BPW 34 FS
1Version 1.6 | 2019-07-10
Produktdatenblatt | Version 1.1
www.osram-os.com
Applications
BPW 34 FS
DIL SMT
Silicon PIN Photodiode with Daylight Blocking Filter
—Electronic Equipment
—Industrial Automation (Machine Controls, Light
Barriers, Vision Controls)
—Measurement Levelling
Features:
—Package: black epoxy
—Quali󰘰cations: The product quali󰘰cation test plan is based on the guidelines of AEC-Q101-REV-C,
Stress Test Quali󰘰cation for Automotive Grade Discrete Semiconductors.
—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
—Especially suitable for applications from 780 nm to 1100 nm
—Short switching time (typ. 20 ns)
—DIL plastic package with high packing density
—Suitable for re󰘱ow soldering
Ordering Information
Type Photocurrent Photocurrent Ordering Code
typ.
Ee = 1 mW/cm²;
λ
= 950 nm; VR = 5 V Ee = 1 mW/cm²;
λ
= 950 nm; VR = 5 V
IPIP
BPW 34 FS-Z ≥ 40 µA 50 µA Q65110A2700
BPW 34 FS
2Version 1.6 | 2019-07-10
Maximum Ratings
TA = 25 °C
Parameter Symbol Values
Operating Temperature Top min.
max.
-40 °C
100 °C
Storage temperature Tstg min.
max.
-40 °C
100 °C
Reverse voltage VRmax. 12 V
Reverse voltage
t ≤ 2 µs; TA = 25 °C
VRmax. 16 V
Reverse voltage
t ≤ 2 min
VRmax. 32 V
Total power dissipation Ptot max. 150 mW
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD max. 2 kV
BPW 34 FS
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Characteristics
TA = 25 °C
Parameter Symbol Values
Wavelength of max sensitivity λS max typ. 950 nm
Spectral range of sensitivity λ10% typ. 780 ... 1100
nm
Radiant sensitive area A typ. 7.02 mm²
Dimensions of active chip area L x W typ. 2.65 x 2.65
mm x mm
Half angle φ typ. 60 °
Dark current
VR = 10 V
IRtyp.
max.
2 nA
30 nA
Spectral sensitivity of the chip
λ = 950 nm
Sλtyp. 0.7 A / W
Quantum yield of the chip
λ = 950 nm
ηtyp. 0.91 Electrons
/ Photon
Open-circuit voltage
Ee = 0.5 mW/cm²; λ = 950 nm
VOmin.
typ.
275 mV
330 mV
Short-circuit current
Ee = 0.5 mW/cm²; λ = 950 nm
ISC typ. 25 µA
Rise time
VR = 5 V; RL = 50 Ω; λ = 850 nm
trtyp. 0.02 µs
Fall time
VR = 5 V; RL = 50 Ω; λ = 850 nm
tftyp. 0.02 µs
Forward voltage
IF = 100 mA; E = 0
VFtyp. 1.3 V
Capacitance
VR = 0 V; f = 1 MHz; E = 0
C0typ. 72 pF
Temperature coe󰘲cient of voltage TCVtyp. -2.6 mV / K
Temperature coe󰘲cient of short-circuit current
λ = 950 nm
TCItyp. 0.18 % / K
Noise equivalent power
VR = 10 V; λ = 950 nm
NEP typ. 0.036 pW /
Hz1/2
Detection limit
VR = 10 V; λ = 950 nm
D* typ. 7.3e12 cm x
Hz1/2 / W
BPW 34 FS
4Version 1.6 | 2019-07-10
Relative Spectral Sensitivity 1), 2)
Srel = f (λ)
λ
OHF00368
0
rel
S
700
20
40
60
80
%
100
nm
800 900 1000 1200
Directional Characteristics 1), 2)
Srel = f (φ)
OHF01402
90
80
70
60
50
40 30 20 10
20 40 60 80 100 1200.40.60.81.0
ϕ
0.2
0.4
0.6
0.8
1.0
100 0
0
0
BPW 34 FS
5Version 1.6 | 2019-07-10
Photocurrent/Open-Circuit Voltage 1), 2)
IP (VR = 5 V) / VO = f (Ee)
E
OHF01097
e
0
10
P
Ι
10
1
10
2
10
4
10
-1
10
0
10
1
10
2
4
10
3
10
2
10
1
10
10
0
V
O
µ
AmV
Ι
P
V
O
3
10
µ
W/cm
2
Dark Current 1), 2)
IR = f (VR); E = 0
0
OHF00080
Ι
R
R
V
0 5 10 15 V 20
1000
2000
3000
4000
pA
Capacitance 1), 2)
C = f (VR); f = 1MHz; E = 0; TA = 25°C
V
OHF00081
R
-2
10
C
0
-1
10
0
10
1
10
2
10V
10
20
30
40
50
60
70
80
pF
100
BPW 34 FS
6Version 1.6 | 2019-07-10
Dark Current 1)
IR = f (TA); E = 0; VR = 10 V
OHF05717
A
T
10-1
˚C020406080 100
R
I
nA
100
101
102
103
104
Power Consumption
Ptot = f (TA)
T
OHF00394
A
0
tot
P
020 40 60 80 ˚C 100
mW
20
40
60
80
100
120
140
160
BPW 34 FS
7Version 1.6 | 2019-07-10
Dimensional Drawing 3)
4.5 (0.177)
4.3 (0.169)
4.0 (0.157)
3.7 (0.146)
1.5 (0.059)
1.7 (0.067)
0.9 (0.035)
0.7 (0.028)
Photosensitive area Cathode lead
GEOY6863
0.3 (0.012)
6.7 (0.264)
6.2 (0.244)
1.2 (0.047)
1.1 (0.043)
(0...0.004)
0...5˚
0.2 (0.008)
0.1 (0.004)
1.1 (0.043)
0.9 (0.035)
2.65 (0.104) x 2.65 (0.104)
1.8 (0.071)±0.2 (0.008)
Chip position
0...0.1
Further Information
Approximate Weight: 43.0 mg
Package marking: Cathode
BPW 34 FS
8Version 1.6 | 2019-07-10
Recommended Solder Pad 3)
