© 2006 Microchip Technology Inc. DS70149B
dsPIC30F5015/5016
Data Sheet
High-Performance, 16-Bit
Digital Signal Controllers
DS70149B-page ii © 2006 Microchip Technology Inc.
Information contained in this publication regarding device
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Trademarks
The Microchip name and logo, the Microchip logo, Accur on,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICST ART,
PRO MATE, PowerSmart, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MX DEV, MXLAB,
SEEV AL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PIC kit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInf o, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
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SQTP is a service mark of Microchip Technology Incorporated
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All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrit y of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violat ion of the Digital Millennium Copyright Act. If suc h a c t s
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
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Company’s quality system processes and procedures are for its
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EEPROMs, microperipherals, nonvolatile memory and analog
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© 2006 Microchip Technology Inc. DS70149B-page 1
High-Performance Modified RISC CPU:
Modified Harvard architecture
C compiler optimized in struction set architecture
with flexible Addressing modes
83 base instructions
24-bit wide instructions, 16-bit wide data path
66 Kbytes on -chip Flash p rogr am spac e
(Instruction words)
2 Kbytes of on-chip data RAM
1 Kbyte of nonvolatile data EEPROM
Up to 30 MIPS operation:
- DC to 40 MHz external clock input
- 4 MHz-10 MHz oscillator input with
PLL active (4x, 8x, 16x)
36 interrupt sources:
- 5 external interrupt sources
- 8 user-selectable priority levels for each
inter rupt so urc e
- 4 processo r trap sources
16 x 16-bit working register array
DSP Engine Features:
Dual data fetch
Accumulator write back for DSP operations
Modulo and Bit-Reversed Addressing modes
Two 40-bit wide accumulators with optional
saturati on log ic
17-bit x 17-bit si ngl e-c ycle hard w are frac tio nal /
integer multiplier
All DSP instructions single cycle
±16-bit single-cycle shift
Peripheral Feat ures:
High-current sink/source I/O pins: 25 mA/25 mA
•Timer module with programmable prescaler:
- Five 16-bit timers/counters; optionally pair
16-bit timers into 32-bit timer modules
16-bit Capture input functions
16-bit Compare/PWM output functions
3-wire SPI modules (supports 4 Frame modes)
•I
2C™ module supports Multi-Master/Slave mode
and 7-bit/10-bit addressing
1 UART modules with FIFO Buffers
1 CAN modules, 2.0B compliant
Motor Control PWM Module Features:
8 PWM output channels
- Complement ary or Indepe ndent Outpu t
modes
- Edge and Center-Aligned modes
4 duty cycle generators
Dedicated time base
Programmable output polarity
Dead-Time control for Complementary mode
Manual output control
Trigger for A/D conversions
Quadrature Encoder Interface Module
Features:
Phase A, Phase B and Index Puls e input
16-bit up/down position counter
Count direction status
Position Measurement (x2 and x4) mode
Programmable digital noise filters on inputs
Alternate 16-bit Timer/Counter mode
Interrupt on position counter roll over/underflow
Note: This data sheet summarizes features of this
group o f ds PIC 30 F dev ic es a nd is n ot in tended to b e
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and pro-
gramming, refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
dsPIC30F5015/5016
dsPIC30F5015/5016 Enhanced Flash
16-bit Digital Signal Contr oller
dsPIC30F5015/5016
DS70149B-page 2 © 2006 Microchip Technology Inc.
Analog Features:
10-bit Analog-to-Digital Converter (ADC) with
4 S/H Inputs:
- 1 Msps conversion rate
- 16 input channels
- Conversion available during Sleep and Idle
Programmable Brown-out Reset
Special Microcontroller Features:
Enhanced Flash program memory:
- 10,000 erase/write cycle (min.) for
industrial temperature range, 100K (typical)
Data EEPROM memory:
- 100,000 erase/write cycle (min.) for
industrial temperature range, 1M (typical)
Self-reprogrammable under software control
Power-on Reset (POR), Power-up Timer (PWR T )
and Oscillator Start-up Timer (OST)
Flexible Watchdog Timer (WDT) with on-chip,
low-power RC oscillator for reliable operation
Fail-Safe Clock Monitor operation detects clock
failure and switches to on-chip, low-power RC
oscillator
Programmable code protection
In-Circuit Serial Programming™ (ICSP™)
programming capabil ity
Selectable Power Ma nag em ent mo des :
- Sleep, Idle and Alternate Clock modes
CMOS Technology:
Low-power, high-speed Flash technology
Wide operating voltage range (2.5V to 5.5V)
Industrial and Extended temperature ranges
Low power consumption
dsPIC30F Motor Control and Powe r Conversion Family*
Device Pins Program
Mem. Bytes/
Instructions
SRAM
Bytes EEPROM
Bytes Timer
16-bit Input
Cap
Output
Comp/Std
PWM
Motor
Control
PWM
A/D 10 -bit
1 Ms ps Quad
Enc
UART
SPI
I2CTM
CAN
dsPIC30F2010 28 12K/4K 512 1024 3 4 2 6 ch 6 ch Yes 1 1 1 -
dsPIC30F3010 28 24K/8K 1024 1024 5 4 2 6 ch 6 ch Yes 1 1 1 -
dsPIC30F4012 28 48K/16K 2048 1024 5 4 2 6 ch 6 ch Yes 1 1 1 1
dsPIC30F3011 40/44 24K/8K 1024 1024 5 4 4 6 ch 9 ch Yes 2 1 1 -
dsPIC30F4011 40/44 48K/16K 2048 1024 5 4 4 6 ch 9 ch Yes 2 1 1 1
dsPIC30F5015 64 66K/22K 2048 1024 5 4 4 8 ch 16 ch Yes 1 2 1 1
dsPIC30F5016 80 66K/22K 2048 1024 5 4 4 8 ch 16 ch Yes 1 2 1 1
dsPIC30F6010 80 144K/48K 8192 4096 5 8 8 8 ch 16 ch Yes 2 2 1 2
*This table provides a summary of the dsPIC30F5015/5016 peripheral features. Other available devices in the dsPI C30F Motor
Control and Power Conversion Family are shown for feature comparison.
© 2006 Microchip Technology Inc. DS70149B-page 3
dsPIC30F5015/5016
Pin Diagram
72
74
73
71
70
69
68
67
66
65
64
63
62
61
20
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
50
49
48
47
46
45
44
21
41
40
39
38
37
36
35
34
23
24
25
26
27
28
29
30
31
32
33
dsPIC30F5016
17
18
19
75
1
57
56
55
54
53
52
51
60
59
58
43
42
76
78
77
79
22
80
RD12
OC4/RD3
OC3/RD2
EMUD2/OC2/RD1
PWM2L/RE2
PWM1H/RE1
PWM1L/RE0
RG0
RG1
C1TX/RF1
C1RX/RF0
PWM3L/RE4
PWM2H/RE3
CN16/UPDN/RD7
CN14/RD5
EMUC2/OC1/RD0
IC4/RD11
IC2/RD9
IC1/RD8
INT4/RA15
IC3/RD10
INT3/RA14
VSS
OSC1/CLKI
VDD
SCL/RG2
U1RX/RF2
U1TX/RF3
EMUC1/SOSCO/T1CK/CN0/RC14
EMUD1/SOSCI/CN1/RC13
VREF+/RA10
VREF-/RA9
AVDD
AVSS
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VDD
CN17/RF4
CN21/RD15
CN18/RF5
AN6/OCFA/RB6
AN7/RB7
PWM4H/RE7
T2CK/RC1
T4CK/RC3
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
AN4/QEA/CN6/RB4
AN3/INDX/CN5/RB3
AN2/SS1/CN4/RB2
PGC/EMUC/AN1/CN3/RB1
PGD/EMUD/AN0/CN2/RB0
VSS
VDD
PWM3H/RE5
PWM4L/RE6
FLTB/INT2/RE9
FLTA/INT1/RE8
AN12/RB12
AN13/RB13
AN14/RB14
AN15/CN12/RB15
VDD
VSS
CN13/RD4
CN19/RD13
SDA/RG3
SDI1/RF7
EMUD3/SDO1/RF8
AN5/QEB/CN7/RB5
VSS
OSC2/CLKO/RC15
CN15/RD6
EMUC3/SCK1/INT0/RF6
CN20/ R D14
80- Pin TQFP
.
dsPIC30F5015/5016
DS70149B-page 4 © 2006 Microchip Technology Inc.
Pin Diagram
dsPIC30F5015
64- Pin TQFP
1
2
3
4
5
6
7
8
9
10
11
12
13 36
35
34
33
32
31
30
29
28
27
26
64
63
62
61
60
59
58
57
56
14
15
16
17
18
19
20
21
22
23
24
25
EMUC1/SOSCO/T1CK/CN0/RC14
EMUD1/SOSCI/T4CK/CN1/RC13
EMUC2/OC1/RD0
IC4/INT4/RD11
IC2/FLTB/INT2/RD9
IC1/FLTA/INT1/RD8
VSS
OSC2/CLKO/RC15
OSC1/CLKI
VDD
SCL/RG2
EMUC3/SCK1/INT0/RF6
U1RX/SDI1/RF2
EMUD3/U1TX/SDO1/RF3
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
VSS
VDD
AN3/INDX/CN5/RB3
AN2/SS1/CN4/RB2
AN1/VREF-/CN3/RB1
AN0/VREF+/CN2/RB0
UPDN/CN16/RD7
PWM3L/RE4
PWM2H/RE3
PWM2L/RE2
VSS
PWM1L/RE0
C1TX/RF1
PWM1H/RE1
EMUD2/OC2/RD1
OC3/RD2
PGC/EMUC/AN6/OCFA/RB6
PGD/EMUD/AN7/RB7
AVDD
AVSS
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VSS
VDD
AN12/RB12
AN13/RB13
AN14/RB14
AN15/CN12/RB15
CN18/RF5
CN17/RF4
SDA/RG3
43
42
41
40
39
38
37
44
48
47
46
50
49
51
54
53
52
55
45
SS2/CN11/RG9
AN5/QEB/CN7/RB5
AN4/QEA/CN6/RB4
IC3/INT3/RD10
VDD
C1RX/RF0
OC4/RD3
CN15/RD6
IC6/CN14/RD5
IC5/CN13/RD4
© 2006 Microchip Technology Inc. DS70149B-page 5
dsPIC30F5015/5016
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 7
2.0 CPU Architecture Overview........................................................................................................................................................ 15
3.0 Memory O rganization................................................................................................................................................................. 23
4.0 Address Generato r Units............................................................................................................................................................ 35
5.0 Interrupts.................................................................................................................................................................................... 41
6.0 Flash Pro g ram Memory............................ ............................ ........................... ..................... ...................................................... 49
7.0 Data EEPR OM Mem o ry........... ........................... ........................... ..................... ....................................................................... 55
8.0 I/O Ports.............................. ............................ ........................... ................................................................................................ 59
9.0 Timer1 Module ........................................................................................................................................................................... 65
10.0 Timer2/3 Module ......... .. .. .. .... ..... .. .. .... .. .. .. .. ....... .. .. .... .. .. .. ....... .. .. .. .. .... .. ..... .. .... .. .. .. .. ....... ............................................................ 69
11.0 Timer4/5 Module ............ .. .. ....... .. .. .. .... .. .. .. ....... .. .. .. .... .. .. ..... .... .. .. .. .. .... ..... .. .. .... .. .. .. .. ................................................................. 75
12.0 Input Capture Module ...................... .... .. .. .. ....... .... .. .. .... .. ....... .. .. .... .. .. ....... .. .... .. .. .... .. ....... .......................................................... 79
13.0 Output Compa re Module........................ ............................ ..................... ..................... .............................................................. 83
14.0 Quadrature Encoder Interface (QEI ) Module ............................................................................................................................. 87
15.0 Mot or Control PWM Module....................................................................................................................................................... 93
16.0 SP I Module............................................................................................................................................................................... 103
17.0 I2C Module............................................................................................................................................................................... 107
18.0 U nivers al Asynchr onous Receiver Transmi tter (UART) Module .............................................................................................. 115
19.0 CAN Module............................................................................................................................................................................. 123
20.0 System Inte g r a tion ...... ..................... ..................... ..................... ........................... ................................................................... 133
21.0 10-bit High-Speed Analog-to-Digital Converter (ADC) Module........................... .... .. ......... .. .... .... .. ......... ................................. 149
22.0 Instruction Set Summary.......................................................................................................................................................... 161
23.0 Development Support............................................................................................................................................................... 169
24.0 Electrical Characteristics.......................................................................................................................................................... 173
25.0 Packagin g In fo rmation.............................. ..................... ............................ ............................................................................... 213
Appendix A: Revision History . ............................................................................................................................................................ 217
Index ................................................................................................................................................................................................. 219
The Micro chip Web Site................ .................................. ........................... ........................................................................................ 225
Customer Change Notification Service....................................................................... ...... ............. .................................................... 225
Customer Support............................................................. .... ............. ...... ...... ............. .... ................................................................... 225
Reader Response.............................................................................................................................................................................. 226
Product Identification System ............................................................................................................................................................ 227
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
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welcome your feedback.
Most Current Data Sheet
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The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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To deter mine if an errata sheet exists for a particular device, please check with one of the following:
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dsPIC30F5015/5016
DS70149B-page 6 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 7
dsPIC30F5015/5016
1.0 DEVICE OVERVIEW
This document contains device specific information for
the dsPIC30F5015 and dsPIC30F5016 devices. The
dsPIC30F devices contain extensive Digital Signal
Processor (DSP) functionality within a high-performance
16-bit microcontroller (MCU) architecture.
Figure 1-1 is a block diagram of the dsPIC30F5015
device. Following the block diagram, Table 1-1
provi des a brief descript ion of the device I/O pinout and
the functions that are multiplexed to the port pins on the
dsPIC30F5015.
Figure 1-2 is a block diagram of the dsPIC30F5016
device. Following the block diagram, Table 1-2
provi des a brief descript ion of the device I/O pinout and
the functions that are multiplexed to the port pins on the
dsPIC30F5016.
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and pro-
gramming, refer to the “dsPIC30F/33F Program-
mer’s Reference Manual” (DS70157).
dsPIC30F5015/5016
DS70149B-page 8 © 2006 Microchip Technology Inc.
FIGURE 1-1: dsPIC30F5015 BLOCK DIAGRAM
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
Power-up
Timer
Oscillator
Start-up Timer
POR/BOR
Reset
Watchdog
Timer
Instruction
Decode &
Control
OSC1/CLKI
MCLR
VDD, VSS
AN4/QEA/CN6/RB4
AN12/RB12
AN13/RB13
AN14/RB14
AN15/CN12/RB15
Low-Voltage
Detect
UART1
SPI1, Motor Control
PWM
Timing
Generation
CAN1
AN5/QEB/CN7/RB5
16
PCH PCL
Program Counter
ALU<16>
16
Address Latch
Prog ram Memory
(66 Kbytes)
Data Latch
24
24
24
24
X Data Bus
IR
I2C
QEI
PGC/EMUC/AN6/OCFA/RB6
PGD/EMUD/AN7/RB7
PCU
PWM1L/RE0
PWM1H/RE1
PWM2L/RE2
PWM2H/RE3
PWM3L/RE4
10-bit ADC
Timers
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
SS2/CN11/RG9 CN18/RF5
EMUC3/SCK1/INT0/RF6
Input
Capture
Module
Output
Compare
Module
EMUC1/SOSCO/T1CK/CN0/RC14
EMUD1/SOSCI/T4CK/CN1/RC13
PORTB
C1RX/RF0
C1TX/RF1
U1RX/SDI1/RF2
EMUD3/U1TX/SDO1/RF3
SCL/RG2
SDA/RG3
PORTG PORTF
PORTD
16
16 16
16 x 16
W Reg Array
Divide
Unit
Engine
DSP
Decode
ROM Latch
16
Y Data Bus
Effective Address
X RAGU
X WAGU
Y AGU
AN0/VREF+/CN2/RB0
AN1/VREF-/CN3/RB1
AN2/SS1/CN4/RB2
AN3/INDX/CN5/RB3
OSC2/CLKO/RC15
CN17/RF4
AVDD, A VSS
SPI2
16
16
16
16
16
PORTC
PORTE
16
16
16
16
8
Interrupt
Controller
PSV & Table
Data Access
Control Bl ock
Stack
Control
Logic
Loop
Control
Logic
Data LatchData Latch
Y Data
(1 Kbyte)
RAM X Data
(1 Kbyte)
RAM
Address
Latch
Address
Latch
Control Signals
to Various Blocks
EMUC2/OC1/RD0
EMUD2/OC2/RD1
OC3/RD2
OC4/RD3
IC5/CN13/RD4
IC6/CN14/RD5
CN15/RD6
UPDN/CN16/RD7
IC1/FLTA/INT1/RD8
IC2/FLTB/INT2/RD9
IC3/INT3/RD10
IC4/INT4/RD11
16
Data EEP ROM
(1 Kbyt e)
16
© 2006 Microchip Technology Inc. DS70149B-page 9
dsPIC30F5015/5016
Table 1-1 provides a brief description of the device I/O
pinout a nd the fun ctions t hat are multiple xed to th e port
pins on the dsPIC30F5015 device. Multiple functions
may exist on one port pin. When multiplexing occurs,
the peripheral module’s functional requirements may
force an override of the data direction of the port pin.
TABLE 1-1: I/O PIN DESCRIPTIONS FOR dsPIC30F5015
Pin Name Pin
Type Buffer
Type Description
AN0-AN15 I Analog Analog input channels.
AN0 and AN1 are also used for device programming data and clock inputs,
respectively.
AVDD P P Positive supply for analog module.
AVSS P P Ground reference for analog module.
CLKI
CLKO I
OST/CMOS
External clock source input. Always associated with OSC1 pin function.
Oscillator crystal output. Connects to crystal or resonator in Crystal
Oscillator mode. Optionally functions as CLKO in RC and EC modes. Always
associated with OSC2 pin function.
CN0-CN18 I ST Input change notification inputs.
Can be software programmed for internal weak pull-ups on all inputs.
C1RX
C1TX I
OST
CAN1 bus recei ve pi n.
CAN1 bus transmit pin.
EMUD
EMUC
EMUD1
EMUC1
EMUD2
EMUC2
EMUD3
EMUC3
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
ST
ST
ST
ST
ST
ST
ST
ST
ICD Primary Communication Channel data input/output pin.
ICD Primary Communication Channel clock input/output pin.
ICD Secondary Communication Channel data input/output pin.
ICD Secondary Communication Channel clock input/output pin.
ICD Tertiary Communication Channel data input/output pin.
ICD Tertiary Communication Channel clock input/output pin.
ICD Quaternary Communication Channel data input/output pin.
ICD Quaternary Communication Channel clock input/output pin.
IC1-IC4 I ST Capture inputs 1 through 4.
INDX
QEA
QEB
UPDN
I
I
I
O
ST
ST
ST
CMOS
Quadratu re Enco der Inde x Puls e inpu t.
Quadrature Encoder Phase A input in QEI mode.
Auxiliary Timer External Clock/Gate input in Timer mode.
Quadrature Encoder Phase A input in QEI mode.
Auxiliary Timer External Clock/Gate input in Timer mode.
Position Up/Down Counter Direction State.
INT0
INT1
INT2
INT3
INT4
I
I
I
I
I
ST
ST
ST
ST
ST
External interrupt 0.
External interrupt 1.
External interrupt 2.
External interrupt 3.
External interrupt 4.
FLTA
FLTB
PWM1L
PWM1H
PWM2L
PWM2H
PWM3L
PWM3H
PWM4L
PWM4H
I
I
O
O
O
O
O
O
O
O
ST
ST
PWM Fault A input.
PWM Fault B input.
PWM 1 Low output.
PWM 1 High output.
PWM 2 Low output.
PWM 2 High output.
PWM 3 Low output.
PWM 3 High output.
PWM 4 Low output.
PWM 4 High output.
Legend: CMOS = CMOS compatible input or output Analog = Analog input
ST = Schmitt Trigger input with CMOS levels O = Output
I = Input P = Power
dsPIC30F5015/5016
DS70149B-page 10 © 2006 Microchip Technology Inc.
MCLR I/P ST Master Clear (Reset) input or programming voltage input. This pin is an active-
low Reset to the device.
OCFA
OC1-OC4 I
OST
Compare Fault A input (for Compare channels 1, 2, 3 and 4).
Compar e outputs 1 thro ugh 4.
OSC1
OSC2
I
I/O
ST/CMOS
Oscillator crystal input. ST buffer when configured in RC mode; CMOS
otherwise.
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator
mode. Optionally functions as CLKO in RC and EC modes.
PGD
PGC I/O
IST
ST In-Circuit Serial Programming™ data input/output pin.
In-Circuit Serial Programming clock input pin.
RB0-RB15 I/O ST PORTB is a bidirectional I/O port.
RC13-RC15 I/O ST PORTC is a bidirectional I/O port.
RD0-RD11 I/O ST PORTD is a bidirectional I/O port.
RE0-RE7 I/O ST PORTE is a bidirectional I/O port.
RF0-RF6 I/O ST PORTF is a bidirectional I/O port.
RG2-RG3
RG6-RG9 I/O
I/O ST
ST PORTG is a bidirectional I/O port.
SCK1
SDI1
SDO1
SS1
SCK2
SDI2
SDO2
SS2
I/O
I
O
I
I/O
I
O
I
ST
ST
ST
ST
ST
ST
Synchronous serial clock input/output for SPI #1.
SPI #1 Data In.
SPI #1 Data Out.
SPI #1 Slave Synchronization.
Synchronous serial clock input/output for SPI #2.
SPI #2 Data In.
SPI #2 Data Out.
SPI #2 Slave Synchronization.
SCL
SDA I/O
I/O ST
ST Synchronous serial clock input/output for I2C™.
Synchronous serial data input/output for I2C.
SOSCO
SOSCI O
I
ST/CMOS 32 kHz low-power oscillator crystal output.
32 kHz low-power oscillator crystal input. ST buffer when configured in RC
mode; CMOS otherwise.
T1CK
T4CK I
IST
ST Timer1 external clock input.
Timer4 external clock input.
U1RX
U1TX I
OST
UART1 Receive.
UART1 Transmit.
VDD P Positive supply for logic and I/O pins.
VSS P Ground reference for logic and I/O pins.
VREF+ I Analog Analog Voltage Reference (High) input.
VREF- I Analog Analog Voltage Reference (Low) input.
TABLE 1-1: I/O PIN DESCRIPTIONS FOR dsPIC30F5015 (CONTINUED)
Pin Name Pin
Type Buffer
Type Description
Legend: CMOS = CMOS compatible input or output Analog = Analog input
ST = Schmitt Trigger input with CMOS levels O = Output
I = Input P = Power
© 2006 Microchip Technology Inc. DS70149B-page 11
dsPIC30F5015/5016
FIGURE 1-2: dsPIC30F5016 BLOCK DIAGRAM
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
Power-up
Timer
Oscillator
Start-up Timer
POR/BOR
Reset
Watchdog
Timer
Instruction
Decode &
Control
OSC1/CLKI
MCLR
VDD, VSS
AN4/QEA/CN6/RB4
AN12/RB12
AN13/RB13
AN14/RB14
AN15/CN12/RB15
Low-Voltage
Detect
UART1
SPI1, Motor Control
PWM
INT4/RA15
INT3/RA14
VREF+/RA10
VREF-/RA9
Timing
Generation
CAN1
AN5/QEB/CN7/RB5
16
PCH PCL
Program Counter
ALU<16>
16
Address Latch
Prog ram Memory
(66 Kbytes)
Data Latch
24
24
24
24
X Data Bus
IR
I2C
QEI
AN6/OCFA/RB6
AN7/RB7
PCU
PWM1L/RE0
PWM1H/RE1
PWM2L/RE2
PWM2H/RE3
PWM3L/RE4
10-bit ADC
Timers
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
FLTA/INT1/RE8
FLTB/INT2/RE9
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
SS2/CN11/RG9
CN18/RF5
EMUC3/SCK1/INT0/RF6
SDI1/RF7
EMUD3/SDO1/RF8
Input
Capture
Module
Output
Compare
Module
EMUC1/SOSCO/T1CK/CN0/RC14
EMUD1/SOSCI/CN1/RC13
T4CK/RC3
T2CK/RC1
PORTB
C1RX/RF0
C1TX/RF1
U1RX/RF2
U1TX/RF3
RG0
RG1
SCL/RG2
SDA/RG3
PORTG PORTF
PORTD
16
16 16
16 x 16
W Reg Array
Divide
Unit
Engine
DSP
Decode
ROM Latch
16
Y Data Bus
Effective Address
X RAGU
X WAGU
Y AGU
PGD/EMUD/AN0/CN2/RB0
PGC/EMUC/AN1/CN3/RB1
AN2/SS1/CN4/RB2
AN3/INDX/CN5/RB3
OSC2/CLKO/RC15
CN17/RF4
AVDD, A VSS
SPI2
16
16
16
16
16
PORTA
PORTC
PORTE
16
16
16
16
8
Interrupt
Controller
PSV & Table
Data Access
Control Bl ock
Stack
Control
Logic
Loop
Control
Logic
Data LatchData Latch
Y Data
(1 Kbyte)
RAM X Data
(1 Kbyte)
RAM
Address
Latch
Address
Latch
Control Signals
to Various Blocks
EMUC2/OC1/RD0
EMUD2/OC2/RD1
OC3/RD2
OC4/RD3
CN13/RD4
CN14/RD5
CN15/RD6
CN16/UPDN/RD7
IC1/RD8
IC2/RD9
IC3/RD10
IC4/RD11
RD12
CN19/RD13
CN20/RD14
CN21/RD15
16
Data EEP ROM
(1 Kbyt e)
16
dsPIC30F5015/5016
DS70149B-page 12 © 2006 Microchip Technology Inc.
Table 1-1 provides a brief description of the device I/O
pinout a nd the fun ctions t hat are multiple xed to th e port
pins on the dsPIC30F5016. Multiple functions may
exist on one port pin. When multiplexing occurs, the
periphe ral mo dule’s functional requir ements may force
an override of the data direction of the port pin.
TABLE 1-2: I/O PIN DESCRIPTIONS FOR dsPIC30F5016
Pin Name Pin
Type Buffer
Type Description
AN0-AN15 I Analog Analog input channels.
AN0 and AN1 are also used for device programming data and clock inputs,
respectively.
AVDD P P Positive supply for analog module.
AVSS P P Ground reference for analog module.
CLKI
CLKO I
OST/CMOS
External clock source input. Always associated with OSC1 pin function.
Oscillator crystal output. Connects to crystal or resonator in Crystal
Oscillator mode. Optionally functions as CLKO in RC and EC modes. Always
associated with OSC2 pin function.
CN0-CN21 I ST Input change notification inputs.
Can be software programmed for internal weak pull-ups on all inputs.
C1RX
C1TX I
OST
CAN1 bus recei ve pi n.
CAN1 bus transmit pin.
EMUD
EMUC
EMUD1
EMUC1
EMUD2
EMUC2
EMUD3
EMUC3
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
ST
ST
ST
ST
ST
ST
ST
ST
ICD Primary Communication Channel data input/output pin.
ICD Primary Communication Channel clock input/output pin.
ICD Secondary Communication Channel data input/output pin.
ICD Secondary Communication Channel clock input/output pin.
ICD Tertiary Communication Channel data input/output pin.
ICD Tertiary Communication Channel clock input/output pin.
ICD Quaternary Communication Channel data input/output pin.
ICD Quaternary Communication Channel clock input/output pin.
IC1-IC4 I ST Capture inputs 1 through 8.
INDX
QEA
QEB
UPDN
I
I
I
O
ST
ST
ST
CMOS
Quadratu re Enco der Inde x Puls e inpu t.
Quadrature Encoder Phase A input in QEI mode.
Auxiliary Timer External Clock/Gate input in Timer mode.
Quadrature Encoder Phase A input in QEI mode.
Auxiliary Timer External Clock/Gate input in Timer mode.
Position Up/Down Counter Direction State.
INT0
INT1
INT2
INT3
INT4
I
I
I
I
I
ST
ST
ST
ST
ST
External interrupt 0.
External interrupt 1.
External interrupt 2.
External interrupt 3.
External interrupt 4.
FLTA
FLTB
PWM1L
PWM1H
PWM2L
PWM2H
PWM3L
PWM3H
PWM4L
PWM4H
I
I
O
O
O
O
O
O
O
O
ST
ST
PWM Fault A input.
PWM Fault B input.
PWM 1 Low output.
PWM 1 High output.
PWM 2 Low output.
PWM 2 High output.
PWM 3 Low output.
PWM 3 High output.
PWM 4 Low output.
PWM 4 High output.
Legend: CMOS = CMOS compatible input or output Analog = Analog input
ST = Schmitt Trigger input with CMOS levels O = Output
I = Input P = Power
© 2006 Microchip Technology Inc. DS70149B-page 13
dsPIC30F5015/5016
MCLR I/P ST Master Clear (Reset) input or programming voltage input. This pin is an active-
low Reset to the device.
OCFA
OCFB
OC1-OC4
I
I
O
ST
ST
Compare Fault A input (for Compare channels 1, 2, 3 and 4).
Compare Fault B input (for Compare channels 5, 6, 7 and 8).
Compar e outputs 1 thro ugh 4.
OSC1
OSC2
I
I/O
ST/CMOS
Oscillator crystal input. ST buffer when configured in RC mode; CMOS
otherwise.
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator
mode. Optionally functions as CLKO in RC and EC modes.
PGD
PGC I/O
IST
ST In-Circuit Serial Programming™ data input/output pin.
In-Circuit Serial Programming clock input pin.
RA9-RA10
RA14-RA15 I/O
I/O ST
ST PORTA is a bidirectional I/O port.
RB0-RB15 I/O ST PORTB is a bidirectional I/O port.
RC1
RC3
RC13-RC15
I/O
I/O
I/O
ST
ST
ST
PORTC is a bidirectional I/O port.
RD0-RD15 I/O ST PORTD is a bidirectional I/O port.
RE0-RE9 I/O ST PORTE is a bidirectional I/O port.
RF0-RF8 I/O ST PORTF is a bidirectional I/O port.
RG0-RG3
RG6-RG9 I/O
I/O ST
ST PORTG is a bidirectional I/O port.
SCK1
SDI1
SDO1
SS1
SCK2
SDI2
SDO2
SS2
I/O
I
O
I
I/O
I
O
I
ST
ST
ST
ST
ST
ST
Synchronous serial clock input/output for SPI #1.
SPI #1 Data In.
SPI #1 Data Out.
SPI #1 Slave Synchronization.
Synchronous serial clock input/output for SPI #2.
SPI #2 Data In.
SPI #2 Data Out.
SPI #2 Slave Synchronization.
SCL
SDA I/O
I/O ST
ST Synchronous serial clock input/output for I2C™.
Synchronous serial data input/output for I2C.
SOSCO
SOSCI O
I
ST/CMOS 32 kHz low-power oscillator crystal output.
32 kHz low-power oscillator crystal input. ST buffer when configured in RC
mode; CMOS otherwise.
T1CK
T2CK
T4CK
I
I
I
ST
ST
ST
Timer1 external clock input.
Timer2 external clock input.
Timer4 external clock input.
U1RX
U1TX I
OST
UART1 Receive.
UART1 Transmit.
VDD P Positive supply for logic and I/O pins.
VSS P Ground reference for logic and I/O pins.
VREF+ I Analog Analog Voltage Reference (High) input.
VREF- I Analog Analog Voltage Reference (Low) input.
TABLE 1-2: I/O PIN DESCRIPTIONS FOR dsPIC30F5016 (CONTINUED)
Pin Name Pin
Type Buffer
Type Description
Legend: CMOS = CMOS compatible input or output Analog = Analog input
ST = Schmitt Trigger input with CMOS levels O = Output
I = Input P = Power
dsPIC30F5015/5016
DS70149B-page 14 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 15
dsPIC30F5015/5016
2.0 CPU ARCHITECTURE
OVERVIEW
This document provides a summary of the
dsPIC30F5015/5016 CP U and perip heral function . For
a compl ete descrip tion of this func tionality, please refer
to the dsPIC30F Family Reference Manual”
(DS70046).
2.1 Core Overview
The core has a 24-bit instruction word. The Program
Counter (PC) is 23 bits wide with the Least Significant
bit (LSb) always clear (see Section 3.1 “Program
Address Space”), and the Most Significant bit (MSb)
is ign ored du ring no rmal program executi on, ex cept for
certain specialized instructions. Thus, the PC can
address up to 4M instruction words of user program
space. An instruction prefetch mechanism is used to
help maintain throughput. Program loop constructs,
free from loop count management overhead, are
supported using the DO and REPEAT inst ru cti on s, b oth
of which are int errup tib le at any point.
The working register array consists of 16x16-bit
register s, each of whi ch can act as dat a, addre ss or off-
set registers. One working register (W15) operates as
a software Stack Pointer for interrupts and calls.
The data space is 64 Kbytes (32K words) and is split
into two blocks, referred to as X and Y data memory.
Each block has its own independent Address Genera-
tion Unit (AGU). Most instructions operate solely
through the X memory AGU, which provides the
appearance of a single unified data space. The
Multiply-Accumulate (MAC) class of dual source DSP
instructions operate through both the X and Y AGUs,
splitting the data address space into two parts (see
Section 3.2 “Data Address Space”). The X and Y
data space boundary is device specific and cannot be
alter ed by the user . Each dat a word consis ts of 2 bytes,
and mos t instruction s can address data eith er as words
or bytes.
There are two methods of accessing data stored in
program memory:
The upper 32 Kbytes of data sp ace memory can b e
mapped into the lower half (user space) of program
space a t any 16K program w ord boundary, defined
by the 8-bit Program Space V isibility Page
(PSVPAG) register. This lets any instruction
access program space as if it were data space,
with a limitation that the access requires an addi-
tional cycle. Moreover, only the lower 16 bits of
each instruction word can be access ed using this
method.
Linear indirect access of 32K word pages within
progra m spac e is also possibl e using any w orking
register, via table read and write instructions.
Table read and write instructions can be used to
access all 24 bits of an instruction word.
Overhead-free circular buffers (Modulo Addressing)
are supported in both X and Y address spaces. This is
primarily intended to remove the loop overhead for
DSP algorithms.
The X AGU also supports Bit-Reversed Addressing on
destination effective addresses, to greatly simplify
input or output data reordering for radix-2 FFT algo-
rithms. Refer to Section 4.0 “Address Generator
Units” for details on Modulo and Bit-Reversed
Addressing.
The core s up ports Inherent (n o op era nd), Re lat iv e, Lit-
eral, Memory Direct, Register Direct, Register Indirect,
Register Offset and Literal Offset Addressing modes.
Instruct ion s are associ ated wi th predefi ned addr essin g
modes, depending upon their functional requirements.
For m os t i ns tru c ti o ns , the c or e i s c apa bl e of e xe c ut i ng
a data (or program data) memory read, a working reg-
ister (data) read, a data memory write and a program
(instruction) memory read per instruction cycle. As a
result, 3-operand instructions are supported, allowing
C = A + B operations to be executed in a single cycle.
A DSP engine has been included to significantly
enhance the core arithmetic capab ility and throughput.
It features a high-speed 17-bit by 17-bit multiplier, a
40-bit ALU, two 40-bit saturating accumulators and a
40-bit b idi rec tio nal b arrel shifter. Dat a in th e a cc umul a-
tor or any worki ng r egist er can be shif ted up to 16 bits
right or 16 bits left in a single cycle. The DSP instruc-
tions ope rate sea mles sly with all other in struct ions an d
have be en desi gned for o ptimal re al-time p erforma nce.
The MAC class of instructions can concurrently fetch
two data operands from memory, while multiplying two
W registers. To enable this concurrent fetching of data
operands, the data space has been split for these
instructions and linear for all others. This has been
achiev ed in a tran sp a r en t and fle xib le mann er, by ded-
icating cert ain worki ng registe rs to e ach addre ss spac e
for the MAC class of instructions.
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and pro-
gramming, refer to the “dsPIC30F/33F Program-
mer’s Reference Manual” (DS70157).
dsPIC30F5015/5016
DS70149B-page 16 © 2006 Microchip Technology Inc.
The core does not support a multi-stage instruction
pipeline. However, a single stage instruction prefetch
mechanism is used, which accesses and partially
decodes instructions a cycle ahead of execution, in
order to maximize available execution time. Most
instructions execute in a single cycle, with certain
exceptions.
The core features a vectored exception processing
structure for traps and interrupts, with 62 independent
vectors. The exceptions consist of up to 8 traps (of
which 4 are re served ) a nd 54 interrupts . Ea ch in terru pt
is priorit ized based on a use r assigned prio rity between
1 and 7 (1 being the lowest priority and 7 being the
highest) in conjunction with a predetermined ‘natural
order’. T raps ha ve fixed prio rities, rang ing from 8 to 15.
2.2 Programmers Model
The programmer’s model is shown in Figure 2-1 and
consists of 16x16-bit working registers (W0 through
W15), 2x40-bit accumulators (ACCA and ACCB),
STATUS register (SR), Data Table Page register
(TBLPAG), Program Space Visibility Page register
(PSVPAG), DO and REPEAT registers (DOSTART,
DOEND, DCOUNT and RCOUNT) and Program
Counter (PC). The working registers can act as data,
address or offset registers. All registers are memory
mapped. W0 acts as the W register for file register
addressing.
Some of these registers have a shadow register asso-
ciated with each of them, as shown in Figure 2-1. The
shadow register is used as a temporary h olding register
and can tr ansfer its con tents to or fro m i t s hos t reg is ter
upon the occurrence of an event. None of the shadow
registers are accessible directly. The following rules
apply for transfer of registers into and out of shadows.
PUSH.S and POP.S
W0, W1, W2, W3, SR (DC, N, OV, Z and C bits
only) are transferred.
DO instruction
DOSTART, DOEND, DCOUNT shadows are
pushed on loop start, and popped on loop end.
When a byte operation is performed on a working
register, only the Least Significant Byte (LSB) of the tar-
get r egis ter i s affec ted. H owever, a be nefit of m emory
mapped working registers is that both the Least and
Most Significant Bytes (MSBs) can be manipulated
through byte-wide data memory space accesses.
2.2.1 SOFTWARE STACK POINTER/
FRAM E POIN TE R
The dsPIC® DSC devices contain a software stack.
W15 is the dedicated software Stack Pointer (SP), and
will be automatically modified by exception processing
and subroutine calls and returns. However, W15 can
be referenced by any instruction in the same manner
as all other W registers. This simplifies the reading,
writing and mani pulati on of the Stack Poi nter (e .g., cre-
ating stack frames).
W15 is initialized to 0x0800 during a Reset. The user
may reprogram the SP during initialization to any
location within data space.
W14 has been dedicated as a Stack Frame Pointer as
defined by the LNK and ULNK instructions. However,
W14 can be referenced by any instruction in the same
manner as all other W registers.
2.2.2 STATUS REGISTER
The dsPIC DSC core has a 16-bit STATUS register
(SR), the LSB of which is referred to as the SR Low
Byte (SRL) and the MSB as the SR High Byte (SRH).
See Figure 2-1 for SR layout.
SRL contains all the MCU ALU operation Status flags
(includ ing the Z bit ), as well as the CPU Inter rupt Prior-
ity Level Status bits, IPL<2:0>, and the Repeat Active
Status bit, RA. During exception processing, SRL is
concatenated with the MSB of the PC to form a
complete word value which is then stacked.
The upper byte of the SR register contains the DSP
Adder/Subtracter Status bits, the DO Loop Active bit
(DA) and the Digit Carry (DC) Status bit.
2.2.3 PROGRAM COUNT ER
The Program Counter is 23 bits wide. Bit 0 is always
clear. Therefore, the PC can address up to 4M
instruction words.
Note: In order to protect against misaligned
stack accesses, W15<0> is always clear.
© 2006 Microchip Technology Inc. DS70149B-page 17
dsPIC30F5015/5016
FIGURE 2-1: dsPIC30F5015/5016 PROGRAMMERS MODEL
TABPAG
PC22 PC0
7 0
D0D15
Program Counter
Data Table Page Address
STATUS Register
Working Registers
DSP Operand
Registers
W1
W2
W3
W4
W5
W6
W7
W8
W9
W10
W11
W12/DSP Offset
W13/DSP Write Back
W14/Frame Pointer
W15/Stack Pointer
DSP Address
Registers
AD39 AD0AD31
DSP
Accumulators ACCA
ACCB
PSVPAG
7 0Program Space Visibility Page Address
Z
0
OA OB SA SB
RCOUNT
15 0
REPEAT Loop Counter
DCOUNT
15 0
DO Loop Counter
DOSTART
22 0
DO Loop Start Address
IPL2 IPL1
SPLIM Stack Pointer Limit Register
AD15
SRL
PUSH.S Shadow
DO Shadow
OAB SAB
15 0 Core Configuration Register
Legend
CORCON
DA DC RA N
TBLPAG
PSVPAG
IPL0 OV
W0/WREG
SRH
DO Loop End Address
DOEND
22
C
dsPIC30F5015/5016
DS70149B-page 18 © 2006 Microchip Technology Inc.
2.3 Divide Support
The dsPIC DSC devices feature a 16/16-bit signed
fractional divide operation, as well as 32/16-bit and
16/16-bit signed and unsigned integer divide
operations, in the form of single instruction iterative
divides. The follo wing in stru ctions a nd data sizes a re
supported:
1. DIVF – 16/16 signed fractional divide
2. DIV.sd – 32/16 signed divide
3. DIV.ud – 32/16 unsigned divide
4. DIV.sw – 16/16 signed divide
5. DIV.uw – 16/16 unsigned divide
The divide instructions must be executed within a
REPEAT loop. Any other form of execution (e.g. a s eries
of discrete divide instructions) will not function correctly
because the instructio n flow depends on RC OUNT. The
divide instruction does not automatically set up the
RCOUNT value, a nd it m ust, therefore, b e expl icitly and
correctly specified in the REPEAT instruction, as shown
in Table 2-1 (REPEAT will execute the target instruction
{operand value+1} times). The REPEAT loop count must
be set up for 18 iterations of the DIV/DIVF instruction.
Thus, a complete divide op eration requires 19 c ycles .
TABLE 2-1: DIVIDE INSTRUCTIONS
2.4 DSP Engine
The DSP engine consis ts of a hi gh-speed 17-bit x 17-bit
multiplier, a barrel shifter, and a 40-bit adder/subtracter
(with two target accumulators, round and saturation
logic).
The dsPIC30F devices have a single instruction flow
which can execute either DSP or MCU instructions.
Many of the hardware resources are shared between
the DSP and MCU instructions. For example, the
instruction set has both DSP and MCU multiply
instructions which use the same hardware multiplier.
The DSP engine also has the capability to perform inher-
ent accumulator-to-accumulator operations, which
require no additional data. These instructions are ADD,
SUB and NEG.
The DSP engine has various options selected through
various bits in the CPU Core Configuration register
(CORCON), as listed below:
1. Fractional or Integer DSP Multiply (IF).
2. Signed or Unsigned DSP Multiply (US).
3. Convention al or Convergent Round i ng (RND).
4. Automatic Saturation On/Off for ACCA (SATA).
5. Automatic Saturation On/Off for ACCB (SATB).
6. Automatic Saturation On/Off for Writes to Data
Memory (SATDW).
7. Accumulator Saturation mode Selection
(ACCSAT).
A block diagram of the DSP engine is shown in
Figure 2-2.
Note: The divide flow is interruptible. However,
the user needs to save the context as
appropriate.
Instruction Function
DIVF Signed fractional divide: Wm/Wn W0; Rem W1
DIV.sd Signed divide: (Wm+1:Wm)/Wn W0; Rem W1
DIV.ud Unsigned divide: (Wm+1:Wm)/Wn W0; Rem W1
DIV.sw Signed divide: Wm/Wn W0; Rem W1
DIV.uw Unsigned divide: Wm/Wn W0; Rem W1
Note: For CORCON layout, see Table 3-3.
TABLE 2-2: DSP INSTRUCTION
SUMMARY
Instruction Algebraic Operation
CLR A = 0
ED A = (x – y)2
EDAC A = A + (x – y)2
MAC A = A + (x * y)
MOVSAC No change in A
MPY A = x * y
MPY.N A = – x * y
MSC A = A – x * y
© 2006 Microchip Technology Inc. DS70149B-page 19
dsPIC30F5015/5016
FIGURE 2-2: DSP ENGINE BLOCK DIAGRAM
Zero Backfill
Sign-Extend
Barrel
Shifter
40-bit Accumulator A
40-bit Accumulator B Round
Logic
X Data Bus
To/From W Array
Adder
Saturate
Negate
32
32
33
16
16 16
16
40 40
40 40
S
a
t
u
r
a
t
e
Y Data Bus
40
Carry/Borrow Out
Carry/Borrow In
16
40
Multiplier/Scaler
17-bit
dsPIC30F5015/5016
DS70149B-page 20 © 2006 Microchip Technology Inc.
2.4.1 MULTIPLIER
The 17x17-bit multiplier is capable of signed or
unsigned operations and can multiplex its output using
a scale r to support eit her 1.31 fracti onal (Q31) or 32-bit
integer results. Unsigned operands are zero-extended
into the 17th bit of the multiplier input value. Signed
operands are sign-extended into the 17th bit of the
multiplier input value. The output of the 17x17-bit
multiplier/scaler is a 33-bit value, which is sign-
extended to 40 bits. Integer data is inherently
represented as a signed two’s complement value,
where the MSB is defined as a sign bit. Generally
speaking, the range of an N-bit two’s complement
integer is -2N-1 to 2N-1 – 1. For a 16-bit integer , the data
range is -3276 8 (0x8 000) to 32767 (0x7F FF), inc ludin g
0. For a 32 -bit intege r , the data r ange is -2, 147,483,648
(0x8000 0000) to 2,147,483,645 (0x7FFF FFFF).
When the multiplier is configured for fractional multipli-
cation, the data is represented as a two’s complement
fraction , where the M SB is define d as a sign b it and the
radix point is implied to lie just after the sign bit
(QX format). The range of an N-bit two’s complement
fraction with th is impl ied ra dix p oint i s -1.0 to (1 – 21-N).
For a 16-bit fraction, the Q15 data range is -1.0
(0x8000) to 0.999969482 (0x7FFF), including 0 and
has a precision of 3.01518x10-5. In Fractional mode, a
16x16 multiply operation generates a 1.31 product,
which has a precision of 4.65661x10-10.
The same multiplier is used to support the MCU multi-
ply instructions, which include integer 16-bit signed,
unsigned and mixed sign multiplies.
The MUL instruction may be directed to use byte or
word-size d operands . Byte operan ds will dire ct a 16-bit
result, and word operands will direct a 32-bit result to
the specified register(s) in the W array.
2.4.2 DATA ACCUMULATORS AND
ADDER/SUBTRACTER
The data accumulator consists of a 40-bit adder/sub-
tracter wi th automatic si gn extension logi c. It can select
one of two accumulators (A or B) as its pre-
accumulation source and post-accumulation destina-
tion. For the ADD and LAC instructions, the data to be
accum ulated or l oaded ca n be optio nally sca led via th e
barrel shifter, prior to accumulation.
2.4.2.1 Adder/Subtracter, Overflow and
Saturation
The adder/subtracter is a 40-bit adder with an optional
zero input into one side and either true or complement
data into the other input. In the case of addition, the
carry/borrow input is active-high and the other input is
true data (not complemented), whereas in the case of
subtraction, the carry/borrow input is active-low and the
other input is complemented. The adder/subtracter
generates Overflow Status bits, SA/SB and OA/OB,
which are latched and reflected in the STATUS
register.
Overflow from bit 39: this is a catastrophic
overflow in which the sign of the accumulator is
destroyed.
Overflow into guard bits 32 through 39: this is a
recoverable overflow. This bit is set whenever all
the guard bits are not identical to each other.
The adder has an additional saturation block which
controls accumulator data saturation, if selected. It
uses the result of the adder, the Overflow Status bits
described above, and the SATA/B (CORCON<7:6>)
and ACCSAT (CORCON<4>) mode control bits to
determine when and to what value to saturate.
Six STATUS register bits have been provided to
support saturation and overflow; they are:
1. OA:
ACCA overflowed into guard bits
2. OB:
ACCB overflowed into guard bits
3. SA:
ACCA saturated (bit 31 overflo w and saturatio n)
or
ACCA overflowed into guard bits and saturated
(bit 39 overflow and saturation)
4. SB:
ACCB saturated (bit 31 overflo w and saturatio n)
or
ACCB overflowed into guard bits and saturated
(bit 39 overflow and saturation)
5. OAB:
Logical OR of OA and OB
6. SAB:
Logical OR of SA and SB
The OA and OB bits are modified each time data
passes through the adder/subtracter. When set, they
indicate that the most recent operation has overflowed
into the accumulator guard bits (bits 32 through 39).
The OA and OB bits can also optionally generate an
arithmetic warning trap when set and the correspond-
ing overflow trap flag enable bit (OVATE, OVBTE) in
the INTCON1 register (refer to Section 5.0 “Inter-
rupts”) is set. This allows the user to take immediate
action, for example, to correct system gain.
© 2006 Microchip Technology Inc. DS70149B-page 21
dsPIC30F5015/5016
The SA and SB bit s are modified each ti me data pass es
through the adder/subtracter, but can only be cleared by
the user. When set, they indicate that the accumulator
has overflowed its maximum range (bit 31 for 32-bit
saturation, or bit 39 for 40-bit saturation) and wi ll be sat-
urated (if saturation is enabled). When saturation is not
enabled, SA and SB default to bit 39 overflow and thus
indicate that a cat astrophic overfl ow has occurred. If the
COVTE bit in the INTCON1 register is set, SA and SB
bits will generate an arithmetic warning trap when
saturation is disabled.
The Overflow and Saturation Status bits can optionally
be viewed in the STATUS register (SR) as the logical
OR of OA an d OB (in bit OAB) and the logical OR of SA
and SB (in bit SAB). Th is allows programm ers to check
one bit in the STATUS register to determine if either
accumulator has overflowed, or one bit to determine if
either a ccum ulator has satu rated. T his w ould be usefu l
for complex number arithmetic which typically uses
both the accu mul ators.
The device supports three Saturation and Overflow
modes.
1. Bit 39 Overflow and Saturation:
When bit 39 overflow and saturation occurs, the
saturation logic load s the maximally positive 9.31
(0x7FFFFFFFFF) or maximally negative 9.31
value (0 x8000000 000) into th e target accumul a-
tor. The SA or SB bit is set and remains set until
cleared by the user. This is referred to as ‘super
saturation’ and provides protection against erro-
neous data or unexpected algorithm problems
(e.g., gain calculations).
2. Bit 31 Overflow and Saturation:
When bit 31 overflow and saturation occurs, the
saturation logic then loads the maximally posi-
tive 1.31 value (0x007FFFFFFF) or maximally
negative 1.31 value (0x0080000000) into the
target accumulator. The SA or SB bit is set and
remains set until cleared by the user. When this
Saturation mode is in effect, the guard bits are not
used (so the OA, OB or OAB bits are never set).
3. Bit 39 Catastrophic Overflow
The bit 39 Overflow Status bit from the adder is
used to set the SA or SB bit, which remain set
until cleared by the user. No saturation opera-
tion is performed and the accumulator is allowed
to overflow (destroying its sign). If the COVTE
bit in the INTCON1 register i s set, a cat astrophic
ove rflow can initiate a trap exception.
2.4.2.2 Accumulat or ‘Write Back’
The MAC class of instructions (with the exception of
MPY, MPY.N, ED and EDAC) can optionally write a
rounded version of the high word (bits 31 through 16)
of the acc umulator that is not t argeted by the instruction
into dat a spac e memory. The write is performe d across
the X bus into combined X and Y address space. The
following addressing modes are supported:
1. W13, Register Direct:
The rounded contents of the non-target accumula-
tor are written into W13 as a 1.15 fraction.
2. [W13]+ = 2, Register Indirect with Post-Incre ment:
The rounded contents of the non-target accu-
mulator are written into the address pointed to
by W13 as a 1.15 fraction. W13 is then
incremented by 2 (fo r a wo rd wr ite).
2.4.2.3 Round Logic
The round logic is a combinational block, which per-
forms a conventional (biased) or convergent (unbiased)
round function during an accumulator write (store). The
Round mode is det ermined by the state of the RND bit
in the CORCON register. It generates a 16-bit, 1.15
data value which is passed to the data space writ e sat-
uration log ic. I f ro undi ng is not indi cate d by the instr uc-
tion, a truncated 1.15 data value is stored and the least
significant word (lsw) is simply discarded.
Conventional rounding takes bit 15 of the accumulator,
zero-extends it and ad ds it to the AC CxH word (bi t s 16
through 31 of the accum ulator). I f the AC CxL word ( bits
0 through 15 of the accumulator) is between 0x8000
and 0xFFFF (0x8000 included), ACCxH is incre-
mented. If ACCxL is between 0x0000 and 0x7FFF,
ACCxH is left un ch ang ed. A consequenc e of thi s alg o-
rithm is that over a succession of random rounding
operations, the value will tend to be biased slightly
positive.
Convergent (or unbiased) rounding operates in the
same manner as conventional rounding, except when
ACCxL equals 0x8000. If this is the case, the LSb (bit
16 of the accumulator) of ACCxH is examined. If it is ‘1’,
ACCxH is inc remen ted. If it is ‘0’, ACCxH is not modi-
fied. Assuming that bit 16 is effectively random in
nature, th is s c hem e w i ll re mo ve any rou ndi ng b ias th at
may accumulate .
The SAC and SAC.R instructions store either a trun-
cated (SAC) or rounded (SAC.R) version of the cont ents
of the t arget accumul ator to data mem ory , via the X bu s
(subject to data saturation, see Section 2.4.2.4 “Data
Space Write Saturation”). Note that for the MAC cl as s
of instructions, the accumulator write back operation
will fu nction in th e same mann er , a ddressing combine d
MCU (X and Y) data space though the X bus. For this
class of instructions, the data is always subject to
rounding.
dsPIC30F5015/5016
DS70149B-page 22 © 2006 Microchip Technology Inc.
2.4.2.4 Data Space Write Saturation
In ad dition to add er/subtr acter sat uration , writes to data
space may also be saturated, but without affecting the
contents of the source accumulator. The data space
write saturation logic block accepts a 16-bit, 1.15 frac-
tional value from the round logic block as its input,
together with overflow status from the original source
(accumulator) and the 16-bit round adder. These are
comb in ed an d used to s el ec t the a pp r op ria te 1.15
fraction al va lue as outp ut to writ e to dat a sp ace m emor y.
If the SATDW bit in the CORCON register is set, data
(after roundi ng or trun ca tio n) is tes te d for ove rflo w and
adjusted accordingly. For input data greater than
0x007FF F, dat a written to me mory is forced to the max-
imum posit ive 1. 15 val ue, 0x7FFF. F or inp ut da ta less
than 0x FF8000, dat a wri tten to memo ry is f orced to the
maximum negative 1.15 value, 0x8000. The MSb of the
source (bit 39) is used to determine the sign of the
operand bei ng tes ted.
If the SATDW bit in the CORCON register is n ot set, the
input data is always passed through unmodified under
all conditions.
2.4.3 BARREL SHIFTER
The barrel shifter is capable of performing up to 16-bit
arithmetic or logic right shifts, or up to 16-bit left shifts
in a single cycle. The source can be either of the two
DSP accumulators or the X bus (to support multi-bit
shifts of register or memory data).
The sh ifter requires a s ign ed bi nary v al ue to de term in e
both the magnitude (number of bits) and direction of the
shift operation. A positive value will shift the operand
right. A negative value will shift the operand left. A
value of ‘0’ will not modify the operand.
The barrel shifter is 40 bits wide, thereby obtaining a
40-bit res ult for DSP shift ope rations an d a 16-bit resu lt
for MCU shift operations. Data from the X bus is pre-
sented to the barrel shifter between bit positions 16 to
31 for right sh ifts, and bit positio ns 0 to 15 for left sh ifts.
© 2006 Microchip Technology Inc. DS70149B-page 23
dsPIC30F5015/5016
3.0 MEMORY ORGANIZATION
3.1 Program Address Space
The program address space is 4M instruction words. It
is addressable by the 23-bit PC, table instruction
Effective Address (EA), or data space EA, when
program space is mapped into data space, as defined
by Table 3-1. Note that the program space address is
incremented by two between successive program
words, in orde r to pro vide c omp atibi lity w ith d ata sp ace
addressing.
User program space access is restricted to the lower
4M instruction word address range (0x000000 to
0x7FFFFE) , for all access es other than TBLRD/TBLWT,
which use TBLPAG<7> to dete rmine user or c onfigura-
tion space access. In TABLE 3-1: “Program Space
Address Construction”, bit 23 allows access to the
Device ID, the User ID and the Configuration bits.
Otherwise, bit 23 is always clear.
FIGURE 3-1:
PROGRAM SP AC E
MEMORY MAP FOR
dsPIC30F5015/5016
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and pro-
grammi ng, refe r to the “dsPIC30F/33F
Programmer’s Reference Manual(DS70157).
Reset - Target Address
User Memor y
Space
000000
00007E
000002
000080
Device Configuration
User Flash
Program Memory
00B000
00AFFE
Configuration Memory
Space
Data EEPROM
(22K instructions)
(1 Kbyte)
800000
F80000
Registers F8000E
F80010
DEVID (2) FEFFFE
FF0000
FFFFFE
Reserved F7FFFE
Reserved
7FFC00
7FFBFE
(Read ‘0’s)
8005FE
800600
UNITID (32 instr.)
8005BE
8005C0
Reset - GOTO Instruction
000004
Reserved
7FFFFE
Reserved
000100
0000FE
000084
Alterna te Vector Table
Reserved
Interrupt Vector Table Vector Tables
dsPIC30F5015/5016
DS70149B-page 24 © 2006 Microchip Technology Inc.
TABLE 3-1: PROGRAM SPACE ADDRESS CONSTRUCTION
FIGURE 3-2: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION
Access Type Access
Space Program Spac e Address
<23> <22:16> <15> <14:1> <0>
Instruction Access User 0 PC<22:1> 0
TBLRD/TBLWT User
(TBLPAG<7> = 0)TBLPAG<7:0> Data EA<15:0>
TBLRD/TBLWT Configuration
(TBLPAG<7> = 1)TBLPAG<7:0> Data EA<15:0>
Program Space Visibility User 0 PSVPAG<7:0> Data EA<14:0>
0Program Counter
23 bits
1
PSVPAG Reg
8 bits
EA
15 bits
Program
Using
Select
TBLPAG Reg
8 bits
EA
16 bits
Using
Byte
24-bit EA
0
0
1/0
Select
User/
Configuration
Table
Instruction
Program
Space
Counter
Using
Space
Select
Note: Program Space Visibility cannot be used to access bits <23:16> of a word in program memory.
Visibility
© 2006 Microchip Technology Inc. DS70149B-page 25
dsPIC30F5015/5016
3.1.1 DATA ACCESS FROM PROGRAM
MEMORY USING TABLE
INSTRUCTIONS
This arc hit ec ture f etc hes 24 -bi t w ide prog ram me mo ry.
Consequently, instructions are always aligned. How-
ever, as the architecture is modified Harvard, data can
also be present in prog ram space.
There are two methods by which program space can
be accessed; via special table instructions, or through
the rema ppi ng of a 16K w ord prog ram space page into
the u pp e r half o f da ta space (s ee Section 3.1.2 “Data
Access From Program Memory Using Program
Space Visibility”). The TBLRDL and TBLWTL instruc-
tions of fer a direct method of reading or writing the least
significant word of any address within program space,
without going through data space. The TBLRDH and
TBLWTH instructions are the only method whereby the
upper 8 bit s o f a pro gram s pa ce word can be acc esse d
as data.
The PC is incremented by two for each successive
24-bit program word. This allows program memory
addresses to directly map to data space addresses.
Program memory can thus be regarded as two 16-bit
word wide add res s s p ac es , res id ing sid e by si de, each
with the same address range. TBLRDL and TBLWTL
access the space that contains the least significant
word, and TBLRDH and TBLWTH access the space that
cont ains the MSB.
Figure 3-2 shows how th e EA is cre ate d fo r t able oper-
ations and data space accesses (PSV = 1). Here,
P<23:0> refers to a program space word, whereas
D<15:0> refers to a data space word.
A set of t able inst ruc tions are prov ide d to move by te or
word-sized data to and from program space.
1. TBLRDL: Table Read Low
Word: Read the least significant word of the
program address;
P<15:0> maps to D<15:0>.
Byte: Read one of the LSBs of the program
address;
P<7:0> maps to the destination byte when byte
select = 0;
P<15:8> m aps to the d estination byte when byte
select = 1.
2. TBLWTL: Ta ble Write Low (ref er to Section 6.0
“Flash Program Memory” for details on Flash
Programming).
3. TBLRDH: Table Read High
Word: Read the most significant word of the
program address;
P<23:16> maps to D<7:0>; D<15:8> always
is = 0.
Byte: Read one of the MSBs of the program
address;
P<23:16> maps to the destination byte when
byte select = 0;
The destination byte will always be = 0 when
byte select = 1.
4. TBLWTH: Table W ri te High (refer to Section 6.0
“Flash Program Memory” for details on Flash
Programming).
FIGURE 3-3: PROGRAM DATA TABLE ACCESS (LEAST SIGNIFICANT WORD)
0
8
16
PC Address
0x000000
0x000002
0x000004
0x000006
23
00000000
00000000
00000000
00000000
Program Memory
‘Phantom’ Byte
(Read as ‘0’).
