73S1217F
Bus-Powered 80515 System-on-Chip with USB,
ISO 7816 / EMV, PINpad and More
Simplifying System Integration™ DATA SHEET
December 2008
Rev. 1.2 © 2008 Teridian Semiconductor Corporation 1
GENERAL DESCRIPTION
The Teridian Semiconductor Corporation 73S1217F is a
versatile and economical CMOS System-on-Chip device
intended for smart card reader applications. The circuit
features an ISO-7816 / EMV interface, an USB 2.0
interface (full-speed 12Mbps - slave) and a 5x6 PINpad
interface. Additional features include 8 user I/Os,
multiple interrupt options and an analog voltage input (for
DC voltage monitoring such as battery level detection).
Other built-in interfaces include an asynchronous serial
and an I2C interface.
The System-on-Chip is built around an 80515 high-
performance core. Its feature and instruction set is
compatible with the industry standard 8051, while
offering one clock-cycle per instruction processing
power (most instructions). With a CPU clock running up
to 24MHz, it results in up to 20MIPS available that
meets the requirements of various encryption needs
such as AES, DES / 3-DES and even RSA (for PIN
encryption for instance). The circuit requires a single 6
to 12 MHz crystal. An optional 32kHz crystal can be
connected to a sub-system oscillator with a real-time-
clock counter to enable stand-alone applications to
access an RTC value.
The respective 73S1217F embedded memories are;
64KB Flash program memory, 2KB user XRAM
memory, and 256B IRAM memory. On top of these
memories are added independent FIFOs dedicated to
the ISO7816 UART and to the USB interface.
The chip incorporates an inductor-based DC-DC
converter that generates all the necessary voltages to
the various 73S1217F function blocks (smart card
interface, digital core, etc.) from any of two distinct
power supply sources: The +5V USB bus (VBUS, 4.4V to
6.5V), or a main battery (VBAT, 4.0V to 6.5V). The chip
automatically powers-up the DC-DC converter with VBUS
if it is present, or uses VBAT as the supply input.
Alternatively, the pin VPC can support a wider power
supply input range (2.7V to 6.5V), when using a single
system supply source.
In addition, the circuit features an ON/OFF mode which
operates directly with an ON/OFF system switch: Any
activity on the ON/OFF button is debounced internally
and controls the power generation circuit accordingly,
under the supervision of the firmware (OFF request /
OFF acknowledgement at firmware level). The OFF
mode can be alternatively initiated from the controller
(firmware action instead of ON/OFF switch).
In OFF mode, the circuit typically draws less than 1μA,
which makes it ideal for applications where battery life
must be maximized.
Wake-up of the controller upon USB cable insertion is
supported.
Embedded Flash memory is in-system programmable
and lockable by means of on-silicon fuses. This makes
the Teridian 73S1217F suitable for both development and
production phases.
Teridian Semiconductor Corporation offers with its
73S1217F a very comprehensive set of software libraries,
including the smart card and USB protocol layers that are
pre-approved against USB, Microsoft WHQL and EMV,
as well as a CCID reference design. Refer to the
Teridian Semiconductor Corporation 73S12xxF Software
User’s Guide for a complete description of the Application
Programming Interface (API Libraries) and related
Software modules.
A complete array of development and programming
tools, libraries and demonstration boards enable
rapid development and certification of readers that
meet most demanding smart card standards.
APPLICATIONS
• Hand-held PINpad smart card readers:
• With USB or serial connectivity
• Ideal for E-banking (MasterCard CAP, etc) and Digital
Identification (Secure Login, Gov’t ID...)
• Transparent USB card readers and USB keys
• General purpose smart card readers
ADVANTAGES
• Reduced BOM
• Larger built-in Flash / RAM than its competitors
• Higher performance CPU core (up to 24MIPS)
• On-chip DC-DC converter and CMOS switches for
battery and USB power
• Sub-μA Power Down mode with ON/OFF switch
• Powerful In-Circuit Emulation and Programming
• A complete set of EMV4.1, USB and CCID libraries
• Overall, the ideal compromise cost / features for high
volume, PINpad reader applications!
73S1217F Data Sheet DS_1217F_001
2 Rev. 1.2
FEATURES
80515 Core:
• 1 clock cycle per instruction (most instructions)
• CPU clocked up to 24MHz
• 64kB Flash memory (lockable)
• 2kB XRAM (User Data Memory)
• 256 byte IRAM
• Hardware watchdog timer
Oscillators:
• Single low-cost 6MHz to 12MHz crystal
• Optional 32kHz crystal (with internal RTC)
• An Internal PLL provides all the necessary clocks to
each block of the system
Interrupts:
• Standard 80C515 4-priority level structure
• 9 different sources of interrupt to the core
Power Down Modes:
• 2 standard 80C515 Power Down and IDLE modes
• Sub-μA OFF mode
ON/OFF Main System Power Switch:
• Input for an SPST momentary switch to ground
Timers:
• (2) Standard 80C52 timers T0 and T1
• (1) 16-bit timer that can generate RTC interrupts
from the 32kHz clock
Built-in ISO-7816 Card Interface:
• LDO regulator produces VCC for the card
• (1.8V, 3V or 5V)
• Full compliance with EMV 4.1
• Activation/Deactivation sequencers
• Auxiliary I/O lines (C4-C8 signals)
• 7kV ESD protection on all interface pins
Communication with Smart Cards:
• ISO 7816 UART for T=0, T=1
• (2) 2-Byte FIFOs for transmit and receive
• Configured to drive multiple external Teridian
73S8010xx interfaces (for multi-SAM architectures)
Communication Interfaces:
• Full-duplex serial interface (1200 to 115kbps UART)
• USB 2.0 Full Speed 12Mbps Interface, PC/SC
compliant with 4 Endpoints:
• Control (16B FIFO)
• Interrupt IN (32B FIFO)
• Bulk IN (128B FIFO)
• Bulk OUT (128B FIFO)
• I
2C Master Interface (400kbps)
Man-Machine Interface and I/Os:
• 6x5 Keyboard (hardware scanning, debouncing and
scrambling)
• (8) User I/Os
• Single programmable current output (LED)
Voltage Detection:
• Analog Input (detection range: 1.0V to 1.5V)
Operating Voltage:
• Single supply 2.7V to 6.5V operation (VPC)
• USB supply (VBUS 4.4V to 5.5V) with or without
battery back up operation (VBAT 4.0V to 6.5V).
• Automated detection of voltage presence - Priority on
VBUS over VBAT
DC-DC Converter:
• Step-up converter
• Generates an intermediary voltage VP
• Requires a single 10μH Inductor
• 3.3V supply available for external circuits
Operating Temperature:
• -40°C to 85°C
Package:
• 68-pin QFN
Software:
• Two-level Application Programming Interface
(ANSI C-language libraries)
• USB, T=0 / T=1 ISO and EMV compliant smart card
protocol layers
• CCID reference design and Windows® driver
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 3
Table of Contents
1Hardware Description ......................................................................................................................... 8
1.1Pin Description .............................................................................................................................. 8
1.2Hardware Overview .................................................................................................................... 11
1.380515 MPU Core ........................................................................................................................ 11
1.3.180515 Overview ............................................................................................................. 11
1.3.2Memory Organization .................................................................................................... 11
1.4Program Security ........................................................................................................................ 16
1.5Special Function Registers (SFRs) ............................................................................................ 18
1.5.1Internal Data Special Function Registers (SFRs) .......................................................... 18
1.5.2IRAM Special Function Registers (Generic 80515 SFRs) ............................................ 19
1.5.3External Data Special Function Registers (SFRs) ........................................................ 20
1.6Instruction Set ............................................................................................................................. 23
1.7Peripheral Descriptions ............................................................................................................... 23
1.7.1Oscillator and Clock Generation .................................................................................... 23
1.7.2Power Supply Management .......................................................................................... 26
1.7.3Power ON/OFF .............................................................................................................. 27
1.7.4Power Control Modes .................................................................................................... 28
1.7.5Interrupts ........................................................................................................................ 35
1.7.6UART ............................................................................................................................. 42
1.7.7Timers and Counters ..................................................................................................... 47
1.7.8WD Timer (Software Watchdog Timer) ......................................................................... 49
1.7.9User (USR) Ports ........................................................................................................... 52
1.7.10Real-Time Clock with Hardware Watchdog (RTC) ........................................................ 54
1.7.11Analog Voltage Comparator .......................................................................................... 57
1.7.12LED Driver ..................................................................................................................... 59
1.7.13I2C Master Interface ....................................................................................................... 60
1.7.14Keypad Interface ............................................................................................................ 67
1.7.15Emulator Port ................................................................................................................. 74
1.7.16USB Interface ................................................................................................................ 75
1.7.17Smart Card Interface Function ...................................................................................... 78
1.7.18VDD Fault Detect Function .......................................................................................... 113
2Application Schematics ................................................................................................................. 114
2.1Typical Application Schematic 1 ............................................................................................... 114
2.2Typical Application Schematic 2 ............................................................................................... 115
3Electrical Specification ................................................................................................................... 116
3.1Absolute Maximum Ratings ...................................................................................................... 116
3.2Recommended Operating Conditions ...................................................................................... 116
3.3Digital IO Characteristics .......................................................................................................... 117
3.4Oscillator Interface Requirements ............................................................................................ 118
3.5DC Characteristics: Analog Input ............................................................................................. 118
3.6USB Interface Requirements .................................................................................................... 119
3.7Smart Card Interface Requirements ......................................................................................... 121
3.8DC Characteristics .................................................................................................................... 123
3.9Current Fault Detection Circuits ............................................................................................... 125
4Equivalent Circuits ......................................................................................................................... 126
4.1Package Pin Designation (68-Pin QFN) ................................................................................... 135
4.2Packaging Information .............................................................................................................. 136
5Ordering Information ...................................................................................................................... 137
6Related Documentation .................................................................................................................. 137
7Contact Information ........................................................................................................................ 137
Revision History ...................................................................................................................................... 138
73S1217F Data Sheet DS_1217F_002
Figures
Figure 1: IC Functional Block Diagram ......................................................................................................... 7
Figure 2: Memory Map ................................................................................................................................ 15
Figure 3: Clock Generation and Control Circuits ........................................................................................ 23
Figure 4: Oscillator Circuit ........................................................................................................................... 25
Figure 5: Detailed Power Management Logic Block Diagram .................................................................... 26
Figure 6: Power-Down Control .................................................................................................................... 29
Figure 7: Detail of Power-Down Interrupt Logic .......................................................................................... 30
Figure 8: Power-Down Sequencing ............................................................................................................ 30
Figure 9: External Interrupt Configuration ................................................................................................... 35
Figure 10: Real Time Clock Block Diagram ................................................................................................ 54
Figure 11: I2C Write Mode Operation .......................................................................................................... 61
Figure 12: I2C Read Operation ................................................................................................................... 62
Figure 13: Simplified Keypad Block Diagram ............................................................................................. 67
Figure 14: Keypad Interface Flow Chart ..................................................................................................... 69
Figure 15: USB Block Diagram ................................................................................................................... 75
Figure 16: Smart Card Interface Block Diagram ......................................................................................... 78
Figure 17: Smart Card Interface Block Diagram ......................................................................................... 79
Figure 18: Asynchronous Activation Sequence Timing .............................................................................. 81
Figure 19: Deactivation Sequence .............................................................................................................. 82
Figure 20: Smart Card CLK and ETU Generation ...................................................................................... 83
Figure 21: Guard, Block, Wait and ATR Time Definitions .......................................................................... 84
Figure 22: Synchronous Activation ............................................................................................................. 86
Figure 23: Example of Sync Mode Operation: Generating/Reading ATR Signals ..................................... 86
Figure 24: Creation of Synchronous Clock Start/Stop Mode Start Bit in Sync Mode ................................. 87
Figure 25: Creation of Synchronous Clock Start/Stop Mode Stop Bit in Sync Mode ................................. 87
Figure 26: Operation of 9-bit Mode in Sync Mode ...................................................................................... 88
Figure 27: 73S1217F Typical Application Schematic (Handheld USB PINpad, with Combo USB-
Bus and Self-powered Configuration) ..................................................................................... 114
Figure 28: 73S1217F Typical Application Schematic (USB Transparent Reader and USB Key
Configuration) .......................................................................................................................... 115
Figure 29: 12 MHz Oscillator Circuit ......................................................................................................... 126
Figure 30: 32KHz Oscillator Circuit ........................................................................................................... 126
Figure 31: Digital I/O Circuit ...................................................................................................................... 127
Figure 32: Digital Output Circuit ................................................................................................................ 127
Figure 33: Digital I/O with Pull Up Circuit .................................................................................................. 128
Figure 34: Digital I/O with Pull Down Circuit ............................................................................................. 128
Figure 35: Digital Input Circuit ................................................................................................................... 129
Figure 36: OFF_REQ Interface Circuit ..................................................................................................... 129
Figure 37: Keypad Row Circuit ................................................................................................................. 130
Figure 38: Keypad Column Circuit ............................................................................................................ 130
Figure 39: LED Circuit ............................................................................................................................... 131
Figure 40: Test and Security Pin Circuit ................................................................................................... 131
Figure 41: Analog Input Circuit ................................................................................................................. 132
Figure 42: Smart Card Output Circuit ....................................................................................................... 132
Figure 43: Smart Card I/O Circuit ............................................................................................................. 133
Figure 44: PRES Input Circuit ................................................................................................................... 133
Figure 45: USB Circuit .............................................................................................................................. 134
Figure 46: ON_OFF Input Circuit .............................................................................................................. 134
Figure 47: 73S1217F Pinout ..................................................................................................................... 135
Figure 48: 73S1217F 68 QFN Mechanical Drawing ................................................................................. 136
4 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 5
Tables
Table 1: 73S1217 Pinout Description ........................................................................................................... 8
Table 2: MPU Data Memory Map ............................................................................................................... 11
Table 3: Flash Special Function Registers ................................................................................................. 13
Table 4: Internal Data Memory Map ........................................................................................................... 14
Table 5: Program Security Registers .......................................................................................................... 17
Table 6: IRAM Special Function Registers Locations ................................................................................ 18
Table 7: IRAM Special Function Registers Reset Values .......................................................................... 19
Table 8: XRAM Special Function Registers Reset Values ......................................................................... 20
Table 9: PSW Register Flags ...................................................................................................................... 22
Table 10: Port Registers ............................................................................................................................. 22
Table 11: Frequencies and Mcount Values for MCLK = 96MHz ................................................................ 24
Table 12: The MCLKCtl Register ................................................................................................................ 24
Table 13: The MPUCKCtl Register ............................................................................................................. 25
Table 14: The INT5Ctl Register .................................................................................................................. 31
Table 15: The MISCtl0 Register .................................................................................................................. 31
Table 16: The MISCtl1 Register .................................................................................................................. 32
Table 17: The MCLKCtl Register ................................................................................................................ 33
Table 18: The PCON Register .................................................................................................................... 34
Table 19: The IEN0 Register ...................................................................................................................... 36
Table 20: The IEN1 Register ...................................................................................................................... 37
Table 21: The IEN2 Register ...................................................................................................................... 37
Table 22: The TCON Register .................................................................................................................... 38
Table 23: The T2CON Register .................................................................................................................. 38
Table 24: The IRCON Register ................................................................................................................... 39
Table 25: External MPU Interrupts .............................................................................................................. 39
Table 26: Control Bits for External Interrupts .............................................................................................. 40
Table 27: Priority Level Groups .................................................................................................................. 40
Table 28: The IP0 Register ......................................................................................................................... 40
Table 29: The IP1 Register ......................................................................................................................... 41
Table 30: Priority Levels.............................................................................................................................. 41
Table 31: Interrupt Polling Sequence.......................................................................................................... 41
Table 32: Interrupt Vectors ......................................................................................................................... 41
Table 33: UART Modes .............................................................................................................................. 42
Table 34: Baud Rate Generation ................................................................................................................ 42
Table 35: The PCON Register .................................................................................................................... 43
Table 36: The BRCON Register ................................................................................................................. 43
Table 37: The MISCtl0 Register .................................................................................................................. 44
Table 38: The S0CON Register .................................................................................................................. 45
Table 39: The S1CON Register .................................................................................................................. 46
Table 40: The TMOD Register .................................................................................................................... 47
Table 41: Timers/Counters Mode Description ............................................................................................ 48
Table 42: The TCON Register .................................................................................................................... 49
Table 43: The IEN0 Register ...................................................................................................................... 50
Table 44: The IEN1 Register ...................................................................................................................... 50
Table 45: The IP0 Register ......................................................................................................................... 51
Table 46: The WDTREL Register ............................................................................................................... 51
Table 47: Direction Registers and Internal Resources for DIO Pin Groups ............................................... 52
Table 48: UDIR Control Bit ......................................................................................................................... 52
Table 49: Selectable Controls Using the UxIS Bits ..................................................................................... 52
Table 50: The USRIntCtl1 Register ............................................................................................................ 53
Table 51: The USRIntCtl2 Register ............................................................................................................ 53
Table 52: The USRIntCtl3 Register ............................................................................................................ 53
Table 53: The USRIntCtl4 Register ............................................................................................................ 53
Table 54: The RTCCtl Register ................................................................................................................... 55
Table 55: The 32-bit RTC Counter .............................................................................................................. 56
Table 56: The 24-bit RTC Accumulator ...................................................................................................... 56
Table 57: The 24-bit RTC Trim (sign magnitude value) ............................................................................. 56
73S1217F Data Sheet DS_1217F_002
Table 58: The INT5Ctl Register .................................................................................................................. 56
Table 59: The ACOMP Register ................................................................................................................. 57
Table 60: The INT6Ctl Register .................................................................................................................. 58
Table 61: The LEDCtl Register ................................................................................................................... 59
Table 62: The DAR Register ....................................................................................................................... 63
Table 63: The WDR Register ...................................................................................................................... 63
Table 64: The SWDR Register ................................................................................................................... 64
Table 65: The RDR Register ....................................................................................................................... 64
Table 66: The SRDR Register .................................................................................................................... 65
Table 67: The CSR Register ....................................................................................................................... 65
Table 68: The INT6Ctl Register .................................................................................................................. 66
Table 69: The KCOL Register ..................................................................................................................... 70
Table 70: The KROW Register ................................................................................................................... 70
Table 71: The KSCAN Register .................................................................................................................. 71
Table 72: The KSTAT Register ................................................................................................................... 72
Table 73: The KSIZE Register .................................................................................................................... 73
Table 74: The KORDERL Register ............................................................................................................. 73
Table 75: The KORDERH Register ............................................................................................................ 74
Table 76: The INT5Ctl Register .................................................................................................................. 74
Table 77: The MISCtl1 Register .................................................................................................................. 76
Table 78: The CKCON Register ................................................................................................................. 77
Table 79: The SCSel Register .................................................................................................................... 89
Table 80: The SCInt Register ..................................................................................................................... 90
Table 81: The SCIE Register ...................................................................................................................... 91
Table 82: The VccCtl Register .................................................................................................................... 92
Table 83: The VccTmr Register .................................................................................................................. 93
Table 84: The CRDCtl Register .................................................................................................................. 94
Table 85: The STXCtl Register ................................................................................................................... 95
Table 86: The STXData Register ................................................................................................................ 96
Table 87: The SRXCtl Register ................................................................................................................... 97
Table 88: The SRXData Register ............................................................................................................... 98
Table 89: The SCCtl Register ..................................................................................................................... 99
Table 90: The SCECtl Register ................................................................................................................. 100
Table 91: The SCDIR Register ................................................................................................................. 101
Table 92: The SPrtcol Register ................................................................................................................. 102
Table 93: The SCCLK Register ................................................................................................................ 103
Table 94: The SCECLK Register .............................................................................................................. 103
Table 95: The SParCtl Register ................................................................................................................ 104
Table 96: The SByteCtl Register .............................................................................................................. 105
Table 97: The FDReg Register ................................................................................................................. 106
Table 98: Divider Ratios Provided by the ETU Counter ........................................................................... 106
Table 99: Divider Values for the ETU Clock ............................................................................................. 107
Table 100: The CRCMsB Register ........................................................................................................... 108
Table 101: The CRCLsB Register ............................................................................................................ 108
Table 102: The BGT Register ................................................................................................................... 109
Table 103: The EGT Register ................................................................................................................... 109
Table 104: The BWTB0 Register .............................................................................................................. 110
Table 105: The BWTB1 Register .............................................................................................................. 110
Table 106: The BWTB2 Register .............................................................................................................. 110
Table 107: The BWTB3 Register .............................................................................................................. 110
Table 108: The CWTB0 Register .............................................................................................................. 110
Table 109: The CWTB1 Register .............................................................................................................. 110
Table 110: The ATRLsB Register ............................................................................................................. 111
Table 111: The ATRMsB Register ............................................................................................................ 111
Table 112: The STSTO Register .............................................................................................................. 111
Table 113: The RLength Register ............................................................................................................. 111
Table 114: Smart Card SFR Table ........................................................................................................... 112
Table 115: The VDDFCtl Register ............................................................................................................ 113
Table 116: Order Numbers and Packaging Marks ................................................................................... 137
6 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 7
D+
SMART
CARD
ISO
INTERFACE
SCLK
SIO
EXTERNAL
SMART
CARD
INTERFACE
POWER
REGULATION
AND VCC
CONTROL
LOGIC
GND
VDD
TBUS1
TBUS2
TBUS3
TBUS0
RXTX
ERST
ISBR
TCLK
TXD
RXD
ICE INTERFACE
SEC
SMART CARD LOGIC
ISO UART and CLOCK GENERATOR
FLASH/ROM
PROGRAM
MEMORY
64KB
DATA
XRAM
2KB
CORE
SERIAL
INT2
INT3
GND
GND
PERIPHERAL
INTERFACE
and SFR LOGIC
FLASH
INTERFACE
TEST
OCDSI
ISR
WATCH-
DOG
TIMER
PMU
PORTS
TIMER_0_
1
MEMORY_
CONTROL
CONTROL
UNIT
RAM_
SFR_
CONTROL
ALU
D-
RESET
VOLTAGE REFERENCE
AND FUSE TRIM
CIRCUITRY
VPD REGULATOR
USB I/O
and
LOGIC
ANA_IN
PLL
and
TIMEBASES
VDD
SCRATCH
IRAM
256B
12MHz
OSCILLATOR
X12OUT
X12IN
COL4
COL3
COL2
COL1
COL0
ROW5
ROW4
ROW3
ROW2
ROW1
ROW0
KEYPAD
INTERFACE
I2C
MASTER
INT.
SDA
SCL
USR(8:0)
DRIVERS
USR7
USR6
USR5
USR4
USR3
USR1
USR2
USR0
32kHz
OSCILLATOR
X32OUT
X32IN
RTC
VCC
RST
CLK
I/O
AUX2
AUX1
PRES
VPC
GND
VBUS
VP
VBAT
VDD
LIN
OFF_REQ
ON_OFF
GND
LED
DRIVER
LED0
Figure 1: IC Functional Block Diagram
73S1217F Data Sheet DS_1217F_002
1 Hardware Description
1.1 Pin Description
Table 1: 73S1217 Pinout Description
Pin Name
Pin (68 QFN)
Type
Equivalent
Circuit*
Description
X12IN 10 I Figure 29 MPU/USB clock crystal oscillator input pin. A 12MHz crystal
is required for USB operation. A 1M resistor is required
between pins X12IN and X12OUT.
X12OUT 11 O Figure 29 MPU/USB clock crystal oscillator output pin.
X32IN 8 I Figure 30 RTC clock crystal oscillator input pin. A 32768Hz crystal is
required for low-power RTC operation.
X32OUT 7 O Figure 30 RTC clock crystal oscillator output pin.
DP 26 IO Figure 45 USB D+ IO pin, requires series 24 resistor.
DM 27 IO Figure 45 USB D- IO pin, requires series 24 resistor.
ROW(5:0) 0
1
2
3
4
5
21
22
24
33
36
37
I Figure 37 Keypad row input sense.
COL(4:0) 0
1
2
3
4
12
13
14
16
19
O Figure 38 Keypad column output scan pins.
USR(7:0) 0
1
2
3
4
5
6
7
35
34
32
31
30
29
23
20
IO Figure 33 General-purpose user pins, individually configurable as
inputs or outputs or as external input interrupt ports.
SCL 5 O Figure 32 I2C (master mode) compatible Clock signal. Note: the pin is
configured as an open drain output. When the I2C interface
is being used, an external pull up resistor is required. A
value of 3K is recommended.
SDA 6 IO Figure 31 I2C (master mode) compatible data I/O. Note: this pin is
bi-directional. When the pin is configured as output, it is an
open drain output. When the I2C interface is being used, an
external pull up resistor is required. A value of 3K is
recommended.
RXD 17 I Figure 35 Serial UART Receive data pin.
TXD 18 O Figure 32 Serial UART Transmit data pin.
8 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 9
Pin Name
Pin (68 QFN)
Type
Equivalent
Circuit*
Description
INT3 48 I Figure 35 General purpose interrupt input.
INT2 49 I Figure 35 General purpose interrupt input.
SIO 47 IO Figure 31 IO data signal for use with external Smart Card interface
circuit such as 73S73S8010x.
SCLK 45 O Figure 32 Clock signal for use with external Smart Card interface
circuit.
PRES 53 I Figure 44 Smart Card presence. Active high. Note: the pin has a very
weak pull down resistor. In noisy environments, an external
pull down may be desired to insure against a false card
event.
CLK 55 O Figure 42 Smart card clock signal.
RST 57 O Figure 42 Smart card Reset signal.
IO 61 IO Figure 43 Smart card Data IO signal.
AUX1 60 IO Figure 43 Auxiliary Smart Card IO signal (C4).
AUX2 59 IO Figure 43 Auxiliary Smart Card IO signal (C8).
VCC 58 PSO Smart Card VCC supply voltage output. A 0.47μF capacitor
is required and should be located at the smart card
connector. The capacitor should be a ceramic type with low
ESR.
GND 56 GND Smart Card Ground.
VPC 65 PSI Power supply source for main voltage converter circuit. A
10μF and a 0.1μF capacitor are required at the VPC input.
The 10μF capacitor should be a ceramic type with low ESR.
VBUS 62 PSI Alternate power source input from USB connector or hub.
VBAT 64 PSI Alternate power source input, typically from two series cells,
V > 4V.
VP 54 PSO Intermediate output of main converter circuit. Requires an
external 4.7μF low ESR filter capacitor to GND.
LIN 66 PSI Connection to 10μH inductor for internal step up converter.
Note: inductor must be rated for 400 mA maximum peak
current.
ON_OFF 63 I Figure 46 Power control pin. Connected to normally open SPST switch
to ground. Closing switch for duration greater than de-
bounce period will turn 73S1217F on. If 73S1217F is on,
closing switch will flag the 73S1217F to go to the off state.
Firmware will control when the power is shut down.
73S1217F Data Sheet DS_1217F_002
Pin Name
Pin (68 QFN)
Type
Equivalent
Circuit*
Description
OFF_REQ 52 O Figure 36 Digital output. If ON_OFF switch is closed (to ground) for de-
bounce duration and circuit is “on,” OFF_REQ will go high
(Request to turn OFF). This output should be connected to
an interrupt pin to signal the CPU core that a request to shut
down power has been initiated. The firmware can then
perform all of its shut down housekeeping duties before
shutting down VDD.
TBUS(3:0)0
1
2
3
50
46
44
41
IO Trace bus signals for ICE.
RXTX 43 IO ICE control.
ERST 38 IO ICE control.
ISBR 3 IO ICE control.
TCLK 39 I ICE control.
ANA_IN 15 AI Figure 41 Analog input pin. This signal goes to a programmable
comparator and is used to sense the value of an external
voltage.
LED0 4 IO Figure 39 Special output driver, programmable pull-down current to
drive LED. May also be used as an input.
SEC 2 I Figure 40 Input pin for use in programming security fuse. It should be
connected to ground when not in use.
TEST 51 DI Figure 40 Test pin, should be connected to ground.
VDD 68
28
40
PSO VDD supply output pin. A 0.1μF capacitor is recommended at
each VDD pin.
GND 9
25
42
67
GND General ground supply pins for all IO and logic circuits.
RESET 1 I Figure 35 Reset input, positive assertion. Resets logic and registers to
default condition. Note: to insure proper reset operation after
VDD is turned on by application of VBUS power or activation of
the ON/OFF switch, external reset circuitry must generate a
proper reset signal to the 73S1217F. This can be
accomplished via a simple RC network.
* See the figures in the Equivalent Circuits section.
10 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 11
1.2 Hardware Overview
The 73S1217F single smart card controller integrates all primary functional blocks required to implement
a smart card reader with host serial and / or USB interface. Included on chip are an 8051-compatible
microprocessor (MPU) which executes up to one instruction per clock cycle (80515), a fully integrated IS0
7816 compliant smart card interface, expansion smart card interface, full speed USB 2.0 compatible
interface, serial interface, I2C interface, 6 x 5 keypad interface, RAM, FLASH memory, a real time clock
(RTC), and a variety of I/O pins.
Advanced power management features include a DC-DC converter and on-chip regulators that generate
all the necessary voltages for the circuit: Primarily a smart card supply VCC, (selectable to 1.8V, 3V or
5V) and a 3.3V digital voltage output (VDD, pin #68) that must be connected to the power supply inputs of
the digital core of the circuit, pins # 28 and 40 (these are not internally connected). Should external
circuitry require a 3.3V digital power supply, the VDD output is capable of supplying additional current.
The whole IC can be powered up either from a USB bus-power supply (VBUS +5V typical), or from a
typical set of battery cells VBAT. Automated switching between these supply inputs give the priority to
VBUS to save the battery life.
A functional block diagram of the 73S1217F is shown in Figure 1.
1.3 80515 MPU Core
1.3.1 80515 Overview
The 73S1217F includes an 80515 MPU (8-bit, 8051-compatible) that performs most instructions in one
clock cycle. The 80515 architecture eliminates redundant bus states and implements parallel execution
of fetch and execution phases. Normally a machine cycle is aligned with a memory fetch, therefore, most
of the 1-byte instructions are performed in a single cycle. This leads to an 8x performance (average)
improvement (in terms of MIPS) over the Intel 8051 device running at the same clock frequency.
Actual processor clocking speed can be adjusted to the total processing demand of the application
(cryptographic calculations, key management, memory management, and I/O management) using the
XRAM special function register MPUCKCtl.
Typical smart card, USB, serial, keyboard, I2C and RTC management functions are available for the
MPU as part of the Teridian standard library. A standard ANSI “C” 80515-application programming
interface library is available to help reduce design cycle. Refer to the 73S12xxF Software User’s Guide.
1.3.2 Memory Organization
The 80515 MPU core incorporates the Harvard architecture with separate code and data spaces.
Memory organization in the 80515 is similar to that of the industry standard 8051. There are three
memory areas: Program memory (Flash), external data memory (XRAM), and internal data memory
(IRAM). Data bus address space is allocated to on-chip memory as shown Table 2.
