www.osram-os.com Produktdatenblatt | Version 1.1 BPW 34 FS BPW 34 FS DIL SMT Silicon PIN Photodiode with Daylight Blocking Filter Applications ----Measurement Levelling ----Electronic Equipment ----Industrial Automation (Machine Controls, Light Barriers, Vision Controls) Features: ----Package: black epoxy ----Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. ----ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ----Especially suitable for applications from 780 nm to 1100 nm ----Short switching time (typ. 20 ns) ----DIL plastic package with high packing density ----Suitable for reflow soldering Ordering Information Photocurrent Photocurrent Ordering Code typ. Ee = 1 mW/cm; = 950 nm; VR = 5 V Ee = 1 mW/cm; = 950 nm; VR = 5 V IP IP BPW 34 FS-Z 40 A Type 1 Version 1.6 | 2019-07-10 50 A Q65110A2700 BPW 34 FS Maximum Ratings TA = 25 C Parameter Symbol Operating Temperature Top min. max. -40 C 100 C Storage temperature Tstg min. max. -40 C 100 C Reverse voltage VR max. 12 V Reverse voltage t 2 s; TA = 25 C VR max. 16 V Reverse voltage t 2 min VR max. 32 V Total power dissipation Ptot max. 150 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV 2 Version 1.6 | 2019-07-10 Values BPW 34 FS Characteristics TA = 25 C Parameter Symbol Wavelength of max sensitivity S max typ. 950 nm Spectral range of sensitivity 10% typ. 780 ... 1100 nm Radiant sensitive area A typ. 7.02 mm Dimensions of active chip area LxW typ. 2.65 x 2.65 mm x mm Half angle typ. 60 Dark current VR = 10 V IR typ. max. Spectral sensitivity of the chip = 950 nm S typ. 0.7 A / W Quantum yield of the chip = 950 nm typ. 0.91 Electrons / Photon Open-circuit voltage Ee = 0.5 mW/cm; = 950 nm VO min. typ. 275 mV 330 mV Short-circuit current Ee = 0.5 mW/cm; = 950 nm ISC typ. 25 A Rise time VR = 5 V; RL = 50 ; = 850 nm tr typ. 0.02 s Fall time VR = 5 V; RL = 50 ; = 850 nm tf typ. 0.02 s Forward voltage IF = 100 mA; E = 0 VF typ. 1.3 V C0 typ. 72 pF Temperature coefficient of voltage TCV typ. -2.6 mV / K Temperature coefficient of short-circuit current = 950 nm TCI typ. 0.18 % / K Noise equivalent power VR = 10 V; = 950 nm NEP typ. 0.036 pW / Hz1/2 Detection limit VR = 10 V; = 950 nm D* typ. 7.3e12 cm x Hz1/2 / W Capacitance VR = 0 V; f = 1 MHz; E = 0 3 Version 1.6 | 2019-07-10 Values 2 nA 30 nA BPW 34 FS Relative Spectral Sensitivity 1), 2) Srel = f () OHF00368 100 S rel % 80 60 40 20 0 700 Directional Characteristics 800 900 1000 nm 1200 1), 2) Srel = f () 40 30 20 10 50 0 1.0 0.8 60 0.6 70 0.4 80 0.2 0 90 1.0 0.8 100 OHF01402 4 Version 1.6 | 2019-07-10 0.6 0.4 0 20 40 60 80 100 120 BPW 34 FS Photocurrent/Open-Circuit Voltage IP (VR = 5 V) / VO = f (Ee) P 1), 2) Dark Current 1), 2) IR = f (VR); E = 0 OHF01097 10 3 A 10 2 10 4 mV OHF00080 4000 VO R pA 10 3 3000 10 2 2000 10 1 1000 10 0 0 VO 10 1 P 10 0 10 -1 0 10 10 1 10 2 W/cm 2 10 4 Ee Capacitance 1), 2) C = f (VR); f = 1MHz; E = 0; TA = 25C OHF00081 100 C pF 80 70 60 50 40 30 20 10 10 -1 10 0 10 1 0 -2 10 5 Version 1.6 | 2019-07-10 V 10 2 VR 0 5 10 15 V VR 20 BPW 34 FS Dark Current 1) IR = f (TA); E = 0; VR = 10 V OHF05717 104 IR nA 103 102 101 100 10-1 0 20 40 60 80 C 100 TA Power Consumption Ptot = f (TA) OHF00394 160 mW Ptot 140 120 100 80 60 40 20 0 20 40 60 0 6 Version 1.6 | 2019-07-10 80 C 100 TA BPW 34 FS Chip position 0.9 (0.035) 0.7 (0.028) 4.5 (0.177) 4.3 (0.169) 6.2 (0.244) 0.2 (0.008) 0.1 (0.004) 6.7 (0.264) 0...5 1.1 (0.043) 