1. Product profile
1.1 General description
Femtofarad capacitance unidirectional ElectroStatic Discharge (ESD) protection diode
array designed to protect up to five signal lines from the damage caused by ESD and
other transients. The device is encapsulated in an ultra small and flat lead SOT666
Surface-Mounted Device (SMD) plastic package.
The combination of extreme ly low ca p acit ance, h igh ESD maximum r ating and ultr a small
package makes the device ideal for high-speed data line protection and antenna
protection ap plic at ion s.
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
PESD5V0F5UV
Femtofarad unidirectional fivefold ESD protection array
Rev. 1 — 17 July 2012 Product data sheet
SOT666
ESD protection of up to 5 lines IEC 61000-4-2; level 4 (ESD)
Low diode capacitance Cd=0.55pF IEC 61000-4-5 (surge); IPPM =2A
Ultra low leakage current IRM <1nA AEC-Q101 qualified
ESD protection up to 8 kV
Computers and peripherals Communication systems
Audio and video equipment Portable electronics
Cellular handsets and accessories SIM card protection
10/100/1000 Mbit/s Ethernet High-speed data lines
Table 1. Quick reference data
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VRWM reverse standoff voltage - - 5 V
Cddiode capacitance f = 1 MHz; VR= 0 V - 0.55 0.7 pF
PESD5V0F5UV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 17 July 2012 2 of 13
NXP Semiconductors PESD5V0F5UV
Femtofarad unidirectional fivefold ESD protection array
2. Pinning information
3. Ordering information
4. Marking
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 cathode
2 common anode
3 cathode
4 cathode
5 cathode
6 cathode
123
456
61
52
43
006aaa159
Table 3. Ordering information
Type number Package
Name Description Version
PESD5V0F5UV - plastic surface-mounted package; 6 leads SOT666
Table 4. Marking codes
Type number Marking code
PESD5V0F5UV AH
PESD5V0F5UV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 17 July 2012 3 of 13
NXP Semiconductors PESD5V0F5UV
Femtofarad unidirectional fivefold ESD protection array
5. Limiting values
[1] Device stressed with 8/20 s exponential decay waveform according to IEC 61000-4-5 and IEC 61643-321.
[2] Measured from pin 1, 3, 4, 5 or 6 to pin 2.
[1] Device stressed with ten non-repetitive ESD pulses.
[2] Measured from pin 1, 3, 4, 5 or 6 to pin 2.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
IPPM rated peak pulse current tp=8/20s[1][2] -2A
Tjjunction temperature - 150 C
Tamb ambient temperature 55 +150 C
Tstg storage temperature 65 +150 C
Table 6. ESD maximum ratings
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Max Unit
VESD electrostatic
discharge voltage IEC 61000-4-2 (contact discharge) [1][2] -8kV
IEC 61000-4-2 (air discharge) [1][2] -8kV
machine model [2] - 400 V
MIL-STD-883 (h uman body model) - 10 kV
Table 7. ESD standards complianc e
Standard Conditions
IEC 61000-4-2; level 4 (ESD) > 8 kV (contact)
MIL-STD-883; class 3B (human body model) > 8 kV
PESD5V0F5UV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 17 July 2012 4 of 13
NXP Semiconductors PESD5V0F5UV
Femtofarad unidirectional fivefold ESD protection array
6. Characteristics
[1] Device stressed with 8/20 s exponential decay waveform according to IEC 61000-4-5 and IEC 61643-321.
[2] Measured from pin 1, 3, 4, 5 or 6 to pin 2.
[3] Non-repetitive current pulse, Transmission Line Pulse (TLP) tp= 100 ns; square pulse;
ANS/IESD STM5-1-2008.