Table 2: MPU Data Memory Map
Address
(hex)
Memory
Technology Memory Type Typical Usage Memory Size
(bytes)
0000-FFFF Flash Memory Non-volatile Program and non-volatile
data
64KB
0000-07FF Static RAM Volatile MPU data XRAM 2KB
FC00-FFFF External SFR Volatile Peripheral control 1KB
Note: The IRAM is part of the core and is addressed differently.
73S1217F Data Sheet DS_1217F_002
Program Memory: The 80515 can address up to 64KB of program memory space from 0x0000 to
0xFFFF. Program memory is read when the MPU fetches instructions or performs a MOVC operation.
After reset, the MPU starts program execution from location 0x0000. The lower part of the program
memory includes reset and interrupt vectors. The interrupt vectors are spaced at 8-byte intervals, starting
from 0x0003. Reset is located at 0x0000.
Flash Memory: The program memory consists of flash memory. The flash memory is intended to
primarily contain MPU program code. Flash erasure is initiated by writing a specific data pattern to
specific SFR registers in the proper sequence. These special pattern/sequence requirements prevent
inadvertent erasure of the flash memory.
The mass erase sequence is:
1. Write 1 to the FLSH_MEEN bit in the FLSHCTL register (SFR address 0xB2[1]).
2. Write pattern 0xAA to ERASE (SFR address 0x94)
Note: The mass erase cycle can only be initiated when the ICE port is enabled.
The page erase sequence is:
1. Write the page address to PGADDR (SFR address 0xB7[7:1])
2. Write pattern 0x55 to ERASE (SFR address 0x94)
The PGADDR register denotes the page address for page erase. The page size is 512 (200h) bytes and
there are 128 pages within the flash memory. The PGADDR denotes the upper seven bits of the flash
memory address such that bit 7:1 of the PGADDR corresponds to bit 15:9 of the flash memory address.
Bit 0 of the PGADDR is not used and is ignored. The MPU may write to the flash memory. This is one of
the non-volatile storage options available to the user. The FLSHCTL SFR bit FLSH_PWE (flash program
write enable) differentiates 80515 data store instructions (MOVX@DPTR,A) between Flash and XRAM
writes. Before setting FLSH_PWE, all interrupts need to be disabled by setting EAL = 1. Table 3 shows
the location and description of the 73S1217F flash-specific SFRs.
Any flash modifications must set the CPUCLK to operate at 3.6923 MHz (MPUCLKCtl = 0x0C)
before any flash memory operations are executed to insure the proper timing when modifying the
flash memory.
12 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 13
Table 3: Flash Special Function Registers
Register SFR
Address
R/W Description
ERASE 0x94 W This register is used to initiate either the Flash Mass Erase cycle or the
Flash Page Erase cycle. Specific patterns are expected for ERASE in
order to initiate the appropriate Erase cycle (default = 0x00).
0x55 – Initiate Flash Page Erase cycle. Must be proceeded by a write
to PGADDR @ SFR 0xB7.
0xAA – Initiate Flash Mass Erase cycle. Must be proceeded by a write
to FLSH_MEEN @ SFR 0xB2 and the debug port must be
enabled.
Any other pattern written to ERASE will have no effect.
PGADDR 0xB7 R/W Flash Page Erase Address register containing the flash memory page
address (page 0 through 127) that will be erased during the Page Erase
cycle (default = 0x00). Note: the page address is shifted left by one bit
(see detailed description above).
Must be re-written for each new Page Erase cycle.
FLSHCTL 0xB2 R/W
Bit 0 (FLSH_PWE): Program Write Enable:
0 – MOVX commands refer to XRAM Space, normal operation (default).
1 – MOVX @DPTR,A moves A to Program Space (Flash) @ DPTR.
This bit is automatically reset after each byte written to flash. Writes to
this bit are inhibited when interrupts are enabled.
W Bit 1 (FLSH_MEEN): Mass Erase Enable:
0 – Mass Erase disabled (default).
1 – Mass Erase enabled.
Must be re-written for each new Mass Erase cycle.
R/W Bit 6 (SECURE):
Enables security provisions that prevent external reading of flash
memory and CE program RAM. This bit is reset on chip reset and may
only be set. Attempts to write zero are ignored.
Internal Data Memory: The internal data memory provides 256 bytes (0x00 to 0xFF) of data memory.
The internal data memory address is always one byte wide and can be accessed by either direct or
indirect addressing. The Special Function Registers occupy the upper 128 bytes. This SFR area is
available only by direct addressing. Indirect addressing accesses the upper 128 bytes of Internal
RAM.
The lower 128 bytes contain working registers and bit-addressable memory. The lower 32 bytes form
four banks of eight registers (R0-R7). Two bits on the program memory status word (PSW) select which
bank is in use. The next 16 bytes form a block of bit-addressable memory space at bit addresses 0x00-
0x7F. All of the bytes in the lower 128 bytes are accessible through direct or indirect addressing. Table 4
shows the internal data memory map.
73S1217F Data Sheet DS_1217F_002
Table 4: Internal Data Memory Map
Addres
s Direct Addressing Indirect Addressing
0xFF Special Function
Registers (SFRs) RAM
0x80
0x7F Byte-addressable area
0x30
0x2F Byte or bit-addressable area
0x20
0x1F Register banks R0…R7 (x4)
0x00
External Data Memory: While the 80515 can address up to 64KB of external data memory in the space
from 0x0000 to 0xFFFF, only the memory ranges shown in Figure 2 contain physical memory. The
80515 writes into external data memory when the MPU executes a MOVX @Ri,A or MOVX @DPTR,A
instruction. The MPU reads external data memory by executing a MOVX A,@Ri or MOVX A,@DPTR
instruction.
There are two types of instructions, differing in whether they provide an eight-bit or sixteen-bit indirect
address to the external data RAM.
In the first type (MOVX A,@Ri), the contents of R0 or R1, in the current register bank, provide the eight
lower-ordered bits of address. This method allows the user access to the first 256 bytes of the 2KB of
external data RAM. In the second type of MOVX instruction (MOVX A,@DPTR), the data pointer
generates a sixteen-bit address.
14 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 15
Address Use Address Use
0xFFFF
Flash
Program
Memory
64K
Bytes
0xFFFF Peripheral Control
Registers (128b)
0XFF80
0xFF7F Smart Card Control
(384b)
0XFE00
0xFDFF USB Registers (512b)
0XFC00
0xFBFF –
0x0800
Address
Use
0x07FF
XRAM
Indirect
Access
Direct
Access
0xFF Byte RAM SFRs
0x80
0x7F Byte RAM
0x48
0x47 Bit/Byte RAM
0x20
0x1F Register bank 3
0x18
0x17 Register bank 2
0x10
0x0F Register bank 1
0x08
0x07 Register bank 0
0x0000 0x0000 0x00
Program Memory External Data Memory Internal Data Memory
Figure 2: Memory Map
Dual Data Pointer: The Dual Data Pointer accelerates the block moves of data. The standard DPTR is a
16-bit register that is used to address external memory. In the 80515 core, the standard data pointer is
called DPTR, the second data pointer is called DPTR1. The data pointer select bit chooses the active
pointer. The data pointer select bit is located at the LSB of the DPS IRAM special function register
(DPS.0). DPTR is selected when DPS.0 = 0 and DPTR1 is selected when DPS.0 = 1.
The user switches between pointers by toggling the LSB of the DPS register. All DPTR-related
instructions use the currently selected DPTR for any activity.
Note: The second data pointer may not be supported by certain compilers.
73S1217F Data Sheet DS_1217F_002
1.4 Program Security
Two levels of program and data security are available. Each level requires a specific fuse to be blown in
order to enable or set the specific security mode. Mode 0 security is enabled by setting the SECURE bit
(bit 6 of SFR register FLSHCTL 0xB2). Mode 0 limits the ICE interface to only allow bulk erase of the
flash program memory. All other ICE operations are blocked. This guarantees the security of the user’s
MPU program code. Security (Mode 0) is enabled by MPU code that sets the SECURE bit. The MPU
code must execute the setting of the SECURE bit immediately after a reset to properly enable Mode 0.
This should be the first instruction after the reset vector jump has been executed. If the “startup.a51”
assembly file is used in an application, then it must be modified to set the SECURE bit after the reset
vector jump. If not using “startup.a51”, then this should be the first instruction in main(). Once security
Mode 0 is enabled, the only way to disable it is to perform a global erase of the flash followed by a full
circuit reset. Once the flash has been erased and the reset has been executed, security Mode 0 is
disabled and the ICE has full control of the core. The flash can be reprogrammed after the bulk erase
operation is completed. Global erase of the flash will also clear the data XRAM memory.
The security enable bit (SECURE) is reset whenever the MPU is reset. Hardware associated with the bit
only allows it to be set. As a result, the code may set the SECURE bit to enable the security Mode 0
feature but may not reset it. Once the SECURE bit is set, the code is protected and no external read of
program code in flash or data (in XRAM) is possible. In order to invoke the security Mode 0, the
SECSET0 (bit 1 of XRAM SFR register SECReg 0xFFD7) fuse must be blown beforehand or the security
mode 0 will not be enabled. The SECSET0 and SECSET1 fuses once blown, cannot be overridden.
Specifically, when SECURE is set:
• The ICE is limited to bulk flash erase only.
• Page zero of flash memory may not be page-erased by either MPU or ICE. Page zero may only be
erased with global flash erase. Note that global flash erase erases XRAM whether the SECURE bit
is set or not.
• Writes to page zero, whether by MPU or ICE, are inhibited.
Security mode 1 is in effect when the SECSET1 fuse has been programmed (blown open). In security
mode 1, the ICE is completely and permanently disabled. The Flash program memory and the MPU are
not available for alteration, observation, nor control. As soon as the fuse has been blown, the ICE is
disabled. The testing of the SECSET1 fuse will occur during the reset and before the start of pre-boot
and boot cycles. This mode is not reversible, nor recoverable. In order to blow the SECSET1 fuse, the
SEC pin must be held high for the fuse burning sequence to be executed properly. The firmware can
check to see if this pin is held high by reading the SECPIN bit (bit 5 of XRAM SFR register SECReg
0xFFD7). If this bit is set and the firmware desires, it can blow the SECSET1 fuse. The burning of the
SECSET0 does not require the SEC pin to be held high.
In order to blow the fuse for SECSET1 and SECSET0, a particular set of register writes in a specific order
need to be followed. There are two additional registers that need to have a specific value written to them
in order for the desired fuse to be blown. These registers are FUSECtl (0xFFD2) and TRIMPCtl
(0xFFD1). The sequence for blowing the fuse is as follows:
1. Write 0x54H to FUSECtl.
2. Write 0x81H for security mode 0 Note: only program one security mode at a time.
3. Write 0x82H for security mode 1 Note: SEC pin must be high for security mode 1.
4. Write 0xA6 to TRIMPCtl.
5. Delay about 500 us
6. Write 0x00 to TRIMPCtl and FUSECtl.
16 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 17
Table 5: Program Security Registers
Register SFR
Address
R/W Description
FLSHCTL 0xB2 R/W Bit 0 (FLSH_PWE): Program Write Enable:
0 – MOVX commands refer to XRAM Space, normal operation (default).
1 – MOVX @DPTR,A moves A to Program Space (Flash) @ DPTR.
This bit is automatically reset after each byte written to flash. Writes to this
bit are inhibited when interrupts are enabled.
W Bit 1 (FLSH_MEEN): Mass Erase Enable:
0 – Mass Erase disabled (default).
1 – Mass Erase enabled.
Must be re-written for each new Mass Erase cycle.
R/W Bit 6 (SECURE):
Enables security provisions that prevent external reading of flash memory
and CE program RAM. This bit is reset on chip reset and may only be set.
Attempts to write zero are ignored.
TRIMPCtl 0xFFD1 W 0xA6 value will cause the selected fuse to be blown. All other values will
stop the burning process.
FUSECtl 0xFFD2 W 0x54 value will set up for security fuse control. All other values are
reserved and should not be used.
SECReg 0xFFD7 W Bit 7 (PARAMSEC):
0 – Normal operation.
1 – Enable permanent programming of the security fuses.
R Bit 5 (SECPIN):
Indicates the state of the SEC pin. The SEC pin is held low by a pull-down
resistor. The user can force this pin high during boot sequence time to
indicate to firmware that sec mode 1 is desired.
R/W Bit 1 (SECSET1):
See the Program Security section.
R/W Bit 0 (SECSET0):
See the Program Security section.
73S1217F Data Sheet DS_1217F_002
1.5 Special Function Registers (SFRs)
The 1217 utilizes numerous SFRs to communicate with the many 1217 peripherals. This results in the
need for more SFR locations outside the direct address IRAM space (0x80 to 0xFF). While some
peripherals are mapped to unused IRAM SFR locations, additional SFRs for the USB, smart card and
other peripheral functions are mapped to the top of the XRAM data space (0xFC00 to 0xFFFF).
1.5.1 Internal Data Special Function Registers (SFRs)
The Special Function Registers map is shown in Table 6.
Table 6: IRAM Special Function Registers Locations
Hex\Bin X000 X001 X010 X011 X100 X101 X110 X111 Bin/
Hex
F8 FF
F0 B F7
E8 EF
E0 A E7
D8 BRCON DF
D0 PSW KCOL KROW KSCAN KSTAT KSIZE KORDERL KORDERH D7
C8 T2CON CF
C0 IRCON C7
B8 IEN1 IP1 S0RELH S1RELH BF
B0
FLSHCTL
PGADDR B7
A8 IEN0 IP0 S0RELL AF
A0 A7
98 S0CON S0BUF IEN2 S1CON S1BUF S1RELL 9F
90 USR70 UDIR70 DPS
ERASE 97
88 TCON TMOD TL0 TL1 TH0 TH1
MCLKCtl 8F
80 SP DPL DPH DPL1 DPH1 WDTREL PCON 87
Only a few addresses are used, the others are not implemented. SFRs specific to the 73S1217F are
shown in bold print (gray background). Any read access to unimplemented addresses will return
undefined data, while most write access will have no effect. However, a few locations are reserved and
not user configurable in the 73S1217F. Writes to the unused SFR locations can affect the operation
of the core and therefore must not be written to. This applies to all the SFR areas in both the
IRAM and XRAM spaces. In addition, all unused bit locations within valid SFR registers must be
left in their default (power on default) states.
18 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 19
1.5.2 IRAM Special Function Registers (Generic 80515 SFRs)
Table 7 shows the location of the SFRs and the value they assume at reset or power-up.
Table 7: IRAM Special Function Registers Reset Values
Name Location Reset Value Description
SP 0x81 0x07 Stack Pointer
DPL 0x82 0x00 Data Pointer Low 0
DPH 0x83 0x00 Data Pointer High 0
DPL1 0x84 0x00 Data Pointer Low 1
DPH1 0x85 0x00 Data Pointer High 1
WDTREL 0x86 0x00 Watchdog Timer Reload register
PCON 0x87 0x00 Power Control
TCON 0x88 0x00 Timer/Counter Control
TMOD 0x89 0x00 Timer Mode Control
TL0 0x8A 0x00 Timer 0, low byte
TL1 0x8B 0x00 Timer 1, high byte
TH0 0x8C 0x00 Timer 0, low byte
TH1 0x8D 0x00 Timer 1, high byte
MCLKCtl 0x8F 0x0A Master Clock Control
USR70 0x90 0xFF User Port Data (7:0)
UDIR70 0x91 0xFF User Port Direction (7:0)
DPS 0x92 0x00 Data Pointer Select Register
ERASE 0x94 0x00 Flash Erase
S0CON 0x98 0x00 Serial Port 0, Control Register
S0BUF 0x99 0x00 Serial Port 0, Data Buffer
IEN2 0x9A 0x00 Interrupt Enable Register 2
S1CON 0x9B 0x00 Serial Port 1, Control Register
S1BUF 0x9C 0x00 Serial Port 1, Data Buffer
S1RELL 0x9D 0x00 Serial Port 1, Reload Register, low byte
IEN0 0xA8 0x00 Interrupt Enable Register 0
IP0 0xA9 0x00 Interrupt Priority Register 0
S0RELL 0xAA 0xD9 Serial Port 0, Reload Register, low byte
FLSHCTL 0xB2 0x00 Flash Control
PGADDR 0xB7 0x00 Flash Page Address
IEN1 0xB8 0x00 Interrupt Enable Register 1
IP1 0xB9 0x00 Interrupt Priority Register 1
S0RELH 0xBA 0x03 Serial Port 0, Reload Register, high byte
S1RELH 0xBB 0x03 Serial Port 1, Reload Register, high byte
IRCON 0xC0 0x00 Interrupt Request Control Register
T2CON 0xC8 0x00 Timer 2 Control
PSW 0xD0 0x00 Program Status Word
KCOL 0XD1 0x1F Keypad Column
73S1217F Data Sheet DS_1217F_002
20 Rev. 1.2
Name Location Reset Value Description
KROW 0XD2 0x3F Keypad Row
KSCAN 0XD3 0x00 Keypad Scan Time
KSTAT 0XD4 0x00 Keypad Control/Status
KSIZE 0XD5 0x00 Keypad Size
KORDERL 0XD6 0x00 Keypad Column LS Scan Order
KORDERH 0XD7 0x00 Keypad Column MS Scan Order
BRCON 0xD8 0x00 Baud Rate Control Register (only BRCON.7 bit used)
A 0xE0 0x00 Accumulator
B 0xF0 0x00 B Register
1.5.3 External Data Special Function Registers (SFRs)
A map of the XRAM Special Function Registers is shown in Table 8. The smart card registers are listed
separately in Table 114.
Table 8: XRAM Special Function Registers Reset Values
Name Location Reset Value Description
DAR 0x FF80 0x00 Device Address Register (I2C)
WDR 0x FF81 0x00 Write Data Register (I2C)
SWDR 0x FF82 0x00 Secondary Write Data Register (I2C)
RDR 0x FF83 0x00 Read Data Register (I2C)
SRDR 0x FF84 0x00 Secondary Read Data Register (I2C)
CSR 0x FF85 0x00 Control and Status Register (I2C)
USRIntCtl1 0x FF90 0x00 External Interrupt Control 1
USRIntCtl2 0x FF91 0x00 External Interrupt Control 2
USRIntCtl3 0x FF92 0x00 External Interrupt Control 3
USRIntCtl4 0x FF93 0x00 External Interrupt Control 4
INT5Ctl 0x FF94 0x00 External Interrupt Control 5
INT6Ctl 0x FF95 0x00 External Interrupt Control 6
MPUCKCtl 0x FFA1 0x0C MPU Clock Control
RTCCtl 0x FFB0 0x00 Real Time Clock Control
RTCCnt3 0x FFB1 0x00 RTC Count 3
RTCCnt2 0x FFB2 0x00 RTC Count 2
RTCCnt1 0x FFB3 0x00 RTC Count 1
RTCCnt0 0x FFB4 0x00 RTC Count 0
RTCACC2 0x FFB5 0x00 RTC Accumulator 2
RTCACC1 0x FFB6 0x00 RTC Accumulator 1
RTCACC0 0x FFB7 0x00 RTC Accumulator 0
RTCTrim2 0x FFB8 0x00 RTC TRIM 2
RTCTrim1 0x FFB9 0x00 RTC TRIM 1
RTCTrim0 0x FFBA 0x00 RTC TRIM 0
ACOMP 0x FFD0 0x00 Analog Compare Register
TRIMPCtl 0x FFD1 0x00 TRIM Pulse Control
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 21
Name Location Reset Value Description
FUSECtl 0x FFD2 0x00 FUSE Control
VDDFCtl 0x FFD4 0x00 VDDFault Control
SECReg 0x FFD7 0x00 Security Register
MISCtl0 0x FFF1 0x00 Miscellaneous Control Register 0
MISCtl1 0x FFF2 0x10 Miscellaneous Control Register 1
LEDCtl 0x FFF3 0xFF LED Control Register
Accumulator (ACC, A): ACC is the accumulator register. Most instructions use the accumulator to hold
the operand. The mnemonics for accumulator-specific instructions refer to accumulator as “A”, not ACC.
B Register: The B register is used during multiply and divide instructions. It can also be used as a
scratch-pad register to hold temporary data.
73S1217F Data Sheet DS_1217F_002
Program Status Word (PSW):
Table 9: PSW Register Flags
MSB LSB
CV AC F0 RS1 RS OV – P
Bit Symbol Function
PSW.7 CV Carry flag.
PSW.6 AC Auxiliary Carry flag for BCD operations.
PSW.5 F0 General purpose Flag 0 available for user.
PSW.4 RS1 Register bank select control bits. The contents of RS1 and RS0 select
the working register bank:
RS1/RS0 Bank Selected Location
00 Bank 0 (0x00 – 0x07)
01 Bank 1 (0x08 – 0x0F)
10 Bank 2 (0x10 – 0x17)
11 Bank 3 (0x18 – 0x1F)
PSW.3 RS0
PSW.2 OV Overflow flag.
PSW.1 F1 General purpose Flag 1 available for user.
PSW.0 P Parity flag, affected by hardware to indicate odd / even number of “one”
bits in the Accumulator, i.e. even parity.
Stack Pointer (SP): The stack pointer is a 1-byte register initialized to 0x07 after reset. This register is
incremented before PUSH and CALL instructions, causing the stack to begin at location 0x08.
Data Pointer: The data pointer (DPTR) is 2 bytes wide. The lower part is DPL, and the highest is DPH.
It can be loaded as a 2-byte register (MOV DPTR,#data16) or as two registers (e.g. MOV DPL,#data8). It
is generally used to access external code or data space (e.g. MOVC A,@A+DPTR or MOVX A,@DPTR
respectively).
Program Counter: The program counter (PC) is 2 bytes wide initialized to 0x0000 after reset. This
register is incremented during the fetching operation code or when operating on data from program
memory. Note: The program counter is not mapped to the SFR area.
Port Registers: The I/O ports are controlled by Special Function Register USR70. The contents of the
SFR can be observed on corresponding pins on the chip. Writing a 1 to any of the ports (see Table 10)
causes the corresponding pin to be at high level (3.3V), and writing a 0 causes the corresponding pin to
be held at low level (GND). The data direction register UDIR70 define individual pins as input or output
pins (see the User (USR) Ports section for details).
Table 10: Port Registers
Register SFR
Address R/W Description
USR70 0x90 R/W Register for User port bits 7:0 read and write operations (pins USR0…
USR7).
UDIR70 0x91 R/W Data direction register for User port bits 0:7. Setting a bit to 0 means that
the corresponding pin is an output.
All ports on the chip are bi-directional. Each consists of a Latch (SFR USR70), an output driver, and an
input buffer, therefore the MPU can output or read data through any of these ports if they are not used for
alternate purposes.
22 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 23
1.6 Instruction Set
All instructions of the generic 8051 microcontroller are supported. A complete list of the instruction set
and of the associated op-codes is contained in the 73S12xxF Software User’s Guide. and of the associated op-codes is contained in the 73S12xxF Software User’s Guide.
1.7 Peripheral Descriptions 1.7 Peripheral Descriptions
1.7.1 Oscillator and Clock Generation 1.7.1 Oscillator and Clock Generation
The 73S1217F has two oscillator circuits; one for the main CPU clock and another for the RTC. The
main oscillator circuit is designed to operate with various crystal or external clock frequencies. An
internal divider working in conjunction with a PLL and VCO provides a 96MHz internal clock within the
73S1217F. 96 MHz is the required frequency for proper operation of specific peripheral blocks such as
the USB, specific timers, ISO 7816 UART and interfaces, Step-up converter, and keypad. The clock
generation and control circuits are shown in Figure 3.
The 73S1217F has two oscillator circuits; one for the main CPU clock and another for the RTC. The
main oscillator circuit is designed to operate with various crystal or external clock frequencies. An
internal divider working in conjunction with a PLL and VCO provides a 96MHz internal clock within the
73S1217F. 96 MHz is the required frequency for proper operation of specific peripheral blocks such as
the USB, specific timers, ISO 7816 UART and interfaces, Step-up converter, and keypad. The clock
generation and control circuits are shown in
Figure 3.
LOW
XTAL
OSC VCO
Phase
Freq
DET
CPU CLOCK
DIVIDER
6 bits
MCLK
96MHz LMCLK=32765Hz
1.5-48MHz
MPU CLOCK - CPCLK
SMART CARD LOGIC
BLOCK CLOCK
SCCLK
SCLK
CLOCK
Prescaler 6bits
SC/SCE
CLOCK
Prescaler 6bits
SEL
ETU CLOCK
DIVIDER
12 bits
div 2
CPUCKDiv
See SC Clock descriptions for more accurate diagram
ETUCLK
MCount(2:0)
KEYCLK
LCLK=32768Hz
X32IN
X32OUT
I2CCLK
1kHz
400kHz
USBCLK
48MHz
DIVIDE
by 120
DIVIDER
/2930
HIGH
XTAL
OSC
X12IN
X12OUT
M DIVIDER
/(2*N + 4)
HCLK
HOSCen
12.00MHz
32768Hz
12.00MHz
USBCKenb
div 2
ICLK
32KOSCenb
SCCKenb
SELSC
DIVIDE
by 96
CLK1M
1MHz
7.386MHz 7.386MHz
3.6923MHz
DIV
32
I2C_2x
800kHz
div 2
SCECLK
div 2 div 2
Mux RTCCLK
Figure 3: Clock Generation and Control Circuits
73S1217F Data Sheet DS_1217F_002
The master clock control register enables different sections of the clock circuitry and specifies the value
of the VCO Mcount divider. The MCLK must be configured to operate at 96MHz to ensure proper
operation of some of the peripheral blocks according to the following formula:
MCLK = (Mcount * 2 + 4) * FXTAL = 96MHz
Mcount is configured in the MCLKCtl register must be bound between a value of 1 to 7. The possible
crystal or external clock frequencies for getting MCLK = 96MHz are shown in Table 11.
Table 11: Frequencies and Mcount Values for MCLK = 96MHz
FXTAL (MHz) Mcount (N)
12.00 2
9.60 3
8.00 4
6.86 5
6.00 6
Master Clock Control Register (MCLKCtl): 0x8F Å 0x0A
Table 12: The MCLKCtl Register
MSB LSB
HSOEN KBEN SCEN USBEN 32KEN MCT.2 MCT.1 MCT.0
Bit Symbol Function
MCLKCtl.7 HSOEN
High-speed oscillator disable. When set = 1, disables the high-speed crystal
oscillator and VCO/PLL system. Do not set this bit = 1.
MCLKCtl.6 KBEN 1 = Disable the keypad logic clock.
MCLKCtl.5 SCEN 1 = Disable the smart card logic clock.
MCLKCtl.4 USBEN 1 = Disable the USB logic clock.
MCLKCtl.3 32KEN
1 = Disable the 32Khz oscillator. When the 32kHz oscillator is enabled, the
RTC and other circuits such as debounce clocks are clocked using the
32kHz oscillator output. When disabled, the main oscillator provides the
32kHz clock for the RTC and other circuits. Note: This bit must be set if
there is no 32KHz crystal. Some internal clocks and circuits will not
run if the oscillator is enabled and no crystal is connected.
MCLKCtl.2 MCT.2 This value determines the ratio of the VCO frequency (MCLK) to the
high-speed crystal oscillator frequency such that:
MCLK = (MCount*2 + 4)* FXTAL. The default value is MCount = 2h such that
MCLK = (2*2 + 4)*12.00MHz = 96MHz.
MCLKCtl.1 MCT.1
MCLKCtl.0 MCT.0
The MPU clock that drives the CPU core defaults to 3.6923MHz after reset. The MPU clock is scalable
by configuring the MPU Clock Control register (MPUCKCtl).
24 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 25
MPU Clock Control Register (MPUCKCtl): 0xFFA1 Å 0x0C
Table 13: The MPUCKCtl Register
MSB LSB
– – MDIV.5 MDIV.4 MDIV.3 MDIV.2 MDIV.1 MDIV.0
Bit Symbol Function
MPUCKCtl.7 –
MPUCKCtl.6 –
MPUCKCtl.5 MDIV.5
This value determines the ratio of the MPU master clock frequency to
the VCO frequency (MCLK) such that
MPUClk = MCLK/(2 * (MPUCKDiv(5:0) + 1)).
Do not use values of 0 or 1 for MPUCKDiv(n).
Default is 0Ch to set CPCLK = 3.6923MHz.
MPUCKCtl.4 MDIV.4
MPUCKCtl.3 MDIV.3
MPUCKCtl.2 MDIV.2
MPUCKCtl.1 MDIV.1
MPUCKCtl.0 MDIV.0
The oscillator circuits are designed to connect directly to standard parallel resonant crystal in a Pierce
oscillator configuration. Each side of the crystal should include a 22pF capacitor to ground for both
oscillator circuits and a 1M resistor is required across the 12MHz crystal.
The CPU clock is available as an output on pin CPUCLK.
73S1217F
X12IN
X12OUT
X32IN
X32OUT
12MHz
22pF 22pF 22pF 22pF
32KHz
1MΩ
Note: The crystals should be placed as close as possible to the IC, and vias should be avoided.
Figure 4: Oscillator Circuit
73S1217F Data Sheet DS_1217F_002
1.7.2 Power Supply Management
The detailed power supply management logic block diagram is shown in Figure 5.
VBUS
VBAT
VBUSTH
+
-
Q
Q
SET
CLR
D
Debounce
Circuit
ON_OFF
DC-DC
Converter
/ Pass
Through*
Delay
Circuit
(POR)
EN
VPC
VP
VP
VCC
Regulator
LIN
OFF_REQ
INT3
MPU
INT
PWRDN*
*PWRDN bit in MISCtl0
VDD
VCC
Power
Control
VCC Voltage
Select
VCC Enable
Pass Through
Mode Enable
PTEN
Q
Q
SET
CLR
S
R
NC
NO
*Pass Through -> VP = VPC
Smart
Card
Power
To optional
external
circuits
20mA max.
VDD
Regulator
VDD to
Internal
Circuits
Figure 5: Detailed Power Management Logic Block Diagram
The 73S1217F contains a power supply and converter circuit that takes power from any one of three
sources; VPC, VBUS, or VBAT.
VPC is specified to range from 2.7 to 6.5 volts. It can typically be supplied by a single cell battery with a
voltage range of 2.7 to approximately 3.1 volts or by a standard supply of 3.3 or 5 volts.
26 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 27
VBUS is typically supplied by an external power supply and ranges in value from 4.4 to 5.5 volts (6.5V
maximum).
VBAT is expected to be supplied from a battery of three to four series connected cells with a voltage value
of 4.0 to 6.5 volts.
VBAT and VBUS are internally switched to VPC by two separate FET switches configured as a SPDT switch
(break-before-make). They will not be enabled at the same time. VBUS is automatically selected in lieu of
VBAT when VBUS is present (i.e. VBUS always has the priority).
If VPC is provided and either VBAT or VBUS is also used, the source of VPC must be diode isolated from the
VPC pin to prevent current flow from VBAT or VBUS into the VPC source.