TBLRDL.W
TBLRDL.B (Wn<0> = 1)
TBLRDL.B (Wn<0> = 0)
dsPIC30F5015/5016
DS70149B-page 26 © 2006 Microchip Technology Inc.
FIGURE 3-4: PROGRAM DATA TABLE ACCESS (MSB)
3.1.2 DATA ACCESS FROM PROGRAM
MEMORY USING PROGRAM
SPACE VISIBILITY
The upper 32 Kbytes of data space may optionally be
mapped into any 16K word program space page. This
provides transparent access of stored constant data
from X data space, without the need to use special
instructions (i.e., TBLRDL/H, TBLWTL/H instructions).
Program space access through the data space occurs
if the MSb of the data space EA is set and program
space visibility is enabled, by setting the PSV bit in the
Core Control register (CORCON). The functions of
CORCON are discussed in Section 2.4 “DSP
Engine”.
Data accesses to this area add an additional cycle to
the instruction being executed, since two program
memory fetch es are requ ire d.
Note that the upper half of addressable data space is
always part of the X data space. Therefore, when a
DSP ope ration uses p rogram sp ace mapp ing to acces s
this m em ory reg ion , Y d ata sp ac e s ho uld ty pic al ly co n-
tain state (variable) data for DSP operations, whereas
X data space should typically contain coefficient
(constant) da ta.
Although each dat a sp ace address, 0x8000 and higher ,
maps directly into a corresponding program memory
address (see Figure 3-5), only the lower 16 bits of the
24-bit program word are used to contain the data. The
upper 8 bits shoul d be progra mmed to forc e an illeg al
instruction to maintain machine robustness. Refer
to the “dsPIC30F/33F Programmer’s Reference Man-
ual” (DS70157) for details on instruction encoding.
Note that by incrementing the PC by 2 for each
program memory word, the Least Significant 15 bits of
data space addresses directly map to the Least Signif-
icant 15 bits in the corresponding program space
addresses. The remaining bits are provided by the
Program Space Visibility Page register,
PSVPAG<7:0>, as shown in Figure 3-5.
For instructions which use PSV that are executed
outside a REPEAT loop:
The following instructions will require one instruc-
tion cycle in addition to the specified execution
time:
-MAC class of instructions with data operand
prefetch
-MOV instr ucti ons
-MOV.D instructions
All other instructions will require two instruction
cycl es in addition to th e specified execution time
of the instruction.
For instructions that use PSV which are executed
inside a REPEAT loop :
The follo wing inst ances will re quire two ins truction
cycl es in addition to th e specified execution time
of the instruction:
- Execution in the first iteration
- Execution in the last iteration
- Execution prior to exiting the loop due to an
interrupt
- Execution upon re-entering the loop after an
interr upt is servi ced
Any other iteration of the REPEAT loop will allow
the instruction, accessing data using PSV, to
execute in a single cycle.
0
8
16
PC Address
0x000000
0x000002
0x000004
0x000006
23
00000000
00000000
00000000
00000000
Program Memory
‘Phantom’ Byte
(Read as ‘0’)
TBLRDH.W
TBLRDH.B (Wn<0> = 1)
TBLRDH.B (Wn<0> = 0)
Note: PSV acc ess is tempo raril y disabl ed durin g
table reads/wr ites.
© 2006 Microchip Technology Inc. DS70149B-page 27
dsPIC30F5015/5016
FIGURE 3-5: DATA SPACE WINDOW INTO PROGRAM SPACE OPERATION
3.2 Data Address Space
The core has two data spaces. The data spaces can be
considered either separate (for some DSP instruc-
tions), o r as o ne u nified linear a ddre ss ran ge (fo r MC U
instruc tions). The dat a spaces are acces s ed usi ng two
Address Generation Units (AGUs) and separate data
paths.
3.2.1 DATA SPACE MEMORY MAP
The data space memory is split into two blocks, X and
Y data space. A key ele me nt of th is archi tec tur e is th at
Y space is a subset of X space, and is fully contained
within X space. In order to provide an apparent linear
addressing space, X and Y spaces have contiguous
addresses.
When ex ecuting an y instr uctio n other th an one of the
MAC class of instructions, the X block consists of the
64 Kbyte data address space (including all Y
address es). When e xecuting on e of the MAC clas s of
instructions, the X block consists of the 64 Kbyte data
address space excluding the Y address block (for data
reads only). In other words, all other instructions
regard the entire data memory as one composite
address space. The MAC class instructions extract the
Y address space from data space and address it using
EAs sourced from W10 and W11. The remaining X
data space is addressed using W8 and W9. Both
address spaces are concurrently accessed only with
the MAC class instructions.
A data space memory map is shown in Figure 3-6.
Figur e 3-7 s hows a graphi cal s ummar y of h ow X and Y
data spaces are accessed for MCU and DSP
instructions.
23 15 0
PSVPAG(1)
15
15
EA<15> =
0
EA<15> = 1
16
Data
Space
EA
Data Space Program Space
8
15 23
0x0000
0x8000
0xFFFF
0x00
0x017FFE
Data Read
Upper Half of Dat a
Space is Mapped
into Program Space
Note: PSVPAG is an 8-bit register, containing bits <22:15> of the program space address
(i.e., it defines the page in program space to which the upper half of data space is being mapped).
0x001200
Address
Con cat enat i on
BSET CORCON,#2 ; PSV bit set
MOV #0x00, W0 ; Set PSVPAG register
MOV W0, PSVPAG
MOV 0x9200, W0 ; Access program memory location
; using a data space access
0x000100
dsPIC30F5015/5016
DS70149B-page 28 © 2006 Microchip Technology Inc.
FIGURE 3-6: dsPIC30F5015/5016 DATA SPACE MEMORY MAP
0x0000
0x07FE
0x0BFE
0xFFFE
LSB
Address
16 bit s
LSBMSB
MSB
Address
0x0001
0x07FF
0x0BFF
0xFFFF
0x8001 0x8000
Optionally
Mapped
into Program
Memory
0x0FFF 0x0FFE
0x10000x1001
0x0801 0x0800
0x0C01
0x0C00
Near
Data
2 Kbyt e
SFR Space
2 Kbyte
SRAM Space
8 Kbyt e
Space
Unimplemented (X)
X Data
SFR Space
X Data RAM (X)
Y Data RAM (Y)
0x1FFF 0x1FFE
Unimplemented
Unimplemented
© 2006 Microchip Technology Inc. DS70149B-page 29
dsPIC30F5015/5016
FIGURE 3-7: DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS EXAMPLE
SFR SPACE
(Y SPACE)
X SPACE
SFR SPACE
UNUSED
X SPACE
X SPACE
Y SPACE
UNUSED
UNUSED
Non-MAC Class Ops (Read/Write) MAC Class Ops Read-Only
Indirect EA using any W Indirect EA using W10, W11 Indirect EA using W8, W9
MAC Class Ops (Write)
dsPIC30F5015/5016
DS70149B-page 30 © 2006 Microchip Technology Inc.
3.2.2 DATA SPACES
The X data space is used by all instructions and sup-
ports all addressing modes. There are separate read
and write data buses. The X read data bus is the return
data path for all instructions that view data space as
combined X and Y address space. It is also the X
address space data path for the dual operand read
instructions (MAC class). The X write data bus is the
only write path to data space for all instructions.
The X dat a sp ace also su pports Modulo Address ing for
all instructions, subject to addressing mode restric-
tions. Bit-Reversed Addressing is only supported for
writes to X data space.
The Y data space is used in concert with the X data
space by the MAC class of instructions (CLR, ED,
EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to pro-
vide two concurrent data read paths. No writes occur
across the Y bus. This class of instructions dedicates
two W register pointers, W10 and W11, to always
address Y data space, independent of X data space,
whereas W8 and W9 always address X data space.
Note that during accumulator write back, the data
address space is consi dere d a c om bin ati on of X and Y
data spaces, so the write occurs across the X bus.
Consequently, the write can be to any address in the
entire data space.
The Y data space can only be used for the data
prefetch operation associated with the MAC class of
instructions. It also supports Modulo Addressing for
automat ed c irc ul ar bu f fe r s. Of c ours e, all othe r ins tru c-
tions ca n access the Y dat a address sp ace thro ugh the
X data path, as part of the composite linear space.
The boundary between the X and Y data spaces is
defined as shown in Figure 3-6 and is not user
prog rammabl e. Should an EA poi nt to data outs ide its
own assigned address space, or to a location outside
physical memory, an all-zero word/byte will be
returned. For example, although Y address space is
visible by all non-MAC instructions using any address-
ing mode , an attem pt by a MAC in structi on to fetc h dat a
from that space, using W8 or W9 (X space pointers),
will return 0x0000.
All effective addresses are 16 bits wide and point to
bytes within the data space. Therefore, the data space
address range is 64 Kbytes or 32K words.
3.2.3 DATA SPACE WIDTH
The core data width is 16 bits. All internal registers are
organ ized as 16-bit wide words. Data space mem ory is
organized in byte addressable, 16-bit wide blocks.
3.2.4 DATA AL IGNMENT
To help maintain backward compatibility with
PICmicro® devices and improve data space memory
usage ef ficiency, the dsPIC30F instructi on set support s
both word and byte operations. Data is aligned in data
memory and regi sters as words, b ut all da ta sp ace EA s
resolve to bytes. Data byte re ads will rea d the comp lete
word, whi ch contain s the byte, using the LSb of any EA
to determine which byte to select. The selected byte is
placed onto the LSB of the X data path (no byte
acces ses are possible fro m the Y data pa th as the MAC
class of instruction can only fetch words). That is, data
memory and registers are organized as two parallel
byte wide entities with shared (word) address decode,
but separate write lines. Data byte writes only write to
the corresponding side of the array or register which
matches the byte address.
As a conse quence of this byte access ibility, all ef fective
address c alc ul atio ns (in cl udi ng tho se ge nera ted by th e
DSP operations, which are restricted to word-sized
data) a re internally scale d to step through word-aligned
memory. For example, the core would recognize that
Post-Modified Register Indirect Addressing mode,
[Ws++], will result in a value of Ws + 1 for byte
operations and Ws + 2 for word operations.
All word accesses must be al igned to an even a ddress.
Misaligned word data fetches are not supported, so
care must be taken when mixing byte and word opera-
tions, or translating from 8-bit MCU code. Should a
misaligned read or write be attempted, an address
error trap will be generated. If the error occurred on a
read, the instruction u nderway is completed, wh ereas if
it occurred on a write, the instruction will be executed
but the write will not occur. In either case, a trap will
then be executed, allowing the system and/or user to
examine the machine state prior to execution of the
address fault.
FIGURE 3-8: DATA ALIGNMENT
TABLE 3-2: EFFECT OF INVALID
MEMORY ACCESSES
Attempted Operation Data Returned
EA = an unimplemented address 0 x0000
W8 or W9 used to access Y data
spa ce in a MAC instru ction 0x0000
W10 or W11 used to access X
data space in a MAC instruction 0x0000
15 8 7 0
0001
0003
0005
0000
0002
0004
Byte 1 Byte 0
Byte 3 Byte 2
Byte 5 Byte 4
LSBMSB
© 2006 Microchip Technology Inc. DS70149B-page 31
dsPIC30F5015/5016
All byte loads into any W register are loaded into the
LSB. The MSB is not modified.
A sign-extend (SE) instruction is provided to allow
users to translate 8-bit signed data to 16-bit signed
values. Alternatively, for 16-bit unsigned data, users
can clear the MSB of any W register by executing a
zero-extend (ZE) instruction on the appropriate
address.
Although m os t i ns truc tio ns are cap able of op era t ing o n
word or byte data sizes, it should be noted that some
instructions, including the DSP instructions, operate
only on words .
3.2.5 NEAR DATA SPACE
An 8 Kbyte ‘near’ data space is reserved in X address
memory space between 0x0000 and 0x1FFF, which is
directly add res sab le via a 13-bit absolut e address field
within all memory direct instructions. The remaining X
address space and all of the Y address space is
address able indirec tly. Additional ly, the whole of X da ta
space is addressable using MOV instructions, which
support memory direct addressing with a 16-bit
address field.
3.2.6 SOFTWARE STACK
The dsPI C DSC de vice c ontain s a softwa re st ack. W15
is used as the Stack Pointer.
The Stack Pointer always points to the first available
free word and grows from lower addresses towards
higher ad dresses. It pre-dec rements for stack pop s and
post-increments for stack pushes, as shown in
Figure 3-9. Note that for a PC push during any CALL
instruc tio n, the M SB o f t he PC i s ze ro-ex te nde d b efo re
the push, ensuring that the MSB is always clear.
There is a Stack Pointer Limit register (SPLIM) associ-
ated with the Stack Pointer. SPLIM is uninitialized at
Reset. As is t he case f or t h e Stack Point er, SPLIM< 0>
is forced to ‘0’, because all stack operations must be
word-aligned. Whenever an Effective Address (EA) is
generated using W15 as a source or destination
pointer, the address thus generated is compared with
the valu e i n SPL IM. If the cont ents of the Stack Po int er
(W15) and the SPLIM register are equal and a push
operatio n is perform ed, a st ack error trap will no t occur.
The stack error trap will occur on a subsequent push
operation. Thus, for example, if it is desirable to cause
a stack error trap when the stack grows beyond
address 0x2000 in RAM, initialize the SPLIM with the
value, 0x1FFE.
Similarl y, a S tack Po inter un derflow ( sta ck erro r) trap i s
generated when the Stack Pointer address is found to
be less than 0x0800, thus preventing the stack from
interfering with the Special Function Register (SFR)
space.
A write to the SPLIM register should not be immediately
follow ed by an ind irec t read ope rati on usi ng W15.
FIGURE 3-9: CALL STACK FRAME
Note: A PC push during exception processing
will concatenate the SRL register to the
MSB of the PC prior to the push.
<Free Word>
PC<15:0>
000000000
015
W15 (before CALL)
W15 (after CALL)
Stack Grows Towards
Higher Address
PUSH: [ W 15++]
POP: [--W15]
0x0000
PC<22:16>
dsPIC30F5015/5016
DS70149B-page 32 © 2006 Microchip Technology Inc.
TABLE 3-3: CORE REGISTER MAP
SFR Name Address
(Home) Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
W0 0000 W0/WREG 0000 0000 0000 0000
W1 0002 W1 0000 0000 0000 0000
W2 0004 W2 0000 0000 0000 0000
W3 0006 W3 0000 0000 0000 0000
W4 0008 W4 0000 0000 0000 0000
W5 000A W5 0000 0000 0000 0000
W6 000C W6 0000 0000 0000 0000
W7 000E W7 0000 0000 0000 0000
W8 0010 W8 0000 0000 0000 0000
W9 0012 W9 0000 0000 0000 0000
W10 0014 W10 0000 0000 0000 0000
W11 0016 W11 0000 0000 0000 0000
W12 0018 W12 0000 0000 0000 0000
W13 001A W13 0000 0000 0000 0000
W14 001C W14 0000 0000 0000 0000
W15 001E W15 0000 1000 0000 0000
SPLIM 0020 SPLIM 0000 0000 0000 0000
ACCAL 0022 ACCAL 0000 0000 0000 0000
ACCAH 0024 ACCAH 0000 0000 0000 0000
ACCAU 0026 Sign-Extension (ACCA<39>) ACCAU 0000 0000 0000 0000
ACCBL 0028 ACCBL 0000 0000 0000 0000
ACCBH 002A ACCBH 0000 0000 0000 0000
ACCBU 002C Sign-Extension (ACCB<39>) ACCBU 0000 0000 0000 0000
PCL 002E PCL 0000 0000 0000 0000
PCH 0030 —PCH
0000 0000 0000 0000
TBLPAG 0032 —TBLPAG
0000 0000 0000 0000
PSVPAG 0034 —PSVPAG
0000 0000 0000 0000
RCOUNT 0036 RCOUNT uuuu uuuu uuuu uuuu
DCOUNT 0038 DCOUNT uuuu uuuu uuuu uuuu
DOSTARTL 003A DOSTARTL 0uuuu uuuu uuuu uuu0
DOSTARTH 003C —DOSTARTH
0000 0000 0uuu uuuu
DOENDL 003E DOENDL 0uuuu uuuu uuuu uuu0
DOENDH 0040 DOENDH 0000 0000 0uuu uuuu
SR 0042 OA OB SA SB OAB SAB DA DC IPL2 IPL1 IPL0 RA N OV Z C 0000 0000 0000 0000
CORCON 0044 US EDT DL2 DL1 DL0 SATA SATB SATDW ACCSAT IPL3 PSV RND IF 0000 0000 0010 0000
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
© 2006 Microchip Technology Inc. DS70149B-page 33
dsPIC30F5015/5016
MODCON 0046 XMODEN YMODEN BWM<3:0> YWM<3:0> XWM<3:0> 0000 0000 0000 0000
XMODSRT 0048 XS<15:1> 0 uuuu uuuu uuuu uuu0
XMODEND 004A XE<15:1> 1 uuuu uuuu uuuu uuu1
YMODSRT 004C YS<15:1> 0 uuuu uuuu uuuu uuu0
YMODEND 004E YE<15:1> 1 uuuu uuuu uuuu uuu1
XBREV 0050 BREN XB<14:0> uuuu uuuu uuuu uuuu
DISICNT 0052 DISICNT<13:0> 0000 0000 0000 0000
TABLE 3-3: CORE REGISTER MAP (CONTINUED)
SFR Name Address
(Home) Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F5015/5016
DS70149B-page 34 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 35
dsPIC30F5015/5016
4.0 ADDRESS GENERATOR UNITS
The dsPIC DSC core contains two independent
Address Generator Units (AGU): the X AGU and Y
AGU. The Y AGU supports word-sized data reads for
the DSP MAC class of instr uctions o nly . Th e dsPIC DSC
AGUs support three types of data addressing:
Linear Addressing
Modulo (Circular) Addressing
Bit-Revers ed Addre ss in g
Linear and Modulo Data Addressing modes can be
applied to data space or program space. Bit-Reversed
Addressi ng is on ly appli cable to data s pace a ddresses .
4.1 Instruction Addressing Modes
The addressing modes in Table 4-1 form the basis of
the addressing modes optimized to support the specific
features of individual instructions. The addressing
modes provided in the MAC class of instructions are
somewhat different from those in the other instruction
types.
4.1.1 FILE REGISTER INSTRUCTIONS
Most file register instructions use a 13-bit address field
(f) to directly address dat a present in the firs t 8192 bytes
of data memory (near data space). Most file register
instructions employ a working register W0, which is
denoted as WREG in these instructions. The des tination
is typically either the same file register, or WREG (with
the exception of the MUL instruction), which writes the
result to a register or register pair. The MOV instruction
allows additional flexibility and can access the entire
data sp ace during file register operation.
4.1.2 MCU INSTRUCTIONS
The three-operand MCU instructions are of the form:
Operand 3 = Operand 1 <function> Operand 2
where O pe rand 1 is alw a ys a work in g reg ister (i.e., the
address ing mode can only be Reg ister Direct), whi ch is
referred to as Wb. Operand 2 can be a W register,
fetched from data memory, or a 5-bit literal. The result
location can be either a W register or an address
location. The following addressing modes are
supported by MCU instructions:
Register Direct
Register Indirect
Register Indirect Post-Modified
Register Indirect Pre-Modified
5-bit or 10-bit Literal
TABLE 4-1: FUNDAMENTAL ADDRESSING MODES SUPPORTED
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and pro-
gramming, refer to the “dsPIC30F/33F Program-
mer’s Reference Manual” (DS70157).
Note: Not all instructions sup port all the address-
ing modes given above. Individual
instructions may support different subsets
of these addressing modes.
Addressing Mode Description
File Register Direct The address of the file register is specified explicitly.
Register Direct The contents of a register are accessed directly.
Register Indirect The contents of Wn forms the EA.
Register Indirect Post-Modified The contents of Wn forms the EA. Wn is post-modified (incremented or
decremented) by a constant value.
Register Indirect Pre-Modified Wn is pre-modified (incremented or decremented) by a signed constant value
to form the EA.
Register Indirect with Register Offset The sum of Wn and Wb forms the EA.
Register Indirect with Literal Offset The sum of Wn and a literal forms the EA.
dsPIC30F5015/5016
DS70149B-page 36 © 2006 Microchip Technology Inc.
4.1.3 MOVE AND ACCUMULATOR
INSTRUCTIONS
Move instructions and the DSP Accumulator class of
instructions provide a greater degree of addressing
flexibility than other instructions. In addition to the
addressing modes supported by most MCU instruc-
tions, Move and Accumulator instructions also support
Register Indirect with Register Offset Addressing
mode, also referred to as Register Indexed mode.
In summary, the following addressing modes are
supported by Move and Accumulator instructions:
Register Direc t
Register Indi rec t
Register Indi rec t Post-Mod ifi ed
Register Indi rec t Pre- Mo dif ied
Register Indirect with Register Offset (Indexed)
Register Indirect with Literal Offset
8-bit Literal
16-bit Literal
4.1.4 MAC INSTRUCTIONS
The dual source operand DSP instructions (CLR, ED,
EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also
referred to a s MAC instruction s, utilize a si mplified se t of
addressing modes to allow the user to effectively
manipulate the data pointers through Register Indirect
tables.
The two source operand prefetch registers must be a
member of the set {W8, W9, W10, W11}. For data
reads, W8 and W9 will always be directed to the X
RAGU and W10 and W11 will a lways be dire cted to the
Y AGU. The ef fective addresses generated (before and
after modification) must, therefore, be valid addresses
within X data space for W8 and W9 and Y data space
for W10 and W11.
In summary, the following addressing modes are
supported by the MAC class of instructions:
Register Indirect
Register Indirect Post-Modified by 2
Register Indirect Post-Modified by 4
Register Indirect Post-Modified by 6
Register Indirect with Register Offset (Indexed)
4.1.5 OTHER INSTRUCTIONS
Besides the various addressing mo des outlin ed above,
some i nstructio ns use li teral con sta nts of various sizes.
For example, BRA (branch) instructions use 16-bit
signed l iterals to spe cify the branch de stination dire ctly ,
whereas the DISI instruction uses a 14-bit unsigned
literal fiel d. In som e in stru cti ons , suc h as ADD Acc, the
source of an operand or result is implied by the opc ode
it self. Cert ain opera tions, such as NOP, do not have any
operands.
4.2 Modulo Addressing
Modulo Addressing is a method of providing an auto-
mated means to support circular data buffers using
hardware. The objective is to remove the need for
software to perform data address boundary checks
when executing tightly looped code, as is typical in
many DSP algorithms.
Modulo Addressing can operate in either data or pro-
gram space (since the data pointer mechanism is essen-
tially the same for both). One circular buffer can be
supported in each of the X (which also provides the
pointers into program space) and Y data spaces. Mod-
ulo Addressing can operate on any W register pointer.
However , it is not advisable to use W14 or W15 for Mod-
ulo Addressing, since these two registers are used as
the St ack Frame Pointer a nd Stack Pointer,
respectively.
In general, any particular circular buffer can only be
configu red to o perate in one direc tion, as t here are cer-
tain restrictions on the buffer start address (for incre-
menting buffers) or end address (for decrementing
buffers) based upon the direction of the buffer.
The only exception to the usage restrictions is for buff-
ers which have a power-of-2 length. As these buffers
satisfy the start and end address criteria, they may
operate in a Bidirectional mode, (i.e., address bound-
ary checks will be performed on both the lower and
upper address boundaries).
Note: For the MOV instructions, the addressing
mode specified in the instruction can differ
for the source and destination EA. How-
ever, the 4-bit Wb (Regi ste r Offset) field is
shared between both source and
destination (but typically only used by
one).
Note: Not all instructions su pport all the address-
ing modes given above. Individual
instructions may support different subsets
of these addressing modes.
Note: Register Indirect with Register Offset
Addressing is only available for W9 (in X
spa ce) and W11 (in Y space).
© 2006 Microchip Technology Inc. DS70149B-page 37
dsPIC30F5015/5016
4.2.1 START AND END ADDRESS
The Modulo Addressing scheme requires that a
starting and an ending address be specified and
loaded in to the 16-bi t M od ulo Bu f fe r Address re gisters :
XMODSRT, XMODEND, YMODSRT and YMODEND
(see Table 3-3).
The length of a circular buffer is not directly specified.
It is determined by the difference between the
corresp onding st art and end ad dress es. Th e ma ximu m
possible length of the circular buffer is 32K words
(64 Kbytes).
4.2.2 W ADDRESS REGISTER
SELECTION
The Mod ulo an d Bi t-Rev ers ed Add ress in g Co ntro l re g-
ister, MODCON<15:0>, contains enable flags, as well
as a W re gister field t o specify the W Address registers .
The XWM and YWM fields select which registers will
operate with Modulo Addressing. If XWM = 15,
X RAGU and X WAGU Modulo Addressing are
disabled. Similarly, if YWM = 15, Y AGU Modulo
Addressi ng is disab led .
The X Address Space Pointer W register (XWM) to
which Modulo Addressing is to be applied, is stored in
MODCON<3 :0> (see Table 3-3). Modulo Add ressin g is
enabled for X data sp ace when XWM is set to any v alue
other than 15 and the XMODEN bit is set at
MODCON<15>.
The Y Address Space Pointer W register (YWM) to
which Modulo Addressing is to be applied, is stored in
MODCON<7:4>. Modulo Addressing is enabled for Y
data space when YWM is set to any value other than
15 and the YMODEN bit is set at MODCON<14>.
FIGURE 4-1: MODULO ADDRESSING OPERATION EXAMPLE
Note: Y-space Modulo Addressing EA calcula-
tions assume word-sized data (LSb of
ever y EA is always clear ).
0x1100
0x1163
Start Addr = 0x1100
End Addr = 0x1163
Length = 0x003 2 w ords
Byte
Address MOV #0x1100,W0
MOV W0, XMODSRT ;set modulo start address
MOV #0x1163,W0
MOV W0,MODEND ;set modulo end address
MOV #0x8001,W0
MOV W0,MODCON ;enable W1, X AGU for modulo
MOV #0x0000,W0 ;W0 holds buffer fill value
MOV #0x1110,W1 ;point W1 to buffer
DO AGAIN,#0x31 ;fill the 50 buffer locations
MOV W0, [W1++] ;fill the next location
AGAIN: INC W0,W0 ;increment the fill value
dsPIC30F5015/5016
DS70149B-page 38 © 2006 Microchip Technology Inc.
4.2.3 MODULO ADDRESSING
APPLICABILITY
Modulo Addressing can be applied to the Effective
Address (EA) calculation associated with any W regis-
ter. It is important to realize that the addres s bou ndaries
check for addresses less than or greater than the upper
(for incrementing buffers) and lower (for decrementing
buffers) boundary addresses (not just equal to). Address
changes may, therefore, jump beyond boundaries and
still be adjusted correctly.
4.3 Bit-Reversed Addressing
Bit-Reversed Addressing is intended to simplify data
reordering for radix-2 FFT al gorithms. It is supported by
the X AGU for data wr ites only.
The modifier , which may be a constant value or register
contents, is regarded as having its bit order reversed.
The addres s sourc e and dest inat ion are ke pt in norma l
order. Thus, the only operand requiring reversal is the
modifier.
4.3. 1 BIT-REVERSED ADDRESSING
IMPLEMENTATION
Bit-Reversed Addressing is enabled when:
1. BWM (W register selection) in the MODCON
register is any value other than 1 5 (the stack can
not be accessed using Bit-Reversed Addressing)
and
2. the BREN bit is set in the XBREV register and
3. the addressing mode used is Register Indirect
with Pre-Increment or Post-Increment.
If the le ng th of a Bi t- R ev ers ed bu ffer is M = 2N bytes,
then the last ‘N’ bits of the data buffer start address
must be zero s.
XB<14:0> is the Bit-Reversed Address modifier or
‘pivot po int’ which is typ ic all y a consta nt. In t he case of
an FFT computation, its value is equal to half of the FFT
dat a buffer size.
When enabled, Bit-Reversed Addressing will only be
executed for Register Indirect with Pre-Increment or
Post-Increment Addressing and word-sized data writes.
It will not function for any other addressing mode or for
byte-sized data, and normal addresses will be gener-
ated instead. When Bit-Reversed Addressing is active,
the W address pointer will always be added to the
address modifier (XB) and the offset associated with the
Register Indirect Addressing mode will be ignored. In
addition, as word-si zed data is a requirement, th e LSb of
the EA is ignored (and always cle ar).
If Bit-Reversed Addressing has already been enabled
by setting the BREN (XBREV<15>) bit, then a write to
the XBREV register should not be immediately followed
by an indirect read operation using the W register that
has been designated as the Bit-Reversed Pointer.
FIGURE 4-2: BIT-REVERSED ADDRESS EXAMPLE
Note: The m odulo correcte d Effective Address is
written back to the re giste r only when Pre-
Modify or Post-Modify Addressing mode is
used to compute the Effective Address.
When an address offset (e.g., [W7 + W2])
is used , m odu lo a dd res s c orrec ti on i s p er-
formed, but the contents of the register
remains unchanged.
Note: All bit-reversed EA calculations assume
word-sized data (LSb of every EA is
always clear). The XB value is scaled
accordingly to generate compatible (byte)
addresses.
Note: Modulo Addressing and Bit-Reversed
Addressing should not be enabled
together. In the event that the user
attempt s to do this , Bit-Reversed Addr ess-
ing wil l assume priori ty when activ e for the
X WAGU, and X WAGU Modulo Address-
ing will be disabled. However, Modulo
Addressing will continue to function in the
X RAGU.
b3 b2 b1 0
b2 b3 b4 0
Bit Locations Swapped Left-to-Right
Around Center of Binary Value
Bit-Reversed Address
XB = 0x0008 for a 16-word Bit-Reversed Buffer
b7 b6 b5 b1
b7 b6 b5 b4
b11 b10 b9 b8
b11 b10 b9 b8
b15 b14 b13 b12
b15 b14 b13 b12
Sequenti al Addre ss
Pivot Point
© 2006 Microchip Technology Inc. DS70149B-page 39
dsPIC30F5015/5016
TABLE 4-2: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)
TABLE 4-3: BIT-REVERSED ADDRESS MODIFIER VALUES FOR XBREV REGISTER
Normal Address Bit-Reversed Address
A3 A2 A1 A0 Decimal A3 A2 A1 A0 Decimal
0000 00000 0
0001 11000 8
0010 20100 4
0011 31100 12
0100 40010 2
0101 51010 10
0110 60110 6
0111 71110 14
1000 80001 1
1001 91001 9
1010 10 0101 5
1011 11 1101 13
1100 12 0011 3
1101 13 1011 11
1110 14 0111 7
1111 15 1111 15
Buffer Size (Words) XB<14:0> Bit-Reversed Address Modifier Value
4096 0x0800
2048 0x0400
1024 0x0200
512 0x0100
256 0x0080
128 0x0040
64 0x0020
32 0x0010
16 0x0008
80x0004
40x0002
20x0001
dsPIC30F5015/5016
DS70149B-page 40 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 41
dsPIC30F5015/5016
5.0 INTERRUPTS
The dsPIC30F5015/5016 has 36 interrupt sources and
4 processor exceptions (traps), which must be
arbitrated based on a priority scheme.
The CPU is responsible for reading the Interrupt
Vector Table (IVT) and transferring the address con-
tained in the interrupt vector to the program counter.
The interrupt vector is transferred from the program
data bus into the program counter, via a 24-bit wide
multiplexer on the input of the program counter.
The Interrupt Vector Table (IVT) and Alternate Inter-
rupt Vector Table (AIVT) are placed near the begin-
ning of program memory (0x000004). The IVT and
AIVT are shown in Figure 5-1.
The interrupt controller is responsible for pre-
processing the interrupts and processor exceptions,
prior to their being presented to the processor core.
The peripheral interrupts and traps are enabled, priori-
tized and co ntrolle d using cen tral ized Specia l Functio n
Registers:
IFS0<15:0>, IFS1<15:0>, IFS2<15:0>
All Interrupt Request Flags are maintained in
these three registers. The flags are set by their
respective peripherals or external signals, and
they are cleared via software.
IEC0<15:0>, IEC1<15:0>, IEC2<15:0>
All Interrupt Enable Control bits are maintained in
these three registers. These control bits are used
to individually enable interrupts from the
peripherals or external signals.
IPC0<15:0>... IPC11<7:0>
The user assignable priority level associated with
each of these 44 interrupts is held centrally in
these twelve registers.
IPL<3:0>
The current CPU priority level is explicitly stored
in the IPL bi ts. IPL<3> i s p res en t in the C ORCO N
register, whereas IPL<2:0> are present in the
STATUS register (SR) in the processor core.
INTCON1< 15: 0>, IN TCO N2<15:0>
Global interru pt co ntrol fu nctio ns are deriv ed from
these two registers. INTCON1 contains the con-
trol and status flags for the processor exceptions.
The INTCON2 r egister controls the external inter-
rupt request signal behavior and the use of the
alternate vector table.
All interrupt sources can be user assigned to one of
seven priority levels, 1 through 7, via the IPCx
registers. Each interrupt source is associated with an
interrupt vector, as shown in Table 5-1. Levels 7 and 1
represent the highest and lowest maskable priorities,
respectively.
If the NSTDIS bit (INTCON1<15>) is set, nesting of
interrupts is prev en ted . Thus, if a n i nte rrupt is c urrentl y
being serviced, processing of a new interrupt is pre-
vented, even if the new interrupt is of higher priority
than the one currently being serviced.
Certain interrupts have specialized control bits for
features like edge or level triggered interrupts, inter-
rupt-on-change, etc. Control of these features remains
within the peripheral module which generates the
interrupt.
The DISI instruction can be used to disable the
processing of interrupts of priorities 6 and lower for a
certain number of instructions, during which the DISI bit
(INTCON2<14>) remains set.
When an interrupt is serviced, the PC is loaded with the
address stored in the vector location in program
memory that corresponds to the interrupt. There are 63
different vectors within the IVT (refer to Figure 5-2).
These vectors are contained in locations 0x000004
through 0x0000FE of program memory (refer to
Figure 5-2). These locations contain 24-bit addresses,
and in order to preserve robustness, an address error
trap will take place should the PC attempt to fetch any
of these words during normal execution. This prevents
execution of random data as a result of accidentally
decrementing a PC into vector space, accidentally
mappin g a da t a sp ac e add ress into v ector sp ac e or th e
PC rolling over to 0x000000 after reaching the end of
implemented program memory space. Execution of a
GOTO instruc t io n to this ve ctor spac e w il l al so gen erate
an address error trap.
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and pro-
gramming, refer to the “dsPIC30F/33F Program-
mer’s Reference Manual” (DS70157).
Note: Interru pt flag bit s get set when an interru pt
conditi on occ urs, regar dless o f the s tate of
its corresponding enable bit. User
software should ensure the appropriate
interrupt flag bits are clear prior to
enabling an interrupt.
Note: Assigning a priority level of 0 to an inter-
rupt source is equivalent to disabling that
interrupt.
Note: The IPL bits become read-only whenever
the NSTDIS bit has been set to ‘1’.
dsPIC30F5015/5016
DS70149B-page 42 © 2006 Microchip Technology Inc.
5.1 Interrupt Priority
The user a ssig nab le Interrupt Pr iori ty (I P<2:0 >) bi t s for
each ind ividual interrupt source are located in the Least
Significant 3 bits of each nibble within the IPCx regis-
ter(s). Bit 3 of each nibble is not used and is read as a
0’. These bits define the priority level assigned to a
particular interrupt by the user.
Since more than one interrupt request source may be
assigned to a specific user specified priority level, a
means is provided to assign prio rity within a given level.
This method is called “Natural Order Priority”.
Natural Order Priority is determined by the position of
an interrupt in the vector table, and only affects
interrupt operation when multiple interrupts with the
same user-assigned priority become pending at the
same time.
Table 5-1 lists the interrupt numbers and interrupt
sources for the dsPIC DSC devices and their
associated vector numbers.
The ability for the user to assign every interrupt to one
of seven pri ority levels means that the user can as sig n
a very high overall priority level to an interrupt with a
low natural order priority.
TABLE 5-1: INTERRUPT VECTOR TABLE
Note: The user-selectable priority levels start at
0, as th e l ow es t p riori ty and level 7 , as th e
highest priority.
Note 1: The Natural Order Priority scheme has 0
as the highest priority and 53 as the
lowest priority.
2: The Natural Order Priority number is the
same as the INT number.
INT
Number Vector
Number Interrupt Source
Highest Natural Order Priority
0 8 IN T 0 Extern a l Interr u pt 0
1 9 IC1 – Input Capture 1
2 10 OC1 – Output Compare 1
3 11 T1 – Timer1
4 12 IC2 – Input Captur e 2
5 13 OC2 – Output Compare 2
6 14 T2 – Tim er2
7 15 T3 – Tim er3
8 16 SPI1
9 17 U1RX – UART1 Receiver
10 18 U1TX – UART1 Transmit ter
11 19 ADC – ADC Convert Done
12 20 NVM – NVM Write Complete
13 21 SI2C – I2C™ Slave In terr up t
14 22 MI2C – I 2C Master Interrupt
15 23 Inpu t Change Int er ru pt
16 24 INT1 – Ex te rn al In te rrupt 1
17 25 Reserved
18 26 Reserved
19 27 OC3 – Output Compare 3
20 28 OC4 – Output Compare 4
21 29 T4 – Tim er4
22 30 T5 – Tim er5
23 31 INT2 – Ex te rn al In te rrupt 2
24 32 Reserved
25 33 Reserved
26 34 SPI2
27 35 C1 – Combined IRQ for CAN1
28 36 IC3 – I nput Captur e 3
29 37 IC4 – I nput Captur e 4
30 38 Reserved
31 39 Reserved
32 40 OC5 – Output Compare 5
33 41 OC6 – Output Compare 6
34 42 OC7 – Output Compare 7
35 43 OC8 – Output Compare 8
36 44 INT3 – Ex te rn al In te rrupt 3
37 45 INT4 – Ex te rn al In te rrupt 4
38 46 Reserved
39 4 7 PWM – PWM Period Match
40 48 QEI – QEI Interrupt
41 49 Reserved
42 50 Reserved
43 51 FLTA – PW M Fault A
44 52 FLTB – PWM Fault B
45-53 53-61 Reserved
Lowest Natural Order Priority
© 2006 Microchip Technology Inc. DS70149B-page 43
dsPIC30F5015/5016
5.2 Reset Sequence
A Reset is not a true exception because the interrupt
controller is not involved in the Reset process. The
process or initi alizes its registers i n respon se to a Reset
which forces the PC to zero. The processor then begins
program execution at location 0x000000. A GOTO
instruction is stored in the first program memory loca-
tion, im media tel y follo wed by th e addres s t arget for th e
GOTO instruction. The processor executes the GOTO to
the speci f ie d add res s and then begi ns op erat ion at the
specified target (start) address.
5.2.1 RESET SOURCES
There are 6 sources of error which will cause a device
Reset.
Watchdog Time-out:
The Watchdog has timed out, indicating that the
process or is no longer ex ecu tin g the corre ct flo w
of code.
Uninitialized W Register Trap:
An attempt to use an uninitialized W register as
an Address Pointer will cause a Reset.
Illegal Instruction Trap:
Attempted execution of any unused opcodes will
result in an illegal instruction trap. Note that a
fetch of an illegal instruction does not result in an
illegal instruction trap if that instruction is flushed
prior to execution due to a flow change.
Brown-out Reset (BOR):
A momentary dip in the power supply to the
device has been detected which may result in
malfunction.
Trap Lockout:
Occurrence of multiple trap condit ions
simultaneously will cause a Reset.
5.3 Traps
Traps can be considered as non-maskable interrupts
indicating a software or hardware error, which adhere
to a predefined priority, as shown in Figure 5-1. They
are intended to provide the user a means to correct
errone ous o pera tio n d urin g debug and w he n o pera tin g
within the application.
Note that many of these trap conditions can only be
detected when th ey occur. Conseque ntly, the ques tion-
able instruction is allowed to complete prior to trap
exception processing. If the user chooses to recover
from the error, the result of the erroneous action that
caused the trap may have to be corrected.
There are 8 fixed priority levels for traps: Level 8
through Level 15, which means that IPL3 is always set
during pr ocessing of a trap.
If the use r is not curren tly executing a trap, and set s the
IPL<3:0> bits to a value of ‘0111’ (Level 7), then all
interr upts are disabled, b ut traps c an still b e processed.
5.3.1 TRAP SOURCES
The following traps are provided with increasing
priority. However, since all traps can be nested, priority
has lit tle ef f e ct .
Math Error Trap:
The math error trap executes under the following four
circumstances:
1. Should an attempt be made to divide by zero,
the divide operation will be aborted on a cycle
boundary and the trap taken.
2. If enabled, a math error trap will be taken when
an ar ithmetic operat ion on either Accum ul ato r A
or B causes an overflow from bit 31 and the
Accumulator Guard bits are not utilized.
3. If enabled, a math error trap will be taken when
an ar ithmetic operat ion on either Accum ul ato r A
or B causes a catastrophic overflow from bit 39
and all saturation is disabled.
4. If the shift amount specified in a shift instruction
is greater than the maximum allowed shift
amount, a trap will occur.
Note: If the user does not intend to take correc-
tive action in the event of a trap error
condition, these vectors must be loaded
with the address of a default handler that
simply contains the RESET instruction. If,
on the other hand, one of the vectors
containing an invalid address is called, an
address error trap is generated.
dsPIC30F5015/5016
DS70149B-page 44 © 2006 Microchip Technology Inc.
Address Error Trap:
This trap is initiated when any of the following
circumstances occurs:
1. A misaligned data word access is attempted.
2. A data fetch from unimplemented data memory
location is attempted.
3. A data access of an unimplemented program
memory location is attempted.
4. An instruction fetch from vector space is
attempted.
5. Execution o f a “BRA #literal” instruct ion or a
GOTO #literal” ins truc ti on, w he re literal
is an u nimplem ented pr ogram me mory addr ess.
6. Executing instructions after modifying the PC to
point to unimplemented program memory
addresses. The PC may be modified by loading
a value into the stack and executing a RETURN
instruction.
Stack Error Trap:
This trap is initiated under the following conditions:
1. The Stack Pointer is loaded with a value which
is greater than the (user-programmable) limit
value written into the SPLIM register (stack
overflow).
2. The Stack Pointer is loaded with a value which
is less than 0x0800 (simple stack underflow).
Oscillator Fail Trap:
This trap is initiated if the external oscillator fails and
operation becomes reliant on an internal RC backup.
5.3.2 HARD AND SOFT TRAPS
It is possible that multiple traps can become active
within the same cycle (e.g., a misaligned word stack
write to an overflowed address). In such a case, the
fixed priority shown in Figure 5-2 is implemented,
whic h may requir e the user t o check if oth er traps are
pending in order to completely correct the Fault.
‘Soft’ traps incl ude exceptions of priority lev el 8 through
level 11, inclusive. The arithmetic error trap (level 11)
falls into this category of traps.
‘Hard’ traps include exceptions of priority level 12
through level 15, inclusive. The address error (level
12), stack error (level 13) and oscillator error (level 14)
traps fall into this category.
Each hard trap that occurs must be Acknowledged
before code execution of any type may continue. If a
lower priority hard trap occurs while a higher priority
trap is pending, acknowledged, or is being processed,
a hard trap conflict will occur.
The device is automatically reset in a hard trap conflict
condition. The TRAPR Status bit (RCON<15>) is set
when the Reset occurs, so that the condition may be
detected in software.
FIGURE 5-1: TRAP VECTORS
Note: In the MAC class of instructions, wherein
the data space is split into X and Y data
space, unimplemented X space includes
all of Y space, and unimplemented Y
space includes all of X space.
Address Error Trap Vector
Oscillator Fail Trap Vector
Stack Error T rap Vector
Reserv ed Vector
Math Error Trap Vector
Reserved
Oscillator Fail Trap Vector
Address Error Trap Vector
Reserv ed Vector
Reserv ed Vector
Interrupt 0 Vector
Interrupt 1 Vector
Interrupt 52 Vector
Interrupt 53 Vector
Math Error Trap Vector
Decreasing
Priority
0x000000
0x000014
Reserved
Stack Error T rap Vector
Reserv ed Vector
Reserv ed Vector
Interrupt 0 Vector
Interrupt 1 Vector
Interrupt 52 Vector
Interrupt 53 Vector
IVT
AIVT
0x000080
0x00007E
0x0000FE
Reserved
0x000094
Reset - GOTO Instruction
Reset - GOTO Address 0x000002
Reserved 0x000082
0x000084
0x000004
Reserv ed Vector
© 2006 Microchip Technology Inc. DS70149B-page 45
dsPIC30F5015/5016
5.4 Interrupt Sequence
All inte rrupt event flags are sampled in the be ginning of
each instruction cycle by the IFSx registers. A pending
Interrupt Request (IRQ) is indicated by the flag bit
being equal to a ‘1’ in an IFSx register. The IRQ will
cause an interrupt to occur if the corresponding bit in
the Interrupt Enable (IECx) register is set. For the
remainder of the instruction cycle, the priorities of all
pending interrupt requests are evaluated.
If there is a pending IRQ with a priority level greater
than the current processor priority level in the IPL bits,
the processor will be interrupted.
The pr ocessor then st acks the curren t program counter
and the low byte of the processor STATUS register
(SRL), as shown in Figure 5-2. The low byte of the
ST ATUS register cont ains the processor pri ority level at
the time prior to the beginning of the interrupt cycle.
The pr ocessor the n loads t he priority level fo r this int er-
rupt into the STATUS register. This action will disable
all lower priority interrupts until the completion of the
Interr u pt Service R outine.
FIGURE 5-2: INTERRUPT STACK
FRAME
The RETFIE (Return from Interrupt) instruction will
unstack the program counter and STATUS registers to
return the processor to its state prior to the interrupt
sequence.
5.5 Alternate Vector Table
In program memory, the Interrupt Vector Table (IVT) is
follow ed by the Altern ate Interr upt Vector Table (AIVT),
as show n in Fig ure 5-1. Access to the Alternate Vector
Table is provided by the ALTIVT bit in the INTCON2
register. If the ALTIVT bit is se t, all int errupt a nd ex cep-
tion processes will use the alternate vectors instead of
the defa ult vectors. The alternate vectors are org anized
in the same manner as the default vectors. The AIVT
supports emulation and debugging efforts by providing
a means to switch between an application and a
support environment, without requiring the interrupt
vectors to be reprogra mmed. Thi s feature al so enable s
switching between applications for evaluation of
different software algorithms at run time.
If the AIVT is not required, the program memory allo-
cated to the AIVT may be used for other purposes.
AIVT is not a protected section and may be freely
programmed by the user.
5.6 Fast Context Saving
A context saving option is available using shadow reg-
isters. Shadow registers are provided for the DC, N,
OV, Z an d C bits in SR, and the re gisters W 0 through
W3. The shadows are only one level deep. The s hadow
registers are accessible using the PUSH.S and POP.S
inst ruc tion s onl y.
When the processor vectors to an interrupt, the
PUSH.S instruction can be used to store the current
value of the aforementioned registers into their
respective shadow registers.
If an ISR of a certain priority uses the PUSH.S and
POP.S instructions for fast context saving, then a
higher priority IS R shou ld no t inc lude the s ame ins truc-
tions. Users must save the key registers in software
during a lo wer priorit y interru pt if the hi gher pri ority ISR
uses fast context saving.
5.7 External Interrupt Requests
The interrupt controller supports five external interrupt
request signals, INT0-INT4. These inputs are edge
sensitive; they require a low-to-high or a high-to-low
transition to generate an interrupt request. The
INTCON2 register has five bits, INT0EP-INT4EP, that
select the polarity of the edge detection circuitry.
5.8 Wake-up from Sleep and Idle
The interrupt controller may be used to wake-up the
processor from either Sleep or Idle modes, if Sleep or
Idle mode is active when the interrupt is generated.
If an enabled interrupt request of sufficient priority is
received by the interrupt controller, then the standard
interrupt request is presented to the processor. At the
same time, the processor will wake-up from Sleep or
Idle and begin execution of the Interrupt Service
Routine (ISR) needed to process the interrupt request.
Note 1: The user can always lower the priority level
by writing a new value into SR. The Interrupt
Service Routine must clear the interrupt flag
bits in the IFSx reg ister before low ering the
processor interrupt priority in order to avoid
recursive interrup ts.
2: The IPL3 bit ( C O R CO N <3>) is always cl ear
when interrupts are being processed. It is
set only dur i ng executio n of traps.
<Free Word>
015
W15 (bef ore CALL
)
W15 (after CALL)
St ac k Gr o w s Towa r ds
Higher Address
PUSH : [W15++]
POP : [--W15]
0x0000
PC<15:0>
SRL IPL3 PC<22:16>
dsPIC30F5015/5016
DS70149B-page 46 © 2006 Microchip Technology Inc.
TABLE 5-2: INTERRUPT CONTROLLER REGISTER MAP FOR dsPIC30F5015
SFR
Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
INTCON1 0080 NSTDIS ——— OVATE OVBTE COVTE MATHERR ADDRERR STKERR OSCFAIL 0000 0000 0000 0000
INTCON2 0082 ALTIVT DISI INT4EP INT3EP INT2EP INT1EP INT0EP 0000 0000 0000 0000
IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0IF 0000 0000 0000 0000
IFS1 0086 IC4IF IC3IF C1IF SPI2IF INT2IF T5IF T4IF OC4IF OC3IF —INT1IF
0000 0000 0000 0000
IFS2 0088 FLTBIF FLTAIF QEIIF PWMIF INT4IF INT3IF 0000 0000 0000 0000
IEC0 008C CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000
IEC1 008E IC4IE IC3IE C1IE SPI2IE INT2IE T5IE T4IE OC4IE OC3IE —INT1IE
0000 0000 0000 0000
IEC2 0090 FLTBIE FLTAIE QEIIE PWMIE INT4IE INT3IE 0000 0000 0000 0000
IPC0 0094 T1IP<2:0> —OC1IP<2:0> IC1IP<2:0> INT0IP<2:0> 0100 0100 0100 0100
IPC1 0096 T31P<2:0> T2IP<2:0> OC2IP<2:0> IC2IP<2:0> 0100 0100 0100 0100
IPC2 0098 —ADIP<2:0> U1TXIP<2:0> U1RXIP<2:0> SPI1IP<2:0> 0100 0100 0100 0100
IPC3 009A CNIP<2:0> —MI2CIP<2:0> SI2CIP<2:0> NVMIP<2:0> 0100 0100 0100 0100
IPC4 009C —OC3IP<2:0> INT1IP<2:0> 0100 0000 0000 0100
IPC5 009E INT2IP<2:0> T5IP<2:0> T4IP<2:0> OC4IP<2:0> 0100 0100 0100 0100
IPC6 00A0 C1IP<2:0> SPI2IP<2:0> 0100 0100 0000 0000
IPC7 00A2 IC4IP<2:0> IC3IP<2:0> 0000 0000 0100 0100
IPC8 00A4 0000 0000 0000 0000
IPC9 00A6 —PWMIP<2:0> INT41IP<2:0> INT3IP<2:0> 0100 0000 0100 0100
IPC10 00A8 FLTAIP<2:0> QEIIP<2:0> 0100 0000 0000 0100
IPC11 00AA FLTBIP<2:0> 0000 0000 0000 0100
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
© 2006 Microchip Technology Inc. DS70149B-page 47
dsPIC30F5015/5016
TABLE 5-3: INTERRUPT CONTROLLER REGISTER MAP FOR dsPIC30F5016
SFR
Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
INTCON1 0080 NSTDIS ——— OVATE OVBTE COVTE MATHERR ADDRERR STKERR OSCFAIL 0000 0000 0000 0000
INTCON2 0082 ALTIVT INT4EP INT3EP INT2EP INT1EP INT0EP 0000 0000 0000 0000
IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0IF 0000 0000 0000 0000
IFS1 0086 IC4IF IC3IF C1IF SPI2IF INT2IF T5IF T4IF OC4IF OC3IF —INT1IF
0000 0000 0000 0000
IFS2 0088 FLTBIF FLTAIF QEIIF PWMIF INT4IF INT3IF 0000 0000 0000 0000
IEC0 008C CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000
IEC1 008E IC4IE IC3IE C1IE SPI2IE INT2IE T5IE T4IE OC4IE OC3IE —INT1IE
0000 0000 0000 0000
IEC2 0090 FLTBIE FLTAIE QEIIE PWMIE INT4IE INT3IE 0000 0000 0000 0000
IPC0 0094 T1IP<2:0> —OC1IP<2:0> IC1IP<2:0> INT0IP<2:0> 0100 0100 0100 0100
IPC1 0096 T31P<2:0> T2IP<2:0> OC2IP<2:0> IC2IP<2:0> 0100 0100 0100 0100
IPC2 0098 —ADIP<2:0> U1TXIP<2:0> U1RXIP<2:0> SPI1IP<2:0> 0100 0100 0100 0100
IPC3 009A CNIP<2:0> —MI2CIP<2:0> SI2CIP<2:0> NVMIP<2:0> 0100 0100 0100 0100
IPC4 009C —OC3IP<2:0> INT1IP<2:0> 0100 0000 0000 0100
IPC5 009E INT2IP<2:0> T5IP<2:0> T4IP<2:0> OC4IP<2:0> 0100 0100 0100 0100
IPC6 00A0 C1IP<2:0> SPI2IP<2:0> 0100 0100 0000 0000
IPC7 00A2 IC4IP<2:0> IC3IP<2:0> 0000 0000 0100 0100
IPC8 00A4 0000 0000 0000 0100
IPC9 00A6 —PWMIP<2:0> INT41IP<2:0> INT3IP<2:0> 0100 0000 0100 0100
IPC10 00A8 FLTAIP<2:0> QEIIP<2:0> 0100 0000 0000 0100
IPC11 00AA FLTBIP<2:0> 0000 0000 0000 0100
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
dsPIC30F5015/5016
DS70149B-page 48 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 49
dsPIC30F5015/5016
6.0 FLASH PROGRAM MEMORY
The dsPIC30F family of devices contains internal
program Flash memory for executing user code. There
are two methods by which the user can program this
memory:
1. In-Circuit Serial Programming™ (ICSP™)
programming capability
2. Run- Time Self-Programming (RTSP)
6.1 In-Circuit Serial Programming
(ICSP)
dsPIC30F devices can be serially programmed while i n
the end ap plica tion ci rcuit. Th is is s imply do ne wit h two
lines for Programming Clock and Programming Data
(which are named PGC and PGD respectively), and
three other lines for Power (VDD), Ground (VSS) and
Master Cl ear (MCLR ). This allows customers to manu-
facture boards with unprogrammed devices, and then
program the microcontroller just before shipping the
product. This also allows the most recent firmware or a
custom firmware to be programmed.
6.2 Run-Time Self-Programming
(RTSP)
RTSP is accomplished using TBLRD (table read) and
TBLWT (table wr ite) ins tru cti ons .
With RTSP, the user may erase program memory,
32 instructions (96 bytes) at a time and can write
program memory data, 32 instructions (96 bytes) at a
time.
6.3 Table Instruction Operation Summary
The TBLRDL and the TBLWTL instructions are used to
read or write to bits<15:0> of program memory.
TBLRDL and TBLWTL can access program memory in
Word or Byte mode.
The TBLRDH and TBLWTH i nstructio ns are used to read
or write to bits<23:16> of program memory. TBLRDH
and TBLWTH can access program memory in Word or
Byte mode.
A 24-bit program memory address is formed using
bits<7:0> of the TBLPAG register and the Effective
Address (EA) from a W register specified in the table
instruction, as shown in Figure 6-1.
FIGURE 6-1: ADDRESSING FOR TABLE AND NVM REGISTERS
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and pro-
grammi ng, refe r to the “dsPIC30F/33F
Programmer’s Reference Manual(DS70157).
0Program Counter
24 bi ts
NVMADRU Reg
8 bit s 16 bit s
Program
Using
TBLPA G Reg
8 bits
Wor k i ng Re g EA
16 bits
Using
Byte
24-bit EA
1/0
0
1/0
Select
Table
Instruction
NVMADR
Addressing
Counter
Using
NVMADR Reg EA
User/Configuration
Space Select
dsPIC30F5015/5016
DS70149B-page 50 © 2006 Microchip Technology Inc.
6.4 RTSP Operation
The dsPIC30F Flash program memory is organized
into rows and panels. Each row consists of 32 instruc-
tions, or 96 bytes. Each panel consists of 128 rows, or
4K x 24 instructions. RTSP allows the user to erase
one row (32 instructions) at a time and to program
32 instru ctions at one time.
Each panel of program memory contains write latches
that hold 32 instructions of programming data. Prior to
the actual programming operation, the write data must
be loaded into the panel write latches. The data to be
programmed into the panel is loaded in sequential
order into the write latches; instruction 0, instruction 1,
etc. The addresses loaded must always be from an
even group of 32 boundary.
The basi c sequence for R TSP programming is to set up
a Table Pointer, then do a series of TBLWT instructions
to load th e wri te latc hes. Program ming is perfo rmed by
setting the special bits in the NVMCON register.
32 TBLWTL and 32 TBLWTH instruc tions ar e required to
load the 32 instructions.
All of the table write operations are single-word writes
(2 instruction cycles), because only the table latches
are written.
After the latches are written, a programming operation
needs to be initiated to program the data.
The Flash program memory is readable, writable and
erasable during normal operation over the entire VDD
range.
6.5 RTSP Control Registers
The four SFRs used to read and write the program
Flash memory are:
•NVMCON
NVMADR
NVMADRU
NVMKEY
6.5.1 NVMCON REGISTER
The NVMCON register controls which blocks are to be
erased, which memory type is to be programmed and
start of the programming cycle.
6.5.2 NVMADR REGISTER
The NVMADR register is used to hold the lower two
bytes of the Effective Address. The NVMADR register
captures the EA<15 :0> of the last table instru ct ion that
has been executed and selects the row to write.
6.5.3 NVMADRU REGISTER
The NVMADRU register is used to hold the upper byte
of the Effective Address. The NVMADRU register cap-
tures the EA<23:16> of the last table instruction that
has been exec uted.
6.5. 4 NVMKEY REGISTER
NVMKEY is a write-only register that is used for write
protection. To start a programming or an erase
sequence, the user must consecutively write 0x55 and
0xAA to the NVMKEY register. Refer to Section 6.6
“Programming Operations” for further details.
Note: The user can also directly write to the
NVMADR and NVMADRU registers to
specify a program memory address for
erasing or programming.
© 2006 Microchip Technology Inc. DS70149B-page 51
dsPIC30F5015/5016
6.6 Programming Operations
A complete programming sequence is necessary for
programming or erasing the internal Flash in RTSP
mode. A progra mming operati on is nominally 2 ms ec in
duration and the processor stalls (waits) until the oper-
ation is finished. Setting the WR bit (NVMCON<15>)
starts the operation, and the WR bit is automatically
cleared when the operation is finished.
6.6.1 PROGRAMMING ALGORITHM FOR
PROGRAM FLASH
The user can erase or program one row of program
Flash memory at a time. The general process is:
1. Read one row of program Flash (32 instruction
words) and store into data RAM as a data
“image”.
2. Update the data image with the desired new
data.
3. Erase program Flash row.
a) Set up NVMCON register for multi-word,
program Flash, erase, and set WREN bit.
b) Write address of row to be erased into
NVMADRU/NVMDR.
c) Write ‘55’ to NVMKEY.
d) Wri te ‘AA to NVMKEY.
e) Set the WR bit. This will begin erase cycle.
f) CPU will stall for the duration of the erase
cycle.
g) The WR bit is cleared when erase cycle
ends.
4. Write 32 instruction words of data from data
RAM “image” into the program Flash write
latches.
5. Program 32 instruction words into program
Flash.
a) Set up NVMCON register for multi-word,
program Flash, program, and set WREN
bit.
b) Write ‘55’ to NVMKEY.
c) Write ‘AA’ to NVMKEY.
d) Set the WR bit. This will begin program
cycle.
e) CPU will stall for duration of the program
cycle.
f) The WR bit is cleared by the hardware
when program cycle ends.
6. Repeat step s 1 through 5 as needed to program
desired amount of program Flash memory.
6.6.2 ERASING A ROW OF PROGRAM
MEMORY
Example 6-1 shows a co de sequence tha t can be used
to erase a row (32 instructions) of program memory.
EXAMPL E 6-1: ERASI NG A RO W OF PROGRAM MEMORY
; Setup NVMCON for erase operation, multi word write
; program memory selected, and writes enabled
MOV #0x4041,W0 ;
MOV W0,NVMCON ; Init NVMCON SFR
; Init pointer to row to be ERASED
MOV #tblpage(PROG_ADDR),W0 ;
MOV W0,NVMADRU ; Initialize PM Page Boundary SFR
MOV #tbloffset(PROG_ADDR),W0 ; Intialize in-page EA[15:0] pointer
MOV W0, NVMADR ; Intialize NVMADR SFR
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55,W0
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1 ;
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Start the erase sequence
NOP ; Insert two NOPs after the erase
NOP ; command is asserted
dsPIC30F5015/5016
DS70149B-page 52 © 2006 Microchip Technology Inc.
6.6.3 LOADING WRITE LATCHES
Example 6-2 shows a sequence of instructions that
can be used to load the 96 bytes of write latches.
32 TBLWTL and 32 TBLWTH instructions are needed to
load the w rite lat ches selected by the Tabl e Pointer.
EXAMPLE 6-2: LOADING WRITE LATCHES
6.6.4 INITIATING THE PROGRAMMING
SEQUENCE
For protec tion, the w rite i nitiate sequenc e for N VMKEY
must be used to allow any erase or program operation
to procee d. After the prog ramming comm and has bee n
executed, the user must wait for the programming time
until programming is complete. The two instructions
following the start of the programming sequence
should be NOPs.
