602EN
Date Jun. 30. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC910L0NSZ0F Series
∗
"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
■ Internal Connection Diagram
2
Sheet No.: D2-A05602EN
■ Truth table
■ Outline Dimensions (Unit : mm)
1. Through-Hole [ex. PC910L0NSZ0F] 2. Through-Hole (VDE option) [ex. PC910L0YSZ0F]
Product mass : approx. 0.55g
Plating material : SnCu (Cu : TYP. 2%)
Product mass : approx. 0.55g
PC910L0NSZ0F Series
Input Enable Output
HHL
LHH
HLH
LLH
L:Logic (0)
H:Logic (1)
1
2
3
4
8
7
6
5
1
2
3
4
5
6
7
8
NC
Anode
Cathode
NC
VE (Enable)
GND
VO (Open collector)
VCC
PC910L
Primary side
mark
SHARP
mark
"S"
2.54±0.25
8 7 6 5
6.5±0.5
0.85±0.2
1.2±0.3
9.66±0.5
3.5
±0.5
0.5±0.1
0.5TYP.
1 2 3 4
3.4±0.5
θ θ
θ:0 to 13˚
7.62±0.3
0.26±0.1
Epoxy resin
Date code
PC910L
4
VDE Identification mark
2.54±0.25
8 7 6 5
6.5±0.5
0.85±0.2
1.2±0.3
9.66±0.5
3.5
±0.5
0.5±0.1
0.5TYP.
1 2 3 4
3.4±0.5
θ θ
θ:0 to 13˚
7.62±0.3
0.26±0.1
Epoxy resin
Date code
Primary side
mark
SHARP
mark
"S"
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
3
repeats in a 20 year cycle
Sheet No.: D2-A05602EN
PC910L0NSZ0F Series
Country of origin
Japan
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A05602EN
■ Absolute Maximum Ratings
4
PC910L0NSZ0F Series
■ Electro-optical Characteristics*4
Input
IF20 mA
Reverse voltage VR5V
Power dissipation P40 mW
Output
VCC 7V
VE5.5 V
High level output voltage
VOH 7V
Low level output current
IOL 50 mA
Collector power dissipation
PC85 mW
Operating temperature
Storage temperature
Viso (rms)
Topr −40 to +85 ˚C
Tstg −55 to +125 ˚C
Tsol 270 ˚C
Forward current
*1
Supply voltage
*2
Enable voltage
*3
Isolation voltage
Soldering temperature
5.0 kV *1 Shall not exceed 500mV from supply voltage (VCC)
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
Parameter Symbol Rating Unit
(Ta=25°C)
Parameter Symbol Unit
Input
Forward voltage VFV
Reverse current IRµA
Terminal capacitance CtTa=25˚C, V=0, f=1MHz
VCC=VO=5.5V, VE=2.0V, IF=250µA
pF
mA
mA
Output
IOH
VOL
mA
mA
V
High level enable current
IEL
Low level enable current
ICCH
µA
IEH
Transfer
charac-
teristics
Isolation resistance RISO Ω
tPLH
tr
tf
∆tw
ns
tPHL ns
Ta=25˚C, IF=10mA
Ta=25˚C, VR=5V
VCC=5.5V, VE=2.0V, IF=0
MIN.
−
−
−
5×1010
25
25
−
−
MAX.
10
150
−1.6
−
−1.6
13
−
1.9
75
75
Conditions
"High→Low" input threshold
current
CMH
CML
VCC=5.5V, VE=2.0V,
IF=5mA, IOL=13mA
VCC=5.5V, VE=2.0V
VCC=5.5V, VE=0.5V
VCC=5.5V, VE=0.5V, IF=0
High level supply current
ICCL
IFHL
Low level supply current VCC=5.5V, VE=2.0V, IF=10mA
VCC=5.5V, VE=0.5V, IF=10mA
Ta=25˚C, DC500V, 40 to 60%RH
VCC=5V,VE=2.0V,
VO=0.8V, RL=350Ω
*4 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin
8
) and GND (pin
5
)
near the device, when it measures the transfer characteristics and the output side
characteristics
*5 Distortion of pulse width ∆tw= | tPHL−tPLH |
*5
TYP.