The power that is supplied to the VPC pin (externally or internally, i.e. through VBAT or VBUS – see above) is
up-converted to the intermediate voltage VP utilizing an inductive, step-up converter. A series power
inductor (nominal value = 10 μH) must be connected from VPC to the pin LIN, and a 10μF low ESR filter
capacitor must be connected to VPC.
VP requires a 4.7μF filter capacitor and will have a nominal value of 5.5V during normal operation. VP is
used internally by the smart card electrical interface circuit and is regulated to the desired smart card
supply VCC voltage (can be programmed for values of 5V, 3V, or 1.8V).
VP is also used internally to generate a 3.3V nominal, regulated power supply VDD. VDD is output on pin
68 and must be directly tied to all other VDD pins on the 73S1217F (pins 28 and 40). VDD powers all the
digital logic, input/output buffering, and analog functions. It can also be used for external circuitry: Up to
20mA current can be supplied to external devices simultaneously to the 73S1217F’s digital core
maximum consumption.
1.7.3 Power ON/OFF
The 73S1217F features an ON_OFF input pin for a momentary contract, main-system ON/OFF switch.
The purpose of this switch is to place the circuit in a very low-power mode – the “OFF” mode – where the
digital core of the circuit is no longer powered, therefore allowing the lowest possible current
consumption.
When in “OFF” mode, an action on the ON/OFF switch will turn-on the power supply of the digital core
(VDD) and apply a power-on-reset condition. Alternatively, entering the “OFF” mode from the “ON” mode
requires firmware action.
When in “ON” mode, an action on the ON/OFF switch will send a request to the controller that will have to
be acknowledged (firmware action required) in order to enter the “OFF” state.
When placed into the “OFF” state, the 73S1217F will consume minimum current from VPC and VBAT; VP
and VDD will be unavailable (VDD out = 0V and VP = 0V).
When in “ON” mode, the 73S1217F will operate normally, with all the features described in this document
available. VP and VDD will be available (VDD out = 3.3V and VP = 5.5V nominal).
Whenever VBUS power is supplied, the circuit will be automatically in the “ON” state: The functions of the
ON/OFF switch and circuitry are overridden and the 73S1217F is in the “ON” state with VP and VDD
available.
Without VBUS applied, the circuit is by default in the “OFF” state, and will respond only to the ON_OFF pin.
The ON_OFF pin should be connected to an SPST switch to ground. If the circuit is OFF and the switch
is closed for a de-bounce period of 50-100ms, the circuit will go into the “ON” state wherein all functions
are operating in normal fashion. If the circuit is in the “ON” state and the ON_OFF pin is connected to
ground for a period greater than the de-bounce period, OFF_REQ will be asserted high and held
regardless of the state of ON/OFF. The OFF_REQ signal should be connected to one of the interrupt
pins to signal the CPU core that a request to shutdown has been initiated. The firmware will
73S1217F Data Sheet DS_1217F_002
acknowledge this request by setting the SCPWRDN bit in the Smart Card VCC Control/Status Register
(VccCtl) high after it has completed all shutdown activities. When SCPWRDN is set high, the circuit will
deactivate the smart card interface if required and turn off all analog functions and the VDD supply for the
logic and companion circuits. The default state upon application of power is the “OFF” state unless
power is supplied to the VBUS supply. Note that at any time, the firmware may assert SCPWRDN and the
73S1217F will go into the “OFF” state (when VBUS is not present). If the OFF switch function is not
desired and the application does not need to shut down power on VDD, the ON_OFF input can be
permanently grounded which will automatically turn on VDD when power is supplied on any of the VPC,
VBAT or VBUS power supply inputs.
If power is applied to both VBAT and VBUS, the circuit will automatically consume power from only the VBUS
source. The 73S1217F will be unconditionally “ON” when VBUS is applied. If the VBUS source is removed,
the 73S1217F will switchover to the VBAT input supply and remain in the “ON” state. The firmware
should assert SCPWRDN based on no activity or VBUS removal to reduce battery power consumption.
When operating from VBUS, and not calling for VCC, the step-up converter becomes a simple switch
connecting VBUS to VP in order to save power. This condition is appropriate for the USB “SUSPEND”
state. The USB “SUSPEND” state requires the power supply current to be less than 500uA. In order to
obtain and meet this low current limitation, the firmware must configure the 73S1217F into a power-down
condition using less than 20uA from VDD.
Note: When the ON_OFF switch function is not needed, i.e. when the 73S1217F must be in an always-
ON state when using another supply than VBUS (VPC or VBAT), some external discrete components are
needed.
1.7.4 Power Control Modes
The 73S1217F contains circuitry to disable portions of the device and place it into a lower power standby
mode or power down the 73S1217F into its “OFF” mode. The standby mode will stop the core, clock
subsystem and the peripherals connected to it. This is accomplished by either shutting off the power or
disabling the clock going to the block. The miscellaneous control registers MISCtl0, MISCtl1 and the
Master Clock Control register (MCLKCtl) provide control over the power modes. The PWRDN bit in
MISCtl0 will set up the 73S1217F for either standby or “OFF” modes. Depending on the state of the
ON/OFF circuitry and power applied to the VBUS input, the 73S1217F will go into either standby mode or
power “OFF” mode. If system power is provided by, VBUS or the ON/OFF circuitry is in the “ON” state,
the MPU core will placed into standby mode. If the VBUS input is not sourcing power and the ON/OFF
circuitry is in the “OFF” state, setting the PWRDN bit will shut down the converter and VP will turn off.
This in turn will turn off the VDD supply and the 73S1217F will be turned “OFF”. The power down modes
should only be initiated by setting the PWRDN bit in the MISCtl0 register and not by manipulating
individual control bits in various registers. Figure 6 shows how the PWRDN bit controls the various
functions that comprise power down state
28 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 29
VDDFAULT
Analog functions
(VCO, PLL,
reference and bias
circuits, etc.)
USB Transceiver
(suspend mode)
32K OSC
ANALOG
COMPARE
High Speed OSC
MCLCKCtl - 32KEN
MISCtl1 - USBPEN
MISCtl1 - ANAPEN
MISCtl0 - PWRDN
VDDFCtl - VDDFEN
ACOMP - CMPEN
MCLCKCtl - HOSEN
Smart Card Power
SCVCCCtl - SCPRDN
+
+
+
+
+
+
USB
SUSPEND
These are the registers and
the names of the control bits.
These are the
block references.
PWRDN Signal
Note: the PWRDN Signal is not the direct version of the PWRDN Bit. There are delays from assertion of the
PWRDN bit to the assertion of the PWRDN Signal (32 MPU clocks) Refer to the Power Down sequence diagram.
PD_ANALOG
Flash Read Pulse
one-shot circuit
MISCtl1 - FRPEN +
Figure 6: Power-Down Control
When the PWRDN bit is set, the clock subsystem will provide a delay of 32 MPUCLK cycles to allow the
program to set the STOP bit in the PCON register. This delay will enable the program to properly halt the
core before the analog circuits shut down (high speed oscillator, VCO/PLL, voltage reference and bias
circuitry, etc.). The PDMUX bit in SFR INT5Ctl should be set prior to setting the PWRDN bit in order to
configure the wake up interrupt logic. The power down mode is de-asserted by any of the interrupts
connected to external interrupts 0, 4 and 5 (external USR[0:7], smart card and Keypad). These interrupt
sources are OR’ed together and routed through delay logic into INT0 to provide this functionality. The
interrupt will turn on the power to all sections that were shut off and start the clock subsystem. After the
clock subsystem clocks start running, the MPUCLK begins to clock a 512 count delay counter. When the
counter times out, the interrupt will then be active on INT0 and the program can resume. Figure 7 shows
the detailed logic for waking up the 73S1217F from a power down state using these specific interrupt
sources. Figure 8 shows the timing associated with the power down mode.
73S1217F Data Sheet DS_1217F_002
USR[7:0] Control
USRxINTSrc set to
4(ext INT0 high)
or
6(ext INT0 low) 1
0
INT5
INT4
RESETB
TC
CLR
9 BIT CNTR
RESETB
CE
PDMUX
(FF94h:bit7)
MPU
INT0
PWRDN_analogQ
CLR
D
PWRDN
(FFF1h:bit7)
USR0
USR6
USR1
USR2
USR3
USR4
USR5
USR7
TC
CE
CLR
5 BIT CNTR
Notes:
1. The counters are clocked by the MPUCLK
2. TC - Terminal count (high at overflow)
3. CE - Count enable RESETB
Figure 7: Detail of Power-Down Interrupt Logic
PWRDN BIT
PWRDN SIG
EXT. EVENT
INT0 to MPU
MPU STOP
ANALOG Enable
PLL CLOCKS
t1
t2
t3
t4
t5
t6
t0
t7
t0: MPU sets PWRDN bit
t1: 32 MPU clock cycles after t0, the PWRDN SIG is asserted, turning all analog functions OFF.
t2: MPU executes STOP instruction, must be done prior to t1.
t3: Analog functions go to OFF condition. No Vref, PLL/VCO, Ibias, etc.
text
text: An external event (RTC, Keypad, Card event, USB) occurs.
t4: PWRDN bit and PWRDN signal are cleared by external event.
t5: High-speed oscillator/PLL/VCO operating.
t6: After 512 MPU clock cycles, INT0 to MPU is asserted.
t7: INT0 causes MPU to exit STOP condition.
Figure 8: Power-Down Sequencing
30 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 31
External Interrupt Control Register (INT5Ctl): 0xFF94 Å 0x00
Table 14: The INT5Ctl Register
MSB LSB
PDMUX – RTCIEN RTCINT USBIEN USBINT KPIEN KPINT
Bit Symbol Function
INT5Ctl.7 PDMUX
When set = 1, enables interrupts from USB, RTC, Keypad (normally going to
int5), Smart Card interrupts (normally going to int4), or USR(7:0) pins (int0) to
cause interrupt on int0. The assertion of the interrupt to int0 is delayed by
512 MPU clocks to allow the analog circuits, including the clock system, to
stabilize. This bit must be set prior to asserting the PWRDN bit in order to
properly configure the interrupts that will wake up the circuit. This bit is reset
= 0 when this register is read.
INT5Ctl.6 –
INT5Ctl.5 RTCIEN RTC interrupt enable.
INT5Ctl.4 RTCINT RTC interrupt flag.
INT5Ctl.3 USBIEN USB interrupt enable.
INT5Ctl.2 USBINT USB interrupt flag.
INT5Ctl.1 KPIEN Keypad interrupt enable.
INT5Ctl.0 KPINT Keypad interrupt flag.
Miscellaneous Control Register 0 (MISCtl0): 0xFFF1 Å 0x00
Table 15: The MISCtl0 Register
MSB LSB
PWRDN – – – – – SLPBK SSEL
Bit Symbol Function
MISCtl0.7 PWRDN
This bit sets the circuit into a low-power condition. All analog (high speed
oscillator and VCO/PLL) functions are disabled 32 MPU clock cycles after
this bit is set = 1. This allows time for the next instruction to set the STOP bit
in the PCON register to stop the CPU core. The RTC will stay active if it is
set to operate from the 32kHz oscillator. The MPU is not operative in this
mode. When set, this bit overrides the individual control bits that otherwise
control power consumption.
MISCtl0.6 –
MISCtl0.5 –
MISCtl0.4 –
MISCtl0.3 –
MISCtl0.2 –
MISCtl0.1 SLPBK UART loop back testing mode.
MISCtl0.0 SSEL Serial port pins select.
73S1217F Data Sheet DS_1217F_002
Miscellaneous Control Register 1 (MISCtl1): 0xFFF2 Å 0x10
Table 16: The MISCtl1 Register
MSB LSB
– – FRPEN FLSH66 – ANAPEN USBPEN USBCON
Bit Symbol Function
MISCtl1.7 –
MISCtl1.6 –
MISCtl1.5 FRPEN
Flash Read Pulse enable (low). If FRPEN = 1, the Flash Read signal is
passed through with no change. When FRPEN = 0 a one-shot circuit that
shortens the Flash Read signal is enabled to save power. The Flash Read
pulse will shorten to 40 or 66ns (approximate based on the setting of the
FLSH66 bit) in duration, regardless of the MPU clock rate. For MPU clock
frequencies greater than 10MHz, this bit should be set high.
MISCtl1.4 FLSH66
When high, creates a 66ns Flash read pulse, otherwise creates a 40ns read
pulse when FRPEN is set.
MISCtl1.3 –
MISCtl1.2 ANAPEN*
0 = Enable the analog functions that generate VREF and bias current
functions. Setting high will turn off the VPD regulator and VCO/PLL
functions.
MISCtl1.1 USBPEN 0 = Enable the USB differential transceiver.
MISCtl1.0 USBCON USB pull-up resistor connect enable.
*Note: The ANAPEN bit should never be set under normal circumstances. Power down control should
only be initiated via use of the PWRDN bit in MISCtl0.
32 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 33
Master Clock Control Register (MCLKCtl): 0x8F Å 0x0A
Table 17: The MCLKCtl Register
MSB LSB
HSOEN KBEN SCEN USBEN 32KEN MCT.2 MCT.1 MCT.0
Bit Symbol Function
MCLKCtl.7 HSOEN
High-speed oscillator enable. When set = 1, disables the high-speed
crystal oscillator and VCO/PLL system. This bit is not changed when the
PWRDN bit is set but the oscillator/VCO/PLL is disabled. The HSOEN bit
should never be set under normal circumstances. Power down control
should only be initiated via use of the PWRDN bit in MISCtl0.
MCLKCtl.6 KBEN
1 = Disable the keypad logic clock. This bit is not changed in PWRDN
mode but the function is disabled.
MCLKCtl.5 SCEN
1 = Disable the smart card logic clock. This bit is not changed in PWRDN
mode but the function is disabled. Interrupt logic for card insertion/removal
remains operable even with smart card clock disabled.
MCLKCtl.4 USBEN
1 = Disable the USB logic clock. This bit is not changed in PWRDN mode
but the function is disabled.
MCLKCtl.3 32KEN
1 = Disable the 32Khz oscillator. This function is not affected by PWRDN
mode. Note: This bit must be set if there is no 32KHz crystal. Some
internal clocks and circuits will not run if the oscillator is enabled and
no crystal is connected.
MCLKCtl.2 MCT.2 This value determines the ratio of the VCO frequency (MCLK) to the high-
speed crystal oscillator frequency such that:
MCLK = (MCount*2 + 4)*Fxtal. The default value is MCount = 2h such that
MCLK = (2*2 + 4)*12.00MHz = 96MHz.
MCLKCtl.1 MCT.1
MCLKCtl.0 MCT.0
73S1217F Data Sheet DS_1217F_002
Power Control Register 0 (PCON): 0x87 Å 0x00
The SMOD bit used for the baud rate generator is setup via this register.
Table 18: The PCON Register
MSB LSB
SMOD – – – GF1 GF0 STOP IDLE
Bit Symbol Function
PCON.7 SMOD If SM0D = 1, the baud rate is doubled.
PCON.6 –
PCON.5 –
PCON.4 –
PCON.3 GF1 General purpose flag 1.
PCON.2 GF0 General purpose flag 1.
PCON.1 STOP Sets CPU to Stop mode.
PCON.0 IDLE Sets CPU to Idle mode.
34 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 35
1.7.5 Interrupts
The 80515 core provides 10 interrupt sources with four priority levels. Each source has its own request
flag(s) located in a special function register (TCON, IRCON, and SCON). Each interrupt requested by the
corresponding flag can be individually enabled or disabled by the enable bits in SFRs IEN0, IEN1, and
IEN2. Some of the 10 sources are multiplexed in order to expand the number of interrupt sources.
These will be described in more detail in the respective sections.
External interrupts are the interrupts external to the 80515 core, i.e. signals that originate in other
parts of the 73S1217F, for example the USB interface, USR I/O, RTC, smart card interface, analog
comparators, etc. The external interrupt configuration is shown in Figure 9.
.
USR
Int
Ctl
USR
Int
Ctl
USR
Int
Ctl
SCInt
Wait Tim eout
Card Event
RxData
TX_Event
Tx_Sent
TX_Error
RX_Error
Card_Det
VCC_OK
CRDCtl
Vcc C TL
+
SCIE
VCC_TMR
RTC
USB
Anal og
Comp
KeyPad
I2C
USR
Int
Ctl
t0
t1
int0
int1
USR
Pads
USR0
USR7
USR6
USR5
USR4
USR3
USR2
USR1
INT2
INT3
INT
Pads
int2
int3
Serial
Ch 0
Serial
Ch 1
SerChan 0 int
SerChan 1 int
int4
INT5
Ctl
INT6
Ctl
int5
int6
+
During STOP, IDLE
when PWRDN bit is set
MPU
CORE
VD D _ Fa u l t
+
Delay
Clear PWRDN bit
PDMUXCtl
1
0
Figure 9: External Interrupt Configuration
73S1217F Data Sheet DS_1217F_002
1.7.5.1 Interrupt Overview
When an interrupt occurs, the MPU will vector to the predetermined address as shown in Table 32. Once
the interrupt service has begun, it can only be interrupted by a higher priority interrupt. The interrupt
service is terminated by a return from the RETI instruction. When an RETI is performed, the processor
will return to the instruction that would have been next when the interrupt occurred.
When the interrupt condition occurs, the processor will also indicate this by setting a flag bit. This bit is
set regardless of whether the interrupt is enabled or disabled. Each interrupt flag is sampled once per
machine cycle, then samples are polled by the hardware. If the sample indicates a pending interrupt
when the interrupt is enabled, then the interrupt request flag is set. On the next instruction cycle, the
interrupt will be acknowledged by hardware forcing an LCALL to the appropriate vector address.
Interrupt response will require a varying amount of time depending on the state of the MPU when the
interrupt occurs. If the MPU is performing an interrupt service with equal or greater priority, the new
interrupt will not be invoked. In other cases, the response time depends on the current instruction. The
fastest possible response to an interrupt is 7 machine cycles. This includes one machine cycle for
detecting the interrupt and six cycles to perform the LCALL.
1.7.5.2 Special Function Registers for Interrupts
Interrupt Enable 0 Register (IEN0): 0xA8 Å 0x00
Table 19: The IEN0 Register
MSB LSB
EAL WDT – ES0 ET1 EX1 ET0 EX0
Bit Symbol Function
IEN0.7 EAL EAL = 0 – disable all interrupts.
IEN0.6 WDT Not used for interrupt control.
IEN0.5 –
IEN0.4 ES0 ES0 = 0 – disable serial channel 0 interrupt.
IEN0.3 ET1 ET1 = 0 – disable timer 1 overflow interrupt.
IEN0.2 EX1 EX1 = 0 – disable external interrupt 1.
IEN0.1 ET0 ET0 = 0 – disable timer 0 overflow interrupt.
IEN0.0 EX0 EX0 = 0 – disable external interrupt 0.
36 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 37
Interrupt Enable 1 Register (IEN1): 0xB8 Å 0x00
Table 20: The IEN1 Register
MSB LSB
– SWDT EX6 EX5 EX4 EX3 EX2 –
Bit Symbol Function
IEN1.7 –
IEN1.6 SWDT Not used for interrupt control.
IEN1.5 EX6 EX6 = 0 – disable external interrupt 6.
IEN1.4 EX5 EX5 = 0 – disable external interrupt 5.
IEN1.3 EX4 EX4 = 0 – disable external interrupt 4.
IEN1.2 EX3 EX3 = 0 – disable external interrupt 3.
IEN1.1 EX2 EX2 = 0 – disable external interrupt 2.
IEN1.0 –
Interrupt Enable 2 Register (IEN2): 0x9A Å 0x00
Table 21: The IEN2 Register
MSB LSB
– – – – – – – ES1
Bit Symbol Function
IEN2.0 ES1 ES1 = 0 – disable serial channel interrupt.
73S1217F Data Sheet DS_1217F_002
Timer/Counter Control Register (TCON): 0x88 Å 0x00
Table 22: The TCON Register
MSB LSB
TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0
Bit Symbol Function
TCON.7 TF1 Timer 1 overflow flag.
TCON.6 TR1 Not used for interrupt control.
TCON.5 TF0 Timer 0 overflow flag.
TCON.4 TR0 Not used for interrupt control.
TCON.3 IE1 Interrupt 1 edge flag is set by hardware when the falling edge on external
interrupt int1 is observed. Cleared when an interrupt is processed.
TCON.2 IT1 Interrupt 1 type control bit. 1 selects falling edge and 0 selects low level for
input pin to cause an interrupt.
TCON.1 IE0 Interrupt 0 edge flag is set by hardware when the falling edge on external
interrupt int0 is observed. Cleared when an interrupt is processed.
TCON.0 IT0 Interrupt 0 type control bit. 1 selects falling edge and 0 sets low level for input
pin to cause interrupt.
Timer/Interrupt 2 Control Register (T2CON): 0xC8 Å 0x00
Table 23: The T2CON Register
MSB LSB
– I3FR I2FR – – – – –
Bit Symbol Function
T2CON.7 –
T2CON.6 I3FR
External interrupt 3 failing/rising edge flag.
I3FR = 0 external interrupt 3 negative transition active.
I3FR = 1 external interrupt 3 positive transition active.
T2CON.5 I2FR
External interrupt 3 failing/rising edge flag.
I2FR = 0 external interrupt 3 negative transition active.
I2FR = 1 external interrupt 3 positive transition active.
T2CON.4 –
T2CON.3 –
T2CON.2 –
T2CON.1 –
T2CON.0 –
38 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 39
Interrupt Request Register (IRCON): 0xC0 Å 0x00
Table 24: The IRCON Register
MSB LSB
– – EX6 IEX5 IEX4 IEX3 IEX2 –
Bit Symbol Function
IRCON.7 –
IRCON.6 –
IRCON.5 IEX6 External interrupt 6 flag.
IRCON.4 IEX5 External interrupt 5 flag.
IRCON.3 IEX4 External interrupt 4 flag.
IRCON.2 IEX3 External interrupt 3 flag.
IRCON.1 IEX2 External interrupt 2 flag.
IRCON.0 –
1.7.5.3 External Interrupts
The external interrupts (external to the CPU core) are connected as shown in Table 25. Interrupts with
multiple sources are OR’ed together and individual interrupt source control is provided in XRAM SFRs to
mask the individual interrupt sources and provide the corresponding interrupt flags. Multifunction USR
[7:0] pins control Interrupts 0 and 1. Dedicated external interrupt pins INT2 and INT3 control interrupts 2
and 3. The polarity of interrupts 2 and 3 is programmable in the MPU. Interrupts 4, 5 and 6 have multiple
peripheral sources and are multiplexed to one of these three interrupts. The peripheral functions will be
described in subsequent sections. Generic 80515 MPU literature states that interrupts 4 through 6 are
defined as rising edge sensitive. Thus, the hardware signals attached to interrupts 4, 5 and 6 are
converted to rising edge level by the hardware.
SFR (special function register) enable bits must be set to permit any of these interrupts to occur.
Likewise, each interrupt has its own flag bit that is set by the interrupt hardware and is reset automatically
by the MPU interrupt handler.
Table 25: External MPU Interrupts
External
Interrupt Connection Polarity Flag Reset
0 USR I/O High Priority see USRIntCtlx Automatic
1 USR I/O Low Priority see USRIntCtlx Automatic
2 External Interrupt Pin INT2 Edge selectable Automatic
3 External Interrupt Pin INT3 Edge selectable Automatic
4 Smart Card Interrupts N/A Automatic
5 USB, RTC and Keypad N/A Automatic
6 I2C, VDD_Fault, Analog Comp N/A Automatic
Note: Interrupts 4, 5 and 6 have multiple interrupt sources and the flag bits are cleared upon reading of
the corresponding register. To prevent any interrupts from being ignored, the register containing multiple
interrupt flags should be stored temporary to allow each interrupt flag to be tested separately to see which
interrupt(s) is/are pending.
73S1217F Data Sheet DS_1217F_002
Table 26: Control Bits for External Interrupts
Enable Bit Description Flag Bit Description
EX0 Enable external interrupt 0 IE0 External interrupt 0 flag
EX1 Enable external interrupt 1 IE1 External interrupt 1 flag
EX2 Enable external interrupt 2 IEX2 External interrupt 2 flag
EX3 Enable external interrupt 3 IEX3 External interrupt 3 flag
EX4 Enable external interrupt 4 IEX4 External interrupt 4 flag
EX5 Enable external interrupt 5 IEX5 External interrupt 5 flag
EX6 Enable external interrupt 6 IEX6 External interrupt 6 flag
1.7.5.4 Power Down Interrupt Logic
The 73S1217F contains special interrupt logic to allow INT0 to wake up the CPU from a power down
(CPU STOP) state. See the Power Control Modes section for details.
1.7.5.5 Interrupt Priority Level Structure
All interrupt sources are combined in groups, as shown in Table 27.
Table 27: Priority Level Groups
Group
0 External interrupt 0 Serial channel 1 interrupt
1 Timer 0 interrupt – External interrupt 2
2 External interrupt 1 – External interrupt 3
3 Timer 1 interrupt – External interrupt 4
4 Serial channel 0 interrupt – External interrupt 5
5 – – External interrupt 6
Each group of interrupt sources can be programmed individually to one of four priority levels by setting or
clearing one bit in the special function register IP0 and one in IP1. If requests of the same priority level
are received simultaneously, an internal polling sequence as per Table 31 determines which request is
serviced first.
IEN enable bits must be set to permit any of these interrupts to occur. Likewise, each interrupt has its
own flag bit that is set by the interrupt hardware and is reset automatically by the MPU interrupt handler.
Interrupt Priority 0 Register (IP0): 0xA9 Å 0x00
Table 28: The IP0 Register
MSB LSB
– WDTS IP0.5 IP0.4 IP0.3 IP0.2 IP0.1 IP0.0
Note: WDTS is not used for interrupt controls.
40 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 41
Interrupt Priority 1 Register (IP1): 0xB9 Å 0x00
Table 29: The IP1 Register
MSB LSB
– – IP1.5 IP1.4 IP1.3 IP1.2 IP1.1 IP1.0
Table 30: Priority Levels
IP1.x IP0.x Priority Level
0 0 Level0 (lowest)
0 1 Level1
1 0 Level2
1 1 Level3 (highest)
Table 31: Interrupt Polling Sequence
External interrupt 0
Polling sequence
Serial channel 1 interrupt
Timer 0 interrupt
External interrupt 2
External interrupt 1
External interrupt 3
Timer 1 interrupt
Serial channel 0 interrupt
External interrupt 4
External interrupt 5
External interrupt 6
1.7.5.6 Interrupt Sources and Vectors
Table 32 shows the interrupts with their associated flags and vector addresses.
Table 32: Interrupt Vectors
Interrupt Request Flag Description Interrupt Vector Address
N/A Chip Reset 0x0000
IE0 External interrupt 0 0x0003
TF0 Timer 0 interrupt 0x000B
IE1 External interrupt 1 0x0013
TF1 Timer 1 interrupt 0x001B
RI0/TI0 Serial channel 0
interrupt
0x0023
RI1/TI1 Serial channel 1
interrupt
0x0083
IEX2 External interrupt 2 0x004B
IEX3 External interrupt 3 0x0053
IEX4 External interrupt 4 0x005B
IEX5 External interrupt 5 0x0063
IEX6 External interrupt 6 0x006B
73S1217F Data Sheet DS_1217F_002
1.7.6 UART
The 80515 core of the 73S1217F includes two separate UARTs that can be programmed to communicate
with a host. The 73S1217F can only connect one UART at a time since there is only one set of TX and
Rx pins. The MISCtl0 register is used to select which UART is connected to the TX and RX pins. Each
UART has a different set of operating modes that the user can select according to their needs. The
UART is a dedicated 2-wire serial interface, which can communicate with an external host processor at
up to 115,200 bits/s. The TX and RX pins operate at the VDD supply voltage levels and should never
exceed 3.6V. The operation of each pin is as follows:
RX: Serial input data is applied at this pin. Conforming to RS-232 standard, the bytes are input LSB first.
The voltage applied at RX must not exceed 3.6V.
TX: This pin is used to output the serial data. The bytes are output LSB first.
The 73S1217F has several UART-related read/write registers. All UART transfers are programmable for
parity enable, parity select, 2 stop bits/1 stop bit and XON/XOFF options for variable communication baud
rates from 300 to 115200 bps. Table 47 shows the selectable UART operation modes and Table 48
shows how the baud rates are calculated.
Table 33: UART Modes
UART 0 UART 1
Mode 0 N/A Start bit, 8 data bits, parity, stop bit, variable
baud rate (internal baud rate generator)
Mode 1
Start bit, 8 data bits, stop bit, variable
baud rate (internal baud rate generator
or timer 1)
Start bit, 8 data bits, stop bit, variable baud
rate (internal baud rate generator)
Mode 2 Start bit, 8 data bits, parity, stop bit,
fixed baud rate 1/32 or 1/64 of fCKMPU N/A
Mode 3
Start bit, 8 data bits, parity, stop bit,
variable baud rate (internal baud rate
generator or timer 1)
N/A
Note: Parity of serial data is available through the P flag of the accumulator. Seven-bit serial modes with
parity, such as those used by the FLAG protocol, can be simulated by setting and reading bit 7 of 8-bit
output data. Seven-bit serial modes without parity can be simulated by setting bit 7 to a constant 1.8-bit
serial modes with parity can be simulated by setting and reading the 9th bit, using the control bits
S0CON3 and S1CON3 in the S0CON and S1CON SFRs.
Table 34: Baud Rate Generation
Using Timer 1 Using Internal Baud Rate Generator
Serial Interface 0 2smod * fCKMPU/ (384 * (256-TH1)) 2smod * fCKMPU/(64 * (210-S0REL))
Serial Interface 1 N/A fCKMPU/(32 * (210-S1REL))
Note: S0REL (9:0) and S1REL (9:0) are 10-bit values derived by combining bits from the respective timer
reload registers SxRELH (bits 1:0) and SxRELL (bits 7:0). TH1 is the high byte of timer 1. The SMOD bit
is located in the PCON SFR.
42 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 43
Power Control Register 0 (PCON): 0x87 Å 0x00
The SMOD bit used for the baud rate generator is set up via this register.
Table 35: The PCON Register
MSB LSB
SMOD – – – GF1 GF0 STOP IDLE
Bit Symbol Function
PCON.7 SMOD If SM0D = 1, the baud rate is doubled.
PCON.6 –
PCON.5 –
PCON.4 –
PCON.3 GF1 General purpose flag 1.
PCON.2 GF0 General purpose flag 1.
PCON.1 STOP Sets CPU to Stop mode.
PCON.0 IDLE Sets CPU to Idle mode.
Baud Rate Control Register 0 (BRCON): 0xD8 Å 0x00
The BSEL bit used to enable the baud rate generator is set up via this register.