EXAMPLE 6-3: INITIATING A PROGRAMMING SEQUENCE
; Set up a pointer to the first program memory location to be written
; program memory selected, and writes enabled
MOV #0x0000,W0 ;
MOV W0,TBLPAG ; Initialize PM Page Boundary SFR
MOV #0x6000,W0 ; An example program memory address
; Perform the TBLWT instructions to write the latches
; 0th_program_word
MOV #LOW_WORD_0,W2 ;
MOV #HIGH_BYTE_0,W3 ;
TBLWTL W2,[W0] ; Write PM low word into program latch
TBLWTH W3,[W0++] ; Write PM high byte into program latch
; 1st_program_word
MOV #LOW_WORD_1,W2 ;
MOV #HIGH_BYTE_1,W3 ;
TBLWTL W2,[W0] ; Write PM low word into program latch
TBLWTH W3,[W0++] ; Write PM high byte into program latch
; 2nd_program_word
MOV #LOW_WORD_2,W2 ;
MOV #HIGH_BYTE_2,W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0++] ; Write PM high byte into program latch
; 31st_program_word
MOV #LOW_WORD_31,W2 ;
MOV #HIGH_BYTE_31,W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0++] ; Write PM high byte into program latch
Note: In Example 6-2, the contents of the upper byte of W3 has no effect.
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55,W0
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1 ;
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Start the erase sequence
NOP ; Insert two NOPs after the erase
NOP ; command is asserted
© 2006 Microchip Technology Inc. DS70149B-page 53
dsPIC30F5015/5016
TABLE 6-1: NVM REGISTER MAP
File Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets
NVMCON 0760 WR WREN WRERR TWRI —PROGOP<6:0> 0000 0000 0000 0000
NVMADR 0762 NVMADR<15:0> uuuu uuuu uuuu uuuu
NVMADRU 0764 NVMADR<23:16> 0000 0000 uuuu uuuu
NVMKEY 0766 KEY<7:0> 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F5015/5016
DS70149B-page 54 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 55
dsPIC30F5015/5016
7.0 DATA EEPROM MEMORY
The data EEPROM memory is readable and writable
during no rmal operatio n over the enti re VDD range. The
data EEPROM memory is directly mapped in the
program memory address space.
The four SFRs used to read and write the program
Flash memory are used to access data EEPROM
memory, as well. As described in Section 4.0
“Address Generator Units”, these registers are:
•NVMCON
NVMADR
NVMADRU
NVMKEY
The EEPROM data memory allows read and write of
single words and 16-word blocks. When interfacing to
data memory, NVMADR, in conjunction with the
NVMADRU register, is used to address the EEPROM
locatio n bei ng ac cess ed. TBLRDL and TBLWTL instruc-
tions are used to read and write data EEPROM. The
dsPIC30F6 010 devic e has 8 Kby tes (4K words) o f data
EEPROM, with an address range from 0x7FF000 to
0x7FFFFE.
A word wri te operatio n should be prec eded by an e rase
of the corresponding memory location(s). The write
typically requires 2 ms to complete, but the write time
will vary with voltage and temperature.
A program or erase operation on the data EEPROM
does n ot sto p the ins truc tion fl ow. The us er is r espon -
sible for waiting for the appropriate duration of time
before initiating another data EEPROM write/erase
operation. Attempting to read the data EEPROM while
a programming or erase operation is in progress results
in unspecified data.
Control bit WR ini tia tes write operations , s imilar to pro-
gram Flash writ es . Th is bi t c an not be cleared, only se t,
in software. This bit is cleared in hardware at the com-
pletion of the write operation. The inability to clear the
WR bit in software prevents the accidental or
premature termination of a write operation.
The WREN bit, when set, will allow a write operation.
On powe r-up, the WR EN bit is clear. The WRERR bi t is
set when a write operation is interrupted by a MCLR
Reset, or a WDT Time-out Reset, during normal oper-
ation . In these si tuatio ns, foll owing Re set, the us er can
check the WRERR bit and rewrite the location. The
address register NVMADR remains unchanged.
7.1 Reading the Data EEPROM
A TBLRD instruction reads a word at the current pro-
gram word address. This example uses W0 as a
pointer to data EEPROM. The result is placed in
register W4, as shown in Example 7-1.
EXAMPLE 7-1: DATA EEPROM READ
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and pro-
grammi ng, refe r to the “dsPIC30F/33F
Programmer’s Reference Manual(DS70157).
Note: Interrupt flag bit NVMIF in the IFS0 regis-
ter is set when write is complete. It must be
cleared in software.
MOV #LOW_ADDR_WORD,W0 ; Init Pointer
MOV #HIGH_ADDR_WORD,W1
MOV W1
,
TBLPAG
TBLRDL [ W0 ], W4 ; read data EEPROM
dsPIC30F5015/5016
DS70149B-page 56 © 2006 Microchip Technology Inc.
7.2 Erasing Data EEPROM
7.2.1 ERASI NG A BLOCK OF DATA
EEPROM
In order to erase a block of data EEPROM, the
NVMADRU and NVMADR registers must initially
point to th e block of memor y to be erased. Co nfigure
NVMCON for erasing a block of data EEPROM, and
set the ERASE and WREN bits in the NVMCON
register. Setting the WR bit initiates the erase, as
shown in Ex ample 7-2.
EXAMPLE 7-2: DATA EEPROM BLOCK ERASE
7.2.2 ERASING A WORD OF DATA
EEPROM
The NVMADRU and NV MADR r egisters must point t o
the block. Erase a block of data Flash and set the
ERASE and WREN bits in the NVMCON register.
Setting the WR bit initiates the erase, as shown in
Example 7-3.
EXAMPLE 7-3: DATA EEPROM W ORD ERASE
; Select data EEPROM block, ERASE, WREN bits
MOV #4045,W0
MOV W0,NVMCON ; Initialize NVMCON SFR
; Start erase cycle by setting WR after writing key sequence
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55,W0 ;
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1 ;
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Initiate erase sequence
NOP
NOP
; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete
; Select data EEPROM word, ERASE, WREN bits
MOV #4044,W0
MOV W0,NVMCON
; Start erase cycle by setting WR after writing key sequence
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55,W0 ;
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1 ;
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Initiate erase sequence
NOP
NOP
; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete
© 2006 Microchip Technology Inc. DS70149B-page 57
dsPIC30F5015/5016
7.3 Writing to the Data EEPROM
To write an EEPROM data location, the following
sequen ce must be followed :
1. Erase data EEPROM word.
a) Select word, data EEPROM, erase and set
WREN bit in NVMCO N regis ter.
b) Write address of word to be erased into
NVMADRU/NVMADR.
c) Enable NVM interrupt (optional).
d) Wri te ‘55’ to NVMKEY.
e) Wri te ‘AA to NVMKEY.
f) Set the WR bit. This will begin erase cycle.
g) Either poll NVMIF bit or wait for NVMIF
interrupt.
h) The WR bit is cleare d when th e erase cycl e
ends.
2. Write data word into data EEPROM write
latches.
3. Program 1 data word into data EEPROM.
a) Select word, data EEPROM, program and
set WREN bit in NVMCON register.
b) Enable NVM wri te don e inte rrupt (o ptiona l).
c) Write ‘55’ to NVMKEY.
d) Wri te ‘AA to NVMKEY.
e) Set the WR bit. This will begin program
cycle.
f) Either poll NVMIF bit or wait for NVM
interrupt.
g) The WR bit is cleared when the write cycle
ends.
The write will not initiate if the above sequence is not
exactly followed (write 0x55 to NVMKEY, write 0xAA to
NVMCON, then set WR bit) for each word. It is strongly
recommended that interrupts be disabled during this
code segment.
Additionally, the WREN bit in NVMCON must be set to
enable writes. This mechanism prevents accidental
writes to data EEPROM, due to unexpected code exe-
cution. The WR EN b it sho ul d be k ept clear at a ll tim es ,
except when updating the EEPROM. The WREN bit is
not cleared by hardware.
After a write sequence has been initiated, clearing the
WREN bit wil l not affect the current write cycle. The WR
bit will be inhibited from being set unless the WREN bit
is set. The WREN bit must be set o n a previous instruc -
tion. Both WR a nd WREN c an not be se t with th e s am e
instruction.
At the completion of the write cycle, the WR bit is
cleared in ha rdware and the No nv ola til e M emory Write
Complete Interrupt Flag bit (NVMIF) is set. The user
may either enable this interrupt, or poll this bit. NVMIF
must be cleared by software.
7.3.1 WRITING A WORD OF DATA
EEPROM
Once the user has erased the word to be programme d,
then a table write instruction is used to write one write
latch, as shown in Example 7-4.
EXAMPLE 7-4: DATA EEPROM W ORD WR ITE
; Point to data memory
MOV #LOW_ADDR_WORD,W0 ; Init pointer
MOV #HIGH_ADDR_WORD,W1
MOV W1,TBLPAG
MOV #LOW(WORD),W2 ; Get data
TBLWTL W2,[ W0] ; Write data
; The NVMADR captures last table access address
; Select data EEPROM for 1 word op
MOV #0x4004,W0
MOV W0,NVMCON
; Operate key to allow write operation
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55,W0
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Initiate program sequence
NOP
NOP
; Write cycle will complete in 2mS. CPU is not stalled for the Data Write Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine write complete
dsPIC30F5015/5016
DS70149B-page 58 © 2006 Microchip Technology Inc.
7.3.2 WRITING A BLOCK OF DATA
EEPROM
To write a block of data EEPROM, write to all sixteen
latches first, then set the NVMCON register and
progra m the block .
EXAMPLE 7-5: DATA EEPROM BLOC K WRITE
7.4 Write Verify
Depending on the application, good programming
practice may dictate that the value written to the mem-
ory should be verified against the original value. This
should be used in applications where excessive writes
can stress bits near the specification limit.
7.5 Protection Against Spuri ous Write
There are conditions when the device may not want to
write to the data EEPROM memory. To protect against
spurious EEPROM writes, various mechanisms have
been built-in. On power-up, the WREN bit is cleared;
also, the Power-up Ti mer prevents EEPROM write.
The writ e in iti ate sequence an d the WR EN bi t tog eth er
help prevent an accidental write during brown-out,
power glitch or software malfunction.
MOV #LOW_ADDR_WORD,W0 ; Init pointer
MOV #HIGH_ADDR_WORD,W1
MOV W1,TBLPAG
MOV #data1,W2 ; Get 1st data
TBLWTL W2,[ W0]++ ; write data
MOV #data2,W2 ; Get 2nd data
TBLWTL W2,[ W0]++ ; write data
MOV #data3,W2 ; Get 3rd data
TBLWTL W2,[ W0]++ ; write data
MOV #data4,W2 ; Get 4th data
TBLWTL W2,[ W0]++ ; write data
MOV #data5,W2 ; Get 5th data
TBLWTL W2,[ W0]++ ; write data
MOV #data6,W2 ; Get 6th data
TBLWTL W2,[ W0]++ ; write data
MOV #data7,W2 ; Get 7th data
TBLWTL W2,[ W0]++ ; write data
MOV #data8,W2 ; Get 8th data
TBLWTL W2,[ W0]++ ; write data
MOV #data9,W2 ; Get 9th data
TBLWTL W2,[ W0]++ ; write data
MOV #data10,W2 ; Get 10th data
TBLWTL W2,[ W0]++ ; write data
MOV #data11,W2 ; Get 11th data
TBLWTL W2,[ W0]++ ; write data
MOV #data12,W2 ; Get 12th data
TBLWTL W2,[ W0]++ ; write data
MOV #data13,W2 ; Get 13th data
TBLWTL W2,[ W0]++ ; write data
MOV #data14,W2 ; Get 14th data
TBLWTL W2,[ W0]++ ; write data
MOV #data15,W2 ; Get 15th data
TBLWTL W2,[ W0]++ ; write data
MOV #data16,W2 ; Get 16th data
TBLWTL W2,[ W0]++ ; write data. The NVMADR captures last table access address.
MOV #0x400A,W0 ; Select data EEPROM for multi word op
MOV W0,NVMCON ; Operate Key to allow program operation
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55,W0
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Start write cycle
NOP
NOP
© 2006 Microchip Technology Inc. DS70149B-page 59
dsPIC30F5015/5016
8.0 I/O PORTS
All of the device pins (except VDD, VSS, MCLR and
OSC1/CLKI) are shared between the peripherals and
the parallel I/O ports.
All I/O input ports feature Schmitt Trigger inputs for
improved noise immunity.
8.1 Pa rallel I/O (P I O ) P o rts
When a peripheral is enabled and the peripheral is
actively driving an associated pin, the use of the pin as
a general purpose output pin is disabled. The I/O pin
may be read, but the output driver for the parallel port
bit will be disabled. If a peripheral is enabled, but the
peripheral is not actively driving a pin, that pin may be
driven by a port.
All port pins have three registers directly associated
with the operation of the port pin. The data direction
register (TRISx ) determ ines whe ther the pin is an inp ut
or an output. If the data direction bit is a ‘1’, t hen the pin
is an input. All port pins are defined as inputs after a
Reset. Reads from the latch (LATx), read the latch.
Writes to the latch, write the latch (LATx). Reads from
the port (PORTx), read the port pins and writes to the
port pins, write the latch (LATx).
Any bit and its associated data and control registers
that are not valid for a particular device will be
disabled. That means the corresponding LATx and
TRISx registers and the port pin will read as zeros.
When a pin is shared with another peripheral or func-
tion that is defined as an input only, it is nevertheless
regarded as a dedicated port because there is no
other competing source of outputs. An example is the
INT4 pin.
The format of the registers for PORTA are shown in
Table 8-2.
The TRISA (Data Direction Control) register controls
the direction of the RA<7:0> pins, as well as the INTx
pins and the VREF pins. The LATA register supplies
data to the outputs and is readable/writable. Reading
the PORTA register yields the state of the input pins,
while writing the PORTA register modifies the contents
of the LATA register.
A parallel I/O (PIO) port that shares a pin with a periph-
eral is, in general, subservient to the peripheral. The
peripheral’s output buffer data and control signals are
provided to a pair of multiplexers. The multiplexers
select whether the peripheral or the associated port
has own ership of the outp ut dat a and co ntrol si gnals of
the I/O pad cell. Figure 8-2 shows how ports are shared
with o ther periphe rals, and th e associa ted I/O cell (pad)
to which they are connected. Table 8-1 and Table 8-2
show the formats of the registers for the shared ports,
PORTB through PORTG.
FIGURE 8-1: BLOCK DIAGRAM OF A DEDICATED PORT STRUCTURE
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
QD
CK
WR LAT+
TRIS Latch
I/O Pad
WR Port
Data Bus
QD
CK
Data Latch
Read LAT
Read Port
Read TRIS
WR TRIS
I/O Cell
Dedicated Port Module
dsPIC30F5015/5016
DS70149B-page 60 © 2006 Microchip Technology Inc.
FIGURE 8-2: BLOCK DIAGRAM OF A SHARED PORT STRUCTURE
8.2 Configuring Analog Port Pins
The use of the ADPC FG and TRIS registers control the
operation of the A/D port pins. The port pins that are
desired as analog inputs must have their correspond-
ing TRIS bit set (input). If the TRIS bit is cleared
(output), the digital output level (VOH or VOL) will be
converted.
When read ing the POR T register, all pins c onfigured a s
analog input channels will read as cleared (a low level).
Pins configured as digital inp uts will not convert an ana-
log input. Analog levels on any pin that is defined as a
digital input (including the ANx pins) may cause the
input buffer to consume current that exceeds the
device specifications.
8.2.1 I/O PORT WRITE/READ TIMING
One instruction cycle is required between a port
direction change or port write operation and a read
operation of the same port. Typically this instruction
would be a NOP.
EXAMPLE 8-1: PORT WRITE/READ
EXAMPLE
QD
CK
WR LAT +
TRIS Latch
I/O Pad
WR Port
Data Bus
QD
CK
Data Latch
Read LA T
Read Port
Read TRIS
1
0
1
0
WR TRIS
Peripheral Output Data
Peripheral Input Data
I/O Cell
Peripheral Module
Peripheral Output Enable
PIO Module
Out put Mult iplexers
Input Data
Peripheral Module Enable
Output Enable
Output Data
MOV 0xFF00, W0 ; Configure PORTB<15:8>
; as inputs
MOV W0, TRISBB ; and PORTB<7:0> as outputs
NOP ; Delay 1 cycle
BTSS PORTB, #13 ; Next Instruction
© 2006 Microchip Technology Inc. DS70149B-page 61
dsPIC30F5015/5016
TABLE 8-1: dsPIC30F5015 PORT REGISTER MAP
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
TRISA 02C0 0000 0000 0000 0000
PORTA 02C2 0000 0000 0000 0000
LATA 02C4 0000 0000 0000 0000
TRISB 02C6 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111
PORTB 02C8 RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 0000 0000 0000 0000
LATB 02CB LATB15 LATB14 LATB13 LATB12 LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000 0000 0000 0000
TRISC 02CC TRISC15 TRISC14 TRISC13 1110 0000 0000 0000
PORTC 02CE RC15 RC14 RC13 0000 0000 0000 0000
LATC 02D0 LATC15 LATC14 LATC13 0000 0000 0000 0000
TRISD 02D2 ——— TRISD11 TRISD10 TRISD9 TRISD8 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 0000 1111 1111 1111
PORTD 02D4 ——— RD11 RD10 RD9 RD8 RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 0000 0000 0000 0000
LATD 02D6 LATD11 LATD10 LATD9 LATD8 LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 0000 0000 0000 0000
TRISE 02D8 TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 0000 0000 1111 1111
PORTE 02DA RE7 RE6 RE5 RE4 RE3 RE2 RE1 RE0 0000 0000 0000 0000
LATE 02DC LATE7 LATE6 LATE5 LATE4 LATE3 LATE2 LATE1 LATE0 0000 0000 0000 0000
TRISF 02EE TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 0000 0000 0111 1111
PORTF 02E0 RF6 RF5 RF4 RF3 RF2 RF1 RF0 0000 0000 0000 0000
LATF 02E2 LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 0000 0000 0000 0000
TRISG 02E4 TRISG9 TRISG8 TRISG7 TRISG6 TRISG3 TRISG2 0000 0011 1100 1100
PORTG 02E6 RG9 RG8 RG7 RG6 —RG3RG2 0000 0000 0000 0000
LATG 02E8 LATG9 LATG8 LATG7 LATG6 —LATG3LATG2 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
dsPIC30F5015/5016
DS70149B-page 62 © 2006 Microchip Technology Inc.
TABLE 8-2: dsPIC30F5016 PORT REGISTER MAP
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
TRISA 02C0 TRISA15 TRISA14 TRISA10 TRISA9 ———————1100 0110 0000 0000
PORTA 02C2 RA15 RA14 RA10 RA9 ———————0000 0000 0000 0000
LATA 02C4 LATA15 LATA14 LATA10 LATA9 —————————0000 0000 0000 0000
TRISB 02C6 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111
PORTB 02C8 RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 0000 0000 0000 0000
LATB 02CB LATB15 LATB14 LATB13 LATB12 LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000 0000 0000 0000
TRISC 02CC TRISC15 TRISC14 TRISC13 TRISC3 TRISC1 1110 0000 0000 1010
PORTC 02CE RC15 RC14 RC13 RC3 RC1 0000 0000 0000 0000
LATC 02D0 LATC15 LATC14 LATC13 LATC3 LATC1 0000 0000 0000 0000
TRISD 02D2 TRISD15 TRISD14 TRISD13 TRISD12 TRISD11 TRISD10 TRISD9 TRISD8 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 1111 1111 1111 1111
PORTD 02D4 RD15 RD14 RD13 RD12 RD11 RD10 RD9 RD8 RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 0000 0000 0000 0000
LATD 02D6 LATD15 LATD14 LATD13 LATD12 LATD11 LATD10 LATD9 LATD8 LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 0000 0000 0000 0000
TRISE 02D8 TRISE9 TRISE8 TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 0000 0011 1111 1111
PORTE 02DA RE9 RE8 RE7 RE6 RE5 RE4 RE3 RE2 RE1 RE0 0000 0000 0000 0000
LATE 02DC LATE9 LATE8 LATE7 LATE6 LATE5 LATE4 LATE3 LATE2 LATE1 LATE0 0000 0000 0000 0000
TRISF 02EE TRISF8 TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 0000 0001 1111 1111
PORTF 02E0 RF8 RF7 RF6 RF5 RF4 RF3 RF2 RF1 RF0 0000 0000 0000 0000
LATF 02E2 LATF8 LATF7 LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 0000 0000 0000 0000
TRISG 02E4 TRISG9 TRISG8 TRISG7 TRISG6 TRISG3 TRISG2 TRISG1 TRISG0 0000 0011 1100 1111
PORTG 02E6 RG9 RG8 RG7 RG6 RG3 RG2 RG1 RG0 0000 0000 0000 0000
LATG 02E8 LATG9 LATG8 LATG7 LATG6 LATG3 LATG2 LATG1 LATG0 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
© 2006 Microchip Technology Inc. DS70149B-page 63
dsPIC30F5015/5016
8.3 Input Change Notification Module
The input change notification module provides the
dsPIC30F devices the ability to generate interrupt
requests to the processor in response to a change-of-
state on selected input pins. This module is capable of
detecting input change-of-states, even in Sleep mode
when the clocks are disabled. There are 22 external
signals (CN0 through CN21) that may be selected
(enabled) for generating an interrupt request on a
change-of-state.
Please refer to the pin diagrams for CN pin locations.
TABLE 8-3: INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 15-8) FOR dsPIC30F5015
TABLE 8-4: INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 7-0) FOR dsPIC30F5015
TABLE 8-5: INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 15-8) FOR dsPIC30F5016
TABLE 8-6: INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 7-0) FOR dsPIC30F5016
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Reset State
CNEN1 00C0 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE 0000 0000 0000 0000
CNEN2 00C2 0000 0000 0000 0000
CNPU1 00C4 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE 0000 0000 0000 0000
CNPU2 00C6 0000 0000 0000 0000
Legend: u = uninitialized bit
SFR
Name Addr. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
CNEN1 00C0 CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 0000 0000 0000
CNEN2 00C2 ———— CN18IE CN17IE CN16IE 0000 0000 0000 0000
CNPU1 00C4 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 0000 0000 0000
CNPU2 00C6 ———— CN18PUE CN17PUE CN16PUE 0000 0000 0000 0000
Legend: u = uninitialized bit
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Reset State
CNEN1 00C0 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE 0000 0000 0000 0000
CNEN2 00C2 0000 0000 0000 0000
CNPU1 00C4 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE 0000 0000 0000 0000
CNPU2 00C6 0000 0000 0000 0000
Legend: u = uninitialized bit
SFR
Name Addr. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
CNEN1 00C0 CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 0000 0000 0000
CNEN2 00C2 CN21IE CN20IE CN19IE CN18IE CN17IE CN16IE 0000 0000 0000 0000
CNPU1 00C4 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 0000 0000 0000
CNPU2 00C6 CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE 0000 0000 0000 0000
Legend: u = uninitialized bit
dsPIC30F5015/5016
DS70149B-page 64 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 65
dsPIC30F5015/5016
9.0 TIMER1 MODULE
This section describes the 16-bit General Purpose
(GP) Timer1 module and associated operational
modes.
The following sections provide a detailed description,
includ ing s etup an d con trol reg isters al ong w ith a ssoci-
ated block diagrams for the operational modes of the
timers.
The T imer1 mo dule is a 16-bit timer which can serv e as
the time count er fo r the rea l-time cl ock, o r ope rate as a
free-running interval timer/counter . The 16-bit timer has
the following modes:
16-bit Ti mer
16-bit Synchronous Counter
16-bit Asynchronous Counter
Further, the following operational characteristics are
supported:
Timer gate operation
Selectable prescaler set tings
Timer operation during CPU Idle and Sleep
modes
Interrupt on 16-bit Period register match or falling
edge of external gate signal
These operating modes are determined by setting the
appropriate bit(s) in the 16-bit SFR, T1CON. Figure 9-1
presents a block diagram of the 16-bit timer module.
16-bit T imer Mode: In t he 16-bi t T imer m ode, the timer
increments on every instruction cycle up to a match
value, preloaded into the Period register, PR1, then
resets to ‘0’ and continues to count.
When the CPU goes into the Idle mode, the timer will
stop incrementing, unless the TSIDL (T1CON<13>)
bit = 0. If TSIDL = 1, the tim er module log ic will resum e
the incrementing sequence upon termination of the
CPU Idle mode.
16-bit Synchronous Counter Mode: In the 16-bit
Synchronous Counter mode, the timer increments on
the rising edge of the applied external clock signal,
which is synchronized with the internal phase clocks.
The timer counts up to a match value preloaded in
PR1, then resets to ‘0’ and continues.
When the CPU goes into the Idle mode, the timer will
stop incrementing, unless the respective TSIDL bit = 0.
If TSIDL = 1, the timer module logic will resume the
incrementing sequence upon termination of the CPU
Idle mode.
16-bit Asynchronous Counter Mode: In the 16-bit
Asynchronous Counter mode, the timer increments on
every rising edge of the applied external clock signal.
The timer counts up to a match value preloaded in
PR1, then resets to ‘0’ and continues.
When the timer is configured for the Asynchronous mode
of operation and the CPU goes into the Idle mode, the
timer w ill s to p increm en ti ng if TSIDL = 1.
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
Note: Timer1 is a Type A timer. Please refer to
the specifications for a Type A timer in
Section 24.0 Electrical Characteristics
of this document.
dsPIC30F5015/5016
DS70149B-page 66 © 2006 Microchip Technology Inc.
FIGURE 9-1: 16-BI T TIMER1 MODULE BLOCK DIAGRAM (TYPE A TIMER)
9.1 Timer Gate Operation
The 16-bit timer can be placed in the Gated Time
Accumu lation mode. Th is mode allow s the int ernal TCY
to increment the respective timer when the gate input
signal (T1CK pin) is asserted high. Control bit TGATE
(T1CON<6>) must be set to enable this mode. The
timer must be enabled (TON = 1) and the timer clock
source se t to interna l (TCS = 0).
When the CPU goes into the Idle mode, the timer will
stop incrementing unless TSIDL = 0. If TSIDL = 1, the
timer will resume the incrementing sequence upon
termination of the CPU Idle mode.
9.2 Timer Prescaler
The input clock (FOSC/4 or external clock) to the 16-bit
timer has a presca le optio n of 1:1, 1:8 , 1:6 4 and 1:25 6,
selected by control bits, TCKPS<1:0> (T1CON<5:4>).
The prescaler counter is cleared when any of the
following occurs:
a write to the TMR1 register
cl earing of the TON bit (T1C ON<1 5>)
device Reset such as POR and BOR
However, if the timer is disabled (TON = 0), then the
timer prescaler cannot be reset since the prescaler
clock is halted.
TMR1 is not cleared when T1CON is written. It is
cleared by writin g to the TMR1 register.
9.3 Timer Operation During Sleep
Mode
During CPU Sleep mode, the timer will operate if:
The timer module is enabled (TON = 1) and
The timer clock s ource is selected as extern al
(TCS = 1) and
The TSYNC bit (T1CON<2>) is asser ted to a logic
0’, which defines the external clock source as
asynchronous
When all three conditions are true, the timer will con-
tinue to count up to the Period register and be reset to
0x0000.
When a ma tch betwe en the tim er and th e Period re gis-
ter occurs, an interrupt can be generated, if the
respective timer interrupt enable bit is asserted.
TON
Sync
SOSCI
SOSCO/
PR1
T1IF
Equal Comparator x 16
TMR1
Reset
LPOSCEN
Event Flag
1
0
TSYNC
Q
QD
CK
TGATE
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TGATE
T
CY
1
0
T1CK
TCS
1
x
0
1
TGATE
0
0
Gate
Sync
© 2006 Microchip Technology Inc. DS70149B-page 67
dsPIC30F5015/5016
9.4 Timer Interrupt
The 16-bit tim er ha s the ab ili ty to ge nerate an interrupt
on period match. When the timer count matches the
Period regi ster , the T1IF bit is asserted and an interru pt
will be generated, if enabled. The T1IF bit must be
cleared in software. The Timer Interrupt Flag, T1IF, is
located in the IFS0 Control register in the interrupt
controller.
When the Gated Time Accumulation mode is enabled,
an interr upt will al so be generat ed on the f alling edge of
the gate signal (at the end of the accumulation cycle).
Enabling an interrupt is accomplis hed via the respective
Timer Interrupt Enable bit, T1IE. The Timer Interrupt
Enable bit is located in the IEC0 Control register in the
interrupt controller.
9.5 Real-Time Clock
Timer1, when operating in Real-Time Clock (RTC)
mode, provides time-of-day and event time-stamping
capabilities. Key operational features of the RTC are:
Operation from 32 kHz LP oscillator
8-bit prescaler
Low power
Real-Time Clock Interrupts
These operating modes are determined by setting the
appropriate bit(s) in the T1CON Control register.
FIGURE 9-2: RECOMMENDED
COMPONENTS FOR
TI MER1 LP OSCILLATOR
RTC
9.5.1 RTC OSCILLAT OR OPERATION
When the TON = 1, T CS = 1 an d TGATE = 0, the timer
increme nt s on the risin g e dge of the 32 kHz LP oscill a-
tor output sig nal, up to the val ue specified in the Period
register, and is then reset to ‘0’.
The TSYNC bit must be asserted to a logic ‘0
(Asynchronous mode) for correct operation.
Enabling LPOSCEN (OSCCON<1>) will disable the
normal Timer and Counter modes and enable a timer
carry-out wake-up event.
When the CPU enters Sleep mode, the RTC will con-
tinue to operate, provided the 32 kHz external crystal
oscillator is active and the control bits have not been
changed. The TSIDL bit should be cleared to ‘0’ in
order for R TC to contin ue ope rati on in Idle mode .
9.5.2 RTC INTERRUPTS
When an interrupt event occurs, the respective
interrupt flag, T1IF, is asserted and an interrupt will be
generated, if enabled. The T1IF bit must be cleared in
software. The respective Timer Interrupt Flag, T1IF, is
located in the IFS0 Status register in the interrupt
controller.
Enabling an interrupt is accomplished via the
respective Timer Interrupt Enable bit, T1IE. The Timer
Interrupt Enable bit is located in the IEC0 Control
register in the inte rrup t controller.
SOSCI
SOSCO
R
C1
C2
dsPIC30FXXXX
32.768 kHz
XTAL
C1 = C2 = 18 pF; R = 100K
dsPIC30F5015/5016
DS70149B-page 68 © 2006 Microchip Technology Inc.
TABLE 9-1: TIMER1 REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
TMR1 0100 Timer1 Register uuuu uuuu uuuu uuuu
PR1 0102 Period Register 1 1111 1111 1111 1111
T1CON 0104 TON —TSIDL TGATE TCKPS1 TCKPS0 —TSYNCTCS 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
© 2006 Microchip Technology Inc. DS70149B-page 69
dsPIC30F5015/5016
10.0 TIMER2/3 MODULE
This section describes the 32-bit General Purpose
(GP) timer module (Timer2/3) and associated opera-
tional modes. Figure 10-1 depicts the simplified block
diagram of the 32-bit Timer2/3 module. Figure 10-2
and Figure 10-3 show Timer2/3 configured as two
independent 16-bit timers: Timer2 and Timer3,
respectively.
The Timer2/3 module is a 32-bit timer, which can be
configu red as two 16-bit timers , with sele ct able oper at-
ing modes. These timers are utilized by other
peripheral modules such as:
Input Capture
Output Compare/Simpl e PWM
The following sections provide a detailed description,
including setup and control registers, along with asso-
ciated bl oc k dia gram s for the ope rati ona l mod es of the
timers.
The 32-bit timer has the following modes:
Two independent 16-bit timers (Timer2 and
Tim er3) with all 16 -bit operating mode s (except
Asynchronous Counter mode)
Single 32-bit Timer operation
Single 32-bit Synchronous Counter
Further, the following operational characteristics are
supported:
ADC Event Trigger
Timer Gate Operation
Selectable Prescaler Settings
Timer Operation during Idle and Sleep modes
Interrupt on a 32-bit Period register Match
These operating modes are determined by setting the
appropriate bit(s) in the 16-bit T2CON and T3CON
SFRs.
For 32-bit timer/counter operation, Timer2 is the least
signifi cant word and Tim er3 is the mos t significant wo rd
of the 32-bit timer.
16-bit Mode: In 16-bit mode, T imer2 and T imer3 can be
configured as two independent 16-bit timers. Each timer
can be set up in either 16-bit Timer mode or 16-bit
Synchronous Counter mode. See Section 9 .0 “Timer1
Module” for details on the se two operating modes.
The only functional difference between Timer2 and
Timer3 is that Timer2 provides synchronization of the
clock prescal er output. This is useful for high-frequency
external clock inputs.
32-bit T imer Mode: In t he 32-bi t T imer m ode, the timer
increments on every instruction cycle up to a match
value, p reloaded in to the com bined 32-bi t Period regis-
ter, PR3/PR2, then rese ts to ‘0’ an d continu es to count.
For synchronous 32-bit reads of the Timer2/Timer3
pair, reading the least significant word (TMR2 register)
will cause the most significant word to be read and
latched into a 16-bit holding register, termed
TMR3HLD.
For synchronous 32-bit writes, the holding register
(TMR3HLD) must first be written to. When followed by
a write to the TMR2 re gister, the content s of TM R3HLD
will be transferred and latched into the MSB of the
32-bit timer (TMR3).
32-bit Synchronous Counter Mode: In the 32-bit
Synchronous Counter mode, the timer increments on
the rising edge of the applied external clock signal,
which is synchronized with the internal phase clocks.
The timer counts up to a match value preloaded in the
combined 32-bit Period regist er, PR3/PR2, then reset s
to ‘0’ and continues.
When the timer is configured for the Synchronous
Counter mode of operation and the CPU goes into the
Idle mode, the timer will stop incrementing, unless the
TSIDL (T2CON<13>) bit = 0. If TSIDL = 1, the timer
module logic will resume the incrementing sequence
upon termination of the CPU Idle mode.
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
Note: Timer2 is a Type B timer and Timer3 is a
Type C timer. Please refe r to the ap prop ri-
ate timer type in Section 24.0 Electrical
Characteristics of this document.
Note: For 32-bit timer operation, T3CON control
bits are ignored. Only T2CON control bits
are used for setup and control. Timer2
clock and gate inputs are utilized for the
32-bit timer module, but an interrupt is
generated with the Timer3 Interrupt Flag
(T3IF) and th e interrupt is en abled with the
Timer3 Interrupt Enable bit (T3IE).
dsPIC30F5015/5016
DS70149B-page 70 © 2006 Microchip Technology Inc.
FIGURE 10-1: 32-BIT TIMER2/3 BLOCK DIAGRAM
TMR3 TMR2
T3IF
Equal Comparator x 32
PR3 PR2
Reset
LSB
MSB
Event Flag
Note: Timer Configuration bit T32, (T2CON<3>), must be set to ‘1’ for a 32-bit timer/counter operation. All control
bits are respective to the T2CON register.
Data Bus<15:0>
TMR3HLD
Read TMR2
Write TMR2 16
16
16
Q
QD
CK
TGATE (T2CON<6>)
(T2CON<6>)
TGATE
0
1
TON TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TCY
TCS
1 x
0 1
TGATE
0 0
Gate
T2CK
Sync
ADC Event Trigger
Sync
© 2006 Microchip Technology Inc. DS70149B-page 71
dsPIC30F5015/5016
FIGURE 10-2: 16- BIT TI MER 2 BLOCK DIAGRAM (TYPE B TIMER)
FIGURE 10-3: 16- BIT TI MER 3 BLOCK DIAGRAM (TYPE C TIMER)
TON
Sync
PR2
T2IF
Equal Comparator x 16
TMR2
Reset
Event Flag
Q
QD
CK
TGATE
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TGATE
TCY
1
0
TCS
1 x
0 1
TGATE
0 0
Gate
T2CK(1)
Sync
Note 1: T2CK input is not available on dsPIC30F5015. This input is grounded as shown in Figure 10-3.
TON
PR3
T3IF
Equal Comparator x 16
TMR3
Reset
Event Flag
Q
QD
CK
TGATE
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TGATE
TCY
1
0
TCS
1 x
0 1
TGATE
0 0
ADC Event Trigger
Sync
Note: The dsPIC30F 5015/5016 devices do not have external pin inputs to Timer3. In these devices, the following
modes should not be used:
1. TCS = 1
2. TCS = 0 and TGATE = 1 (gated time accumulation)
dsPIC30F5015/5016
DS70149B-page 72 © 2006 Microchip Technology Inc.
10.1 Timer Gate Operation
The 32-bit timer can be placed in the Gated Time
Accumu lation mode. Th is mode allow s the int ernal TCY
to increment the respective timer when the gate input
signal (T2CK pin) is asserted high. Control bit TGATE
(T2CO N<6>) mus t be set to en able this mode . When in
this mode, Timer2 is the originating clock source. The
TGATE setting is ignored for T imer3 . The timer must b e
enabled (TON = 1) and the timer clock source set to
internal (TCS = 0).
The falling edge of the external signal terminates the
count ope rati on, bu t does not res et the time r. The user
must reset the timer in order to start counting from zero.
10.2 ADC Event Trigger
When a matc h occurs betwe en the 32-bit timer (TM R3/
TMR2) and the 32-bit combined Period register (PR3/
PR2), a special ADC trigger event signal is generated
by Timer3.
10.3 Timer Prescaler
The in put cloc k (FOSC/4 or external clock) to the timer
has a prescale option of 1:1, 1:8, 1:64 and 1:256
selected by control bits TCKPS<1:0> (T2CON<5:4>
and T3CON<5:4>). For the 32-bit timer operation, the
origina ting clock so urce is Timer2. Th e prescale r oper-
ation for Timer3 is not applicable in this mode. The
prescaler counter is cleared when any of the following
occurs:
a write to the TMR2/TMR3 register
clearing either of the TON (T2CON<15> or
T3CON<15>) bits to ‘0
device Reset such as POR and BOR
However, if the timer is disabled (TON = 0), then the
Timer2 prescaler cannot be reset, since the prescaler
clock is halted.
TMR2/TMR3 is not cleared when T2CON/T3CON is
written.
10.4 Timer Operation During Sleep
Mode
During CPU Sleep mode, the timer will not operate,
because the internal clocks are disabled.
10.5 Timer Interrupt
The 32-bit timer module can generate an interrupt on
period ma tch, or on the fa lling edge of the externa l gate
signal. When the 32-bit timer count matches the
respective 32-bit Period register, or the falling edge of
the external “gate” signal is detected, the T3IF bit
(IFS0<7>) is asserted and an interrupt will be gener-
ated if enabled. In this mode, the T3IF interrupt flag is
used as the source of the interrupt. The T3IF bit must
be cleared in sof tw are.
Enabling an interrupt is accomplished via the
respective Timer Interru pt Enable bi t, T3IE (IEC0<7 >).
© 2006 Microchip Technology Inc. DS70149B-page 73
dsPIC30F5015/5016
TABLE 10-1: TIMER2/3 REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
TMR2 0106 Timer2 Register uuuu uuuu uuuu uuuu
TMR3HLD 0108 Timer3 Holding Register (For 32-bit timer operations only) uuuu uuuu uuuu uuuu
TMR3 010A Timer3 Register uuuu uuuu uuuu uuuu
PR2 010C Period Register 2 1111 1111 1111 1111
PR3 010E Period Register 3 1111 1111 1111 1111
T2CON 0110 TON —TSIDL TGATE TCKPS1 TCKPS0 T32 TCS(1) 0000 0000 0000 0000
T3CON 0112 TON —TSIDL TGATE TCKPS1 TCKPS0 0000 0000 0000 0000
Legend: u = uninitialized bit
Note 1: T C S in T2 CON is not availa ble on the dsP IC 3 0F 501 5.
Note 2: Refer todsPIC30F Family Reference Manual” (DS70046) for descriptions of r egist er bit fields.
dsPIC30F5015/5016
DS70149B-page 74 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 75
dsPIC30F5015/5016
11.0 TIMER4/5 MODULE
This section describes the second 32-bit General
Purpose ti mer modul e (T imer4/5) a nd associ ated oper-
ational modes. Figure 11-1 depicts the simplified block
diagram of the 32-bit Timer4/5 module. Figure 1 1-2 and
Figure 11-3 s how T im er4/5 c onf igu r ed as two ind epen-
dent 16-bit timers, Timer4 and Timer5, respectively.
The Timer4/5 module is similar in operation to the
Timer2/3 module. However, there are some
differences, which are listed below:
The Timer4/5 module does not support the ADC
Event Trigger feature
Timer4/5 can not be utilized by other peripheral
modules such as Input Capture and Output Compare
The operating modes of the Timer4/5 module are
determined by settin g the appropriate bit(s) in the 16-bit
T4CON and T5CON SFRs.
For 32-bit timer/counter operation, Timer4 is the least
signifi cant word and Tim er5 is the mos t significant wo rd
of the 32-bit timer.
FIGURE 11-1: 32-BIT TIMER4/5 BLOC K DIAGRAM
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
Note: Timer4 is a Type B timer and Timer5 is a
Type C timer. Please refe r to the ap prop ri-
ate timer type in Section 24.0 Electrical
Characteristics of this document.
Note: For 32-bit timer operation, T5CON control
bits are ignored. Only T4CON control bits
are used for setup and control. Timer4
clock and gate inputs are utilized for the
32-bit timer module, but an interrupt is
generated with the Timer5 Interrupt Flag
(T5IF) and th e interrupt is en abled with the
Timer5 Interrupt Enable bit (T5IE).
TMR5 TMR4
T5IF
Equal Comparator x 32
PR5 PR4
Reset
LSB
MSB
Event Flag
Note: Timer Configuration bit T45, (T4CON<3 >), must be s et to ‘1’ for a 32-bit timer/counter operation. All
control bits are respective to the T4CON register.
Data Bus<15:0>
TMR5HLD
Read TMR4
Write TMR4 16
16
16
Q
QD
CK
TGATE (T4CON<6>)
(T4CON<6>)
TGATE
0
1
TON TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
T
CY
TCS
1
x
0
1
TGATE
0
0
Gate
T4CK
Sync
Sync
dsPIC30F5015/5016
DS70149B-page 76 © 2006 Microchip Technology Inc.
FIGURE 11-2: 16-BIT TIMER4 BLOCK DIAGRAM (TYPE B TIMER)
FIGURE 11-3: 16-BIT TIMER5 BLOCK DIAGRAM (TYPE C TIMER)
TON
Sync
PR4
T4IF
Equal Comparator x 16
TMR4
Reset
Event Flag
Q
QD
CK
TGATE
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TGATE
TCY
1
0
TCS
1 x
0 1
TGATE
0 0
Gate
T4CK
Sync
TON
PR5
T5IF
Equal Com parat or x 16
TMR5
Reset
Event Flag
Q
QD
CK
TGATE
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TGATE
TCY
1
0
TCS
1 x
0 1
TGATE
0 0
ADC Event Trigger
Sync
Note: The dsPIC30F5015/5016 devices do not have an external pin input to Timer5. In these devices, the
following modes should not be used:
1. TCS = 1
2. TCS = 0 and TGATE = 1 (gated time accumulation)
© 2006 Microchip Technology Inc. DS70149B-page 77
dsPIC30F5015/5016
TABLE 11-1: TIMER4/5 REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
TMR4 0114 Timer4 Register uuuu uuuu uuuu uuuu
TMR5HLD 0116 Time r5 Holding Register (For 32-bit operations only) uuuu uuuu uuuu uuuu
TMR5 0118 Timer5 Register uuuu uuuu uuuu uuuu
PR4 011A Period Register 4 1111 1111 1111 1111
PR5 011C Period Register 5 1111 1111 1111 1111
T4CON 011E TON —TSIDL TGATE TCKPS1 TCKPS0 T45 —TCS0000 0000 0000 0000
T5CON 0120 TON —TSIDL TGATE TCKPS1 TCKPS0 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
dsPIC30F5015/5016
DS70149B-page 78 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 79
dsPIC30F5015/5016
12.0 INPUT CAPTURE MODULE
This section describes the input capture module and
associated operational modes. The features provided by
this module are useful in applications requiring
frequency (period) and pulse m easurement. Figure 12-1
depicts a block diagram of the input capture module.
Input capture is useful for such m odes as:
Frequency/Period/Pulse Measurements
Additional source s of External Interrupts
The key operational features of the input capture
module are:
Simple Capture Event mode
Timer2 and Timer3 mode selection
Interrupt on input capture event
These operating modes are determined by setting the
appropriate bits in the ICxCON register (where
x = 1,2,...,N). The dsPIC30F5015/5016 device has 8
capture channels.
12.1 Simple Capture Event Mode
The simple capture events in the dsPIC30F product
family are:
Capture every falling edge
Capture every rising edge
Capture every 4th rising edge
Capture every 16th rising edge
Capture every rising and falling edge
These simple Input Capture modes are configured by
setting the appropriate bits ICM<2:0> (ICxCON<2:0>).
12.1.1 CAPTURE PRESCALER
There are four input capture prescaler settings, speci-
fied by bits ICM<2:0> (ICxCON<2:0>). Whenever the
capture c hanne l is turn ed of f, the pre scaler co unter w ill
be cleared. In addition, any Reset will clear the
prescaler counter.
FIGURE 12-1: INPUT CAPTURE MODE BLOCK DIAGRAM
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
ICxBUF
Prescaler
ICx
ICM<2:0>
Mode Select
3
Note: Where ‘x ’ is sho wn, referen ce is ma de to the reg isters or bits associa ted to the res pecti ve inpu t
capture channels 1 through N.
10
Set Flag
Pin
ICxIF
ICTMR
T2_CNT T3_CNT
Edge
Detection
Logic
Clock
Synchronizer
1, 4, 16
From General Purpose Timer Module
16 16
FIFO
R/W
Logic
ICI<1:0>
ICBNE, ICOV
ICxCON Interrupt
Logic
Set Flag
ICxIF
Data Bus
dsPIC30F5015/5016
DS70149B-page 80 © 2006 Microchip Technology Inc.
12.1.2 CAPTURE BUFFER OPERATION
Each capture channel has an associated FIFO buffer,
which is four 16-bit words deep. There are two status
flags, which provide status on the FIFO buffer:
ICBFNE – Input Capture Buffer Not Empty
IC OV – Input Capture Ov erfl ow
The ICBFNE will be set on the fir st input ca ptu r e event
and remain set until all capture events have been read
from the FIF O. As each word is read fro m the FIFO, th e
remaining words are advanced by one position within
the buffer.
In the event that the FIFO is full with four capture
events and a fifth capture event occurs prior to a read
of the FIFO, an overflow condition will occur and the
ICOV bit will be s et to a logic ‘1’. The fifth capture event
is lost and is not stored in the FIFO. No additional
events will be captured till all four events have been
read from the buffer.
If a FIFO read is performed after the last read and no
new capture event has been received, the read will
yield indeterminate results.
12.1.3 TIMER2 AND TIMER3 SELECTION
MODE
Each capture channel can select between one of two
timers for the time base, Timer2 or Timer3.
Selection of the timer resource is accomplished
through SFR bit ICTMR (ICxCON<7>). Timer3 is the
default timer resource available for the input capture
module.
12.1.4 HALL SENSOR MODE
When the input capture module is set for capture on
every ed ge, rising a nd falli ng, ICM <2:0> = 001, the fol-
lowing operations are performed by the input capture
logic:
The input capture interrupt flag is set on every
edge, rising and falling
The interrupt on Capture mode setting bits,
ICI<1:0>, is ign ored, sinc e every capture
generates an interrupt
A capture overflow condition is not generated in
this mode
12.2 Input Capture Operation During
Sleep and Idle Modes
An input capture event will generate a device wake-up
or interrupt, if enabled, if the device is in CPU Idle or
Sleep mode.
Independent of the timer being enabled, the input
capture module will wake-up from the CPU Sleep or
Idle mode when a capture event occurs, if ICM<2:0> =
111 and the interrupt enable bi t is as se rted . The sam e
wake-up can generate an interrupt if the conditions for
processing the interrupt have been satisfied. The
wake-up feature is useful as a method of adding extra
external pin interrupts.
12.2.1 INPUT CAPTURE IN CPU SLEEP
MODE
CPU Sleep mode allows input capture module opera-
tion with reduced functionality. In the CPU Sleep
mode, the ICI<1:0> bits are not applicable, and the
input capture module can only function as an external
interr upt so urce .
The capture module must be configured for interrupt
only on the rising edge (ICM<2:0> = 111) in order for
the input capture module to be used while the device
is in Sleep mode. The prescale settings of 4:1 or 16:1
are not applicable in this mode.
12.2.2 INPUT CAPTURE IN CPU IDLE
MODE
CPU Idle mode allows input capture module operation
with full functionality. In the CPU Idle mode, the Inter-
rupt mode selected by the ICI<1:0> bits is applicable,
as well as the 4:1 and 16:1 capture prescale settings,
which are defined by control bits ICM<2:0>. This mode
requires the selected timer to be enabled. Moreover,
the ICSIDL bit must be asserted to a logic ‘0’.
If the input capture module is defined as
ICM<2:0> = 111 in CPU Idle mode, the input capture
pin will serve only as an external interrupt pin.
12.3 Input Capture Interrupts
The inpu t captur e channe ls have the a bility to generate
an interrupt, based upon the selected number of cap-
ture even t s . The selecti on num be r is se t b y c ont rol bits
ICI<1:0> (ICxCON<6:5>).
Each chan nel provide s an interrupt flag (ICxI F) bit. The
respective capture channel interrupt flag is located in
the corresponding IFSx Status register.
Enabling an interrupt is accomplished via the respec-
tive Capture Channel Interrupt Enable (ICxIE) bit. The
Capture Interrupt Enable bit is located in the
corresponding IEC Control register.
© 2006 Microchip Technology Inc. DS70149B-page 81
dsPIC30F5015/5016
TABLE 12-1: INPUT CAPTURE REGISTER MAP
SFR Name Addr. Bit 15 Bi t 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 B it 3 Bit 2 Bit 1 B it 0 Reset State
IC1BUF 0140 Input 1 Capture Register uuuu uuuu uuuu uuuu
IC1CON 0142 —ICSIDL ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
IC2BUF 0144 Input 2 Capture Register uuuu uuuu uuuu uuuu
IC2CON 0146 —ICSIDL ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
IC3BUF 0148 Input 3 Capture Register uuuu uuuu uuuu uuuu
IC3CON 014A —ICSIDL ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
IC4BUF 014C Input 4 Capture Register uuuu uuuu uuuu uuuu
IC4CON 014E —ICSIDL ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
dsPIC30F5015/5016
DS70149B-page 82 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 83
dsPIC30F5015/5016
13.0 OUTPUT COMP ARE MODULE
This sec tion desc ribes the ou tput comp are modu le and
associated operational modes. The features provided
by this module are useful in applications requiring
operational modes such as:
Generation of Variable Width Output Pulses
Pow er Fact or Correction
Figure 13-1 depicts a block diagram of the output
compare module.
The key operational features of the output compare
module include:
Timer2 and Timer3 Selection mode
Simple Output Compare Match mode
Dual Output Compare Match mode
Simple PWM mode
Output Compare during Sleep and Idle modes
Interrupt on Output Compare/PWM Event
These operating modes are determined by setting the
appropriate bits in the 16-bit OCxCON SFR (where
x = 1,2,3,...,N). The dsPIC30F5015/5016 device has
8 compare channels.
OCxRS and OCxR in the figure represent the Dual
Compare registers. In the Dual Compare mode, the
OCxR register is used for the f irst comp are and O CxRS
is used for the second compare.
FIGURE 13-1: OUTPUT COMPARE MODE BLOCK DIAGRAM
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
OCxR
Comparator
Output
Logic QS
R
OCM<2:0>
Output Enable
OCx
Set Fla g bit
OCxIF
OCxRS
Mode Select
3
Note: Where ‘x’ is shown, reference is made to the registers associated with the respective output compare
channels 1 through N.
OCFA
OCTSEL 01
T2P2_MATCH
TMR2<15:0 TMR3<15:0> T3P3_MATCH
From General Purpose
(for x = 1, 2, 3 or 4)
01
Timer Module
dsPIC30F5015/5016
DS70149B-page 84 © 2006 Microchip Technology Inc.
13.1 Timer2 and Timer3 Sel ection
Mode
Each output compare channel can select between one
of two 16-bit timers; Timer2 or Timer3.
The selection of the timers is controlled by the OCTSEL
bit (OCxCON<3> ). T im er2 is the de fault ti mer reso urce
for the output compare module.
13.2 Simple Output Compare Match
Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 001,
010 or 011, the selected output compare channel is
configured for one of three simple output compare
match modes:
Compare forces I/O pin low
Compare forces I/O pin high
Compare toggles I/O pin
The OCxR reg is ter i s us ed in th es e m ode s. Th e O C xR
register is loaded with a value and is compared to the
selected incrementing timer count. When a compare
occur s, o ne of th ese compare mat ch modes occu rs. I f
the counter resets to zero before reaching the value in
OCxR, the state of the OCx pin remains unchanged.
13.3 Dual Output Compare Match Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 100
or 101, the selec ted outp ut compare chan nel is co nfig-
ured fo r one of two dual output co mpare mod es , whic h
are:
Single Output Pulse mode
Conti nuous Output Pulse mode
13.3.1 SINGLE-PULSE MODE
For the use r to confi gure the modul e for the ge ner ation
of a single output pulse, the following steps are
required (assuming timer is off):
Determine instruction cycle time TCY.
Calculate desired pulse width value based on
TCY.
Calcu late ti me to s tart pulse from ti mer st a rt valu e
of 0x0000.
Write pulse width start and stop times into OCxR
and OCxRS Compare registers (x denotes
channel 1, 2, ...,N).
Set Timer Period register to value equal to, or
greater than, value in OCxRS Compare register.
Set OCM<2:0> = 100.
Enable timer, TON (TxCON<15>) = 1.
To initiate another single pulse, issue another write to
set OCM<2:0> = 100.
13.3.2 CONTINUOUS PULSE MODE
For the use r to confi gure the modul e for the ge neratio n
of a continuous stream of output pulses, the following
steps are required:
Determine instruction cycle time TCY.
Calculate desired pulse value based on TCY.
Calculate timer to start pulse width from timer
start value of 0x0000.
Write pulse width start and stop times into OCxR
and OCxRS (x denotes channel 1, 2, ...,N)
Compare registers, respectively.
Set Timer Period register to value equal to, or
greater than, value in OCxRS Compare register.
Set OCM<2:0> = 101.
Enable timer, TON (TxCON<15>) = 1.
13.4 Simple PWM Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 110
or 111, the selec ted outp ut comp are c hannel is confi g-
ured for th e PWM mode of opera tion. When co nfigured
for the PWM mode of operation, OCxR is the main l atch
(read-only) and OCxRS is the secondary latch. This
enables glitchless PWM transitions.
The user must perform the following steps in order to
configure the output compare module for PWM
operation:
1. Set the PWM pe riod by writing to the appropriate
Period register.
2. Set the PWM duty cy cle by writ ing to the OCxRS
register.
3. Configure the output compare module for PWM
operation.
4. Set the TMRx prescale value and enable the
timer, TON (TxCON<15>) = 1.
13.4.1 INPUT PIN FAULT PROTECTION
FOR PWM
When control bits OCM<2:0> (OCxCON<2:0>) = 111,
the selected output compare channel is again
configured for the PWM mode of operation, with the
addition al feature of input Fa ult protect ion. While in this
mode, if a logic ‘0’ is detected on the OCFA pin, the
respective PWM output pin is placed in the high-
impedance input state. The OCFLT bit (OCxCON<4>)
indicates whether a Fault condition has occurred. This
state will be maintained until both of the following
events have occurred:
The external Fault condition has been removed.
The PWM mode has been re-enabled by writing
to the appropriate control bits.
© 2006 Microchip Technology Inc. DS70149B-page 85
dsPIC30F5015/5016
13.4.2 PWM PERIOD
The PWM period is specified by writing to the PRx
register. The PWM period can be calculated using
Equation 13-1.
EQUATION 13-1: PWM PERIOD
PWM frequency is defined as 1/[PWM period].
When the selected TMRx is equal to its respective
Period regi ster, PRx, the followi ng four event s occur o n
the next i ncrement cycle:
TMRx is clear e d.
The OCx pin is set.
- Exception 1: If PWM duty cycle is 0x0000,
the OCx pin will r emain low.
- Exception 2: If d uty cycl e is gr eater tha n PRx,
the pin will remain high.
The PWM duty cycle is latched from OCxRS into
OCxR.
The corresponding timer interrupt flag is set.
See Figure 13-1 for key PWM period comparisons.
Timer3 is referred to in the figure for clarity.
FIGURE 13-1: PWM OUTPUT TIMING
13.5 Output Compare Operation During
CPU Sleep Mode
When the CPU enters the Sleep mode, all internal
clocks are stopped. Therefore, when the CPU enters
the Sleep state, the output compare channel will drive
the pin to the active state that was observed prior to
entering the CPU Sleep state.
For example, if the pin was high when the CPU
entered the Sleep state, the pin will remain high. Like-
wise, if the pin was low when the CPU entered the
Sleep state, the pin will remain low. In either case, the
output compare module will resume operation when
the device wakes up.
13.6 Output Compare Operation During
CPU Idle Mode
When the CPU enters the Idle mode, the output
compare module can operate with full functionality.
The output compare channel will operate during the
CPU Idle m ode if th e O CSID L bi t (O CxCO N<13 >) is at
logic ‘0’ and the s elected tim e b ase (Timer2 or Timer3)
is enabled and the TSIDL bit of the selected timer is
set to logic ‘0’.
13.7 Output Compare Interrupts
The outpu t comp are channels have the abil ity to gener-
ate an interrupt on a compare match, for whichever
match mode has been selected.
For all m odes exc ept the PWM mode, when a comp are
event occurs, the respective interrupt flag (OCxIF) is
asserte d an d an int errup t wil l be ge nera ted, if enable d.
The OCxIF bit is located in the corresponding IFS
Status register and must be cleared in software. The
interrupt is enabled via the respective Compare
Interrupt Enable (OCxIE) bit, located in the
corresponding IEC Control register.
For the PWM mode, when a n event occurs, the respec-
tive Timer In terru pt Fl ag (T2IF or T3 IF) i s ass erted an d
an interrupt will be generated, if enabled. The IF bit is
located in the IFS0 S tatus register and must be cleared
in software. The interrupt is enabled via the respective
T imer Interrupt Enable b it (T2IE or T3IE), lo cated in th e
IEC0 Control register. The output compare interrupt
flag is never set during the PWM mode of operation.
PWM Period = [(PRx) + 1] • 4 • TOSC
(TMRx Prescale Value)
Period
Duty Cycle
TMR3 = Duty Cycle (OCxR) TMR3 = Duty Cycle (OCxR)
TMR3 = PR3
T3IF = 1
(Interrupt Flag)
OCxR = OCxRS
TMR3 = PR3
(Interrupt Flag)
OCxR = OCxRS
T3IF = 1
dsPIC30F5015/5016
DS70149B-page 86 © 2006 Microchip Technology Inc.
TABLE 13-1: OUTPUT COMPARE REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
OC1RS 0180 Output Compare 1 Secondary Register 0000 0000 0000 0000
OC1R 0182 Output Compare 1 Main Register 0000 0000 0000 0000
OC1CON 0184 —OCSIDL OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000
OC2RS 0186 Output Compare 2 Secondary Register 0000 0000 0000 0000
OC2R 0188 Output Compare 2 Main Register 0000 0000 0000 0000
OC2CON 018A —OCSIDL OCFLT OCTSE OCM<2:0> 0000 0000 0000 0000
OC3RS 018C Output Compare 3 Secondary Register 0000 0000 0000 0000
OC3R 018E Output Compare 3 Main Register 0000 0000 0000 0000
OC3CON 0190 —OCSIDL OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000
OC4RS 0192 Output Compare 4 Secondary Register 0000 0000 0000 0000
OC4R 0194 Output Compare 4 Main Register 0000 0000 0000 0000
OC4CON 0196 —OCSIDL OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
© 2006 Microchip Technology Inc. DS70149B-page 87
dsPIC30F5015/5016
14.0 QUADRATURE ENCODER
INTERFACE (QEI) MODULE
This section describes the Quadrature Encoder Inter-
face (QEI) module and associated operational modes.
The QEI module provides the interface to incremental
encoders for obtaining mechanical position data.
The operational features of the QEI include:
Three input channels for two phase signals and
index pulse
16-bit up/down position counter
Count direction status
Position Measurement (x2 and x4) mode
Programmable digital noise filters on inputs
Alternate 16-bit Timer/Counter mode
Quadrature Encoder Interface interrupts
These operating modes are determined by setting the
appropriate bits QEIM<2:0> (QEICON<10:8>).
Figure 14-1 depicts the Quadrature Encoder Interface
block dia gram .
FIGURE 14-1: QUADRATURE ENCODER INTERFACE BLOCK DIAGRAM
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
16-bit Up/Down Counter
Comparator/
Max Count Register
Quadrature
Programmable
Digital Filter
QEA
Programmable
Digital Filter
INDX
1Up/Down
Existing Pin Logic
UPDN
3
Encoder
Programmable
Digital Filter
QEB
Interface Logic
QEIM<2:0>
Mode Select
3
(POSCNT)
(MAXCNT)
PCDOUT
QEIIF
Event
Flag
Reset
Equal
2
TCY
1
0
TQCS TQCKPS<1:0>
2
1, 8, 64, 256
Prescaler
Q
Q
D
CK
TQGATE
QEIM<2:0>
Synchronize
Det
1
0
Sleep Inpu t
0
1
UDSRC
QEICON<11> Zero Detect
0
dsPIC30F5015/5016
DS70149B-page 88 © 2006 Microchip Technology Inc.