BPW 34 FS
9Version 1.6 | 2019-07-10
Reflow Soldering Profile
Product complies to MSL Level 4 acc. to JEDEC J-STD-020E
0
0s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Pro󰘰le Feature Symbol Pb-Free (SnAgCu) Assembly Unit
Minimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
2 3 K/s
Time tS
TSmin to TSmax
tS60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL217 °C
Time above liquidus temperature tL80 100 s
Peak temperature TP245 260 °C
Time within 5 °C of the speci󰘰ed peak
temperature TP - 5 K
tP10 20 30 s
Ramp-down rate*
TP to 100 °C
3 6 K/s
Time
25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; ful󰘰llment for the whole T-range
BPW 34 FS
10 Version 1.6 | 2019-07-10
Taping 3)
OHAY2287
1.5 (0.059)
4 (0.157)
0.8 (0.031)
2 (0.079)
4.1 (0.161)
1.75 (0.069)
5.5 (0.217)
12 (0.472)
6.9 (0.272)
Cathode/Collector Side
BPW 34 FS
11 Version 1.6 | 2019-07-10
Tape and Reel 4)
D
0
2
P
P
0
1
P
W
FE
Direction of unreeling
N
W
1
2
W
A
OHAY0324
Label
Leader:
Trailer:
13.0
Direction of unreeling
±0.25
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Reel Dimensions
A W Nmin W1W2 max Pieces per PU
180 mm 12 + 0.3 / - 0.1 mm 60 mm 12.4 + 2 mm 18.4 mm 1500
BPW 34 FS
12 Version 1.6 | 2019-07-10
Barcode-Product-Label (BPL)
Dry Packing Process and Materials 3)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%
bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
BPW 34 FS
13 Version 1.6 | 2019-07-10
Schematic Transportation Box 3)
OHA02044
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
02
4 5
(Q)QTY:
2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY:
2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
OSRAM
Packing
Sealing label
Barcode label
Moisture Level 3 Floor time 168 Hours Moisture Level 6Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Barcode label
Dimensions of Transportation Box
Width Length Height
195 ± 5 mm 195 ± 5 mm 30 ± 5 mm
BPW 34 FS
14 Version 1.6 | 2019-07-10
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device speci󰘰ed in this
data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding e󰘯ect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal 󰘰lled materials including silver.
Metal 󰘰lled materials can be a󰘯ected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
OSRAM Opto Semiconductors declares that this product contains DEHP (Diethylhexylphthalat) CAS 117-
81-7 above the current RoHS and REACh SVHC limit of 0.1%. A full Product Material Data Sheet (MDS) is
available on request.
For further application related information please visit www.osram-os.com/appnotes
BPW 34 FS
15 Version 1.6 | 2019-07-10
Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please 󰘰nd the latest version on the OSRAM OS website.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales o󰘲ce.By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred
Product and functional safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not quali󰘰ed at module and system level for such application.
In case Buyer – or Customer supplied by Buyer – considers using OSRAM OS components in product safe-
ty devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
Partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-
nate the customer-speci󰘰c request between OSRAM OS and Buyer and/or Customer.
BPW 34 FS
16 Version 1.6 | 2019-07-10
Glossary
1) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only re󰘱ect statistical 󰘰gures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
2) Testing temperature: TA = 25°C (unless otherwise speci󰘰ed)
3) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are speci󰘰ed with ±0.1 and
dimensions are speci󰘰ed in mm.
4) Tape and Reel: All dimensions and tolerances are speci󰘰ed acc. IEC 60286-3 and speci󰘰ed in mm.
BPW 34 FS
17 Version 1.6 | 2019-07-10
Revision History
Version Date Change
1.5 2019-06-24 Disclaimer
1.6 2019-07-10 Barcode-Product-Label (BPL)
Notes
BPW 34 FS
18 Version 1.6 | 2019-07-10
BPW 34 FS
19 Version 1.6 | 2019-07-10