Table 36: The BRCON Register
MSB LSB
BSEL – – – – – – –
Bit Symbol Function
BRCON.7 BSEL
If BSEL = 0, the baud rate is derived using timer 1. If BSEL = 1
the baud rate generator circuit is used.
BRCON.6 –
BRCON.5 – .
BRCON.4 –
BRCON.3 –
BRCON.2 –
BRCON.1 –
BRCON.0 –
73S1217F Data Sheet DS_1217F_002
Miscellaneous Control Register 0 (MISCtl0): 0xFFF1 Å 0x00
Transmit and receive (TX and RX) pin selection and loop back test configuration are set up via this register.
Table 37: The MISCtl0 Register
MSB LSB
PWRDN – – – – – SLPBK SSEL
Bit Symbol Function
MISCtl0.7 PWRDN This bit places the 73S1217F into a power down state.
MISCtl0.6 –
MISCtl0.5 –
MISCtl0.4 –
MISCtl0.3 –
MISCtl0.2 –
MISCtl0.1 SLPBK
1 = UART loop back testing mode. The pins TXD and RXD are to be
connected together externally (with SLPBK =1) and therefore:
SLPBK SSEL Mode
0 0 normal using Serial_0
0 1 normal using Serial_1
1 0 Serial_0 TX feeds Serial_1 RX
1 1 Serial_1 TX feeds Serial_0 RX
MISCtl0.0 SSEL
Selects either Serial_1 if set =1 or Serial_0 if set = 0 to be connected to
RXD and TXD pins.
1.7.6.1 Serial Interface 0
The Serial Interface 0 can operate in four modes:
• Mode 0
Pin RX serves as input and output. TX outputs the shift clock. Eight bits are transmitted with the LSB
first. The baud rate is fixed at 1/12 of the crystal frequency. Reception is initialized in Mode 0 by setting
the flags in S0CON as follows: RI0 = 0 and REN0 = 1. In other modes, a start bit when REN0 = 1 starts
receiving serial data.
• Mode 1
Pin RX serves as input, and TX serves as serial output. No external shift clock is used, 10 bits are
transmitted: a start bit (always 0), 8 data bits (LSB first), and a stop bit (always 1). On receive, a start bit
synchronizes the transmission, 8 data bits are available by reading S0BUF, and stop bit sets the flag
RB80 in the Special Function Register S0CON. In mode 1 either internal baud rate generator or timer 1
can be use to specify baud rate.
• Mode 2
This mode is similar to Mode 1, with two differences. The baud rate is fixed at 1/32 or 1/64 of oscillator
frequency and 11 bits are transmitted or received: a start bit (0), 8 data bits (LSB first), a programmable
9th bit, and a stop bit (1). The 9th bit can be used to control the parity of the serial interface: at
transmission, bit TB80 in S0CON is output as the 9th bit, and at receive, the 9th bit affects RB80 in
Special Function Register S0CON.
• Mode 3
The only difference between Mode 2 and Mode 3 is that in Mode 3 either internal baud rate generator or
timer 1 can be use to specify baud rate.
The S0BUF register is used to read/write data to/from the serial 0 interface.
Serial Interface 0 Control Register (S0CON): 0x9B Å 0x00
44 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 45
Transmit and receive data are transferred via this register.
Table 38: The S0CON Register
MSB LSB
SM0 SM1 SM20 REN0 TB80 RB80 TI0 RI0
Bit Symbol Function
S0CON.7 SM0 These two bits set the UART0 mode:
Mode Description SM0 SM1
0 N/A 0 0
1 8-bit UART 0 1
2 9-bit UART 1 0
3 9-bit UART 1 1
S0CON.6 SM1
S0CON.5 SM20 Enables the inter-processor communication feature.
S0CON.4 REN0 If set, enables serial reception. Cleared by software to disable reception.
S0CON.3 TB80 The 9th transmitted data bit in Modes 2 and 3. Set or cleared by the MPU,
depending on the function it performs (parity check, multiprocessor
communication etc.).
S0CON.2 RB80 In Modes 2 and 3 it is the 9th data bit received. In Mode 1, if SM20 is 0,
RB80 is the stop bit. In Mode 0 this bit is not used. Must be cleared by
software.
S0CON.1 TI0 Transmit interrupt flag, set by hardware after completion of a serial transfer.
Must be cleared by software.
S0CON.0 RI0 Receive interrupt flag, set by hardware after completion of a serial
reception. Must be cleared by software.
1.7.6.2 Serial Interface 1
The Serial Interface 1 can operate in 2 modes:
• Mode A
This mode is similar to Mode 2 and 3 of Serial interface 0, 11 bits are transmitted or received: a start
bit (0), 8 data bits (LSB first), a programmable 9th bit, and a stop bit (1). The 9th bit can be used to
control the parity of the serial interface: at transmission, bit TB81 in S1CON is outputted as the 9th
bit, and at receive, the 9th bit affects RB81 in Special Function Register S1CON. The only difference
between Mode 3 and A is that in Mode A only the internal baud rate generator can be use to specify
baud rate.
• Mode B
This mode is similar to Mode 1 of Serial interface 0. Pin RX serves as input, and TX serves as serial
output. No external shift clock is used, 10 bits are transmitted: a start bit (always 0), 8 data bits (LSB
first), and a stop bit (always 1). On receive, a start bit synchronizes the transmission, 8 data bits are
available by reading S1BUF, and stop bit sets the flag RB81 in the Special Function Register
S1CON. In mode 1, the internal baud rate generator is use to specify the baud rate.
The S1BUF register is used to read/write data to/from the serial 1 interface.
73S1217F Data Sheet DS_1217F_002
Serial Interface Control Register (S1CON): 0x9B Å 0x00
The function of the serial port depends on the setting of the Serial Port Control Register S1CON.
Table 39: The S1CON Register
MSB LSB
SM – SM21 REN1 TB81 RB81 TI1 RI1
Bit Symbol Function
S1CON.7 SM Sets the UART operation mode.
SM Mode Description Baud Rate
0 A 9-bit UART variable
1 B 8-bit UART variable
S1CON.6 –
S1CON.5 SM21 Enables the inter-processor communication feature.
S1CON.4 REN1 If set, enables serial reception. Cleared by software to disable
reception.
S1CON.3 TB81 The 9th transmitted data bit in Mode A. Set or cleared by the MPU,
depending on the function it performs (parity check, multiprocessor
communication etc.).
S1CON.2 RB81 In Mode B, if sm21 is 0, rb81 is the stop bit. Must be cleared by
software.
S1CON.1 TI1 Transmit interrupt flag, set by hardware after completion of a serial
transfer. Must be cleared by software.
S1CON.0 RI1 Receive interrupt flag, set by hardware after completion of a serial
reception. Must be cleared by software.
Multiprocessor operation mode: The feature of receiving 9 bits in Modes 2 and 3 of Serial Interface 0
or in Mode A of Serial Interface 1 can be used for multiprocessor communication. In this case, the slave
processors have bit SM20 in S0CON or SM21 in S1CON set to 1. When the master processor outputs
slave’s address, it sets the 9th bit to 1, causing a serial port receive interrupt in all the slaves. The slave
processors compare the received byte with their network address. If there is a match, the addressed
slave will clear SM20 or SM21 and receive the rest of the message, while other slaves will leave the
SM20 or SM21 bit unaffected and ignore this message. After addressing the slave, the host will output
the rest of the message with the 9th bit set to 0, so no serial port receive interrupt will be generated in
unselected slaves.
46 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 47
1.7.7 Timers and Counters
The 80515 has two 16-bit timer/counter registers: Timer 0 and Timer 1. These registers can be
configured for counter or timer operations.
In timer mode, the register is incremented every machine cycle, meaning that it counts up after every 12
periods of the MPU clock signal.
In counter mode, the register is incremented when the falling edge is observed at the corresponding input
signal T0 or T1 (T0 and T1 are the timer gating inputs derived from USR[0:7] pins, see the User (USR)
Ports section). Since it takes 2 machine cycles to recognize a 1-to-0 event, the maximum input count
rate is 1/2 of the oscillator frequency. There are no restrictions on the duty cycle, however to ensure
proper recognition of 0 or 1 state, an input should be stable for at least 1 machine cycle.
Four operating modes can be selected for Timer 0 and Timer 1. Two Special Function Registers (TMOD
and TCON) are used to select the appropriate mode.
The Timer 0 load registers are designated as TL0 and TH0 and the Timer 1 load registers are designated
as TL1 and TH1.
Timer/Counter Mode Control Register (TMOD): 0x89 Å 0x00
Table 40: The TMOD Register
MSB LSB
GATE C/T M1 M0 GATE C/T M1 M0
Timer 1 Timer 0
Bits TR1 and TR0 in the TCON register start their associated timers when set.
Bit Symbol Function
TMOD.7
TMOD.3
GATE If set, enables external gate control (USR pin(s) connected to T0 or T1
for Counter 0 or 1, respectively). When T0 or T1 is high, and TRx bit is
set (see the TCON register), a counter is incremented every falling edge
on T0 or T1 input pin. If not set, the TRx bit controls the corresponding
timer.
TMOD.6
TMOD.2
C/T Selects Timer or Counter operation. When set to 1, the counter
operation is performed based on the falling edge of T0 or T1. When
cleared to 0, the corresponding register will function as a timer.
TMOD.5
TMOD.1
M1 Selects the mode for Timer/Counter 0 or Timer/Counter 1, as shown in
TMOD description.
TMOD.4
TMOD.0
M0 Selects the mode for Timer/Counter 0 or Timer/Counter 1, as shown in
TMOD description.
73S1217F Data Sheet DS_1217F_002
Table 41: Timers/Counters Mode Description
M1 M0 Mode Function
0 0 Mode 0 13-bit Counter/Timer.
0 1 Mode 1 16-bit Counter/Timer.
1 0 Mode 2 8-bit auto-reload Counter/Timer.
1 1 Mode 3 If Timer 1 M1 and M0 bits are set to 1, Timer 1 stops. If Timer 0 M1
and M0 bits are set to 1, Timer 0 acts as two independent 8-bit
Timer/Counters.
Mode 0
Putting either timer/counter into mode 0 configures it as an 8-bit timer/counter with a divide-by-32
prescaler. In this mode, the timer register is configured as a 13-bit register. As the count rolls over from
all 1’s to all 0’s, it sets the timer overflow flag TF0. The overflow flag TF0 then can be used to request an
interrupt. The counted input is enabled to the timer when TRx = 1 and either GATE = 0 or TX = 1 (setting
GATE = 1 allows the timer to be controlled by external input TX, to facilitate pulse width measurements).
TRx are control bits in the special function register TCON; GATE is in TMOD. The 13-bit register consists
of all 8 bits of TH1 and the lower 5 bits of TL0. The upper 3 bits of TL0 are indeterminate and should be
ignored. Setting the run flag (TRx) does not clear the registers. Mode 0 operation is the same for timer 0
as for timer 1.
Mode 1
Mode 1 is the same as mode 0, except that the timer register is run with all 16 bits.
Mode 2
Mode 2 configures the timer register as an 8-bit counter (TLx) with automatic reload. The overflow from
TLx not only sets TFx, but also reloads TLx with the contents of THx, which is preset by software. The
reload leaves THx unchanged.
Mode 3
Mode 3 has different effects on timer 0 and timer 1. Timer 1 in mode 3 simply holds its count. The effect
is the same as setting TR1 = 0. Timer 0 in mode 3 establishes TL0 and TH0 as two separate counters.
TL0 uses the timer 0 control bits: C/T, GATE, TR0, INT0, and TF0. TH0 is locked into a timer function
(counting machine cycles) and takes over the use of TR1 and TF1 from timer 1. Thus, TH0 now controls
the "timer 1" interrupt. Mode 3 is provided for applications requiring an extra 8-bit timer or counter. When
timer 0 is in mode 3, timer 1 can be turned on and off by switching it out of and into its own mode 3, or
can still be used by the serial channel as a baud rate generator, or in fact, in any application not requiring
an interrupt from timer 1 itself.
48 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 49
Timer/Counter Control Register (TCON): 0x88 Å 0x00
Table 42: The TCON Register
MSB LSB
TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0
Bit Symbol Function
TCON.7 TF1
The Timer 1 overflow flag is set by hardware when Timer 1 overflows.
This flag can be cleared by software and is automatically cleared when
an interrupt is processed.
TCON.6 TR1 Timer 1 Run control bit. If cleared, Timer 1 stops.
TCON.5 TF0
Timer 0 overflow flag set by hardware when Timer 0 overflows. This flag
can be cleared by software and is automatically cleared when an
interrupt is processed.
TCON.4 TR0 Timer 0 Run control bit. If cleared, Timer 0 stops.
TCON.3 IE1 External Interrupt 1 edge flag.
TCON.2 IT1 External interrupt 1 type control bit.
TCON.1 IE0 External Interrupt 0 edge flag.
TCON.0 IT0 External Interrupt 0 type control bit.
1.7.8 WD Timer (Software Watchdog Timer)
The software watchdog timer is a 16-bit counter that is incremented once every 24 or 384 clock cycles.
After a reset, the watchdog timer is disabled and all registers are set to zero. The watchdog consists of a
16-bit counter (WDT), a reload register (WDTREL), prescalers (by 2 and by 16), and control logic. Once
the watchdog starts, it cannot be stopped unless the internal reset signal becomes active.
Note: It is recommended to use the hardware watchdog timer instead of the software watchdog
timer (refer to the RTC description).
WD Timer Start Procedure: The WDT is started by setting the SWDT flag. When the WDT register
enters the state 0x7CFF, an asynchronous WDTS signal will become active. The signal WDTS sets bit 6
in the IP0 register and requests a reset state. WDTS is cleared either by the reset signal or by changing
the state of the WDT timer.
Refreshing the WD Timer: The watchdog timer must be refreshed regularly to prevent the reset request
signal from becoming active. This requirement imposes an obligation on the programmer to issue two
instructions. The first instruction sets WDT and the second instruction sets SWDT. The maximum delay
allowed between setting WDT and SWDT is 12 clock cycles. If this period has expired and SWDT has
not been set, WDT is automatically reset, otherwise the watchdog timer is reloaded with the content of
the WDTREL register and WDT is automatically reset.
73S1217F Data Sheet DS_1217F_002
Interrupt Enable 0 Register (IEN0): 0xA8 Å 0x00
Table 43: The IEN0 Register
MSB LSB
EAL WDT ET2 ES0 ET1 EX1 ET0 EX0
Bit Symbol Function
IEN0.7 EAL EAL = 0 – disable all interrupts.
IEN0.6 WDT Watchdog timer refresh flag.
Set to initiate a refresh of the watchdog timer. Must be set directly before
SWDT is set to prevent an unintentional refresh of the watchdog timer. WDT
is reset by hardware 12 clock cycles after it has been set.
IEN0.5 –
IEN0.4 ES0 ES0 = 0 – disable serial channel 0 interrupt.
IEN0.3 ET1 ET1 = 0 – disable timer 1 overflow interrupt.
IEN0.2 EX1 EX1 = 0 – disable external interrupt 1.
IEN0.1 ET0 ET0 = 0 – disable timer 0 overflow interrupt.
IEN0.0 EX0 EX0 = 0 – disable external interrupt 0.
Interrupt Enable 1 Register (IEN1): 0xB8 Å 0x00
Table 44: The IEN1 Register
MSB LSB
– SWDT EX6 EX5 EX4 EX3 EX2
Bit Symbol Function
IEN1.7 –
IEN1.6 SWDT Watchdog timer start/refresh flag. Set to activate/refresh the watchdog
timer. When directly set after setting WDT, a watchdog timer refresh is
performed. Bit SWDT is reset by the hardware 12 clock cycles after it has
been set.
IEN1.5 EX6 EX6 = 0 – disable external interrupt 6.
IEN1.4 EX5 EX5 = 0 – disable external interrupt 5.
IEN1.3 EX4 EX4 = 0 – disable external interrupt 4.
IEN1.2 EX3 EX3 = 0 – disable external interrupt 3.
IEN1.1 EX2 EX2 = 0 – disable external interrupt 2.
IEN1.0 –
50 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 51
Interrupt Priority 0 Register (IP0): 0xA9 Å 0x00
Table 45: The IP0 Register
MSB LSB
– WDTS IP0.5 IP0.4 IP0.3 IP0.2 IP0.1 IP0.0
Bit Symbol Function
IP0.6 WDTS Watchdog timer status flag. Set when the watchdog timer has expired.
The internal reset will be generated, but this bit will not be cleared by the
reset. This allows the user program to determine if the watchdog timer
caused the reset to occur and respond accordingly. Can be read and
cleared by software.
Note: The remaining bits in the IP0 register are not used for watchdog control.
Watchdog Timer Reload Register (WDTREL): 0x86 Å 0x00
Table 46: The WDTREL Register
MSB LSB
WDPSEL WDREL6 WDREL5 WDREL4 WDREL3 WDREL2 WDREL1 WDREL0
Bit Symbol Function
WDTREL.7 WDPSEL
Prescaler select bit. When set, the watchdog is clocked through an
additional divide-by-16 prescaler.
WDTREL.6
to
WDTREL.0
WDREL6-0
Seven bit reload value for the high-byte of the watchdog timer. This
value is loaded to the WDT when a refresh is triggered by a
consecutive setting of bits WDT and SWDT.
73S1217F Data Sheet DS_1217F_002
1.7.9 User (USR) Ports
The 73S1217F includes 8 pins of general purpose digital I/O (GPIO). On reset or power-up, all USR pins
are inputs until they are configured for the desired direction. The pins are configured and controlled by
the USR70 and UDIR70 SFRs. Each pin declared as USR can be configured independently as an input
or output with the bits of the UDIR70 register. Table 47 lists the direction registers and configurability
associated with each group of USR pins. USR pins 0 to 7 are multiple use pins that can be used for
general purpose I/O, external interrupts and timer control.
Table 48 shows the configuration for a USR pin through its associated bit in its UDIR register. Values
read from and written into the GPIO ports use the data registers USR70. Note: After reset, all USR pins
are defaulted as inputs and pulled up to VDD until any write to the corresponding UDIR register is
performed. This insures all USR pins are set to a known value until set by the firmware. Unused USR
pins can be set for output if unused and unconnected to prevent them from floating. Alternatively, unused
USR pins can be set for input and tied to ground or VDD.
Table 47: Direction Registers and Internal Resources for DIO Pin Groups
USR Pin Group Type
Direction
Register
Name
Direction
Register
(SFR)
Location
Data
Register
Name
Data
Register
(SFR)
Location
USR_0…USR_7 Multi-use UDIR70 0x91 [7:0] USR70 0x90 [7:0]
Table 48: UDIR Control Bit
UDIR Bit
0 1
USR Pin
Function output input
Four XRAM SFR registers (USRIntCtl1, USRIntCtl2, USRIntCtl3, and USRIntCtl4) control the use of the
USR [7:0] pins. Each of the USR [7:0] pins can be configured as GPIO or individually be assigned an
internal resource such as an interrupt or a timer/counter control. Each of the four registers contains two
3-bit configuration words named UxIS (where x corresponds to the USR pin). The control resources
selectable for the USR pins are listed in Table 74 through Table 78. If more than one input is connected
to the same resource, the resources are combined using a logical OR.
Table 49: Selectable Controls Using the UxIS Bits
UxIS Value Resource Selected for USRx Pin
0 None
1 None
2 T0 (counter0 gate/clock)
3 T1 (counter1 gate/clock)
4 Interrupt 0 rising edge/high level on USRx
5 Interrupt 1 rising edge/high level on USRx
6 Interrupt 0 falling edge/low level on USRx
7 Interrupt 1 falling edge/low level on USRx
Note: x denotes the corresponding USR pin. Interrupt edge or level control is assigned in the IT0 and IT1
bits in the TCON register.
52 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 53
External Interrupt Control Register (USRIntCtl1) : 0xFF90 Å 0x00
Table 50: The USRIntCtl1 Register
MSB LSB
– U1IS.6 U1IS.5 U1IS.4 – U0IS.2 U0IS.1 U0IS.0
External Interrupt Control Register (USRIntCtl2) : 0xFF91 Å 0x00
Table 51: The USRIntCtl2 Register
MSB LSB
– U3IS.6 U3IS.5 U3IS.4 – U2IS.2 U2IS.1 U2IS.0
External Interrupt Control Register (USRIntCtl3) : 0xFF92 Å 0x00
Table 52: The USRIntCtl3 Register
MSB LSB
– U5IS.6 U5IS.5 U5IS.4 – U4IS.2 U4IS.1 U4IS.0
External Interrupt Control Register (USRIntCtl4) : 0xFF93 Å 0x00
Table 53: The USRIntCtl4 Register
MSB LSB
– U7IS.6 U7IS.5 U7IS.4 – U6IS.2 U6IS.1 U6IS.0
73S1217F Data Sheet DS_1217F_002
1.7.10 Real-Time Clock with Hardware Watchdog (RTC)
Figure 10 shows the block diagram of the Real Time Clock. The RTC block uses the 32768Hz oscillator
signal and divider logic to produce 0.5-second time marks. The time marks are used to create interrupts
at intervals from 0.5 seconds to 8 seconds as selected by RTC Interval (RTCINV(2:0)). The 32768Hz
oscillator can be disabled but is intended to operate at all times and in all power consumption modes.
If a 32kHz crystal is not provided, the 32 kHz oscillator should be disabled and the RTC will operate from
MCLK (96MHz) divided by 2930 (refer to the oscillator and clock generation section). The clock
generated by the high speed oscillator will not yield exactly 32768 Hz, but a frequency of approximately
32764.505119 Hz. This yields a negative 106.6 PPM (1 / 9375) error with respect to 32768Hz. The RTC
circuit provides hardware to compensate for this error by providing an offset circuit that will adjust the
RTC counter.
ADDER
23 BIT TRIM VALUE
24 BIT ACCUMULATOR
SELECT
INTERRUPT
RATE
DIVIDER
1/2 Second
1 Second
2 Second
4 Second
8 Second
SELECT
COUNT
RATE
32 BIT COUNTER
OVERFLOW
SIGN
ADVANCE
R/W BUS
R/W BUS
RTC INT
R/W BUS
R/W BUS
R/W BUS
1/2
1
2
1/2
1
2
4
8
IF K overflow* sign=0, extra count
IF K overflow* sign=1, skip one count
1.024KHz
CLOCK
WATCH
DOG
TIMER
RESET
START
RTC ISR
WDT_TIMEOUT
1/2s TIMEOUT
RTCCLK
Figure 10: Real Time Clock Block Diagram
54 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 55
A 32-bit RTC counter is clocked by a selectable clock (1/2, 1, 2 second) to measure time. A trimming
function is provided such that a trim value is accumulated in a 24-bit accumulator at the same rate as the
RTC counter. The trim value is sign magnitude number. When the accumulator reaches overflow, it will
advance the counter one additional count if the trim value is positive, or prevent the counter from
advancing one count if the trim value is negative. This mechanism allows the RTC counter to be adjusted
to keep accurate time with a minimum 0.5 second resolution. When using the high speed oscillator, the
RTC counter wants to have an extra count added every 9375 seconds to keep the RTC counter at the
proper time. If the one second RTC counter rate is used, the RTC Trim value should be set to 0x6FD
(1789 decimal). This value is derived by taking the resolution of the 24 bit accumulator (2 ^ 24 =
16777216) and dividing this by 9375. This means the RTC accumulator will overflow every 9375 seconds
and will cause the RTC counter to advance by 2 when the accumulator overflow occurs, thus bringing the
RTC count to the proper time.
In addition to the basic software watchdog timer included in the 80515 MPU, an independent, robust,
fixed-duration, hardware watchdog timer (WDT) is included with the 73S1217F RTC. The Watch Dog
timer will give the MPU ½ second to respond to the RTC Interrupt. If the processor does not perform an
RTC Interrupt service, a full RESET will be performed. The RTC interrupt is connected to the core
interrupt “external interrupt 5” signal. The RTC interrupt must be enabled to obtain the watchdog timer
function. Note: if the power down mode doesn’t want the watchdog to wake up the MPU, the RTC
interrupt should be masked before entering the power down mode.
Real Time Clock Control Register (RTCCtl) : 0x FFB0 Å 0x00
Table 54: The RTCCtl Register
MSB LSB
– – RTCLD CTSEL.1 CTSEL.0 RINT.2 RINT.1 RINT.0
Bit Symbol Function
RTCCtl.7 –
RTCCtl.6 –
RTCCtl.5 RTCLD
When set, RTC parameters (RTC Count, RTC Accumulator, and RTC
Trim) are loaded at the next 32kHz clock positive edge.
RTCCtl.4 CTSEL.1
Selects the time value that is counted by the real time clock:
0x – 1 second (default)
10 – ½ second
11 – 2 seconds
RTCCtl.3 CTSEL.0
RTCCtl.2 RINT.2
RTC interrupt internal selection bits: (listed as bits 2,1,0)
100 – 0.5 second
0xx – 1 second (default)
101 – 2 seconds
110 – 4 seconds
111 – 8 seconds
RTCCtl.1 RINT.1
RTCCtl.0 RINT.0
73S1217F Data Sheet DS_1217F_002
There are 3 sets of registers to load the RTC 24-bit accumulator, 32-bit counter and 23-bit trim registers.
The registers are loaded when the RTCLD bit is set in RTCCtl.
Table 55: The 32-bit RTC Counter
Register RTCCnt3 RTCCnt2 RTCCnt1 RTCCnt0
RTCCnt[31:24] RTCCnt[23:16] RTCCnt[15:8] RTCCnt[7:0]
Table 56: The 24-bit RTC Accumulator
Register RTCACC2 RTCACC1 RTCACC0
RTCACC [23:16] RTCACC [15:8] RTCACC [7:0]
Table 57: The 24-bit RTC Trim (sign magnitude value)
Register RTCTrim2 RTCTrim1 RTCTrim0
RTCTrim [23:16] RTCTrim [15:8] RTCTrim [7:0]
External Interrupt Control Register (INT5Ctl): 0xFF94 Å 0x00
Table 58: The INT5Ctl Register
MSB LSB
PDMUX – RTCIEN RTCINT USBIEN USBINT KPIEN KPINT
Bit Symbol Function
INT5Ctl.7 PDMUX Power down multiplexer control.
INT5Ctl.6 –
INT5Ctl.5 RTCIEN
When set =1, enables RTC interrupt. Note: The RTC based watchdog will
be enabled when set.
INT5Ctl.4 RTCINT
When set =1, indicates interrupt from Real Time Clock function. Cleared
on read of register.
INT5Ctl.3 USBIEN USB interrupt enable.
INT5Ctl.2 USBINT USB interrupt flag.
INT5Ctl.1 KPIEN Keypad interrupt enable.
INT5Ctl.0 KPINT Keypad interrupt flag.
56 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 57
1.7.11 Analog Voltage Comparator
The 73S1217F includes a programmable comparator that is connected to the ANA_IN pin. The
comparator can be configured to trigger an interrupt if the input voltage rises above or falls below a
selectable threshold voltage. The comparator control register should not be modified when the analog
interrupt (ANAIEN bit in the INT6Ctl register) is enabled to guard against any false interrupt that might be
generated when modifying the threshold. The comparator has a built-in hysteresis to prevent the
comparator from repeatedly responding to low-amplitude noise. This hysteresis is approximately 20mV.
The maximum voltage on the ANA_IN pad should be less than 3 volts. An external resistor divider is
required for detecting voltages greater than 3.0 volts. Interrupt control is handled in the INT6Ctl register.
Analog Compare Control Register (ACOMP): 0xFFD0 Å 0x00
Table 59: The ACOMP Register
MSB LSB
ANALVL – ONCHG CPOL CMPEN 0 TSEL.1 TSEL.0
Bit Symbol Function
ACOMP.7 ANALVL
When read, indicates whether the input level is above or below the
threshold. This is a real time value and is not latched, so it may change
from the time of the interrupt trigger until read.
ACOMP.6 –
ACOMP.5 ONCHG
If set, the Ana_interrupt is invoked on any change above or below the
threshold, bit 4 is ignored.
ACOMP.4 CPOL
If set = 1, Ana_interrupt is invoked when signal rises above selected
threshold. If set = 0, Ana_interrupt is invoked when signal goes below
selected threshold (default).
ACOMP.3 CMPEN
Enables power to the analog comparator. 1= Enabled. 0 = Disabled
(default).
ACOMP.2 0 This value must be fixed at 0.
ACOMP.1 TSEL.1
Sets the voltage threshold for comparison to the voltage on pin ANA_IN.
Thresholds are as follows:
00 = 1.00V
01 = 1.24V
10 = 1.40V
11 = 1.50V
ACOMP.0 TSEL.0
73S1217F Data Sheet DS_1217F_002
External Interrupt Control Register (INT6Ctl): 0xFF95 Å 0x00
Table 60: The INT6Ctl Register
MSB LSB
– – VFTIEN VFTINT I2CIEN I2CINT ANIEN ANINT
Bit Symbol Function
INT6Ctl.7 –
INT6Ctl.6 –
INT6Ctl.5 VFTIEN VDD fault interrupt enable.
INT6Ctl.4 VFTINT VDD fault interrupt flag.
INT6Ctl.3 I2CIEN I2C interrupt enabled.
INT6Ctl.2 I2CINT I2C interrupt flag.
INT6Ctl.1 ANIEN
If ANIEN = 1 Analog Compare event interrupt is enabled. When
masked (ANIEN = 0), ANINT (bit 0) may be set, but no interrupt is
generated.
INT6Ctl.0 ANINT
(Read Only) Set when the selected ANA_IN signal changes with
respect to the selected threshold if Compare_Enable is asserted.
Cleared on read of register.
58 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 59
1.7.12 LED Driver
The 73S1217F provides a single dedicated output pin for driving an LED. The LED driver pin can be
configured as a current source that will pull to ground to drive an LED that is connected to VDD without
the need for an external current limiting resistor. This pin may be used as general purpose output with
the programmed pull-down current and a strong (CMOS) pull-up, if enabled. The analog block must be
enabled when this output is being used to drive the selected output current.
This pin may be used as an input with consideration of the programmed output current and level. The
register bit when read, indicates the state of the pin.
LED Control Register (LEDCtl): 0xFFF3 Å 0xFF
Table 61: The LEDCtl Register
MSB LSB
– LPUEN ISET.1 ISET.0 LEDD3 LEDD2 LEDD 1 LEDD0
Bit Symbol Function
LEDCtl.7 –
LEDCtl.6 LPUEN 0 = Pull-up is enabled for the LED pin.
LEDCtl.5 ISET.1
These two bits control the drive current (to ground) for the LED driver pin.
Current levels are:
00 = 0ma(off)
01 = 2ma
10 = 4ma
11 = 10ma
LEDCtl.4 ISET.0
LEDCtl.3 –
LEDCtl.2 –
LEDCtl.1 –
LEDCtl.0 LEDD0 Write data controls output level of pin LED0. Read will report level of pin LED0.