14.1 Quadrature Encoder Interface
Logic
A typica l in cre me nt a l (a.k .a . optical) enc ode r has three
outputs: Phase A, Phase B and an index pulse. These
signals are useful and often required in position and
speed control of ACIM and SR motors.
The two chann els, Phase A (QEA) and Phase B (QEB),
have a unique relationship. If Phase A leads Phase B,
then the direction (of the motor) is deemed positive or
forward. If Phase A lags Phase B, then the direction (of
the motor) is deemed negative or reverse.
A third channel, termed index pulse, occurs once per
revolution and is used as a reference to establish an
absolute position. The index pulse coincides with
Phase A and Phase B, both low.
14.2 16-bit Up/Down Position Counter
Mode
The 16-bit up/down counter counts up or down on
ever y count pulse, w hich is generat ed by t he dif ference
of the Phase A and Phase B input signals. The counter
acts as an integrato r , wh ose cou nt value is proporti onal
to position. The direction of the count is determined by
the UPDN signal, which is generated by the
Quadrature Enc ode r Interfac e log ic.
14.2.1 POSITION COUNTER ERROR
CHECKING
Position c oun t e rror checkin g i n the Q EI i s p rov ide d for
and indic ated by the CNTERR bit (QEICO N<15>). The
error checking only applies when the position counter
is configured for Reset on the Index Pulse modes
(QEIM<2:0> = 110 or 100). In these modes, the
contents of the POSCNT register are compared with
the values (0xFFFF or MAXCNT + 1, depending on
direction). If these values are detected, an error condi-
tion is ge nera t ed by setti ng the CNTERR bi t a nd a Q EI
count error interrupt is generated. The QEI count error
interrupt can be disabled by setting the CEID bit
(DFLTCON<8>). The position counter continues to
count enc oder edg es after an err or has been detected.
The POSCNT register continue s to count up/do wn until
a natural rollover/underflow. No interrupt is generated
for the natural rollover/underflow event. The CNTERR
bit is a read/write bit and reset in software by the user.
14.2.2 POSITION COUNTER RESET
The Position Counter Reset Enable bit, POSRES
(QEICON<2> ), controls whe ther the posit ion counter is
reset when the index pulse is detected. This bit is only
applicable when QEIM<2:0> = 100 or 110.
If the POSRES bit is se t to ‘1’, then the posi tion count er
is reset when the index pulse is detected. If the
POSRES bit is set to ‘0’, then the position counter is not
reset when the index pulse is detected. The position
counter will continue counting up or down, and will be
reset on the rollover or underflow condition.
The interrupt is still generated on the detection of the
index pulse and not on the position counter overflow/
underflow.
14.2.3 COUNT DIRECTION STATUS
As mentioned in the previous section, the QEI logic
generates an UPDN signal, based upon the relation-
ship between Phase A and Phase B. In addition to the
output pin, the state of this int ernal UPDN sign al is sup-
plied to a SFR bit, UPDN (QEICON<11>), as a read-
only bit. To place the state of this signal on an I/O pin,
the SFR bit, PCDOUT (QEICON<6>), must be ‘1’.
14.3 Position Measurement Mode
There are two measurement modes which are sup-
ported and are termed x2 and x4. These modes are
selected by the Q EIM <2:0> mode select bits loc ate d i n
SFR QEICON<10:8>.
When control bits QEIM<2:0> = 100 or 101, the x2
Measurement mode is selected and the QEI logic only
looks at the Phase A input for the position counter
increment rate. Every rising and falling edge of the
Phase A s ignal ca uses the positio n counter to b e incre-
mented or decremented. The Phase B signal is still
utilized for the determination of the counter direction,
just as in the x4 mode.
Within the x2 Measurement mode, there are two
variations of how the position counter is reset:
1. Position counter reset by detection of index
pulse, QEIM<2:0> = 100.
2. Position counter reset by match with MAXCNT,
QEIM<2:0> = 101.
When control bits QEIM<2:0> = 110 or 111, the x4
Measurement mode is selected and the QEI logic looks
at both edges of the Phase A and Phase B input sig-
nals. Every edge of both signals causes the position
counter to inc rem ent or decr em ent.
Within the x4 Measurement mode, there are two
variations of how the position counter is reset:
1. Position counter reset by detection of index
pulse, QEIM<2:0> = 110.
2. Position counter reset by match with MAXCNT,
QEIM<2:0> = 111.
The x4 Measurement mode provides for finer resolu-
tion data (more position counts) for determining motor
position.
© 2006 Microchip Technology Inc. DS70149B-page 89
dsPIC30F5015/5016
14.4 Programmable Digital Noise
Filters
The digital noise filter section is responsible for reject-
ing noise on the incoming capture or quadrature
signals. Schmitt Trigger inputs and a three-clock cycle
delay filter combine to reject low-level noise and large,
short duration nois e s pik es tha t ty pic al ly occ ur i n n ois e
prone applications, such as a motor system.
The filter ensures that the filtered output signal is not
permitted to change until a stable value has been
registered for three consecutive clock cycles.
For the QEA, QEB and INDX pins, the clock divide
frequency for the digital filter is programmed by bits
QECK<2:0> (DFLTCON<6:4>) and are derived from
the base instruction cycle TCY.
To enable the filter output for channels QEA, QEB and
INDX, the QEOUT bit must be ‘1 . The f ilt er netwo rk for
all channels is disabled on POR and BOR.
14.5 Alternate 16-bit Timer/Counter
When the QEI module is not configured for the QEI
mode, QEIM<2:0> = 001, the module can be config-
ured as a simple 16-bit timer/counter. The setup and
control of the auxiliary timer is accomplished through
the QEICON SFR register. This timer functions
identic all y to Timer1 . The QEA pin is use d as the tim er
clock input.
When configured as a timer, the POSCNT register
serves as the Timer Count register and the MAXCNT
register serves as the Period register. When a Timer/
Period re gis ter match oc curs , the Q EI interrupt flag wil l
be asserted.
The only exception between the general purpose tim-
ers and this timer is the added feature of external up/
down input select. When the UPDN pin is asserted
high, the timer will increment up. When the UPDN pin
is asserted low, the timer will be decremented.
The UPDN control/Status bit (QEICON<11>) can be
used to select the count direction state of the Timer
register. When UPDN = 1, the timer will count up.
When UPDN = 0, the timer will co unt down .
In addition, control bit, UDSRC (QEICON<0>), deter-
mines whether the timer count direction state is based
on the logic state written into the UPDN control/Status
bit (QEICON<11>), or the QEB pin state. When
UDSRC = 1, t he timer count dire ction is c ontrolled from
the QEB pin. Likewise, when UDSRC = 0, the timer
count direction is controlled by the UPDN bit.
14.6 QEI Module Operation During CPU
Sleep Mode
14.6.1 QEI OPERATION DURING CPU
SLEE P MOD E
The QEI module will be halted during the CPU Sleep
mode.
14.6.2 TIMER OPERATION DURING CPU
SLEE P MOD E
During CPU Sleep mode, the timer will not operate,
because the internal clocks are disabled.
14.7 QEI Module Operation During CPU
Idle Mode
Since the QEI module can function as a Quadrature
Encoder Interface, or as a 16-bit timer, the following
section describes operation of the module in both
modes.
14.7.1 QEI OPERATION DURING CPU IDLE
MODE
When the CPU is placed in the Idle m ode, the Q EI mod-
ule will operate if the QEISIDL bit (QEICON<13>) = 0.
This bit defaults to a logic0’ upon executing POR and
BOR. For halting the QEI module during the CPU Idle
mode, QEISIDL should be set to ‘1’.
Note: Changing the operational mode (i.e., from
QEI to Timer or vice versa), will not affect
the Timer/Position Count register contents.
Note: This timer does not support the External
Asynchronous Counter mode of operation.
If using an exte rnal cloc k sourc e, the cl ock
will automatically be synchronized to the
internal instruction cycle.
dsPIC30F5015/5016
DS70149B-page 90 © 2006 Microchip Technology Inc.
14.7.2 TIMER OPERATION DURING CPU
IDLE MODE
When the CPU is placed in the Idle mode and the QEI
module is configured in the 16-bit Timer mode, the
16-bit timer will operate if the QEISIDL bit
(QEICON<13>) = 0. This bit defaults to a logic ‘0’ upon
execut ing POR a nd BO R. F or halting the ti me r mo dul e
during the CPU Idle mode, QEISIDL should be set
to 1’.
If the QEISIDL bit is cleared, the timer will function
normally, as if the CPU Idle mode had not been
entered.
14.8 Quadrature Encoder Interface
Interrupts
The Quadrature Encoder Interface has the ability to
generate an interrupt on occurrence of the following
events:
Inter rupt on 16-bit up/down position counter
rollover/underflow
Detection of qualified index pulse, or if CNTERR
bit is set
Timer period match event (overflow/underflow)
Gate accumulation event
The QEI Interrupt Flag bit, QEIIF, is asserted upon
occurrence of any of the above events. The QEIIF bit
must be cleared in software. QEIIF is located in the
IFS2 Status register.
Enabling an interrupt is accomplished via the respec-
tive enable bit, QEIIE. The QEIIE bit is located in the
IEC2 Control register.
© 2006 Microchip Technology Inc. DS70149B-page 91
dsPIC30F5015/5016
TABLE 14-1: QEI REGISTER MAP
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
QEICON 0122 CNTERR QEISIDL INDX UPDN QEIM<2:0> SWPAB PCDOUT TQGATE TQCKPS<1:0> POSRES TQCS UDSRC 0000 0000 0000 0000
DFLTCON 0124 IMV<1:0> CEID QEOUT QECK2 QECK1 QECK0 0000 0000 0000 0000
POSCNT 0126 Position Counter<15:0> 0000 0000 0000 0000
MAXC NT 0 128 Maximun C oun t<15 :0> 1111 1111 1111 1111
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
dsPIC30F5015/5016
DS70149B-page 92 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 93
dsPIC30F5015/5016
15.0 MOTOR CONTROL PWM
MODULE
This module simplifies the task of generating multiple,
synchronized Pulse-Width Modulated (PWM) outputs.
In particular, the following power and motion control
applications are supported by the PWM module:
Three Phase AC Inducti on Motor
Switched Reluctance (SR) Motor
Brushless DC (BLDC) Motor
Uninterruptible Power Supply (UPS)
The PWM module has the following features:
8 PWM I/O pins with 4 duty cycle generators
Up to 16-bit resolution
‘On-the-Fly’ PWM frequency changes
Edge and Center-Aligned Output modes
Single-Pulse Generation mode
Interrupt support for asymmetrical updates in
Center-Aligned mode
Output override control for Electrically
Commutative Motor (ECM) operation
‘Special Event’ comparator for scheduling other
peripheral events
Fault pins to optionally drive each of the PWM
output pins to a defined state
Duty cycle updates are configurable to be
immediate or synchronized to the PWM time base
This module contains 4 duty cycle generators, num-
bered 1 through 4. The modul e has 8 PW M output p ins,
numbere d PWM1 H/PWM 1L throu gh PWM 4H/PWM4 L.
The eight I/O pins are groupe d int o high/low numbered
pairs, denoted by the suffix H or L, respectively. For
complementary loads, the low PWM pins are always
the complement of the corresponding high I/O pin.
The PWM module allows several modes of operation
which are beneficial for specific power control
applications.
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
dsPIC30F5015/5016
DS70149B-page 94 © 2006 Microchip Technology Inc.
FIGURE 15-1: PWM MODULE BLOCK DIAGRAM
PDC4
PDC4 Buffer
PWMCON1
PTPER Buffer
PWMCON2
PTPER
PTMR
Comparator
Comparator
Channel 4 Dead-Time
Generator and
PTCON
SEVTCMP
Comparator Special Event Trigger
FLTBCON
OVDCON
PWM Enable and Mode SFRs
PWM Ma nua l
Control SFR
Channel 3 Dead-Time
Generator and
Channel 2 Dead-Time
Generator and
PWM Generator
#3
PWM Generator
#2
PWM Ge nera t or #4
SEVTDIR
PTDIR
DTCON1 Dead-Time Control SFRs
Special Event
Postscaler
PWM1L
PWM1H
PWM2L
PWM2H
PWM3L
PWM3H
PWM Generator
#1 Channel 1 De ad- Tim e
Generator and
Note: Details of PWM Gene rator #1, #2 an d #3 not shown for clarity.
16-bit Data Bus
PWM4L
PWM4H
DTCON2
FLTACON Fault Pin Control SFRs
PWM Time Base
Output
Driver
Block
FLTB
FLTA
Overr ide Log i c
Overr ide Log i c
Overr ide Log i c
Override Logic
© 2006 Microchip Technology Inc. DS70149B-page 95
dsPIC30F5015/5016
15.1 PWM Time Base
The PWM time base is provided by a 15-bit timer with
a pr escaler and postsc aler . The time base is acce ssible
via the PTMR SFR. PTMR<15> is a read-only Status
bit, P TDIR, tha t indic ates th e present c ount dir ection of
the PWM time base. If PTDIR is cleared, PTMR is
counting upwards. If PTDIR is set, PTMR is counting
downwards. The PWM time base is configured via the
PTCON SFR. The time base is enabled/disabled by
setting/clearing the PTEN bit in the PTCON SFR.
PTMR is not cleared when the PTEN bit is cleared in
software.
The PTPER SFR sets the counting period for PTMR.
The user must write a 15-bit value to PTPER<14:0>.
When the value in PTMR<14:0> matches the value in
PTPER<14:0>, the time base will either reset to ‘0’, or
reverse the count direction on the next occurring clock
cycle. The action taken depends on the operating
mode of the time base.
The PWM time base can be configured for four different
modes of opera tion:
Free-Running mode
Single-Shot mode
Continuous Up/Down Count mode
Continuous Up/Down Count mode with interrupts
for double updates
These four modes are selected by the PTMOD<1:0>
bits in the PT CON SFR. The Up/Down Counting modes
support center-aligned PWM generation. The Single-
Shot mode allows the PWM module to support pulse
control of certain Electronically Commutative Motors
(ECMs).
The interrupt sig nal s ge nera t ed b y the PWM t im e bas e
depend on the mode sele ction bit s (P TMOD<1:0>) and
the post sca ler bit s (P T OPS <3:0>) in the PT CON SFR.
15.1.1 F REE-RUNNIN G MODE
In Free-Running mode, the PWM time base counts
upwards until the value in the Time Base Period regis-
ter (P TPER) is match ed. The P TMR regi ster is reset o n
the following input clock edge and the time base will
continue to count upwards as long as the PTEN bit
remains set.
When the PWM time base i s in the Free-Run ning mode
(PTMOD<1:0> = 00), an interrupt event is generated
each tim e a m atch wi th the P TPER reg ister o ccurs an d
the PTMR register is reset to zero. The postscaler
selectio n bi ts m ay b e us ed i n thi s mode of th e timer t o
reduce the frequency of the interrupt events.
15.1.2 SINGLE-SHOT MODE
In the Single -Shot C ounti ng mode , t he PWM t ime b ase
begins counting upwards when the PTEN bit is set.
When the value in the PTMR register matches the
P TPER reg is ter, the P TM R regi st er w il l be res et o n th e
following input clock edge and the PTEN bit will be
cleared by the hardware to halt the time base.
When the PWM time base is in the Single-Shot mode
(PTMOD<1:0> = 01), an interrupt event is generated
when a match with the PTPER register occurs, the
PTMR register is reset to zero on the following input
clock edge, and the P TEN bit is cleared. The postscaler
selection bits have no effect in this mode of the timer.
15.1.3 CONTINUOUS UP/DOWN
COUNTING MODES
In the Continuous Up/Down Counting modes, the PWM
time bas e count s upwar ds until th e value in the PTPER
register is matched. The timer will begin counting
downwards on the following input clock edge. The
PTDIR bit in the PTCON SFR is read-only and indi-
cates the counting direction. The PTDIR bit is set when
the timer counts downwards.
In the Up/Down Counting mode (PTMOD<1:0> = 10),
an interrupt event is generated each time the value of
the PTMR register becomes zero and the PWM time
base begins to count upwards. The postscaler selec-
tion bit s may be used in this mode of the timer to reduce
the frequency of the interrupt events.
Note: If the Period register is set to 0x0000, the
timer will stop counting, and the interrupt
and the special event trigger will not be
generated, even if the special event value
is also 0x0000. The module will not update
the Period register if it is already at
0x0000; therefore, the user must disable
the module in order to update the Period
register.
dsPIC30F5015/5016
DS70149B-page 96 © 2006 Microchip Technology Inc.
15.1.4 DOUBLE UPDATE MODE
In the Double Update mode (PTMOD<1:0> = 11), an
inter rupt event is generated each time the PTM R regis-
ter is eq ual to zero, as well as each time a pe riod match
occur s. Th e postsc aler se lecti on bits ha ve no effect in
this mode of the timer.
The Do uble Update mo de provides two addition al func-
tions to the user. First, the control loop bandwidth is
doubled because the PWM duty cycles can be
updated, twice per period. Second, asymmetrical
center-aligned PWM waveforms can be generated,
which are useful for minimizing output waveform
distortion in certain motor control applications.
15.1.5 PWM TIME BASE PR ESCA LER
The input clock to PTMR (FOSC/4), has prescaler
options of 1:1, 1:4, 1:16, or 1:64, selected by control
bits PTCKPS<1:0> in the PTCON SFR. The prescaler
counter is cleared when any of the following occurs:
a write to the PTMR register
a write to the PTCON register
any devic e Re se t
PTMR is not cleared when PTCON is written.
15.1.6 PWM TIME BASE POSTSCALER
The match output of PTMR can optionally be post-
scaled through a 4-bit postscaler (which gives a 1:1 to
1:16 scaling).
The postscaler counter is cleared when any of the
following occurs:
a write to the PTMR register
a write to the PTCON register
any devic e Re se t
The PTMR register is not cleared when PTCON is written.
15.2 PWM Period
PTPER is a 15-bit register and is used to set the counting
period for the PWM time base. PTPER is a double-
buffered register. The PTPER buffer contents are loaded
into the PTPER register at the following instants:
Free-Running and Single-Shot modes: When the
PTMR register is reset to zero after a match with
the PTPER register.
Up/Down Counting modes: When the PTMR
register is zero.
The value held in the PTPER buffer is automatically
loaded into the PTPER register when the PWM time
base is disabled (PTEN = 0).
The PWM period can be determined using
Equation 15-1:
EQUATION 15-1: PWM PERIOD
If the PWM time base is configured for one of the Up/
Down Count modes, the PWM period is given by
Equation 15-2.
EQUATION 15-2: PWM PERIOD (UP/DOWN
MODE)
The maximum resolution (in bits) for a given device
oscillator and PWM frequency can be determined using
Equation 15-3:
EQUATION 15-3: PWM RESOLUTION
15.3 Edge-Aligned PWM
Edge-aligned PWM signals are produced by the module
when the PWM time base is in the Free-Running or
Single-Shot mode. For edge-aligned PWM outputs, the
output has a period specified by the value in PTPER
and a duty cycle specified by the appropriate Duty Cycle
register (see Figure 15-2). The PWM output is driven
active at the beginning of the period (PTMR = 0) and is
driven inactive when the value in the Duty Cycle register
matches PTMR.
If the value in a particular Duty Cycle register is zero,
then the output on the corresponding PWM pin will be
inactiv e for the entire PWM period. In additi on, the out-
put on the PWM pin will be active for the entire PWM
period if the value in the Duty Cycle register is greater
than the value held in the PTPER register.
FIGURE 15-2: EDGE-ALIGNED PWM
Note: Programming a value of 0x0001 in the
Period register could generate a continu-
ous interrupt pulse and hence, must be
avoided.
TPWM = TCY (PTPER + 1)
(PTMR Prescale Value)
TPWM = 2 • TCY • (PTPER + 1)
(PTMR Prescale Value)
Resolution = log (2 TPWM/TCY)
log (2)
Period
Duty Cycle
0
PTPER
PTMR
Value
New Duty Cycle Latched
© 2006 Microchip Technology Inc. DS70149B-page 97
dsPIC30F5015/5016
15.4 Center-Aligned PWM
Center-aligned PWM signals are produced by the
module when the PWM time base is configured in an
Up/Down Counting mode (see Figure 15-3).
The PWM compare output is driven to the active state
when the value of the Duty Cycle register matches the
value of PTMR and the PWM time base is counting
downwards (PTDIR = 1). The P W M co mpare ou tp ut is
driv en to the inacti ve st ate w hen t he PWM ti me bas e is
counting upwards (PTDIR = 0) and the value in the
PTMR register matches the duty cycle value.
If the value in a particular Duty Cycle register is zero,
then the output on the corresponding PWM pin will be
inactiv e for the en tire PWM p erio d. In add iti on, the out-
put on the PWM pin will be active for the entire PWM
period i f the value i n th e Duty Cycle re gis ter is equal to
the value held in the PTPER register.
FIGURE 15-3: CENTER- AL IGNE D PWM
15.5 PWM Duty Cycle Comparison
Units
There are four 16-bit Special Function Registers
(PDC1, PDC2, PDC3 and PDC4) used to specify duty
cycl e values fo r the PWM module.
The value in each Duty Cycle register determines the
amount of time that the PWM output is in the active
state. The Duty Cycle registers are 16 bits wide. The
LSb of a Duty Cycle register determines whether the
PWM edge occurs in the beginning. Thus, the PWM
resolution is effectively doubled.
15.5.1 DUTY CYCLE REGISTER BUFFERS
The four PWM Duty Cycle registers are double- buf fered
to allow glitchless updates of the PWM outputs. For each
duty cycle, there is a Duty Cycle register that is acce ssi-
ble by the user, and a second Duty Cycle register that
holds the actual compare value used in the present
PWM period.
For edge-aligned PWM output, a new duty cycle value
will be updated whenever a match with the PTPER reg-
ister occurs and PTMR is reset. The contents of the
duty cycle buffers are automatically loaded into the
Duty Cycle registers when the PWM time base is dis-
abled (PTEN = 0) and the UDIS bit is cleared in
PWMCON2.
When the PWM time base is in the Up/Down Counting
mode, new duty cycle values are updated when the
value of the PTMR register is zero and the PWM time
base b egins to c ount upwar ds. The co ntents o f the duty
cycle buffers are automatically loaded into the Duty
Cycle registers when the PWM time base is disabled
(PTEN = 0).
When the PWM time base is in the Up/Down Counting
mode with double updates, new duty cycle values are
updated when the value of the PTMR register is zero,
and when the value of the PTMR register matches the
value in the PTPER register. The contents of the duty
cycle buffers are automatically loaded into the Duty
Cycle registers when the PWM time base is disabled
(PTEN = 0).
15.5.2 DUTY CYCLE IMMEDIATE
UPDATES
When the Immediate Update Enable bit is set (IUE = 1),
any write to the Duty Cycle registers updates the new
duty cycle value immediately. This feature gives the
option to the user to allow immediate updates of the
active PWM Duty Cycle registers instead of waiting for
the end of the current time base period. System stabil-
ity is improved in closed-loop servo applications by
reducing the delay between system observation and
the issuance of system corrective commands when
immedi ate update s are ena ble d.
If the PWM output is active at the time the new duty
cycle is written, and the new duty c ycle is less tha n th e
current time base value, the PWM pulse width is
shortened.
If the PWM output is active at the time the new duty
cycle is written, and the new duty cycle is greater than
the current time base value, the PWM pulse width is
lengthened.
If the PWM output is inactive at the time the new duty
cycle is written, and the new duty cycle is greater than
the curren t ti me base valu e, th e PW M ou tput become s
active immediately and remains active for the new
written duty cycle value.
0
PTPER PTMR
Value
Period
Period/2
Duty
Cycle
dsPIC30F5015/5016
DS70149B-page 98 © 2006 Microchip Technology Inc.
15.6 Complementary PWM Operation
In the Complementary mode of operation, each pair of
PWM outputs is obtained by a complementary PWM
signal. A dead time may be optionally inserted during
device switching, when both outputs are inactive for a
short period (Refer to Section 15.7 “Dead-Time
Generators”).
In Complementary mode, the duty cycle comparison
units are assigned to the PWM outputs as follows:
PDC1 register controls PWM1H/PWM1L outputs
PDC2 register controls PWM2H/PWM2L outputs
PDC3 register controls PWM3H/PWM3L outputs
PDC4 register controls PWM4H/PWM4L outputs
The Complementary mode is selected for each PWM
I/O pin pair by clearing the appropriate PMODx bit in the
PWMCON1 SFR. The PWM I/O pins are set to
Complementary mode by default upon a device Reset.
15.7 Dead-Time Generators
Dead-time gene ration m ay be provided when an y o f the
PWM I/O pin pairs are operating in the Complementary
Output mode. The PWM output s use Push-Pull drive cir-
cuits. Due to the inability of the power output devices to
switch instantaneously, some amount of time must be
provided between the turn off event of one PWM output
in a complementary pair and the turn on event of the
other transistor.
The PWM mod ule allows two dif ferent dead times to be
programmed. These two dead times may be used in
one of two methods described below to increase user
flexibility:
The PWM output signals can be optimized for
different turn off times in the high side and low
side transistors in a complementary pair of tran-
sistors. The first dead time is inserted between
the turn off event of the lower transistor of the
complementary pair and the turn on event of the
upper transistor. The second dead time is
inserted between the turn off event of the upper
transistor and the turn on event of the lower tran-
sistor.
The two dea d tim es can be assi gne d to individua l
PWM I/O pin pairs. This operating mode allows
the PWM module to drive different transistor/load
combin ati ons w it h ea ch complemen tary PWM I/O
pin pair.
15.7.1 DEAD-TIME GENERATORS
Each complementary output pair for the PWM module
has a 6-bit down counter that is used to produce the
dead-time insertion. As shown in Figure 15-4, each
dead-time unit has a rising and falling edge detector
connected to the duty cycle comparison output.
15.7.2 DEAD-TIME ASSIGNMENT
The DTCON2 SFR contains control bits that allow the
dead times to be assigned to each of the complemen-
tary outputs. Table 15-1 summarizes the function of
each dead-time selection control bit.
TABLE 15-1: DEAD-TIME SELECTION BITS
15.7.3 DEAD-TIME RANGES
The amount of dead time provided by each dead-time
unit is selected by specifying the input clock prescaler
value and a 6-bit unsigned value. The amount of dead
time provided by each unit may be set independently.
Four input clock prescaler selections have been pro-
vided to allow a su itable range of dead times, bas ed on
the device operating frequency. The clock prescaler
option may be selected independently for each of the
two dead-time values. The dead-time clock prescaler
values are selected using the DTAPS<1:0> and
DTBPS<1:0> control bits in the DTCON1 SFR. One of
four clock prescaler options (TCY, 2 TCY, 4 TCY or 8
TCY) may be s elected for e ach of the dea d-time values .
After the prescaler values are selected, the dead time
for each unit is adjusted by loading two 6-bit unsigned
values into the DTCON1 SFR.
The dead-time unit prescalers are cleared on the
following events:
On a load of the down timer due to a duty cycle
comparison edge event.
On a write to the DTCON1 or DTCON2 registers.
On any device Reset.
Bit Function
DTS1A Selects PWM1L/PWM1H active edge dead time.
DTS1I Selects PWM1L/PWM1H inactive edge
dead time.
DTS2A Selects PWM2L/PWM2H active edge dead time.
DTS2I Selects PWM2L/PWM2H inactive edge
dead time.
DTS3A Selects PWM3L/PWM3H active edge dead time.
DTS3I Selects PWM3L/PWM3H inactive edge
dead time.
DTS4A Selects PWM4L/PWM4H active edge dead time.
DTS4I Selects PWM4L/PWM4H inactive edge
dead time.
Note: The user should not modify the DTCON1
or DTCON2 values while the PWM mod-
ule is operating (PTEN = 1). Unexpected
results may occur.
© 2006 Microchip Technology Inc. DS70149B-page 99
dsPIC30F5015/5016
FIGURE 15-4: DEAD-TIME TIMING DIAGRAM
15.8 Independent PWM Output
An Independent PWM Output mode is required for
driving certain types of loads. A particular PWM output
pair is in the Independent Output mode when the cor-
respond ing PM OD bi t in the PW MCO N1 regi ster i s se t.
No dead-time control is implemented between adjacent
PWM I/O pins when the module is operating in the
Indepen dent mode and b oth I/O pin s a r e al lowe d to b e
active simultaneously.
In the Ind ependent mod e, e ach du ty c yc le gen era tor i s
connected to both of the PWM I/O pins in an output
pair. By using the associated Duty Cycle register and
the appropriate bits in the OVDCON register, the user
may select the following signal output options for each
PWM I/O pin operating in the Independent mode:
I/O pin outputs PWM signal
I/O pi n inactive
I/O pin active
15.9 Single-Pulse PWM Operation
The PWM modu le pro duces sin gle-pu lse o utput s whe n
the P TCON co ntrol bits PTMOD<1: 0> = 10. Only edge-
aligned outputs may be produced in the Single-Pulse
mode. In Single-Pulse mode, the PWM I/O pin(s) are
driven to the active state when the PTEN bit is set.
When a match with a Duty Cycle register occurs, the
PWM I/O pin is driven to the inactive state. When a
match with the PTPER register occurs, the PTMR reg-
ister is cleared, all active PWM I/O pins are driven to
the inactive state, the PTEN bit is cleared and an
inter rupt is genera ted .
15.10 PWM Output Override
The PWM output override bits allow the user to manu-
ally drive the PWM I/O pins to specified logic states,
independent of the duty cycle comparison units.
All control bits associated with the PWM output over-
ride function are contained in the OVDCON register.
The up p er ha l f of th e OVD C ON r eg is ter co ntai ns ei gh t
bits , POVDxH<4:1> and POVDxL<4 :1>, that de termine
which PWM I/O pins will be overridden. The lower half
of the OVDCON register contains eight bits,
POUTxH<4:1> and POUTxL<4:1>, that determine the
state of the PWM I/O pins when a particular output is
overridden via the POVD bits.
15.10.1 COMPLEMENTARY OUTPUT MODE
When a PWMxL pin is driven active via the OVDCON
register, the output signal is forced to be the comple-
ment of the corresponding PWMxH pin in the pair.
Dead-time insertion is still performed when PWM
channel s are overridden manu all y.
15.10.2 OVERRIDE SYNCHRONIZATION
If the OSYNC bit in the PWMCON2 register is set, all
output overrides performed via the OVDCON register
are sync hro ni zed to the PWM tim e b ase. Sy nc hron ou s
output overrides occur at the following times:
Edge-Aligned mode, when PTMR is zero.
Center-Aligned modes, when PTMR is zero and
when the value of PTMR matches PTPER.
Duty Cycle Generator
PWMxH
PWMxL
Time selected by DTSxA bit (A or B) Time selected by DTSxI bit (A or B)
dsPIC30F5015/5016
DS70149B-page 100 © 2006 Microchip Technology Inc.
15.11 PWM Output and Polarity Control
There are three device Configuration bits associated
with the PWM module that provide PWM output pin
control:
HPOL Configuration bit
LPOL Configuration bit
PWMPIN Configuration bit
These th ree b its in the F P ORBO R C on figu r ati on re gi s-
ter (see Section 20.0 “System Integration”) work in
conjunction with the four PWM Enable bits
(PWMEN<4:1>) located in the PWMCON1 SFR. The
Config uration bit s and PWM en able bits ensure tha t the
PWM pins are in th e correct sta tes after a device Reset
occurs. The PWMPIN configuration fuse allows the
PWM module outputs to be optionally enabled on a
device Reset. I f PWMPIN = 0, the PWM ou tput s will b e
driv en to t he i r i n ac ti v e sta t es at Re se t . If P WM P IN = 1
(default) , the PWM outputs wi ll be tri-stated. The HPOL
bit specifies the polarity for the PWMxH outputs,
whereas the LPOL bit specifies the polarity for the
PWMxL outputs.
15.11.1 OUTPUT PIN CONTROL
The PEN<4:1>H and PEN<4:1>L control bits in the
PWMCON1 SFR enable each high PWM output pin
and each low PWM output pin, respectively. If a partic-
ular PWM output pin is not enabled, it is treated as a
general purpose I/O pin.
15.12 PWM FAULT Pins
There are two Fault pins (FLTA and FLTB) associated
with the PWM module. When asserted, these pins can
optionally drive each of the PWM I/O pins to a defined
state.
15.12.1 FAULT PIN ENABLE BITS
The FLTACON and FLTBCON SFRs ea ch ha ve 4 con-
trol bits that determine whether a particular pair of
PWM I/O pi ns i s to b e co ntro lle d by the Fa ul t inp ut pi n.
To enable a specific PWM I/O pin pair for Fault over-
rides, the corresponding bit should be set in the
FLTACON or FLTBCON re gister.
If all enable bits are cleared in the FLTACON or
FLTBCON registers, then the corresponding Fault
input pi n has no ef fec t on the PWM m odule and th e pin
may be used as a general purpose interrupt or I/O pin.
15.12.2 FAULT STATES
The FLTACON and FLTBCON Special Function Reg-
isters ha ve 8 bi ts e ach tha t determ ine the sta te of each
PWM I/O pin when it is overridden by a Fault input.
When the se bi ts are c leared , the PW M I/O pin is drive n
to the inactive state. If the bit is set, the PWM I/O pin
will be driven to the active state . The active and inactive
states are referenced to the polarity defined for each
PWM I/O pin (HPOL and LPOL polarity control bits).
A special case exists when a PWM module I/O pair is
in the Complementary mode and both pins are pro-
grammed to be active on a Fault condition. The
PWMxH pin always has priority in the Complementary
mode, so that both I/O pins cannot be driven active
simultaneously.
15.12.3 FAULT PIN PRIORITY
If bot h Fault input p ins have be en assig ned to c ontrol a
parti cular PWM I/O pin , the Fault st ate pr ogrammed for
the Fault A input pin will take priority over the Fault B
input pin.
15.12.4 FAULT INPUT MODES
Each of the Fault input pins has two modes of
operation:
Latched Mode: When the Fault pin is driven low,
the PWM outputs will go to the states defined in
the FLTACON/FLTBCON register. The PWM out-
puts will remain in this state until the Fault pin is
driven high and the corresponding interrupt flag
has bee n cle ared i n soft ware. When b oth of these
actions have occurred, the PWM outputs will
return to normal operation at the beginning of the
next PWM cycle or half-cycle boundary. If the
interrupt flag is cleared before the Fault condition
ends, th e PWM m odule will w ait unti l the F ault pi n
is no longer asserted, to restore the outputs.
Cycle-by-Cycle Mode: When the Fault input pin
is driven low, the PWM outputs remain in the
defined Fault states for as long as the Fault pin is
held low. After the Fault pin is driven high, the
PWM outputs return to normal operation at the
beginning of the following PWM cycle or
half-cycle boundary.
The opera ting mod e for each Fault inp ut pin is selecte d
using the FLTAM and FLTBM control bits in the
FLTACON and FLTBCON Special Function Registers.
Each of the Fault pins can be controlled manually in
software.
Note: The Fault pin logic can operate indepen-
dent of the PWM logic. If al l the enable bit s
in the FLTACON/FLTBCON registers are
cleared, then the Fault pin(s) could be
used as general purpose interrupt pin(s).
Each Fault pin has an interrupt vector,
interrupt flag bit and interrupt priority bits
associat ed with it.
© 2006 Microchip Technology Inc. DS70149B-page 101
dsPIC30F5015/5016
15.13 PWM Update Lockout
For a comple x PWM appl ica tion, the user may nee d to
write up to fou r Duty Cyc le registers and the T ime Base
Period register, PTPER, at a given ti me . In some appl i-
cations , it is import ant that all buff er registers be writte n
befor e the new duty cycle and p eriod values are loaded
for use by the module.
The PWM update lockout feature is enabled by setting
the UDIS control bit and clearing the IUE control bit in
the PWMCON2 SFR. The UDIS bit affects all Duty
Cycle Buffer registers and the PWM time base period
buffer, PTPER. No duty cycle changes or period value
changes will have effect while UDIS = 1.
If the IUE bit is set, any change to the Duty Cycle reg-
isters is immediate ly updated regardl ess of the bit state
of the UDI. The PWM Period register update (PTPER)
is not affected by the IUE control bit.
15.14 PWM Special Event Trigger
The PWM module has a special event trigger that
allows A/D conversions to be synchronized to the PWM
time bas e. The A/D sa mplin g an d convers ion ti me ma y
be programmed to occur at any point within the PWM
period. The special event trigger allows the user to min-
imize th e delay betwee n the time whe n A/D conversio n
results are acquired and the time when the duty cycle
value is updat ed.
The PWM special event trigger has an SFR named
SEVTCMP, and five contro l bit s to control it s o peratio n.
The PTMR value for which a special event trigger
should occur is loaded into the SEVTCMP register.
When the PWM time base is in an Up/Down Counting
mode, an addi tional c ontrol b it is r equired t o sp ecify th e
counting phase for the special event trigger. The count
phase is selected using the SEVTDIR control bit in the
SEVTCMP SFR. If the SEVTDIR bit is cleared, the spe-
cial event trigger will occur on the upward counting
cycle of the PWM time base. If the SEVTDIR bit is set,
the special event trigger will occur on the downward
count cycle of the PWM time base. The SEVTDIR
control bit has no effect unless the PWM time base is
configured for an Up/Down Counting mode.
15.14.1 SPECIAL EVENT TRIGGER
POSTSCALER
The PWM special event trigger has a postscaler that
allows a 1:1 to 1:16 postscale ratio. The postscaler is
configured by writing the SEVOPS<3:0> control bits in
the PWMCON2 SFR.
The special event output postscaler is cleared on the
following events:
Any write to the SEVTCMP register
Any devi ce Reset
15.15 PWM Operation During CPU Sleep
Mode
The Fault A and Fault B input pins have the ability to
wake the CPU from Sleep mode. The PWM module
generates an interrupt if either of the Fault pins is
driven low while in Sleep.
15.16 PWM Operation During CPU Idle
Mode
The PTCON SFR contains a PTSIDL control bit. This
bit determines if the PWM module will continue to
operate or stop when the device enters Idle mode. If
PTSIDL = 0, the module will continue to operate. If
PT S IDL = 1, the module will stop operation as long as
the CPU remains in Idle mode.
dsPIC30F5015/5016
DS70149B-page 102 © 2006 Microchip Technology Inc.
TABLE 15-2: 8-OUTPUT PWM REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 1 0 Bit 9 B it 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Rese t Sta te
PTCON 01C0 PTEN —PTSIDL——— PTOPS<3:0> PTCKPS<1:0> PTMOD<1:0> 0000 0000 0000 0000
PTMR 01C2 PTDIR PWM Timer Count Value 0000 0000 0000 0000
PTPER 01C4 PWM Time Base Period Register 0111 1111 1111 1111
SEVTCMP 01C6 SEVTDIR PWM Special Event Compare Register 0000 0000 0000 0000
PWMCON1 01C8 —— PTMOD4 PTMOD3 PTMOD2 PTMOD1 PEN4H PEN3H PEN2H PEN1H PEN4L PEN3L PEN2L PEN1L 0000 0000 1111 1111
PWMCON2 01CA —— SEVOPS<3:0> IUE OSYNC UDIS 0000 0000 0000 0000
DTCON1 01CC DTBPS<1:0> Dead-Time B Value DTAPS<1:0> Dead-Time A Value 0000 0000 0000 0000
DTCON2 01CE —————— DTS4A DTS4I DTS3A DTS3I DTS2A DTS2I DTS1A DTS1I 0000 0000 0000 0000
FLTACON 01D0 FAOV4H FAOV4L FAOV3H FAOV3L FAOV2H FAOV2L FAOV1H FAOV1L FLTAM FAEN4 FAEN3 FAEN2 FAEN1 0000 0000 0000 0000
FLTBCON 01D2 FBOV4H FBOV4L FBOV3H FBOV3L FBOV2H FBOV2L FBOV1H FBOV1L FLTBM FBEN4 FBEN3 FBEN2 FBEN1 0000 0000 0000 0000
OVDCON 01D4 POVD4H POVD4L POVD3H POVD3L POVD2H POVD2L POVD1H POVD1L POUT4H POUT4L POUT3H POUT3L POUT2H POUT2L POUT1H POUT1L 1111 1111 0000 0000
PDC1 01D6 PWM Duty Cycle #1 Register 0000 0000 0000 0000
PDC2 01D8 PWM Duty Cycle #2 Register 0000 0000 0000 0000
PDC3 01DA PWM Duty Cycle #3 Register 0000 0000 0000 0000
PDC4 01DC PW M Duty Cycle #4 Register 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
© 2006 Microchip Technology Inc. DS70149B-page 103
dsPIC30F5015/5016
16.0 SPI MODULE
The Serial Peripheral Interface (SPI) module is a syn-
chronou s serial inte rface. It is usefu l for commun icating
with other peripheral devices such as EEPROMs, shift
registers, display drivers and A/D converters, or other
microcontrollers. It is compatible with Motorola’s SPI
and SIOP interfaces.
16.1 Operating Function Description
Each SPI module consists of a 16-bit Shift register,
SPIxSR (where x = 1 or 2), used for shifting data in
and out, and a Buffer register, SPIxBUF. A Control
register, SPIxCON, configures the module. Addition-
ally, a status register, SPIxSTAT, indicates various
st at us co ndi tions.
The serial interface consists of 4 pins: SDIx (serial
data input), SDOx (serial data output), SCKx (shift
clock input or output), and SSx (active-low slave
select).
In Master mode operation, SCK is a clock output, but
in Slave mode, it is a clock input.
A series of eight (8) or sixteen (16) clock pulses shifts
out bits from the SPIxSR to SDOx pin and simulta-
neously shifts in data from SDIx pin. An interrupt is
generated when the transfer is complete and the
corresponding Interrupt Flag bit (SPI1IF or SPI2IF) is
set. This interru pt ca n be dis ab led throu gh an Interru pt
Enable bit (SPI1IE or SPI2IE).
The receive operation is double-buffered. When a
complete byte is received, it is transferred from
SPIxSR to SPIxBUF.
If the receive buffer is full when new data is being
transferred from SPIxSR to SPIxBUF, the module will
set the SPIROV bit, indicating an overflow condition.
The transfer of the data from SPIxSR to SPIxBUF will
not be completed and the new data will be lost. The
module will not respond to SCL transitions while
SPIROV is ‘1’, effectively disabling the module until
SPIxBUF is read by user software.
Transmit writes are also double-buffered. The user
writes to SPIxBUF. When the master or slave transfer
is completed, the contents of the Shift register
(SPIxSR) is moved to the receive buffer. If any trans-
mit data has been written to the Buffer register, the
contents of the transmit buffer are moved to SPIxSR.
The received data is thus placed in SPIxBUF and the
transmit data in SPIxSR is ready for the next transfer.
In Master mode, the clock is generated by prescaling
the system clock. Data is transmitted as soon as a
value is written to SPIxBUF. The interrupt is generated
at the middle of the transfer of the last bit.
In Slave mode, data is transmitted and received as
external clock pulses appear on SCK. Again, the inter-
rupt is generated when the last bit is latched. If SSx
control is enabled, then transmission and reception
are enabled only when SSx = low. The SDOx output
will be disabled in SSx mode with SSx high.
The clock provided to the module is (FOSC/4). This
clock is then prescaled by the primary (PPRE<1:0>)
and the secondary (SPRE<2:0>) prescale factors. The
CKE bit determines whether transmit occurs on transi-
tion from active clock state to Idle clock state, or vice
versa. The CKP bit selects the Idle state (high or low)
for the clock.
16.1.1 WORD AND BYTE
COMMUNICATION
A control bit, MODE16 (SPIxCON<10>), allows the
module to communicate in either 16-bit or 8-bit mode.
16-bit operation is identical to 8-bit operation, except
that the number of bits transmitted is 16 instead of 8.
The user software must disable the module prior to
changing the MODE16 bit. The SPI module is reset
when the MODE16 bit is changed by the user.
A basic dif ference betwee n 8-bit and 16-bit operat ion is
that the data is transmitted out of bit 7 of the SPIxSR for
8-bit operation, and data is transmitted out of bit 15 of
the SPIxSR for 16-bit opera tion. In both mode s, dat a is
shifted into bit 0 of the SPIxSR.
16.1.2 SDOx DISABLE
A control bit , DISSDO, is provided to the SPIxCON reg-
ister to allow the SDOx output to be disabled. This will
allow the SPI module to be connected in an input only
configuration. SDO can also be used for general
purpose I/O.
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
Note: The user must perform reads of SPIxBUF
if the module is used in a transmit only
configuration to avoid a receive overflow
conditi on (SPIRO V = 1).
Note: Both the transmit buffer (SPIxTXB) and
the receive buffer (SPIxRXB) are mapped
to the same register address, SPIxBUF.
dsPIC30F5015/5016
DS70149B-page 104 © 2006 Microchip Technology Inc.
FIGURE 16-1: SPI BLOCK DIAGRAM
FIGURE 16-2: SPI MASTER/SLAVE CONNECTION
Note: x = 1 or 2.
Read Write
Internal
Data Bus
SDIx
SDOx
SSx
SCKx
SPIxSR
SPIxBUF
bit 0
Shift
clock Edge
Select
FCY
Primary
1, 4, 16, 64
Enable Master Clock
Prescaler
Secondary
Prescaler
1:1-1:8
SS & FSYNC
Control
Clock
Control
Transmit
SPIxBUF
Receive
Serial Input Buffer
(SPIxBUF)
Shift Register
(SPIxSR)
MSb LSb
SDOx
SDIx
PROCESSOR 1
SCKx
SPI Master
Serial Input Buffer
(SPIyBUF)
Shift Register
(SPIySR)
LSb
MSb
SDIy
SDOy
PROCESSOR 2
SCKy
SPI Slav e
Serial Clock
Note: x = 1 or 2, y = 1 or 2.
© 2006 Microchip Technology Inc. DS70149B-page 105
dsPIC30F5015/5016
16.2 Framed SPI Support
The module supports a basic framed SPI protocol in
Master or Sla ve mode. The contro l bit FRMEN ena bles
framed SPI supp ort and c auses the SSx pin to p erform
the frame synchronization pulse (FSYNC) function.
The control bit, SPIFSD, determines whether the SSx
pin is an input or an output (i.e., whether the module
receives or generates the frame synchronization
pulse). The frame pulse is an active-high pulse for a
single SPI clock cycle. When frame synchronization is
enabled, the data transmission starts only on the
subsequent transmit edge of the SPI clock.
16.3 Slave Select Synchronization
The SSx pin allows a Synchronous Slave mode. The
SPI must be configured in SPI Slave mode, with SSx
pin control enabled (SSEN = 1). When the SSx pin is
low, transmission and reception are enabled, and the
SDOx pin is driven. When SSx pin goes high, the SDOx
pin is no longer driven. Also, the SPI module is re-
synchronized, and all counters/control circuitry are
reset. Therefore, when the SSx pin is asserted low
again, transmission/reception will begin at the MSb,
even if SSx had been deasserted in the middle of a
transmit/receive.
16.4 SPI Operation During CPU Sleep
Mode
During Sleep mod e, the SPI modu le is shut down. If the
CPU enters Sleep mode while an SPI transaction is in
progress, then the transmission and reception is
aborted.
The transmitter and receiver will stop in Sleep mode.
However, register contents are not affected by
entering or exiting Sleep mode.
16.5 SPI Operation During CPU Idle
Mode
When the device enters Idle mode, all clock sources
remain functional. The SPISIDL bit (SPIxSTAT<13>)
selects if the SPI module will stop or continue on Idle.
If SPISIDL = 0, the module will continue to operate
when the CPU enters Idle mode. If SPISIDL = 1, the
module will stop when the CPU enters Idle mode.
dsPIC30F5015/5016
DS70149B-page 106 © 2006 Microchip Technology Inc.
TABLE 16-1: SPI1 REGISTER MAP
TABLE 16-2: SPI2 REGISTER MAP
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
SPI1STAT 0220 SPIEN SPISIDL SPIROV SPITBF SPIRBF 0000 0000 0000 0000
SPI1CON 0222 FRMEN SPIFSD DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 0000 0000 0000
SPI1BUF 0224 Transmit and Receive Buffer 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
SPI2STAT 0226 SPIEN SPISIDL SPIROV SPITBF SPIRBF 0000 0000 0000 0000
SPI2CON 0228 FRMEN SPIFSD DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 0000 0000 0000
SPI2B UF 022 A Transmit and Receive Buffer 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
© 2006 Microchip Technology Inc. DS70149B-page 107
dsPIC30F5015/5016
17.0 I2C MODULE
The Inter-Integrated Circuit (I2C) module provides
complete hardware support for both Slave and Multi-
Master modes of the I2C serial communication
standard, with a 16-bit interface.
This module offers the following key features:
•I
2C interface supporting both Master and Slave
operation.
•I
2C Slave mode supports 7 and 10-bit address.
•I
2C Master mode supports 7 and 10-bit address.
•I
2C port allows bidirectional transfers between
master and slav es.
Serial clock synchronization for I2C port can be
used as a ha ndshake mechanis m to suspen d and
resume serial transfer (SCLREL control).
•I
2C supports Multi-Master operation; detects bus
collision and will arbitrate accordingly.
17.1 Operating Function Description
The hardw are fully im plements all the maste r and slave
functions of the I2C Standard and Fast mode
specifications, as well as 7 and 10-bit addressing.
Thus, the I2C module can operate either as a slave or
a master on an I2C bus.
17.1.1 VARIOUS I2C MODES
The following types of I2C operation are supported:
•I
2C Slave operation with 7-bit address
•I
2C Slave operation with 10-bit address
•I
2C Master operation with 7 or 10-bit address
See the I2C programmer’s model in Figure 17-1.
17.1.2 PIN CONFIGURATION IN I2C MODE
I2C has a 2- pin i nterfac e; pin SCL is clock and pin SD A
is data.
FIGURE 17-1: PROGRAMMERS MODEL
17.1.3 I2C REGISTERS
I2CCON and I2 CSTAT are con trol a nd st at us regis ters,
respect ively . The I2CCO N register is readable an d writ-
able. The lower 6 bits of I2CSTAT are read-only. The
remaining bits of the I2CSTAT are read/write.
I2CRSR is the Shift register used for shifting data,
whereas I2CRCV is the Buffer register to which data
bytes are written, or from which data bytes are read.
I2CRCV is the Receive buffer, as shown in Figure 16-1.
I2CTRN is the Transmit register to which bytes are writ-
ten during a transmit operation, as s hown in Figure 16-2.
The I2C ADD registe r holds the slave ad dress. A Status
bit, ADD10, indicates 10-bit Address mode. The
I2CBRG acts as the Baud Rate Generator (BRG)
reload value.
In receive operations, I2CRSR and I2CRCV together
form a double -buf fered re ceiver. Whe n I2CRS R receiv es
a complete byte, i t is transferred to I 2CRCV and an inter-
rupt pulse is generated. During transmission, the
I2CTRN is not doub le-bu ff ered.
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
bit 7 bit 0 I2CRCV (8 bits)
bit 7 bit 0 I2CTRN (8 bits)
bit 8 bit 0 I2CBRG (9 bits)
bit 15 bit 0 I2CCON (16 bits)
bit 15 bit 0 I2CSTAT (16 bits)
bit 9 bit 0 I2CADD (10 bits)
Note: Following a Restart condition in 10-bit
mode, the user only needs to match the
first 7-bit addre ss.
dsPIC30F5015/5016
DS70149B-page 108 © 2006 Microchip Technology Inc.
FIGURE 17-2: I2C™ BLOCK DIAGRAM
I2CRSR
I2CRCV
Internal
Data Bus
SCL
SDA
Shift
Mat ch Detect
I2CADD
Start and
Stop bit Detect
Clock
Addr_Match
Clock
Stretching
I2CTRN LSB
Shift
Clock
Write
Read
BRG Down I2CBRG
Reload
Control
FCY
Start, Restart,
Stop bit Generate
Write
Read
Acknowledge
Generation
Collision
Detect
Write
Read
Write
Read
I2CCON
Write
Read
I2CSTAT
Control Logic
Read
LSB
Counter
© 2006 Microchip Technology Inc. DS70149B-page 109
dsPIC30F5015/5016
17.2 I2C Module Addresses
The I2CADD register contains the Slave mode
addresses. The register is a 10-bit register.
If the A10M bit (I2CCON<10>) is ‘0’, the address is
inter prete d by the mo dul e as a 7 - bit add ress . When an
address is re ceived, i t is c ompa red to the 7 LSbs of the
I2CADD register.
If the A10M bit is 1 , the ad dress is assume d to b e a
10-bit address. When an address is received, it is
compared with the binary value ‘1 1 1 1 0 A9 A8
(where A9, A8 are two Most Significant bits of
I2CADD). If that value matches, the next address is
compared with the Least Significant 8 bits of I2CADD,
as specified in the 10-bit addressing protocol.
TABLE 17-1: 7-BIT I2C SLAVE ADDRESSES
SUPPORTED BY DSPIC30F
17.3 I2C 7-bit Slave Mode Operation
Once enabled (I2CEN = 1), the slave module will wait
for a Start bit to occur (i.e., the I2C module is ‘Idle’).
Following the detection of a Start bit, 8 bits are shifted
into I2CRSR and the address is compared against
I2CADD. In 7-bit mode (A10M = 0), bits I2CADD<6:0>
are compared against I2CRSR<7:1> and I2CRSR<0>
is the R_W bit. All incoming bits are sampled on the
rising edge of SCL.
If an address match occurs, an Acknowledgement will
be sent, and the Slave Event Interrupt Flag (SI2CIF) is
set on the falling edge of the ninth (ACK) bit. The
address match does not affect the contents of the
I2CRCV buffer or the RBF bit.
17.3.1 SLAVE TRANSMISSION
If the R_W bit received is a ‘1’, then the serial port will
go into Transmit mode. It wil l send ACK on the nin th bit
and then hold SCL to ‘0’ until the CPU responds by
writing to I2CTRN. SCL is released by setting the
SCLREL b it, and 8 bits of dat a are s hifted ou t. Dat a bit s
are shifted out on the falling edge of SCL, such that
SDA is val id during SCL hi gh (see timi ng diagram). The
interrupt pulse is sent on the falling edge of the ninth
clock pulse, regardless of the status of the ACK
received from the master.
17.3.2 SL AV E RECEP TI ON
If the R_W bit received is a ‘0’ during an address
match, then Receive mode is initiated. Incoming bits
are sa mpl ed on the risi ng ed ge of SCL . After 8 bi t s are
received, if I2CRCV is not full or I2COV is not set,
I2CRSR is transferred to I2CRCV. ACK is sent on the
ninth clock.
If the RBF flag is set, indicating that I2CRCV is still
holding data from a pre vious operati on (RBF = 1), the n
ACK is not sent; however, the interrupt pulse is gener-
ated. In the case of an overflow, the contents of the
I2CRSR are not loaded into the I2CRCV.
17.4 I2C 10-bit Slave Mode Operation
In 10-bit mode, the basic receive and transmit opera-
tions are the same as in the 7-bit mode. However, the
criteria for address match is more complex.
The I2C specification dictates that a slave must be
address ed for a write ope ration, with tw o address byte s
following a Start bit.
The A10M bit is a control bit that signifies that the
address in I2CADD is a 10-bit address rather than a
7-bit address. The address detection protocol for the
first byte of a message address is identical for 7-bit
and 10-bit messages, but the bits being compared are
different.
I2CADD holds the entire 10-bit address. Upon receiv-
ing an address following a Start bit, I2CRSR <7:3> is
compared against a literal ‘11110’ (the default 10-bit
address) and I2CRSR<2:1> are compared against
I2CADD<9:8>. If a match occurs and if R_W = 0, the
interrupt pu lse is sent. Th e ADD10 bit will be cleare d to
indicate a partial address match. If a match fails or
R_W = 1, the ADD10 bit is cleared and the module
returns to the Idle state.
The low byte of the address is then received and com-
pared with I2CADD<7:0>. If an address match occurs,
the interrupt pulse is generated and the ADD10 bit is
set, indicating a complete 10-bit address match. If an
address match did not occur, the ADD10 bit is cleared
and the module returns to the Idle state.
0x00 General call address or start byte
0x01-0x03 Reserved
0x04-0x07 Hs mode Master codes
0x08-0x77 Valid 7-bit addresses
0x78-0x7b Valid 10-bit addresses
(lower 7 bit s)
0x7c-0x7f Reserved
Note: The I2CRCV will be loaded if the I2COV
bit = 1 and the RBF flag = 0. In this case,
a read of the I2CRCV was performed, but
the user did not clear the state of the
I2COV bit before the next receive
occurred. The Acknowledgement is not
sent (ACK = 1) and the I2CRCV is
updated.
dsPIC30F5015/5016
DS70149B-page 110 © 2006 Microchip Technology Inc.
17.4.1 10-BIT MODE SLAVE
TRANSMISSION
Once a slave is addressed in this fashion, with the full
10-bit address (we will refer to this state as
“PRIOR_ADDR_MATCH”), the master can begin
sending data bytes for a slave reception operation.
17.4.2 10-BIT MODE SLAVE R ECEPTION
Once ad dress ed, the ma ster ca n genera te a Rep eated
Start, reset the high byte of the address and set the
R_W bit without generating a Stop bit, thus initiating a
slave tran sm it ope ratio n.
17.5 Automatic Clock Stretch
In the sla ve mod es, the modul e ca n synchro nize b uf fer
reads and write to the master device by clock
stretching.
17.5.1 T RANSMI T CLOCK STRETCHING
Both 10-bit and 7-bit transmit modes implement clock
stretching by asserting the SCLREL bit after the falling
edge of the ninth clock if the TBF bit is cleared,
indicating the buffer is empty.
In slave transmit modes, clock stretching is always
performed, irrespective of the STREN bit.
Clock synchronization takes place following the ninth
clock of the transmit sequence. If the device samples
an ACK on the fa lling edge o f the ni nth cl ock, a nd if th e
TBF bit is still clear, then the SCLREL bit is automati-
cally cleared. The SCLREL being cleared to ‘0’ will
assert the SCL line low. The user s ISR must set the
SCLREL bit before transmission is allowed to con-
tinue. By ho ldi ng the SC L l ine lo w, the user has tim e to
service the ISR and load the contents of the I2CTRN
before the master device can initiate another transmit
sequence.
17.5.2 REC EIVE CLOCK STRETCHING
The STREN bit in the I2CCON register can be used to
enable clock stretching in Slave Receive mode. When
the STREN bit is set, the SCL pin will be held low at
the end of each data receive sequence.
17.5.3 CLOCK STRETCHING DURING
7-BIT ADDRESSING (STREN = 1)
When the STREN bit is set in Slave Receive mode,
the SCL lin e is held low when the Buffer regis ter is ful l.
The method for stretching the SCL output is the same
for both 7 and 10-bit addressing modes.
Clock stretching takes place following the ninth clock of
the receive sequence. On the falling edge of the ninth
clock at the end of the ACK sequence, if the RBF bit is
set, the SCLREL bit is automatically cleared, forcing the
SCL output to be held low. The user ’s ISR must set the
SCLREL bit before reception is allowed to continue. By
holding the SCL line low, the user has time to service
the ISR and read the contents of the I2CRCV before the
master device can initiate another receive sequence.
This will prevent buffer ov erruns from occ urring.
17.5.4 CLOCK STRETCHING DURING
10-BIT ADDRESSING (STREN = 1)
Clock stretching takes place automatically during the
addressing sequence. Because this module has a
register for the entire address, it is not necessary for
the protocol to wait for the address to be updated.
After the address phase is complete, clock stretching
will occur on each data receive or transmit sequence
as was described earlier.
17.6 Software Controlled Clock
Stretching (STREN = 1)
When the STREN bit is ‘1’, the SCLREL bit may be
cleared by software to allow software to control the
clock stretching. The logic will synchronize writes to
the SCLREL bit with the SCL clock. Clearing the
SCLREL bit will not assert the SCL output until the
module detects a falling edge on the SCL output and
SCL is sampled low. If the SCLREL bit is cleared by
the user while the SCL line has been sampled low, the
SCL output will be asserted (held low). The SCL out-
put will remain low until the SCLREL bit is set, and all
other devices on the I2C bus have deasserted SCL.
This ensures that a write to the SCLREL bit will not
violate the minimum high time requirement for SCL.
If the STREN bit is ‘0’, a software write to the SCLREL
bit will be disregarded and have no effect on the
SCLREL bit.
Note 1: If the user loads the contents of I2CTRN,
setting the TBF bit before the fallin g edge
of the n int h c lo ck , th e SC LREL bit w il l n ot
be cleared and clock stretching will not
occur.
2: The SCLREL bit can be set in software,
regardless of the state of the TBF bit.
Note 1: If the user reads the contents of the
I2CRCV, clearing the RBF bit before the
falling edge of the ninth clock, the
SCLREL bit will not be cleared and clock
stretching will not occur.
2: The SCLREL bit can be set in software,
regardles s of the state of the RBF bit. The
user should be careful to clear the RBF bit
in the ISR before the next receive
sequence in order to prevent an overflow
condition.
© 2006 Microchip Technology Inc. DS70149B-page 111
dsPIC30F5015/5016
17.7 Interrupts
The I2C module generates two interrupt flags, MI2CIF
(I2C Master I nterrupt Flag) an d SI2CIF (I2C Slav e Inter-
rupt Flag). The MI2CIF interrupt flag is activated on
completion of a master message event. The SI2CIF
interrupt flag is activated on detection of a message
directed to the slave.