−
60
−1000.02
−0.60.4
mA
−−5
5.5
mA
−10
−0.5
−0.7
5
1011
Floating capacitance CfTa=25˚C, V=0, f=1MHz
Ta=25˚C, IF=7.5mA,
VCC=5V, RL=350Ω,
CL=15pF,
Ta=25˚C, IF=7.5mA, VCC=5V,
RL=350Ω, CL=15pF, VEH=3V
VEL=0.5V
Ta=25˚C, IF=0, VCC=5V,
VCM=1kV(P-P),
RL=350Ω, VO (Min)=2V
Ta=25˚C, IF=5mA, VCC=5V,
VCM=1kV(P-P),
RL=350Ω, VO (Max)=0.8V
1.6
−
−
mA
52.5
−
7
50
ns−−10
ns−−20
ns−35−
ns−−15
ns−−10
kV/µs10 −20
pF−50.6
48
kV/µs−10 −−20
(unles otherwise specified Ta=−40 to 85˚C)
High level output voltage
Low level output voltage
"High→Low" propagation delay time
"High→Low" enable
propagation delay time
"Low→High" enable
propagation delay time
Instantaneous common mode
rejection voltage
(High level output)
Instantaneous common mode
rejection voltage
(Low level output)
"Low→High" propagation delay time
Rise time
Fall time
Distortion of pulse width
Response time
tEHL
tELH
Sheet No.: D2-A05602EN
■ Model Line-up
5
Please contact a local SHARP sales representative to inquire about production status.
PC910L0NSZ0F Series
PC910L0NSZ0F PC910L0YSZ0F
−−−−−− Approved
−−−−−−
−−−−−−
PC910L0YIP0F
Approved
Lead Form
Package
Model No.
DIN EN60747-5-2
Sleeve
Through-Hole
Taping
SMT Gullwing
50pcs/sleeve 1 000pcs/reel
Sheet No.: D2-A05602EN
6
PC910L0NSZ0F Series
Fig.1 Test Circuit for Propagation Delay Time and Rise Time, Fall Time
Fig.2 Test Circuit for Enable Propagation Delay Time
Fig.3 Test Circuit for Instantaneous Common Mode Rejection Voltage
1
2
3
45
6
7
8
350Ω
5V
47Ω
Pulse input
0.1µF
IF
CL
VO
*CL includes the probe
and wiring capacitance.
90%
10%
7.5mA
3.75mA
0mA
5V
1.5V
IF
VO
tPHL tPLH
VOL
tr
tf
0.1µF
5V
350Ω
8
7
6
54
3
2
1
Pulse input
VE
IF=7.5mA
VO
CL
1.5V
5V
0.5V
1.5V
3V
VE
VO
tEHL tELH
VOL
*CL includes the probe
and wiring capacitance.
0.1µF
5V
350Ω
8
7
6
54
3
2
1
AB
GL SW IF
CL
VCM
*CL includes the probe and wiring capacitance.
1kV
0V
5V
VCM
VO
VOL
VO(MIN.)
VO(MAX.)
VO
(IF=0)
(IF=5mA)
When the switch for
LED sets to A
When the switch for
LED sets to B
Sheet No.: D2-A05602EN
7
PC910L0NSZ0F Series
Fig.4 Forward Current vs. Ambient
Temperature
Fig.5 Collector Power Dissipation vs.
Ambient Temperature
Fig.8 Low Level Output Voltage vs. Ambient
Temperature
Fig.9 Input Threshold Current vs.
Ambient Temperature
Fig.6 Forward Current vs. Forward Voltage Fig.7 High Level Output Current vs.