73S1217F Data Sheet DS_1217F_002
1.7.13 I2C Master Interface
The 73S1217F includes a dedicated fast mode, 400kHz I2C Master interface. The I2C interface can read
or write 1 or 2 bytes of data per data transfer frame. The MPU communicates with the interface through
six dedicated SFR registers:
• Device Address (DAR)
• Write Data (WDR)
• Secondary Write Data (SWDR)
• Read Data (RDR)
• Secondary Read Data (SRDR)
• Control and Status (CSR)
The DAR register is used to set up the slave address and specify if the transaction is a read or write
operation. The CSR register sets up, starts the transaction and reports any errors that may occur. When
the I2C transaction is complete, the I2C interrupt is reported via external interrupt 6. The I2C interrupt is
automatically de-asserted when a subsequent I2C transaction is started. The I2C interface uses a 400kHz
clock from the time-base circuits.
1.7.13.1 I2C Write Sequence
To write data on the I2C Master Bus, the 80515 has to program the following registers according to the
following sequence:
1. Write slave device address to Device Address register (DAR). The data contains 7 bits for the slave
device address and 1 bit of op-code. The op-code bit should be written with a ‘0’ to indicate a write
operation.
2. Write data to Write Data register (WDR). This data will be transferred to the slave device.
3. If writing 2 bytes, set bit 0 of the Control and Status register (CSR) and load the second data byte to
Secondary Write Data register (SWDR).
4. Set bit 1 of the CSR register to start I2C Master Bus.
5. Wait for I2C interrupt to be asserted. It indicates that the write on I2C Master Bus is done. Refer to
information about the INT6Ctl, IEN1 and IRCON register for masking and flag operation.
60 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 61
Figure 11 shows the timing of the I2C write mode.
1-7 8 9 10-17 18
ACK bit ACK bit STOP
condition
START
condition
SCL
SDA
LSBMSB LSBMSB
Device Address
[7:0] Write Data [7:0
I2C_Interrupt
Start I2C
(CSR bit1)
Transfer length
(CSR bit0)
1-7 8 9 10-17 18
ACK bit ACK bit STOP
condition
START
condition
SCL
SDA
LSBMSB LSBMSB
Device Address
[7:0] Write Data [7:0]
I2C_Interrupt
Start I2C
(CSR bit1)
Transfer length
(CSR bit0)
Secondary Write
Data [7:0]
ACK bit
19-26 27
LSBMSB
Figure 11: I2C Write Mode Operation
1.7.13.2 I2C Read Sequence
To read data on the I2C Master Bus from a slave device, the 80515 has to program the following registers
in this sequence:
1. Write slave device address to the Device Address register (DAR). The data contains 7 bits device
address and 1 bit of op-code. The op-code bit should be written with a 1.
2. Write control data to the Control and Status register (CSR). Write a 1 to bit 1 to start I2C Master Bus.
Also write a 1 to bit 0 if the Secondary Read Data register (SRDR) is to be captured from the I2C
Slave device.
3. Wait for I2C interrupt to be asserted. It indicates that the read operation on the I2C bus is done.
Refer to information about the INT6Ctl, IEN1 and IRCON registers for masking and flag operation.
4. Read data from the Read Data register (RDR).
5. Read data from Secondary Read Data register (SRDR) if bit 0 of Control and Status register (CSR) is
written with a 1.
73S1217F Data Sheet DS_1217F_002
62 Rev. 1.2
The following diagram shows the timing of the I2C read mode.
1-7 8 9 10-17 18
ACK bit No ACK bit STOP
condition
START
condition
SCL
SDA
LSBMSB LSBMSB
Device Address
[7:0] Read Data [7:0
I2c_Interrupt
Start I2C
(CSR bit1)
Transfer length
(CSR bit0)
1-7 8 9 10-17 18
ACK bit No ACK bit STOP
condition
START
condition
SCL
SDA
LSBMSB LSBMSB
Device Address
[7:0] Read Data [7:0]
I2c_Interrupt
Start I2C
(CSR bit1)
Transfer length
(CSR bit0)
Secondary Read
Data[7:0]
ACK bit
19-26 27
Figure 12: I2C Read Operation
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 63
Device Address Register (DAR): 0xFF80 Å 0x00
Table 62: The DAR Register
MSB LSB
DVADR.6 DVADR.5 DVADR.4 DVADR.3 DVADR.2 DVADR.1 DVADR.0 I2CRW
Bit Symbol Function
DAR.7
DVADR
[0:6] Slave device address.
DAR.6
DAR.5
DAR.4
DAR.3
DAR.2
DAR.1
DAR.0 I2CRW If set = 0, the transaction is a write operation. If set = 1, read.
I2C Write Data Register (WDR): 0XFF81 Å 0x00
Table 63: The WDR Register
MSB LSB
WDR.7 WDR.6 WDR.5 WDR.4 WDR.3 WDR.2 WDR.1 WDR.0
Bit Function
WDR.7
Data to be written to the I2C slave device.
WDR.6
WDR.5
WDR.4
WDR.3
WDR.2
WDR.1
WDR.0
73S1217F Data Sheet DS_1217F_002
I2C Secondary Write Data Register (SWDR): 0XFF82 Å 0x00
Table 64: The SWDR Register
MSB LSB
SWDR.7 SWDR.6 SWDR.5 SWDR.4 SWDR.3 SWDR.2 SWDR.1 SWDR.0
Bit Function
SWDR.7
Second Data byte to be written to the I2C slave device if bit 0 (I2CLEN) of the Control
and Status register (CSR) is set = 1.
SWDR.6
SWDR.5
SWDR.4
SWDR.3
SWDR.2
SWDR.1
SWDR.0
I2C Read Data Register (RDR): 0XFF83 Å 0x00
Table 65: The RDR Register
MSB LSB
RDR.7 RDR.6 RDR.5 RDR.4 RDR.3 RDR.2 RDR.1 RDR.0
Bit Function
RDR.7
Data read from the I2C slave device.
RDR.6
RDR.5
RDR.4
RDR.3
RDR.2
RDR.1
RDR.0
64 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 65
I2C Secondary Read Data Register (SRDR): 0XFF84 Å 0x00
Table 66: The SRDR Register
MSB LSB
SRDR.7 SRDR.6 SRDR.5 SRDR.4 SRDR.3 SRDR.2 SRDR.1 SRDR.0
Bit Function
SRDR.7
Second Data byte to be read from the I2C slave device if bit 0 (I2CLEN) of the Control
and Status register (CSR) is set = 1.
SRDR.6
SRDR.5
SRDR.4
SRDR.3
SRDR.2
SRDR.1
SRDR.0
I2C Control and Status Register (CSR): 0xFF85 Å 0x00
Table 67: The CSR Register
MSB LSB
– – – – – AKERR I2CST I2CLEN
Bit Symbol Function
CSR.7 –
CSR.6 –
CSR.5 –
CSR.4 –
CSR.3 –
CSR.2 AKERR
Set to 1 if acknowledge bit from Slave Device is not 0. Automatically reset
when the new bus transaction is started.
CSR.1 I2CST
Write a 1 to start I2C transaction. Automatically reset to 0 when the bus
transaction is done. This bit should be treated as a “busy” indicator on
reading. If it is high, the serial read/write operations are not completed and
no new address or data should be written.
CSR.0 I2CLEN Set to 1 for 2-byte read or write operations. Set to 0 for 1-byte operations.
73S1217F Data Sheet DS_1217F_002
External Interrupt Control Register (INT6Ctl): 0xFF95 Å 0x00
Table 68: The INT6Ctl Register
MSB LSB
– – VFTIEN VFTINT I2CIEN I2CINT ANIEN ANINT
Bit Symbol Function
INT6Ctl.7 –
INT6Ctl.6 –
INT6Ctl.5 VFTIEN VDD fault interrupt enable.
INT6Ctl.4 VFTINT VDD fault interrupt flag.
INT6Ctl.3 I2CIEN When set = 1, the I2C interrupt is enabled.
INT6Ctl.2 I2CINT
When set =1, the I2C transaction has completed. Cleared upon the start of
a subsequent I2C transaction.
INT6Ctl.1 ANIEN Analog compare interrupt enable.
INT6Ctl.0 ANINT Analog compare interrupt flag.
66 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 67
1.7.14 Keypad Interface
The 73S1217F supports a 30-button (6 row x 5 column) keypad (SPST Mechanical Contact Switches)
interface using 11 dedicated I/O pins. Figure 13 shows a simplified block diagram of the keypad
interface.
Scan
pull-up
Debouncing
Debounce Time
7 6 5 4 3 2 1 0
KSIZE Register
6
(1) KCOL is normally used as Read only
register. When hardware keyscan mode
is disabled, this register is to be used by
firmware to write the column data to
handle firmware scanning.
(2) 1kHz internal clock signal can be
selected either from the PLL (= from the
12MHz main clock), or from the 32kHz
system clock.
Key_Detect
Hardware Scan Enable
6
Column
Scan Order
5
Column Value
Row Value
Key_Detect_Enable
KORDERL / H Registers
76543210
76543210
76543210
KCOL Register(1)
76543210
KROW Register
Dividers 1kHz (2)
Scan
Time
KSCAN Register
76543210
76543210
KSTAT Register
Keypad Clock
Keypad Clock
VDD
pull-
up
COL4:0
ROW5:0
73S1217F
If smaller keypad than 6x 5 is to be
implemented, unused row inputs
should be connected to VDD. Unused
column outputs should be left
unconnected.
VDD
Figure 13: Simplified Keypad Block Diagram
There are five drive lines (outputs) corresponding to columns and six sense lines (inputs) corresponding
to rows. Hysteresis and pull-ups are provided on all inputs (rows), which eliminate the need for external
resistors in the keypad. Key scanning happens by asserting one of the 5 column lines low and looking for
a low on a sense line indicating that a key is pressed (switch closed) at the intersection of the drive/sense
(column/row) line in the keypad. Key detection is performed by hardware with an incorporated debounce
timer. Debouncing time is adjustable through the KSCAN register. Internal hardware circuitry performs
73S1217F Data Sheet DS_1217F_002
column scanning at an adjustable scanning rate and column scanning order through registers KSCAN
and KORDERL / KORDERH. Key scanning is disabled at reset and must be enabled by firmware. When
a valid key is detected, an interrupt is generated and the valid value of the pressed key is automatically
written into the KCOL and KROW registers. The keypad interface uses a 1kHz clock derived from either
the 32768Hz crystal or the 12MHz crystal. The selection of the clock source is made external to this
block, by setting bit 3 – 32KBEN – in the MCLKCtl register, see the oscillator and clock generation
section). Disabling the 32kHz oscillator will source the 1kHz clock from the 12MHz main oscillator and
divide it down. Setting bit 6 – KBEN – in the MCLKCtl register will enable keypad scanning and
debouncing. The keypad size can be adjusted within the KSIZE register.
Normal scanning is performed by hardware when the bit SCNEN is set at 1 in the KSTAT register. Figure
14 shows the flowchart of how the hardware scanning operates. In order to minimize power, scanning
does not occur until a key-press is detected. Once hardware key scanning is enabled, the hardware
drives all column outputs low and waits for a low to be detected on one of the inputs. When a low is
detected on any row, and before key scanning starts, the hardware checks that the low level is still
detected after a debounce time. The debounce time is defined by firmware in the KSCAN register (bits
7:0, DBTIME). Debounce times from 4ms to 256ms in 4ms increments are supported. If a key is not
pressed after the debounce time, the hardware will go back to looking for any input to be low. If a key is
confirmed to be pressed, key scanning begins.
Key scanning asserts one of the 5 drive lines (COL 4:0) low and looks for a low on a sense line indicating
that a key is pressed at the intersection of the drive/sense line in the keypad. After all sense lines have
been checked without a key-press being detected, the next column line is asserted. The time between
checking each sense line is the scan time and is defined by firmware in the KSCAN register (bits 0:1 –
SCTIME). Scan times from 1ms to 4ms are supported. Scanning order does not affect the scan time.
This scanning continues until the entire keypad is scanned. If only one key is pressed, a valid key is
detected. Simultaneous key presses are not considered as valid (If two keys are pressed, no key is
reported to firmware).
Possible scrambling of the column scan order is provided by means of the KORDERL and KORDERH
registers that define the order of column scanning. Values in these registers must be updated every time
a new keyboard scan order is desired. It is not possible to change the order of scanning the sense lines.
The column and row intersection for the detected valid key are stored in the KCOL and KROW registers.
When a valid key is detected, an interrupt is generated. Firmware can then read those registers to
determine which key had been pressed. After reading the KCOL and KROW registers, the firmware can
update the KORDERL / KORDERH registers if a new scan order is needed.
When the SCNEN bit is enabled in the KSTAT register, the KCOL and KROW registers are only updated
after a valid key has been identified. The hardware does not wait for the firmware to service the interrupt
in order to proceed with the key scanning process. Once the valid key (or invalid key – e.g. two keys
pressed) is detected, the hardware waits for the key to be released. Once the key is released, the
debounce timer is started. If the key is not still released after the debounce time, the debounce counter
starts again. After a key release, all columns will be driven low as before and the process will repeat
waiting for any key to be pressed.
When the SCNEN bit is disabled, all drive outputs are set to the value in the KCOL register. If firmware
clears the SCNEN bit in the middle of a key scan, the KCOL register contains the last value stored in
there which will then be reflected on the output pins.
A bypass mode is provided so that the firmware can do the key scanning manually (SCNEN bit must be
cleared). In bypass mode, the firmware writes/reads the Column and Row registers to perform the key
scanning.
68 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 69
Figure 14: Keypad Interface Flow Chart
Any
Row
Input = 0 ?
Keypad Initialization
All Column
Outputs = 0
Deboucing
Timer
Any Row
Input still = 0 ?
Yes
No
No
How Many
keys have been
detected?
Download of the key row and
column values in KROW and
KCOL registers
1 key
Keypad Interrupt
generation
Is (are)
the key(s)
released ?
(*)
Deboucing
Timer Yes
Is (are)
the key(s)
still released ?
(*)
No
No
KSCAN Register:
Debouncing Time
KSTAT Register:
Enable HW Scanning
Enable Keypad Interrupt
Keypad Scanning
KORDERL / H Registers:
Column Scan Order
KSTAT Register:
Key Detect Interrupt
Yes
KCOL Register:
Value of the valid key column
KROW Register:
Value of the valid key row
KSCAN Register:
Scanning Rate
KSIZE Register:
Keypad Size Definition
0 key
Register Used to Control the
hardware keypad interface
Register written by the hardware
keypad interface
More
than
1 key
KSCAN Register:
Debouncing Time
(*) Key release is cheked by looking for a low level on any row.
73S1217F Data Sheet DS_1217F_002
Keypad Column Register (KCOL): 0xD1 Å 0x1F
This register contains the value of the column of a key detected as valid by the hardware. In bypass
mode, this register firmware writes directly this register to carry out manual scanning.
Table 69: The KCOL Register
MSB LSB
– – – COL.4 COL.3 COL.2 COL.1 COL.0
Bit Symbol Function
KCOL.7 –
KCOL.6 –
KCOL.5 –
KCOL.4 COL.4
Drive lines bit mapped to corresponding with pins COL(4:0). When a key
is detected, firmware reads this register to determine column. In bypass
(S/W keyscan) mode, Firmware writes this register directly. 0x1E =
COL(0) low, all others high. 0x0F = COL(4) low, all others high. 0x1F =
COL(4:0) all high.
KCOL.3 COL.3
KCOL.2 COL.2
KCOL.1 COL.1
KCOL.0 COL.0
Keypad Row Register (KROW): 0xD2 Å 0x3F
This register contains the value of the row of a key detected as valid by the hardware. In bypass mode,
this register firmware reads directly this register to carry out manual detection.
Table 70: The KROW Register
MSB LSB
– – ROW.5 ROW.4 ROW.3 ROW.2 ROW.1 ROW.0
Bit Symbol Function
KROW.7 –
KROW.6 –
KROW.5 ROW.6
Sense lines bit mapped to correspond with pins ROW(5:0). When key
detected, firmware reads this register to determine row. In bypass mode,
firmware reads rows and has to determine if there was a key press or not.
0x3E = ROW(0) low, all others high. 0x1F = ROW(5) low, all others high.
0x3F = ROW(5:0) all high.
KROW.4 ROW.4
KROW.3 ROW.3
KROW.2 ROW.2
KROW.1 ROW.1
KROW.0 ROW.0
70 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 71
Keypad Scan Time Register (KSCAN): 0xD3 Å 0x00
This register contains the values of scanning time and debouncing time.
Table 71: The KSCAN Register
MSB LSB
DBTIME.5 DBTIME.4 DBTIME.3 DBTIME.2 DBTIME.1 DBTIME.0 SCTIME.1 SCTIME.0
Bit Symbol Function
KSCAN.7 DBTIME.5
De-bounce time in 4ms increments. 1 = 4ms de-bounce time, 0x3F =
252ms, 0x00 = 256ms. Key presses and key releases are de-bounced by
this amount of time.
KSCAN.6 DBTIME.4
KSCAN.5 DBTIME.3
KSCAN.4 DBTIME.2
KSCAN.3 DBTIME.1
KSCAN.2 DBTIME.0
KSCAN.1 SCTIME.1
Scan time in ms. 01 = 1ms, 02 = 2ms, 00 = 3ms, 00 = 4ms. Time between
checking each key during keypad scanning.
KSCAN.0 SCTIME.0
73S1217F Data Sheet DS_1217F_002
Keypad Control/Status Register (KSTAT): 0xD4 Å 0x00
This register is used to control the hardware keypad scanning and detection capabilities, as well as the
keypad interrupt control and status.
Table 72: The KSTAT Register
MSB LSB
– – – – KEYCLK HWSCEN KEYDET KYDTEN
Bit Symbol Function
KSTAT.7 –
KSTAT.6 –
KSTAT.5 –
KSTAT.4 –
KSTAT.3 KEYCLK The current state of the keyboard clock can be read from this bit.
KSTAT.2 HWSCEN
Hardware Scan Enable – When set, the hardware will perform automatic
key scanning. When cleared, the firmware must perform the key scanning
manually (bypass mode).
KSTAT.1 KEYDET
Key Detect – When HWSCEN = 1 this bit is set causing an interrupt that
indicates a valid key press was detected and the key location can be read
from the Keypad Column and Row registers. When HWSCEN = 0, this bit
is an interrupt which indicates a falling edge on any Row input if all Row
inputs had been high previously (note: multiple Key Detect interrupts may
occur in this case due to the keypad switch bouncing). In all cases, this bit
is cleared when read. When HWSCEN = 0 and the keypad interface 1kHz
clock is disabled, a key press will still set this bit and cause an interrupt.
KSTAT.0 KYDTEN
Key Detect Enable – When set, the KEYDET bit can cause an interrupt and
when cleared the KEYDET cannot cause an interrupt. KEYDET can still
get set even if the interrupt is not enabled.
72 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 73
Keypad Scan Time Register (KSIZE): 0xD5 Å 0x00
This register is not applicable when HWSCEN is not set. Unused row inputs should be connected to
VDD.
Table 73: The KSIZE Register
MSB LSB
– – ROWSIZ.2 ROWSIZ.1 ROWSIZ.0 COLSIZ.2 COLSIZ.1 COLSIZ.0
Bit Symbol Function
KSIZE.7 –
KSIZE.6 –
KSIZE.5 ROWSIZ.2
Defines the number of rows in the keypad. Maximum number is 6 given
the number of row pins on the package. Allows for a reduced keypad size
for scanning.
KSIZE.4 ROWSIZ.1
KSIZE.3 ROWSIZ.0
KSIZE.2 COLSIZ.2
Defines the number of columns in the keypad. Maximum number is 5
given the number of column pins on the package. Allows for a reduced
keypad size for scanning.
KSIZE.1 COLSIZ.1
KSIZE.0 COLSIZ.0
Keypad Column LS Scan Order Register (KORDERL): 0xD6 Å 0x00
In the KORDERL and KORDERH registers, Column Scan Order(14:0) is grouped into 5 sets of 3 bits
each. Each set determines which column (COL(4:0) pin) to activate by loading the column number into
the 3 bits. When in HW_Scan_Enable mode, the hardware will step through the sets from 1Col to 5Col
(up to the number of columns in Colsize) and scan the column defined in the 3 bits. To scan in sequential
order, set a counting pattern with 0 in set 0, and 1 in set 1,and 2 in set 2, and 3 in set 3, and 4 in set 4.
The firmware should update this as part of the interrupt service routine so that the new scan order is
loaded prior to the next key being pressed. For example, to scan COL(0) first, 1Col(2:0) should be
loaded with 000’b. To scan COL(4) fifth, 5Col(2:0) should be loaded with 100’b.
Table 74: The KORDERL Register
MSB LSB
3COL.1 3COL.0 2COL.2 2COL.1 2COL.0 1COL.2 1COL.1 1COL.0
Bit Symbol Function
KORDERL.7 3COL.1
Column to scan 3rd (lsb’s).
KORDERL.6 3COL.0
KORDERL.5 2COL.2
Column to scan 2nd. KORDERL.4 2COL.1
KORDERL.3 2COL.0
KORDERL.2 1COL.2
Column to scan 1st. KORDERL.1 1COL.1
KORDERL.0 1COL.0
73S1217F Data Sheet DS_1217F_002
Keypad Column MS Scan Order Register (KORDERH): 0xD7 Å 0x00
Table 75: The KORDERH Register
MSB LSB
– 5COL.2 5COL.1 5COL.0 4COL.2 4COL.1 4COL.0 3COL.2
Bit Symbol Function
KORDERH.7 –
KORDERH.6 5COL.2
Column to scan 5th. KORDERH.5 5COL.1
KORDERH.4 5COL.0
KORDERH.3 4COL.2
Column to scan 4th. KORDERH.2 4COL.1
KORDERH.1 4COL.0
KORDERH.0 3COL.2 Column to scan 3rd (msb’s).
External Interrupt Control Register (INT5Ctl): 0xFF94 Å 0x00
Table 76: The INT5Ctl Register
MSB LSB
PDMUX – RTCIEN RTCINT USBIEN USBINT KPIEN KPINT
Bit Symbol Function
INT5Ctl.7 PDMUX Power down multiplexer control.
INT5Ctl.6 –
INT5Ctl.5 RTCIEN When set =1, enables RTC interrupt.
INT5Ctl.4 RTCINT
When set =1, indicates interrupt from Real Time Clock function. Cleared
on read of register.
INT5Ctl.3 USBIEN USB interrupt enable.
INT5Ctl.2 USBINT USB interrupt flag.
INT5Ctl.1 KPIEN Enables Keypad interrupt when set = 1.
INT5Ctl.0 KPINT
This bit indicates the Keypad logic has set Key_Detect bit and a key
location may be read. Cleared on read of register.
1.7.15 Emulator Port
The emulator port, consisting of the pins E_RST, E_TCLK and E_RXTX, provides control of the MPU
through an external in-circuit emulator. The E_TBUS[3:0] pins, together with the E_ISYNC/BRKRQ, add
trace capability to the emulator. The emulator port is compatible with the ADM51 emulators
manufactured by Signum Systems.
If code trace capability is needed on this interface, 20pF capacitors (to ground) need to be added to allow
the trace function capability to run properly. These capacitors should be attached to the TBUS0:3 and
ISBR signals.
74 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 75
1.7.16 USB Interface
The 73S1217F provides a single interface, full speed -12Mbps - USB device port as per the Universal
Serial Bus Specification, Revision 2.0 (backward compatible with USB 1.1). USB circuitry gathers the
transceiver, the Serial Interface Engine (SIE), and the data buffers. An internal pull-up to VDD on D+
indicates that the device is a full speed device attached to the USB bus (allows full speed recognition by
the host without adding any external components). When using the USB interface, VDD must be between
3.0V – 3.6V in order to meet the USB VOH requirement. The interface is highly configurable under
firmware control. Control (Endpoint 0), Interrupt IN, Bulk IN and Bulk OUT transfers are supported. Four
endpoints are supported and are configured by firmware:
must be between
3.0V – 3.6V in order to meet the USB VOH requirement. The interface is highly configurable under
firmware control. Control (Endpoint 0), Interrupt IN, Bulk IN and Bulk OUT transfers are supported. Four
endpoints are supported and are configured by firmware:
• Endpoint 0, the default (Control) endpoint as required by the USB specification, is used to exchange
control and status information between the 73S1217F and the USB host.
• Endpoint 0, the default (Control) endpoint as required by the USB specification, is used to exchange
control and status information between the 73S1217F and the USB host.
• Bulk IN Endpoint #1 • Bulk IN Endpoint #1
• Bulk OUT Endpoint #1 • Bulk OUT Endpoint #1
• Interrupt IN Endpoint #2 • Interrupt IN Endpoint #2
• The USB block contains several FIFOs used for communication. • The USB block contains several FIFOs used for communication.
• There is a 128-byte RAM FIFO for each BULK endpoint. Maximum Bulk packet size is 64 bytes. • There is a 128-byte RAM FIFO for each BULK endpoint. Maximum Bulk packet size is 64 bytes.
• There is a 32-byte RAM FIFO for the interrupt endpoint. Maximum Interrupt packet size is 16 bytes. • There is a 32-byte RAM FIFO for the interrupt endpoint. Maximum Interrupt packet size is 16 bytes.
• There is a 16-byte RAM FIFO for the control endpoint. Maximum Control packet size is 16 bytes. • There is a 16-byte RAM FIFO for the control endpoint. Maximum Control packet size is 16 bytes.
Figure 15 shows the simplified block diagram of the USB interface. Figure 15 shows the simplified block diagram of the USB interface.
Transceivers
VDD
0
MISCtl1
D+
D-
USB Registers
16-Byte FIFO
Control Endpoint 0
128-Byte FIFO
Bulk IN Endpoint 1
128-Byte FIFO
Bulk OUT En dpoint 1
32-Byte FIFO
Interrupt IN Endpoint 2
48MHz
Clock
USB
Full Speed
12Mbps
Serial
Interface
Engine
1
MISCtl1
USBPEN
USBCon
Figure 15: USB Block Diagram
The USB interface consists of a Serial Interface Engine (SIE) that handles NRZI encoding/decoding, bit
stuffing / unstuffing, and CRC generation/checking. It also generates headers for packets to be
transmitted and decodes the headers of received packets. An analog transceiver interfaces with the
external USB bus. The USB interface hardware performs error checking and removes the USB protocol
fields from the incoming messages before passing the data to the firmware. The hardware also adds the
USB protocol fields to the outgoing messages coming from the firmware. The hardware implements
NRZI encoding/decoding, CRC checking/generation (both on data and token packets), device address
73S1217F Data Sheet DS_1217F_002
decoding, handshake packet generation, Data0/Data1 toggle synchronization, bit stuffing, bus idle
detection and other protocol generation/checking required in Chapter 8 of the USB specification.
The firmware is responsible for servicing and building the messages required under Chapter 9 of the USB
specification. Device configuration is stored in the firmware. Data received from the USB port is stored in
the appropriate IN FIFO that is read by the firmware and processed. The messages to be sent back to
the USB host are generated by firmware and placed back into the appropriate OUT FIFO. Stall/NAK
handshakes are generated as appropriate if the RAM is not available for another message from the USB
host. Suspend and resume modes are supported. All register/FIFO spaces are located in Data Memory
space. The FIFOs are dedicated for USB storage and are unused in a configuration that is not using
USB. All registers in the USB interface are located in external data memory address (XRAM) space
starting at address FC00’h.
1.7.16.1 USB Interface Implementation
The 73S1217F Application Programming Interface includes some dedicated software commands to
configure the USB interface, to get a status of each USB Endpoint, to stall / unstall portions of the USB,
and to send / receive data to / from each endpoint.
USB API entirely manages the USB circuitry, the USB registers and the FIFOs. Use of those commands
facilitates USB implementation, without dealing with low-level programming.
Miscellaneous Control Register 1 (MISCtl1): 0xFFF2 Å 0x10
Table 77: The MISCtl1 Register
MSB LSB
– – FRPEN FLSH66 – ANAPEN USBPEN USBCON
Bit Symbol Function
MISCtl1.7 –
MISCtl1.6 –
MISCtl1.5 FRPEN Flash Read Pulse enable.
MISCtl1.4 FLSH66 Flash Read Pulse.
MISCtl1.3 –
MISCtl1.2 ANAPEN Analog power enable.
MISCtl1.1 USBPEN 0 = Enable the USB differential transceiver.
MISCtl1.0 USBCON
1 = Connect pull-up resistor from VDD to D+. If connected, the USB host
will recognize the attachment of a USB device and begin enumeration.
Note: When using the USB on the 73S1217F, external 24 series resistors must be added to the D+ and
D- signals to provide the proper impedance matching on these pins.
The USB peripheral block is not able to support read or write operations to the USB SFR registers when
the MPU clock is running at MPU clock rates of 12MHz or greater. In order to properly communicate with
the USB SFR registers when running at these speeds, wait states must be inserted when addressing the
USB SFRs. The CKCON register allows wait states to be inserted when accessing these registers. The
proper settings for the number of wait states are shown in Error! Reference source not found..
When changing the MPU clock rate or the number of wait states, the USB connection
must be inactive. If the USB is active, then it must be inactivated before changing the
MPU clock or number of wait states. It can then be reconnected and re-enumerated.
Changing these parameters while the USB interface is active may cause communication errors on
the USB interface.
76 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 77
Clock Control Register (CKCON): 0x8E Å 0x01
Table 78: The CKCON Register
MSB LSB
– – – – – CKWT.2 CKWT.1 CKWT.0
Bit Symbol Function
CKCON.7 –
CKCON.6 –
CKCON.5 –
CKCON.4 –
CKCON.3 –
CKCON.2 CKWT.2
These three bits determine the number of wait states (machine cycles) to
insert when accessing the USB SFRs:
000 = 0 (not to be used).
001 = 1 wait state. Use when MPU clock is <12MHz.
010 = 2 wait states. Use when MPU clock is between 12 and 16MHz.
011 = 3 wait states. Use when MPU clock is 24MHz.
100 = 4 wait states.
101 = 5 wait states.
110 = 6 wait states.
111 = 7 wait states.
CKCON.1 CKWT.1
CKCON.0 CKWT.0
73S1217F Data Sheet DS_1217F_002
1.7.17 Smart Card Interface Function
The 73S1217F integrates one ISO-7816 (T=0, T=1) UART, one complete ICC electrical interface as well
as an external smart card interface to allow multiple smart cards to be connected using the Teridian
73S8010x family of interface devices. Figure 16 shows the simplified block diagram of the card circuitry
(UART + interfaces), with detail of dedicated XRAM registers.