0.9 (0.035) 1.8 (0.071) 0.2 (0.008) 1.7 (0.067) 1.5 (0.059) 4.0 (0.157) 3.7 (0.146) 0.3 (0.012) 3) 1.2 (0.047) 1.1 (0.043) 0...0.1 (0...0.004) Dimensional Drawing Photosensitive area Cathode lead 2.65 (0.104) x 2.65 (0.104) GEOY6863 Further Information Approximate Weight: 43.0 mg Package marking: Cathode 7 Version 1.6 | 2019-07-10 BPW 34 FS Recommended Solder Pad 8 Version 1.6 | 2019-07-10 3) BPW 34 FS Reflow Soldering Profile Product complies to MSL Level 4 acc. to JEDEC J-STD-020E OHA04525 300 C T 250 Tp 245 C 240 C tP 217 C 200 tL 150 tS 100 50 25 C 0 0 50 100 150 200 250 s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 C to 150 C tS Time tS TSmin to TSmax Ramp-up rate to peak*) TSmax to TP Liquidus temperature 60 2 3 100 120 2 3 Unit K/s s K/s TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 C Time within 5 C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 C 10 Time 25 C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 9 Version 1.6 | 2019-07-10 C 480 s K/s s BPW 34 FS 1.5 (0.059) 2 (0.079) 0.8 (0.031) 4.1 (0.161) 6.9 (0.272) 4 (0.157) 5.5 (0.217) Cathode/Collector Side 12 (0.472) 3) 1.75 (0.069) Taping OHAY2287 10 Version 1.6 | 2019-07-10 BPW 34 FS Tape and Reel 4) W1 D0 P0 A N F W E 13.0 0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel Dimensions A 180 mm W Nmin 12 + 0.3 / - 0.1 mm 11 Version 1.6 | 2019-07-10 W1 60 mm W2 max 12.4 + 2 mm 18.4 mm Pieces per PU 1500 BPW 34 FS Barcode-Product-Label (BPL) Dry Packing Process and Materials 3) Moisture-sensitive label or print L E E V l e be sela ). k, H de L If an bl r co ba (R id m ity . H R hu 0% e e /6 tiv C la ared ag ck re fr 30 _ < in pa % k of to 90 rs ea s d ). rs ou or te (p on rs H de , ou iti H an bjec ng ou rs co C 72 si nd H ou 5 te 48 C su es e H co 24 6 da e y 40 be oc tim C e or < ith tim ill pr). or ct w O w nt 23 tim e at lo or fa M TO F s al tim at le C at lo at or e. P th F l tic th va lo or ur O F lo s ui on be if: read en w ed l 4 5 F m la ce eq id lo g, n oc l ve vi 5a is in or be 24 de pr ve l 6 Le de , nt whe e te co g: , w e Le ve l ke r ou se da ba ed flo ur e Le ve m % ba e ba al st ur e Le r en re ed e re> 10 oi st e e fo tim ur se al op fo M se oi st ur as k, is or . 33 se is M oi st bed k, lo H an , g ph -0 M oi in an in F R ng ar rbl D M e ba T r po If bl ith % lif ki r C. (if S is p. w ea r ks lf J10 ba to et th va Y ea m rs m _ r w, < he ed 1 ee te Y d, EC iredicat S fte at nt > 1 W Hou D A flody qu In no ire 1. d e ou 4 8 re reity is qu/JE re 2. bo e M tim to es id 2b re C 16 : e a) S tim is IP ic ed loor tim e b) ev Humor or e en F tim lo or D 2a king nc te F op a) lo or 3. b) ba re F lo da e fe l 1 2 F If al re tim ve l 4. se d l 2a ve Le 3 an ve l ag e Le e B ve ur e Le at st ur e Le D oi st ur e M oi st ur M oi st M oi M N E RS s in IV O IT T S C nta N U TIO U coSEND Ais bUagRMEICO T E CThIS S d Barcode label < M RA OS Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 Desiccant AM OSR OHA00539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. 