17.8 Slope Control
The I2C standard requires slope control on the SDA
and SCL signals for Fast Mode (400 kHz). The control
bit, DISSLW , enables the us er to disable slew rate con-
trol, if desired. It is necessary to disable the slew rate
control for 1 MHz mode.
17.9 IPMI Support
The con trol bit, IPM IEN, enabl es the modul e to supp ort
Intelligent Peripheral Management Interface (IPMI).
When this bit is set, the module ac ce pts and ac t s upo n
all addres ses .
17.10 General Call Address Support
The general call address can address all devices.
When this address is used, all devices should, in
theor y, respond with an Acknow l edg em ent .
The general call address is one of eight addresses
reserved for specific purposes by the I2C protocol. It
consists of all ‘0’s with R_W = 0.
The general call address is recognized when the Gen-
eral Call Enable (GCEN) bit is set (I2CCON<7> = 1).
Following a Start bit detection, 8 bits are shifted into
I2CRSR and the address is compared with I2CADD,
and is also compared with the general call address
which is fixed in hardware.
If a gen eral cal l addre ss matc h occurs, the I2CRS R is
transferred to the I2CRCV after the eighth clock, the
RBF flag is set, and on the falling edge of the ninth bit
(ACK bit), the master event interrupt flag (MI2CIF) is
set.
When the i nte rrupt is serviced, the s ou rce f or th e int er-
rupt can be checked by reading the contents of the
I2CRCV to determine if the address was device
specific, or a general call address.
17.11 I2C Master Support
As a Master device, six operations are supported.
Assert a Start condition on SDA and SCL.
Assert a Restart condition on SDA and SCL.
Write to the I2CTRN register initiating
transmission of data/address.
Generate a Stop condition on SDA and SCL.
Configure the I2C port to receive data.
Generate an ACK condition at the end of a
received byte of data.
17.12 I2C Master Operation
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer is
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the begi nning of the next seria l transfer, the I2C bus will
not be released.
In Master Transmitter mode, serial data is output
through SDA, while SCL outputs the serial clock. The
first byte transmitted contains the slave address of the
receiving device (7 bits) and the data direction bit. In
this ca se, the da ta direc tion bit (R_ W) is logi c ‘0’. Serial
data is transmitted 8 bits at a time. After each byte is
transmitted , an ACK bit i s received . S t art and Stop con-
ditions are output to indicat e the beginn ing and the en d
of a serial transfer.
In Master Rec eive mode, the firs t byte transmitte d con-
tains the slave address of the transmitting device
(7 bits) and the data direction bit. In this case, the data
direction bit (R_W) is logic ‘1’. Thus, the first byte
transmitted is a 7-bit slave address, followed by a ‘1’ to
indicate receive bit. Serial data is received via SDA,
while SCL outputs the serial clock. Serial data is
receive d 8 bits at a tim e. After each byte is rece ived, an
ACK bit is transmitted. Start and Stop conditions
indicate the beginning and end of transmission.
17.12.1 I2C MASTER TRANSMISSION
Transmission of a data byte, a 7-bit address, or the
second half of a 10-bit address is a ccomplish ed by sim-
ply wri ting a va lue to I2CTR N registe r. The user shoul d
only write to I2CTRN when the module is in a WAIT
state. This action will set the buffer full flag (TBF) and
allow the Baud Rate Generator to begin counting and
start the next transmission. Each bit of address/data
will be shifted out onto the SDA pin after the falling
edge of SCL is asserted. The Transmit Status Flag,
TRSTAT (I2CSTAT<14>), indicates that a master
transmit is in progress.
17.12.2 I2C MASTER RECEPTION
Master mode recepti on is enabl ed by progra mmin g the
receive enable (RCEN) bit (I2CCON<3>). The I2C
module must be Idle before the RCEN bit is set, other-
wise the RCEN bit will be disregarded. The Baud Rate
Generator begins counting, and on each rollover, the
state of the SCL pin toggles, and data is shifted in to the
I2CRSR on the rising edge of each clock.
17.12.3 BAUD RATE GENERATOR
In I2C Master mode, the reload value for the BRG is
located in the I2CBRG register. When the BRG is
loaded w ith th is v alu e, the BRG c ou nt s d own to ‘0’ and
stop s until anothe r reload has taken pla ce. If clock arbi-
tration is taking place, for instance, the BRG is
reloaded when the SCL pin is sampled high.
dsPIC30F5015/5016
DS70149B-page 112 © 2006 Microchip Technology Inc.
As per the I2C standard, FSCK may be 100 kHz or
400 kHz. However, the user can specify any baud rate
up to 1 MHz. I2CBRG values of ‘0’ or ‘1’ are illegal.
EQUATION 17-1: SERIAL CLOCK RATE
17.12.4 CLOCK ARBITRATION
Clock arbitration occurs when the master de-asserts
the SCL pin (SCL allowed to float high) during any
receive, transmit, or Restart/Stop condition. When the
SCL pin is allowed to float high, the Baud Rate Gener-
ator is suspended from counting until the SCL pin is
actually sampled high. When the SCL pin is sampled
high, the Baud Rate Generator is reloaded with the
content s of I2CB RG and begin s counting. Th is ensures
that t he S CL high time wi ll always be at l eas t o ne BRG
rollover count in the event that the clock is held low by
an external device.
17.12.5 M ULTI-MASTER COMMUNICATION,
BUS COLLISION AND BUS
ARBITRATION
Multi-M aster operation support is achieved by bus arbi-
tration. When the master outputs address/data bits
onto the SDA pin, arbitration takes place when the
master outputs a1’ on SDA, by letting SDA float high
whil e another mas ter asser ts a ‘0’. When the SCL pin
floats high, data should be stable. If the expected data
on SDA is a ‘1’ and the data sampled on the SDA
pin = 0, then a bus collision has taken place. The
master will set the MI2CIF pulse and reset the master
portion of the I2C port to its Idle state.
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the TBF flag is
cleared, the SDA and SCL lines are deasserted, and a
value can now be written to I2CTRN. When the user
services the I2C master event Interrupt Service Rou-
tine, if the I2C bus i s free (i.e ., the P bit is s et), the us er
can resume communication by asserting a Start
condition.
If a Start, Restart, Stop or Ack nowl edge co nditio n was
in progres s w hen the b us co lli si on o cc urre d, th e c ond i-
tion is aborte d, the SDA an d SCL line s are dea sserte d,
and the respective control bits in the I2CCON register
are cleared to ‘0’. When the user services the bus col-
lision Interrupt Service Routine, and if the I2C bus is
free, the use r can resum e co mm un ication by asse rtin g
a Start conditio n.
The Master will continue to monitor the SDA and SCL
pins, and if a Stop condition occurs, the MI2CIF bit will
be set.
A write to the I2CTR N will start the trans mission of dat a
at the first data bit, regardless of where the transmitter
left off when bus collision occurred.
In a Multi-Maste r en vi ronm en t, th e i nte rrup t ge nera tio n
on the d etecti on of St art a nd Stop conditio ns al lows the
determination of when the bus is free. Control of t he I2C
bus can be taken when the P bit is set in the I2CSTAT
register, or the bus is Idle and the S and P bits are
cleared.
17.13 I2C Module Operation During CPU
Sleep and Idle Modes
17.13.1 I2C OPERATION DURING CPU
SLEE P MOD E
When the device enters Sleep mode, all clock sources
to the module are shutdown and stay at logic ‘0’. If
Sleep occurs in the middle of a transmission, and the
state machine is partially into a transmission as the
clocks s top, the n the tra nsmiss ion is ab orted. Si milarl y,
if Sleep occurs in the middle of a reception, then the
reception is aborted.
17.13.2 I2C OPERATION DURING CPU IDLE
MODE
For the I2C, the I2CSIDL bit selects if the module will
stop on Idle or continue on Idle. If I2CSIDL = 0, the
module will continue operation on assertion of the Idle
mode. If I2CSIDL = 1, the module will stop on Idle.
I2CBRG FCY
FSCL
-------------FCY
1 111 111,,
---------------------------
⎝⎠
⎛⎞
1=
© 2006 Microchip Technology Inc. DS70149B-page 113
dsPIC30F5015/5016
TABLE 17-2: I2C™ REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
I2CRCV 0200 Receive Register 0000 0000 0000 0000
I2CTRN 0202 Tra nsmit Register 0000 0000 1111 1111
I2CBRG 0204 Baud Rate Generator 0000 0000 0000 0000
I2CCON 0206 I2CEN I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 0001 0000 0000 0000
I2CSTAT 0208 ACKSTAT TRSTAT BCL GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF 0000 0000 0000 0000
I2CADD 020A Address Regist er 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
dsPIC30F5015/5016
DS70149B-page 114 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 115
dsPIC30F5015/5016
18.0 UNIVERSAL ASYNCHRONOUS
RECEIVER TRANSMITTER
(UART) MODULE
This section describes the Universal Asynchronous
Receiver/Transmitter Communications module.
18.1 UART Module Overview
The key features of the UART module are:
Full-duplex, 8 or 9-bit data communication
Even, Od d or No Parity options ( for 8 -bit data)
One or two Stop bits
Fully integ rate d Baud R ate Ge nera tor with 16-b it
prescaler
Baud rates range from 38 bps to 1.875 Mbps at a
30 MHz instruction rate
4-word deep transmit data buffer
4-word deep receive data buffer
Parity, Framing and Buffer Overrun error
detection
Support for Interrupt only on Address Detect
(9th bit = 1)
Separate Transmit and Receive Interrupts
Loopback mode for diagnostic support
FIGURE 18-1: UART TRANSMITTER BLOCK DIAGRAM
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
Write Write
UTX8 UxTXREG Low Byte
Load TSR
Transmit Control
– Control TSR
– Control Buffer
– Generate Flags
– Generate Interrupt
Control and Status bi ts
UxTXIF
Data
0’ (Start)
1’ (Stop)
Parity Parity
Generator
Transmit Shift Register (UxTSR)
16 Divider
Control
Signals
16X Baud Cl o ck
from Baud Rate
Generator
Internal Data Bus
UTXBRK
Note: x = 1
UxTX
dsPIC30F5015/5016
DS70149B-page 116 © 2006 Microchip Technology Inc.
FIGURE 18-2: UART RECEIVER BLOCK DIAGRAM
Read
URX8 UxRXREG Low Byte
Load RSR
UxMODE
Receive Buffer Control
– Generate Flags
– Generate Interrupt
UxRXIF
UxRX
· Start bit Detect
Receive Shift Register
16 Divider
Control
Signals
UxSTA
– Shift Data Characters
Read Read
Write Write
to Buffer
8-9
(UxRSR)
PERR
FERR
· Parity Check
· Stop bit Detect
· Shift Clock Generation
· Wake Logic
16
Internal Data Bus
1
0
LPBACK
From UxTX
16x Baud Clock from
Baud Rate Generato r
Note: x = 1
© 2006 Microchip Technology Inc. DS70149B-page 117
dsPIC30F5015/5016
18.2 Enabling and Setting Up UART
18.2.1 ENABLING THE UART
The UART module is enabled by setting the UARTEN
bit in the UxMODE register (where x = 1). Once
enabled , the UxTX and UxRX pins are configured as an
output and an input respectively, overriding the TRIS
and LATCH register bit settings for the corresponding
I/O port pins. The UxTX pin is at logic ‘1’ when no
transmission is taking place.
18.2.2 DISABLING THE UART
The UART module is disabled by clearing the
UARTEN bit in the UxMODE register. This is the
default state after any Reset. If the UART is disabled,
all I/O pins operate as port pins under the control of
the latch and TRIS bits of the corresponding port pins.
Disabling the UART module resets the buffers to
empty states. Any data characters in the buffers are
lost, and the baud rate counter is reset.
All error and status flags associated with the UART
module are reset when the module is disabled. The
URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and
UTXBF bits are cleared, whereas RIDLE and TRMT
are set. Other control bits, including ADDEN,
URXISEL<1:0>, UTXISEL, as well as the UxMODE
and UxBRG registers, are not affected.
Clearing the UARTEN bit while the UART is active will
abort all pending transmissions and receptions and
reset the module as defined above. Re-enabling the
UART will restart the UART in the same configuration.
18.2.3 SETTING UP DATA, PARITY AND
STOP BIT SELECTIONS
Control bit s, PDSEL< 1:0>, in the UxMO DE register are
used to select the data length and parity used in the
transmission. The data length may either be 8 bits with
even, odd or no parity, or 9 bits with no parity.
The STSEL bit determines whether one or two Stop
bits will be used during data transmission.
The defau lt (Power-on) se tting of the UAR T is 8 bit s, no
parity, 1 Stop bit (typically represented as 8, N, 1).
18.3 Transmitting Data
18.3.1 TRANSMITTING IN 8-BIT DATA
MODE
The following steps must be performed in order to
transmit 8-bit data:
1. Set up the UART:
First, the data length, parity and number of Stop
bits must be selected. Then, the Transmit and
Receive Interrupt enable and priority bits are
setup in the UxMODE and UxSTA registers.
Also, the appropriate baud rate value must be
written to the UxBRG register.
2. Enable the UART by setting the UARTEN bit
(UxMODE<15>).
3. Set the UTXEN bit (UxSTA<10>), thereby
enabling a transmission.
4. Write the byte to be t ransmitted to the lower byte
of UxTXREG. The value will be transferred to
the T ransm it Shift registe r (UxTSR) immedia tely
and the serial bit stream will start shifting out
during the next rising edge of the baud clock.
Alternatively, the data byte may be written while
UTXEN = 0, following which, the user may set
UTXEN. This will cause the serial bit stream to
begin immediately because the baud clock will
start from a cleared state.
5. A Transmit interrupt will be generated depend-
ing on the value of the interrupt control bit
UTXISEL (UxSTA<15>).
18.3.2 TRANSMITTING IN 9-BIT DATA
MODE
The sequence of steps involved in the transmission of
9-bit data is similar to 8-bit transmission, except that a
16-bit data word (of which the upper 7 bits are always
clear) must be written to the UxTXREG register.
18.3.3 TRANSMIT BUFFER (UXTXB)
The transmit buffer is 9 bits wide and 4 characters
deep. Including the Transmit Shift register (UxTSR),
the user effectively has a 5-deep FIFO (First-In, First-
Out) buffer. The UTXBF Status bit (UxSTA<9>)
indicates whether the transmit buffer is full.
If a user attempts to write to a full buffer, the new data
will not be accepted into the FIFO, and no data shift
will occur within the buffer. This enables recovery from
a buffer overrun condition.
The FIFO is reset during any device Reset, but is not
affected when the device enters or wakes up from a
Power-Saving mode.
Note: The UTXEN bit must be set after the
UARTEN bit is set to enable UART
transmissions.
dsPIC30F5015/5016
DS70149B-page 118 © 2006 Microchip Technology Inc.
18.3.4 TRANSMIT INTERRUPT
The transmit interrupt flag (U1TXIF) is located in the
corresponding Interrupt Flag register.
The transmitter generates an edge to set the UxTXIF
bit. The cond itio n for gene ratin g the in terru pt depe nds
on UTXISEL control bit:
a) If UTXISEL = 0, an interrupt is generated when
a word is tra ns ferre d fro m the Transmit buf fe r to
the Transmit Shift register (UxTSR). This
implies that the transmit buffer has at least one
empty word.
b) If UTXISEL = 1, an interrupt is generated when
a word is tra ns ferre d fro m the Transmit buf fe r to
the Transmit Shift register (UxTSR) and the
Transmit buffer is empty.
Switching between the two interrupt modes during
operation is possible and sometimes offers more
flexibility.
18.3.5 TRANSMIT BREAK
Setting the UTXBRK bit (UxSTA<11>) will cause the
UxTX line to be driven to logic0’. The UTXBRK bit
overrides all transmission activity. Therefore, the user
should generally wait for the transmitter to be Idle
before setting UTXBRK.
To send a break character, the UTXBRK bit must be
set by software and must remain set for a minimum of
13 baud cl oc k cy cl es . The UTX BR K b it is then cle a red
by software to generate Stop bits. The user must wait
for a duration of at least one or two baud clock cycles
in order to ensure a valid Stop bit(s) before reloading
the UxTXB or starting other transmitter activity. Trans-
mission of a break character does not generate a
transmit interrupt.
18.4 Receiving Data
18.4.1 RECEIVING IN 8-BIT OR 9-BIT DATA
MODE
The following steps must be performed while receiving
8-bit or 9-bit data:
1. Set up the UART (see Section 18.3.1
“Transmitting in 8-bit Data Mode”).
2. Enable the UART (see Section 18.3.1
“Transmitting in 8 -bit D ata Mode”).
3. A receive interrupt will be generated when one
or more data words have been received,
depending on the receive interrupt settings
specified by the URXISEL bits (UxSTA<7:6>).
4. Read the OERR bit to determine if an overrun
error has occ urred. The OERR bit must be reset
in software.
5. Read the received data from UxRXREG. The
act of reading UxRXREG will move the next
word to the top of the receive FIFO, and the
PERR and FERR values will be updated.
18.4.2 RECEIVE BUFFER (UXRXB)
The receive buffer is 4 words deep. Including the
Receive Shift register (UxRSR), the user effectively
has a 5-word deep FIFO buffer.
URXDA (UxSTA<0>) = 1 indicates that the receive
buffer has data available. URXDA = 0 implies that the
buffer is empty. If a user attempts to read an empty
buffer, the old values in the buffer will be read and no
data shift will occur within the FIFO.
The FIFO is reset during any device Reset. It is not
affected when the device enters or wakes up from a
Power-Saving mode.
18.4.3 RECEIVE INTERRUPT
The receive interrupt flag (U1RXIF or U2RXIF) can be
read from the corresponding Interrupt Flag register.
The interrupt flag is set by an edge generated by the
rece iver. The cond iti on f or se tti ng t he re ceiv e int err upt
flag depends on the settings specified by the
URXISEL<1:0> (UxSTA<7:6>) control bits.
a) If URXISEL<1:0> = 00 or 01, an interrupt is
generated every time a data word is transferred
from the Receive Shift register (UxRSR) to the
Receive Buffer. There may be one or more
charact ers in the receive buffer.
b) If URXISEL<1:0> = 10, an int errupt is gene rated
when a word is transferred from the Receive
Shift register (UxRSR) to the Receive Buffer,
which, as a result of the transfer, contains
3 characters.
c) If URXISEL<1:0> = 11, an interrupt is set when
a word is transf erred from th e Receive Shift reg-
ister (UxRSR) to the Receive Buffer , which, as a
result of the transfe r, conta ins 4 c ha rac ters (i.e .,
becomes full).
Switching between the Interrupt modes during opera-
tion is possible, though generally not advisable during
normal operation.
18.5 Reception Error Handling
18.5.1 RECEIVE BUFFER OVERRUN
ERROR (OERR BIT)
The OERR bit (UxSTA<1>) is set if all of the following
conditions occur:
a) The receive buffer is full.
b) The Receive Shift register is full, but unable to
transfer the character to the receive buffer.
c) The Stop bit of the character in the UxRSR is
detected, indicating that the UxRSR needs to
transfer the character to the buffer.
Once OERR is se t, no furthe r dat a is s hif ted in UxRSR
(until the OERR bit is cleared in software or a Reset
occurs). The data held in UxRSR and UxRXREG
remains val id.
© 2006 Microchip Technology Inc. DS70149B-page 119
dsPIC30F5015/5016
18.5.2 FRAMING ERROR (FERR BIT)
The FERR bit (UxSTA<2>) is set if a ‘0’ is detected
instead of a Stop bit. If two Stop bits are selected, both
Stop bits must be ‘1’, otherwise FERR will be set. The
read-only FERR bit is buffered along with the received
data. It is cleared on any Reset.
18.5.3 PARITY ERROR (PERR BIT)
The PERR bit (UxSTA<3>) is set if the parity of the
received word is incorrect. This error bit is applicable
only if a Parity mode (odd or even) is selected. The
read-only PERR bit is buffered along with the received
data bytes. It is cleared on any Reset.
18.5.4 IDLE STATUS
When the receiver is active (i.e., between the initial
detection of the Start bit and the completion of the
Stop bit), the RIDLE bit (UxSTA<4>) is ‘0’. Between
the com ple tio n of th e Stop bit and d ete cti on o f the nex t
Start bit, the RIDLE bit is 1’, indicating that the UART
is Idle.
18.5.5 RECEIV E BRE AK
The receiver will count and expect a certain number of
bit times based on the values programmed in the
PDSEL (UxMODE<2:1>) and STSEL (UxMODE<0>)
bits.
If the break is longer than 13 bit times, the reception is
considered complete after the number of bit times
specified by PDSEL and STSEL. The URXDA bit is
set, FERR is set, zeros are loaded into the receive
FIFO, interrupts are generated, if appropriate, and the
RIDLE bit is set.
When the module receiv es a lo ng b r ea k s ign al a nd th e
receiver has detected the Start bit, the data bits and
the inv ali d Stop bit (wh ic h sets the FER R), the receiv er
must wait for a valid Stop bit before looking for the
next Start bit. It cannot assume that the break condi-
tion on the line is the next Start bit.
Break is regarded as a character containing all 0’s,
with the FERR bit set. The break character is loaded
into the buffer. No further reception can occur until a
Stop bit is received. Note that RIDLE goes high when
the Stop bit has not been received yet.
18.6 Address Detect Mode
Setting the ADDEN bit (UxSTA<5>) enables this
special mode, in which a 9th bit (URX8) value of ‘1
identifies the received word as an address rather than
data. This mode is only applicable for 9-bit data com-
munication. The URXISEL control bit does not have
any impact on interrupt generation in this mode, since
an interrupt (if enabled) will be generated every time
the received word has the 9th bit set.
18.7 Loopback Mode
Setting the LPBACK bit enables this special mode in
which the UxTX pin is int ernally conne cted to the UxRX
pin. When configured for the Loopback mode, the
UxRX pin is disconnected from the internal UART
receive logic. However, the UxTX pin still functions as
in a normal operation.
To select this mode:
a) Configure UART for desired mode of operation.
b) Set LPBACK = 1 to enable Loopback mode.
c) Enable tran sm is si on as def ine d in Section 18.3
“Transmitting Data”.
18.8 Baud Rate Generator
The UART has a 16-bit Baud Rate Generator to allow
maximu m fl exib ilit y in b aud r ate ge nera tio n. Th e Baud
Rate Generator register (UxBRG) is readable and
writable. The baud rate is computed as follows:
BRG = 16-bit value held in UxBRG register
(0 through 65535)
FCY = Instruction Clock Rate (1/TCY)
The Baud Rate is given by Equati on 1 8-1 .
EQUATION 18-1: BAUD RATE
Therefore, maxi mum baud rate possible is
FCY/16 (if BRG = 0),
and the minimum baud rate possible is
FCY/(16 * 65536).
With a full 16-bit Baud Rate Generator, at 30 MIPS
operation, the minimum baud rate achievable is
28.5 bps.
Baud Rate = FCY/(16 * (BRG + 1) )
dsPIC30F5015/5016
DS70149B-page 120 © 2006 Microchip Technology Inc.
18.9 Auto-Baud Support
To allow the system to determine baud rates of
received characters, the input can be optionally linked
to a selected capture input. To enable this mode, the
user must prog ram t he i nput capt ure modu le to det ect
the falling and rising edges of the Start bit.
18.10 UART Operation During CPU
Sleep and Idle Modes
18.10.1 UART OPERATION DURING CPU
SLEEP MODE
When the device enters Sleep mode, all clock sources
to the module are shutdown and stay at logic ‘0’. If
entry into Sleep mode occurs while a transmission is
in progress, then the transmission is aborted. The
UxTX pin is driven to logic ‘1’. Similarly, if entry into
Sleep mode occurs while a reception is in progress,
then the reception is aborted. The UxSTA, UxMODE,
transmit and receive registers and buffers, and the
UxBRG register are not affected by Sleep mode.
If the Wake bit (UxMODE<7>) is set before the device
enters Sleep mode, then a falling edge on the UxRX
pin will generate a receive interrupt. The Receive
Interrupt Select Mode bit (URXISEL) has no effect for
this function. If the receive interrupt is enabled, then
this will wake-up the device from Sleep. The UARTEN
bit must be set in order to generate a wake-up
interrupt.
18.10.2 UART OPERATION DURING CPU
IDLE MODE
For the UART, the USIDL bit selects if the module will
stop operation when the device enters Idle mode, or
whethe r the m odu le wi ll co nti nue on Idl e. If U SID L = 0,
the module will continue operation during Idle mode. If
USIDL = 1, the module will stop on Idle.
© 2006 Microchip Technology Inc. DS70149B-page 121
dsPIC30F5015/5016
TABLE 18-1: UART1 REGISTER MAP
SFR Name Addr . Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
U1MODE 020C UARTEN —USIDL WAKE LPBACK ABAUD PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000
U1STA 020E UTXISEL UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0000 0001 0001 0000
U1TXREG 0210 UTX8 Transmit Register 0000 000u uuuu uuuu
U1RXREG 0212 URX8 Receive Register 0000 0000 0000 0000
U1BRG 0214 Baud Rate Generator Prescaler 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
dsPIC30F5015/5016
DS70149B-page 122 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 123
dsPIC30F5015/5016
19.0 CAN MODULE
19.1 Overview
The Controller Area Network (CAN) module is a serial
interface, useful for communicating with other CAN
modules or microcontroller devices. This interface/
protocol was designed to allow communications within
noisy environments. Only one CAN module is
available.
The C AN mo du le i s a co mm un i ca tio n co ntr o ll er i mp le -
menting the CAN 2.0 A/B protocol, as defined in the
BOSCH specification. The module will support
CAN 1.2, CAN 2.0A, CAN 2.0B Passive and CAN 2.0B
Active v ersio ns of th e protocol. Th e m od ule im ple men-
tation is a full CAN system. The CAN specification is
not covered within this data sheet. The reader may
refer to the BOSCH CAN specification for further
details.
The module features are as follows:
Implementation of the CAN protocol CAN 1.2,
CAN 2.0A and CAN 2.0B
Standard and extended data frames
0-8 bytes data length
Programmable bit rate up to 1 Mbit/sec
Support for remote frames
Doubl e-bu f fe red receiver with two prioritiz ed
received message storage buffers (each buffer
may contain up to 8 bytes of data)
6 full (standard/extended identifier) acceptance
filters, 2 associated with the high priority receive
buffer, and 4 associated with the low priority
rece ive buffer
2 full acceptance filter masks, one each associ-
ated wit h the high and low pr iority r eceive buffers
Three transmit buffers with application specified
priori tization and abort c apabilit y (each buf fer may
contain up to 8 bytes of data)
Programmable wake-up functionality with
integrated low pass filter
Programm abl e Loopback m ode su pp orts self -tes t
operation
Signaling via interrupt capabilities for all CAN
receiver and transmitter error states
Programmable clock source
Programmable link to timer module for
time-stamp ing and ne twork synchro nization
Low-power Sleep and Idle mode
The CAN bus module consists of a protocol engine,
and message buffering/control. The CAN protocol
engine ha ndles all func tions fo r receiv ing and trans mit-
ting messages on the CAN bus. Messages are
transmitted by first loading the appropriate data regis-
ters. Status and errors can be checked by reading the
appropriate registers. Any message detected on the
CAN bus is checked for errors and then matched
against filters t o se e if i t sh oul d be received and stored
in one of the receive registers.
19.2 Frame Types
The CAN module transmits various types of frames,
which include data messages or remote transmission
requests initiated by the user as other frames that are
automatically generated for control purposes. The
following frame types are supported:
Standard Data Frame
A Standard Data Frame is generated by a node when
the node wishes to transmit data. It includes an 11-bit
Standard Identifier (SID) but not an 18-bit Extended
Identifier (EID).
Extended Data Frame
An Extended Data Frame is similar to a Standard Data
Frame, but includes an Extended Identifier as well.
Remote Frame
It is possible for a destination node to request the data
from the source. For this purpose, the destination node
sends a Remote Frame with an identifier that matches
the ide ntifier of the requi red D ata Frame. T he approp ri-
ate dat a so urce nod e will the n send a D at a Frame as a
response to this remote request.
Error Frame
An Error Frame is generated by any node that detects
a bus error. An error frame consis ts of 2 fiel ds: a n Error
Flag field and an Error Delimiter field.
Overload Frame
An Overload Frame can be generated by a node as a
result of 2 conditions. First, the node detects a domi-
nant bit during lnterframe Space, which is an illegal
conditi on. Second, due to int erna l conditions, the nod e
is not yet ab le to start rec eption of the ne xt message. A
node may generate a maximum of 2 sequential
Overload Frames to delay the start of the next
message.
Inter frame Spac e
Interframe Space separates a proceeding frame (of
whatever type) from a following Data or Remote
Frame.
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
dsPIC30F5015/5016
DS70149B-page 124 © 2006 Microchip Technology Inc.
FIGURE 19-1: CAN BUFFERS AND PROTOCOL ENGINE BLOCK DIAGRAM
Acceptance Filter
RXF2
R
X
B
1
A
c
c
e
p
t
A
c
c
e
p
t
Identifier
Data Field Data Field
Identifier
Acceptance Mas k
RXM1
Acceptance Filter
RXF3
Acceptance Filter
RXF4
Acceptance Filter
RXF5
M
A
B
Acceptance Mask
RXM0
Acceptance Filter
RXF0
Acceptance Filter
RXF1
R
X
B
0
MSGREQ
TXB2
TXABT
TXLARB
TXERR
MTXBUFF
MESSAGE
Message
Queue
Control Transmit Byte Sequencer
MSGREQ
TXB1
TXABT
TXLARB
TXERR
MTXBUFF
MESSAGE
MSGREQ
TXB0
TXABT
TXLARB
TXERR
MTXBUFF
MESSAGE
Receive ShiftTransmit Shift
Receive
Error
Transmit
Error
Protocol
RERRCNT
TERRCNT
ErrPas
BusOff
Finite
State
Machine
Counter
Counter
Transmit
Logic
Bit
Timing
Logic
CiTX(1) CiRX(1)
Bit Timing
Generator
PROTOCOL
ENGINE
BUFFERS
CRC Check
CRC Generator
Note 1: i = 1 refers to CAN1 module
© 2006 Microchip Technology Inc. DS70149B-page 125
dsPIC30F5015/5016
19.3 Modes of Operation
The CAN module can operate in one of several operation
modes selected by the user . These modes include:
Initialization Mode
Disable Mode
Normal Operation Mode
List en-O n ly Mo de
Loop bac k Mo de
Error Recognition Mode
Modes are requested by setting the REQOP<2:0>
bits (CiCTRL<10:8>). Entry into a mode is
acknowledged by monitoring the OPMODE<2:0> bits
(CiCTRL<7:5>). The module will not change the mode
and the OPMODE bits until a change in mode is
acceptable, generally during bus idle time which is
defined as at least 11 consecuti ve rec es sive bits.
19.3.1 INITIALIZATION MODE
In the Ini tialization mode, the module will not tra nsmit or
receive. The error counters are cleared and the inter-
rupt flags remain unchanged. The programmer will
have access to Configuration registers that are access
restricted in other modes. The module will protect the
user from accidentally violating the CAN protocol
through p rogramming er rors. All registe rs which contro l
the configuration of the module can not be modified
while the module is on-line. The CAN module will not
be allowed to enter the Configuration mode while a
transmission is taking place. The Configuration mode
serves as a lock to protect the following registers:
All Module Control Registers
Baud Rate and Interrupt Configuration Registers
Bus Timing Registers
Identifier Acceptance Filter Registers
Identifier Acceptance Mask Registers
19.3.2 DISABLE MODE
In Disable mode, the module will not transmit or
receive . The mo dule has the ability to set the W AKIF b it
due to bus activity, however any pending interrupts will
remain and the error counters will retain their value.
If the REQOP<2:0> bits (CiCTRL<10:8>) = 001, the
module will enter the Mo dule Disable mo de. If the mod-
ule is active, the module will wait for 11 recessive bits
on the CAN bus, detect that condition as an idle bus,
then accept the module disable command. When the
OPMODE<2:0> bits (CiCTRL<7:5>) = 001, that indi-
cates whether the module successfully went into Mod-
ule Di sable mode. The I/O pins will rev ert to no rmal I/O
function when the module is in the Module Disable
mode.
The module can be programmed to apply a low-pass
filter function to the C iRX inp ut line whil e the modu le or
the CPU is in Sleep mode. The WAKFIL bit
(CiCFG2<14>) enables or disables the filter.
19.3.3 NORMAL OPERATION MODE
Normal Operating mode is selected when
REQOP<2:0> = 000. In this mode, the module is
activated, the I/O pins will assume the CAN bus
functions. The module will transmit and receive CAN
bus messages via the CxTX and CxRX pins.
19.3.4 LISTEN-ONLY MODE
If the Listen-Onl y mo de is a cti va ted, the mod ule on th e
CAN bus is passive. The transmitter buffers revert to
the Port I/O function. The receive pins remain inputs.
For the rec eiv er, no error flags or Ac kn ow le dge s ign al s
are sent. The error counters are deactivated in this
state. The Listen-Only mode can be used for detecting
the baud rate on the CAN bus. To use this, it is neces-
sary that there are at least two further nodes that
communicate with each other.
19.3.5 ERROR RECOGNITION MODE
The module can be set to ignore all errors and receive
any message. The Error Recognition mode is activated
by set ting t he RXM< 1:0> b its (CiRXnC ON<6:5 >) regis -
ters to ‘11’. In this mode, the data which is in the
message assembly buffer until the time an error
occurred, is copied in the receive buffer and can be
read via the CPU interface.
19.3.6 LOOPBACK MODE
If the Loopbac k mode is activ ated, the mo dule will con-
nect the internal transmit signal to the internal receive
signal at the module boundary. The transmit and
receive pins revert to their port I/O function.
Note: Typically, if the CAN module is allowed to
transmit in a particular mode of operation
and a transmission is requested immedi-
ately after the CAN module has been
placed in tha t mode of operati on, the mod-
ule waits for 11 consecutive recessive bits
on the bus before starting transmission. If
the user switches to Disable mode within
this 11-bi t pe riod , th en thi s tr ansm issi on is
aborted and the corresponding TXABT bit
is set and TXREQ bit is cleared.
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DS70149B-page 126 © 2006 Microchip Technology Inc.
19.4 Message Reception
19.4.1 RECEIV E BU FFER S
The CAN bus module has 3 receive buffers. However,
one of the receiv e b uf fers is al ways c om mi tted to mo n-
itoring the bus for incoming messages. This buffer is
called the Message Assembly Buffer (MAB). So there
are 2 receive b uf fers v isibl e, RXB0 and RXB1, that ca n
essentially instantaneously receive a complete
message from the protocol engine.
All messages are assembled by the MAB, and are
transferred to the RXBn buffers only if the acceptance
filter criterion are met. When a message is received,
the RXnIF flag (CiINTF<0> or CiINRF<1>) will be set.
This bi t can only b e set by the module when a message
is received. The bit is cleared by the CPU when it has
completed processing the message in the buffer. If the
RXnIE bit (CiINTE<0> or CiINTE<1>) is set, an
interrupt will be generated when a message is
received.
RXF0 and RXF1 filters with RXM0 mask are associated
with RXB0. The filters RXF2, RXF3, RXF4, and RXF5
and the mask RXM1 are associated with RXB1.
19.4.2 MESSAGE ACCEPTANCE FILTER S
The me ssage acc eptance filters and masks ar e used to
determine if a message in the message assembly
buffer should be loaded into either of the receive buff-
ers. Once a valid message has been received into the
message assembly buffer, the identifier fields of the
messa ge ar e co mpared to the filte r values. If there i s a
match, that message will be loaded into the appropria te
rece ive buffer.
The acceptance filter looks at incoming messages for
the RXIDE bit (CiRXnSID<0>) to determine how to
compare the identifiers. If the RXIDE bit is clear, the
message is a standard frame, and only filters with the
EXIDE bit (CiRXFnSID<0>) clear are compared. If the
RXIDE bit is set, the message is an extended frame,
and only filters with the EXIDE bit set are compared.
Configuring the RXM<1:0> bits to ‘01’ or ‘10’ can
ove rride the EXIDE bit.
19.4.3 MESSAGE ACCEPTANCE FILTER
MASKS
The mask bits e ssential ly determi ne which bit s to appl y
the filter to. If any m as k bit is se t to a ze ro, then that b it
will automatically be accepted regardless of the filter
bit. There are 2 prog rammab le ac cept ance filter ma sks
assoc iated with the receive bu ffers, one for each bu ffer .
19.4.4 RECEIVE OVERRUN
An overrun condition occurs when the message
assemb ly buffe r has ass emble d a valid recei ved mes-
sage, the message is accepted through the acceptance
filter s, and when the rec eiv e buffer asso cia ted wit h the
filter has not been designated as clear of the previous
message.
The overrun error flag, RXnOVR (CiINTF<15> or
CiINTF<14>) and the ERRIF bit (CiINTF<5>) will be set
and the message in the MAB will be discarded.
If the D BEN bi t i s cle ar, RXB1 and RXB0 o pera te inde-
pendently. When this is the case, a message intended
for RXB0 will not be diverted into RXB1 if RXB0
contains an unread message and the RX0OVR bit will
be set.
If the DBEN bit is set, the overrun for RXB0 is handled
differently. If a va lid m es sa ge is r ece iv ed fo r R XB0 an d
RXFUL = 1 indicates that RXB0 is full and RXFUL = 0
indicates that RXB1 is empty, the message for RXB0
will be loaded into RXB1. An overrun error will not be
generated for RXB0. If a valid message is received for
RXB0 and RXFUL = 1 and RXFUL = 1 indicates that
both RXB0 and RXB1 are fu ll, the m es sage w il l be lost
and an overrun will be indicated for RXB1.
19.4.5 RECEIVE ERRORS
The CAN module will detect the following receive
errors:
Cyclic Redundancy Check (CRC) Error
Bit Stuffing Error
Invalid Message Receive Error
These receive errors do not generate an interrupt.
However, the receive error counter is incremented by
one in case one of these errors occur. The RXWAR bit
(CiINTF<9>) indicates that the Receive Error Counter
has reached the CPU warning limit of 96 and an
interrupt is genera ted.
19.4.6 RECEIVE INTERRUPTS
Receive interrupts can be divided into 3 major groups,
each including various conditions that generate
interrupts:
Receive Interrupt
A mess age has been s uccessf ully recei ved and loaded
into one of the receive buffers. This interrupt is acti-
vated immediately after receiving the End-of-Frame
(EOF) field. Reading the RXnIF flag will indicate which
receive buffer caused the interrupt.
Wake-up interrupt
The CAN module has woken up from Disable mode or
the device has woken up from Sleep mode.
© 2006 Microchip Technology Inc. DS70149B-page 127
dsPIC30F5015/5016
Receive Error Interrupts
A receive error inte rrup t w ill be in di cat ed b y th e ER RIF
bit. This bit shows that an error condition occurred. The
source of the error can be determined by checking the
bits in the CAN Interrupt Status register, CiINTF.
Invalid message received
If any type of erro r occ urred d uring recept ion o f the last
message, an error will be indicated by the IVRIF bit.
Receiver overrun
The RXnOVR bit indicates that an overrun condition
occurred.
Receiver warning
The RXWAR bit indicates that the Receive Error
Counter (RERRCNT<7:0>) has reached the warning
limit of 96.
Receiver error passive
The RXEP bit in di cat es that the Receive Erro r Coun ter
has exceeded the error passive limit of 127 and the
module has gone into Error Passive state.
19.5 Message Transmission
19.5.1 TRANSMI T BUFFERS
The CAN module has three transmit buffers. Each of
the thre e buf fers occ upies 14 bytes of d ata. Ei ght of th e
bytes a re the maximum 8 bytes of the transm itted me s-
sage. Five bytes hold the standard and extended
identifiers and other message arbitration information.
19.5.2 TRANSMIT MESSAGE PRIORITY
Transmit priority is a prioritization within each node of the
pending transmittable messages. There are 4 levels of
transmit priority . If TXPRI<1:0> (CiTXnCON<1:0>, where
n = 0, 1 or 2 represents a particular t ransmit buffer) for a
particular message buffer is set to ‘11’, that buffer has the
highest priority. If TXPRI<1:0> for a particular message
buf fer is set to 10’ or ‘01’, that buffer has an intermediate
priority. If TXPRI<1:0> for a particular message buffer is
00’, that buffer has the lowest priority.
19.5.3 TRANSMISSION SEQUENCE
To initiate transm issi on of th e mess age, th e TXREQ bit
(CiTXnCON<3>) must be set. The CAN bus module
resolves any timing conflicts between setting of the
TXREQ bit and the Start-of-Frame (SOF), ensuring
that if the priority was changed, it is resolved correctly
before the SOF occurs. When TXREQ is set, the
TXABT (CiTXnCON<6>), TXLARB (CiTXnCON<5>)
and TXERR (CiTXnCON<4>) flag bits are
automatically cleared.
Setting t he TXREQ bit simply flags a message buf fer as
enqueued for transmission. When the module detects
an available bus, it begins transmitting the message
which has been determi ned to have the highest priori ty .
If the transmission completes successfully on the first
attempt, the TXREQ bit is cl eared autom aticall y and an
interrupt is generated if TXIE was set.
If the message transmission fails, one of the error
condition flags will be set and the TXREQ bit will
remain set indicating that the message is still pending
for transmission. If the message encountered an error
condition during the transmission attempt, the TXERR
bit will be set and the error condition may cause an
interrupt. If the message loses arbitration during the
transmission attempt, the TXLARB bit is set. No
interrupt is generated to signal the loss of arbitration.
19.5.4 ABORTING MESSAGE
TRANSMISSION
The system can also abort a message by clearing the
TXREQ bit associated with each message buffer. Set-
ting the ABAT bit (CiCTRL<12>) will request an abort
of all pending messages. If the message has not yet
started transmission, or if the message started but is
interrupted by loss of arbitration or an error, the abort
will be processed. The abort is indicated when the
module sets the TXABT bit and the TXnIF flag is not
automatically set.
19.5.5 TRANSMISSION ERRORS
The CAN module will detect the followin g trans m iss io n
errors:
Acknowledge Error
Form Error
Bit Error
These transmission err ors will not necessarily generate
an inte rrupt, b ut are indi cated by t he tra nsmis sion error
counter. However, each of these errors will cause the
transmission error counter to be incremented by one.
Once the value of the error counter exceeds the value
of 96, the ERRIF (CiINTF<5>) and the TXWAR bit
(CiINTF<10>) are set. Once the value of the error
counter exceeds the value of 96, an interrupt is
generate d and the TXW A R bit in the Erro r Flag regist er
is set.
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DS70149B-page 128 © 2006 Microchip Technology Inc.
19.5.6 TRANSMIT INTERRUPTS
T ransmit interrupts can be divided into 2 major groups,
each including various conditions that generate
interrupts:
Transmit Interrupt
At least one of the three transmit buffers is empty (not
scheduled) and can be loaded to schedule a message
for transmission. Reading the TXnIF flags will indicate
which transmit buffer is available and caused the
interrupt.
Transmit Error Interrupts
A transmission error interrupt will be indicated by the
ERRIF flag. This flag shows that an error condition
occurre d. The source of t he error can be determined b y
checking the error flags in the CAN Interrupt Status
register, CiINTF. The flags i n this regis ter are rel ated to
receive and transmit errors.
Transmitter Warning Interrupt
The TXWAR bit indicates that the Transmit Error
Counter has reached the CPU warning limit of 96
Transmitter Error Passive
The TXEP bit (CiINTF<12>) indicates that the
Transmit Error Counter has exceeded the error
passive limit of 127 and the module has gone to
Error Passive state
Bus Off
The TXBO bit (CiINTF<13>) indicates that the
Transmit Error Counter has exceeded 255 and
the module has gone to Bus Off state
19.6 Baud Rate Setting
All nodes on any particular CAN bus must have the
same nomin al bit rate. In ord er to set the baud rate, the
following parameters have to be initialized:
Syn chronization Jump Width
Baud rate prescaler
Phase segments
Length determination of Phase2 Seg
Sample Poi nt
Propagation segment bits
19.6.1 BI T TIMING
All controllers on the CAN bus must have the same
baud rate and bit length. However, different controllers
are not required to have the same master oscillator
clock. At different clock frequencies of the individual
controllers, the baud rate has to be adjusted by
adjusti ng the num be r of time quan t a in eac h segm en t.
The Nominal Bit Time can be thought of as being
divided into separate non-overlapping time segments.
These segments are shown in Figure 19-2.
Synchroniz ati on se gm ent (Syn c Seg)
Pr opagation time segment (P rop Seg)
Phase segment 1 (Phase1 Seg)
Phase segment 2 (Phase2 Seg)
The time segments and also the nominal bit time are
made up of integer units of time called time quanta or
TQ. By defini tio n, th e No mi na l Bit Time has a minimum
of 8 TQ and a maximum of 25 TQ. Also, by definition,
the min im um no mi nal bit time is 1 μsec, corr espon ding
to a maximum bit rate of 1 MHz.
FIGURE 19-2: CAN BIT TIMING
Input Signal
Sync Prop
Segment Phase
Segment 1 Phase
Segment 2 Sync
Sample Point
TQ
© 2006 Microchip Technology Inc. DS70149B-page 129
dsPIC30F5015/5016
19.6.2 PRESCALER SETTING
There is a programmable prescaler, with integral
values ranging from 1 to 64, in addition to a fixed divide-
by-2 for clock gen erat ion . The Time Quantum (TQ) is a
fixed u nit of time derive d from the os cill ator per iod , and
is given by Equation 19-1, where FCAN is FCY (if the
CANCKS bit is set or 4 FCY if CANCKS is cleared).
EQUATION 19-1: TIME QUANTUM FOR
CLOCK GENERATION
19.6.3 PROPAGATION SEGMENT
This p art of t he bit time is u sed to com pensa te phy sica l
delay ti me s withi n the ne twork . These delay times co n-
sist of the signal propagation time on the bus line and
the internal delay time of the nodes. The Propagation
Segment can be programmed from 1TQ to 8 TQ by
setting the PRSEG<2:0> bits (CiCFG2<2:0>).
19.6.4 PHASE SEGMENTS
The phase segments are used to optimally locate the
sampling of the received bit within the transmitted bit
time. The sampling point is between Phase1 Seg and
Phase2 Seg. These segmen ts are lengthen ed or sho rt-
ened by res ynchronizatio n. The end of the Phase1 Seg
determines the sampling point within a bit period. The
segment is programmable from 1TQ to 8 TQ. Phase2
Seg provides delay to the next transmitted data transi-
tion. Th e segment is programmable from 1 TQ to 8 TQ,
or it may be defined to be equal to the greater of
Phase1 Seg or the Information Processing Time
(2 TQ). The Phase1 Seg is initialized by setting bits
SEG1PH<2:0> (CiCFG2<5:3>) and Phase2 Seg is
initialized by setting SEG2PH<2:0> (CiCFG2<10:8>).
The following requirement must be fulfilled while setting
the lengths of the Phase Segments:
Prop ag ati on Segm en t + Phase1 Seg > = Phas e2
Seg
19.6.5 SAMPLE POINT
The sample point is the point of time at which the bus
level is read and interpreted as the value of that respec-
tive bi t. The loca tio n i s at the end of Phas e1 Seg . I f th e
bit timin g is slow and cont ains many TQ, it is possible to
specify multiple sampling of the bus line at the sample
point. The level determin ed by the CAN bus then co rre-
sponds to the result from the majority decision of three
values. The majority samples are taken at the sample
point and twice before with a distance of TQ/2. The
CAN module allows the user to choose between sam-
pling thre e times at the s ame point or once at the same
point, by setting or clea ring the SAM bit (CiC FG2<6>).
Typically, the sampling of the bit should take place at
about 60-70% through the bit time, depending on the
system parameters.
19.6.6 SYNCHRONIZATION
To compensate for phase shifts between the oscillator
frequencies of the different bus stations, each CAN
controller must be able to synchronize to the relevant
signal edge of the incoming signal. When an edge in
the transmitted data is detected, the logic will compare
the loc ation of the edge t o th e expec ted tim e (Syn chro-
nous Segment). The circuit will then adjust the values
of Phase1 Seg and Phase2 Seg. There are 2
mechanisms used to synchronize.
19.6.6. 1 Hard Synchr oni za tio n
Hard Sync hro niz ati on is o nl y don e wheneve r t here i s a
‘recessive’ to ‘dominant’ edge during Bus Idle, indicat-
ing the start of a message. After hard synchronization,
the bit time counters are restarted with the Synchro-
nous Segment. Hard synchronization forces the edge
which has caused the hard sy nchroniz ation to l ie within
the sync hronization segment o f the rest arted bit ti me. If
a hard synchronization is done, there will not be a
resynchronization within that bit time.
19.6.6.2 Resynchronization
As a result of resynchronization, Phase1 Seg may be
lengthened or Phase2 Seg may be shortened. The
amount of lengthening or shortening of the phase
buffer segment has an upper bound known as the
synchronization jump width, and is specified by the
SJW<1:0> bits (CiCFG1<7:6>). The value of the
synchronization jump width will be added to Phase1
Seg or subtracted from Phase2 Seg. The
resynchronization jump width is programmable
between 1TQ and 4 TQ.
The following requirement must be fulfilled whi le setting
the SJW<1:0> bits:
Phase2 Seg > Synchronizati on Jump Width
Note: FCAN must not exceed 30 MHz. If
CANCKS = 0, then FCY must not exceed
7.5 MHz.
TQ = 2 (BRP<5:0> + 1)/FCAN
dsPIC30F5015/5016
DS70149B-page 130 © 2006 Microchip Technology Inc.
TABLE 19-1: CAN1 REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
C1RXF0SID 0300 Receive Acceptance Filter 0 Standard Identifier<10:0> EXIDE 000u uuuu uuuu uu0u
C1RXF0EIDH 0302 Receive Acceptance Filter 0 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RXF0EIDL 0304 Receive Acceptance Filter 0 Extended Identifier<5:0> uuuu uu00 0000 0000
C1RXF1SID 0308 Receive Acceptance Filter 1 Standard Identifier<10:0> EXIDE 000u uuuu uuuu uu0u
C1RXF1EIDH 030A Receive Acceptance Filter 1 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RXF1EIDL 030C Receive Acceptance Filter 1 Extended Identifier<5:0> uuuu uu00 0000 0000
C1RXF2SID 0310 Receive Acceptance Filter 2 Standard Identifier<10:0> EXIDE 000u uuuu uuuu uu0u
C1RXF2EIDH 0312 Receive Acceptance Filter 2 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RXF2EIDL 0314 Receive Acceptance Filter 2 Extended Identifier<5:0> uuuu uu00 0000 0000
C1RXF3SID 0318 Receive Acceptance Filter 3 Standard Identifier <10:0> EXIDE 000u uuuu uuuu uu0u
C1RXF3EIDH 031A Receive Acceptance Filter 3 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RXF3EIDL 031C Receive Acceptance Filter 3 Extended Identifier<5:0> uuuu uu00 0000 0000
C1RXF4SID 0320 Receive Acceptance Filter 4 Standard Identifier<10:0> EXIDE 000u uuuu uuuu uu0u
C1RXF4EIDH 0322 Receive Acceptance Filter 4 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RXF4EIDL 0324 Receive Acceptance Filter 4 Extended Identifier<5:0> uuuu uu00 0000 0000
C1RXF5SID 0328 Receive Acceptance Filter 5 Standard Identifier<10:0> EXIDE 000u uuuu uuuu uu0u
C1RXF5EIDH 032A Receive Acceptance Filter 5 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RXF5EIDL 032C Receive Acceptance Filter 5 Extended Identifier<5:0> uuuu uu00 0000 0000
C1RXM0SID 0330 Receive Acceptance Mask 0 Standard Identifier<10:0> MIDE 000u uuuu uuuu uu0u
C1RXM0EIDH 0332 Receive Acceptance Mask 0 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RXM0EIDL 0334 Receive Acceptance Mask 0 Extended Identifier<5:0> uuuu uu00 0000 0000
C1RXM1SID 0338 Receive Acceptance Mask 1 Standard Identifier<10:0> MIDE 000u uuuu uuuu uu0u
C1RXM1EIDH 033A Receive Acceptance Mask 1 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RXM1EIDL 033C Receive Acceptance Mask 1 Extended Identifier<5:0> uuuu uu00 0000 0000
C1TX2SID 0340 Transmit Buffer 2 Standard Identifier <10:6> Transmit Buffer 2 Standard Identifier<5:0> SRR TXIDE uuuu u000 uuuu uuuu
C1TX2EID 0342 Transmit Buffer 2 Extended Identifier<17:14> Transmit Buffer 2 Extended Identifier<13:6> uuuu 0000 uuuu uuuu
C1TX2DLC 0344 Transmit Buffer 2 Extended Identifier<5:0> TXRTR TXRB1 TXRB0 DLC<3:0> uuuu uuuu uuuu u000
C1TX2B1 0346 Transmit Buffer 2 Byte 1 Transmit Buffer 2 Byte 0 uuuu uuuu uuuu uuuu
C1TX2B2 0348 Transmit Buffer 2 Byte 3 Transmit Buffer 2 Byte 2 uuuu uuuu uuuu uuuu
C1TX2B3 034A Transmit Buffer 2 Byte 5 Transmit Buffer 2 Byte 4 uuuu uuuu uuuu uuuu
C1TX2B4 034C Transmit Buffer 2 Byte 7 Transmit Buffer 2 Byte 6 uuuu uuuu uuuu uuuu
C1TX2CON 034E TXABT TXLARB TXERR TXREQ TXPRI<1:0> 0000 0000 0000 0000
C1TX1SID 0350 Transmit Buffer 1 Standard Identifier<10:6> Transmit Buffer 1 Standard Identifier<5:0> SRR TXIDE uuuu u000 uuuu uuuu
C1TX1EID 0352 Transmit Buffer 1 Extended Identifier<17:14> Transmit Buffer 1 Extended Identifier<13:6> uuuu 0000 uuuu uuuu
C1TX1DLC 0354 Transmit Buffer 1 Extended Identifier<5:0> TXRTR TXRB1 TXRB0 DLC<3:0> uuuu uuuu uuuu u000
C1TX1B1 0356 Transmit Buffer 1 Byte 1 Transmit Buffer 1 Byte 0 uuuu uuuu uuuu uuuu
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
© 2006 Microchip Technology Inc. DS70149B-page 131
dsPIC30F5015/5016
C1TX1B2 0358 Transmit Buffer 1 Byte 3 Transmit Buffer 1 Byte 2 uuuu uuuu uuuu uuuu
C1TX1B3 035A Transmit Buffer 1 Byte 5 Transmit Buffer 1 Byte 4 uuuu uuuu uuuu uuuu
C1TX1B4 035C Transmit Buffer 1 Byte 7 Transmit Buffer 1 Byte 6 uuuu uuuu uuuu uuuu
C1TX1CON 035E TXABT TXLARB TXERR TXREQ TXPRI<1:0> 0000 0000 0000 0000
C1TX0SID 0360 Transmit Buffer 0 Standard Identifier<10:6> Transmit Buffer 0 Standard Identifier<5:0> SRR TXIDE uuuu u000 uuuu uuuu
C1TX0EID 0362 Transmit Buffer 0 Extended Identifier<17:14> Transmit Buffer 0 Extended Identifier<13:6> uuuu 0000 uuuu uuuu
C1TX0DLC 0364 Transmit Buffer 0 Extended Identifier<5:0> TXRTR TXRB1 TXRB0 DLC<3:0> uuuu uuuu uuuu u000
C1TX0B1 0366 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 uuuu uuuu uuuu uuuu
C1TX0B2 0368 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 uuuu uuuu uuuu uuuu
C1TX0B3 036A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 uuuu uuuu uuuu uuuu
C1TX0B4 036C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 uuuu uuuu uuuu uuuu
C1TX0CON 036E TXABT TXLARB TXERR TXREQ TXPRI<1:0> 0000 0000 0000 0000
C1RX1SID 0370 Receive Buffer 1 Standard Identifier<10:0> SRR RXIDE 000u uuuu uuuu uuuu
C1RX1EID 0372 Receive Buffer 1 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RX1DLC 0374 Receive Buffer 1 Extended Identifier<5:0> RXRTR RXRB1 RXRB0 DLC<3:0> uuuu uuuu 000u uuuu
C1RX1B1 0376 Receive Buffer 1 Byte 1 Receive Buffer 1 Byte 0 uuuu uuuu uuuu uuuu
C1RX1B2 0378 Receive Buffer 1 Byte 3 Receive Buffer 1 Byte 2 uuuu uuuu uuuu uuuu
C1RX1B3 037A Receive Buffer 1 Byte 5 Receive Buffer 1 Byte 4 uuuu uuuu uuuu uuuu
C1RX1B4 037C Receive Buffer 1 Byte 7 Receive Buffer 1 Byte 6 uuuu uuuu uuuu uuuu
C1RX1CON 037E —RXFUL RXRTRRO FILHIT<2:0> 0000 0000 0000 0000
C1RX0SID 0380 Receive Buffer 0 Standard Identifier<10:0> SRR RXIDE 000u uuuu uuuu uuuu
C1RX0EID 0382 Receive Buffer 0 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RX0DLC 0384 Receive Buffer 0 Extended Identifier<5:0> RXRTR RXRB1 RXRB0 DLC<3:0> uuuu uuuu 000u uuuu
C1RX0B1 0386 Receive Buffer 0 Byte 1 Receive Buffer 0 Byte 0 uuuu uuuu uuuu uuuu
C1RX0B2 0388 Receive Buffer 0 Byte 3 Receive Buffer 0 Byte 2 uuuu uuuu uuuu uuuu
C1RX0B3 038A Receive Buffer 0 Byte 5 Receive Buffer 0 Byte 4 uuuu uuuu uuuu uuuu
C1RX0B4 038C Receive Buffer 0 Byte 7 Receive Buffer 0 Byte 6 uuuu uuuu uuuu uuuu
C1RX0CON 038E —RXFUL RXRTRRO DBEN JTOFF FILHIT0 0000 0000 0000 0000
C1CTRL 0390 CANCAP CSIDLE ABAT CANCKS REQOP<2:0> OPMODE<2:0> ICODE<2:0> 0000 0100 1000 0000
C1CFG1 0392 SJW<1:0> BRP<5:0> 0000 0000 0000 0000
C1CFG2 0394 —WAKFIL SEG2PH<2:0> SEG2PHTS SAM SEG1PH<2:0> PRSEG<2:0> 0u00 0uuu uuuu uuuu
C1INTF 0396 RX0OVR RX1OVR TXBO TXEP RXEP TXWA
RRXWAR EWARN IVRIF WAKIF ERRIF TX2IF TX1IF TX0IF RX1IF RX0IF 0000 0000 0000 0000
C1INTE 0398 IVRIE WAKIE ERRIE TX2IE TX1IE TX0IE RX1E RX0IE 0000 0000 0000 0000
C1EC 039A Transmit Error Count Register Receive Error Count Register 0000 0000 0000 0000
TABLE 19-1: CAN1 REGISTER MAP (CONTINUED)
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
dsPIC30F5015/5016
DS70149B-page 132 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 133
dsPIC30F5015/5016
20.0 SYSTEM INTEGRATION
There are several features intended to maximize sys-
tem reliability, minimize cost through elimination of
external components, provide power-saving operating
modes and of fer code protection:
Oscillator Selection
Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Programmable Brown-out Reset (BOR)
Watchdog Timer (WDT)
Power-Saving modes (Sleep and Idle)
Code Protection
Unit ID Locations
In-Circuit Serial Programming (ICSP)
dsPIC30F devices have a Watchdog Timer, which is
permanently enabled via the Configuration bits or can
be software controlled. It runs off its own RC oscillator
for added reliability. There are two timers that offer
necessary delays on power-up. One is the Oscillator
Start-up Timer (OST), intended to keep the chip in
Reset until the crystal oscillator is stable. The other is
the Power-up Timer (PWRT), which provides a delay
on power-up only, designed to keep the part in Reset
while the power supply stabilizes. With these two tim-
ers on-chip, most applications need no external Reset
circuitry.
Sleep mode is designed to offer a very low-current
Power-Down mode. The user ca n wake -up fro m Slee p
through external Reset, Watchdog Timer Wake-up or
through an inte rrupt. Several os cillator opti ons are also
made available to allow the part to fit a wide variety of
applications. In the Idle mode, the clock sources are
still active, but the CPU is shut-off. The RC oscillator
option saves system cost, while the LP crystal option
saves power.
20.1 Oscillator System Overview
The dsPIC30F oscillator system has the following
modules and features:
Various external and internal oscillator options as
clock sources
An on-chip PLL to boost internal operating
frequency
A clock switching mechanism between various
clock sources
Programm abl e c loc k pos t s ca ler for system po w er
savings
A Fail-Safe Clock Monitor (FSCM) that detects
clock failure and takes fail-safe measures
Clock Control register OSCCON
Configuration bits for main oscillator selection
Configuration bits determine the clock source upon
Power-on Reset (POR) and Brown-out Reset (BOR).
Thereafter, the clock source can be changed between
permiss ible c lock sourc es. The O SCCO N registe r co n-
trols the clock switching and reflects system clock
related Status bits.
Table 20-1 pro vi des a sum mar y of the dsPIC3 0F os ci l-
lator operating modes. A simplified diagram of the
oscillator system is shown in Figure 20-1.
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and pro-
grammi ng, refe r to the “dsPIC30F/33F
Programmer’s Reference Manual(DS70157).
dsPIC30F5015/5016
DS70149B-page 134 © 2006 Microchip Technology Inc.