Direct
Mode
Card
Insertion
Activation /
Deactivation
Sequencer
VCC
Buffer / Level
Shifter
RST
Buffer / Level
Shifter
CLK
I/O
Buffer / Level
Shifter
C4
Buffer / Level
Shifter
C8
Buffer / Level
Shifter
VCC Card
Generation
ICC Event
ICC Pwr_event
I/O ICC#1
I/OExt. ICC
CLK ICC
CLKExt. ICC
Card Clock
Management
7.2MHz
SCCLK/
SCSCLK
PRES
Serial
UART
Internal ICC Interface
SCSel
UART
T=0 T=1
RLength
STSTO
ATRMsB/LsB
BGT/EGT
SRXData
SRXCtl
STXData
STXCtl
SCPrtcol
SCCtl
FDReg
SByteCtl
SParCtl
Card Interrupt
Management
SCInt
SCIE
External ICC Interface
Bypass
Mode
XRAM Registers
VccCtl/
VccTMR
SCCLK/SCSCLK
Timers
2-Byte
Tx FIFO
2-Byte
Rx FIFO
Card and
Mode
Selection
TX
RX
SCDir
SCECtl
BGT0/1/2/3/
CWT0/1
SIO
SCLK
SCCLK
SCSCLK
Figure 16: Smart Card Interface Block Diagram
Card interrupts are managed through two dedicated registers SCIE (Interrupt Enable to define which
interrupt is enabled) and SCInt (Interrupt status). They allow the firmware to determine the source of an
interrupt, that can be a card insertion / removal, card power fault, or a transmission (TX) or reception (RX)
event / fault. It should be noted that even when card clock is disabled, an ICC interrupt can be generated
on a card insertion / removal to allow power saving modes. Card insertion / removal is generated from
the respective card switch detection inputs (whose polarity is programmable).
78 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 79
The built-in ICC Interface has a linear regulator (VCC generator) capable of driving 1.8, 3.0 and 5.0V smart
cards in accordance with the ISO 7816-3 and EMV4.0 standards. This converter uses the VP (5.5V
nominal) input supply source. See the power supply management section above for more detail.
Auxiliary I/O lines C4 and C8 are only provided for the built-in interface. If support for the auxiliary lines is
necessary for the external smart card interface, they need to be handled manually through the USR GPIO
pins. The external 73S8010x devices directly connect the I/O (SIO) and clock (SCLK) signals and control
is handled via the I2C interface.
Figure 17 shows how multiple 73S8010x devices can be connected to the 73S1217F.
73S1217F
73S8010
73S8010 SC3
SC2
73S8010 SC(n)
SC1
INT3
SDA
SCL
INT
SCL
SDA
INT
SCL
SDA
INT
SCL
SDA
SAD(0:2)
SAD(0:2)
SAD(0:2)
I/O
RST
CLK
C4
C8
VPC
PRES
PRES
PRES
IOUC
IOUC
IOUC
XTALIN
XTALIN
XTALIN
GND
PRES
VPC
PRES
SIO
SCLK
VCC
Figure 17: Smart Card Interface Block Diagram
73S1217F Data Sheet DS_1217F_002
1.7.17.1 ISO 7816 UART
An embedded ISO 7816 (hardware) UART is provided to control communications between a smart card
and the 73S1217F MPU. The UART can be shared between the one built-in ICC interface and the
external ICC interface. Selection of the desired interface is made via the SCSel register. Control of the
external interface is handled by the I2C interface for any external 73S8010x devices. The following is a
list of features for the ISO 7816 UART:
• Two-byte FIFO for temporary data storage on both TX and Rx data.
• Parity checking in T=0. This feature can be enabled/disabled by firmware. Parity error reporting to
firmware and Break generation to ICC can be controlled independently.
• Parity error generation for test purposes.
• Retransmission of last byte if ICC indicates T=0 parity error. This feature can be enabled/disabled by
firmware.
• Deletion of last byte received if ICC indicates T=0 parity error. This feature can be enabled/disabled
by firmware.
• CRC/LRC generation and checking. CRC/LRC is automatically inserted into T=1 data stream by the
hardware. This feature can be enabled/disabled by firmware.
• Support baud rates: 230000, 115200, 57600, 38400, 28800, 19200, 14400, 9600 under firmware
control (assuming 12MHz crystal) with various F/D settings.
• Firmware manages F/D. All F/D combinations are supported in which F/D is directly divisible by 31 or
32 (i.e. F/D is a multiple of either 31 or 32).
• Flexible ETU clock generation and control.
• Detection of convention (direct or indirect) character TS. This affects both polarity and order of bits in
byte. Convention can be overridden by firmware.
• Supports WTX Timeout with an expanded Wait Time Counter (28 bits).
• A Bypass Mode is provided to bypass the hardware UART in order for the software to emulate the
UART (for non-standard operating modes). In such a case, the I/O line value is reflected in SFR
SCCtl or SCECtl respectively for the built-in or external interfaces. This mode is appropriate for some
synchronous and non T=0 / T=1 cards.
The single integrated smart card UART is capable of supporting T=0 and T=1 cards in hardware,
therefore offloading the bit manipulation tasks from the firmware. The embedded firmware instructs the
hardware which smart card it should communicate with at any point in time. Firmware reconfigures the
UART as required when switching between smart cards. When the 73S1217F has transmitted a
message with an expected response, the firmware should not switch the UART to another smart card
until the first smart card has responded. If the smart card responds while another smart card is selected,
that first smart card’s response will be ignored.
80 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 81
1.7.17.2 Answer to Reset Processing
A card insertion event generates an interrupt to the firmware, which is then responsible for the
configuration of the electrical interface, the UART and activation of the card. The activation sequencer
goes through the power up sequence as defined in the ISO 7816-3 specification. An asynchronous
activation timing diagram is shown in Figure 18. After the card RST is de-asserted, the firmware instructs
the hardware to look for a TS byte that begins the ATR response. If a response is not provided within the
pre-programmed timeout period, an interrupt is generated and the firmware can then take appropriate
action, including instructing the 73S1217F to begin a deactivation sequence. Once commanded, the
deactivation sequencer goes through the power down sequence as defined in the ISO 7816-3
specification. If an ATR response is received, the hardware looks for a TS byte that determines
direct/inverse convention. The hardware handles the indirect convention conversion such that the
embedded firmware only receives direct convention. This feature can be disabled by firmware within the
SByteCtl register. Parity checking and break generation is performed on the TS byte unless disabled by
firmware. If during the card session, a card removal, over-current or other error event is detected, the
hardware will automatically perform the deactivation sequence and then generate an interrupt to the
firmware. The firmware can then perform any other error handling required for proper system operation.
Smart card RST, I/O and CLK, C4, C8 shall be low before the end of the deactivation sequence. Figure
19 shows the timing for a deactivation sequence.
VCCSEL
bits
VCC
VCCOK bit
RSTCRD bit
RST
CLK
IO
t1 t2 t3 t4 t5
tto
See Note
ATR starts
t4
SELSC
bits
t1: SELSC.1 bit set (selects internal ICC interface) and a non-zero value in VCCSEL bits (calling for
a value of Vcc of 1.8, 3.0, or 5.0 volts) will begin the activation sequence. t1 is the time for Vcc to rise
to acceptable level, declared as Vcc OK (bit VCCOK gets set). This time depends on filter capacitor
value and card Icc load.
tto: The time allowed for Vcc to rise to Vcc OK status after setting of the VCCSEL bits. This time is
generated by the VCCTMR counter. If Vcc OK is not set, (bit VCCOK) at this time, a deactivation will
be initiated. VCCSEL bits are not automatically cleared. The firmware must clear the VCCSEL bits
before starting a new activation.
t2: Time from VCCTmr timeout and VCC OK to IO reception (high), typically 2-3 CLK cycles if
RDYST = 0. If RDYST = 1, t2 starts when VCCOK = 1.
t3: Time from IO = high to CLK start, typically 2-3 CLK cycles.
t4: Time allowed for start of CLK to de-assertion of RST. Programmable by the RLength register.
t5: Time allowed for ATR timeout, set by the STSTO register.
Note: If the RSTCRD bit is set, RST is asserted (low). Upon clearing RSTCRD bit, RST will be
de-asserted after t4.
Figure 18: Asynchronous Activation Sequence Timing
73S1217F Data Sheet DS_1217F_002
82 Rev. 1.2
VCC
IO
RST
CLK
t1 t2
t3
t4
t5
Firmware sets
VCCSEL to 00
CMDVCCnB
t5 delay or
Card Event
t1: Time after either a “card event” occurs or firmware sets the VCCSela and VCCSelb bits to 0 (see
t5, VCCOff_tmr) occurs until RST is asserted low.
t2: Time after RST goes low until CLK stops.
t3: Time after CLK stops until IO goes low.
t4: Time after IO goes low until VCC is powered down.
t5: Delayed VCC off time (in ETUs per VCCOff_tmr bits). Only in effect due to firmware
deactivation.
Figure 19: Deactivation Sequence
1.7.17.3 Data Reception/Transmission
When a 12Mhz crystal is used, the smart card UART will generate a 3.69Mhz (default) clock to both
smart card interfaces. This will allow approximately 9600bps (1/ETU) communication during ATR (ISO
7816 default). As part of the PPS negotiation between the smart card and the reader, the firmware may
determine that the smart card parameters F and D may be changed. After this negotiation, the firmware
may change the ETU by writing to the SFR FDReg to adjust the ETU and CLK. The firmware may also
change the smart card clock frequency by writing to the SFR SCCLK (SCECLK for external interface).
Independent clock frequency control is provided to each smart card interface. Clock stop high or Clock
stop low is supported in asynchronous mode. Figure 20 shows the ETU and CLK control circuits. The
firmware determines when clock stop is supported by the smart card and when it is appropriate to go into
that mode (and when to come out of it). The smart card UART is clocked by the same clock is provided
to the selected smart card. The transition between smart card clocks is handled in hardware to eliminate
any glitches for the UART during switchover. The external smart card clock is not affected when
switching the UART to communicate with the internal smart card.
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 83
PLL
ETU Divider
12 bits
FI Decoder
DIV
by
2
ETUCLK
CLK
DIV
by
2
SCLK
Pre-Scaler
6 bits
Pre-Scaler
6 bits
F/D Register
SCCLK(5:0)
SCSCLK(5:0)
MSCLK
MSCLKE
MCLK =
96MHz
FDReg(3:0)
FDReg(7:4)
9926
1/744
3.69M
1/13
7.38M
7.38M
3.69M
7.38M
Defaults
in Italics
SCSel(3:2)
1/13
SYNC
CENTER
EDGE
Figure 20: Smart Card CLK and ETU Generation
There are two, two-byte FIFOs that are used to buffer transmit and receive data. During a T=0 processing, if
a parity error is detected by the 73S1217F during message reception, an error signal (BREAK) will be
generated to the smart card. The byte received will be discarded and the firmware notified of the error.
Break generation and receive byte dropping can be disabled under firmware control. During the
transmission of a byte, if an error signal (BREAK) is detected, the last byte is retransmitted again and the
firmware notified. Retransmission can be disabled by firmware. When a correct byte is received, an
interrupt is generated to the firmware, which then reads the byte from the receive FIFO. Receive overruns
are detected by the hardware and reported via an interrupt. During transmission of a message, the firmware
will write bytes into the transmit FIFO. The hardware will send them to the smart card. When the last byte of
a message has been written, the firmware will need to set the LASTTX bit in the STXCtl SFR. This will
cause the hardware to insert the CRC/LRC if in a T=1 protocol mode. CRC/LRC generation/checking is only
provided during T=1 processing. Firmware will need to instruct the smart function to go into receive mode
after this last transmit data byte if it expects a response from the smart card. At the end of the smart card
response, the firmware will put the interface back into transmit mode if appropriate.
The hardware can check for the following card-related timeouts:
• Character Waiting Time (CWT).
• Block Waiting Time (BWT).
• Initial Waiting Time (IWT).
The firmware will load the Wait Time registers with the appropriate value for the operating mode at the
appropriate time. Figure 21 shows the guard, block, wait and ATR time definitions. If a timeout occurs,
an interrupt will be generated and the firmware can take appropriate recovery steps. Support is provided
for adding additional guard times between characters using the Extra Guard Time register (EGT) and
between the last byte received by the 73S1217F and the first byte transmitted by the 73S1217F using the
Block Guard Time register (BGT). Other than the protocol checks described above, the firmware is
responsible for all protocol checking and error recovery.
73S1217F Data Sheet DS_1217F_002
> EGT
< WWT
CHAR 1 CHAR 2
CHAR
N+1
CHAR
N+2
CHAR
N+3
BLOCK1 BLOCK2
> BWT < CWT
RECEPTION
TRANSMISSION
T = 1 Mode
CHAR 1 CHAR 2 CHAR N
RST
TSTO(7:0) ATRTO(15:0)
VCC_OK
RLen(7:0)
CHAR 1 CHAR 2 CHAR N
ATR Timing Parameters
IWT(15:0)
BGT(4:0)
TX
T = 0 Mode
IO
EGT
(By seting Last_TXByte and
TX/RXB=0 during CHAR N,
RX mode will start after last
TX byte)
WWT is set by the value in the BWT registers.
Figure 21: Guard, Block, Wait and ATR Time Definitions
1.7.17.4 Bypass Mode
It is possible to bypass the smart card UART in order for the firmware to support non-T=0/T=1 smart
cards. This is called Bypass mode. In this mode the embedded firmware will communicate directly with
the selected smart card and drive I/O during transmit and read I/O during receive in order to communicate
with the smart card. In this mode, ATR processing is under firmware control. The firmware must
sequence the interface signals as required. Firmware must perform TS processing, parity checking,
break generation and CRC/LRC calculation (if required).
1.7.17.5 Synchronous Operation Mode
The 73S1217F supports synchronous operation. When sync mode is selected for either interface, the
CLK signal is generated by the ETU counter. The values in FDReg, SCCLK, and SCECLK must be set to
obtain the desired sync CLK rate. There is only one ETU counter and therefore, in sync mode, the
interface must be selected to obtain a smart card clock signal. In sync mode, input data is sampled on
the rise of CLK, and output data is changed on the fall of CLK.
Special Notes Regarding Synchronous Mode Operation
84 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 85
When the SCISYN or SCESNC bits (SPrtcol, bit 7, bit 5, respectively) are set, the selected smart card
interface operates in synchronous mode and there are changes in the definition and behavior of pertinent
register bits and associated circuitry. The following requirements are to be noted:
1. The source for the smart card clock (CLK or SCLK) is the ETU counter. Only the actively selected
interface can have a running synchronous clock. In contrast, an unselected interface may have a
running clock in the asynchronous mode of operation.
2. The control bits CLKLVL, SCLKLVL, CLKOFF, and SCLKOFF are functional in synchronous mode.
When the CLKOFF bit is set, it will not truncate either the logic low or logic high period when the (stop
at) level is of opposite polarity. The CLK/SCLK signal will complete a correct logic low or logic high
duty cycle before stopping at the selected level. The CLK “start” is a result of the falling edge of the
CLKOFF bit. Setting clock to run when it is stopped low will result in a half period of low before going
high. Setting clock to run when it is stopped high will result in the clock going low immediately and
then running at the selected rate with 50% duty cycle (within the limitations of the ETU divisor value).
3. The Rlen(7:0) is configured to count the falling edges of the ETU clock (CLK or SCLK) after it has
been loaded with a value from 1 to 255. A value of 0 disables the counting function and RLen
functions such as I/O source selection (I/O signal bypasses the FIFOs and is controlled by the
SCCLK/SCECLK SFRs). When the RLen counter reaches the “max” (loaded) value, it sets the
WAITTO interrupt (SCInt, bit 7), which is maskable via WTOIEN (SCIE, bit 7). I2CMODEIt must be
reloaded in order to start the counting/clocking process again. This allows the processor to select the
number of CLK cycles and hence, the number of bits to be read or written to/from the card.
4. The FIFO is not clocked by the first CLK (falling) edge resulting from a CLKOFF de-assertion (a clock
start event) when the CLK was stopped in the high state and RLen has been loaded but not yet
clocked.
5. The state of the pin IO or SIO is sampled on the rising edge of CLK/SCLK and stored in bit 5 of the
SCCtl/SCECtl register.
6. When Rlen = max or 0 and I2CMODE = 1 (STXCtl, b7), the IO or SIO signal is directly controlled by
the data and direction bits in the respective SCCtl and SCECtl register. The state of the data in the
TX FIFO is bypassed.
7. In the SPrtcol register, bit 6 (MODE9/8B) becomes active. When set, the RXData FIFO will read
nine-bit words with the state of the ninth bit being readable in SRXCtl, bit 7 (B9DAT). The RXDAV
interrupt will occur when the ninth bit has been clocked in (rising edge of CLK or SCLK).
8. Care must be taken to clear the RX and TX FIFOs at the start of any transaction. The user shall read
the RX FIFO until it indicates empty status. Reading the TX FIFO twice will reset the input byte
pointer and the next write to the TX FIFO will load the byte to the “first out” position. Note that the bit
pointer (serializer/deserializer) is reset to bit 0 on any change of the TX/RXD bit.
Special bits that are only active for sync mode include: SRXCtl, b7 “BIT9DAT”, SPrtcol b6 “MODE9/8B”,
STXCtl, b7 “I2CMODE”, and the definition of SCInt b7, which was “WAITTO”, becomes RLenINT
interrupt, and SCIE b7, which was “WTOIEN”, becomes RLenIEN.
73S1217F Data Sheet DS_1217F_002
VCC
VCCOK
RSTCRD
RST
CLK
IO
t1 t2
t3
t4
tto
VCCSEL
bits
t1: The time from setting VCCSEL bits until VCCOK = 1.
tto: The time from setting VCCSEL bits until VCCTMR times out. At t1 (if RDYST = 1) or tto (if RDYST = 0),
activation starts. It is suggested to have RDYST = 0 and use the VCCTMR interrupt to let MPU know when
sequence is starting.
t2: time from start of activation (no external indication) until IO goes into reception mode (= 1). This is
approximately 4 SCCLK (or SCECLK) clock cycles.
t3: minimum one half of ETU period.
t4: ETU period.
Note that in Sync mode, IO as input is sampled on the rising edge of CLK. IO changes on the falling edge of
CLK, either from the card or from the 73S1217F. The RST signal to the card is directly controlled by the
RSTCRD bit (non-inverted) via the MPU and is shown as an example of a possible RST pattern.
Figure 22: Synchronous Activation
IO reception on
RST
CLK
CLKOFF
CLKLVL
Rlength Interrupt
RLength Count
RLenght = 1
TX/RXB Mode bit
(TX = '1')
1. Clear CLKOFF after Card is in reception mode.
2. Set RST bit.
3. Interrupt is generated when Rlength counter is MAX.
4. Read and clear Interrupt.
5. Clear RST bit.
6. Toggle TX/RXB to reset bit counter.
7. Reload RLength Counter.
Count MAX
1
2
4
7
5
t1. CLK wll start at least 1/2 ETU after CLKOFF is set low
when CLKLVL = 0
t1
3
6
Figure 23: Example of Sync Mode Operation: Generating/Reading ATR Signals
86 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 87
RLength Count - was set for length of ATR
CLK
IO
RLength Interrupt
CLK Stop
CLK Stop Level
IO Bit
IODir Bit
TX/RX Mode Bit
TX = '1'
Data from Card -end of ATR Data from TX FIFO
RLength
Count MAX
1. Interrupt generated when Rlength counter is MAX.
2. Read and clear Interrupt.
3. Set CLK Stop and CLK Stop level high in Interrupt routine.
4. Set TX/RX Bit to TX mode.
5. Reload Rlength Counter.
6. Set IO Bit low and IODir = Output. Since Rlen=(MAX or 0) and TX/RX =1, IO pin is controlled by IO bit.
7. Clear CLK Stop and CLK Stop level.
Note: Data in TX fifo should not be Empty here.
START Bit
Synchronous Clock Start/Stop Mode style Start bit procedure. This procedure should be used to
generate the start bit insertion in Synchronous mode for Synchronous Clock Start/Stop Mode protocol.
RLen=0 Rlen=1
21
3
7
6
5
6
4
Figure 24: Creation of Synchronous Clock Start/Stop Mode Start Bit in Sync Mode
RLength Count
(Rlength = 9)
CLK
IO
RLength Interrupt
CLK Stop
CLK Stop Level
IO Bit
IODir Bit
TX/RX Mode Bit
TX = '1'
I2CMode = 1: Data to/from Card
I2CMode = 0: Data from TX fifo
I2CMode = 1:ACK Bit (to/from card)
I2CMode = 0: Data from TX fifo
RLength Count MAX
1. Interrupt generated when Rlength counter is MAX.
2. Read and clear Interrupt.
3. Set CLK Stop and CLK Stop level high, set IO Bit low and IODir = Output.
4. Set IO Bit High and IODir = Output.
5. Set TX/RX Bit to RX mode.
6. Reload Rlength Counter.
7. Clear CLK Stop and CLK Stop level.
STOP Bit
Synchronous Clock Start/Stop Mode Stop bit procedure. This procedure should be used to
generate the Stop bit in Synchronous Mode.
12
4
3
5
7
6
Min ½ ETU
Figure 25: Creation of Synchronous Clock Start/Stop Mode Stop Bit in Sync Mode
73S1217F Data Sheet DS_1217F_002
RLength Count
RLength = 9
CLK
IO
RLength Interrupt
RX data
TX/RX Mode Bit
TX = '1'
Data from Card
(Bit 8)
Data from Card
(Bit 1)
RLength Count MAX
Rlen=9
Protection Bit
(Bit 9)
RX FIFO
(Data from Card is ready for CPU read)
Protection Bit is ready for CPU read
Rlen=8 Rlen=0 Rlen =1
Protection Bit Data
(Bit 9)
1._ Interrupt generated
when Rlength counter is
Max
2._ Read and clear
Interrupt
3._ Reload RLength
counter
RLength Count
RLength = 9
RLength Count MAX
Rlen=9
Rlen=8
RLength Interrupt
CLK
CLK Stop
CLK Stop Level = 0
1._ Interrupt generated
when Rlength counter is Max
2._Stop CLK after the last
byte and protection bit
Stop CLK after receiving the last byte and protection bit.
Receive data in 9 bit mode
Figure 26: Operation of 9-bit Mode in Sync Mode
Synchronous card operation is broken down into three primary types. These are commonly referred to as
2-wire, 3-wire and I2C synchronous cards. Each card type requires different control and timing and
therefore requires different algorithms to access. Teridian has created an application note to provide
detailed algorithms for each card type. Refer to the application note titled “73S12xxF Synchronous Card
Design Application Note”.
88 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 89
1.7.17.6 Smart Card SFRs
Smart Card Select Register (SCSel): 0xFE00 Å 0x00
The Smart Card Select register is used to determine which smart card interface is using the ISO UART.
The internal Smart Card has integrated 7816-3 compliant sequencer circuitry to drive an external smart
card interface. The external smart card interface relies on 73S8010x parts to generate the ISO 7816-3
compatible signals and sequences. Multiple 73S8010x devices can be connected to the external smart
card interface.
Table 79: The SCSel Register
MSB LSB
– – – – SELSC.1 SELSC.0 BYPASS –
Bit Symbol Function
SCSel.7 –
SCSel.6 –
SCSel.5 –
SCSel.4 –
SCSel.3 SELSC.1
Select Smart Card Interface – These bits select the interface that is using
the IS0 UART. These bits do not activate the interface. Activation is
performed by the VccCtl register.
00 = No smart card interface selected.
01 01 = External Smart Card Interface selected (using SCLK, SIO).
02 1X = Internal Smart Card Interface selected.
SCSel.2 SELSC.0
SCSel.1 BYPASS
1 = Enabled, 0 = Disabled. When enabled, ISO UART is bypassed and the
I/O line is controlled via the SCCtl and SCECtl registers.
SCSel.0 –
73S1217F Data Sheet DS_1217F_002
Smart Card Interrupt Register (SCInt): 0xFE01 Å 0x00
When the smart card interrupt is asserted, the firmware can read this register to determine the actual
cause of the interrupt. The bits are cleared when this register is read. Each interrupt can be disabled by
the Smart Card Interrupt Enable register. Error processing must be handled by the firmware. This
register relates to the interface that is active – see the SCSel register (above).
Table 80: The SCInt Register
MSB LSB
WAITTO CRDEVT VCCTMRI RXDAV TXEVT TXSENT TXERR RXERR
Bit Symbol Function
SCInt.7 WAITTO
Wait Timeout – An ATR or card wait timeout has occurred. In sync
mode, this interrupt is asserted when the RLen counter (it advances on
falling edges of CLK/ETU) reaches the loaded (max) value. This bit is
cleared when the SCINT register is read. When running in Synchronous
Clock Stop Mode, this bit becomes RLenINT interrupt (set when the Rlen
counter reaches the terminal count).
SCInt.6 CRDEVT
Card Event – A card event is signaled via pin DETCARD either when the
Card was inserted or removed (read the CRDCtl register to determine
card presence) or there was a fault condition in the interface circuitry.
This bit is functional even if the smart card logic clock is disabled and
when the PWRDN bit is set. This bit is cleared when the SCInt register is
read.
SCInt.5 VCCTMRI
VCC Timer – This bit is set when the VCCTMR times out. This bit is
cleared when the SCInt register is read.
SCInt.4 RXDAV
Rx Data Available – Data was received from the smart card because the
Rx FIFO is not empty. In bypass mode, this interrupt is generated on a
falling edge of the smart card I/O line. After receiving this interrupt in
bypass mode, firmware should disable it until the firmware has received
the entire byte and is waiting for the next start delimiter. This bit is
cleared when there is no RX data available in the RX FIFO.
SCInt.3 TXEVNT
TX Event – Set whenever the TXEMTY or TXFULL bits are set in the
SRXCtl SFR. This bit is cleared when the STXCtl register is read.
SCInt.2 TXSENT
TX Sent – Set whenever the ISO UART has successfully transmitted a
byte to the smart card. Also set when a CRC/LRC byte is sent in T=1
mode. Will not be set in T=0 when a break is detected at the end of a
byte (when break detection is enabled). This bit is cleared when the
SCInt register is read.
SCInt.1 TXERR
TX Error – An error was detected during the transmission of data to the
smart card as indicated by either BREAKD or TXUNDR bit being set in
the STXCtl SFR. Additional information can be found in that register
description. This bit is cleared when the STXCtl register is read.
SCInt.0 RXERR
RX Error – An error was detected during the reception of data from the
smart card. Additional information can be found in the SRXCtl register.
This interrupt will be asserted for RXOVRR, or RX Parity error events.
This bit is cleared when the SRXCtl register is read.
90 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 91
Smart Card Interrupt Enable Register (SCIE): 0xFE02 Å 0x00
When set to 1, the respective condition can cause a smart card interrupt. When set to a 0, the respective
condition cannot cause an interrupt. When disabled, the respective bit in the Smart Card Interrupt
register can still be set, but it will not interrupt the MPU.
Table 81: The SCIE Register
MSB LSB
WTOIEN CDEVEN VTMREN RXDAEN TXEVEN TXSNTEN TXEREN RXEREN
Bit Symbol Function
SCIE.7 WTOIEN
Wait Timeout Interrupt Enable – Enable for ATR or Wait Timeout Interrupt.
In sync mode, function is RLIEN (RLen = max.) interrupt enable.
SCIE.6 CDEVEN Card Event Interrupt Enable.
SCIE.5 VTMREN VCC Timer Interrupt Enable.
SCIE.4 RXDAEN Rx Data Available Interrupt Enable.
SCIE.3 TXEVEN TX Event Interrupt Enable.
SCIE.2 TXSNTEN TX Sent Interrupt Enable.
SCIE.1 TXEREN TX Error Interrupt Enable.
SCIE.0 RXEREN RX Error Interrupt Enable.
73S1217F Data Sheet DS_1217F_002
Smart Card VCC Control/Status Register (VccCtl): 0xFE03 Å 0x00
This register is used to control the power up and power down of the integrated smart card interface. It is
used to determine whether to apply 5V, 3V, or 1.8V to the smart card. Perform the voltage selection with
one write operation, setting both VCCSEL.1 and VCCSEL.0 bits simultaneously. The VDDFLT bit (if
enabled) will provide an emergency deactivation of the internal smart card slot. See the VDD Fault
Detect Function section for more detail.
Table 82: The VccCtl Register
MSB LSB
VCCSEL.1 VCCSEL.0 VDDFLT RDYST VCCOK – – SCPWRDN
Bit Symbol Function
VccCtl.7 VCCSEL.1
Setting non-zero value for bits 7,6 will begin activation sequence with target
Vcc as given below:
State VCCSEL.1 VCCSEL.0 VCC
1 0 0 0V
2 0 1 1.8V
3 1 0 3.0V
4 1 1 5V
A card event or VCCOK going low will initiate a deactivation sequence.
When the deactivation sequence for RST, CLK and I/O is complete, VCC will
be turned off. When this type of deactivation occurs, the bits must be reset
before initiating another activation.
VccCtl.6 VCCSEL.0
VccCtl.5 VDDFLT
If this bit is set = 0, the CMDVCC3B and CMDVCC5B outputs are
immediately set = 1 to signal to the companion circuit to begin deactivation
when there is a VDD Fault event. If this bit is set = 1 and there is a VDD
Fault, the firmware should perform a deactivation sequence and then set
CMDVCC3B or CMDVCC5B = 1 to signal the companion circuit to set
VCC = 0.
VccCtl.4 RDYST
If this bit is set = 1, the activation sequence will start when bit VCCOK is
set = 1. If not set, the deactivation sequence shall start when the VCCTMR
times out.
VccCtl.3 VCCOK (Read only). Indicates that VCC output voltage is stable.
VccCtl.2 –
VccCtl.1 –
VccCtl.0 SCPWRDN
This bit controls the power-off mode of the 73S1217F circuit.
1 = power off, 0 = normal operation. When in power down mode,
VDD = 0V. VDD can only be turned on by pressing the ON/OFF switch or by
application of 5V to VBUS. If VBUS power is available and SCPWRDN bit is
set, it has no effect until VBUS is removed and VDD will shut off.
92 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 93
VCC Stable Timer Register (VccTmr): 0xFE04 Å 0x0F
A programmable timer is provided to set the time from activation start (setting the VCCSEL.1 and
VCCSEL.0 bits to non-zero) to when VCC_OK is evaluated. VCC_OK must be true at the end of this
timers programmed interval (tto in Figure 18) in order for the activation sequence to continue. If VCC_OK
is not true and the end of the interval (tto), the Card Event interrupt will be set, and a deactivation
sequence shall begin including clearing of the VCCSEL bits.
Table 83: The VccTmr Register
MSB LSB
OFFTMR.3 OFFTMR.2 OFFTMR.1 OFFTMR.0 VCCTMR.3 VCCTMR.2 VCCTMR.1 VCCTMR.0
Bit Symbol Function
VccTmr.7 OFFTMR.3
VCC Off Timer – The bits set the delay (in number of ETUs) for
deactivation after the VCCSEL.1 and VCC SEL.0 have been set to 0.
The time value is a count of the 32768Hz clock and is given by tto =
OFFTMR(7:4) * 30.5μs. This delay does not affect emergency
deactivations due to VDD Fault or card events. A value of 0000 results in
no additional delay.
