DATASHEET
3.3 VOLT ZERO DELAY LOW SKEW BUFFER ICS2309
IDT™ / ICS™
3.3 VOLT ZERO DELAY LOW SKEW BUFFER 1
ICS2309 REV F 041906
Description
The ICS2309 is a low phase noise, high-speed PLL
based, low-skew zero delay buffer. Based on ICS’
proprietary low jitter Phase Locked Loop (PLL)
techniques, the device provides nine low skew outputs
at speeds up to 133 MHz at 3.3 V. The outputs can be
generated from the PLL (f or zero dela y), or directly from
the input (for te sting), and can be set to tri-state mode
or to stop at a low level. The PLL feedback is on-chip
and is obtained from the CLKOUT pad.
The ICS2309 is av ailable in two different versions. The
ICS2309-1 is the base part. The ICS2309-1H is a high
drive version with faster rise and fall times.
Features
•Clock outputs from 10 to 133 MHz
•Zero input-output delay
•Nine low skew (<250 ps) outputs
•Device-to-device skew <700 ps
•Full CMOS outputs with 12 mA output drive
capability at TTL levels
•5 V tolerant CLKIN
•Tri-state mode for board-level testing
•Advanced, low power, sub-micron CMOS process
•Operating voltage of 3.3 V
•Industrial temperature range available
•Packaged in 16-pin SOIC and TSSOP (-1H version
only)
•RoHS 5 (green) or RoHS 6 (green and lead free)
complaint packaging
Block Diagram
CLKA4
CLKB1
CLKA3
CLKB2
CLKB3
CLKA2
CLKA1
CLKB4
CLKIN
Control
Logic
1
0
S2, S1 2
PLL
VDD
2
GND 2
CLKOUT
ICS2309
3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS
IDT™ / ICS™
3.3 VOLT ZERO DELAY LOW SKEW BUFFER 2
ICS2309 REV F 041906
Pin Assignment
Output Clock Mode Select Table
Note 1. Outputs are in high impedance state
Note 2. Buffer mode only; not zero delay between input and output
Pin Descriptions
12
1
11
2
10
CLKIN CLKOUT
3
9
CLKA1
4
CLKA2
CLKA4
5
VDD
6
CLKA3
7
GND
8
CLKB1
VDD
GND
CLKB4
CLKB2 CLKB3
S2 S1
16
15
14
13
16 pin narrow (150 mil) SOIC
S2 S1 CLKA1:A4 CLKB1:B4 A & B Source CLKOUT PLL Status
0 0 Tri-state (note 1) Tri-state (note 1) PLL Driven OFF
0 1 Running Tri-state (note 1) PLL Driven ON
1 0 Running Running CLKIN (note 2) PLL Bypass Mode OFF
1 1 Running Running PLL Driven ON
Pin
Number Pin
Name Pin Ty pe Pin Description
1 CLKIN Input Clock input (5 V tolerant).
2 - 3 CLKA1 :A4 Output Clock outputs A1:A4. See table above.
4 VDD Power Power supply. Connect to 3.3 V.
5 GND Power Connect to ground.
6 - 7 CLKB1 :B4 Output Clock outputs B1:B4. See table above.
8 S2 Input Select inpu t 2. See table above. Internal pull-up.
9 S1 Input Select inpu t 1. See table above. Internal pull-up.
10 - 11 CLKB1:B4 Output Clock outputs B1:B4. See table above.
12 GND Power Connect to ground.
13 VDD Power Power supply. Connect to 3.3 V.
14 - 15 CLKA1:A4 Output Clock outputs A1:A4. See table above.
16 CLKOUT Input Buffered output. Internal feedback on this pin.
ICS2309
3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS
IDT™ / ICS™
3.3 VOLT ZERO DELAY LOW SKEW BUFFER 3
ICS2309 REV F 041906
External Components
The ICS2309 requir es a mi nimum number of external components for proper operation. Decoupling
capacitors of 0.01 mF should be connected between VDD and GND on pins 4 and 5, and VDD and GND
on pins 13 and 12, as close t o the device as possible. A series termination resistor of 33 Ω may be used to
each clock output pin to reduce reflections.