TABLE 20-1: OSCILLATOR OPERATING MODES
Oscillator Mode Description
XTL 200 kHz-4 MHz crystal on OSC1:OSC2
XT 4 MHz-10 MHz crystal on OS C1:OSC2
XT w/PLL 4x 4 MHz-10 MHz crystal on OSC1:OSC2, 4x PLL enabled
XT w/PLL 8x 4 MHz-10 MHz crystal on OSC1:OSC2, 8x PLL enabled
XT w/PLL 16x 4 MHz-7.5 MHz crystal on OSC1:OSC2, 16x PLL enabled(1)
LP 32 kHz crystal on SOSCO:SOSCI(2)
HS 10 MHz-25 MHz crystal
HS/2 w/PLL 4x 10 MHz-20 MHz c rystal , divide by 2, 4x P LL enable d(3)
HS/2 w/PLL 8x 10 MHz-20 MHz c rystal , divide by 2, 8x P LL enable d(3)
HS/2 w/PLL 16x 10 MHz-15 MHz crystal, divide by 2, 16x PLL enabled(1)
HS/3 w/PLL 4x 12 MHz-25 MHz c rystal , divide by 3, 4x P LL enable d(4)
HS/3 w/PLL 8x 12 MHz-25 MHz c rystal , divide by 3, 8x P LL enable d(4)
HS/3 w/PLL 16x 12 MHz-22.5 MHz crystal, divide by 3, 16x PLL enabled(1)(4)
EC External clock input (0-40 MHz)
ECIO External clock input (0-40 MHz), OSC2 pin is I/O
EC w/PLL 4x External clock input (4-10 MHz), OSC2 pin is I/O, 4x PLL enabled
EC w/PLL 8x External clock input (4-10 MHz), OSC2 pin is I/O, 8x PLL enabled
EC w/PLL 16x External clock input (4-7.5 MHz), OSC2 pin is I/O, 16x PLL enabled(1)
ERC External RC oscillator, OSC2 pin is FOSC/4 outp ut(5)
ERCIO External RC oscillator, OSC2 pin is I/O(5)
FRC 7.37 MHz internal RC oscillator
FRC w/PLL 4x 7.37 MHz internal RC oscillator, 4x PLL enabled
FRC w/PLL 8x 7.37 MHz internal RC oscillator, 8x PLL enabled
FRC w/PLL 16x 7.37 MHz internal RC oscillator, 16x PLL enabled
LPRC 512 kHz internal RC oscillator
Note 1: Any higher will violate device operating frequency range.
2: LP oscillator can be conveniently shared as system clock, as well as Real-Time Clock for Timer1.
3: Any higher will violate PLL input range.
4: Any lower will violate PLL input range.
5: Requires external R and C. Frequency operation up to 4 MHz.
© 2006 Microchip Technology Inc. DS70149B-page 135
dsPIC30F5015/5016
FIGURE 20-1: OSCILLATOR SYSTEM BLOCK DIAGRAM
Primary
OSC1
OSC2
SOSCO
SOSCI
Oscillator
32 kHz LP
Clock
and Control
Block
Switching
Oscillator
x4, x8, x16
PLL
Primary
Oscillator
Stability Detector
Stability Detector
Secondary
Oscillator
Programmable
Clock Divider
Oscillator
Start-up
Timer
Fail-Safe Clock
Monitor (FSCM)
Internal Fast RC
Oscillator (FRC)
Internal
Low-Power RC
Oscillator (LPRC)
PWRSAV Instruction
Wake-up Request
Oscillator Configuration Bits
System
Clock
Oscillator Trap
to Timer1
LPRC
Secondary Osc
POR Done
Primary Osc
FPLL
POST<1:0>
2
FCKSM<1:0> 2
PLL
Lock COSC<1:0>
NOSC<1:0>
OSWEN
CF
TUN<4:0>
5
dsPIC30F5015/5016
DS70149B-page 136 © 2006 Microchip Technology Inc.
20.2 Oscillator Configurations
20.2.1 INITIAL CLOCK SOURCE
SELECTION
While coming out of Power-on Reset or Brown-out
Reset, th e device sel ects its clock source based on:
a) FOS<2:0> Configuration bits that select one of
four oscillator groups.
b) AND FPR<4:0> Configuration bits that select
one of 16 oscillator choices within the primary
group.
The selection is as shown in Table 20-2.
TABLE 20-2: CONFIGURATION BIT VALUES FOR CLOCK SELECTION
Oscillator Mode Oscillator
Source FOS<2:0> FPR<4:0> OSC2 Function
ECIO w/PLL 4x PLL 11101101 I/O
ECIO w/PLL 8x PLL 11101110 I/O
ECIO w/PLL 16x PLL 11101111 I/O
FRC w/PLL 4x PLL 11100001 I/O
FRC w/PLL 8x PLL 11101010 I/O
FRC w/PLL 16x PLL 11100011 I/O
XT w/PLL 4x PLL 11100101 OSC2
XT w/PLL 8x PLL 11100110 OSC2
XT w/PLL 16x PLL 11100111 OSC2
HS/2 w/PLL 4x PLL 11110001 OSC2
HS/2 w/PLL 8x PLL 11110010 OSC2
HS/2 w/PLL 16x PLL 11110011 OSC2
HS/3 w/PLL 4x PLL 11110101 OSC2
HS/3 w/PLL 8x PLL 11110110 OSC2
HS/3 w/PLL 16x PLL 11110111 OSC2
ECIO External 01101100 I/O
XT External 01100100 OSC2
HS External 01100010 OSC2
EC External 01101011 CLKO
ERC External 01101001 CLKO
ERCIO External 01101000 I/O
XTL External 01100000 OSC2
LP Secondary 000xxxxx (Note 1, 2)
FRC Internal FRC 001xxxxx (Note 1, 2)
LPRC Internal LPRC 010xxxxx (Note 1, 2)
Note 1: OSC2 pin function is determined by FPR<4:0>.
2: OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is
selected at all times.
© 2006 Microchip Technology Inc. DS70149B-page 137
dsPIC30F5015/5016
20.2.2 O SCIL LA TOR START-UP TIMER
(OST)
In order to ensure that a crystal oscillator (or ceramic
resonator) has started and stabilized, an Oscillator
Start-up Timer is included. It is a simple 10-bit counter
that counts 1024 TOSC cycles before releasing the
oscil lator clock t o th e rest of the syste m. The t ime-ou t
period is designated as TOST. The TOST time is
involv ed ev ery time the osci lla tor has to res t art (i.e., on
POR, BOR and wake-up from Sleep). The Oscillator
Start-up Timer is applied to the LP, XT, XTL, and HS
Oscil la tor m od es (upo n wak e-u p fro m Slee p, PO R an d
BOR) for the primary oscillator.
20.2.3 LP OSCILLATOR CONTROL
Enabling the LP oscillator is controlled with two
elements:
1. The current oscillator group bits COSC<2:0>
2. The LPOSCEN bit (OSC CO N regis ter)
The LP oscillator is ON (even during Sleep mode) if
LPOSCEN = 1. The LP oscillator is the device clock if:
COSC<2:0> =
000
(LP se lected as m ain oscilla tor)
and
LPOSCEN = 1
Keeping the LP oscillator ON at all times allows for a
fast swit ch to the 3 2 kHz syst em cl oc k f or lowe r powe r
operation. Returning to the faster main oscillator will
still require a start-up time.
20.2.4 PHASE LOCKED LOOP (PLL)
The PLL multi plies the clock wh ic h is gen era ted by the
primary oscillator. The PLL is selectable to have either
gains of x4, x8 and x16. Input and output frequency
ranges are summarized in Table 20-3.
TABLE 20-3: PLL FREQUENCY RANGE
The PLL fe atures a loc k output, which i s asserted when
the PLL enters a phase locked state. Should the loop
fall out of lock (e.g ., due to nois e), the lock signal will b e
rescinded. The state of this signal is reflected in the
read-only LOCK bi t in the OSCCON register.
20.2.5 FAST RC OSCILLATOR (FRC)
The FRC oscillator is a fast (7.37 MHz ±2% nominal)
internal RC o sc il lato r. This oscil la tor i s intended to pro-
vide reasonable device operating speeds without the
use of an external crystal , ceramic res onator or RC net-
work. The FRC oscillator can be used with the PLL to
obtain higher clock frequencies.
The dsPIC3 0F o pera tes fro m th e FRC o scil lat or w he n-
ever the current oscillator selection control bits in the
OSCCON register (OSCCON<14:12>) are set to ‘001’.
The six bit field specified by TUN<4:0>
(OSCTUN<4:0>) allows the user to tune the internal
fast RC oscillator (nominal 7.37 MHz). The user can
tune the FRC oscillator within a range of +12.6%
(930 kH z) and -13% (9 60 kHz) in step s of 0.4 % aroun d
the factory-calibrated setting, see Table 20-4.
If OSCCON<1 4:12> are set to ‘111’ and F PR<4:0> a re
set to ‘00101’, ‘00110’ or ‘00111’, then a PLL
multiplier of 4, 8 or 16 (respectively) is applied.
TABLE 20-4: FRC TUNING
Fin PLL
Multiplier Fout
4 MHz-10 MHz x4 16 MHz-40 MHz
4 MHz-10 MHz x8 32 MHz-80 MHz
4 MHz-7.5 MH z x16 64 MHz-120 MHz
Note: When a 16x PLL is used, the FRC oscilla-
tor must not be tuned to a frequency
greater than 7.5 MHz.
TUN<5:0>
Bits FRC Frequency
01 1111 +12.6%
01 1110 +12.2%
01 1101 +11.8%
... ...
00 0100 +1.6%
00 0011 +1.2%
00 0010 +0.8%
00 0001 +0.4%
00 0000 Center Frequency (oscillator is
running at calibrated frequency)
11 1111 -0.4%
11 1110 -0.8%
11 1101 -1.2%
11 1100 -1.6%
... ...
10 0011 -11.8%
10 0010 -12.2%
10 0001 -12.6%
10 0000 -13.0%
dsPIC30F5015/5016
DS70149B-page 138 © 2006 Microchip Technology Inc.
20.2.6 LOW-POWER RC OSCILLATOR
(LPRC)
The LPRC oscillator is a component of the Watchdog
Timer (WDT) and oscillates at a nominal frequency of
512 kHz. The LPRC oscillator is the clock source for
the Power-up Timer (PWRT) circuit, WDT and clock
monitor circuits. It may also be used to provide a low
frequency clock source option for applications where
power consumption is critical, and timing accuracy is
not required.
The LPRC oscillator is always enabled at a Power-on
Reset, because it is the clock source for the PWRT.
After the PWRT expires, the LPRC oscillator will
remain ON if one of the following is TRUE:
The Fail-Safe Clock Monitor is enabl ed
The WDT is enabled
The LPRC oscillator is selected as the system
clock via the COSC<2:0> control bits in the
OSCCO N regi st er
If one of the abo ve co nditio ns is not tru e, th e LPRC wil l
shut-off after the PWRT expires.
20.2.7 FAIL-SAFE CLOCK MONITOR
The Fail-Saf e Cl oc k Mo nit or (F SCM) al low s the dev ic e
to conti nue to operate even i n the e vent o f an os cilla tor
failure. The FSCM functi on i s e nab le d by ap pro pria tel y
programming the FCKSM Configuration bits (Clock
Switch and Monitor Selection bits) in the FOSC Con-
figur atio n re gis ter. If the FSCM fun ct ion is ena ble d, th e
LPRC Internal oscillator will run at all times (except
during Sleep mode) and will not be subject to control
by the SWDTEN bit.
In the event of an oscillator failure, the FSCM will
generate a clock failure trap event and will switch the
system clock over to the FRC oscillator. The user will
then have the option to either attempt to restart the
oscillator or execute a controlled shutdown. The user
may decide to treat the trap as a w arm Reset by simpl y
loading the Reset address into the oscillator fail trap
vector. In this event, the CF (Clock Fail) Status bit
(OSCCON<3>) is also set whenever a clock failure is
recognized.
In the event of a clock failure, the WDT is unaffected
and continues to run on the LPRC clock.
If the oscillator has a very slow start-up time coming
out of POR, BOR or Sleep, it is possible that the
PWRT timer will expire before the oscillator has
started. In such cases, the FSCM will be activated and
the FSCM will initiate a clock failure trap, and the
COSC<2:0> bits are loaded with FRC oscillator selec-
tion. This will effectively shut-off the original oscillator
that was trying to start.
The user may detect this situation and restart the
oscillator in the clock fail trap, ISR.
Upon a clock failure detection, the FSCM module will
initiate a clock switch to the FRC oscillator as follows:
1. The COSC bits (OSCCON<14:12>) are loaded
with the FRC oscillator selection value.
2. CF bit is set (OSCCON<3>).
3. OSWEN control bit (OSCCON<0>) is cleared.
For the purpose of clock switching, the clock sources
are sectioned into four groups:
1. Primary
2. Secondary
3. Internal FRC
4. Internal LPRC
The user can switch between these functional groups,
but canno t switch between options within a group. If the
primary group is selected, then the choice within the
group is always determined by the FPR<4:0>
Configuration bits.
The OSC CON register holds t he control and Status bits
related to clock switching.
COSC<2: 0>: R ead -onl y Status bits alway s refl ec t
the current oscillator group in effect.
NOSC<2:0>: Control bits which are written to
indicate the new oscillator group of choice.
- On POR and BOR, COSC<2:0> and
NOSC<2:0> are both l oaded with the
Configuration bit values FOS<2:0>.
LOCK: The LOCK Status bit indicates a PLL lock.
CF: Read-only Status bit indicating if a clock fail
detect has occurred.
OSWEN: Control bit changes from a ‘0’ to a ‘1
when a clock transition sequence is initiated.
Clearing the OSWEN control bit will abort a clock
transition in progress (used for hang-up
situations).
If Configuration bits FCKSM<1:0> = 1x, then the clock
switching and Fail-Safe Clock Monitor functions are
disabled. This is the default Configuration bit setting.
If clock switching is disabled, then the FOS<2:0> and
FPR<4:0> bits directly control the oscillator selection
and the COSC<2:0> bits do not control the clock
selection. However, these bits will reflect the clock
source selection.
Note 1: OSC2 pin function is determined by the
Primary Oscillator mode selection
(FPR<4:0>).
2: Note that O SC1 pin c annot be u sed as a n
I/O pi n, ev en i f the sec ond ary o sc ill ato r o r
an internal clock source is selected at all
times.
Note: The application should not attempt to
switch to a clock of frequency lower than
100 KHz when the Fail-Saf e Clock Moni tor
is enable d. If c loc k s w itc hin g is perfo rme d,
the device may generate an oscillator fail
trap and switch to the Fast RC oscillator.
© 2006 Microchip Technology Inc. DS70149B-page 139
dsPIC30F5015/5016
20.2.8 PROTECTION AGAINST
ACCIDENTAL WRITES TO OSCCON
A write to the OSCCON register is intentionally made
difficult because it controls clock switching and clock
scaling.
To write to the OSCCON low byte, the following code
sequence must be executed without any other
instruc tions in between:
Byte wri te is allow ed for one i nstruction c ycle. Write the
desired value or use bit manipulation instruction.
To write to the OSCCON high byte, the following
instructions must be executed without any other
instruc tions in between:
Byte wri te is allow ed for one i nstruction c ycle. Write the
desired value or use bit manipulation instruction.
20.3 Reset
The dsPIC30F differentiates between various kinds of
Reset:
a) Power-on Reset (POR)
b) MCLR Reset during normal operation
c) MCLR Reset during Sleep
d) Watchdog Timer (WDT) Reset (during normal
operation)
e) Programmable Brown-out Reset (BOR)
f) RESET Instruction
g) Reset cause by trap lockup (TRAPR)
h) Reset caused by illegal opcode, or by using an
uninitialized W register as an Address Pointer
(IOPUWR)
Dif fer ent regi sters a re a ffe cted in dif fe rent w ays by var-
ious Reset conditions. Most registers are not affected
by a WD T wake-up, since this is viewed as the resump-
tion of normal operation. Status bits from the RCON
register are set or cleared differently in different Reset
situations, as indicated in Table 20-5. These bits are
used in s oftwa re to dete rmi ne th e na ture of the Reset.
A block di agram of the on-ch ip Reset circuit is shown in
Figure 20-2.
A MCLR noise filter is provided in the MCLR Reset
path. The filter detects and ignores small pulses.
Internall y generated Res ets do not drive MCLR pi n low .
FIGURE 20-2: RESET SYSTEM BLOCK DIAGRAM
Byte Write “0x46” to OSCCON low
Byte Write “0x57” to OSCCON low
Byte Write0x78to OSCCON high
Byte Write0x9Ato OSCCON high
S
RQ
MCLR
VDD
VDD Rise
Detect POR
SYSRST
Sleep or Idle
Brown-out
Reset BOREN
RESET
Instruction
WDT
Module
Digital
Glitch Filter
BOR
Trap Conflict
Illegal Opcode/
Uninitialized W Register
dsPIC30F5015/5016
DS70149B-page 140 © 2006 Microchip Technology Inc.
20.3.1 POR: POWER-O N RESET
A power-on event will generate an internal POR pulse
when a VDD rise is detected. The Reset pulse w ill occur
at the POR circuit threshold voltage (VPOR), which is
nominally 1.85V. The device supply voltage character-
istics mus t meet spec ified sta rting v olt ag e and rise ra te
requirements. The POR pulse will reset a POR timer
and place the device in the Reset state. The POR also
selects the device clock source identified by the
oscillator configuration fuses.
The POR circuit inserts a small delay, TPOR, which is
nominally 10 μs and ensures that the device bias
circuit s are stable. Furthermore, a user selected power-
up time-out (TPWRT) is applied. The TPWRT pa ra me te r
is based on Configuration bits and can be 0 ms (no
delay), 4 ms, 16 ms or 64 ms. The total delay is at
device power-up TPOR + TPWRT. When these delays
have expired, SYSRST will be negated on the next
leading edge of the Q1 clock, and the PC will jump to
the Reset vector.
The timing for the SYSRST signal is shown in
Figure 20-3 through Figure 20-5.
FIGURE 20-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)
FIGURE 20-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1
TPWRT
TOST
VDD
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
MCLR
TPWRT
TOST
VDD
Internal POR
PWRT T ime-out
OST Time-out
Internal Reset
MCLR
© 2006 Microchip Technology Inc. DS70149B-page 141
dsPIC30F5015/5016
FIGURE 20-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2
20.3.1.1 POR with Long Crystal S tart-up Time
(with FSCM Enabled)
The osci ll ator s t art-up circuit r y is not linked to the POR
circuitry. Some crystal circuits (especially low
frequency crystals) will have a relatively long start-up
time. Th erefore, one or more of the foll owing condit ions
is possible after the POR timer and the PWRT have
expired:
The oscillator circuit has not begun to oscillate.
The Oscillator Start-up Timer has NOT expired (if
a crystal oscillator is used) .
The PLL has not achieved a L OCK (if PLL is
used).
If th e FSCM is enabled and one of th e above c onditions
is true, then a clock failure trap will occur. The device
will automatically switch to the FRC oscillator and the
user can switch to the desired crystal oscillator in the
trap, ISR.
20.3.1.2 Operating without FSCM and PWRT
If the FSCM is disabled and the Power-up Timer
(PWRT) is also disabled, then the device will exit rap-
idly from Reset on power-up. If the clock source is
FRC, LPRC, EXTRC or EC, it will be active
immediately.
If the FSCM is disabled and the system clock has not
start ed, the de vice w ill be in a frozen st ate at th e Res et
vector until the system clock starts. From the user’s
perspective, the device will appear to be in Reset until
a system clock is available.
20.3.2 BOR: PROGRAMMABLE
BROWN-OUT RESET
The BOR (Brown-out Reset) module is based on an
internal voltage reference circuit. The main purpose of
the BOR mo dule is to gener ate a devi ce Reset when
a brown-out condition occurs. Brown-out conditions
are generally caused by glitches on the AC mains
(i.e., missing portions of the AC cycle waveform due
to bad power transmission lines or voltage sags due
to excessive current draw when a large inductive load
is turned on).
The BOR module allows selection of one of the
following voltage trip points:
2.6V-2.71V
•4.1V-4,4V
4.58V-4.73V
A BOR will generate a Reset pulse whi ch will rese t the
device. The BOR will select the clock source, based on
the Configuration bit values (FOS<2:0> and
FPR<4:0>). Furthermore, if an oscillator mode is
selected, the BOR will activate the Oscillator Start-up
Timer (OST). The system clock is held until OST
expires. If the PLL is used, then the clock will be held
until the LOCK bit (OSCCON<5>) is ‘1’.
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
TPWRT
TOST
Note: The BOR volta ge trip point s indica ted here
are nominal values provided for design
guidance only.
dsPIC30F5015/5016
DS70149B-page 142 © 2006 Microchip Technology Inc.
Concurrently, the POR time-out (TPOR) and the PWRT
time-out (TPWRT) will be applied before the internal
Reset is released. If TPWRT = 0 and a crystal oscillator
is being use d, the n a nom inal delay of T FSCM = 100 μs
is applied. The total delay in this case is
(TPOR +TFSCM).
The BOR Status bit (RCON<1>) will be set to indicate
that a BOR has occurred. The BOR circuit, if enabled,
will continue to operate while in Sleep or Idle modes
and wi ll reset th e device sh ould VDD fall below t he BOR
threshold voltage.
FIGURE 20-6: EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW VDD POWER-UP)
Note: Dedicated supervisory devices, such as
the MCP1XX and MCP8XX, may also be
used as an external Power-on Reset
circuit.
Note 1: External Power-on Reset circuit is
requ ir ed on ly if the VDD power-up slope
is too s low . Th e dio de D help s dis charge
the c apacitor quickly when VDD powers
down.
2: R should be suitably chosen so as to
make sure that the voltage drop across
R does not vio late the devi ce’s electrical
specification.
3: R1 should be suitably chosen so as to
limit any curren t flo wing into MCL R from
external capacitor C, in the event of
MCLR/VPP pin breakdown due to Elec-
trostatic Discharge (ESD) or Electrical
Overstress (EOS).
C
R1
R
D
VDD
dsPIC30F
MCLR
© 2006 Microchip Technology Inc. DS70149B-page 143
dsPIC30F5015/5016
Table 20-5 shows the Reset conditions for the RCON
register. Since the c ontrol bits within the RCO N register
are R/W , the information in the table implies that all the
bits are negated prior to the action specified in the
conditi on column.
TABLE 20-5: INITIALIZATION CONDITION FOR RCON REGISTER CASE 1
Table 20-6 shows a second example of the bit
conditions for the RCON register. In this case, it is not
assu med th e use r has s et/ cle ared s peci fic bits pr ior to
action specified in the condition column.
TABLE 20-6: INITIALIZATION CONDITION FOR RCON REGISTER CASE 2
Condition Program
Counter TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR
Power-on Reset 0x000000 000000011
Brown-out Reset 0x000000 000000001
MCLR Reset during normal
operation 0x000000 001000000
Software Reset during
normal ope rati on 0x000000 000100000
MCLR Reset during Sleep 0x000000 001000100
MCLR Reset during Idle 0x000000 001001000
WDT Time-out Reset 0x000000 000010000
WDT Wake-up PC + 2 000010100
Interrupt Wake-up from
Sleep PC + 2(1) 000000100
Clock Failure Trap 0x000004 000000000
Trap Reset 0x000000 100000000
Illegal Operation Trap 0x000000 010000000
Note 1: When the wake-up is du e to an enable d inte rrupt, the PC is loade d with th e corre spond ing in terrupt v ector.
Condition Program
Counter TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR
Power-on Reset 0x000000 000000011
Brown-out Reset 0x000000 uuuuuuu01
MCLR Reset during normal
operation 0x000000 uu10000uu
Software Reset during
normal ope rati on 0x000000 uu01000uu
MCLR Reset during Sleep 0x000000 uu1u001uu
MCLR Reset during Idle 0x000000 uu1u010uu
WDT Time-out Reset 0x000000 uu00100uu
WDT Wake-up PC + 2 uuuu1u1uu
Interrupt Wake-up from
Sleep PC + 2(1) uuuuuu1uu
Clock Failure Trap 0x000004 uuuuuuuuu
Trap Reset 0x000000 1uuuuuuuu
Illegal Operation Reset 0x000000 u1uuuuuuu
Legend: u = unchanged
Note 1: When the wak e-up is due to an enable d interrupt, the PC is loa ded with the co rresponding interrup t vector .
dsPIC30F5015/5016
DS70149B-page 144 © 2006 Microchip Technology Inc.
20.4 Watchdog Timer (WDT)
20.4.1 WATCHDOG TIMER OPERATION
The primary function of the Watchdog Timer (WDT) is
to reset the processor in the event of a software
malfunction. The WDT is a free-running timer, which
runs off an on-chip RC oscillator, requiring no external
component. Therefore, the WDT timer will continue to
operate even if the main processor clock (e.g., the
crystal oscillator) fails.
20.4.2 ENABLING AND DISABLING THE
WDT
The Watchdog Timer can be “enabled” or “disabled”
only through a Configuration bit (FWDTEN) in the
Configuration register FWDT.
Setting FWDTEN = 1 enables the Watchdog Timer.
The enabling is done when programming the device.
By default, after chip-erase, FWDTEN bit = 1. Any
device programmer capable of programming
dsPIC30F devices allows programming of this and
other Configuration bits.
If enabled, the WDT will increment until it overflows or
“times out”. A WDT time-out will force a device Reset
(except during Sleep). To prevent a WDT time-out, the
user must clear the Watchdog Timer using a CLRWDT
instruction.
If a WDT times out during Sleep, the device will wake-
up. The WDT O bit in the RCO N register wil l be cleare d
to indicate a wake-up resulting from a WDT time-out.
Setting FWDTEN = 0 allows user software to enable/
disable the Watchdog Timer via the SWDTEN
(RCON<5>) control bit.
20.5 Power-Saving Modes
There are tw o powe r-savi ng state s that c an be en tered
through the execu tion of a spe ci al ins t ru cti on, PWRSAV.
These are: Sleep and Idle.
The format of the PWRSAV instruc tion is as follows:
PWRSAV <parameter>, where ‘parameter’ defines
Idle or Sleep mode.
20.5.1 SLEEP MODE
In Sleep m ode, t he clo ck to t he CPU a nd peri pheral s is
shutdown. If an on-chip oscillator is being used, it is
shutdown.
The Fail-Safe Clock Monitor is not functional during
Sleep, since there is no clock to monitor. However,
LPRC clock remains active if WDT is ope rational during
Sleep.
The Brown -out protect ion circu it, if enable d, will remai n
functional during Sleep.
The processor wakes up from Sleep if at least one of
the following conditions has occurred:
any interrupt that is individually enabled and
meets the required priority level
any Reset (POR, BOR and MCLR)
WDT time-out
On waking up from Sleep mode, the processor will
restart the same clock that was active prior to entry
into Sleep mode. When clock switching is enabled,
bits COSC<2:0> will determine the oscillator source
that will be used on wake-up. If clock switch is
disabled, then there is only one sy ste m cl ock .
If the clock source is an oscillator, the clock to the
device is held off until OST times out (indicating a sta-
ble oscillator). If PLL is used, the system clock is held
off until LOCK = 1 (indicating that the PLL is stable).
Eith er way, T
POR
, T
LOCK
and T
PWRT
delays are applied
.
If EC, FRC, LPRC o r EXTRC o scillato rs are used, then
a delay of TPOR (~10 μs) is appli ed. This is the smalles t
delay possible on wake-up from Sleep.
Moreover, if LP oscillator was active during Sleep, and
LP is the oscillator used on wake-up, then the start-up
delay will be equal to TPOR. PWRT delay and OST
timer delay are not applied. In order to have the small-
est poss ible sta rt-up delay when waking up fro m Sleep,
one of these faste r wake-up optio ns shoul d be selecte d
before entering Sleep.
Any interrupt that is individually enabled (using the
corresponding IE bit) and meets the prevailing priority
level will be able to wake-up the processor. The proces-
sor will process the interrupt and branch to the ISR. The
Sleep Status bit in RCON re gis ter is set up on w a ke-u p
.
All Resets will wake-up the processor from Sleep
mode. Any Reset, other than POR, will set the Sleep
Status bit. In a POR, the Sleep bit is cleared.
If Watchdog Timer is enabled, then the processor will
wake-up from Sleep mode upon WDT time-out. The
Sleep and WDTO Status bits are both set.
Note: If a POR or BOR occurred, the selection of
the oscillator is based on the FOS<2:0>
and FPR<4:0> Configuration bits.
Note:
In spite of various delays applied (T
POR
,
T
LOCK
and T
PWRT
), the crystal oscillator
(and PLL) may not be active at the end of
the time-out (e.g., for low frequency crys-
tals. In such cases), if FSCM is enabled,
then the device will detect this as a clock
failure and process the clock failure trap,
the FRC oscillator will be enabled, and the
user will have to re-enable the crystal oscil-
lator. If FSCM is not enabled, then the
device will simply suspend execution of
code until the clock is stable, and will
remain in Sleep until the oscillator clock has
started.
© 2006 Microchip Technology Inc. DS70149B-page 145
dsPIC30F5015/5016
20.5.2 IDLE MODE
In Idle mode, the clock to the CPU is shutdown while
periphera ls keep running. Unlike Sleep mode, the clock
sour ce rem ains active .
Several peripherals have a control bit in each module
that allows them to operate during Idle.
LPRC fail-safe clock remains active if clock failure
detect is enabled.
The processor wakes up from Idle if at least one of the
following conditions is true:
on any interrupt that is individually enabled (IE bit
is ‘1’) and meets the required priority level
on any Reset (POR, BOR, MCLR)
on WDT time-out
Upon wake-up from Idle mode, the clock is re-applied
to the CPU and instruction execution begins immedi-
ately, starting with the in stru cti on following the PWRSAV
instruction.
Any interrupt that is individually enabled (using IE bit)
and meets the prevailing priority level will be able to
wake-u p th e p roc es sor. The pro ce ssor w i ll p roc es s th e
interrupt and branch to the ISR. The Idle Status bit in
the RCON register is set upon wake-up.
Any Reset, other than POR, will set the Idle Status bit.
On a POR, the Idle bit is cleared.
If Watchdog Timer is enabled, then the processor will
wake-up from Idle mode upon WDT time-out. The Idle
and WDTO Status bits are both set.
Unlike wake-up from Sleep, there are no time delays
involv ed in wake -up from Idle.
20.6 Device Configuration Registers
The Configuration bits in each device Configuration
register specify some of the device modes and are
prog ramme d by a de vice prog ra mmer, or by using the
In-Circuit Serial Programming (ICSP) feature of the
device. Each device Configuration register is a 24-b it
register, but only the lower 16 bits of each register are
used to hold configuration data. There are four
Configuration registers available to the user:
1. FOSC (0xF80000): Oscillator Configuration
Register
2. FWDT (0xF80002): Watchdog Timer
Configu ration Register
3. FBORPOR (0xF80004): BOR and POR
Configu ration Register
4. FGS (0xF8000A): General Code Segment
Configu ration Register
The placement of the Configuration bits is automati-
cally ha ndled when you sel ect the device in your device
programmer. The desired state of the Configuration
bit s may be spec ified in the s ource cod e (dependent o n
the language tool used), or through the programming
interface. After the device has been programmed, the
application software may read the Configuration bit
values through the table read instructions. For addi-
tional information, please refer to the programming
specifications of the device.
Note: If the code protection configuration fuse
bits (FGS<GCP> and FGS<GWRP>)
have been programmed, an erase of the
entire code-protected device is only
possib le at vol tages VDD 4.5V.
dsPIC30F5015/5016
DS70149B-page 146 © 2006 Microchip Technology Inc.
20.7 Peripheral Module Disable (PMD)
Registers
The Peripheral Module Disable (PMD) registers
provide a method to disable a peripheral module by
stopping all clock sources supplied to that module.
When a pe rip heral is di sa bled via t he a ppropri ate PMD
control bit, the peripheral is in a minimum power
consumption state. The control and status registers
associated with the peripheral will also be disabled so
writes to those registers will have no effect and read
values will be invalid.
A peripheral module will only be enabled if both the
associated bit in the PMD register is cleared and the
peripher al is supported by the specific ds PIC DSC va ri-
ant. If the peripheral is present in the device, it is
enabled in the PMD register by default.
20.8 In-Circuit Debugger
When MPLAB® ICD 2 is selected as a debugger, the
In-Circuit Debugging functionality is enabled. This
function all ow s sim ple debugging funct ion s w hen use d
with MPLAB IDE. When the device has this feature
enabled, some of the resources are not available for
general us e. These reso urces incl ude the first 80 byte s
of data RAM and two I/O pins.
One of four pairs of Debug I/O pins may be selected by
the user using configuration options in MPLAB IDE.
These pin pairs are named EMUD/EMUC, EMUD1/
EMUC1, EMUD2/EMUC2 and EMUD3/EMUC3.
In each c as e, th e se lec te d EMU D p in i s th e Em ula tio n/
Debug Data line, and the EMUC pin is the Emulation/
Debug Clock line. These pins will interface to the
MPLAB ICD 2 module available from Microchip. The
selected pair of Debug I/O pins is used by MPLAB
ICD 2 to send commands and receive responses, as
well as to send and receive data. To use the In-Circuit
Debugger function of the device, the design must
implement ICSP connections to MCLR, VDD, VSS,
PGC, PGD and the selected EMUDx/EMUCx pin pair.
This gives rise to two possibilities:
1. If EMUD/EMUC is selected as the debug I/O pi n
pair, then only a 5-pin interface is required, as
the EMUD and EMUC pin functions are multi-
plexed with the PGD and PGC pin functions in
all dsPIC30F devices.
2. If EMUD1/EMUC1, EMUD2/EMUC2 or EMUD3/
EMUC3 is selected as the debug I/O pin pair,
then a 7-pin interface is required, as the
EMUDx/EMUCx pin functions (x = 1, 2 or 3) are
not multiplexed with the PGD and PGC pin
functions.
Note: If a PMD bit is set, the corresponding mod-
ule is d isabled after a delay of 1 instruc tion
cycle. Sim ilarly, if a PM D bit is clea red, th e
corresponding module is enabled after a
delay of 1 instruction cycle (assuming the
module control registers are already
configured to enable module operation).
© 2006 Microchip Technology Inc. DS70149B-page 147
dsPIC30F5015/5016
TABLE 20-7: SYSTEM INTEGRATION REGISTER MAP FOR dsPIC30F5015/5016
TABLE 20-8: DEVICE CONFIGURATION REGISTER MAP
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
RCON 0740 TRAPR IOPUWR BGST EXTR SWR SWDTEN WDTO SLEEP IDLE BOR POR Depends on type of Reset.
OSCCON 0742 COSC<2:0> NOSC<2:0> POST<1:0> LOCK —CF LPOSCEN OSWEN Depends on Configuration bits.
OSCTUN 0744 TUN<4:0> 0000 0000 0000 0000
PMD1 0770 T5MD T4MD T3MD T2MD T1MD QEIMD PWMMD I2CMD U2MD U1MD SPI2MD SPI1MD —C1MDADCMD
0000 0000 0000 0000
PMD2 0772 IC8MD IC7MD IC6MD IC5MD IC4MD IC3MD IC2MD IC1MD OC8MD OC7MD OC6MD OC5MD OC4MD OC3MD OC2MD OC1MD 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
File Name Addr. Bits 23-16 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
FOSC F80000 —FCKSM<1:0> —FOS<2:0> —FPR<4:0>
FWDT F80002 —FWDTEN FWPSA<1:0> FWPSB<3:0>
FBORPOR F80004 MCLREN PWMPIN HPOL LPOL BOREN BORV<1:0> —FPWRT<1:0>
FGS F8000A GCP GWRP
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F5015/5016
DS70149B-page 148 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 149
dsPIC30F5015/5016
21.0 10-BIT HIGH-SPEED ANALOG-
TO-DIGITAL CONVERTER
(ADC) MODULE
The10-bit high-speed Analog-to-Digital Converter
(ADC) allows conversion of an analog input signal to a
10-bit digital number. This module is based on a Suc-
cessive Approximation Register (SAR) architecture,
and provi des a maximum sampling rate of 1 Msps. The
ADC module has 16 analog inputs which are multi-
plexed into four s ample and hold ampli fiers. The o utput
of the sample and hold is the input into the converter,
which generates the result. The analog reference volt-
ages are software selectable to either the device sup-
ply voltage (AVDD/AVSS) or the voltage level on the
(VREF+/VREF-) pin. The ADC has a unique feature of
being able to operate while the device is in Sleep
mode.
The ADC module has six 16-bit registers:
A/D Control Register1 (ADCON1)
A/D Control Register2 (ADCON2)
A/D Control Register3 (ADCON3)
A/D Input Select Register (ADCHS)
A/D Port Configuration Register (ADPCFG)
A/D Input Scan Selection Register (ADCSSL)
The ADCON1, ADCON2 and ADCON3 registers
control the operation of the ADC module. The ADCHS
register selects the input channels to be converted. The
ADPCFG register configures the port pins as analog
inputs or as digital I/O. The ADCSSL register selects
input s for sca nni ng .
The block diagram of the A/D module is shown in
Figure 21-1.
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
Note: The SSRC<2:0>, ASAM, SIMSAM,
SMPI<3:0>, BUFM and ALTS bits, as well
as the ADCON3 and ADCSSL registers,
must not be written to while ADON = 1.
This would lead to indeterminate results.
dsPIC30F5015/5016
DS70149B-page 150 © 2006 Microchip Technology Inc.
FIGURE 21-1: 10- BIT H IGH-S PEE D A/D FUNCTIONAL BLOCK DIAGRAM
S/H
+
-
10-bit Resu lt Conversion Logic
VREF+ (Note 1)
AVSS
AVDD
ADC
Data
16-wor d, 10- bit
Dual Port
Buffer
Bus Interface
AN12
AN0
AN5
AN7
AN9
AN13
AN14
AN15
AN12
AN1
AN2
AN3
AN4
AN6
AN8
AN10
AN11
AN13
AN14
AN15
AN8
AN9
AN10
AN11
AN4
AN5
AN6
AN7
AN0
AN1
AN2
AN3
CH1
CH2
CH3
CH0
AN5
AN2
AN11
AN8
AN4
AN1
AN10
AN7
AN3
AN0
AN9
AN6
AN1
VREF- (No te 2)
Sample/Sequence
Control
Sample
CH1,CH2,
CH3,CH0
Input MUX
Control
Input
Switches
S/H
+
-
S/H
+
-
S/H
+
-
Format
Note 1: VREF+ is multiplexed with AN0 in the dsPIC30F5015 variant.
2: VREF- is multiplexed with AN1 in the dsPIC30F5015 variant.
© 2006 Microchip Technology Inc. DS70149B-page 151
dsPIC30F5015/5016
21.1 ADC Result Buffer
The module contains a 16-word dual port, read-only
buffer, called ADCBUF0...ADCBUFF, to buffer the A/D
result s. The RAM i s 10 bits wi de, but is read into differe nt
format 16-bit words. The contents of the sixteen ADC
Result Buffer registers, ADCBUF0 through ADCBUFF,
cannot be written by user software.
21.2 Conversion Operation
After th e ADC module has been configu red, the samp le
acquisition is started by setting the SAMP bit. Various
sources, such as a programmable bit, timer time-outs and
external events, will terminate acquisition and start a con-
version. When the A/D conversion is complete, the result
is loaded into ADCBUF0...ADCBUFF, and the A/D
interrupt Flag ADIF and the DONE bit are set after the
number of samples specified by the SMPI bit.
The following steps should be followed for doing an
A/D conversion:
1. Configu re the ADC module:
- Configure analog pins, voltage reference
and digital I/O
- Select A/D input channels
- Select A/D conversi on cl ock
- Select A/D conversi on trig ger
- Turn on A/D module
2. Configure A/D i nterrupt (if required):
- Clear ADIF bit
- Select A/D interrupt priority
3. Start sampling.
4. Wait the required acquisition time.
5. Trigger acquisition end, start conversion
6. Wait for A/D conversion to complete, by either:
- Waiting for the A/D interrupt
- Waiting for the DONE bit to get set
7. Read A/D result buffer, clear ADIF if required.
21.3 Selecting the Conversion
Sequence
Several groups of control bits select the sequence in
which the A/D connects inputs to the sample/hold
channels, converts channels, writes the buffer mem-
ory, and generates interrupts. The sequence is
controlled by the sampling clocks.
The SIMSAM bit controls the acquire/convert
sequence for multiple channels. If the SIMSAM bit is
0’, the two or four se lec ted chan ne ls are acqu ired and
converted sequentially, with two or four sample clocks.
If the SIMSAM bit is 1’, two or four selected channels
are acquired simultaneously, with one sample clock.
The channels are then converted sequentially. Obvi-
ously, if there is only 1 channel selected, the SIMSAM
bit is not applicable .
The CHPS bits selects how many channels are sam-
pled. This can vary from 1, 2 or 4 channels. If CHPS
selects 1 channel, the CH0 channel will be sampled at
the sample clock and converted. The result is stored in
the buffer. If CHPS selects 2 channels, the CH0 and
CH1 channels w ill b e s am pl ed and con ve r ted . If C HP S
selects 4 channels, the CH0, CH1, CH2 and CH3
channels will be sampled and converted.
The SMPI bits select the number of acquisition/conver-
sion sequences that would be performed before an
interrupt occurs. This can vary from 1 sample per
interrupt to 16 samples per interrupt.
The user cannot program a combination of CHPS and
SMPI bits that specifies more than 16 conversions per
interrupt, or 8 conversions per interrupt, depending on
the BUFM bit. The BUFM bit, when set, will split the
16-word results buffer (ADCBUF0...ADCBUFF) into
two 8-word groups. Writing to the 8-word buffers will be
alternate d on each in terrupt event. Use o f the BUFM bit
will depend on how much time is available for moving
data o ut of the buf fers after the inte rrupt, as determine d
by the application.
If the processor can quickly unload a full buffer within
the time it takes to acquire and convert one channel,
the BUFM bit can be ‘0’ and up to 16 conversions may
be done per interrupt. The processor will have one
sample and conversion time to move the sixteen
conversions.
If the processor cannot unload the buffer within the acqui-
sition and conversion time, the BUFM bit should be ‘1’.
For example, if SMPI<3:0> (ADCON2<5:2>) = 0111,
then eight conversions will be loaded into 1/2 of the
buf fer , fol lowing wh ich an int errupt occ urs. The ne xt eight
conversions will be loaded into the other 1/2 of the buffer .
The processor will have the entire time between
int errupt s to m ove the eight co nver sion s.
The ALTS bit can be used to alternate the inputs
select ed durin g the samp ling sequ ence. The i nput mu l-
tiplexer has two sets of sample inputs: MUX A and
MUX B. If the ALTS bit i s ‘0’, onl y the MUX A input s are
selected for sampling. If the ALTS bit is ‘1’ and
SMPI<3:0> = 0000, on the first sample/convert
sequence, the MUX A inputs are selected, and on the
next acquire/convert sequence, the MUX B inputs are
selected.
The CSCNA bit (ADCON2<10>) will allow the CH0
channel inputs to be alternately scanned across a
select ed number of analog i nputs for the MUX A g roup.
The inputs are selected by the ADCSSL register. If a
particular bit in the ADCSSL register is ‘1’, the corre-
sponding input is selected. The inputs are always
scanne d from low er to higher numbered in puts, st arting
after each interrupt. If the number of inputs selected is
greate r than the number of s amples ta ken per int errupt,
the higher numbered inputs are unused.
dsPIC30F5015/5016
DS70149B-page 152 © 2006 Microchip Technology Inc.
21.4 Programming the Start of
Conversion Trigger
The conversion trigger will terminate acquisition and
start the requested conversions.
The SSRC<2:0> bits select the source of the
conversion trigger.
The SSRC bits provide for up to 5 alternate sources of
conversion trigger.
When SSRC<2:0> = 000, the conversion trigger is
under software control. Clearing the SAMP bit will
cause the co nve r si on trigger.
When SSRC<2:0> = 111 (Auto-Start mode), the con-
version trigger is under A/D clock control. The SAMC
bits select the number of A/D clocks between the start
of acqu isitio n and the s t art of conv ers ion . T his p r ov ide s
the fastest conversion rates on multiple channels.
SAMC must always be at least 1 clock cycle.
Other trigger sources can come from timer modules,
Motor Control PWM module, or external interrupts.
21.5 Aborting a Conversion
Clearing the ADON bit during a conversion will abort
the cu rrent conv ersion a nd stop the sam pling sequ enc-
ing. The ADCBUF will not be updated with the partially
completed A/D conversion sample. That is, the
ADCBUF will continue to contain the value of the last
completed conversion (or the last value written to the
ADCBUF register).
If the clearing of the ADON bit coincides with an
auto-start, the clearing has a higher priority.
After the A/D conversion is aborted, a 2 TAD wait is
required before the next sampling may be started by
setting the SAMP bit.
If sequential sampling is specified, the A/D will continue
at the next sample pulse which corresponds with th e next
channel converted. If simultaneous sampling is specified,
the A/D will continue with the next multichannel group
conv ersio n se quen ce.
21.6 Selecting the A/D Conversion
Clock
The A/ D conv ersion requir es 12 TAD. The source of the
A/D conversion clock is software selected using a 6-bit
counter. There are 64 possible options for TAD.
EQUATION 21-1: A/D CONVERSION CLOCK
The internal RC oscillator is selected by setting the
ADRC bit.
For correct A/D conversions, the A/D conversion clock
(TAD) must be selected to ensure a minimum TAD time
of 83.33 nsec (for VDD = 5V). Refer to Section 24.0
“Electrical Characteristics” for minimum TAD under
other ope rati ng con di tion s.
Example 21-1 shows a sample calculation for the
ADCS<5:0> bits, assuming a device operating speed
of 30 MIPS.
EXAMPLE 21-1: A/D CONVERSION CLOCK
CALCULATION
21.7 ADC Speeds
The dsPIC30F 10-bit ADC specifications permit a
maximum 1 Msps sampling rate. Table 21-1
summarizes the conversion speeds for the dsPIC30F
10-bit ADC and the required operating conditions.
Note: To operate the ADC at the maximum
specified conversion speed, the Auto-
Conve rt Trigg er op tion should be s ele cte d
(SSRC = 111) and the Auto-Sample Time
bits should be set to 1 TAD
(SAMC = 00001). This configuration will
give a total conversion period (sample +
convert) of 13 TAD.
The use of any other conversion trigger will
result in additional TAD cycles to
synchronize the external event to the ADC.
TAD = TCY * (0.5*(ADCS<5:0> +1))
ADCS<5:0> = 2 – 1
TAD
TCY
TAD = 84 nsec
ADCS<5:0> = 2 – 1
TAD
TCY
TCY = 33 nsec (30 MIPS)
= 2 • – 1
84 nsec
33 nsec
= 4.09
Therefore,
Set ADCS<5 :0> = 5
Actual TAD = (ADCS<5:0> + 1)
TCY
2
= (9 + 1)
33 nse c
2
= 99 nsec
© 2006 Microchip Technology Inc. DS70149B-page 153
dsPIC30F5015/5016
TABLE 21-1: 10-BIT CONVERSION RATE PARAMETERS
dsPIC30F 10-bit A/D Converter Conversion Rates
A/D Speed TAD
Minimum Sampling
Time Min RS Max VDD Temperature A/D Channels Configuration
Up to
1 Msps(1) 83.33 ns 12 TAD 500Ω4.5V to 5.5V -40°C to +85°C
Up to
750 ksps(1) 95.24 ns 2 TAD 500Ω4.5V to 5.5V -40°C to +85°C
Up to
600 ksps(1) 138.89 ns 12 TAD 500Ω3.0V to 5.5V -40°C to +125°C
Up to
500 ksps 153.85 ns 1 TAD 5.0 kΩ4.5V to 5.5V -40°C to +125°C
Up to
300 ksps 256.41 ns 1 TAD 5.0 kΩ3.0V to 5.5V -40°C to +125°C
Note 1: External VREF- and VREF+ pins must be used for correct operation. See Figure 21-2 for recommended
circuit.
V
REF
-V
REF
+
ADC
ANx S/H
S/H
CH1, CH2 or CH3
CH0
V
REF
-V
REF
+
ADC
ANx S/H CH
X
V
REF
-V
REF
+
ADC
ANx S/H
S/H
CH1, CH2 or CH3
CH0
V
REF
-V
REF
+
ADC
ANx S/H CH
X
ANx or V
REF
-
or
AV
SS
or
AV
DD
V
REF
-V
REF
+
ADC
ANx S/H CH
X
ANx or V
REF
-
or
AV
SS
or
AV
DD
dsPIC30F5015/5016
DS70149B-page 154 © 2006 Microchip Technology Inc.
The configuration guidelines give the required setup
values for the conversion speeds above 500 ksps,
sinc e t h ey r equ i r e ex ter n a l VREF pins usage and there
are some differences in the configuration procedure.
Configuration details that are not critical to the
conversion speed have been omitted.
The following figure depicts the recommended circuit
for the conversion rates above 500 ksps.
FIGURE 21-2: ADC VOLTAGE REFERENCE SCHEMATIC
21.7.1 1 Msps CONFIGURATION
GUIDELINE
The co nfiguration f or 1 Msp s operatio n is depen dent on
whether a single input pin is to be sampled or whether
multiple pins w ill be sampled.
21.7.1.1 Single Analog Input
For conversions at 1 Msps for a single analog input, at
least two sample and hold channels must be enabled.
The analog input multiplexer must be configured so
that the same input pin is connected to both sample
and hold channels. The ADC converts the value held
on one S/H channel, while the second S/H channel
acq uires a new input sample.
21.7.1.2 Multiple Analog Inputs
The ADC can also be used to sample multiple analog
input s using mult iple sampl e and hold chann els. In thi s
case, the total 1 Msp s conversion rat e is divided among
the dif ferent input signa ls. For exampl e, four input s can
be sampl ed at a rate of 250 ksp s for ea ch sig nal or two
inputs could be sampled at a rate of 500 ksps for each
signal. Sequential sampling must be used in this con-
figuration to allow adequate sampling time on each
input.
V
DD
V
DD
V
DD
R2
10
C2
0.1
μ
FC1
0.01
μ
F
R1
10
C8
1 mF
V
DD
C7
0.1 mF
V
DD
C6
0.01 mF
V
DD
C5
1 mF
V
DD
C4
0.1 mF
V
DD
C3
0.01 mF
dsPIC30F5015
1
2
3
4
5
6
MCLR
8
VSS
VDD
11
12
13 36
35
34
33
32
31
30
29
28
27
VDD
64
63
62
61
60
59
58
VDD
VSS
14
VREF-
VREF+
17
18
AVDD
AVSS
21
22
23
24
VSS
AVDD VDD
43
42
VSS
40
39
VDD
37
44
48
47
46
50
49
51
54
53
52
55
45
VDD
VDD
© 2006 Microchip Technology Inc. DS70149B-page 155
dsPIC30F5015/5016
21.7.1.3 1 Msps Configuration Items
The following configuration items are required to
achieve a 1 Msps conversion rate.
Compl y with con di t ion s provided in Table 21-2
Connect external VREF+ and VREF- pins following
the recommended circuit shown in Figure 21-2
Set SSRC<2:0> = 111 in the ADCO N1 regist er to
enable the auto-convert opti on
Enable automatic sampling by setting the ASAM
control bit in the ADCON1 register
Enabl e seq uen tial sam pli ng by cl eari ng the
SIMSAM bit in the ADCON1 register
Enable at least two sample and hold channels by
writing the CHPS<1:0> control bits in the
ADCON2 register
Write the SMPI<3 :0> con trol bit s in the ADCON2
register for the desired number of conversions
between interrupts. At a minimum, set SMPI<3:0>
= 0001 since at least two sample and hold
channels should be enabled
Configure the A/D clock period to be:
by writing to the ADCS<5:0> control bits in the
ADCON3 register
Configure the sampling time to be 2 TAD by
writing: SAMC<4:0> = 00010
Select at least two channels per analog input pin
by writing to the ADCHS register
21.7.2 750 ksps CONFIGURATION
GUIDELINE
The following configuration items are required to
achiev e a 7 50 k s p s con ve r si on ra te. T his co nfiguration
assumes that a single analog input is to be sampled.
Compl y with con di t ion s provided in Table 21-2
Connect external VREF+ and VREF- pins following
the recommended circuit shown in Figure 21-2
Set SSRC<2:0> = 111 in the ADCO N1 regist er to
enable the auto-convert opti on
Enable automatic sampling by setting the ASAM
control bit in the ADCON1 register
Enable one sample and hold channel by setting
CHPS<1:0> = 00 in the ADCON2 register
Write the SMPI<3 :0> con trol bit s in the ADCON2
register for the desired number of conversions
between interrupts
Configure the A/D clock period to be:
by writing to the ADCS<5:0> control bits in the
ADCON3 register
Configure the sampling time to be 2 TAD by
writing: SAMC<4:0> = 00010
21.7.3 600 ksps CONFIGURATION
GUIDELINE
The configuration for 600 ksps operation is dependent
on whether a single input pin is to be sampled or
whether multiple pins will be sampled.
21.7.3. 1 Single Analog Input
When performing conversions at 600 ksps for a single
analog input, at least two sample and hold channels
must be enabl ed. The analog input multip lexer must be
configured so that the same input pin is connected to
both sample and hold channels. The ADC the value
held on one S/H channel, while the second S/H
channel acquires a new input sample.
21.7.3.2 Multiple Analog Input
The ADC can also be used to sample multiple analog
input s using mult iple sampl e and hold chann els. In thi s
case, the total 600 ksps conversion rate is divided
among the different input signals. For example, four
inputs can be sampled at a rate of 150 ksps for each
signal or two inputs can be sampled at a rate of 300
ksps for each signal. Sequential sampling must be
used in this configuration to allow adequate sampling
time on each input.
21.7.3.3 600 ksps Configuration Items
The following configuration items are required to
achieve a 600 ksps conversion rate.
Comply with conditions provided in Table 21-2
Connect external VREF+ and V REF- pins following
the recommended circuit shown in Figure 21-2
Set SSRC<2:0> = 111 in the ADCON1 regist er to
enable the auto-convert option
Enable automatic sampling by setting the ASAM
control bit in the AD CON1 register
Enable sequential sampling by clearing the
SIMSAM bit in the ADCON1 register
Enable at least two sample and hold channels by
writin g the CHPS <1:0> control bits in the
ADCON2 register
Write the SMPI<3:0> control bits in the ADCON2
register for the desired number of conversions
between interrupts. At a minimum, set
SMPI<3:0> = 0001 s ince at least two s ample and
hold channels should be enabled
Config ure the A/D clock period to be:
by writing to the ADCS<5:0> control bits in the
ADCON3 register
Configure the sampling time to be 2 Tad by
writing: SAMC<4:0> = 00010
Select at least two channels per analog input pin
by writing to the ADCHS register
1
12 x 1,000,000 = 83.33 ns
1
(12 + 2) X 750,000 = 95.24 ns
1
12 x 6 00,000 = 138.89 ns
dsPIC30F5015/5016
DS70149B-page 156 © 2006 Microchip Technology Inc.
21.8 ADC Acquisition Requirements
The analog input model of the 10-bit ADC is shown in
Figure 21-3. The total sampling time for the ADC is a
function of the internal amplifier settling time, device
VDD and the holding capacitor charge time.
For the AD C to meet its s pe ci fie d ac cu rac y, the charge
holding capacitor (CHOLD) must be allowed to fully
charge to the volta ge level on the an alog input pin . The
analog ou tput source impedance (RS), the interconnect
impedance (RIC), and the internal sampling switch
(RSS) impedance combine to directly affect the time
required to cha rge the cap acito r CHOLD. The combined
impedance must therefore be small enough to fully
charge the holding capacitor within the chosen sample
time. To minimize the effects of pin leakage currents on
the accura cy of the ADC , the ma ximum recom me nde d
sour ce impedance, RS, is 5 kΩ for conversi on rates up
to 500 ksps and a maximum of 500Ω for conversion
rates up to 1 Msps. After the analog input channel is
selected (changed), this sampling function must be
comple ted p r ior to s t art ing the co nve r si on. Th e internal
holdi ng capaci tor wi ll be i n a disc harged state pr ior to
each sample operation.
The us er mus t all ow at le ast 1 TAD pe riod o f sampl ing
time, TSAMP, between conversions to allow each sam-
ple to be ac quired . This s ample time ma y be co ntrolle d
manually in software by setting/clearing the SAMP bit,
or it ma y be aut om atic al ly con trol led by the AD C. In an
automatic configuration, the user must allow enough
time between conversion triggers so that the minimum
sample time can be satisfied. Refer to Table 24-40 for
TAD and sample time requi rem en t s.
FIGU RE 21-3 : ADC C O NVER T ER AN AL OG IN PUT M O DEL
CPIN
VA
Rs ANx VT = 0.6V
VT = 0.6V I leaka ge
RIC 250ΩSampling
Switch
RSS
CHOLD
= DAC capacitance
VSS
VDD
= 4.4 pF
± 500 nA
Legend: CPIN
VT
I leakage
RIC
RSS
CHOLD
= input capacitance
= threshold voltage
= leakage current at the pin due to
= interconnect resistance
= sampling switch resistance
= sample/hold capacitance (from DAC)
various junctions
Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs 5 kΩ.
RSS 3 kΩ
© 2006 Microchip Technology Inc. DS70149B-page 157
dsPIC30F5015/5016
21.9 Module Power-Down Modes
The module has 3 internal power modes. When the
ADON bit is1’, the module is in Active mode; it is fully
powered and function al. When ADO N is ‘0’, th e module
is in Off mode. The digital and analog portions of the
circuit are disabled for maximum current savings. In
order to return to the Active mode from Off mode, the
user must wait for the ADC circuitry to stabilize.
21.10 ADC Operation During CPU Sleep
and Idle Modes
21.10.1 ADC OPERATION DURING CPU
SLEEP MODE
When the device enters Sleep mode, all clock sources
to the module are shutdown and stay at logic0’.
If Sleep occurs in the middle of a conversion, the con-
version is aborted. The converte r will not c onti nue with
a partially completed conversion on exit from Sleep
mode.
Register contents are not affected by the device
entering or leaving Sleep mode.
The ADC mo dule can op erate during Sl eep mode if th e
ADC cloc k source is se t to RC (ADRC = 1). When the
RC clock source is selected, the ADC module waits
one instruction cycle before starting the conversion.
This allows the SLEEP instruction to be executed,
which eliminates all digital switching noise from the
conversion. When the conversion is complete, the
DONE bit will be set and the result loaded into the
ADCBUF register.
If the A/D interrupt is enabled, the device will wake-up
from Sleep. If the A/D interrupt is not enabled, the A/D
module will then be turned off, although the ADON bit
will remain set.
21.10.2 ADC OPERATION DURING CPU
IDLE MODE
The ADSIDL bit selects if the module w ill s top on Idle or
continue on Idle. If ADSIDL = 0, the module will continue
operation on assertion of Idle mode. If ADSIDL = 1, the
module will stop on Idle.
21.11 Effects of a Reset
A device Reset forces all registers to their Reset state.
This forces the ADC module to be turned off, and any
conversion and acquisition sequence is aborted. The
values that are in the ADCBUF registers are not modi-
fied. The ADC re su lt regi ster w ill c ont ain u nknown dat a
after a Power-on Reset.
21.12 Output Formats
The ADC re su lt i s 10 bits wide. The dat a b uffer RAM i s
also 10 b it s wid e. The 10 -bit data can be read in one of
four different formats. The FORM<1:0> bits select the
format. Each of the outpu t format s trans lates t o a 16-bit
result on the data bus.
Write data will always be in right justified (integer)
format.
FIGURE 21-4: ADC OUTPUT DATA FORMAT S
RAM Contents: d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
Read to Bus:
Signed Fractional (1.15) d09 d08d07d06d05d04d03d02d01d00000000
Fractional (1.15)d09d08d07d06d05d04d03d02d01d00000000
Signed Integer d09 d09 d09 d09 d09 d09 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
Integer 0 0 0 0 0 0 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
dsPIC30F5015/5016
DS70149B-page 158 © 2006 Microchip Technology Inc.
21.13 Configuring Analog Port Pins
The use of the ADPC FG and TRIS registers control the
operation of the ADC port pins. The port pins that are
desired as analog inputs must have their correspond-
ing TRIS bit set (input). If the TRIS bit is cleared (out-
put), the digital output level (VOH or VOL) will be
converted.
The A/D operation is independent of the state of the
CH0SA<3:0>/CH0SB<3:0> bits and the TRIS bits.
When read ing the POR T register, all pins c onfigured a s
analog input channels will read as cleare d.
Pins configured as digital inputs will not convert an
analog i nput. Analog leve ls on any pin that is defined as
a dig ital inp ut (inc luding t he ANx p ins) ma y cause the
input buffer to consume current that exceeds the
device specifications.
21.14 Connection Considerations
The anal og inp uts h ave diod es to VDD and V SS as ESD
protection. This requires that the analog input be
betwee n VDD and VSS. If the input voltage exceeds this
range by greater th an 0.3V (eit her direct ion), one o f the
diodes becomes forward b iased and it may damage the
device if the input curre nt specificati on is exce ede d.
An external RC filter is sometimes added for anti-
aliasi ng of the input signal. The R component should be
select ed to ens ure that the sampl ing time requir ement s
are satisfied. Any external components connected (via
high-impedance) to an analog input pin (capacitor,
zener diode, etc.) should have very little leakage
current at the pin.