VccTmr.6 OFFTMR.2
VccTmr.5 OFFTMR.1
VccTmr.4 OFFTMR.0
VccTmr.3 VCCTMR.3
VCC Timer – VCCOK must be true at the time set by the value in these
bits in order for the activation sequence to continue. If not, the VCCSEL
bits will be cleared. The time value is a count of the 32768Hz clock and
is given by tto = VCCTMR(3:0) * 30.5μs. A value of 0000 results in no
timeout, not zero time, and activation requires that RDYST is set and
RDY goes high.
VccTmr.2 VCCTMR.2
VccTmr.1 VCCTMR.1
VccTmr.0 VCCTMR.0
73S1217F Data Sheet DS_1217F_002
Card Status/Control Register (CRDCtl): 0xFE05 Å 0x00
This register is used to configure the card detect pin (DETCARD) and monitor card detect status. This
register must be written to properly configure Debounce, Detect_Polarity (= 0 or = 1), and the pull-
up/down enable before setting CDETEN. The card detect logic is functional even without smart card logic
clock. When the PWRDN bit is set = 1, no debounce is provided but card presence is operable.
Table 84: The CRDCtl Register
MSB LSB
DEBOU
N
CDETEN – – DETPOL PUENB PDEN CARDIN
Bit Symbol Function
CRDCtl.7 DEBOUN
Debounce – When set = 1, this will enable hardware de-bounce
of the card detect pin. The de-bounce function shall wait for
64ms of stable card detect assertion before setting the CARDIN
bit. This counter/timer uses the keypad clock as a source of
1kHz signal. De-assertion of the CARDIN bit is immediate upon
de-assertion of the card detect pin(s).
CRDCtl.6 CDETEN
Card Detect Enable – When set = 1, activates card detection
input. Default upon power-on reset is 0.
CRDCtl.5 –
CRDCtl.4 –
CRDCtl.3 DETPOL
Detect Polarity – When set = 1, the DETCARD pin shall interpret
a logic 1 as card present.
CRDCtl.2 PUENB Enable pull-up current on DETCARD pin (active low).
CRDCtl.1 PDEN Enable pull-down current on DETCARD pin.
CRDCtl.0 CARDIN
Card Inserted – (Read only). 1 = card inserted, 0 = card not
inserted. A change in the value of this bit is a “card event.” A
read of this bit indicates whether smart card is inserted or not
inserted in conjunction with the DETPOL setting.
94 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 95
TX Control/Status Register (STXCtl): 0xFE06 Å 0x00
This register is used to control transmission of data to the smart card. Some control and some status bits
are in this register.
Table 85: The STXCtl Register
MSB LSB
I2CMODE – TXFULL TXEMTY TXUNDR LASTTX TX/RXB BREAKD
Bit Symbol Function
STXCtl.7 I2CMODE
I2C Mode – When in sync mode and this bit is set, and when the RLen count
value = max or 0, the source of the smart card data for IO pin (or SIO pin) will
be connected to the IO bit in SCCtl (or SCECtl) register rather than the TX
FIFO. See the description for the Protocol Mode Register for more detail.
STXCtl.6 –
STXCtl.5 TXFULL
TX FIFO is full. Additional writes may corrupt the contents of the FIFO. This
bit it will remain set as long as the TX FIFO is full. Generates a TX_Event
interrupt upon going full.
STXCtl.4 TXEMTY
1 = TX FIFO is empty, 0 = TX FIFO is not empty. If there is data in the TX
FIFO, the circuit will transmit it to the smart card if in transmit mode. In T=1
mode, if the LASTTX bit is set and the hardware is configured to transmit the
CRC/LRC, the TXEMTY will not be set until the CRC/LRC is transmitted. In
T=0, if the LASTTX bit is set, TXEMTY will be set after the last word has
been successfully transmitted to the smart card. Generates a TXEVNT
interrupt upon going empty.
STXCtl.3 TXUNDR
TX Underrrun – (Read only) Asserted when a transmit under-run condition
has occurred. An under-run condition is defined as an empty TX FIFO when
the last data word has been successfully transmitted to the smart card and
the LASTTX bit was not set. No special processing is performed by the
hardware if this condition occurs. Cleared when read by firmware. This bit
generates a TXERR interrupt.
STXCtl.2 LASTTX
Last TX Byte – Set by firmware (in both T=0 and T=1) when the last byte in
the current message has been written into the transmit FIFO. In T=1 mode,
the CRC/LRC will be appended to the message. Should be set after the last
byte has been written into the transmit FIFO. Should be cleared by firmware
before writing first byte of next message into the transmit FIFO. Used in T=0
to determine when to set TXEMTY.
STXCtl.1 TX/RXB
1 = Transmit mode, 0 = Receive mode. Configures the hardware to be
receiving from or transmitting to the smart card. Determines which counters
should be enabled. This bit should be set to receive mode prior to switching
to another interface. Setting and resetting this bit shall initialize the CRC
logic. If LASTTX is set, this bit can be reset to RX mode and UART logic will
automatically change mode to RX when TX operation is completed
(TX_Empty =1).
STXCtl.0 BREAKD
Break Detected – (Read only) 1 = A break has been detected on the I/O line
indicating that the smart card detected a parity error. Cleared when read.
This bit generates a TXERR interrupt.
73S1217F Data Sheet DS_1217F_002
STX Data Register (STXData): 0xFE07 Å 0x00
Table 86: The STXData Register
MSB LSB
STXDAT.7 STXDAT.6 STXDAT.5 STXDAT.4 STXDAT.3 STXDAT.2 STXDAT.1 STXDAT.0
Bit Function
STXData.7
Data to be transmitted to smart card. Gets stored in the TX FIFO and then extracted by
the hardware and sent to the selected smart card. When the MPU reads this register,
the byte pointer is changed to effectively “read out” the data. Thus, two reads will
always result in an “empty” FIFO condition. The contents of the FIFO registers are not
cleared, but will be overwritten by writes.
STXData.6
STXData.5
STXData.4
STXData.3
STXData.2
STXData.1
STXData.0
96 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 97
SRX Control/Status Register (SRXCtl): 0xFE08 Å 0x00
This register is used to monitor reception of data from the smart card.
Table 87: The SRXCtl Register
MSB LSB
BIT9DAT – LASTRX CRCERR RXFULL RXEMTY RXOVR
R
PARITYE
Bit Symbol Function
SRXCtl.7 BIT9DAT
Bit 9 Data – When in sync mode and with MODE9/8B set, this bit will contain
the data on IO (or SIO) pin that was sampled on the ninth CLK (or SCLK)
rising edge. This is used to read data in synchronous 9-bit formats.
SRXCtl.6 –
SRXCtl.5 LASTRX
Last RX Byte – User sets this bit during the reception of the last byte. When
byte is received and this bit is set, logic checks CRC to match 0x1D0F (T=1
mode) or LRC to match 00h (T=1 mode), otherwise a CRC or LRC error is
asserted.
SRXCtl.4 CRCERR (Read only) 1 = CRC (or LRC) error has been detected.
SRXCtl.3 RXFULL (Read only) RX FIFO is full. Status bit to indicate RX FIFO is full.
SRXCtl.2 RXEMTY
(Read only) RX FIFO is empty. This is only a status bit and does not
generate an RX interrupt.
SRXCtl.1 RXOVRR
RX Overrun – (Read Only) Asserted when a receive-over-run condition has
occurred. An over-run is defined as a byte was received from the smart
card when the RX FIFO was full. Invalid data may be in the receive FIFO.
Firmware should take appropriate action. Cleared when read. Additional
writes to the RX FIFO are discarded when a RXOVRR occurs until the
overrun condition is cleared. Will generate an RXERR interrupt.
SRXCtl.0 PARITYE
Parity Error – (Read only) 1 = The logic detected a parity error on incoming
data from the smart card. Cleared when read. Will generate RXERR
interrupt.
73S1217F Data Sheet DS_1217F_002
SRX Data Register (SRXData): 0xFE09 Å 0x00
Table 88: The SRXData Register
MSB LSB
SRXDAT.7 SRXDAT.6 SRXDAT.5 SRXDAT.4 SRXDAT.3 SRXDAT.2 SRXDAT.1 SRXDAT.0
Bit Function
SRXData.7
(Read only) Data received from the smart card. Data received from the smart card
gets stored in a FIFO that is read by the firmware.
SRXData.6
SRXData.5
SRXData.4
SRXData.3
SRXData.2
SRXData.1
SRXData.0
98 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 99
Smart Card Control Register (SCCtl): 0xFE0A Å 0x21
This register is used to monitor reception of data from the smart card.
Table 89: The SCCtl Register
MSB LSB
RSTCRD – IO IOD C8 C4 CLKLVL CLKOFF
Bit Symbol Function
SCCtl.7 RSTCRD
1 = Asserts the RST (set RST = 0) to the smart card interface, 0 = De-
assert the RST (set RST = 1) to the smart card interface. Can be used to
extend RST to the smart card. Refer to the RLength register description.
This bit is operational in all modes and can be used to extend RST during
activation or perform a “Warm Reset” as required. In auto-sequence mode,
this bit should be set = 0 to allow the sequencer to de-assert RST per the
RLength parameters.
In sync mode (see the SPrtcol register) the sense of this bit is non-inverted,
if set =1 , RST = 1, if set = 0, RST = 0. Rlen has no effect on Reset in sync
mode.
SCCtl.6 –
SCCtl.5 IO
Smart Card I/O. Read is state of I/O signal (Caution, this signal is not
synchronized to the MPU clock). In Bypass mode, write value is state of
signal on I/O. In sync mode, this bit will contain the value of I/O pin on the
latest rising edge of CLK.
SCCtl.4 IOD
Smart Card I/O Direction control Bypass mode or sync mode. 1 = input
(default), 0 = output.
SCCtl.3 C8
Smart Card C8. When C8 is an output, the value written to this bit will
appear on the C8 line. The value read when C8 is an output is the value
stored in the register. When C8 is an input, the value read is the value on
the C8 pin (Caution, this signal is not synchronized to the MPU clock).
When C8 is an input, the value written will be stored in the register but not
presented to the C8 pin.
SCCtl.2 C4
Smart Card C4. When C4 is an output, the value written to this bit will
appear on the C4 line. The value read when C4 is an output is the value
stored in the register. When C4 is an input, the value read is the value on
the C4 pin (Caution, this signal is not synchronized to the MPU clock).
When C4 is an input, the value written will be stored in the register but not
presented to the C4 pin.
SCCtl.1 CLKLVL
1 = High, 0 = Low. If CLKOFF is set = 1, the CLK to smart card will be at
the logic level indicated by this bit. If in bypass mode, this bit directly
controls the state of CLK.
SCCtl.0 CLKOFF
0 = CLK is enabled. 1 = CLK is not enabled. When asserted, the CLK will
stop at the level selected by CLKLVL. This bit has no effect if in bypass
mode.
73S1217F Data Sheet DS_1217F_002
External Smart Card Control Register (SCECtl): 0xFE0B Å 0x00
This register is used to directly set and sample signals of External Smart Card interface. There are three
modes of asynchronous operation, an “automatic sequence” mode, and bypass mode. Clock stop per
the ISO 7816-3 interface is also supported but firmware must handle the protocol for SIO and SCLK for
I2C clock stop and start. Control for Reset (to make RST signal), activation control, voltage select, etc.
should be handled via the I2C interface when using external 73S73S8010x devices. USR(n) pins shall be
used for C4, C8 functions if necessary.
Table 90: The SCECtl Register
MSB LSB
– – SIO SIOD – – SCLKLVL SCLKOFF
Bit Symbol Function
SCECtl.7 –
SCECtl.6 –
SCECtl.5 SIO
External Smart Card I/O. Bit when read indicates state of pin SIO for
SIOD = 1 (Caution, this signal is not synchronized to the MPU clock), when
written, sets the state of pin SIO for SIOD = 0. Ignored if not in bypass or
sync modes. In sync mode, this bit will contain the value of IO pin on the
latest rising edge of SCLK.
SCECtl.4 SIOD
1 = input, 0 = output. External Smart Card I/O Direction control. Ignored if
not in bypass or sync modes.
SCECtl.3 –
SCECtl.2 –
SCECtl.1 SCLKLVL
Sets the state of SCLK when disabled by SCLKOFF bit. If in bypass mode,
this bit directly controls the state of SCLK.
SCECtl.0 SCLKOFF
0 = SCLK enabled, 1 = SCLK disabled. When disabled, SCLK level is
determined by SCLKLVL. This bit has no effect if in bypass mode.
100 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 101
C4/C8 Data Direction Register (SCDIR): 0xFE0C Å 0x00
This register determines the direction of the internal interface C4/C8 lines. After reset, all signals are
tri-stated.
Table 91: The SCDIR Register
MSB LSB
– – – – C8D C4D – –
Bit Symbol Function
SCDIR.7 –
SCDIR.6 –
SCDIR.5 –
SCDIR.4 –
SCDIR.3 C8D 1 = input, 0 = output. Smart Card C8 direction.
SCDIR.2 C4D 1 = input, 0 = output. Smart Card C4 direction.
SCDIR.1 –
SCDIR.0 –
73S1217F Data Sheet DS_1217F_002
Protocol Mode Register (SPrtcol): 0xFE0D Å 0x03
This register determines the protocol to be use when communicating with the selected smart card. This
register should be updated as required when switching between smart card interfaces.
Table 92: The SPrtcol Register
MSB LSB
SCISYN MOD9/8B SCESYN 0 TMODE CRCEN CRCMS RCVATR
Bit Symbol Function
SPrtcol.7 SCISYN
Smart Card Internal Synchronous mode – Configures internal smart card
interface for synchronous mode. This mode routes the internal interface
buffers for RST, IO, C4, C8 to SCCtl register bits for direct firmware control.
CLK is generated by the ETU counter.
SPrtcol.6 MOD9/8B
Synchronous 8/9 bit mode select – For sync mode, in protocols with 9-bit
words, set this bit. The first eight bits read go into the RX FIFO and the
ninth bit read will be stored in the IO (or SIO) data bit of the SRXCtl
register.
SPrtcol.5 SCESYN
Smart Card External Synchronous mode – Configures External Smart Card
interface for synchronous mode. This mode routes the external smart card
interface buffers for SIO to SCECtl register bits for direct firmware control.
SCLK is generated by the ETU counter.
SPrtcol.4 0 Reserved bit, must always be set to 0.
SPrtcol.3 TMODE
Protocol mode select – 0: T=0, 1: T=1. Determines which smart card
protocol is to be used during message processing.
SPrtcol.2 CRCEN
CRC Enable – 1 = Enabled, 0 = Disabled. Enables the
checking/generation of CRC/LRC while in T=1 mode. Has no effect in T=0
mode. If enabled and a message is being transmitted to the smart card,
the CRC/LRC will be inserted into the message stream after the last TX
byte is transmitted to the smart card. If enabled, CRC/LRC will be checked
on incoming messages and the value made available to the firmware via
the CRC LS/MS registers.
SPrtcol.1 CRCMS
CRC Mode Select – 1 = CRC, 0 = LRC. Determines type of checking
algorithm to be used.
SPrtcol.0 RCVATR
Receive ATR – 1 = Enable ATR timeout, 0 = Disable ATR timeout. Set by
firmware after the smart card has been turned on and the hardware is
expecting ATR.
102 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 103
SC Clock Configuration Register (SCCLK): 0xFE0F Å 0x0C
This register controls the internal smart card (CLK) clock generation.
Table 93: The SCCLK Register
MSB LSB
– – ICLKFS.5 ICLKFS.4 ICLKFS.3 ICLKFS.2 ICLKFS.1 ICLKFS.0
Bit Symbol Function
SCCLK.7 –
SCCLK.6 –
SCCLK.5 ICLKFS.5
Internal Smart Card CLK Frequency Select – Division factor to determine
internal smart card CLK frequency. MCLK clock is divided by (register
value + 1) to clock the ETU divider, and then by 2 to generate CLK. Default
ratio is 13. The programmed value in this register is applied to the divider
after this value is written, in such a manner as to produce a glitch-free
output, regardless of the selection of active interface. A register value = 0
will default to the same effect as register value = 1.
SCCLK.4 ICLKFS.4
SCCLK.3 ICLKFS.3
SCCLK.2 ICLKFS.2
SCCLK.1 ICLKFS.1
SCCLK.0 ICLKFS.0
External SC Clock Configuration Register (SCECLK): 0xFE10 Å 0x0C
This register controls the external smart card (SCLK) clock generation.
Table 94: The SCECLK Register
MSB LSB
– – ECLKFS.5 ECLKFS.4 ECLKFS.
3
ECLKFS.2 ECLKFS.1 ECLKFS.0
Bit Symbol Function
SCECLK.7 –
SCECLK.6 –
SCECLK.5 ECLKFS.5
External Smart Card CLK Frequency Select – Division factor to determine
external smart card CLK frequency. MCLK clock is divided by (register
value + 1) to clock the ETU divider, and then by 2 to generate SCLK.
Default ratio is 13. The programmed value in this register is applied to the
divider after this value is written, in such a manner as to produce a glitch-
free output, regardless of the selection of active interface. A register value
= 0 will default to the same effect as register value = 1.
SCECLK.4 ECLKFS.4
SCECLK.3 ECLKFS.3
SCECLK.2 ECLKFS.2
SCECLK.1 ECLKFS.1
SCECLK.0 ECLKFS.0
73S1217F Data Sheet DS_1217F_002
Parity Control Register (SParCtl): 0xFE11 Å 0x00
This register provides the ability to configure the parity circuitry on the smart card interface. The settings
apply to both integrated smart card interfaces.
Table 95: The SParCtl Register
MSB LSB
– DISPAR BRKGEN BRKDET RETRAN DISCRX INSPE FORCPE
Bit Symbol Function
SParCtl.7 –
SParCtl.6 DISPAR
Disable Parity Check – 1 = disabled, 0 = enabled. If enabled, the UART
will check for even parity (the number of 1’s including the parity bit is even)
on every character. This also applies to the TS during ATR.
SParCtl.5 BRKGEN
Break Generation Disable – 1 = disabled, 0 = enabled. If enabled, and T=0
protocol, the UART will generate a Break to the smart card if a parity error
is detected on a receive character. No Break will be generated if parity
checking is disabled. This also applies to TS during ATR.
SParCtl.4 BRKDET
Break Detection Disable – 1 = disabled, 0 = enabled. If enabled, and T=0
protocol, the UART will detect the generation of a Break by the smart card.
SParCtl.3 RETRAN
Retransmit Byte – 1 = enabled, 0 = disabled. If enabled and a Break is
detected from the smart card (Break Detection must be enabled), the last
character will be transmitted again. This bit applies to T=0 protocol.
SParCtl.2 DISCRX
Discard Received Byte – 1 = enabled, 0 = disabled. If enabled and a parity
error is detected (Parity checking must be enabled), the last character
received will be discarded. This bit applies to T=0 protocol.
SParCtl.1 INSPE
Insert Parity Error – 1 = enabled, 0 = disabled. Used for test purposes. If
enabled, the UART will insert a parity error in every character transmitted
by generating odd parity instead of even parity for the character.
SParCtl.0 FORCPE
Force Parity Error – 1 = enabled, 0 = disabled. Used for test purposes. If
enabled, the UART will generate a parity error on a character received from
the smart card.
104 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 105
Byte Control Register (SByteCtl): 0xFE12 Å 0x2C
This register controls the processing of characters and the detection of the TS byte. When receiving, a
Break is asserted at 10.5 ETU after the beginning of the start bit. Break from the card is sampled at 11
ETU.
Table 96: The SByteCtl Register
MSB LSB
– DETTS DIRTS
BRKDUR.1 BRKDUR.
0
– – –
Bit Symbol Function
SByteCtl.7 –
SByteCtl.6 DETTS
Detect TS Byte – 1 = Next Byte is TS, 0 = Next byte is not TS. When
set, the hardware will treat the next character received as the TS and
determine if direct or indirect convention is being used. Direct
convention is the default used if firmware does not set this bit prior to
transmission of TS by the smart card to the firmware. The hardware will
check parity and generate a break as defined by the DISPAR and
BRKGEN bits in the parity control register. This bit is cleared by
hardware after TS is received. TS is decoded before being stored in
the receive FIFO.
SByteCtl.5 DIRTS
Direct Mode TS Select – 1 = direct mode, 0 = indirect mode.
Set/cleared by hardware when TS is processed indicating either
direct/indirect mode of operation. When switching between smart
cards, the firmware should write the bit appropriately since this register
is not unique to an individual smart card (firmware should keep track of
this bit).
SByteCtl.4 BRKDUR.1
Break Duration Select – 00 = 1 ETU, 01 = 1.5 ETU, 10 = 2 ETU, 11 =
reserved. Determines the length of a Break signal which is generated
when detecting a parity error on a character reception in T=0 mode.
SByteCtl.3 BRKDUR.0
SByteCtl.2 –
SByteCtl.1 –
SByteCtl.0 –
73S1217F Data Sheet DS_1217F_002
FD Control Register (FDReg): 0xFE13 Å 0x11
Table 97: The FDReg Register
MSB LSB
FVAL.3 FVAL.2 FVAL.1 FVAL.0 DVAL.3 DVAL.2 DVAL.1 DVAL.0
Bit Symbol Function
FDReg.7 FVAL.3
Refer to Table 99. This value is converted per the table to set the divide
ratio used to generate the baud rate (ETU). Default, also used for ATR, is
0001 (Fi = 372). This value is used by the selected interface.
FDReg.6 FVAL.2
FDReg.5 FVAL.1
FDReg.4 FVAL.0
FDReg.3 DVAL.3
Refer to Table 99. This value is used to set the divide ratio used to generate
the smart card CLK. Default, also used for ATR, is 0001 (Di = 1).
FDReg.2 DVAL.2
FDReg.1 DVAL.1
FDReg.0 DVAL.0
This register uses the transmission factors F and D to set the ETU (baud) rate. The values in this register
are mapped to the ISO 7816 conversion factors as described below. The CLK signal for each interface is
created by dividing a high-frequency, intermediate signal (MSCLK) by 2. The ETU baud rate is created
by dividing MSCLK by 2 times the Fi/Di ratio specified by the codes below. For example, if FI = 0001 and
DI = 0001, the ratio of Fi/Di is 372/1. Thus, the ETU divider is configured to divide by 2 * 372 = 744. The
maximum supported F/D ratio is 4096.
Table 98: Divider Ratios Provided by the ETU Counter
FI (code) 0000 0001 0010 0011 0100 0101 0110 0111
Fi (ratio) 372 372 558 744 1116 1488 1860
1860⊕
FCLK max 4 5 6 8 12 16 20
20⊕
FI(code) 1000 1001 1010 1011 1100 1101 1110 1111
Fi(ratio) 512⊕ 512 768 1024 1536 2048
2048⊕ 2048⊕
FCLK max 5⊕ 5 7.5 10 15 20
20⊕ 20⊕
DI(code) 0000 0001 0010 0011 0100 0101 0110 0111
Di(ratio) 1⊕ 1 2 4 8 16 32
32⊕
DI(code) 1000 1001 1010 1011 1100 1101 1110 1111
Di(ratio) 12 20 16⊕ 16⊕ 16⊕ 16⊕ 16⊕ 16⊕
Note: values marked with ⊕ are not included in the ISO definition and arbitrary values have been
assigned.
The values given below are used by the ETU divider to create the ETU clock. The entries that are not
shaded will result in precise CLK/ETU per ISO requirements. Shaded areas are not precise but are
within 1% of the target value.
106 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 107
Table 99: Divider Values for the ETU Clock
Fi code 0000 0001 0010 0011 0100 0101
Di
code
F→
D↓
372 372 558 744 1116 1488
0001 1 744 744 1116 1488 2232 2976
0010 2 372 372 558 744 1116 1488
0011 4 186 186 279 372 558 744
0100 8 93 93 138 186 279 372
1000 12 62 62 93 124 186 248
0101 16 47 47 70 93 140 186
1001 20 37 37 56 74 112 149
0110 32 23 23 35 47 70 93
Fi code 0110 1001 1010 1011 1100 1101
Di
code
F→
D↓
1860 512 768 1024 1536 2048
0001 1 3720 1024 1536 2048 3072 4096
0010 2 1860 512 768 1024 1536 2048
0011 4 930 256 384 512 768 1024
0100 8 465 128 192 256 384 512
1000 12 310 85 128 171 256 341
0101 16 233 64 96 128 192 256
1001 20 186 51 77 102 154 205
0110 32 116 32 48 64 96 128
73S1217F Data Sheet DS_1217F_002
CRC MS Value Registers (CRCMsB): 0xFE14 Å 0xFF, (CRCLsB): 0xFE15 Å 0xFF
Table 100: The CRCMsB Register
MSB LSB
CRC.15 CRC.14 CRC.13 CRC.12 CRC.11 CRC.10 CRC.9 CRC.8
Table 101: The CRCLsB Register
MSB LSB
CRC.7 CRC.6 CRC.5 CRC.4 CRC.3 CRC.2 CRC.1 CRC.0
The 16-bit CRC value forms the TX CRC word in TX mode (write value) and the RX CRC in RX mode
(read value). The initial value of CRC to be used when generating a CRC to be transmitted at the end of
a message (after the last TX byte is sent) when enabled in T=1 mode. Should be reloaded at the
beginning of every message to be transmitted. When using CRC, both CRC registers should be
initialized to FF. When using LRC the CRCLsB Value register should be loaded to 00. When receiving a
message, the firmware should load this with the initial value and then read this register to get the final
value at the end of the message. These registers need to be reloaded for each new message to be
received. When in LRC mode, bits (7:0) are used and bits (15:8) are undefined. During LRC/CRC
checking and generation, this register is updated with the current value and can be read to aid in
debugging. This information will be transmitted to the smart card using the timing specified by the Guard
Time register. When checking CRC/LRC on an incoming message (CRC/LRC is checked against the
data and CRC/LRC), the firmware reads the final value after the message has been received and
determines if an error occurred (= 0x1D0F (CRC) no error, else error; = 0 (LRC) no error, else error).
When a message is received, the CRC/LRC is stored in the FIFO. The polynomial used to generate and
check CRC is x16 + x12+ x5 +1. When in indirect convention, the CRC is generated prior to the conversion
into indirect convention. When in indirect convention, the CRC is checked after the conversion out of
indirect convention. For a given message, the CRC generated (and readable from this register) will be
the same whether indirect or direct convention is used to transmit the data to the smart card. The
CRCLsB / CRCMsB registers will be updated with CRC/LRC whenever bits are being received or
transmitted from/to the smart card (even if CRCEN is not set and in mode T1). They are available to the
firmware to use if desired.
108 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 109
Block Guard Time Register (BGT): 0xFE16 Å 0x10
This register contains the Extra Guard Time Value (EGT) most-significant bit. The Extra Guard Time
indicates the minimum time between the leading edges of the start bit of consecutive characters. The
delay is depends on the T=0/T=1 mode. Used in transmit mode. This register also contains the Block
Guard Time (BGT) value. Block Guard Time is the minimum time between the leading edge of the start
bit of the last character received and the leading edge of the start bit of the first character transmitted.
This should not be set less than the character length. The transmission of the first character will be held
off until BGT has elapsed regardless of the TX data and TX/RX control bit timing.
Table 102: The BGT Register
MSB LSB
EGT.8 – – BGT.4 BGT.3 BGT.1 BGT.2 BGT.0
Bit Symbol Function
BGT.7 EGT.8 Most-significant bit for 9-bit EGT timer. See EGT below.
BGT.6 –
BGT.5 –
BGT.4 BGT.4
Time in ETUs between the start bit of the last received character to start bit
of the first character transmitted to the smart card. Default value is 22.
BGT.3 BGT.3
BGT.2 BGT.2
BGT.1 BGT.1
BGT.0 BGT.0
Extra Guard Time Register (EGT): 0xFE17 Å 0x0C
This register contains the Extra Guard Time Value (EGT) least-significant byte. The Extra Guard Time
indicates the minimum time between the leading edges of the start bit of consecutive characters. The
delay depends on the T=0/T=1 mode. Used in transmit mode.
Table 103: The EGT Register
MSB LSB
EGT.7 EGT.6 EGT.5 EGT.4 EGT.3 EGT.1 EGT.2 EGT.0
Bit Function
EGT.7
Time in ETUs between start bits of consecutive characters. In T=0 mode, the minimum is
1. In T=0, the leading edge of the next start bit may be delayed if there is a break detected
from the smart card. Default value is 12. In T=0 mode, regardless of the value loaded, the
minimum value is 12, and for T=1 mode, the minimum value is 11.
EGT.6
EGT.5
EGT.4
EGT.3
EGT.2
EGT.1
EGT.0
73S1217F Data Sheet DS_1217F_002
Block Wait Time Registers (BWTB0): 0xFE1B Å 0x00, (BWTB1): 0xFE1A Å 0x00, (BWTB2):
0xFE19 Å 0x00, (BWTB3): 0xFE18 Å 0x00
Table 104: The BWTB0 Register
MSB LSB
BWT.7 BWT.6 BWT.5 BWT.4 BWT.3 BWT.1 BWT.2 BWT.0
Table 105: The BWTB1 Register
MSB LSB
BWT.15 BWT.14 BWT.13 BWT.12 BWT.11 BWT.10 BWT.9 BWT.8
Table 106: The BWTB2 Register
MSB LSB
BWT.23 BWT.22 BWT.21 BWT.20 BWT.19 BWT.18 BWT.17 BWT.16
Table 107: The BWTB3 Register
MSB LSB
– – – – BWT.27 BWT.26 BWT.25 BWT.24
These registers (BWTB0, BWTB1, BWTB2, BWTB3) are used to set the Block Waiting Time(27:0)
(BWT). All of these parameters define the maximum time the 73S1217F will have to wait for a character
from the smart card. These registers serve a dual purpose. When T=1, these registers are used to set
up the block wait time. The block wait time defines the time in ETUs between the beginning of the last
character sent to smart card and the start bit of the first character received from smart card. It can be
used to detect an unresponsive card and should be loaded by firmware prior to writing the last TX byte.
When T = 0, these registers are used to set up the work wait time. The work wait time is defined as the
time between the leading edge of two consecutive characters being sent to or from the card. If a timeout
occurs, an interrupt is generated to the firmware. The firmware can then take appropriate action. A Wait
Time Extension (WTX) is supported with the 28-bit BWT.
Character Wait Time Registers (CWTB0): 0xFE1D Å 0x00, (CWTB1): 0xFE1C Å 0x00
Table 108: The CWTB0 Register
MSB LSB
CWT.7 CWT.6 CWT.5 CWT.4 CWT.3 CWT.1 CWT.2 CWT.0
Table 109: The CWTB1 Register
MSB LSB
CWT.15 CWT.14 CWT.13 CWT.12 CWT.11 CWT.10 CWT.9 CWT.8
These registers (CWTB0, CWTB1) are used to hold the Character Wait Time(15:0) (CWT) or Initial
Waiting Time(15:0) (IWT) depending on the situation. Both the IWT and the CWT measure the time in
ETUs between the leading edge of the start of the current character received from the smart card and the
leading edge of the start of the next character received from the smart card. The only difference is the
mode in which the card is operating. When T=1 these registers are used to configure the CWT and these
registers configure the IWT when the ATR is being received. These registers should be loaded prior to
receiving characters from the smart card. Firmware must manage which time is stored in the register. If
a timeout occurs, an interrupt is generated to the firmware. The firmware can then take appropriate
action.