12 Version 1.6 | 2019-07-10 BPW 34 FS Schematic Transportation Box 3) Barcode label N O : (Q )Q TY :2 00 0 (9 D ) D /C :0 (X ) Packing Sealing label Length 195 5 mm 195 5 mm 13 Version 1.6 | 2019-07-10 M Y DE -1 +Q -1 R 18 P OHA02044 Dimensions of Transportation Box Width RO UP : M RA OS PR O D 5 14 2 110 0 G 4 01 4 C: D/ (9 D) 20 00 (Q )Q TY : O TC P) (6 T LO (1 T) O D PR D EM Y 18 R -1 : Q + P -1 G R O U P: u L lt S iT Y O T6 P 7 L 6 M 14 4 (G ) E Bi D Bi n1 Bi n2 : Pn3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R ditio 0 C R 07 PA 7 na RT l TE C KV XT AR Muster A o M n O d u p cto to rs R 34 ic N O : O S H 12 G BA TC H (1 T) LO T N O :1 (6 P) 23 em 8 2199 2100 5 14 2 110 0 (X ) O M O PT O M 998 NO : CThISTU SE S 21 2100 BA _ < s ur s ). Ho ururs s de Ho co 72 Ho ur te 48 e Ho 24 6 da 40 be tim e e C or th r pr < ll tim ct ). 23 oo r wi nt tim e at l wi fa r Fl oo tim s at at le C at e. ica l Fl th oo r th va ur nt Fl oo s ui be on if: read w ed l 4 5 Fl la m ide ce eq lo g, oc ve l vi is in en de be 24 de or l 5a6 pr Le ve nt wh e te co , w, g: ve l Le ke r re ou se da ba ed flo ba Le ve tu re m % ba e al e Le r en re e ed re 10 ois stu ur e tim se fo al op se fo > , M oi r se st ur 3 is is ha se M oi st nk be k, oo . 03 rd g M oi in an in Fl RH g, r-p bla DM ba Ca po If bl th % kinr life is (if . ar ST f p. wi 10 ba to et Jel r th va Ye ar ks s m _ < cat m d, C ed 1 Ye ee ur ire Sh te w, te di at nt > 1 W Ho Af flody qu In no ire DE 1. e ou 4 8 re ed re qu JE 2. bo ity is M or tim e e 16 re C/ : es id 2b r a) St tim mor is IP ed oo r tim e vic b) g e r Hu Fl oo en tim De 2a kin nc te Fl oo r a) op 3. b) ba re Fl oo da e fe l 1 Fl If al re tim ve l 2 4. se d l 2a3 Le ve g an ve l e Le Ba te ur e Le ve Le Da oist stur e ur e M oi st ur M oi st M oi H 12 34 . RH 0% /6 C : L e el selab . , H) nk de co (R bla r S S em R ic AM o n O d u p ct to o H rs NO If 23 G E V E ba ity id m hu e e d tiv re ag NO :1 L la re fra ck 30 Nns IVE RS in pa % k of ai IT TO to 90 ea d ntNS < ns UC or TIO te (p d , g itio ND U g coSE an bjec C sin nd O 5 C su es Ais baRE co IC y M oc (G ) M u L lt S iT Y O T6 P 7 L 6 E D Muster Bi Bi n1 Bi n2 : P- n3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R0 ditio 0 C R PA 77 na RT l TE CK VA XT R: Barcode label Height 30 5 mm BPW 34 FS Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. OSRAM Opto Semiconductors declares that this product contains DEHP (Diethylhexylphthalat) CAS 11781-7 above the current RoHS and REACh SVHC limit of 0.1%. A full Product Material Data Sheet (MDS) is available on request. For further application related information please visit www.osram-os.com/appnotes 14 Version 1.6 | 2019-07-10 BPW 34 FS Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS website. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office.By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred Product and functional safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. OSRAM OS products are not qualified at module and system level for such application. In case Buyer - or Customer supplied by Buyer - considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales Partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer. 15 Version 1.6 | 2019-07-10 BPW 34 FS Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2) Testing temperature: TA = 25C (unless otherwise specified) 3) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with 0.1 and dimensions are specified in mm. 4) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm. 16 Version 1.6 | 2019-07-10 BPW 34 FS Revision History Version Date Change 1.5 2019-06-24 Disclaimer 1.6 2019-07-10 Barcode-Product-Label (BPL) Notes 17 Version 1.6 | 2019-07-10 BPW 34 FS 18 Version 1.6 | 2019-07-10 BPW 34 FS 19 Version 1.6 | 2019-07-10