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS2309. These ratings,
which are standard v alues f or ICS commercially rated pa rts, ar e stress ratings only. Functional opera tion of
the device at these or any other conditions above those indicated in the operational sectio ns of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can
affect product reliability. Electrical parameters are guaranteed only over the recommended operating
temperature range.
Recommended Operation Conditions
Item Rating
Supply Voltage, VDD 7 V
All Inputs and Outputs -0.5 V to VDD+0.5 V
CLKIN and FBIN inputs -0.5 V to 5.5 V
Electrostatic Discharge (HBM) 2000 V
Ambient Operating Temperature (Commercial) 0 to +70°C
Ambient Operating Temperature (Industrial) -40 to +85°C
Storage Temperature -65 to +150°C
Junction Temperature 150°C
Soldering Temperature 260°C
Parameter Min. Typ. Max. Units
Ambient Operating Temperature (Industrial) -40 +85 °C
Ambient Operating Temperature (Commercial) 0 +70 °C
Power Supply Voltage (measured in respect to GND) +3.0 +3.6 V
ICS2309
3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS
IDT™ / ICS™
3.3 VOLT ZERO DELAY LOW SKEW BUFFER 4
ICS2309 REV F 041906
DC Electrical Characteristics
ICS2309M-1, VDD = 3.3 V ±0.3 V, Ambient Temperature -40 to +85°C (Industrial), (0-70°C Commercial)
Note 1: When there is no clock signal present at CLKIN, the ICS2309 will enter power down mode. The
PLL is stopped and the outputs are tri-state.
ICS2309M-1, VDD = 3.3 V ±0.3 V, Ambient Temperature -40 to +85°C (Industrial), (0-70°C Commercial)
Note 1: When there is no clock signal present at CLKIN, the ICS2309 will enter power down mode. The
PLL is stopped and the outputs are tri-state.
Parameter Symbol Conditions Min. Typ. Max. Units
Operating Voltage VDD 3.0 3.6 V
Input High Voltage VIH 2V
Input Low Voltage VIL 0.8 V
Input Low Current IIL VIN = 0V 50 µA
Input High Current IIH VIN = VDD 100 µA
Output High Voltage VOH IOH = -8 mA 2.4 V
Output Low Voltage VOL IOL = 8 mA 0.4 V
Operating Supply Current IDD No Load 32 mA
Power Down Supply
Current CLKIN = 0, Note 1 12 µA
Short Circuit Current IOS Each output ±50 mA
Input Capacitance CIN S2, S1, CLKIN 5 pF
Parameter Symbol Conditions Min. Typ. Max. Units
Operating Voltage VDD 3.0 3.6 V
Input High Voltage VIH 2V
Input Low Voltage VIL 0.8 V
Input Low Current IIL VIN = 0V 50 µA
Input High Current IIH VIN = VDD 100 µA
Output High Voltage VOH IOH = -12 mA 2.4 V
Output Low Voltage VOL IOL = 12 mA 0.4 V
Operating Supply Current IDD No Load 32 mA
Power Down Supply
Current CLKIN = 0, Note 1 12 µA
Short Circuit Current IOS Each output ±50 mA
Input Capacitance CIN S2, S1, CLKIN 5 pF
ICS2309
3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS
IDT™ / ICS™
3.3 VOLT ZERO DELAY LOW SKEW BUFFER 5
ICS2309 REV F 041906
AC Electrical Characteristics
ICS2309M-1, VDD=3.3 V ±0.3 V, Ambient temperature -40 to +85°C (Industrial), (0-7 0°C Commercial)
Note 2: With VDD at a steady rate and valid input at CLKIN .
ICS2309M-1H, VDD=3.3 V ±0.3 V, Ambient temperature -40 to +85 °C (Industrial), (0-70°C Commercial)
Note 3: With VDD at a steady rate and valid input at CLKIN .
