74LVT16244B
3.3 V LVT 16-bit buffer/driver (3-State)
Product data
Supersedes data of 1998 Oct 07 2002 Oct 31
INTEGRATED CIRCUITS
Philips Semiconductors Product data
74LVT16244B3.3 V LVT 16-bit buffer/driver (3-State)
2
2002 Oct 31
FEATURES
•16-bit bus interface
•3-State buffers
•Output capability: +64 mA / –32 mA
•TTL input and output switching levels
•Input and output interface capability to systems at 5 V supply
•Bus-hold data inputs eliminate the need for external pull-up
resistors to hold unused inputs
•Live insertion/extraction permitted
•Power-up 3-State
•No bus current loading when output is tied to 5 V bus
•Latch-up protection exceeds 500 mA per JEDEC Std 17
•ESD protection exceeds 2000 V per MIL STD 883 Method 3015
and 200 V per Machine Model
DESCRIPTION
The 74LVT16244B is a high-performance BiCMOS product
designed for VCC operation at 3.3 V.
This device is a 16-bit buffer and line driver featuring non-inverting
3-State bus outputs. The device can be used as four 4-bit buffers,
two 8-bit buffers, or one 16-bit buf fer.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS
Tamb = 25 °CTYPICAL UNIT
tPLH
tPHL Propagation delay
nAx to nYx CL = 50 pF;
VCC = 3.3 V 1.8 ns
CIN Input capacitance nOE VI = 0 V or 3.0 V 3 pF
COUT Output capacitance Outputs disabled; VO = 0 V or 3.0 V 9 pF
ICCZ Total supply current Outputs disabled; VCC = 3.6 V 70 µA
ORDERING INFORMATION
TYPE NUMBER PACKAGE TEMPERATURE RANGE DWG NUMBER
74LVT16244BDL 48-Pin Plastic SSOP Type III –40 °C to +85 °C SOT370-1
74LVT16244BDGG 48-Pin Plastic TSSOP T ype II –40 °C to +85 °C SOT362-1
74LVT16244BEV 56VFBGA Ball Grid Array –40 °C to +85 °C SOT702-1
LOGIC SYMBOL
1OE
1
1A0
47
1A1
46
1A2
44
1A3
43
2OE
48
2A0
41
2A1
2
40
2A2
38
3
2A3
37
5
6
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
8
9
11
12
3OE
25
3A0
36
3A1
35
3A2
33
3A3
32
4OE
24
4A0
30
4A1
13
29
4A2
27
14
4A3
26
16
17
3Y0
3Y1
3Y2
3Y3
4Y0
4Y1
4Y2
4Y3
19
20
22
23
SA00014
NOTE:
Pin numbers are shown for SSOP and TSSOP packages only.
Philips Semiconductors Product data
74LVT16244B3.3 V LVT 16-bit buffer/driver (3-State)
2002 Oct 31 3
LOGIC SYMBOL (IEEE/IEC)
48 EN1
1 ∇
46
44
43
41
40
38
37
36
EN2
EN3
EN4
1
2 ∇1
3 ∇1
4 ∇1
1
25
24
47
35
33
32
30
29
27
26
3
2
5
6
8
9
11
12
13
14
16
17
19
20
22
23
SA00631
1OE
2OE
3OE
4OE
1A0
1A1
1A2
1A3
2A0
2A1
2A2
3A0
3A1
3A2
3A3
4A0
4A1
4A2
4A3
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
3Y0
3Y1
3Y2
3Y3
4Y0
4Y3
2A3
4Y1
4Y2
NOTE:
Pin numbers are shown for SSOP and TSSOP packages only.