© 2006 Microchip Technology Inc. DS70149B-page 159
dsPIC30F5015/5016
TABLE 21-2: ADC REGISTER MAP
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
ADCBUF0 0280 ADC Data Buffer 0 0000 00uu uuuu uuuu
ADCBUF1 0282 ADC Data Buffer 1 0000 00uu uuuu uuuu
ADCBUF2 0284 ADC Data Buffer 2 0000 00uu uuuu uuuu
ADCBUF3 0286 ADC Data Buffer 3 0000 00uu uuuu uuuu
ADCBUF4 0288 ADC Data Buffer 4 0000 00uu uuuu uuuu
ADCBUF5 028A ADC Data Buffer 5 0000 00uu uuuu uuuu
ADCBUF6 028C ADC Data Buffer 6 0000 00uu uuuu uuuu
ADCBUF7 028E ADC Data Buffer 7 0000 00uu uuuu uuuu
ADCBUF8 0290 ADC Data Buffer 8 0000 00uu uuuu uuuu
ADCBUF9 0292 ADC Data Buffer 9 0000 00uu uuuu uuuu
ADCBUFA 0294 ADC Data Buffer 10 0000 00uu uuuu uuuu
ADCBUFB 0296 ADC Data Buffer 1 1 0000 00uu uuuu uuuu
ADCBUFC 0298 ADC Data Buffer 12 0000 00uu uuuu uuuu
ADCBUFD 029A ADC Data Buffer 13 0000 00uu uuuu uuuu
ADCBUFE 029C ADC Data Buffer 14 0000 00uu uuuu uuuu
ADCBUFF 029E ADC Data Buffer 15 0000 00uu uuuu uuuu
ADCON1 02A0 ADON —ADSIDL FORM<1:0> SSRC<2:0> SIMSAM ASAM SAMP DONE 0000 0000 0000 0000
ADCON2 02A2 VCFG<2:0> CSCNA CHPS<1:0> BUFS SMPI<3:0> BUFM ALTS 0000 0000 0000 0000
ADCON3 02A4 SAMC<4:0> ADRC —ADCS<5:0>
0000 0000 0000 0000
ADCHS 02A6 CH123NB<1:0> CH123SB CH0NB CH0SB<3:0> CH123NA<1:0> CH123SA CH0NA CH0SA<3:0> 0000 0000 0000 0000
ADPCFG 02A8 PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 0000 0000 0000
ADCSSL 02AA CSSL15 CSSL14 CSSL13 CSSL12 CSSL11 CSSL10 CSSL9 CSSL8 CSSL7 CSSL6 CSSL5 CSSL4 CSSL3 CSSL2 CSSL1 CSSL0 0000 0000 0000 0000
Legend: u = uninitialized bit
Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bi t fields.
dsPIC30F5015/5016
DS70149B-page 160 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 161
dsPIC30F5015/5016
22.0 INSTRUCTION SET SUMMARY
The dsPIC30F instruction set adds many
enhancements to the previous PICmicro® Microcon-
troller (MCU) instruction sets, while maintaining an
easy migration from PICmicro MCU instruction sets.
Most instructions are a single program memory word
(24 bits). Only three instructions require two program
memory locations.
Each single-word instruction is a 24-bit word divided
into an 8-bit opcode which specifies the instruction
type, and one or more operands which further specify
the operation of the instruction.
The instruction set is highly orthogonal and is grouped
into five bas ic ca tego ries:
Word or byte-oriented operations
Bit-oriented operations
Literal operations
DSP operations
Control operations
Table 22-1 shows the general symbols used in
des c ribing t he instructions.
The dsPIC30F instruction set summary in Table 22-2
lists all the instructions along with the status flags
affected by each instruction.
Most word or byte-oriented W register instructions
(including barrel shift instructions) have three
operands:
The first source operand, which is typically a
register ‘Wb’ without any address modifier
The second source operand, which is t ypically a
register ‘Ws’ with or without an address modifier
The destination of the result, which is typically a
register ‘Wd’ with or without an address modifier
However, word or byte-oriented file register
instructions have two operands:
The file register specified by the value ‘f
The destination, which could either be the file
register ‘f’ or the W0 reg ister, which is de noted as
‘WREG’
Most bit oriented instructions (including simple rotate/
shift instructions) have two operands:
The W register (with or without an address modi-
fier) or file register (specified by the value of ‘Ws’
or ‘f’)
The bit in the W register or file register
(specified by a literal value, or indirectly by the
contents of register ‘Wb’)
The litera l instruct ions that invo lve data m ovement ma y
use some of the following operands:
A lite ral value to be lo aded i nto a W regi ster or file
register (specified by the value of ‘k’)
The W register or file register where the literal
value is to be loaded (specified by ‘Wb’ or ‘f’)
However, literal instructions that involve arithmetic or
logical operations use some of the following operands:
The first source operand, which is a register ‘Wb’
without any addre s s modifier
The second source operand, which is a literal
value
The dest ination of the result (only if not the same
as the first source operand), which is typically a
register ‘Wd’ with or without an address modifier
The MAC class of DSP instructions may use some of the
following operands:
The accumulator (A or B) to be used (required
operand)
The W regis ters t o be used as the two operands
The X and Y address space prefetch operations
The X and Y address space prefetch destinations
The accumulator w rite-back destination
The other DSP instructions do not involve any
multipl ic ati on, and may include:
The accumul ator to be used (requ ired )
The source o r destin ation ope rand (des ignated as
Wso or Wdo, respectively) with or without an
address modifier
The amount of shift, specified by a W register
‘Wn’ or a literal value
The control instructions may use some of the following
operands:
A program memory address
The mode of the table read and table write
instructions
All instructions are a single word, except for certain
double-word instructions, which were made double-
word instructions so that all the required information is
available in these 48 bits. In the second word, the
8MSbs are0’s. I f thi s se co nd wo r d is ex ec ut e d as an
instruction (by itself), it will execute as a NOP.
Note: This data sheet summarizes features of this
group of ds PIC30 F devi ces and is not intende d to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and pro-
grammi ng, refe r to the “dsPIC30F/33F
Programmer’s Reference Manual(DS70157).
dsPIC30F5015/5016
DS70149B-page 162 © 2006 Microchip Technology Inc.
Most single-word instructions are executed in a single
instruc tion cycle, u nle ss a co ndi tional test is tru e or the
program counter is changed as a result of the instruc-
tion. In these cases, the executio n takes tw o instructio n
cycles with the additional instruction cycle(s) executed
as a NOP. Notable exceptions are the BRA (uncondi-
tional/c ompu ted bra nch), i ndirec t CALL/GOTO, al l t abl e
reads and writes and RETURN/RETFIE instructions,
which are single-word instructions, but take two or
three cycles. Certain instructions that involve skipping
over the subsequent instruction, require either two or
three cycles if the skip is performed, depending on
whether the instruction being skipped is a single-word
or two-w ord in struction. Moreover, double-word mo ves
require two cycles. The double-word instructions
execute in two instruction cycles.
Note: For more details on the instruction set,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
TABLE 22-1: SYMBOLS USED IN OPCODE DESCRIPTIONS
Field Description
#text Me ans literal defined by “text
(text) Mean s “content of “text
[text] Means “the location addressed by text
{ } Optional field or operation
<n:m> Register bit field
.b Byte mode selection
.d Double-word mode selection
.S Shadow register select
.w Word mode selection (default)
Acc One of two accumulators {A, B}
AWB Accumulator write-back destination address register {W13, [W13 ] + = 2}
bit4 4-bit bit selection field (used in word addressed instructions) {0...15}
C, DC, N, OV, Z MCU Status bit s: Carry, Digit Carry, Negative, Overfl ow, Zero
Expr Absolute address, label or expression (resolved by the linker)
fFile register address {0x0000...0x1FFF}
lit1 1-bit unsigned literal {0,1}
lit4 4-bit unsigned literal {0...15}
lit5 5-bit unsigned literal {0...31}
lit8 8-bit unsigned literal {0...255}
lit10 10-bit unsigned literal {0...255} for Byte mode, {0:1023} for Word mode
lit14 14-bit unsigned literal {0...16384}
lit16 16-bit unsigned literal {0...65535}
lit23 23-bit unsigned literal {0...8388608}; LSB must be ‘0
None Field does not require an entry, may be blank
OA, OB, SA, SB DSP Status bits: ACCA Overflow, ACCB Overflow, ACCA Saturate, ACCB Saturate
PC Program Counter
Slit10 10-bit signed literal {-512...511}
Slit16 16-bit signed literal {-32768...32767}
Slit6 6-bit signed literal {-16...16}
© 2006 Microchip Technology Inc. DS70149B-page 163
dsPIC30F5015/5016
Wb Base W register {W0..W15}
Wd Destination W register { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }
Wdo Destination W register
{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }
Wm,Wn Dividend, Divisor working register pair (direct addressing)
Wm*Wm Multiplicand and Multiplier working register pair for Square instructions
{W4*W4,W5*W5,W6*W6,W7*W7}
Wm*Wn Multiplicand and Multiplier working register pair for DSP instructions
{W4*W5,W4*W6,W4*W7,W5*W6,W5*W7,W6*W7}
Wn One of 16 working registers {W0..W15}
Wnd One of 16 destination working registers {W0..W15}
Wns One of 16 source working registers {W0..W15}
WREG W0 (working register used in file register instructions)
Ws Source W register { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }
Wso Source W register
{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }
Wx X data space prefetch address register for DSP instructions
{[W8]+ = 6, [W8]+ = 4, [W8]+ = 2, [W8], [W8]- = 6, [W8]- = 4, [W8]- = 2,
[W9]+ = 6, [W9]+ = 4, [W9]+ = 2, [W9], [W9]- = 6, [W9]- = 4, [W9]- = 2,
[W9+W12], none}
Wxd X data space prefetch destination register for DSP instructions {W4..W7}
Wy Y data space prefetch address register for DSP instructions
{[W10]+ = 6, [W10]+ = 4, [W10]+ = 2, [W10], [W10]- = 6, [W10]- = 4, [W10]- = 2,
[W11]+ = 6, [W11]+ = 4, [W11]+ = 2, [W11], [W11]- = 6, [W11]- = 4, [W11]- = 2,
[W11+W12], none}
Wyd Y data space prefetch destination register for DSP instructions {W4..W7}
TABLE 22-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)
Field Description
dsPIC30F5015/5016
DS70149B-page 164 © 2006 Microchip Technology Inc.
TABLE 22-2: INSTRUCTION SET OVERVIEW
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
words # of
cycles Status Flags
Affected
1ADD ADD Acc Add Accumulators 1 1 OA,OB,SA,SB
ADD ff = f + WREG 1 1 C,DC,N,OV,Z
ADD f,WREG WREG = f + WREG 1 1 C,DC,N,OV,Z
ADD #lit10,Wn Wd = lit10 + Wd 1 1 C,DC,N,OV,Z
ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C,DC,N,OV,Z
ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C,DC,N,OV,Z
ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulator 1 1 OA,OB,SA,SB
2ADDC ADDC ff = f + WREG + (C) 1 1 C,DC,N,OV,Z
ADDC f,WREG WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z
ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z
ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z
ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z
3AND AND ff = f .AND. WREG 1 1 N,Z
AND f,WREG WREG = f .AND. WREG 1 1 N,Z
AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N,Z
AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N,Z
AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N,Z
4ASR ASR ff = Arithmetic Right Shift f 1 1 C,N,OV,Z
ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z
ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z
ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N,Z
ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z
5BCLR BCLR f,#bit4 Bit Clear f 1 1 None
BCLR Ws,#bit4 Bit Clear Ws 1 1 None
6BRA BRA C,Expr Branch if Carry 1 1 (2) None
BRA GE,Expr Branch if greate r than or equal 1 1 (2) None
BRA GEU,Expr Branch if unsigned greater than or equal 1 1 (2) None
BRA GT,Expr Branch if greater than 1 1 (2) None
BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None
BRA LE,Expr Branch if less t han or equal 1 1 (2) None
BRA LEU,Expr Branch if unsigned less than or equal 1 1 (2) None
BRA LT,Expr Branch if less than 1 1 (2) None
BRA LTU,Expr Branch if unsigned less than 1 1 (2) None
BRA N,Expr Branch if Negative 1 1 (2) None
BRA NC,Expr Branch if Not Carry 1 1 (2) None
BRA NN,Expr Branch if Not Negative 1 1 (2) None
BRA NOV,Expr Branch if Not Overflow 1 1 (2) None
BRA NZ,Expr Branch if Not Zero 1 1 (2) None
BRA OA,Expr Branch if accumulator A overflow 1 1 (2) None
BRA OB,Expr Branch if accumulator B overflow 1 1 (2) None
BRA OV,Expr Branch if Overflow 1 1 (2) None
BRA SA,Expr Branch if accumulator A saturated 1 1 (2) None
BRA SB,Expr Branch if accumulator B saturated 1 1 (2) None
BRA Expr Branch Unconditionally 1 2 None
BRA Z,Expr Branch if Zero 1 1 (2) None
BRA Wn Computed Branch 1 2 None
7BSET BSET f,#bit4 Bit Set f 1 1 None
BSET Ws,#bit4 Bit Set Ws 1 1 None
8BSW BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None
BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None
9BTG BTG f,#bit4 Bit Toggle f 1 1 None
BTG Ws,#bit4 Bit Toggle Ws 1 1 None
10 BTSC BTSC f,#bit4 Bit Test f, Skip if Clear 1 1
(2 or 3) None
BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1
(2 or 3) None
© 2006 Microchip Technology Inc. DS70149B-page 165
dsPIC30F5015/5016
11 BTSS BTSS f,#bit4 Bit Test f, Skip if Set 1 1
(2 or 3) None
BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1
(2 or 3) None
12 BTST BTST f,#bit4 Bit Test f 1 1 Z
BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C
BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z
BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C
BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z
13 BTSTS BTSTS f,#bit4 Bit Test then Set f 1 1 Z
BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C
BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z
14 CALL CALL lit23 Call subrou ti ne 2 2 None
CALL Wn Call indir ect subr ou ti ne 1 2 None
15 CLR CLR ff = 0x0000 1 1 None
CLR WREG WREG = 0x0000 1 1 None
CLR Ws Ws = 0x0000 1 1 None
CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumulator 1 1 OA,OB,SA,SB
16 CLRWDT CLRWDT Clear Watchdog Timer 1 1 WDTO,Sleep
17 COM COM ff = f 11N,Z
COM f,WREG WREG = f 11N,Z
COM Ws,Wd Wd = Ws 11N,Z
18 CP CP fCompare f with WREG 1 1 C,DC,N,OV,Z
CP Wb,#lit5 Compare Wb with lit5 1 1 C,DC,N,OV,Z
CP Wb,Ws Compare Wb with Ws (Wb – Ws) 1 1 C,DC,N,OV,Z
19 CP0 CP0 fCompare f with 0x0000 1 1 C,DC,N,OV,Z
CP0 Ws Compare Ws with 0x0000 1 1 C,DC,N,OV,Z
20 CPB CPB fCompare f with WREG, with Borrow 1 1 C,DC,N,OV,Z
CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C,DC,N,OV,Z
CPB Wb,Ws Compare Wb with Ws, with Borrow
(Wb – Ws – C)1 1 C,DC,N,OV,Z
21 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1
(2 or 3) None
22 CPSGT CPSGT Wb, Wn Compare Wb with Wn, skip if > 1 1
(2 or 3) None
23 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1
(2 or 3) None
24 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if 11
(2 or 3) None
25 DAW DAW Wn W n = decimal adjust Wn 1 1 C
26 DEC DEC ff = f –1 1 1 C,DC,N,OV,Z
DEC f,WREG WREG = f –1 1 1 C,DC,N,OV,Z
DEC Ws,Wd Wd = Ws – 1 1 1 C,DC,N,OV,Z
27 DEC2 DEC2 ff = f – 2 1 1 C,DC,N,OV,Z
DEC2 f,WREG WREG = f – 2 1 1 C,DC,N,OV,Z
DEC2 Ws,Wd Wd = Ws – 2 1 1 C,DC,N,OV,Z
28 DISI DISI #lit14 Disable Interrupts for k instruction cycles 1 1 None
29 DIV DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N,Z,C, OV
DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N,Z,C, OV
DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N,Z,C, OV
DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N,Z,C, OV
30 DIVF DIVF Wm,Wn Signed 16/16-bit Fractional Divide 1 18 N,Z,C, OV
31 DO DO #lit14,Expr Do code to PC + Expr, lit14 + 1 times 2 2 None
DO Wn,Expr Do code to PC + Expr, (Wn) + 1 times 2 2 None
32 ED ED Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance (no accumulate) 1 1 OA,OB,OAB,
SA,SB,SAB
33 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA,OB,OAB,
SA,SB,SAB
34 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None
TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
words # of
cycles Status Flags
Affected
dsPIC30F5015/5016
DS70149B-page 166 © 2006 Microchip Technology Inc.
35 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 C
36 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C
37 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C
38 GOTO GOTO Expr Go to address 2 2 None
GOTO Wn Go to indirect 1 2 None
39 INC INC ff = f + 1 1 1 C,DC,N,OV,Z
INC f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z
INC Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z
40 INC2 INC2 ff = f + 2 1 1 C,DC,N,OV,Z
INC2 f,WREG WREG = f + 2 1 1 C,DC,N,OV,Z
INC2 Ws,Wd Wd = Ws + 2 1 1 C,DC,N,OV,Z
41 IOR IOR ff = f .IOR. WREG 1 1 N,Z
IOR f,WREG WREG = f .IOR. WREG 1 1 N,Z
IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N,Z
IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N,Z
IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N,Z
42 LAC LAC Wso,#Slit4,Acc Load Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
43 LNK LNK #lit14 Link frame pointer 1 1 None
44 LSR LSR ff = Logical Right Shift f 1 1 C,N,OV,Z
LSR f,WREG WREG = Logical Right Shift f 1 1 C,N,OV,Z
LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C,N,O V,Z
LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N,Z
LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N,Z
45 MAC MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd,
AWB
Multiply and Accumulate 1 1 OA,OB,OAB,
SA,SB,SAB
MAC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate 1 1 OA,OB,OAB,
SA,SB,SAB
46 MOV MOV f,Wn Move f to Wn 1 1 None
MOV fMove f to f 1 1 N,Z
MOV f,WREG Move f to WREG 1 1 N,Z
MOV #lit16,Wn Move 16-bit litera l to Wn 1 1 Non e
MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None
MOV Wn,f Move Wn to f 1 1 None
MOV Wso,Wdo Move Ws to Wd 1 1 None
MOV WREG,f Move WREG to f 1 1 N,Z
MOV.D Wns,Wd Move Double from W(ns):W(ns + 1) to Wd 1 2 None
MOV.D Ws,Wnd Move Double from Ws to W(nd + 1):W(nd) 1 2 None
47 MOVSAC MOVSAC Acc,Wx,Wxd,Wy,Wyd,AWB Prefetch and store Accumulator 1 1 None
48 MPY MPY
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd Multiply Wm by Wn to Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
MPY
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square Wm to Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
49 MPY.N MPY.N
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd -(Multiply Wm by Wn) to Accumulator 1 1 None
50 MSC MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd,
AWB
Multiply and Subtract from Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
51 MUL MUL.SS Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * signed(Ws) 1 1 None
MUL.SU Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * unsigned(Ws) 1 1 None
MUL.US Wb,Ws,Wnd {Wnd+1, Wnd} = unsigned(Wb) * signed(Ws) 1 1 None
MUL.UU Wb,Ws,Wnd {Wnd+1, Wnd} = unsigned(Wb) *
unsigned(Ws) 11None
MUL.SU Wb,#lit5,Wnd {Wnd+1, Wnd} = signed(Wb) * unsigned(lit5) 1 1 None
MUL.UU Wb,#lit5,Wnd {Wnd+1, Wnd} = unsigned(Wb) *
unsigned(lit5) 11None
MUL fW3:W2 = f * WREG 1 1 None
TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
words # of
cycles Status Flags
Affected
© 2006 Microchip Technology Inc. DS70149B-page 167
dsPIC30F5015/5016
52 NEG NEG Acc Negate Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
NEG ff = f + 1 1 1 C,DC,N,OV,Z
NEG f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z
NEG Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z
53 NOP NOP No Operation 1 1 None
NOPR No Operation 1 1 None
54 POP POP fPop f from Top-of-S tack (TOS) 1 1 None
POP Wdo Pop from Top-of-Stack (TOS) to Wdo 1 1 None
POP.D Wnd Pop from Top-of-Stack (TOS) to
W(nd):W(nd+1) 12None
POP.S Pop Shadow Registers 1 1 All
55 PUSH PUSH fPush f to Top-of-Stack (TOS) 1 1 None
PUSH Wso Push Wso to Top-of-Stack (TOS) 1 1 None
PUSH.D Wns Push W(ns):W(ns+1) to Top-of-Stack (TOS) 1 2 None
PUSH.S Push Shadow Registers 1 1 None
56 PWRSAV PWRSAV #lit1 Go into Sleep or Idle mode 1 1 WDTO,Sleep
57 RCALL RCALL Expr Relative Call 1 2 None
RCALL Wn Computed Call 1 2 None
589 REPEAT REPEAT #lit14 Repeat Next Instruction lit14 + 1 times 1 1 None
REPEAT Wn Repeat Next Instruction (Wn) + 1 times 1 1 None
59 RESET RESET Software device Reset 1 1 None
60 RETFIE RETFIE Return from interrupt 1 3 (2) None
61 RETLW RETLW #lit10,Wn Return with literal in Wn 1 3 (2) None
62 RETURN RETURN Return from Subroutine 1 3 (2) None
63 RLC RLC ff = Rotate Left throu gh Carr y f 1 1 C,N,Z
RLC f,WREG WREG = Rotate Left through Carr y f 1 1 C,N,Z
RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C,N,Z
64 RLNC RLNC ff = Rotate Left (No Carry) f 1 1 N,Z
RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N,Z
RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N,Z
65 RRC RRC ff = Rotate Right through Carry f 1 1 C,N,Z
RRC f,WREG WREG = Rotate Right through Carry f 1 1 C,N,Z
RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C,N,Z
66 RRNC RRNC ff = Rotate Right (No Carry) f 1 1 N,Z
RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N,Z
RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N,Z
67 SAC SAC Acc,#Slit4,Wdo Store Accumulator 1 1 None
SAC.R Acc,#Slit4,Wdo Store Rounded Accumulator 1 1 None
68 SE SE Ws,Wnd Wnd = sign-extended Ws 1 1 C,N,Z
69 SETM SETM ff = 0xFFFF 1 1 None
SETM WREG WREG = 0x FFFF 1 1 None
SETM Ws Ws = 0xFFFF 1 1 None
70 SFTAC SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA,OB,OAB,
SA,SB,SAB
SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA,OB,OAB,
SA,SB,SAB
71 SL SL ff = Left Shift f 1 1 C,N,OV,Z
SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z
SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z
SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N,Z
SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N,Z
TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
words # of
cycles Status Flags
Affected
dsPIC30F5015/5016
DS70149B-page 168 © 2006 Microchip Technology Inc.
72 SUB SUB Acc Subtract Accumulators 1 1 OA,OB,OAB,
SA,SB,SAB
SUB ff = f – WREG 1 1 C,DC,N,OV,Z
SUB f,WREG WREG = f – WREG 1 1 C,DC,N,OV,Z
SUB #lit10,Wn Wn = Wn – lit10 1 1 C,DC,N,OV,Z
SUB Wb,Ws,Wd Wd = Wb – Ws 1 1 C,DC,N,OV,Z
SUB Wb,#lit5,Wd Wd = Wb – lit5 1 1 C,DC,N,OV,Z
73 SUBB SUBB ff = f – WREG – (C) 1 1 C,DC,N,OV,Z
SUBB f,WREG WREG = f – WREG – (C) 1 1 C,DC,N,OV,Z
SUBB #lit10,Wn Wn = Wn – lit10 – (C) 1 1 C,DC,N,OV,Z
SUBB Wb,Ws,Wd Wd = Wb – Ws – (C) 1 1 C,DC,N,OV,Z
SUBB Wb,#lit5,Wd Wd = Wb – lit5 – (C) 1 1 C,DC,N,OV,Z
74 SUBR SUBR ff = WREG – f 1 1 C,DC,N,OV,Z
SUBR f,WREG WREG = WREG – f 1 1 C,DC,N,OV,Z
SUBR Wb,Ws,Wd Wd = Ws – Wb 1 1 C,DC,N,OV,Z
SUBR Wb,#lit5,Wd Wd = lit5 – Wb 1 1 C,DC,N,OV,Z
75 SUBBR SUBBR ff = WREG – f – (C) 1 1 C,DC,N,OV,Z
SUBBR f,WREG WREG = WREG – f – (C) 1 1 C,DC,N,OV,Z
SUBBR Wb,Ws,Wd Wd = Ws – Wb – (C) 1 1 C,DC,N,OV,Z
SUBBR Wb,#lit5,Wd Wd = lit5 – Wb – (C) 1 1 C,DC,N,OV,Z
76 SWAP SWAP.b Wn Wn = nibble swap Wn 1 1 None
SWAP Wn Wn = byte swap Wn 1 1 None
77 TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None
78 TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None
79 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None
80 TBLWTL TBLWTL Ws,Wd Write Ws to Prog<15 :0> 1 2 None
81 ULNK ULNK Unlink Frame Pointer 1 1 None
82 XOR XOR ff = f .XOR. WREG 1 1 N,Z
XOR f,WREG WREG = f .XOR. WREG 1 1 N,Z
XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N,Z
XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N,Z
XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N,Z
83 ZE ZE Ws,Wnd Wnd = Zero-Extend Ws 1 1 C,Z,N
TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
words # of
cycles Status Flags
Affected
© 2006 Microchip Technology Inc. DS70149B-page 169
dsPIC30F5015/5016
23.0 DEVELOPMENT SUPPORT
The PICmicro® microcontrollers are supported with a
full ran ge of hardware a nd softwa re develo pment to ols:
Integrated Development Environment
- MPLAB® IDE Software
Assemblers/Compilers/Linkers
- MPASMTM Assembler
- MPLAB C18 and MPLAB C30 C Compilers
-MPLINK
TM Object Linker/
MPLIBTM Object Librarian
- MPLAB ASM30 Assembler/Linker/Library
Simulators
- MPLAB SIM Software Simulator
•Emulators
- MPLAB ICE 2000 In-Circuit Emulator
- MPLAB ICE 4000 In-Circuit Emulator
In-Circuit Debugger
- MPLAB ICD 2
Device Progra mmers
- PICSTART® Plus Development Programmer
- MPLAB PM3 Device Programmer
- PICkit™ 2 Development Programmer
Low-Cost Demonstration and Development
Boards and Evaluation Kits
23.1 MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16-bit micro-
controller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- Emulator (sold separatel y)
- In-Circuit Deb u gger (so ld separately)
A full-featured editor with color-coded context
A multiple project manager
Customizable data windows with direct edit of
contents
High-level source code debugging
Visual device initializer for easy register
initialization
Mouse over variable inspection
Drag and drop variables from source to watch
windows
Exten si ve on-l in e help
Integration of select third party tools, such as
HI-TECH Software C Compilers and IAR
C Compilers
The MPLAB IDE allows you to:
Edit your source files (eithe r assembly or C)
One touch assemble (or compile) and download
to PICmicro MCU emulator and simulator tools
(automatically updates all project information)
Debug us ing :
- Source files (assemb ly or C)
- Mixed assembly and C
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
dsPIC30F5015/5016
DS70149B-page 170 © 2006 Microchip Technology Inc.
23.2 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for all PICmicro MCUs.
The MPASM Assembler generates relocatable object
files fo r the MPLINK Ob ject Linker , Int el® standa rd HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
Integration into MPLAB IDE projects
User-defined macros to streamline
assembly code
Conditional assembly for multi-purpose
sour ce fil es
Directives that allow complete control over the
assembly process
23.3 MPLAB C18 and MPLAB C30
C Compilers
The MPLAB C18 and MPLAB C30 Code Development
Systems are complete ANSI C compilers for
Microchip’s PIC18 family of microcontrollers and the
dsPIC30, dsPIC33 and PIC24 family of digital signal
controllers. These compilers provide powerful integra-
tion capabilities, superior code optimization and ease
of use not found with other compilers.
For easy source level debugging, the compilers provide
symbol info rmation tha t is optimized to the MPLAB IDE
debugger.
23.4 MPLINK Object Linker/
MPLIB Object Librari an
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB O bject Li brarian manag es the cre ation an d
modification of library files of precompiled code. When
a routine from a library is called from a source file , only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
Efficient linking of single libraries instead of many
smaller files
Enhanced code maintainability by grouping
related modules together
Flexible creation of libraries with easy module
listing, replacement, de letion and extraction
23.5 MPLAB ASM30 Assembler, Linker
and Librarian
MPLAB ASM30 Assembler produces relocatable
machine code from symbolic assembly language for
dsPIC30F devices. MPLAB C30 C Compiler uses the
assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linke d with other relocatable ob ject files and
arch ives to c rea te an e xecu tabl e fil e. N otabl e fe atu res
of the assembler include:
Support for the entire dsPIC30F instruction set
Support for fixed-point and floating-point data
Command line interface
Rich dire cti ve set
Flexible macro language
MPLAB IDE compatibility
23.6 MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulat-
ing the PICmicro MCUs and dsPIC® DSCs on an
instruction level. On any given instruction, the data
areas can be examined or modified and stimuli can be
applied from a comprehensive stimulus controller.
Registers can be logged to files for further run-time
analysis. The trace buffer and logic analyzer display
extend the power of the simulator to record and track
program execution, actions on I/O, most peripherals
and internal registers.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C18 and
MPLAB C30 C Compilers, and the MPASM and
MPLAB ASM30 Assemblers. The software simulator
offers the flexibility to develop and debug code outside
of the hardware laboratory environment, making it an
excellent, economical software development tool.
© 2006 Microchip Technology Inc. DS70149B-page 171
dsPIC30F5015/5016
23.7 MPLAB ICE 2000
High-Performance
In-Circui t Emu lator
The MPLAB ICE 2000 In-Circuit Emulator is intended
to provide the product development engineer with a
complete microcontroller design tool set for PICmicro
microcontrollers. Software control of the MPLAB ICE
2000 In-Circuit Emulator is advanced by the MPLAB
Integrated Development Environment, which allows
editing, building, downloading and source debugging
from a single environment.
The MPLAB ICE 2000 is a full-featured emulator
system with enhanced trace, trigger and data monitor-
ing feat ures. Interc hangeabl e proces sor modul es allow
the system to be easily reconfigured for emulation of
different processors. The architecture of the MPLAB
ICE 2000 In-Circuit Emulator allows expansion to
support new PICmicro microcontrollers.
The MPLAB ICE 2000 In-Circuit Emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft® Windows® 32-bit operating system were
chosen to best make these features available in a
simple, unified application.
23.8 MPLAB ICE 4000
High-Performance
In-Circui t Emu lator
The MPLAB ICE 4000 In-Circuit Emu lator is intende d to
provide the product development engineer with a
complete microcontroller design tool set for high-end
PICmicro MCUs and dsPIC DSCs. Software control of
the MPLAB ICE 4000 In-Circuit Emulator is provided by
the MPLAB Integrated Development Environment,
which allows editing, building, downloading and source
debugging from a single environm ent.
The MPLAB ICE 4000 is a premium emulator system,
providing the features of MPLAB ICE 2000, but with
increased emulation memory and high-speed perfor-
mance for dsPIC30F and PIC18XXXX devices. Its
advanc ed emulator fe atures inc lude complex t riggering
and timing, and up to 2 Mb of emulation memory.
The MPLAB ICE 4000 In-Circuit Emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft Windows 32-bit operating system were
chosen to best make these features available in a
simple, unified application.
23.9 MPLAB ICD 2 In-Circuit Debugger
Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a
powerful, low-cost, run-time development tool,
connecting to the host PC via an RS-232 or high-speed
USB interface. This tool is based on the Flash PICmicro
MCUs and can be used to develop for these and other
PICmicro MCUs and dsPIC DSCs. The MPLAB ICD 2
utilizes the in-circuit debugging capability built into
the Flash devices. This feature, along with Microchip’s
In-Circuit Serial ProgrammingTM (ICSPTM) protocol,
offers cost-effective, in-circuit Flash debugging from the
graphical user interface of the MPLAB Integrated
Development Environment. This enables a designer to
develop and debug source code by setting breakpoints,
single stepping and watching variables, and CPU
status and peripheral registers. Running at full speed
enables testing hardware and applications in real
time. MPLAB ICD 2 also serves as a development
programmer for selected PICmicro devices.
23.10 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64 ) for men us an d error m essages and a m odu-
lar, detachable socket assembly to support various
pack age types. The ICSP™ cable assembly is incl uded
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Devic e Programmer ca n read, verif y and program
PICmicro devices without a PC connection. It can also
set code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 h as high-spe ed co mmunicat ions and
optimized algorithms for quick programming of large
memory devices and in corporates an SD/MMC card for
file storage and secure data applications.
dsPIC30F5015/5016
DS70149B-page 172 © 2006 Microchip Technology Inc.
23.11 PICSTART Plus Development
Programmer
The PICSTART Plus Development Programmer is an
easy-to-use, low-cost, prototype programmer. It
connects to the PC via a COM (RS-232) port. MPLAB
Inte grated Dev elopmen t En vironme nt so ftware makes
using the programmer simple and efficient. The
PICSTART Plus Development Programmer supports
most PICmicro devices in DIP packages up to 40 pins.
Larger pin count devices, such as the PIC16C92X and
PIC17C76 X, may be sup ported with an a dapter socket.
The PICSTART Plus Development Programmer is CE
compliant.
23.12 PICkit 2 Development Programmer
The PICkit™ 2 Development Programmer is a low-cost
programmer with an easy-to-use interface for pro-
gramming many of Microchip’s baseline, mid-range
and PIC1 8F families of Fl ash memory mic rocontrollers.
The PICkit 2 S tar ter Kit includes a pr ototypin g develop-
ment board, twelve sequential lessons, software and
HI-TECH’s PICC™ Lite C compiler, and is designed to
help get up to speed quickly using PIC® micro-
controllers. The kit provides everything needed to
program, evaluate and develop applications using
Microchip’s powerful, mid-range Flash memory family
of microcontroll ers.
23.13 Demonstration, Development and
Evaluation Boards
A wide variety of demonstration, development and
evaluation boards for various PICmicro MCUs and dsPIC
DSCs allows quick application development on fully func-
tional systems. Most boards includ e prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
The board s suppo rt a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory .
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demon-
stration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart® battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Check the Microchip web page (www.microchip.com)
and the latest “Product Selector Guide” (DS00148) for
the complete list of demonstration, development and
evaluation kits.
© 2006 Microchip Technology Inc. DS70149B-page 173
dsPIC30F5015/5016
24.0 ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC30F electrical character istics. Additional information will be provided in future
revisions of this document as it becomes available.
For detailed information about the dsPIC30F architecture and core, refer to the “dsPIC30F Family Reference Manual”
(DS70046).
Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for
extende d peri ods may aff ec t devi ce re liabil ity. Functional o perat ion o f the devi ce at th ese o r any other co nditio ns ab ove
the parameters indicated in the operation listings of this specification is not implied.
Absolute Maximum Ratings(†)
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature.............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD and MCLR) (1)...............................................-0.3V to (VDD + 0.3V)
Vo lt a ge on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V
Vo lt a ge on MCLR with respect to VSS........................................................................................................0V to +13.25V
Maximum curr ent o ut of VSS pin ...........................................................................................................................300 mA
Maximum curr ent i nto VDD pin(2)...........................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD)..........................................................................................................±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD)...................................................................................................±20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin....................................................................................................25 mA
Maximum current sunk by all ports.......................................................................................................................200 mA
Maximum current sourced by all ports(2)...............................................................................................................200 mA
Note 1: Voltage sp ikes below VSS at the MCLR/VPP pin, inducin g curr ent s g reater than 8 0 mA, ma y ca use l atch-up.
Thus, a se ries resisto r of 50-100Ω should be u sed w he n a ppl yi ng a “low” level to the MCL R/VPP pin, rath er
than pulling this pin directly to VSS.
2: Maximum allowable current is a function of device maximum power dissipation. See Table 24-6.
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device . This is a stres s rating onl y and funct ional ope ration of the device at tho se or any other co nditio ns above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
dsPIC30F5015/5016
DS70149B-page 174 © 2006 Microchip Technology Inc.
24.1 DC Characteristics
TABLE 24-1: OPERATING MIPS VS. VOLTAGE FOR dsPIC30F5015
VDD Range
(in Volts) Temp Range
(in °C)
Max MIPS
dsPIC30F5015-30I dsPIC30F5015-20E
4.5-5.5 -40 to +85 30
4.5-5.5 - 40 to +125 20
3.0-3.6 -40 to +85 20
3.0-3.6 - 40 to +125 15
2.5-3.0 -40 to +85 10
TABLE 24-2: OPERATING MIPS VS. VOLTAGE FOR dsPIC30F5016
VDD Range
(in Volts) Temp Range
(in °C)
Max MIPS
dsPIC30F5016-30I dsPIC30F5016-20E
4.5-5.5 -40 to +85 30
4.5-5.5 - 40 to +125 20
3.0-3.6 -40 to +85 20
3.0-3.6 - 40 to +125 15
2.5-3.0 -40 to +85 10
TABLE 24-3: THERMAL OPERATING CONDITIONS FOR dsPIC30F5015/5016
Rating Symbol Min Typ Max Unit
dsPIC30F5015-30I/dsPIC30F5016-30I
Operating Junction Temperature Range TJ-40 +125 °C
Operating Ambient Temperature Range TA-40 +85 °C
dsPIC30F5015-20E/dsPIC30F5016-20E
Operati ng Junction Temperat ure Range TJ-40 +150 °C
Operating Ambient Temperature Range TA-40 +125 °C
Power Dissipation:
Internal ch ip pow er dis sip ation:
PDPINT + PI/OW
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation PDMAX (TJ – TA)/θJA W
TABLE 24-4: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 80-pin TQFP (12x12x1m m ) θJA 39 °C/W 1
Package Thermal Resistance, 64-pin TQFP (10x10x1m m ) θJA 39 °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-ja (θJA) numbers are achieved by package simulations.
PINT VDD IDD IOH
()×=
PI/OVDD VOH
{}
IOH
×()
VOL IOL
×
()
+=
© 2006 Microchip Technology Inc. DS70149B-page 175
dsPIC30F5015/5016
TABLE 24-5: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
Operating Voltage(2)
DC10 VDD Supply Voltage 2.5 5.5 V Industri al temperature
DC11 VDD Supply Voltage 3.0 5.5 V Extended temperature
DC12 VDR RAM Data Retention Voltage(3) 1.5 V
DC16 VPOR VDD Start Voltage
to ensure internal
Power-on Rese t signal
—VSS —V
DC17 SVDD VDD Rise Rate
to ensure internal
Power-on Rese t signal
0.05 V/ms 0-5V in 0.1 sec
0-3V in 60 ms
Note 1: Data in “Ty p” column is a t 5V, 25°C unless ot herwis e st ated. Par ameters are for d esign guidan ce onl y and
are not t ested.
2: These parameters are characterized but not tested in manufacturing.
3: This is the limit to which VDD can be lowered without losing RAM data.
dsPIC30F5015/5016
DS70149B-page 176 © 2006 Microchip Technology Inc.
TABLE 24-6: DC CHARACTERISTICS: OPERATING CURRENT (IDD)
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5. 5V
(unless otherwise stated)
Operating temp erature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Parameter
No. Typical(1) Max Units Conditions
Operating Current (IDD)(2)
DC31a 5.6 10 mA 25°C 3.3V 0.128 MIPS
LPRC (512 kHz)
DC31b 5.7 10 mA 85°C
DC31c 5.5 10 mA 125°C
DC31e 14 23 mA 25°C 5VDC31f 15 23 mA 85°C
DC31g 15 23 mA 125°C
DC30a 10 21 mA 25°C 3.3V (1.8 MIPS)
FRC (7.37 MHz)
DC30b 12 21 mA 85°C
DC30c 14 21 mA 125°C
DC30e 23 38 mA 25°C 5VDC30f 24 38 mA 85°C
DC30g 25 38 mA 125°C
DC23a 30 50 mA 25°C 3.3V
4 MIPS
DC23b 32 50 mA 85°C
DC23c 35 50 mA 125°C
DC23e 32 53 mA 25°C 5VDC23f 34 53 mA 85°C
DC23g 35 53 mA 125°C
DC24a 35 60 mA 25°C 3.3V
10 MIPS
DC24b 37 60 mA 85°C
DC24c 40 60 mA 125°C
DC24e 62 95 mA 25°C 5VDC24f 63 95 mA 85°C
DC24g 65 95 mA 125°C
DC27a 63 95 mA 25°C 3.3V
20 MIPS
DC27b 65 95 mA 85°C
DC27d 108 145 mA 25°C 5VDC27e 127 145 mA 85°C
DC27f 130 145 mA 125°C
DC29a 151 200 mA 25°C 5V 30 MIPS
DC29b 170 200 mA 85°C
Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have
an imp act on the current c onsumpti on. The tes t condi tions fo r all IDD measur ement s are as follow s: OSC1
driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to VDD.
MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data
Memory are oper ational . N o peripheral modules are operat ing.
© 2006 Microchip Technology Inc. DS70149B-page 177
dsPIC30F5015/5016
TABLE 24-7: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Parameter
No. Typical(1) Max Units Conditions
Operating Current (IDD)(2)
DC51a 5.2 9 mA 25°C 3.3V
0.128 MIPS
LPRC (512 kHz)
DC51b 5.3 9 mA 85°C
DC51c 5.4 9 mA 125°C
DC51e 13 22 mA 25°C 5VDC51f 14 22 mA 85°C
DC51g 15 22 mA 125°C
DC50a 8.1 13 mA 25°C 3.3V
(1.8 MIPS)
FRC (7.37 MHz)
DC50b 8.2 13 mA 85°C
DC50c 8.3 13 mA 125°C
DC50e 19 32 mA 25°C 5VDC50f 20 32 mA 85°C
DC50g 21 32 mA 125°C
DC43a 12 26 mA 25°C 3.3V
4 MIPS
DC43b 14 26 mA 85°C
DC43c 17 26 mA 125°C
DC43e 25 42 mA 25°C 5VDC43f 26 42 mA 85°C
DC43g 28 42 mA 125°C
DC44a 23 40 mA 25°C 3.3V
10 MIPS
DC44b 25 40 mA 85°C
DC44c 26 40 mA 125°C
DC44e 42 68 mA 25°C 5VDC44f 43 68 mA 85°C
DC44g 45 68 mA 125°C
DC47a 40 55 mA 25°C 3.3V
20 MIPS
DC47b 40 55 mA 85°C
DC47d 70 85 mA 25°C 5VDC47e 72 85 mA 85°C
DC47f 74 85 mA 125°C
DC49a 98 120 mA 25°C 5V 30 MIPS
DC49b 103 120 mA 85°C
Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: Base IIDLE current is measured with Core off, Clock on and all modules turned off.
dsPIC30F5015/5016
DS70149B-page 178 © 2006 Microchip Technology Inc.
TABLE 24-8: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise st ated)
Operati ng tem pera ture -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Parameter
No. Typical(1) Max Units Conditions
Power Down Current (IPD)(2)
DC60a 0.2 μA 25°C 3.3V
Base Power Down Current
DC60b 0.7 40 μA 85°C
DC60c 12 65 μA 125°C
DC60e 0.4 μA 25°C 5VDC60f 1.7 55 μA 85°C
DC60g 16 90 μA 125°C
DC61a 10 30 μA 25°C 3.3V
Watchdog Timer Current: ΔIWDT(3)
DC61b 12 30 μA 85°C
DC61c 12 30 μA 125°C
DC61e 20 40 μA 25°C 5VDC61f 22 40 μA 85°C
DC61g 23 40 μA 125°C
DC62a 4 10 μA 25°C 3.3V
T imer 1 w/32 kHz Crystal: ΔITI32(3)
DC62b 5 10 μA 85°C
DC62c 4 10 μA 125°C
DC62e 4 15 μA 25°C 5VDC62f 6 15 μA 85°C
DC62g 5 15 μA 125°C
DC63a 33 65 μA 25°C 3.3V
BOR On: ΔIBOR(3)
DC63b 38 65 μA 85°C
DC63c 39 65 μA 125°C
DC63e 38 70 μA 25°C 5VDC63f 41 70 μA 85°C
DC63g 42 70 μA 125°C
Note 1: Data in “T y p” column is at 5V, 25°C unless othe rwise stat ed. Parameters are for des ign guidance only and
are not t ested.
2: These parameters are characterized but not tested in manufacturing.
3: The Δ current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
© 2006 Microchip Technology Inc. DS70149B-page 179
dsPIC30F5015/5016
TABLE 24-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125° C for Extende d
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
VIL Input Low Voltage(2)
DI10 I/O pi ns:
with Schmitt Trigger buffer VSS —0.2VDD V
DI15 MCLR VSS —0.2VDD V
DI16 OSC1 (in XT, HS and LP modes) VSS —0.2VDD V
DI17 OSC1 (in RC mode)(3) VSS —0.3VDD V
DI18 SDA, SCL VSS —0.3VDD V SMbus disabled
DI19 SDA, SCL VSS —0.2VDD V SMbus enabled
VIH Input High Voltage(2)
DI20 I/O pi ns:
with Schmitt Trigger buffer 0.8 VDD —VDD V
DI25 MCLR 0.8 VDD —VDD V
DI26 OSC1 (in XT, HS and LP modes) 0.7 VDD —VDD V
DI27 OSC1 (in RC mode)(3) 0.9 VDD —VDD V
DI28 SDA, SCL 0.7 VDD —VDD V SMbus disabled
DI29 SDA, SCL 0.8 VDD —VDD V SMbus enabled
ICNPU CNXX Pull-up Current(2)
DI30 50 250 400 μAVDD = 5V, VPIN = VSS
IIL Input Leakage Current(2)(4)(5)
DI50 I/O po rts 0.01 ±1 μAVSS VPIN VDD,
Pin at hi gh-impedance
DI51 Analog Input Pins 0.50 μAVSS VPIN VDD,
Pin at hi gh-impedance
DI55 MCLR —0.05±5μAVSS VPIN VDD
DI56 OSC1 0.05 ±5 μAVSS VPIN VDD, XT, HS
and LP Osc mode
Note 1: Data in “Ty p” column is a t 5V, 25°C unless ot herwis e st ated. Par ameters are for d esign guidan ce onl y and
are not t ested.
2: These parameters are characterized but not tested in manufacturing.
3: In RC oscillator configuration, the OSC1/CLKl pin is a Schmitt Trigger input. It is not recommended that
the dsPIC30F device be driven with an external clock while in RC mode.
4: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
5: Negative current is defined as current sourced by the pin.
dsPIC30F5015/5016
DS70149B-page 180 © 2006 Microchip Technology Inc.
FIGURE 24-1: BROWN-OUT RESET CHARACTERISTICS
TABLE 24-10: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
VOL Output Low Voltage(2)
DO10 I/O ports 0.6 V IOL = 8.5 mA, VDD = 5V
——TBDVI
OL = 2.0 mA, VDD = 3V
DO16 OSC2/CLKO 0.6 V IOL = 1.6 mA, VDD = 5V
(RC or EC Osc mode) TBD V IOL = 2.0 mA, VDD = 3V
VOH Output High Voltage(2)
DO20 I/O ports VDD – 0 .7 V IOH = -3.0 mA, VDD = 5V
TBD V IOH = -2.0 mA, VDD = 3V
DO26 OSC2/CLKO VDD – 0.7 V IOH = -1.3 mA, VDD = 5V
(RC or EC Osc mode) TBD V IOH = -2.0 mA, VDD = 3V
Capacitive Loading Specs
on Output Pins(2)
DO50 COSC2 OSC2/SO SC2 pin 15 pF In XTL, XT, HS and LP mo des
when e xternal cloc k is used to
drive OSC1.
DO56 CIO All I/O pins and OSC2 50 pF RC or EC Osc mode
DO58 CBSCL, SDA 400 pF In I2C™ mode
Legend: TBD = To Be Determined
Note 1: Data i n “Typ” colum n i s at 5V, 25°C unles s otherwise st ate d. Parameters ar e for design gu ida nc e on ly and
are not tested.
2: These parameters are characterized but not tested in manufacturing.
BO10
Reset (due to BOR)
VDD
(Device in Brown-out Reset)
(Device not in Brown-out Reset)
Power-up Time-out
BO15
© 2006 Microchip Technology Inc. DS70149B-page 181
dsPIC30F5015/5016
TABLE 24-11: ELECTRICAL CHARACTERISTICS: BOR
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
BO10 VBOR BOR Voltage(2) on
VDD transition
low-to-high
BORV = 11(3) V Not in operating
range
BORV = 10 2.6 2.71 V
BORV = 01 4.1 4.4 V
BORV = 00 4.58 4.73 V
BO15 VBHYS —5mV
Note 1: Data i n “Typ” column is at 5V, 25°C unles s ot he rwis e s t ate d. Pa ram ete rs a re for design g uid anc e o nly an d
are not t ested.
2: These parameters are characterized but not tested in manufacturing.
3: 11’ values not in usable operating range.
TABLE 24-12: DC CHARACTERISTICS: PROGRAM AND EEPROM
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operati ng tem pe rature -40 °C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
Data EEPROM Memory(2)
D120 EDByte Endurance 100K 1M E/W -40°C TA +85°C
D121 VDRW VDD for Read/Write VMIN 5.5 V Using EECON to read/write
VMIN = Minimum operating
voltage
D122 TDEW Erase/Write Cycle Time 2 ms
D123 TRETD Characteristic Retention 40 1 00 Year Provided no other specif ications
are violated
D124 IDEW IDD During Prog ramming 10 30 mA Row E rase
Program FLASH
Memory(2)
D130 EPCell Endurance 10K 100K E/W -40°C TA +85°C
D131 VPR VDD for Read VMIN —5.5VVMIN = Minimum operating
voltage
D132 VEB VDD for Bulk Erase 4.5 5.5 V
D133 VPEW VDD for Erase/Write 3.0 5.5 V
D134 TPEW Erase/Write Cycle Time 2 ms
D135 TRETD Characteristic Retention 40 1 00 Year Provided no other specif ications
are violated
D136 TEB ICSP™ Block Erase Time 4 ms
D137 IPEW IDD During Prog ramming 10 30 mA Row E rase
D138 IEB IDD During Prog ramming 10 30 mA Bulk Erase
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated.
2: These parameters are characterized but not tested in manufacturing.
dsPIC30F5015/5016
DS70149B-page 182 © 2006 Microchip Technology Inc.
24.2 AC Characteristics and Timing Parameters
The information contained in this section defines dsPIC30F AC characteristics and timing parameters.
FIGURE 24-2: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
FIGURE 24-3: EXTERNAL CLOCK TIMING
TABLE 24-13: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise st ated)
Operati ng tem pera ture -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Operati ng voltage VDD range as described in DC Spec Section 24.0.
VDD/2
CL
RL
Pin
Pin
VSS
VSS
CL
RL= 464Ω
CL= 50 pF for all pins except OSC2
5 pF for OSC2 output
Load Cond itio n 1 – for all pins except OSC2 Load Condition 2 – for OSC2
OSC1
CLKO
Q4 Q1 Q2 Q3 Q4 Q1
OS20
OS25
OS30 OS30
OS40 OS41
OS31 OS31
© 2006 Microchip Technology Inc. DS70149B-page 183
dsPIC30F5015/5016
TABLE 24-14: EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symb
ol Characteristic Min Typ(1) Max Units Conditions
OS10 FOSC External CLKI Frequen cy (2)
(External clocks allowed only
in EC mode)
DC
4
4
4
40
10
10
7.5(3)
MHz
MHz
MHz
MHz
EC
EC with 4x PLL
EC with 8x PLL
EC with 16x PLL
Oscilla tor Frequency(2) DC
0.4
4
4
4
4
10
10
10
10
12(4)
12(4)
12(4)
32.768
4
4
10
10
10
7.5(3)
25
20(4)
20(4)
15(3)
25
25
22.5(3)
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
kHz
RC
XTL
XT
XT with 4x PLL
XT with 8x PLL
XT with 16x PLL
HS
HS/2 with 4x PLL
HS/2 with 8x PLL
HS/2 with 16x PLL
HS/3 with 4x PLL
HS/3 with 8x PLL
HS/3 with 16x PLL
LP
OS20 TOSC TOSC = 1/FOSC See para meter OS10
for FOSC value
OS25 TCY Instruction Cycle Time(2)(5) 33 DC ns See Table 24-16
OS30 TosL,
TosH External Clock(2) in (OSC1)
High or Low Time .45 x TOSC ——nsEC
OS31 TosR,
TosF External Clock(2) in (OSC1)
Rise or Fall Time ——20nsEC
OS40 TckR CLKO Rise Time(2)(6) ns See parameter D031
OS41 TckF CLKO Fall Time(2)(6) ns See parameter D032
Note 1: Data in “Ty p” column is a t 5V, 25°C unless ot herwis e st ated. Par ameters are for d esign guidan ce onl y and
are not t ested.
2: These parameters are characterized but not tested in manufacturing.
3: Limited by the PLL output frequency range.
4: Limited by the PLL input frequency range.
5: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at “Min.”
values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the
“Max.” cycle time limit is “DC” (no clock) for all devices.
6: Measure ments are ta ken in EC or ERC m ode s. Th e CLKO s ig nal is meas ured on the OSC 2 pi n. CLKO is
low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY).
dsPIC30F5015/5016
DS70149B-page 184 © 2006 Microchip Technology Inc.
TABLE 24-15: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.5 TO 5.5 V)
AC CHARACTERISTICS
Standard Operating Cond itions: 2.5V to 5.5V
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
OS50 FPLLI PLL Input Frequency Range(2) 4
4
4
4
4
4
5(3)
5(3)
5(3)
4
4
4
10
10
7.5(4)
10
10
7.5(4)
10
10
7.5(4)
8.33(3)
8.33(3)
7.5(4)
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
EC with 4x PLL
EC with 8x PLL
EC with 16x PLL
XT with 4x PLL
XT with 8x PLL
XT with 16x PLL
HS/2 with 4x PLL
HS/2 with 8x PLL
HS/2 with 16x PLL
HS/3 with 4x PLL
HS/3 with 8x PLL
HS/3 with 16x PLL
OS51 FSYS On-Chip PLL Output(2) 16 120 MHz EC, XT, HS/2, HS/3
modes with PLL
OS52 TLOC PLL Start-up Time (Lock Time) 20 50 μs
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data i n “Typ” colum n i s at 5V, 25°C unles s otherwise st ate d. Pa ram ete rs are for design guidanc e on ly and
are not tested.
3: Limited by oscillator frequency range.
4: Limited by device operating frequency range.
TABLE 24-16: PLL JITTER
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Characteristic Min Typ(1) Max Units Conditions
OS61 x4 PLL 0.251 0.413 % -40°C TA +85°C VDD = 3.0 to 3.6V
0.251 0.413 % -40°C TA +125°C VDD = 3.0 to 3.6V
0.256 0.47 % -40°C TA +85°C VDD = 4.5 to 5.5V
0.256 0.47 % -40°C TA +125°C VDD = 4.5 to 5.5V
x8 PLL 0.355 0.584 % -40°C TA +85°C VDD = 3.0 to 3.6V
0.355 0.584 % -40°C TA +125°C VDD = 3.0 to 3.6V
0.362 0.664 % -40°C TA +85°C VDD = 4.5 to 5.5V
0.362 0.664 % -40°C TA +125°C VDD = 4.5 to 5.5V
x16 PLL 0.67 0.92 % -40°C TA +85°C VDD = 3.0 to 3.6V
0.632 0.956 % -40°C TA +85°C VDD = 4.5 to 5.5V
0.632 0.956 % -40°C TA +125°C VDD = 4.5 to 5.5V
Note 1: These parameters are characterized but not tested in manufacturing.
© 2006 Microchip Technology Inc. DS70149B-page 185
dsPIC30F5015/5016
TABLE 24-17: INTERNAL CLOCK TIMING EXAMPLES
Clock
Oscillator
Mode
FOSC
(MHz)(1) TCY (μsec)(2) MIPS(3)
w/o PLL MIPS(3)
w PLL x4 MIPS(3)
w PLL x8 MIPS(3)
w PLL x16
EC 0.200 20.0 0.05
4 1.0 1.0 4.0 8.0 16.0
10 0.4 2.5 10.0 20.0
25 0.16 6.25
XT 4 1.0 1.0 4.0 8.0 16.0
10 0.4 2.5 10.0 20.0
Note 1: Assumption: Oscillator Postscaler is divide by 1.
2: Instruction Execution Cycle Time: TCY = 1/MIPS.
3: Instruction Execution Frequency: MIPS = (FOSC * PLLx)/4 (since there are 4 Q clocks per instruction
cycle).
dsPIC30F5015/5016
DS70149B-page 186 © 2006 Microchip Technology Inc.
TABLE 24-18: AC CHARACTERISTICS: INTERNAL FRC JITTER, ACCURACY AND DRIFT(2)
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Characteristic Min Typ Max Units Conditions
Internal FRC Jitter @ FRC Freq. = 7.37 MHz(1)
OS62 FRC +0.04 +0.16 % -40°C TA +85°C VDD = 3.0-3.6V
—+
0.07 +0.23 % -40°C TA +125°C VDD = 4.5-5.5V
FRC with 4x PLL +0.31 +0.62 % -40°C TA +85°C VDD = 3.0-3.6 V
—+0.34 +0.77 % -40°C TA +125°C VDD = 4.5-5.5V
FRC with 8x PLL +0.44 +0.87 % -40°C TA +85°C VDD = 3.0-3.6 V
—+0.48 +1.08 % -40°C TA +125°C VDD = 4.5-5.5V
FRC with 16x PLL +0.71 +1.23 % -40°C TA +125°C VDD = 4.5-5.5V
Internal FRC Accuracy @ FRC Freq. = 7.37 MHz(1)
OS63 FRC +0.5 % -40°C TA +125°C VDD = 3.0-5.5V
Internal FRC Drift @ FRC Freq. = 7.37 MHz(1)
OS64 -0.7 0.5 % -40°C TA +85°C VDD = 3.0-3.6V
-0.7 0.7 % -40°C TA +125°C VDD = 3.0-3.6V
-0.7 0.5 % -40°C TA +85°C VDD = 4.5-5.5 V
-0.7 0.7 % -40°C TA +125°C VDD = 4.5-5.5V
Note 1: Frequency calibrated at 25°C and 5V. TUN bits can be used to compensate for temperature drift.
2: Overall FRC variation can be calculated by adding the absolute valves of jitter, accuracy and drift
percentages.
TABLE 24-19: INTERNAL LPRC ACCURACY
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise st ated)
Operati ng tem pera ture -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Characteristic Min Typ Max Units Conditions
LPRC @ Freq. = 512 kHz(1)
OS65 -35 +35 %
Note 1: Change of LPRC frequency as VDD changes.
© 2006 Microchip Technology Inc. DS70149B-page 187
dsPIC30F5015/5016
FIGURE 24-4: CLKO AND I/O TIMING CHARACTERISTICS
TABLE 24-20: CLKO AND I/O TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise st ated)
Operati ng tem pera ture -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1)(2)(3) Min Typ(4) Max Units Conditions
DO31 TIOR Port output rise time 7 20 ns
DO32 TIOF Port output fall time 7 20 ns
DI35 TINP INTx pin high or low time (output) 20 ns
DI40 TRBP CNx high or low time (input) 2 TCY ——ns
Note 1: These parameters are asynchronous events not related to any internal clock edges.
2: Measurements are taken in RC mode and EC mode where CLKO output is 4 x TOSC.
3: These parameters are characterized but not tested in manufacturing.
4: Data in “Typ” column is at 5V, 25°C unless otherwise stated.
Note: Refer to Figur e 24-2 for load conditions.
I/O Pin
(Input)
I/O Pin
(Output)
DI35
Old Value New Value
DI40
DO31
DO32
dsPIC30F5015/5016
DS70149B-page 188 © 2006 Microchip Technology Inc.
FIGURE 24-5: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING CHARACTERISTICS
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Time-out
Internal
Reset
Watchdog
Timer
Reset
SY11
SY10
SY20
SY13
I/O Pins
SY13
Note: Refer to Figure 24-2 for load conditions.
FSCM
Delay
SY35
SY30
SY12
© 2006 Microchip Technology Inc. DS70149B-page 189
dsPIC30F5015/5016
FIGURE 24-6: BAND GAP START-UP TIME CHARACTERISTICS
TABLE 24-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SY10 TmcL MCLR Pulse Width (low) 2 μs -40°C to +85°C
SY11 TPWRT Power-up T im er Period 3
12
50
4
16
64
6
22
90
ms -40°C to +85°C
User programmable
SY12 TPOR Power-on Reset Delay(4) 31030μs -40°C to +85°C
SY13 TIOZ I/O High-Impedance from MCLR
Low or Watchdog Timer Reset —0.81.0μs
SY20 TWDT1 Wat chdog Ti mer T ime -out Perio d
(No Prescaler) 1.4 2.1 2.8 ms VDD = 5V, -40°C to +85°C
TWDT2 1.4 2.1 2.8 ms VDD = 3V, -40°C to +85°C
SY25 TBOR Brown-out Reset Pulse Width(3) 100 μsVDD VBOR (D034)
SY30 TOST Oscillator Start-up Timer Period
1024 T
OSC
——TOSC = OSC1 period
SY35 TFSCM Fail-Safe Clock Monitor Delay 500 900 μs -40°C to +85°C
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated.
3: Refer to Figure 24-1 and Table 24-11 for BOR.
4: Characterized by design but not tested.
