Product Type Features
DRAM Type Small Outline (SO)
Connector System Cable-to-Board
Profile Low
Row-to-Row Spacing 8.2 mm [ .322 in ]
Sealable No
Connector & Contact Terminates To Printed Circuit Board
Center Post Without
Product Type Socket
Configuration Features
Module Orientation Right Angle
Number of Positions 200, 260
Number of Rows 2
Keying Reverse
Number of Keys 1
Center Key Offset Right
Electrical Characteristics
DRAM Voltage (V) 1.2
Signal Characteristics
SGRAM Voltage (V) 1.2
Body Features
Ejector Type Locking
Retention Post Location Both Ends
Latch Material High Temperature Thermoplastic
Ejector Location Both Ends
Retention Post Material Copper Alloy
Contact Features
Solder Tail Contact Plating Material Gold Flash over Nickel
Contact Mating Area Plating Material Gold Flash
Contact Current Rating (Max) (A) .5
Contact Base Material Copper Alloy
Socket Type Memory Card
Socket Style SO DIMM