Parameter Symbol Conditions Min. Typ. Max. Units
Output Clock Frequency fIN 10 pF load, see table on page 2 10 133 MHz
Output Clock Frequency 30 pF load, see t able on page 2 10 100 MHz
Output Rise Time tOR 0.8 to 2.0 V, outputs loaded 2.5 ns
Output Fall Time tOF 2.0 to 0.8 V, outputs loaded 2.5 ns
Output Clock Duty Cycle tDC Measured at 1.4 V, Fout=66.67
MHz 40 50 60 %
Output Clock Duty Cycle tDC Measured at 1.4 V, Fout=50
MHz 45 50 55 %
Device to Device Skew Rising edges at VDD/2 700 ps
Output to Output Skew Rising edges at VDD/2 250 ps
Input to Output Skew Rising edges at VDD/2 ±350 ps
Input to Output Skew
(PLL bypass mode) Rising edges at VDD/2, S2= 1,
S1 = 0 158.7ns
Cycle to Cycle Jitter Measured at 66.67M, outputs
loaded 200 ps
PLL Lock Time Note 2 1.0 ms
Parameter Symbol Conditions Min. Typ. Max. Units
Output Clock Frequency fIN 10 pF load, see table on page 2 10 133 MHz
Output Clock Frequency 30 pF load, see t able on page 2 10 100 MHz
Output Rise Time tOR 0.8 to 2.0 V, outputs loaded 1.5 ns
Output Fall Time tOF 2.0 to 0.8 V, outputs loaded 1.5 ns
Output Clock Duty Cycle tDC Measured at 1.4 V, Fout=66.67
MHz 40 50 60 %
Output Clock Duty Cycle tDC Measured at 1.4 V, Fout=50
MHz 45 50 55 %
Device to Device Skew Rising edges at VDD/2 700 ps
Output to Output Skew Rising edges at VDD/2 250 ps
Input to Output Skew Rising edges at VDD/2 ±350 ps
Input to Output Skew
(PLL bypass mode) Rising edges at VDD/2, S2= 1,
S1 = 0 158.7ns
Cycle to Cycle Jitter Measured at 66.67M, outputs
loaded 200 ps
PLL Lock Time Note 3 1.0 ms
ICS2309
3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS
IDT™ / ICS™
3.3 VOLT ZERO DELAY LOW SKEW BUFFER 6
ICS2309 REV F 041906
Package Outline and Package Dimensions (16-pin TSSOP, 4.40 mm Body, 0.65 mm Pitch )
Package dimensions are kept current with JEDEC Publication No. 95
INDEX
AREA
1 2
16
D
E1 E
SEATING
PLANE
A
1
A
A
2
e
- C -
b
.10 (.004) C
c
L
*For reference only. Controlling dimensions in mm.
Millimeters Inches*
Symbol Min Max Min Max
A -- 1.20 -- 0.047
A1 0.05 0.15 0.002 0.006
A2 0.80 1.05 0.032 0.041
b 0.19 0.30 0.007 0.012
C 0.09 0.20 0.0035 0.008
D 4.90 5.1 0.193 0.201
E 6.40 BASIC 0.252 BASIC
E1 4.30 4.50 0.169 0.177
e 0.65 Basic 0.0256 Basic
L 0.45 0.75 0.018 0.030
α0°8°0°8°
ICS2309
3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS
IDT™ / ICS™
3.3 VOLT ZERO DELAY LOW SKEW BUFFER 7
ICS2309 REV F 041906
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
INDEX
AREA
1 2
16
D
E
SEATING
PLANE
A1
A
e
- C -
B
.10 (.004) C
C
L
H
h x 45
Millimeters Inches
Symbol Min Max Min Max
A 1.35 1.75 .0532 .0688
A1 0.10 0.25 .0040 .0098
B 0.330.51.013.020
C 0.19 0.25 .0075 .0098
D 9.80 10.00 .3859 .3937
E 3.80 4.00 .1497 .1574
e 1.27 BASIC 0.050 BASIC
H 5.80 6.20 .2284 .2440
h 0.250.50.010.020
L 0.401.27.016.050
α0°8°0°8°
ICS2309
3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS
IDT™ / ICS™
3.3 VOLT ZERO DELAY LOW SKEW BUFFER 8
ICS2309 REV F 041906
Ordering Information
Parts that are ordered with a “LF” suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been check ed for both accuracy and reliability, Integrated Circuit Systems (ICS)
assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result
from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial
applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary
environmental requirements are not recommended withou t additional processing by ICS. ICS reserves the right to change any
circuitr y or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or
critical medical instruments.