TABLE 24-22: BAND GAP START-UP TIME REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5. 5V
(unless otherwise stated)
Operating temp erature -40°C TA +85°C for Industrial
-40°C TA +125°C for Exten ded
Param
No. Symbol Characteristic(1) Min Typ Max Units Conditions
SY40 TBGAP Ba nd Ga p St art-up T im e 40 65 µs Defined as the time betwe en the
instant that the band gap is enabled
and the moment that the band gap
reference voltage is stable
(RCON<13> Status bit).
Note 1: These parameters are characterized but not tested in manufacturing.
VBGAP
Enable Band Gap
Band Gap
0V
(see Note)
Stable
Note: Set FBORPOR<7>.
SY40
dsPIC30F5015/5016
DS70149B-page 190 © 2006 Microchip Technology Inc.
FIGURE 24-7: TIMER1, 2, 3, 4 AND 5 EXTERNAL CLOCK TIMING CHARACTERISTICS
TABLE 24-23: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS(1)
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operati ng tem pe rature -40 °C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ Max Units Conditions
TA10 TTXH TxCK High Time Synchronous,
no prescaler 0.5 TCY + 20 ns Must also meet
parameter TA15
Synchronous,
with prescaler 10 ns
Asynchronous 10 ns
TA11 TTXL TxCK Low Time Synchronous,
no prescaler 0.5 TCY + 20 ns Must also meet
parameter TA15
Synchronous,
with prescaler 10 ns
Asynchronous 10 ns
TA15 TTXP TxCK Input Period Synchronous,
no prescaler TCY + 10 ns
Synchronous,
with prescaler Greater of:
20 ns or
(TCY + 40)/N
——N = prescale
value
(1, 8, 64, 256)
Asynchronous 20 ns
OS60 Ft1 SOSC1/T1CK oscillator input
frequency range (oscillator enabled
by setting bit TCS (T1CON, bit 1))
DC 50 kHz
TA20 TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment 0.5 TCY 1.5
TCY
Note 1: Timer1 is a Type A.
Note: Refer to Figure 24- 2 for l oad conditions.
Tx11
Tx15
Tx10
Tx20
TMRX OS60
TxCK
© 2006 Microchip Technology Inc. DS70149B-page 191
dsPIC30F5015/5016
TABLE 24-24: TIMER2 AND TIMER4 EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operati ng tem pe rature -40 °C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ Max Units Conditions
TB10 TtxH TxC K H igh Time Synchronous,
no prescaler 0.5 TCY + 20 ns Must also meet
parameter TB15
Synchronous,
with prescaler 10 ns
TB11 TtxL TxCK Low Ti me Synchronou s,
no prescaler 0.5 TCY + 20 ns Must also meet
parameter TB15
Synchronous,
with prescaler 10 ns
TB15 TtxP TxCK Input Period Synchro nou s,
no prescaler TCY + 10 ns N = prescal e
value
(1, 8, 64, 256)
Synchronous,
with prescaler Greater of:
20 ns or
(TCY + 40)/N
TB20 TCKEXT-
MRL Delay from External TxCK Clock
Edge to Timer Increment 0.5 TCY 1.5 TCY
TABLE 24-25: TIMER3 AND TIMER5 EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise st ated)
Operati ng tem pera ture -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ Max Units Conditions
TC10 TtxH TxCK High Time Synchronous 0.5 TCY + 20 ns Must also meet
parameter TC15
TC11 TtxL TxCK Low Time Synchronous 0.5 TCY + 20 ns Must also meet
parameter TC15
TC15 TtxP TxCK Input Period Synchronous,
no prescaler TCY + 10 ns N = prescale
value
(1, 8, 64, 256)
Synchronous,
with prescaler Greater of:
20 ns or
(TCY + 40)/N
TC20 TCKEXT-
MRL Delay from External TxCK Clock
Edge to Timer Increment 0.5 TCY —1.5
TCY
dsPIC30F5015/5016
DS70149B-page 192 © 2006 Microchip Technology Inc.
FIGURE 24-8: TIMERQ (QEI MODULE) EXTERNAL CLOCK TIMING CHARACTERISTICS
TABLE 24-26: QEI MODULE EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Cond itions: 2.5V to 5.5V
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ Max Units Conditions
TQ10 TtQH TQCK High Time Synchronous,
with prescaler TCY + 20 ns Must al so meet
parameter TQ15
TQ11 TtQL TQCK Low Time Synchronous,
with prescaler TCY + 20 ns Must al so meet
parameter TQ15
TQ15 TtQP TQCP Input
Period Synchronous,
with prescaler 2 * TCY + 40 ns
TQ20 TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment 0.5 TCY 1.5
TCY ns
Note 1: These parameters are characterized but not tested in manufacturing.
TQ11
TQ15
TQ10
TQ20
QEB
POSCNT
© 2006 Microchip Technology Inc. DS70149B-page 193
dsPIC30F5015/5016
FIGURE 24-9: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS
FIGURE 24-10: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS
TABLE 24-27: INPUT CAPTURE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Max Units Conditions
IC10 TccL ICx Input Low Time No Prescaler 0.5 TCY + 20 ns
With Prescaler 10 ns
IC11 TccH ICx Input High Time No Prescaler 0.5 TCY + 20 ns
With Prescaler 10 ns
IC15 TccP ICx Input Period (2 TCY + 40)/N ns N = prescale
value (1, 4, 16)
Note 1: These parameters are characterized but not tested in manufacturing.
TABLE 24-28: OUTPUT COMPARE MODULE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Ope rati ng temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
OC10 TccF OCx Output Fall Tim e ns See parameter D0 32
OC11 TccR OCx Outpu t Rise Time ns See parame ter D0 31
Note 1: These parameters are characterized but not tested in manufacturing.
2: Dat a in “Ty p” colu mn is at 5V, 25°C unless otherw ise state d. Parame ters are for de sign gu idanc e only and
are not t ested.
ICX
IC10 IC11
IC15
Note: Refer to Figure 24-2 for load conditions.
OCx
OC11 OC10
(Output Compare
Note: Refer to Figure 24-2 for load conditions.
or PWM Mode)
dsPIC30F5015/5016
DS70149B-page 194 © 2006 Microchip Technology Inc.
FIGURE 24-11: OC/PWM MODULE TIMING CHARACTERISTICS
TABLE 24-29: SIMPLE OC/PWM MODE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Ope rati ng temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
OC15 TFD Fault Input to PWM I/O
Change 50 ns
OC20 TFLT Fault Input Pulse Width 50 ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Dat a in “Typ” column is at 5V, 25°C unles s othe rwise st ate d. Par ameters are for desi gn gui dance only an d
are not t ested.
OCFA/OCFB
OCx
OC20
OC15
© 2006 Microchip Technology Inc. DS70149B-page 195
dsPIC30F5015/5016
FIGURE 24-12: MOTOR CONTROL PWM MODULE FAULT TIMING CHARACTERISTICS
FIGURE 24-13: MOTOR CONTROL PWM MODULE TIMING CHARACTERISTICS
TABLE 24-30: MOTOR CONTROL PWM MODULE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temp erature -40 °C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
MP10 TFPWM PWM Output Fall Time ns See par ameter D032
MP11 TRPWM PWM Output Rise Time ns See parameter D031
MP20 TFD Fault Input to PWM
I/O Chan ge ——50ns
MP30 TFH Minimum Pulse Width 50 ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Dat a in “Typ” column is at 5V, 25°C unles s othe rwise st ate d. Par ameters are for desi gn gui dance only an d
are not t ested.
FLTA/B
PWMx
MP30
MP20
PWMx
MP11 MP10
Note: Refer to Figure 24-2 for load cond iti ons.
dsPIC30F5015/5016
DS70149B-page 196 © 2006 Microchip Technology Inc.
FIGURE 24-14: QEA/QEB INPUT CHARACTERISTICS
TABLE 24-31: QUADRATURE DECODER TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise sta ted)
Operating temperature -40°C TA +85°C for Industri al
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Typ(2) Max Units Conditions
TQ30 TQUL Quadrature Input Low Time 6 TCY —ns
TQ31 TQUH Quadrature Input High Time 6 TCY —ns
TQ35 TQUIN Quadrature Input Period 12 TCY —ns
TQ36 TQUP Quadrature Phase Period 3 TCY —ns
TQ40 TQUFL Filter Ti me to Recognize Low,
with Digital Filter 3 * N * TCY ns N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
TQ41 TQUFH Filter Time to Recognize High,
with Digital Filter 3 * N * TCY ns N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
Note 1: These parameters are characterized but not tested in manufacturing.
2: N = Index Channel Digital Filter Clock Divide Select Bits. Refer to the “Quadrature Encoder Interface
(QEI)” section in thedsPIC30F Family Reference Manual” (DS70046).
TQ30
TQ35
TQ31
QEA
(input)
TQ30
TQ35
TQ31
QEB
(input)
TQ36
QEB
Internal
TQ40TQ41
© 2006 Microchip Technology Inc. DS70149B-page 197
dsPIC30F5015/5016
FIGURE 24-15: QEI MODULE INDEX PULSE TIMING CHARACTERISTICS
TABLE 24-32: QEI INDEX PULSE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5. 5V
(unless otherwise stated)
Operati ng tem per ature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Max Units Conditions
TQ50 TqIL Filter Time to Recognize Low,
with Digital Filter 3 * N * TCY ns N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
TQ51 TqiH Filter Time to Recognize High,
with Digital Filter 3 * N * TCY ns N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
TQ55 Tqidxr Index Pulse Recognized to Position
Counter Reset (Ungated Index) 3 TCY —ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Alignment of index pulses to QEA and QEB is shown for position counter reset timing only. Shown for
forward direction only (QEA leads QEB). Same timing applies for reverse direction (QEA lags QEB) but
index pulse recognition occurs on falling edge.
QEA
(input)
Ungated
Index
QEB
(input)
TQ55
Index Internal
Position
TQ50
TQ51
dsPIC30F5015/5016
DS70149B-page 198 © 2006 Microchip Technology Inc.
FIGURE 24-16: SPI MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS
TABLE 24-33: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operati ng tem per ature -40 °C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP10 TscL SCKX Output Low Time(3) TCY/2 ns
SP11 TscH SCKX Output High Time(3) TCY/2 ns
SP20 TscF SCKX Output Fall Time(4) ns See parameter D032
SP21 TscR SCKX Output Rise Time(4) ns See parameter D031
SP30 TdoF SDOX Data Output Fall Time(4) ns See parameter D032
SP31 TdoR SDOX Data Output Rise
Time(4) ns See parameter D031
SP35 TscH2doV,
TscL2doV SDOX Data Output Valid after
SCKX Edge 30 ns
SP40 TdiV2scH,
TdiV2scL Setup Time of SDIX Data Input
to SCKX Edge 20 ns
SP41 TscH2diL,
TscL2diL Hold Time of SDIX Data Input
to SCKX Edge 20 ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Dat a in “Typ” column is at 5V, 25°C unles s othe rwise st ate d. Par ameters are for desi gn gui dance only an d
are not t ested.
3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4: Assumes 50 pF load on all SPI pins.
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SDIx
SP11 SP10
SP40 SP41
SP21
SP20
SP35
SP20
SP21
MSb LSb
BIT14 - - - - - -1
MSb IN LSb IN
BIT14 - - - -1
SP30
SP31
Note: Refer to Figur e 24-2 for load conditio ns.
© 2006 Microchip Technology Inc. DS70149B-page 199
dsPIC30F5015/5016
FIGURE 24-17: SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS
TABLE 24-34: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125° C for Extende d
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP10 TscL SCKX output low time(3) TCY/2——ns
SP11 TscH SCKX output high time(3) TCY/2——ns
SP20 TscF SCKX output fall time(4) ns See parameter D032
SP21 TscR SCKX output rise time(4) ns See parameter D031
SP30 TdoF SDOX data output fall time(4) ns See parameter D032
SP31 TdoR SDOX data output rise time(4) ns See parameter D031
SP35 TscH2doV,
TscL2doV SDOX data output valid after
SCKX edge ——ns
SP36 TdoV2sc,
TdoV2scL SDOX data output setup to
first SCKX edge 30——ns
SP40 TdiV2scH,
TdiV2scL Setup time of SDIX data input
to SCKX edge 20——ns
SP41 TscH2diL,
TscL2diL Hold time of SDIX data input
to SCKX edge 20——ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Dat a in “Typ” colu mn i s at 5V, 25°C u nle ss o therwise stated. Pa ram ete rs are for des ign g uid anc e on ly a nd
are not t ested.
3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4: Assumes 50 pF load on all SPI pins.
SCKX
(CKP = 0)
SCKX
(CKP = 1)
SDOX
SDIX
SP36
SP30,SP31
SP35
MSb
MSb IN
BIT14 - - - - - -1
LSb IN
BIT14 - - - -1
LSb
Note: Refer to Figure 24-2 for load conditions.
SP11 SP10 SP20
SP21
SP21
SP20
SP40
SP41
dsPIC30F5015/5016
DS70149B-page 200 © 2006 Microchip Technology Inc.
FIGURE 24-18: SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
TABLE 24-35: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP70 TscL SCKX Input Low Time 30 ns
SP71 TscH SCKX Input High Time 30 ns
SP72 TscF SCKX Input Fall Time(3) 1025ns
SP73 TscR SCKX Input Rise Time(3) 1025ns
SP30 TdoF SDOX Data Output Fall Time(3) ns See parameter D032
SP31 TdoR SDOX Data Output Rise Time(3) ns See parameter D031
SP35 TscH2doV,
TscL2doV SDOX Data Output Valid after
SCKX Edge ——30ns
SP40 TdiV2scH,
TdiV2scL Setup Time of SDIX Data Input
to SCKX Edge 20 ns
SP41 TscH2diL,
TscL2diL Hold Time of SDIX Data Input
to SCKX Edge 20 ns
SP50 TssL2scH,
TssL2scL SSX to SCKX or SCKX Input 120 ns
SP51 TssH2doZ SSX to SDOX Output
High-Impedance(3) 10 50 ns
SP52 TscH2ssH
TscL2ssH SSX after SCK Edge 1.5 TCY +40 ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Dat a in “Typ” column is at 5V, 25°C unl ess oth erwise s tate d. Parame ters are for de sign gu idanc e only an d
are not t ested.
3: Assumes 50 pF load on all SPI pins.
SS
X
SCK
X
(CKP =
0
)
SCK
X
(CKP =
1
)
SDO
X
SDI
SP50
SP40 SP41
SP30,SP31 SP51
SP35
SDI
X
MSb LSb
BIT14 - - - - - -1
MSb IN BIT14 - - - -1 LSb IN
SP52
SP73
SP72
SP72
SP73
SP71 SP70
Note: Refer to Figure 24-2 for load conditions.
© 2006 Microchip Technology Inc. DS70149B-page 201
dsPIC30F5015/5016
FIGURE 24-19: SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS
SSX
SCKX
(CKP = 0)
SCKX
(CKP = 1)
SDOX
SDI
SP50
SP60
SDIX
SP30,SP31
MSb BIT14 - - - - - -1 LSb
SP51
MSb IN BIT14 - - - -1 LSb IN
SP35
SP52
SP52
SP73
SP72
SP72
SP73
SP71 SP70
SP40 SP41
Note: Refer to Figure 24- 2 for l oad conditions.
dsPIC30F5015/5016
DS70149B-page 202 © 2006 Microchip Technology Inc.
TABLE 24-36: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise sta ted)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP70 TscL SCKX Input Low Time 30 ns
SP71 TscH SCKX Input High Time 30 ns
SP72 TscF SCKX Input Fall Time(3) —1025ns
SP73 TscR SCKX Input Rise Time(3) —1025ns
SP30 TdoF SDOX Data Output Fall Time(3) ns See parameter D032
SP31 TdoR SDOX Data Output Rise Time(3) ns See parameter D031
SP35 TscH2doV,
TscL2doV SDOX Data Output Valid after
SCKX Edge ——30ns
SP40 TdiV2scH,
TdiV2scL Setup Time of SDIX Data Input
to SCKX Edge 20 ns
SP41 TscH2diL,
TscL2diL Hold Time of SDIX Data Input
to SCKX Edge 20 ns
SP50 TssL2scH,
TssL2scL SSX to SCKX or SCKX input 120 ns
SP51 TssH2doZ SS to SDOX Output
High-Impedance(4) 10 50 ns
SP52 TscH2ssH
TscL2ssH SSX after SCKX Edge 1.5 TCY + 40 ns
SP60 TssL2doV SDOX Data Output Valid after
SSX Edge ——50ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data i n “Typ” colum n is a t 5V, 25°C unles s o the rw is e stated. Param ete rs a re for design gu ida nc e on ly and
are not tested.
3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specificat ion.
4: Assumes 50 pF load on all SPI pins.
© 2006 Microchip Technology Inc. DS70149B-page 203
dsPIC30F5015/5016
FIGURE 24-20 : I 2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)
FIGURE 24-21 : I 2C™ BUS DATA TIMING CHARACTERISTICS (MASTER MODE)
IM31 IM34
SCL
SDA
Start
Condition Stop
Condition
IM30 IM33
Note: Refer to Figure 24-2 for load conditions.
IM11 IM10 IM33
IM11 IM10
IM20
IM26 IM25
IM40 IM40 IM45
IM21
SCL
SDA
In
SDA
Out
Note: Refer to Figure 24-2 for load conditions.
dsPIC30F5015/5016
DS70149B-page 204 © 2006 Microchip Technology Inc.
TABLE 24-37: I2C™ BUS DATA TIMING REQUIREMENTS (MASTER MODE)
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min(1) Max Units Conditions
IM10 TLO:SCL Clock Low Time 100 kHz mode TCY/2 (BRG + 1) μs—
400 kHz mode TCY/2 (BRG + 1) μs—
1 MHz mode(2) TCY/2 (BRG + 1) μs—
IM11 THI:SCL Clock High Time 100 kHz mode TCY/2 (BRG + 1) μs—
400 kHz mode TCY/2 (BRG + 1) μs—
1 MHz mode(2) TCY/2 (BRG + 1) μs—
IM20 TF:SCL SDA and SCL
Fall Time 100 kHz mode 300 ns CB is specified to be
from 10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(2) 100 ns
IM21 TR:SCL SDA and SCL
Rise Time 100 kHz mode 1000 ns CB is specified to be
from 10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(2) 300 ns
IM25 TSU:DAT Data Input
Setup Time 100 kHz mode 250 ns
400 kHz mode 100 ns
1 MHz mode(2) TBD — ns
IM26 THD:DAT Data Input
Hold Time 100 kHz mode 0 ns
400 kHz mode 0 0.9 μs
1 MHz mode(2) TBD — ns
IM30 TSU:STA Start Condition
Setup Time 100 kHz mode TCY/2 (BRG + 1) μs Only releva nt for
repeated Start
condition
400 kHz mode TCY/2 (BRG + 1) μs
1 MHz mode(2) TCY/2 (BRG + 1) μs
IM31 THD:STA Start Condition
Hold Time 100 kHz mode TCY/2 (BRG + 1) μs After this peri od the
first clock pulse is
generated
400 kHz mode TCY/2 (BRG + 1) μs
1 MHz mode(2) TCY/2 (BRG + 1) μs
IM33 TSU:STO Stop Condition
Setup Time 100 kHz mode TCY/2 (BRG + 1) μs—
400 kHz mode TCY/2 (BRG + 1) μs
1 MHz mode(2) TCY/2 (BRG + 1) μs
IM34 THD:STO Stop Condition 100 kHz mode TCY/2 (BRG + 1) ns
Hold Ti me 400 kHz mode TCY/2 (BRG + 1) ns
1 MHz mode(2) TCY/2 (BRG + 1) ns
IM40 TAA:SCL Output Valid
From Clock 100 kHz mode 3500 ns
400 kHz mode 1000 ns
1 MHz mode(2) ——ns
IM45 TBF:SDA Bus Free Time 100 kHz mode 4.7 μs Time the bus mus t be
free before a new
transmission can start
400 kHz mode 1.3 μs
1 MHz mode(2) TBD μs
IM50 CBBus Capacitive Loading 400 pF
Legend: TBD = To Be Determined
Note 1: BRG is the value of the I2C Bau d Rate G ene rato r. Refer to the “Int er-Inte grate d Circuit (I2C™)” se cti o n
in the dsPIC30F Family Reference Manual.
2: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).
© 2006 Microchip Technology Inc. DS70149B-page 205
dsPIC30F5015/5016
FIGURE 24-22 : I 2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)
FIGURE 24-23 : I 2C™ BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)
IS31 IS34
SCL
SDA
Start
Condition Stop
Condition
IS30 IS33
IS30 IS31 IS33
IS11
IS10
IS20
IS26 IS25
IS40 IS40 IS45
IS21
SCL
SDA
In
SDA
Out
dsPIC30F5015/5016
DS70149B-page 206 © 2006 Microchip Technology Inc.
TABLE 24-38: I2C™ BUS DATA TIMING REQUIREMENTS (SLAVE MODE)
AC CHARACTERISTICS
Standard Operating Cond itions: 2.5V to 5.5V
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Max Units Conditions
IS10 TLO:SCL Clock Low Time 100 kHz mode 4.7 μs Device must operate at a
minimum of 1.5 MHz
400 kHz mode 1.3 μs Device must operate at a
minimum of 10 MHz
1 MHz mode(1) 0.5 μs—
IS11 THI:SCL Clock High Time 100 kHz mode 4.0 μs Device must operate at a
minimum of 1.5 MHz
400 kHz mode 0.6 μs Device must operate at a
minimum of 10 MHz
1 MHz mode(1) 0.5 μs—
IS20 TF:SCL SDA and SCL
Fall Time 100 kHz mode 300 ns CB is specified to be from
10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(1) 100 ns
IS21 TR:SCL SDA and SCL
Rise Time 100 kHz mode 1000 ns CB is specified to be from
10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(1) 300 ns
IS25 TSU:DAT Data Input
Setup Time 100 kHz mode 250 ns
400 kHz mode 100 ns
1 MHz mode(1) 100 ns
IS26 THD:DAT Data Input
Hold Time 100 kHz mode 0 ns
400 kHz mode 0 0.9 μs
1 MHz mode(1) 00.3μs
IS30 TSU:STA Start Condition
Setup Time 100 kHz mode 4.7 μs Only relevant for repeated
Start condition
400 kHz mode 0.6 μs
1 MHz mode(1) 0.25 μs
IS31 THD:STA Start Condition
Hold Time 100 kHz mode 4.0 μs After this period, the first
clock pulse is generated
400 kHz mode 0.6 μs
1 MHz mode(1) 0.25 μs
IS33 TSU:STO Stop Condition
Setup Time 100 kHz mode 4.7 μs—
400 kHz mode 0.6 μs
1 MHz mode(1) 0.6 μs
IS34 THD:STO Stop Condition 100 kHz mode 4000 ns
Hold Time 400 kHz mode 600 ns
1 MHz mode(1) 250 ns
IS40 TAA:SCL Output Valid
From Clock 100 kHz mode 0 3500 ns
400 kHz mode 0 1000 ns
1 MHz mode(1) 0 350 ns
IS45 TBF:SDA Bus Free Time 100 kHz mode 4.7 μs Time the bus must be free
before a new transmission
can start
400 kHz mode 1.3 μs
1 MHz mode(1) 0.5 μs
IS50 CBBus Capacitive
Loading — 400pF
Note 1: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).
© 2006 Microchip Technology Inc. DS70149B-page 207
dsPIC30F5015/5016
FIGURE 24-24: CAN MODULE I/O TIMING CHARACTERISTICS
TABLE 24-39: CAN MODULE I/O TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Cond itions: 2.5V to 5.5V
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
CA10 TioF Port Output Fall Time ns See parameter D032
CA11 TioR Port Output Rise Time ns See parameter D031
CA20 Tcwf Pulse Width to Trigger
CAN W ake-up Filter 500 ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Dat a in “Typ” column is at 5V, 25°C unles s othe rwise st ate d. Par ameters are for desi gn gui dance only an d
are not t ested.
CXTX Pin
(output)
CA10 CA11
Old Value New Value
CA20
CXRX Pin
(input)
dsPIC30F5015/5016
DS70149B-page 208 © 2006 Microchip Technology Inc.
TABLE 24-40: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS(1)
AC CHARACTERISTICS
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min. Typ Max. Units Conditions
Device Supply
AD01 AVDD Modu le VDD Supply Greater of
VDD – 0.3
or 2.7
Lesser of
VDD + 0.3
or 5.5
V—
AD02 AVSS Modu le VSS Supply Vss – 0.3 VSS + 0.3 V
Reference Inputs
AD05 VREFH Reference Voltage High AVss +
2.7 AVDD V—
AD06 VREFL Reference Voltage Low AVss AVDD – 2.7 V
AD07 VREF Absolute Reference Voltage AVss – 0.3 AVDD + 0.3 V
AD08 IREF Current Drain 200
.001 300
3μA
μAA/D operating
A/D off
Analog Input
AD10 VINH-VINL Full-Scale Inpu t Sp an VREFL VREFH V—
AD12 Leakage Current ±0.001 ±0.244 μAV
INL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
Source Impedance = 5 kΩ
AD13 Leakage Current ±0.001 ±0.244 μAV
INL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
Source Impedance = 5 kΩ
AD17 RIN Recom m end ed Impedance
of Analog Voltage Source ——ΩSee Table 21-2
DC Accuracy
AD20 Nr Resoluti on 10 dat a bit s bits
AD21 INL Integral N onl ine ari ty(2) —±1±1LSbVINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
AD21A INL Integral Nonl ine ari ty(2) —±1±1LSbVINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
AD22 DNL Differential Nonlinearity(2) —±1±1LSbVINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
AD22A DNL Differential Nonlinearity(2) —±1±1LSbVINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
AD23 GERR Gain Error(2) —±5±6LSbVINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
AD23A GERR Gain Error(2) —±5±6LSbVINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
Note 1: These parameters are characterized but not tested in manufacturing.
2: Measurements taken with external VREF+ and VREF- used as the ADC voltage references.
3: The A/D conversio n resul t neve r decre as es w ith an inc rea se in the inp ut vol t ag e, and has no miss in g
codes.
© 2006 Microchip Technology Inc. DS70149B-page 209
dsPIC30F5015/5016
AD24 EOFF Offset Error(2) ±1 ±2 ±3 LSb VINL = AVSS = V REFL = 0V,
AVDD = VREFH = 5V
AD24A EOFF Offset Error(2) ±1 ±2 ±3 LSb VINL = AVSS = V REFL = 0V,
AVDD = VREFH = 3V
AD25 Monotonicity(3) Guaranteed
Dynamic Performance
AD30 THD Total Harmonic Distortion -64 -67 dB
AD31 SINAD Signal to Noise and
Distortion —5758dB
AD32 SFDR Spurious Free Dynamic
Range —6771dB
AD33 FNYQ Input Signal Bandwidth 500 kHz
AD34 ENOB Effective Number of Bits 9.29 9.41 bits
TABLE 24-40: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS(1) (CONTINUED)
AC CHARACTERISTICS
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise st ated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min. Typ Max. Units Conditions
Note 1: These parameters are characterized but not tested in manufacturing.
2: Measurements taken with external VREF+ and VREF- used as the ADC voltage references.
3: The A/D conversio n resul t neve r decre as es w ith an inc rea se in the inp ut vol t ag e, and has no miss in g
codes.
dsPIC30F5015/5016
DS70149B-page 210 © 2006 Microchip Technology Inc.
FIGURE 24-25: 10-BIT HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS
(CHPS = 01, SIMSAM = 0, ASAM = 0, SSRC = 000)
AD55
TSAMP
CLEAR SAMPSET SAMP
AD61
ADCLK
Instruction
SAMP
ch0_dischrg
ch1_samp
AD60
DONE
ADIF
ADRES(0)
ADRES(1)
1 2 3 4 5 6 8 5 6 7
1– Software sets ADCON. SAMP to start sam p ling .
2– Sampling starts after discharge period TSAMP is described in Section 2 0.8 “A/D Acquisiti on Requirements”.
3– Software clears ADCON. SAM P to start conversion.
4– Sampling ends, conversion sequence starts.
5– Convert bit 9.
8– One TAD for end of conversion.
AD50
ch0_samp
ch1_dischrg
eoc
7
AD55
8
6– Convert bit 8.
7– Convert bit 0.
Execution
© 2006 Microchip Technology Inc. DS70149B-page 211
dsPIC30F5015/5016
FIGURE 24-26: 10-BIT HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS
(CHPS = 01, SIMSAM = 0, ASAM = 1, SSRC = 111, SAMC = 00001)
AD55
TSAMP
SET ADON
ADCLK
Instruction
SAMP
ch0_dischrg
ch1_samp
DONE
ADIF
ADRES(0)
ADRES(1)
1 2 3 4 5 6 4 5 6 8
1– Software sets ADCON. ADON to start AD operation.
2– Sampling starts after discharge period.
3– Convert bit 9.
4– Convert bit 8.
5– Convert bit 0.
AD50
ch0_samp
ch1_dischrg
eoc
7 3
AD55
6– One TAD for end of conversion.
7– Begin conversion of next channel.
8– Sample for time specified by SAMC.
TSAMP TCONV
3 4
Execution
TSAMP is described in the “dsPIC30F
Family Reference Manual” (DS70046), Section 17.
TSAMP is described in Section 20.8
“A/D Acquisit ion Requirements”.
dsPIC30F5015/5016
DS70149B-page 212 © 2006 Microchip Technology Inc.
TABLE 24-41: 10-BIT HIGH-SPEED A/D CONVERSION TIMING REQUIREMENTS
AC CHARACTERISTICS
St a ndard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125 °C for Extende d
Param
No. Symbol Characteristic Min. Typ(1) Max. Units Conditions
Clock Parameters
AD50 TAD A/D Clock Period 83.33(2) —nsSee Table 21-1(3)
AD51 tRC A/D Internal RC Oscillator Period 700 900 1100 ns
Conversion Rate
AD55 tCONV Conversion Time 12 TAD ——
AD56 FCNV Throughput Rate 1 .0 Msps See Table 21-1(3)
AD57 TSAMP Sample Time 1 TAD ——See Table 21-1(3)
Timing Parameters
AD60 tPCS Conversion Start from Sample
Trigger(3) 1.0 TAD Auto-Convert Trigger
(SSRC = 111) not
selected
AD61 tPSS Sample Start from Setting
Sample (SAMP) Bit 0.5 TAD 1.5 TAD ——
AD62 tCSS Conversion Completion to
Sample Start (ASAM = 1)(4) 0.5 TAD —ns
AD63 tDPU Time to Stabilize Analog Stage
from A/D Off to A/D On(4) —20μs—
Note 1: These parameters are characterized but not tested in manufacturing.
2: Operating Temperature: -40°C to +85°C
3: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures.
4: Characterized by design but not tested.
© 2006 Microchip Technology Inc. DS70149B-page 213
dsPIC30F5015/5016
25.0 PACKAGING INFORMATION
25.1 Package Marking Information
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designat or ( )
can be found on the outer packaging for this package.
Note: In the event the fu ll Mic rochip part nu mber ca nnot be m arked o n one line, it w ill
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
64-Lead TQFP
dsPIC30F5015
-30I/PT
0512XXX
Example
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
80-Lead TQFP
dsPIC30F5016
30I/PT
0512XXX
Example
3
e
3
e
dsPIC30F5015/5016
DS70149B-page 214 © 2006 Microchip Technology Inc.
64-Lead Plastic Thin Quad Flatp ack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1510515105
β
Mold Draft An g le Bo tto m 1510515105
α
Mold Draft Angle Top
0.270.220.17.011.009.007BLead Width 0.230.180.13.009.007.005
c
Lead Thickness
1616n1Pins per Side
10.1010.009.90.398.394.390D1Molded Package Length 10.1010.009.90.398.394.390E1Molded Package Width 12.2512.0011.75.482.472.463DOverall Length 12.2512.0011.75.482.472.463EOverall Width 73.5073.50
φ
Foot Angle
0.750.600.45.030.024.018LFoot Length 0.250.150.05.010.006.002A1Standoff 1.051.000.95.041.039.037A2Molded Package Thickness 1.201.101.00.047.043.039AOverall Height
0.50.020
p
Pitch 6464
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERS
*
INCHESUnits
Footprint F .039 REF. 1.00 REF.
Pin 1 Corner Chamfer CH .025 .035 .045 0.64 0.89 1.14
REF: Reference Dimension, usually without tolerance, for information purposes only.
Revised 07-22-05
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
See ASME Y14.5M
*
Controlling Parameter
JEDEC Equivalent: MS-026
Notes:
c
2
1
n
DD1
B
p
#leads=n1
E1
E
A2
A1
A
L
CH x 45°
β
φ
α
F
Drawing No. C04-085
© 2006 Microchip Technology Inc. DS70149B-page 215
dsPIC30F5015/5016
80-Lead Plastic Thin Quad Flatp ack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
F
E
E1
#leads=n1
p
B
D1 D
n
1
2
φ
c
β
L
A
A1 A2
α
CH x 45°
1.101.00.043.039
1.140.890.64.045.035.025CH
Pin 1 Corner Chamfer
1.00 REF..039 REF.F
Footprint
Units INCHES MILLIMETERS
*
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n80 80
Pitch p.020 BSC 0.50 BSC
Overall Height A .047 1.20
Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05
Standoff A1 .002 .004 .006 0.05 0.10 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Foot Angle
φ
3.5° 3.5°
Overall Width E .551 BSC 14.00 BSC
Overall Length D .551 BSC 14.00 BSC
Molded Package Width E1 .472 BSC 12.00 BSC
Molded Package Length D1 .472 BSC 12.00 BSC
Pins per Side n1 20 20
Lead Thickness c.004 .006 .008 0.09 0.15 0.20
Lead Width B .007 .009 .011 0.17 0.22 0.27
Mold Draft Angle Top
α
10° 15° 10° 15°
Mold Draft Angle Bottom
β
10° 15° 10° 15°
Notes:
JEDEC Equivalent: MS-026 Revised 07-22-05
*
Controlling Parameter
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
See ASME Y14.5M
See ASME Y14.5M
Drawing No. C04-092
dsPIC30F5015/5016
DS70149B-page 216 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 217
dsPIC30F5015/5016
APPENDIX A: REVISION HISTORY
Revision A (July 2005)
Original data sheet for dsPIC30F5015 and
dsPIC30F5016 devices.
Revision B (September 2006)
Revision B of this data sheet reflects these changes:
Base instruction CP1 removed (see Table 22-2)
Supported I2C Slave Addresses (see Ta ble 17-1)
ADC Conversion Clock selection (see
Section 2 1.0 “10-bit High-Speed Analog-to-
Digital Converter (ADC) Module”)
Revised Electrical Characteristics
- Operating curr ent (IDD) specificati ons
(see Table 24-6)
- Idle current (IIDLE) specifications
(see Table 24-7)
- Power-down current (IPD) specificati ons
(see Table 24-8)
- I/O Pin input specifications
(see Table 24-9)
- BOR voltage limits
(see Table 24-11)
- Watchdog Timer limits
(see Table 24-21)
dsPIC30F5015/5016
DS70149B-page 218 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 219
dsPIC30F5015/5016
INDEX
A
A/D Aborting a Conver sion ............................ .................152
Acquisition Requirements ........................................156
ADCHS ....................................................................149
ADCON1 .................................................................. 149
ADCON2 .................................................................. 149
ADCON3 .................................................................. 149
ADCSSL ...................................................................149
ADPCFG .................................................................. 149
Configuring Analog Port Pins ...................................158
Connection Considerations .................................... ..158
Conversi o n Op e r a tio n ........................... ...................151
Effects of a Reset .....................................................157
Operation During CPU Idle Mode ............................157
Operation During CPU Sleep Mode .........................157
Output Fo rmats ...... ..................... ........................... ..157
Power-Down Modes .................................................157
Programming the Start of Conversion Trigger .........152
Register Map ........................ ..................... ...............159
Result Buffer ........................ ..................... ...............151
Selecting the Conversion Clock ...............................152
Selecting the Conversion Sequence ........................151
AC Temperature and Voltage Specifications ................. 182
AC Characteristics ...........................................................182
Internal FRC Jitter, Accuracy and Drift ....................186
Internal LPRC Accuracy ...........................................186
Load Conditions ..................... ....... .. .... .. .. .... ..... .... .. ..182
PLL Jitter ..................................................................184
Address Generator Units ...................................................35
Altern a te Vector Table ( AIVT) ........................... .................45
Alternate 16-bit Timer/Counter ...........................................89
Assembler
MPASM Assembler ..................................................170
Automatic Clock Stretch ...................................................110
During 10-bit Addressing (STREN = 1) ....................110
During 7-bit Addressing (STREN = 1) ......................110
Receive Mode ..........................................................110
Transmit Mode .................................. .. .... .. .. ......... .. ..110
B
Barrel Shifter ......................................................................22
Bit-Reversed Addre ssing .................. ..................... ............38
Example .....................................................................38
Implementation ..........................................................38
Modifier Values for XBRE V Re g ister ........ .................39
Sequence Table (16-Entry) ........................................39
Block Diagrams
CAN Buffers and Protocol Engine ............................124
Dedicate d Po rt Structu re ................................ ............59
DSP Engine ............... ................................. ...............19
dsPIC30F5015 ............................................................. 8
dsPIC30F5016 ........................................................... 11
Exter n a l Pow e r-on Reset C i r cu i t ........ ...... ..... .. ...... .. .1 42
Input Capture Mode ............... ....... .. .. .... .. .. ....... .. .... .. ..79
I2C ............................................................................108
Oscillator System .....................................................135
Output Co mpa re Mode ............................. .................83
Programmer’s Model ..................................................17
PWM Module ....................... ......... .... .... .... ......... .... ....94
Quadrature Encoder Interface ...................................87
Reset System ................... ..................... ...................139
Shared Po rt Structure ............................ .................... 60
SPI ........................................................................... 104
SPI Master/Slave Connection .................................. 104
UART Receiver ........................................................ 116
UART Transmitter .................................................... 115
10-bit High-Speed A/D Functional ................. .... .. .. .. 150
16-bit Timer1 Module (Type A Timer) ........................ 66
16-bit Timer2 (Type B Timer) .................................... 71
16-bit Timer3 (Type C Timer) .................................... 71
16-bit Timer4 (Type B Timer) .................................... 76
16-bit Timer5 (Type C Timer) .................................... 76
32-bit Timer2/3 ..................... ..................... ................ 70
32-bit Timer4/5 ..................... ..................... ................ 75
BOR. See Brown-out Reset.
Brown-o u t Re set (BOR) . ............... ..................... .............. 133
C
C Compilers
MPLAB C18 ............................ ................................. 170
MPLAB C30 ............................ ................................. 170
CANBaud Rate Setting ................................................... 128
Bit Timin g ............................ ..................... ................ 128
Message Reception ................................................. 126
Acceptance Filter Masks ................................. 126
Acceptance Filters ........................................... 126
Receive Buffers ..... ..................... ..................... 126
Receive Errors ............................ ..................... 126
Receive Interrupts .............. ............... .............. 126
Receive Ove rrun ......... ..................... .............. .. 126
Message Transmission ............................................ 127
Aborting ........................................................... 127
Errors ............................................................... 127
Interrupts ......................................................... 128
Sequence ........................................................ 127
Transmit Buffers .............................................. 127
Transmit Priority .............................................. 127
Modes of Ope ration .............. ..................... .............. 125
Disable ............................................................ 125
Error Recognition ............................................. 125
Initialization ...................................................... 125
Listen-Only ...................................................... 125
Loopback ......................................................... 125
Normal ............................................................. 125
Phase Seg m e n ts ....... ..................... ......................... 129
Prescaler Setting ..................................................... 129
Propagation Segment .............................................. 129
Sample Point ....... ............... ..................... ................ 129
Synchronization ....................................................... 129
CAN Module ................ .. .... .. ....... .... .. .... .. .... ....... .. .... .. .... .. 123
CAN1 Registe r Map .................... ..................... ........ 130
Frame Types ........................................................... 123
Overview .................................................................. 123
Code Examples
Data EEPRO M Block Erase ..... ............... .................. 56
Data EEPRO M Block Write ...... ..................... ............ 58
Data EEPROM Read ................................................. 55
Data EEP RO M Word Er a se ..... ................................. 56
Data EEPRO M Word Write ......................... .............. 57
Erasing a Row of Program Memory .......................... 51
Initiating a Programming Sequence ...................... .... 52
Loading Write Latches ........................ ..... .. .. .... .. .. .. .. .. 52
Code Protection . . ............................................................. 133
Config u ring Analog Port Pins ............ ........................... ...... 60
dsPIC30F5015/5016
DS70149B-page 220 © 2006 Microchip Technology Inc.
CoreRegister Map ... ............... ..................... ..................... ..32
Core Overview ...................................................................15
CPU Architecture Overview ...............................................15
Customer Change Notification Service ............................225
Custome r Notification Ser vice .... ............... .............. .........225
Customer Support ............................................... .... .... .....225
D
Data Address Space ..........................................................27
Alignment ...................................................................30
Alignment (Figure) .....................................................30
Effect of Invalid Memory Accesses ............................30
MCU and DSP (MAC Class) Instructions Example ....29
Memory Map ........................................................27, 28
Near Data Space .......................................................31
Softwa re Stack ...... ............................ .........................31
Spaces ....................................................................... 30
Width .......................................................................... 30
Data EEPROM Memory .....................................................55
Erasing .......................................................................56
Erasing, Block ............................................................56
Erasing, Word ............................................................56
Protection Agains t S pur io u s Write ........ .............. .......58
Reading ......................................................................55
Write Verify ................................................................58
Writing ........................................................................ 57
Writing , Block .... ............... ........................... ...............58
Writing , Wo rd ...... ..................... ..................... .............57
DC Characteristics ...........................................................174
I/O Pin Input Specifications ......................................179
I/O Pin Output Specifications ...................................180
Idle Current (IIDLE) ...................................................177
Operating Current (IDD) ............................................176
Operating MIPS vs Voltage
dsPIC30F5015 ................................................. 174
dsPIC30F5016 ................................................. 174
Power-Down Current (IPD) .......................................178
Program and EEPROM ............................................181
Temperature and Voltage Specifications ................. 175
Thermal Operating Conditions .................................174
Development Support ......................................................169
Device Configuration
Register Map ............................ ..................... ...........147
Device Configuration Registers ........................................145
FBORPOR ...............................................................145
FGS ..........................................................................145
FOSC ....................................................................... 145
FWDT .......................................................................145
Device Overview ..................................................................7
Divide Support .......................... .. .... .. .... .. ....... .... .. .... .. ....... ..18
DSP Engine ..... .............. .................................. ...................18
Data Accumulators and Adder/Subtracter .................20
Accumulator Write Back .....................................21
Data Space Write Saturation ........ .....................22
Overflow and Saturation ............................. .......20
Round Logic . ......................................................21
Multiplier .....................................................................20
dsPIC30F5015 PORT
Register Map ............................ ..................... .............61
dsPIC30F5016 PORT
Register Map ............................ ..................... .............62
Dual Output Compare Match Mode .................... .... .. .. ..... ..84
Continuous Pulse Mode ................................ .. .... .......84
Single Pulse Mode ........................................ .... .. .......84
E
Electrical Characteristics ................................................. 173
Equations
A/D Conversion Clock ................... .............. ............. 152
Baud Rate ................................................................ 119
PWM Period .................................. ............................. 96
PWM Period (Up/Down Mode) ............................ .... .. 96
PWM Resoluti on ......................... .............. ................. 96
Serial Clock Rate ..................................................... 112
Time Quantum for Clock Generation ....................... 129
Errata ................................................................................... 5
F
Fast Context Saving .......................................................... 45
Flash Pr o g ram Memory ................. .................................... 49
Erasing a Row ................... ............... ..................... .... 51
Initiating Programming Sequence .............................. 52
Loading Write Latches ...................... .. .. .... .. ..... .. .. .... .. 52
Operations ................................................................. 51
Programming Algorithm ........................ ..................... 51
Table Ins tructio n Opera tion Summary ................... .... 49
I
I/O Ports ......................... ........................... ......................... 59
Parallel I/O (PIO) ....................................................... 59
Idle Current (IIDLE) ........................................................... 177
In-Circuit Debugger .......................................................... 146
In-C i r cu i t Se rial Pro g ramming (I C SP) .. .. .. ...... ...... ..... . 49 , 1 3 3
Initialization Condition for RCON Register Case 1 .......... 143
Initialization Condition for RCON Register Case 2 .......... 143
Input Capture Module ........................................................ 79
Interrupts ................................................................... 80
Operation During Sleep and Idle Modes .................... 80
Register Map ......... ........................... ..................... .... 81
Simple Capture Event Mode ...................................... 79
Input Change Notification Module ...................................... 63
Register Map (Bits 15-8 for dsPIC30F5015) .............. 63
Register Map (Bits 15-8 for dsPIC30F5016) .............. 63
Register Map (Bits 7-0 for dsPIC30F5015) ................ 63
Register Map (Bits 7-0 for dsPIC30F5016) ................ 63
Instruction Addressing Modes ........................................... 35
File Register Instructions ........................................... 35
Fundamental Modes Supported ................................ 35
MAC Instru ctions ..... .............. ............... ..................... 36
MCU Instru ctions ..... ........................... ....................... 35
Move and Accumulator Instruc tions ........................... 36
Other Ins tructio n s ........................... ........................... 36
Instruction Set
Overview .................................................................. 164
Summary ................................................................. 161
Inter n e t Ad d ress .......... ........................... ......................... 225
Interrupt Vector Table (IVT) ............................................... 45
Interrupts ............................................................................ 41
Controller
Register Map for dsPIC30F5015 ....................... 46
Register Map for dsPIC30F5016 ....................... 47
External Requests ..................................................... 45
Interrupt Stack Frame ................................................ 45
Priority ....................................................................... 42
Sequence .................................................................. 45
© 2006 Microchip Technology Inc. DS70149B-page 221
dsPIC30F5015/5016
I2C Master Mode
Baud Rate Generator ...............................................111
Clock Arbitration .......................................................112
Multi-Master Communication, Bus Collision
and Bus Arbitration ......................... .... ........... ..112
Reception .................................................................111
Transmission ............................................................111
I2C Module .......................................................................107
Addresses ................................................................ 109
General Call Address Support .................................111
Interrupts ..................................................................111
IPMI Support ............................................... .............111
Master Operation .....................................................111
Master Support ........................................................111
Operating Function Description ...............................107
Operation During CPU Sleep and Idle Modes .........112
Pin Configuration .....................................................107
Programmer’s Model ................................................107
Register Map ........................ ..................... ...............113
Registers ..................................................................107
Slope Control . ..........................................................111
Software Controlled Clock Stretching (STREN = 1) .110
Various Modes ..................................................... ....107
I2C 10-bit Slave Mode Operation .....................................109
Reception .................................................................110
Transmission ............................................................110
I2C 7-bit Slave Mode Operation .......................................109
Reception .................................................................109
Transmission ............................................................109
M
Memory Organization .........................................................23
Microc h i p In ternet Web Site ........................ .....................225
Modulo Addressing ............................................................36
Applicability ................................................................ 38
Operation Example ....................................................37
Start and End Address ...............................................37
W Addres s Reg i s te r Selection ........ ..................... ......37
Motor Control PWM Module ...............................................93
MPLAB ASM30 Assembler, Linker, Librarian ..................170
MPLAB ICD 2 In-Circuit Debugger ..................... ......... ....171
MPLAB ICE 2000 High-Perform ance Universal
In-Circuit Emulator ...................................................171
MPLAB ICE 4000 High-Perform ance Universal
In-Circuit Emulator ...................................................171
MPLAB Integrated Development Environment Software .169
MPLAB PM3 Device Programmer ...................................171
MPLINK Object Linker/MPL IB Object Librarian ......... ......170
N
NVMRegister Map ........................ ..................... .................53
O
Operating Current (IDD) ....................................................176
Oscillator
Operating Modes (Table) .........................................134
Syste m Over view ....... ........................... ...................133
Oscillator Configurations ..................................................136
Fail-Safe Clock Monitor ............................................138
Fast RC (FRC) .........................................................137
Initial Clock Source Selection ..................................136
Low-Power RC (LPRC) ............................................138
LP Oscillator Control ................................................137
Phase Locked Loop (PLL) ..................................... ..137
Start- u p Timer (OST) ....... ..................... ...................137
Oscillator Selection ..........................................................133
Output Com p a re Module ........................ ..................... ...... 83
Interrupts ................................................................... 85
Operation During CPU Idle Mode .............................. 85
Operation During CPU Sleep Mode .......................... 85
Register Map ....... ............... ..................... .................. 86
Timer2, Timer3 Selection Mode ................................ 84
P
Packaging
Information ............................................................... 213
Marking .................................................................... 213
Peripheral Module Disable (PMD) Registers ................... 146
PICSTART Plus Development Programmer .................... 172
Pinout Descriptions
dsPIC30F5015 ............................................................. 9
dsPIC30F5016 ........................................................... 12
POR. See Power-on Reset.
Port Write/Read Example .................................................. 60
Position Measurement Mode ............................... .... .... .. .... 88
Power-Down Current (IPD) ............................................... 178
Power-on Reset (POR) .................................................... 133
Oscillator Start-up Timer (OST) .......... ......... ............ 133
Power-up Timer (PWRT) ......................................... 133
Power-Saving Modes ....................................................... 144
Idle ........................................................................... 145
Sleep ....................................................................... 144
Power-Saving Modes (Sleep and Idle) ............................ 133
Program Address Space .................................................... 23
Construction .............................................................. 24
Data Access from Program Memory Using
Program Space Visibility .................................... 26
Data Access from Program Memory Using
Table Ins tructio n s .......................... .................... 25
Data Acce ss from, Address Gener a tion .................... 24
Memory Map .............................................................. 23
Table Instructions
TBLRDH ............................................................ 25
TBLRDL ............................................................. 25
TBLWTH ............................................................ 25
TBLWTL ............................................................ 25
Program Counter ............................................................... 16
Program Data Table Access (MSB) ................................... 26
Program Space Visibility
Window into Program Space Operation .................... 27
Programmable ................................................................. 133
Programmable Digital Noise Filters ................................... 89
Programm er’s Model ......................................................... 16
Protection Against Accidental Writes to OSCCON .......... 139
PWMCenter-Aligned ........................................................... 97
Complementary Operation ........................................ 98
Dead-Time Generators .... .......................................... 98
Assignment ........................................................ 98
Ranges .............................................................. 98
Selectio n Bits . ............... ..................... .............. .. 98
Duty Cycle Compa r ison Un its ....... ....................... ...... 97
Immediate Updates .............. .... .. ....... .. .. .... .. .. .... 97
Register Buffers ........................ ......................... 97
Edge-Aligned ............................................................. 96
Fault Pins ................................................................. 100
Enable Bits ...................................................... 100
Fault States ..................................................... 100
Input Modes ..................................................... 100
Priority ............................................................. 100
Independent Output ................................................... 99
Operation During CPU Idle Mode ............................ 101
dsPIC30F5015/5016
DS70149B-page 222 © 2006 Microchip Technology Inc.
Operation During CPU Sleep Mode .........................101
Output and Polarity Control ......................................100
Output Pin Co n tr o l ........... ............... .................100
Output Override .... ............................ .........................99
Complementary Output Mode ............................99
Synchronization .................................................99
Period .........................................................................96
Single -Pulse Operation ......................... .....................99
Special Event Trigger ...............................................101
Postscaler ........................................................101
Time Bas e .................................... ..............................95
Continuous Up/Down Counting Modes ..............95
Double Update Mode ...................... .. .... .. .. .. .......96
Free-Running Mode ...........................................95
Postscaler ..........................................................96
Prescaler ............................................................96
Single-Shot Mode ..............................................95
Update Lockout .................. .... .. .. .. ....... .. .. .... .. .. .. .......101
Q
Quadrature Encoder Interface (Q EI) . ............................ .....87
Interrupts .................................................................... 90
Logic ..........................................................................88
Operation During CPU Idle Mode .... ..........................89
Operation During CPU Sleep Mode ...........................89
Register Map ............................ ..................... .............91
Timer Operation During CPU Idle Mode ....................90
Timer Operation During CPU Sleep Mode . ................89
R
Reader Response ............................................................226
Reset ........................................................................133, 139
Reset Sequence ............................... .... .. ......... .. .... .. .... .......43
Reset Sources ...... ..................... ............................ ....43
Resets
BOR, Programmable ......................... .......................141
POR .........................................................................140
POR with Long Crystal Start-up Time ......................141
POR, Operating without FSCM and PWRT .............141
Revision History ...............................................................217
Run-Time Self-Programming (RTSP) ................................49
Control Reg i sters ......... .............. ..................... ...........50
NVMADR ...........................................................50
NVMADRU .........................................................50
NVMCON ........................................................... 50
NVMKEY ............................................................50
Operation ...................................................................50
S
Simple Capture Event Mode
Capture Bu ffer Operation ............................ ...............80
Capture Prescaler ................................. .....................79
Hall Sensor Mode .......................... ......... ...... .... .........80
Timer2 and Timer3 Selection Mode ...........................80
Simple Output Compare Match Mode ................................84
Simple PWM Mode ............................................................84
Input Pin Fault Protection ............................ .. .... .. .......84
Period .........................................................................85
Softwa re Simulator (MP L AB SIM) .... ........................... .....170
Softwa re Stack Pointe r, Frame Pointer ......... .....................16
CALL Stack Frame .....................................................31
SPI Module ...................................................................... 103
Framed SPI Support ................................................ 105
Operating Function Description ............................... 103
Operation During CPU Idle Mode ............................ 105
Operation During CPU Sleep Mode ......................... 105
SDOx Disabl e ...................... ..................... ............... 103
Slave Select Synchron i zation ..................... ............. 105
SPI1 Register Map ................................................... 106
SPI2 Register Map ................................................... 106
Word and Byte Communication ............................... 103
STATUS Regi ster .................... ........................... ............... 16
Symbols Used in Opcode Descriptions ........................... 162
System Integration ...........................................................133
Register Map ......... ........................... ..................... ..147
T
Timer1 Module ................................................................... 65
Gate Operation .......................................................... 66
Interrupt ..................................................................... 67
Operation During Sleep Mode ................................... 66
Prescaler ................................................................... 66
Real-Time Clock ........................................................ 67
Interrupts ........................................................... 67
Oscillato r Operation . ......... ........ ........ ................. 67
Register Map ......... ........................... ..................... .... 68
16-bit Asynchronous Counter Mode .......................... 65
16-bit Synchronous Counter Mode ............................ 65
16-bit Timer Mode ...................................................... 65
Timer2/3 Module ................................. .... .. .. .... .. ....... .. .... .. .. 69
ADC Event Trigger ..................................................... 72
Gate Operation .......................................................... 72
Interrupt ..................................................................... 72
Operation During Sleep Mode ................................... 72
Register Map ......... ........................... ..................... .... 73
Timer Prescaler ......................................................... 72
16-bit Mode ....... ....... .. .. .... .. .. ....... .. .... .. .. .... .. ....... .. .. .... 69
32-bit Synchronous Counter Mode ............................ 69
32-bit Timer Mode ...................................................... 69
Timer4/5 Module ................................. .... .. .. .... .. ....... .. .... .. .. 75
Register Map ......... ........................... ..................... .... 77
Timing Diagrams
Band Gap Start-up Time . ......................................... 189
Brown-o u t Re set .................. ............... ..................... 180
CAN Bit .................... ..................... ..................... ...... 128
CAN Module I/O .................................. .. .... .. ....... .... ..207
Center-Aligned PWM ................................................. 97
CLKOUT and I/O ..................................................... 187
Dead-Time ................................................................. 99
Edge-Aligned PWM .................................. ......... .... .... 96
External Clock .......................................................... 182
Input Capture (CAPx) .............................................. 193
I2C Bus Data (Master Mode) ................................... 203
I2C Bus Data (Slave Mode) ..................................... 205
I2C Bus Start/Stop Bits (Master Mode) .................... 203
I2C Bus Start/Stop Bits (Slave Mode) ...................... 205
Motor Control PWM Module .................................... 195
Motor Control PWM Module Fault ........................... 195
OC/PWM Module ..................................................... 194
Output Com p a re (OCx) ............. ..................... .......... 193
PWM Output ................................... ........................... 85
QEA/QEB Input Characteristics ...... .... .. .... .. ......... .. .. 196
QEI Module Index Pulse ............................. ....... .... .. 197
Reset, Watchdog Timer, Oscillator Start-up Timer
and Power-up Timer ........................................ 188
SPI Master Mode (CKE = 0) .................................... 198
SPI Master Mode (CKE = 1) .................................... 199
© 2006 Microchip Technology Inc. DS70149B-page 223
dsPIC30F5015/5016
SPI Slave Mode (CKE = 0) ......................................200
SPI Slave Mode (CKE = 1) ......................................201
Time-out Sequence on Power-up (MCLR Not
Tied to VDD), Case 1 ........................................140
Time-out Sequence on Power-up (MCLR Not
Tied to VDD), Case 2 ........................................141
Time-out Sequence on Power-up (MCLR
Tied to VDD) ..................................................... 140
TimerQ (QEI Module) Ex ternal Clock ..... .................192
Timer1, 2, 3, 4, 5 External Clock ..............................190
10-bit High-Speed A/D Conversion (CHPS = 01,
SIMSAM = 0, ASAM = 0, SSRC = 000) ...........210
10-bit High-Speed A/D Conversion (CHPS = 01,
SIMSAM = 0, ASAM = 1, SSRC = 111,
SAMC = 00001) ...............................................211
Timing Requirements
A/D Conversion .... .............. ..................... ............... ..212
Band Gap Start-up Time ..........................................189
CAN Module I/O .......................................................207
CLKOUT and I/O ......................................................187
External Clock ..........................................................183
Input Capture ................. .... .. .. ....... .... .. .. .... .. ....... .... ..193
I2C Bus Data (Master Mode) . ...................................204
I2C Bus Data (Slave Mode) . .....................................206
Motor Control PWM Module .....................................195
Output Co mpa re ......................... ..................... ........193
QEI Module External Clock ......................... ..... .... .. ..192
QEI Module Index Pulse ........................................ ..197
Quadrature Decoder ....................... .. .... .. .... ....... .. ....196
Reset, Watchdog Timer, Oscillator Start-up Timer ,
Power-up Timer and Brown-out Reset ............189
Simple OC/PWM Mode ............................................194
SPI Master Mode (CKE = 0) ....................................198
SPI Master Mode (CKE = 1) ....................................199
SPI Slave Mode (CKE = 0) ......................................200
SPI Slave Mode (CKE = 1) ......................................202
Timer1 External Clock ..............................................190
Timer2 and Timer4 External Clock ..........................191
Timer3 and Timer5 External Clock ..........................191
Timing Specifications
PLL Clock .................................................................184
Traps .................................................................................. 43
Hard and Soft .............................................................44
Sources ......................................................................43
Vectors .......................................................................44
U
UART
Address Detect Mode .............................................. 119
Auto-Baud Support .................................................. 120
Baud Rate Generator .............................................. 119
Disabling .................................................................. 117
Enabling ................................................................... 117
Loopback Mode ........................ .... .. .. ....... .. .... .. .. .... .. 119
Module Overview ..................................................... 115
Operation During CPU Sleep and Idle Modes ......... 120
Receiving Data ........................................................ 118
In 8-bit or 9-bit Data Mode ............................... 118
Interrupt ........................................................... 118
Receive Buffer (UxRXB) ......... ..................... .... 118
Reception Error Handling ........... ........ ......... ............ 118
Framing Er ror (FERR Bit) .................. .............. 119
Idle Status ....................................................... 119
Parity Error (PERR Bit) .. .................................. 119
Receive Bre a k .................. ..................... .......... 119
Receive Buffer Overrun Error (OERR Bit) ....... 118
Setting Up Data, Parity and Stop Bit Selections ...... 117
Transmitting Data .................................................... 117
In 8-bit Data Mode ................................. .. .. .. .... 117
In 9-bit Data Mode ................................. .. .. .. .... 117
Interrupt ........................................................... 118
Transmit Buffer (UxTXB) ................................. 117
UART1 Register Map .............................................. 121
Unit ID Locations ............................................................. 133
Universal Asynchronous Receiver Transmitter
Module (UART) ........................................................ 115
W
Wake-up from Sleep . ....................................................... 133
Wake-up from Sleep and Idle ............................................ 45
Watchdog Timer (WDT) ...................... .... .... ........... .. 133, 144
Enabling and Disabling ............................................ 144
Operation ................................................................. 144
WWW Addres s ........ ..................... ........................... ........ 225
WWW, On-Line Support ...................................................... 5
Z
10-Bit High-Speed Analog-to-Digital (A/D) Converter
Module ..................................................................... 149
16-bit Up/Down Position Counter Mode ........................ .. .. 88
Count Direction Status ... ....... .... .... .... ......... .. .... .... .... .. 88
Error Checking .................................. ......................... 88
8-Output PWM
Register Map ....... ............... ..................... ................ 102
dsPIC30F5015/5016
DS70149B-page 224 © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. DS70149B-page 225
dsPIC30F5015/5016
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DS70149BdsPIC30F5015/5016
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© 2006 Microchip Technology Inc. DS70149B-page 227
dsPIC30F5015/5016
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
dsPIC30F5016AT-30I/PT-000
Example:
dsPIC30F5015AT-30I/PF = 30 MIPS, Industrial temp., TQFP package, Rev. A
Trademark
Architecture
Flash
E = Extended High Temp -40°C to +125°C
I = Industrial -40°C to +85°C
Temperature
Device ID
Package
PT = TQFP 10x10
PT = TQFP 12x1 2
S = Die (W affle Pack)
W = Die (Wafers)
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Custom ID (3 digits) or
T = Tape and Reel
A,B,C… = Revision Level
Engineering Sample (ES)
Speed
30 = 30 MIPS
DS70149B-page 228 © 2006 Microchip Technology Inc.
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