FUNCTION TABLE
INPUTS OUTPUTS
nOE nAx nYx
L L L
L H H
H X Z
H = High voltage level
L = Low voltage level
X = Don’t care
Z = High Impedance “off” state
PIN CONFIGURATION
48-pin SSOP and TSSOP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1OE
1Y0
1Y1
GND
1Y2
1Y3
2Y0
2Y1
GND
2Y2
2Y3
3Y0
3Y1
GND
3Y4
VCC
4Y0
VCC
3Y2
4Y1
GND
4Y3
4OE
4Y2
2OE
1A0
1A1
GND
1A2
1A3
2A0
2A1
GND
2A2
2A3
3A0
3A1
GND
3A3
VCC
4A0
VCC
3A2
4A1
GND
4A3
3OE
4A2
SA00013
PIN DESCRIPTION
48-pin SSOP and TSSOP
PIN NUMBER SYMBOL NAME AND FUNCTION
47, 46, 44, 43
41, 40, 38, 37
36, 35, 33, 32
30, 29, 27, 26
1A0 - 1A3,
2A0 - 2A3,
3A0 - 3A3,
4A0 - 4A3 Data inputs
2, 3, 5, 6
8, 9, 11, 12
13, 14, 16, 17
19, 20, 22, 23
1Y0 - 1Y3,
2Y0 - 2Y3,
3Y0 - 3Y3,
4Y0 - 4Y3 Data outputs
1, 48
25, 24 1OE, 2OE,
3OE, 4OE Output enables
4, 10, 15, 21
28, 34, 39, 45 GND Ground (0V)
7, 18, 31, 42 VCC Positive supply voltage
Philips Semiconductors Product data
74LVT16244B3.3 V LVT 16-bit buffer/driver (3-State)
2002 Oct 31 4
PIN CONFIGURATION
56-ball VFBGA terminal assignments
A
B
C
D
E
F
G
H
J
K
123456
TOP VIEW
SA00619
PIN DESCRIPTION
56-ball VFBGA terminal assignments
1 2 3 4 5 6
A 1OE NC NC NC NC 2OE
B 1Y1 1Y0 GND GND 1A0 1A1
C 1Y3 1Y2 VCC VCC 1A2 1A3
D 2Y1 2Y0 GND GND 2A0 2A1
E 2Y3 2Y2 2A2 2A3
F 3Y0 3Y1 3A1 3A0
G 3Y2 3Y3 GND GND 3A3 3A2
H 4Y0 4Y1 VCC VCC 4A1 4A0
J 4Y2 4Y3 GND GND 4A3 4A2
K 4OE NC NC NC NC 3OE
Philips Semiconductors Product data
74LVT16244B3.3 V LVT 16-bit buffer/driver (3-State)
2002 Oct 31 5
ABSOLUTE MAXIMUM RATINGS1, 2
SYMBOL PARAMETER CONDITIONS RATING UNIT
VCC DC supply voltage –0.5 to +4.6 V
IIK DC input diode current VI < 0 –50 mA
VIDC input voltage3–0.5 to +7.0 V
IOK DC output diode current VO < 0 –50 mA
VOUT DC output voltage3Output in OFF or HIGH state –0.5 to +7.0 V
IO
DC out
p
ut current
Output in LOW state 128 mA
I
OUT
DC
o
u
tp
u
t
c
u
rrent
Output in HIGH state –64 mA
Tstg Storage temperature range –65 to +150 °C
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C.
3. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
LIMITS
UNIT
SYMBOL
PARAMETER
MIN MAX
UNIT
VCC DC supply voltage 2.7 3.6 V
VIInput voltage 0 5.5 V
VIH HIGH-level input voltage 2.0 V
VIL Input voltage 0.8 V
IOH HIGH-level output current –32 mA
IO
LOW-level output current 32
mA
I
OL LOW-level output current; current duty cycle ≤ 50%; f ≥ 1 kHz 64
mA
∆t/∆vInput transition rise or fall rate; Outputs enabled 10 ns/V
Tamb Operating free-air temperature range –40 +85 °C
Philips Semiconductors Product data
74LVT16244B3.3 V LVT 16-bit buffer/driver (3-State)
2002 Oct 31 6
DC ELECTRICAL CHARACTERISTICS
LIMITS
SYMBOL PARAMETER TEST CONDITIONS Temp = –40 °C to +85 °C UNIT
MIN TYP1MAX
VIK Input clamp voltage VCC = 2.7 V ; IIK = –18 mA –0.85 –1.2 V
VCC = 2.7 V to 3.6 V ; IOH = –100 µA VCC–0.2 VCC
VOH High-level output voltage VCC = 2.7 V; IOH = –8 mA 2.4 2.5 V
VCC = 3.0 V ; IOH = –32 mA 2.0 2.3
VCC = 2.7 V ; IOL = 100 µA 0.07 0.2
VCC = 2.7 V ; IOL = 24 mA 0.3 0.5
VOL Low-level output voltage VCC = 3.0 V ; IOL = 16 mA 0.25 0.4 V
VCC = 3.0 V ; IOL = 32 mA 0.3 0.5
VCC = 3.0 V ; IOL = 64 mA 0.4 0.55
VCC = 3.6 V ; VI = VCC or GND Control pins 0.1 ±1.0
I
In
p
ut leakage current
VCC = 0 V or 3.6 V ; VI = 5.5 V 0.4 10
µA
I
I
Inp
u
t
leakage
c
u
rrent
VCC = 3.6 V ; VI = VCC
Data
p
ins 4
0.1 1
µ
A
VCC = 3.6 V ; VI = 0
Data
pins 4
–0.4 –5
IOFF Output off current VCC = 0 V; VI or VO = 0 V to 4.5 V 0.1 ±100 µA
6
VCC = 3 V ; VI = 0.8 V 75 135
IHOLD Bus Hold current A inputs
6
VCC = 3 V ; VI = 2.0 V –75 –135 µA
VCC = 0 V to 3.6 V ; VCC = 3.6 V ±500
IEX Current into an output in the
HIGH state when VO > VCC VO = 5.5 V ; VCC = 3.0 V 50 125 µA
IPU/PD Power-up/down 3-State
output current 3VCC ≤ 1.2 V; VO = 0.5 V to VCC; VI = GND or VCC
OE/OE = Don’t care 1±100 µA
IOZH 3-State output HIGH current VCC = 3.6 V ; VO = 3.0 V; VI = VIL or VIH 0.5 5µA
IOZL 3-State output LOW current VCC = 3.6 V; VO = 0.5 V; VI = VIL or VIH 0.5 –5 µA
ICCH VCC = 3.6 V; Outputs HIGH, VI = GND or VCC, IO = 0 0.07 0.12
ICCL Quiescent supply current VCC = 3.6 V ; Outputs LOW, VI = GND or VCC, IO = 0 4.0 6.0 mA
ICCZ VCC = 3.6 V ; Outputs Disabled; VI = GND or VCC, IO = 050.07 0.12
∆ICC Additional supply current per
input pin 2VCC = 3 V to 3.6 V; One input at VCC–0.6 V,
Other inputs at VCC or GND 0.1 0.2 mA
NOTES:
1. All typical values are at VCC = 3.3 V and Tamb = 25 °C.
2. This is the increase in supply current for each input at the specified voltage level other than VCC or GND.
3. This parameter is valid for any VCC between 0 V and 1.2 V with a transition time of up to 10 msec.
From VCC = 1.2 V to VCC = 3.3 V ±0.3 V a transition time of 100 µsec is permitted. This parameter is valid for Tamb = 25 °C only.
4. Unused pins at VCC or GND.
5. ICCZ is measured with outputs pulled to VCC or GND.
6. This is the bus-hold overdrive current required to force the input to the opposite logic state.
Philips Semiconductors Product data
74LVT16244B3.3 V LVT 16-bit buffer/driver (3-State)
2002 Oct 31 7
AC CHARACTERISTICS
GND = 0 V ; tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω; Tamb = –40 °C to +85 °C. LIMITS
SYMBOL PARAMETER WAVEFORM VCC = 3.3 V ±0.3 V VCC = 2.7 V UNIT
MIN TYP1MAX MAX
tPLH
tPHL Propagation delay
nAx to nYx 10.5
0.5 1.8
1.7 3.2
3.2 4.0
4.0 ns
tPZH
tPZL Output enable time
to HIGH and LOW level 21.0
1.0 2.3
2.1 4.0
4.0 5.0
5.3 ns
tPHZ
tPLZ Output disable time
from HIGH and LOW Level 21.0
1.0 3.2
2.9 4.5
4.0 5.0
4.4 ns
NOTE:
1. All typical values are at VCC = 3.3 V and Tamb = 25 °C.
AC WAVEFORMS
VM = 1.5 V ; VIN = GND to 3.0 V.