Part / Order Number Marking Shipping Packaging Package Temperature
2309MI-1 ICS2309MI-1 Tubes 16-pin SOIC -40 to +85° C
2309MI-1T ICS2309MI-1 Tape and Reel 16-pin SOIC -40 to +85° C
2309MI-1LF 2309MI-1LF Tube s 16-pin SOIC -40 to +85 ° C
2309MI-1LFT 2309MI-1LF Tape and Reel 16-pin SOIC -40 to +85° C
2309M-1 ICS2309M-1 Tube s 16-pin SOIC 0 to +70° C
2309M-1T ICS2309M-1 Tape and Reel 16-pin SOIC 0 to +70° C
2309M-1LF ICS2309M1LF Tubes 16-pin SOIC 0 to +70° C
2309M-1LFT ICS2309M1LF Tape and Reel 16-pin SOIC 0 to +70° C
2309MI-1H ICS2309MI-1H Tubes 16-pin SOIC -40 to +85° C
2309MI-1HT ICS2309MI-1H Tape and Reel 16-pin SOIC -40 to +85° C
2309MI-1HLF 2309MI-1HLF Tubes 16-pin SOIC -4 0 to +85° C
2309MI-1HLFT 2309MI-1HLF Tape and Reel 16-pin SOIC -40 to +85° C
2309M-1H ICS2309M-1H Tubes 16-pi n SOI C 0 to +70° C
2309M-1HT ICS2309M-1H Tape and Reel 16-pin SOIC 0 to +70° C
2309M-1HLF 2309M-1HLF Tube s 16 -p in SOI C 0 to +70° C
2309M-1HLFT 2309M-1HLF Tape and Reel 16-pin SOIC 0 to +70° C
2309GI-1H 2309GI1H Tubes 16-pin TSSOP -40 to +85° C
2309GI-1HT 2309GI1H Tape and Reel 16-pin TSSOP -40 to +85° C
2309GI-1HLF 309GI1HL Tubes 16-pin TSSOP -40 to +85° C
2309GI-1HLFT 309GI1HL Tape and Reel 16-pin TSSOP -40 to +85° C
2309G-1H 2309G-1H Tubes 16-pin TSSOP 0 to +70° C
2309G-1HT 2309G-1H Tape and Reel 16-pin TSSOP 0 to +70° C
2309G-1HLF 2309G1HL Tubes 16-pin TSSOP 0 to +70° C
2309G-1HLFT 2309G1HL Tape and Reel 16-pin TSSOP 0 to +70° C
ICS2309
3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS
IDT™ / ICS™
3.3 VOLT ZERO DELAY LOW SKEW BUFFER 9
ICS2309 REV F 041906
Revision History
Rev. Originator Date Description of Change
A P. Griffith 12/01/04 New device/datasheet; Preliminary.
B P. Griffith 12/27/04 Add TSSOP package. Made corrections to IDD, IDDP, input capacitance and duty cycle
specs/test conditions. Removed jitter specs for CL=15 pF. Added I/O skew spec for
bypass mode and duty cycle spec for Fout=50 MHz.
C P. Griffith 1/25/05 Made corrections to test conditions for output rise time, fall time, duty cycle and
cycle-to-cycle jitter. Moved from Preliminary to Final.
D P. Griffith 5/24/05 Added LF ordering info to 16-pin TSSOP (-1H version only); added Thermal Chars for
16-pin TSSOP package
E A.Ilkbahar 09/01/05 Added LF to all versions.
F R. Willner 04/19/06 Corrected Output Clock Mode Select Table to include CLKOUT functionality.
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trademarks used to identify products or services of their respective owners.
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ICS2309
3.3 VOLT ZERO DELAY LOW SKEW BUFFER ZERO DELAY BUFFERS