Ambient Temperature
Forward current IF (mA)
Ambient temperature Ta (°C)
0
5
10
15
20
25
−40 0 25 50 100 125−25 75
8570
Forward voltage VF (V)
Forward current IF (mA)
1 1.2 1.4 1.6 1.8 2
1
10
100
0.1
Ta=50˚C
Ta=0˚C
Ta=−20˚C
Ta=−40˚C
Ta=85˚C
Ta=25˚C
Ambient temperature Ta (˚C)
High level output current IOH (µA)
−50 −25 0 25 50 10075
0.01
0.1
1
10
100
0.001
IF=250µA
VCC=5.5V
VO=5.5V
VE=2.0V
Input threshold current IFHL (mA)
4
5
6
0
VCC=5V
VO=0.8V
VE=2.0V
RL=350Ω
3
2
Ambient temperature Ta (˚C)
−50 −25 0 25 50 10075
1
Low level output voltage VOL (V)
0.4
0.6
0.8
0
IF=5.0mA
VCC=5.5V
VE=2.0V
0.2
IO=16.0mA
IO=12.8mA
IO=9.6mA
IO=6.4mA
Ambient temperature Ta (˚C)
−50 −25 0 25 50 10075
Collector power dissipation PC (mW)
Ambient temperature Ta (°C)
0
20
40
60
80
85
100
−40 0 25 50 100 125−25 75
8570
Sheet No.: D2-A05602EN
8
PC910L0NSZ0F Series
Fig.10 Output Voltage vs. Forward Current
Fig.12 Propagation Delay Time vs.
Ambient Temperature
Fig.11 Propagation Delay Time vs. Forward
Current
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
0
1
2
60
3
12
6
43
5
4
5
Output voltage VO (V)
Forward current IF (mA)
VCC=5.0V
VO=0.8V
VE=2.0V
Ta=25˚C
RL=350Ω
RL=1kΩ
RL=4kΩ
Propagation delay time tPHL, tPLH (ns)
0
100
20
40
60
80
−50 0−25 755025 100
Ambient temperature Ta (˚C)
IF=7.5mA
VCC=5.0V
RL=350Ω
t
PLH
tPHL
Propagation delay time tPHL, tPLH (ns)
0
100
20
40
60
80
5101520
Forward current IF (mA)
Ta=25˚C
VCC=5.0V
RL=350Ω
tPLH
tPHL
Sheet No.: D2-A05602EN
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
9
PC910L0NSZ0F Series
■ Design Considerations
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute
design.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Notes about static electricity
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC and GND near the device.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through LED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of LED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent LED.
● Design guide
● Degradation
In general, the emission of the LED used in photocouplers will degrade over time.
In the case of long term operation, please take the general LED degradation (50% degradation over 5 years)
into the design consideration.
Please decide the input current which become 2 times of MAX. IFHL.
Low level input current
High level input current
High level enable input voltage
Low level enable input voltage
Supply voltage
Fan out (TTL load)
Operating temperature
Parameter
IFL
IFH
VEH
VEL
VCC
N
Topr
Symbol
0
8
2.0
0
4.5
−
−40
MIN.
250
15
VCC
0.8
5.5
8
70
MAX.
−
−
−
−
−
−
−
TYP.
µA
mA
V
V
V
−
˚C
Unit
● Recommended operating conditions
Sheet No.: D2-A05602EN
■ Manufacturing Guidelines
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
10
PC910L0NSZ0F Series
Sheet No.: D2-A05602EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
● Presence of ODC
11
PC910L0NSZ0F Series
Sheet No.: D2-A05602EN
■ Package specification
12
12.0
6.7
5.8
10.8
520
±2
(Unit : mm)
PC910L0NSZ0F Series
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
Sheet No.: D2-A05602EN
13
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
DJ
G
B
H
H
A
C
Dimensions List (Unit : mm)
A
16.0±0.3
B
7.5±0.1
C
1.75±0.1
D
12.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.4±0.05
J
4.2±0.1
K
10.2±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
5˚
MAX.
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
17.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 1 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC910L0NSZ0F Series
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
14
Sheet No.: D2-A05602EN
■ Important Notices
PC910L0NSZ0F Series
[E235]