nAx INPUT VM
VM
nYx OUTPUT
VM
VM
tPLH tPHL
SW00008
2.7 V
0 V
VOH
VOL
W aveform 1. Input (nAx) to Output (nYx) Propagation Delays
nOE INPUT VM
VM
tPZH tPHZ
nYx OUTPUT
VOH
VM
VM
nYx OUTPUT
VOL
tPZL tPLZ 3.5 V
0 V
VOL + 0.3 V
VOH – 0.3 V
SW00009
0 V
2.7 V
W aveform 2. 3-State Output Enable and Disable Times
Philips Semiconductors Product data
74LVT16244B3.3 V LVT 16-bit buffer/driver (3-State)
2002 Oct 31 8
TEST CIRCUIT AND WAVEFORMS
PULSE
GENERATOR
RT
VIN D.U.T. VOUT
CLRL
VCC
RL
OPEN VMVM
tWAMP (V)
NEGATIVE
PULSE 10% 10%
90% 90%
0 V
VMVM
tW
AMP (V)
POSITIVE
PULSE
90% 90%
10% 10% 0 V
tTHL (tF)
tTLH (tR)t
THL (tF)
tTLH (tR)
VM = 1.5 V
Input Pulse Definition
DEFINITIONS
RL = Load resistor; see AC CHARACTERISTICS for value.
CL = Load capacitance includes jig and probe capacitance;
see AC CHARACTERISTICS for value.
RT = Termination resistance should be equal to ZOUT of
pulse generators.
GND
6 V
SW00003
Test Circuit for 3-State Outputs
TEST SWITCH
tPHZ/tPZH GND
tPLZ/tPZL 6 V
tPLH/tPHL open
SWITCH POSITION
INPUT PULSE REQUIREMENTS
FAMILY Amplitude Rep. Rate tWtRtF
74LVT16 2.7 V ≤10 MHz 500 ns ≤2.5 ns ≤2.5 ns
Philips Semiconductors Product data
74LVT16244B3.3 V LVT 16-bit buffer/driver (3-State)
2002 Oct 31 9
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm SOT370-1
Philips Semiconductors Product data
74LVT16244B3.3 V LVT 16-bit buffer/driver (3-State)
2002 Oct 31 10
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1
Philips Semiconductors Product data
74LVT16244B3.3 V LVT 16-bit buffer/driver (3-State)
2002 Oct 31 11
VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls;
body 4.5 x 7 x 0.65 mm SOT702-1
Philips Semiconductors Product data
74LVT16244B3.3 V LVT 16-bit buffer/driver (3-State)
2002 Oct 31 12
REVISION HISTORY
Rev Date Description
_4 20021031 Product data (9397 750 09136); supersedes 74LVT16244B_3 of 1998 Oct 07 (9397 750 04706).
Engineering Change Notice 853–1778 27401 (date: 20011203).
Modifications:
•Add VFBGA56 (EV) package option.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys
no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent,
copyright, or mask work right infringement, unless otherwise specified.
Contact information
For additional information please visit
http://www.semiconductors.philips.com. Fax: +31 40 27 24825
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com.
Koninklijke Philips Electronics N.V. 2002
All rights reserved. Printed in U.S.A.
Date of release: 10-02
Document order number: 9397 750 09136
Data sheet status[1]
Objective data
Preliminary data
Product data
Product
status[2] [3]
Development
Qualification
Production
Definitions
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Level
I
II
III