Fig 1. 8/20 s pu lse waveform according to
IEC 61000-4-5 and IEC 61643-321 Fig 2. ESD pulse waveform according to
IEC 61000-4-2
t (μs)
0403010 20
001aaa630
40
80
120
IPP
(%)
0
e−t
100 % IPP; 8 μs
50 % IPP; 20 μs
001aaa631
I
PP
100 %
90 %
t
30 ns 60 ns
10 %
t
r
= 0.7 ns to 1 ns
Table 8. Characteristics
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VRWM reverse standoff
voltage --5V
IRM reverse leakage current VRWM =5V - <1 10 nA
VBR breakdown voltage IR=10mA 7.5 8.8 10 V
Cddiode capacitance f = 1 MHz; VR= 0 V - 0.55 0.7 pF
VCL clamping voltage IPP =1A [1][2] --13V
IPPM =2A [1][2] --15V
rdyn dynamic resistance IR=10A [3] -1.1-
PESD5V0F5UV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 17 July 2012 5 of 13
NXP Semiconductors PESD5V0F5UV
Femtofarad unidirectional fivefold ESD protection array
Tamb =25C
Fig 3. Diode capacitance as a function of reverse
voltage; typical values Fig 4. Crosstalk; typical values
Fig 5. V-I characteristics for a unidirectional ESD protection diode
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PESD5V0F5UV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 17 July 2012 6 of 13
NXP Semiconductors PESD5V0F5UV
Femtofarad unidirectional fivefold ESD protection array
Fig 6. ESD clamping test setup
Fig 7. Clamped +8 kV pulse waveform
(IEC 61000-4-2 network) Fig 8. Clamped 8 kV pulse waveform
(IEC 61000-4-2 network)
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PESD5V0F5UV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 17 July 2012 7 of 13
NXP Semiconductors PESD5V0F5UV
Femtofarad unidirectional fivefold ESD protection array
7. Application information
The device is designed for the protection of up to five unidirectional data or signal lines
from surge pulses and ESD damage.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the device as clos e to the input terminal or connector as possible.
2. Minimize the path length between the device and the protected line.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Use ground planes whenever possible. For multilayer PCBs, use ground vias.
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
Fig 9. Typical application for unidirectional
application of five lines Fig 10. Typical application for bidirectional
application of four lines
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PESD5V0F5UV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 17 July 2012 8 of 13
NXP Semiconductors PESD5V0F5UV
Femtofarad unidirectional fivefold ESD protection array
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
Fig 11. Package outline SOT666
Dimensions in mm 04-11-08
1.7
1.5
1.7
1.5
1.3
1.1
1
0.18
0.08
0.27
0.17
0.5
pin 1 index
123
456
0.6
0.5
0.3
0.1
Table 9. Packing methods
The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
4000 8000
PESD5V0F5UV SOT666 2 mm pitch, 8 mm tape and reel - -315
4 mm pitch, 8 mm tape and reel -115 -
PESD5V0F5UV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 17 July 2012 9 of 13
NXP Semiconductors PESD5V0F5UV
Femtofarad unidirectional fivefold ESD protection array
11. Soldering
Fig 12. Reflow soldering footprint SOT666
solder lands
placement area
occupied area
solder paste
sot666_fr
2.75
2.45
2.1
1.6
0.4
(6×)
0.55
(2×)
0.25
(2×)
0.6
(2×)
0.65
(2×)
0.3
(2×)
0.325
(4×)
0.45
(4×)
0.5
(4×)
0.375
(4×)
1.72
1.7
1.0750.538
Dimensions in mm
PESD5V0F5UV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 17 July 2012 10 of 13
NXP Semiconductors PESD5V0F5UV
Femtofarad unidirectional fivefold ESD protection array
12. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PESD5V0F5UV v.1 20120717 Product data sheet - -
PESD5V0F5UV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 17 July 2012 11 of 13
NXP Semiconductors PESD5V0F5UV
Femtofarad unidirectional fivefold ESD protection array
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificat ion — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incident al,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whethe r or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregat e and cumulative liabil ity towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless ot herwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in app lications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications an d ther efo re su ch inclusi on a nd/or use is at the cu stome r's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or cu stomer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by custo mer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and product s using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third p arty
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby exp r essly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains dat a from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
PESD5V0F5UV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 17 July 2012 12 of 13
NXP Semiconductors PESD5V0F5UV
Femtofarad unidirectional fivefold ESD protection array
No offer to sell or license — Nothing in this document may be interpret ed or
construed as an of fer to sell product s that is op en for accept ance or the grant ,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors PESD5V0F5UV
Femtofarad unidirectional fivefold ESD protection array
© NXP B.V. 2012. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 July 2012
Document identifier: PESD5V0F5UV
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Application information. . . . . . . . . . . . . . . . . . . 7
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 7
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 7
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
10 Packing information . . . . . . . . . . . . . . . . . . . . . 8
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
14 Contact information. . . . . . . . . . . . . . . . . . . . . 12
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13