110 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 111
ATR Timeout Registers (ATRLsB): 0xFE20 Å 0x00, (ATRMsB): 0xFE1F Å 0x00
Table 110: The ATRLsB Register
MSB LSB
ATRTO.7 ATRTO.6 ATRTO.5 ATRTO.4 ATRTO.3 ATRTO.1 ATRTO.2 ATRTO.0
Table 111: The ATRMsB Register
MSB LSB
ATRTO.15 ATRTO.14 ATRTO.13 ATRTO.12 ATRTO.11 ATRTO.10 ATRTO.9 ATRTO.8
These registers (ATRLsB and ATRLsB) form the ATR timeout (ATRTO [15:0]) parameter. Time in ETU
between the leading edge of the first character and leading edge of the last character of the ATR
response. Timer is enabled when the RCVATR is set and starts when leading edge of the first start bit is
received and disabled when the RCVATR is cleared. An ATR timeout is generated if this time is
exceeded.
TS Timeout Register (STSTO): 0xFE21 Å 0x00
Table 112: The STSTO Register
MSB LSB
TST0.7 TST0.6 TST0.5 TST0.4 TST0.3 TST0.1 TST0.2 TST0.0
The TS timeout is the time in ETU between the de-assertion of smart card reset and the leading edge of
the TS character in the ATR (when DETTS is set). The timer is started when smart card reset is
de-asserted. An ATR timeout is generated if this time is exceeded (MUTE card).
Reset Time Register (RLength): 0xFE22 Å 0x70
Table 113: The RLength Register
MSB LSB
RLen.7 RLen.6 RLen.5 RLen.4 RLen.3 RLen.1 RLen.2 RLen.0
Time in ETUs that the hardware delays the de-assertion of RST. If set to 0 and RSTCRD = 0, the
hardware adds no extra delay and the hardware will release RST after VCCOK is asserted during
power-up. If set to 1, it will delay the release of RST by the time in this register. When the firmware sets
the RSTCRD bit, the hardware will assert reset (RST = 0 on pin). When firmware clears the bit, the
hardware will release RST after the delay specified in Rlen. If firmware sets the RSTCRD bit prior to
instructing the power to be applied to the smart card, the hardware will not release RST after power-up
until RLen after the firmware clears the RSTCRD bit. This provides a means to power up the smart card
and hold it in reset until the firmware wants to release the RST to the selected smart card. Works with
the selected smart card interface.
73S1217F Data Sheet DS_1217F_002
Shaded locations indicate functions that are not provided in sync mode.
Table 114: Smart Card SFR Table
Name Address b7 b6 b5 b4 b3 b2 b1 b0
SCSel FE00 SelSC(1:0) BYPASS
SCInt FE01 WAITTO/
RLIEN
CRDEVT VCCTMR RXDAVl TXEVNT TXSENT TXERR RXERR
SCIE FE02 WTOI/
RLIEN
CDEVNT VTMREN RXDAEN TXEVEN TXSNTEN TXERR RXERR
VccCtl FE03 VCCSEL.1 VCCSEL.0 VDDFLT RDYST VCCOK SCPWRDN
VccTmr FE04 OFFTMR(3:0) VCCTMR(3:0)
CRDCtl FE05 DEBOUN CDETEN DETPOL PUENB PDEN CARDIN
STXCtl FE06 I2CMODE TXFULL TXEMTY TXUNDR LASTTX TX/RXB BREAKD
STXData FE07 TXDATA(7:0)
SRXCtl FE08 BIT9DAT LASTRX CRCERR RXFULL RXEMTY RXOVRR PARITYE
SRXData FE09 RXDATA(7:0)
SCCtl FE0A RSTCRD IO IOD C8 C4 CLKLVL CLKOFF
SCECtl FE0B SIO SIOD SCLKLVL SCLKOFF
SCDIR FE0C C8D C4D
SPrtcol FE0D I2CMODE MOD9/8B SCESYN 0 TMODE CRCEN CRCMS RCVATR
SCCLK FE0F ICLKFS(5:0)
SCECLK FE10 ECLKFS(5:0)
SParCtl FE11 DISPAR BRKGEN BRKDET RTRAN DISCRX INSPE FORCPE
SByteCtl FE12 DETTS DIRTS BRKDUR (1:0)
FDReg FE13 FVAL(3:0) DVAL (3:0)
CRCMsB FE14 CRC(15:8)
CRCLsB FE15 CRC(7:0)
BGT FE16 EGT8 BGT(4:0)
EGT FE17 EGT(7:0)
BWTB3 FE18 BWT(27:24)
BWTB2 FE19 BWT(23:16)
BWTB1 FE1A BWT(15:8)
BWTB0 FE1B BWT(7:0)
CWTB1 FE1C CWT(15:8)
CWTB0 FE1D CWT(7:0)
ATRMsB FE1F ATRTO(15:8)
ATRLsB FE20 ATRTO(7:0)
STSTO FE21 TSTO(7:0)
RLength FE22 RLen(7:0)
112 Rev. 1.2
DS_1217F_002 73S1217F Data Sheet
Rev. 1.2 113
1.7.18 VDD Fault Detect Function
The 73S1217F contains a circuit to detect a low-voltage condition on the supply voltage VDD. If enabled,
it will deactivate the active internal smart card interface when VDD falls below the VDD Fault threshold. The
register configures the VDD Fault threshold for the nominal default of 2.3V* or a user selectable threshold.
The user’s code may load a different value using the FOVRVDDF bit =1 after the power-up cycle has
completed
VDDFault Control Register (VDDFCtl): 0xFFD4 Å 0x00
Table 115: The VDDFCtl Register
MSB LSB
– FOVRVDDF VDDFLTEN – STXDAT.3 VDDFTH.2 VDDFTH.1 VDDFTH.0
Bit Symbol Function
VDDFCtl.7 –
VDDFCtl.6 FOVRVDDF
Setting this bit high will allow the VDDFLT(2:0) bits set in this register to
control the VDDFault threshold. When this bit is set low, the VDDFault
threshold will be set to the factory default setting of 2.3V*.
VDDFCtl.5 VDDFLTEN Set = 1 will disable VDD Fault operation.
VDDFCtl.4 –
VDDFCtl.3 –
VDDFCtl.2 VDDFTH.2
VDD Fault Threshold.
Bit value(2:0) VDDFault voltage
000 2.3 (nominal default)
001 2.4
010 2.5
011 2.6
100 2.7
101 2.8
110 2.9
111 3.0
VDDFCtl.1 VDDFTH.1
VDDFCtl.0 VDDFTH.0
* Note: The VDD Fault factory default can be set to any threshold as defined by bits VDDFTH(2:0). The
73S1217F has the capability to burn fuses at the factory to set the factory default to any of these
voltages. Contact Teridian for further details.
73S1217F Data Sheet DS_1217F_002
114 Rev. 1.2
SMARTCARD
SLOT #1
Y1
12.000MHz
VDD
VDD
C20
0.1uF
R2
1M
+
C16
1uF
GND
1
GND
2
VPC
3
NC
4
NC
5
NC
6
PRES
7
I/O
8
NC 9
AUX2 10
AUX1 11
GND 12
CLK 13
RST 14
VCC 15
NC 16
VDDF_ADJ 17
SCL 18
SDA 19
VDD 20
GND 21
INT 22
XTALIN 23
XTALOUT 24
NC
25
I/OUC
26
AUX1UC
27
AUX2UC
28
SAD0
29
SAD1
30
SAD2
31
NC
32
U3
73S8010R
R13
0
L1 10uH
VDD
12
BT1
BATTERY
C17
27p
C19
1.0uF
C18
27p
+
C4
10uF
R15
20k
VDD 68
RESET 1
SEC 2
ISBR 3
SCL 5
SDA 6
X32OUT 7
X32IN 8
GND 9
X12IN 10
X12OUT 11
COL0 12
COL1 13
COL2 14
ANAIN 15
COL3 16
RXD 17
TXD
18
COL4
19
USR7
20
ROW0
21
ROW1
22
USR6
23
ROW2
24
GND
25
DP
26
DM
27
VDD
28
USR5
29
USR4
30
USR3
31
USR2
32
ROW3
33
USR1
34
USR0
35
ROW4
36
ROW5
37
ERST
38
TCLK
39
VDD
40
TBUS3
41
GND
42
RXTX
43
TBUS2
44
SCLK
45
TBUS1
46
SIO
47
INT3
48
INT2
49
TBUS0
50
TEST
51
OFF_REQ 52
PRES 53
VP 54
CLK 55
GND 56
RST 57
VCC 58
C8/AUX2 59
C4/AUX1 60
I/O 61
VBUS 62
ON_OFF 63
VBAT 64
VPC 65
LIN 66
GND 67
SLUG 69
LED0 4
U1
73S1217F
SMARTCARD
SLOT #2
D1
LED
C12
0.1uF
R7
3k
C11
0.47uF
D- 2
D+ 3
GND 4
VCC 1
GND 5
GND 6
J1
USB_CONN_4
C2
22pF
A
8
.
C13
0.1uF
C14
0.1uF
C15
0.1uF
VDD
R8
3k
Host Serial RX
+
C5
0.1uF
Host Serial TX
DOWN
C7 10uF
F3
1
Y
CLR
2
VO
3
VDD
2
DB0
7
NC
15
GND
1
RS
4
R/W*
5
E
6
DB7
14
DB6
13
DB5
12
DB4
11
DB3
10
DB2
9
DB1
8
U2
D
E
7
UP
ENTER
1 2
S11 SW
/
BON_OFF
R1 24
F1
12
BT4
BATTERY
3
30-SWITCH
KEYPAD
9
ON/CE
X Z
VDD
LCD
BRIGHTNESS
ADJUST
C
F
R4 100k
4
OPTIONAL LCD DISPLAY SYSTEM
16 CHARACTER BY 2 LINES
1 3
S1
SW_MOM
5
W
USR2
USR1
USR4
USR3
USR5
USR0
0
USR6
6
F2
C10
27p
R6 1M
C1
0.1uF
R9
1M
R5
200k
C8
4.7uF
1 3
S2
SW_MOM
1 3
S3
SW_MOM
1 3
S4
SW_MOM
1 3
S5
SW_MOM
R3 24
C9
27p
R10
10k
1 3
S6
SW_MOM
1 3
S12
SW_MOM
1 3
S17
SW_MOM
1 3
S22
SW_MOM
1 3
S27
SW_MOM
R14
1K
1 3
S7
SW_MOM
1 3
S13
SW_MOM
1 3
S18
SW_MOM
1 3
S23
SW_MOM
1 3
S28
SW_MOM
1 3
S8
SW_MOM
D2
5.0V Zener
1 3
S14
SW_MOM
1 3
S19
SW_MOM
C6 0.1uF
1 3
S24
SW_MOM
1 3
S29
SW_MOM
1 3
S9
SW_MOM
1 3
S15
SW_MOM
1 3
S20
SW_MOM
3
2
1
Q1
NFET
1 3
S25
SW_MOM
1 3
S30
SW_MOM
1 3
S16
SW_MOM
1 3
S10
SW_MOM
1 3
S21
SW_MOM
1 3
S26
SW_MOM
1 3
S31
SW_MOM
12
BT2
BATTERY
12
BT3
BATTERY
D-
+5VDC
D+
GND
VCC
1
RST
2
CLK
3
C4
4
GND
5
VPP
6
I/O
7
C8
8
SW-1
9
SW-2
10
J2
Smart Card Connector
C3
22pF
USR1
USR2
USR6
USR5
USR4
AA
USR3
AA
AA
R11
0
VCC
1
RST
2
CLK
3
C4
4
GND
5
VPP
6
I/O
7
C8
8
SW-1
9
SW-2
10
J3
Smart Card Connector
VDD
R12
20k
USR0
13
2
CW
RV1
10K
USR5
2 Application Schematics
2.1 Typical Application Schematic 1
Figure 27: 73S1217F Typical Application Schematic (Handheld USB PINpad, with Combo USB-Bus and Self-powered Configuration)
D 21S_1 73S1217F Data Sheet 7F_002
Rev. 1.2 115
Y2
12.000MHz
VDD
R16
1M
L2 10uH
+
C24
10uF
VDD 68
RESET 1
SEC 2
ISBR 3
SCL 5
SDA 6
X32OUT 7
X32IN 8
GND 9
X12IN 10
X12OUT 11
COL0 12
COL1 13
COL2 14
ANAIN 15
COL3 16
RXD 17
TXD
18
COL4
19
USR7
20
ROW0
21
ROW1
22
USR6
23
ROW2
24
GND
25
DP
26
DM
27
VDD
28
USR5
29
USR4
30
USR3
31
USR2
32
ROW3
33
USR1
34
USR0
35
ROW4
36
ROW5
37
ERST
38
TCLK
39
VDD
40
TBUS3
41
GND
42
RXTX
43
TBUS2
44
SCLK
45
TBUS1
46
SIO
47
INT3
48
INT2
49
TBUS0
50
TEST
51
OFF_REQ 52
PRES 53
VP 54
CLK 55
GND 56
RST 57
VCC 58
C8/AUX2 59
C4/AUX1 60
I/O 61
VBUS 62
ON_OFF 63
VBAT 64
VPC 65
LIN 66
GND 67
SLUG 69
LED0 4
U4
73S1217F
C31
0.47uF
D- 2
D+ 3
GND 4
VCC 1
GND 5
GND 6
J4
USB_CONN_4
C22
22pF
C32
0.1uF
C33
0.1uF
C34
0.1uF
VDD
+
C26 10uF
C28
4.7uF
R18 24
R21
20K
VDD
C30
27p
C27
0.1uF
C23 0.1uF
R19 24
C29
27p
R17
10k
D-
+5VDC
C25 0.1uF
GND
D+ SMARTCARD
SLOT #1
VCC
1
RST
2
CLK
3
C4
4
GND
5
VPP
6
I/O
7
C8
8
SW-1
9
SW-2
10
J5
Smart Card Connector
C21
22pF
R20
0
VDD
R22 20K
2.2 Typical Application Schematic 2
Figure 28: 73S1217F Typical Application Schematic (USB Transparent Reader and USB Key Configuration)
73S1217F Data Sheet DS_1217F_001
116 Rev. 1.2
3 Electrical Specification
3.1 Absolute Maximum Ratings
Operation outside these rating limits may cause permanent damage to the device. The smart card
interface pins are protected against short circuits to VCC, ground, and each other.
Parameter Rating
DC Supply voltage, VDD -0.5 to 4.0 VDC
Supply Voltage VPC -0.5 to 6.6 VDC
Supply Voltage VBUS -0.5 to 6.6 VDC
Supply Voltage VBAT -0.5 to 6.6 VDC
Storage Temperature -60° to 150°C
Pin Voltage (except card interface) -0.3 to (VDD+0.5) VDC
Pin Voltage (card interface) -0.3 to (VCC+0.5) VDC
ESD tolerance (except card interface) +/- 2KV
ESD tolerance (card interface) +/- 7KV
Pin Current ± 200 mA
Note: ESD testing on smart card pins is HBM condition, 3 pulses, each polarity referenced to ground.
Note: Smart Card pins are protected against shorts between any combinations of Smart Card pins.
3.2 Recommended Operating Conditions
Unless otherwise noted all specifications are valid over these temperatures and supply voltage ranges:
Parameter Rating
Supply Voltage VPC 2.7 to 6.5 VDC
Supply Voltage VBUS 4.4 to 5.5 VDC
Supply Voltage VBAT 4.0 to 6.5 VDC
Ambient Operating Temperature (Ta) -40°C to +85°C
DS_1217F_002 73S1217F Data Sheet
3.3 Digital IO Characteristics
These requirements pertain to digital I/O pin types with consideration of the specific pin function and
configuration. The Row pins have 100K pull-ups.
Symbol Parameter Conditions Min. Typ. Max. Unit
Voh Output level, high Ioh = -2mA 0.8 * VDD V
DD V
OFF_REQ pin - IOH = -1mA VDD - 0.45 V
Vol Output level, low Iol = 2mA 0 0.3 V
OFF_REQ pin – Iol = 2mA 0.45 V
Vih Input voltage, high 2.7v < VDD <3.6v 1.8 VDD +0.3 V
Vil Input voltage, low 2.7v < VDD <3.6v -0.3 0.6 V
RESET, ON_OFF,PRES
pins
-0.3 0.8 V
Ileak Leakage current 0 < Vin < VDD
All output modes disabled,
pull-up/downs disabled
-5 5 μA
Ipu Pull-up current If provided and enabled,
Vout < 0.1v
-5 -3 μA
Ipd Pull-down current If provided and enabled,
Vout > VDD – 0.1v
3 5
μA
Symbol Parameter Conditions Min. Typ. Max. Unit
Iled LED drive current Vout = 1.3V,
2.7v < VDD < 3.6v
1.7
3.4
8.5
2
4
10
2.3
4.6
11.5
mA
Iolkrow Keypad Row output
low current
0.0v < Voh < 0.1v
when pull-up R is enabled
-40 -100
μA
Iolkcol Keypad column
output high current
0.0v < Voh < 0.1v
when col. is pulled low
-1.5 -3 mA
Rev. 1.2 117
73S1217F Data Sheet DS_1217F_002
118 Rev. 1.2
3.4 Oscillator Interface Requirements
Symbol Parameter Condition Min Typ. Max Unit
Low-Power Oscillator Requirements. No External Load Beside The Crystal And Capacitor Is
Permitted On Xout32
Pxtal Power in crystal 1 W
IIL Input Leakage Current GND < Vin < VDD
-5 5 A
High-frequency oscillator (XIN) Parameters. XIN is used as input for external clock for test
purposes only. A resistor connecting X12IN to X12OUT is required, value = 1MΩ
VILX12IN Input Low Voltage –
X12IN -0.3 0.3*VDD V
VIHX12IN Input High Voltage – X12IN 0.7*VDD Vdd+.0.3 V
IILXTAL Input Current -X12IN GND < Vin < Vdd -10 10 A
Fxtal Crystal resonant
frequency Fundamental mode 6 12 MHz
3.5 DC Characteristics: Analog Input
Symbol Parameter Condition Min Typ. Max Unit
VTHTOL Voltage Threshold
Tolerance
Selected Threshold
Value -3% +3% V
DS_1217F_002 73S1217F Data Sheet
3.6 USB Interface Requirements
Parameter Condition Min Typ. Max Unit
Receiver Parameters
Differential input sensitivity VDI |(DP)-(DM)| 0.2 V
Differential common mode
range VCM Includes VDI range 0.8 2.5 V
Single ended receiver
threshold VSE 0.8 2.0 V
Transmitter Levels
Low Level Output Voltage VOL USBCon = 1 (DP
pullup enabled) 0.3 V
High Level Output Voltage
VOH 15K resistor to
ground VDD – 0.1V VDD V
Output Resistance (1)
Driver output resistance ZDRV Steady state drive1 28 44
PD Pullup Resistor (to VDD) Zpu USBCon = 1 1.2 1.5 1.8 k
Transceiver Power Requirements
Operating supply
current(output) IPSO Outputs enabled 5 mA
Operating supply current
(input) IPSI Outputs Hi-Z 1 mA
Supply current in powerdown IPDN 10 nA
Supply current in suspend. IPSS 10 nA
1 External source (series) termination resistors of 24 must be included on circuit board.
Rev. 1.2 119
73S1217F Data Sheet DS_1217F_002
120 Rev. 1.2
Parameter Condition Min Typ. Max Unit
CL = 50pf, series 24Ω, 1% source termination resistor included
Rise Time USBTR 10% to 90% 4 20 ns
Fall Time USBTF 90% to 10% 4 20 ns
Rise/fall time matching TRFM (USBTR/USBTF) 90 111.11 %
Output signal crossover
voltage VCRS Includes VDI range 1.3 2.0 V
Source Jitter to Next
Transition TDJ1 Measured as in Figure 7-
49 of USB 2.0 Spec -3.5 3.5 ns
Source Jitter For Paired
Transitions TDJ2 Measured as in Figure 7-
49 of USB 2.0 Spec (1) (2) -4 4 ns
Receiver Jitter to Next
Transition TJR1
Measure as in Figure 7-51
of USB 2.0 Spec.
Characterized but not
production tested.
-18.5 18.5 ns
Receiver Jitter for Paired
Transitions TJR2
Measure as in Figure 7-51
of USB 2.0 Spec.
Characterized but not
production tested.
-9 9 ns
Source SE0 interval of
EOP TEOPT Figure 7-50 of USB 2.0
Spec 160 175 ns
Receiver SEO interval of
EOP TEOPR Figure 7-50 of USB 2.0
Spec. (3) 82 ns
(1) For both transitions of differential signaling.
(2) Excluding first transition from the Idle state.
(3) Must accept as valid EOP.
DS_1217F_002 73S1217F Data Sheet
3.7 Smart Card Interface Requirements
Symbol Parameter Condition Min Typ. Max Unit
Card Power Supply (VCC) Regulator
General conditions, -40°C < T < 85°C, 4.75V < VPC < 6.0V, 2.7V < VDD < 3.6V
VCC
Card supply Voltage
including ripple and
noise
Inactive mode -0.1 0.1 V
Inactive mode, ICC = 1mA -0.1 0.4 V
Active mode; ICC <65mA; 5V 4.65 5.25 V
Active mode; ICC < 65mA; 3V 2.85 3.15 V
Active mode; ICC < 40mA; 1.8V 1.68 1.92 V
Active mode; single pulse of
100mA for 2μs; 5 volt, fixed load
= 25mA
4.6 5.25 V
Active mode; single pulse of
100mA for 2μs; 3V, fixed load =
25mA
2.76 3.15 V
Active mode; current pulses of
40nAs with peak |ICC | <200mA, t
<400ns; 5V
4.6 5.25 V
Active mode; current pulses of
40nAs with peak |ICC | <200mA,t
<400ns; 3V
2.7 3.15 V
Active mode; current pulses of
20nAs with peak |ICC | <100mA,t
<400ns; 1.8V
1.62 1.92 V
VCCrip V
CC Ripple fRIPPLE = 20kHz – 200MHz 350 mV
ICCmax Card supply output
current
Static load current, VCC>1.65 40 mA
Static load current, VCC>4.6 or 2.7
volts as selected 65 mA
ICCF I
CC fault current Class A, B (5V and 3V) 100 180 mA
Class C (1.8V) 60 130
VSR Vcc slew rate, rise Rise rate on activate C = 0.47μF 0.12 .30 0.50
V/μs
VSF Vcc slew rate, fall Fall rate on deactivate, C = 0.47μF 0.15 .30 1.20
V/μs
Vrdy Vcc ready voltage
(VCCOK = 1)
5V operation, Vcc rising 4.6 V
3V operation, Vcc rising 2.75 V
1.8V operation, Vcc rising 1.65 V
Rev. 1.2 121
73S1217F Data Sheet DS_1217F_002
122 Rev. 1.2
Symbol Parameter Condition Min Typ. Max Unit
Interface Requirements – Data Signals: I/O, AUX1 and AUX2
VOH Output level, high IOH =0 0.9 *
VCC V
CC+0.1 V
IOH = -40μA 0.75 VCC V
CC+0.1 V
VOL Output level, low IOL = 1mA 0.15 *VCC V
VIH Input level, high 0.6 *
VCC V
CC+0.30 V
VIL Input level, low -0.15 0.2 * VCC V
VINACT Output voltage when outside
of session
IOL = 0 0.1 V
IOL = 1mA 0.3 V
ILEAK Input leakage VIH = VCC 10
μA
IIL Input current, low VIL = 0 0.65 mA
IIL Input current, low VIL = 0 0.7 mA
ISHORTL Short circuit output current For output low, shorted
to VCC through 33Ω 15 mA
ISHORTH Short circuit output current For output high, shorted
to ground through 33Ω 15 mA
tR, tF Output rise time, fall times
For I/O, AUX1, AUX2,
CL = 80pF, 10% to 90%.
For I/OUC, AUX1UC,
AUX2UC, CL = 50Pf,
10% to 90%.
100 ns
tIR, tIF Input rise, fall times 1 μs
RPU Internal pull-up resistor Output stable for >200ns 8 11 14 kΩ
FDMAX Maximum data rate 1 MHz
Reset and Clock for Card Interface, RST, CLK
VOH Output level, high IOH = -200μA 0.9 * VCC V
CC V
VOL Output level, low IOL = 200μA 0
0.15 *VCC V
VINACT Output voltage when outside
of session
IOL = 0 0.1 V
IOL = 1mA 0.3 V
IRST_LIM Output current limit, RST 30 mA
ICLK_LIM Output current limit, CLK 70 mA
tR, tF Output rise time, fall time
CL = 35pF for CLK,
10% to 90% 8 ns
CL = 200pF for RST,
10% to 90% 100 ns
δ Duty cycle for CLK
CL = 35pF, FCLK
≤ 20MHz, CLKIN duty
cycle is 48% to 52%.
45 55 %
DS_1217F_002 73S1217F Data Sheet
3.8 DC Characteristics
Symbol Parameter Condition Min Typ. Max Unit
IPC
Supply Current @ VPC = 2.7V
(VBUS and VBAT unconnected)
CPU clock @ 24MHz 52 65 78
mA
CPU clock @ 12MHz 39 48 58
mA
CPU clock @ 6MHz 31 39 46
mA
CPU clock @ 3.69MHz 28 35 42
mA
Supply Current @ VPC = 3.3V
(VBUS and VBAT unconnected)
CPU clock @ 24MHz 40 50 60
mA
CPU clock @ 12MHz 30 37 45
mA
CPU clock @ 6MHz 24 30 36
mA
CPU clock @ 3.69MHz 22 27 32
mA
Supply Current @ VPC = 5.0V
(VBUS and VBAT unconnected)
CPU clock @ 24MHz 24 30 35
mA
CPU clock @ 12MHz 18 22 26
mA
CPU clock @ 6MHz 14 18 21
mA
CPU clock @ 3.69MHz 13 16 19
mA
IVBUS
Supply Current @ VVBUS =
4.4V
CPU clock @ 24MHz 19 23 28
mA
CPU clock @ 12MHz 14 17 21
mA
CPU clock @ 6MHz 11 14 17
mA
CPU clock @ 3.69MHz 10 13 15
mA
Supply Current @ VVBUS =
5.0V
CPU clock @ 24MHz 19 23 28
mA
CPU clock @ 12MHz 14 17 21
mA
CPU clock @ 6MHz 11 14 17
mA
CPU clock @ 3.69MHz 10 13 15
mA
Supply Current @ VVBUS =
5.5V
CPU clock @ 24MHz 19 23 28
mA
CPU clock @ 12MHz 14 17 21
mA
CPU clock @ 6MHz 11 14 17
mA
CPU clock @ 3.69MHz 10 13 15
mA
Symbol Parameter Condition Min Typ. Max Unit
IVBAT
Supply Current @ VVBAT =
4.0V (VBUS = 0V)
CPU clock @ 24MHz 32 40 49
mA
CPU clock @ 12MHz 24 30 36
mA
CPU clock @ 6MHz 19 24 29
mA
CPU clock @
3.69MHz 17 22 26
mA
Supply Current @ VVBAT = CPU clock @ 24MHz 24 30 36
mA
Rev. 1.2 123
73S1217F Data Sheet DS_1217F_002
124 Rev. 1.2
5.0V (VBUS = 0V) CPU clock @ 12MHz 18 22 27
mA
CPU clock @ 6MHz 14 18 21
mA
CPU clock @
3.69MHz 13 16 19
mA
Supply Current @ VVBAT =
6.5V (VBUS = 0V)
CPU clock @ 24MHz 19 23 28
mA
CPU clock @ 12MHz 14 17 21
mA
CPU clock @ 6MHz 11 14 17
mA
CPU clock @
3.69MHz 10 13 15
mA
VDD VDD Supply Voltage 2.7V < VPC < 6.5V,
IVDD < 40mA.
3.0 3.3 3.6 V
IDD_IN Supply Current
(pins 28 and 40)
CPU clock @ 24MHz 29 33.5
mA
CPU clock @ 12MHz 21 24
mA
CPU clock @ 6MHz 15.5 18
mA
CPU clock @
3.69MHz 13.5 15.5 mA
Power down
(-40° to 85°C) 8 50
μA
Power down (25°C) 6 13
μA
IDD_OUT
Supply Current – pin 68
(available to external
circuitry)
Circuit ON 20 mA
IVBUS Supply Current from VBUS VCC off, IDDINTERNAL <
20μA 0.2 0.4 mA
IVBAT
IVPC
Supply Current from VBAT or
VPC Circuit OFF 0.01 1 μA
VBUSON V
BUS detection threshold 3.5 V
VBUSIDI
S
VBUS discharge current 50 A
External Capacitor Values
CVPC External filter capacitor for
VPC
8.0 10.0 12.0 μF
CVP External filter capacitor for VP 2.0 4.7 10.0
μF
CVDD* External filter capacitors for
VDD
0.2 1.0
μF
CVCC External filter capacitor for
VCC
CVCC should be
ceramic with low
ESR (<100MΩ).
0.2 0.47 1.0 μF
*Note: Recommend on 0.1μF for each VDD pin.
DS_1217F_002 73S1217F Data Sheet
3.9 Current Fault Detection Circuits
Symbol Parameter Condition Min Typ. Max Unit
IVPmax V
P over current fault 150 mA
IDDmax VDD over-current limit 40 100 mA
ICCF Card overcurrent fault 80 150 mA
ICCF1P8 Card overcurrent fault VCC = 1.8V 60 130 mA
Rev. 1.2 125
73S1217F Data Sheet DS_1217F_002
126 Rev. 1.2
4 Equivalent Circuits
VDD
X12LIN X12OUT
ENABLE
TTL
To
circuit
ESD
ESD
Figure 29: 12 MHz Oscillator Circuit
VDD
X32LIN
X32OUT
ENABLEb
TTL
To
circuit
>1MEG
ESD
ESD
Figure 30: 32KHz Oscillator Circuit
DS_1217F_002 73S1217F Data Sheet
PIN
VDD
STRONG
PFET
STRONG
NFET
Data
From
circuit
TTL
To
circuit
Output
Disable
ESD
Figure 31: Digital I/O Circuit
PIN
VDD
STRONG
PFET
STRONG
NFET
Data
From
circuit
Output
Disable
ESD
Figure 32: Digital Output Circuit
Rev. 1.2 127
73S1217F Data Sheet DS_1217F_002
128 Rev. 1.2
PIN
VDD
STRONG
PFET
STRONG
NFET
Data
From
circuit
TTL
To
circuit
Output
Disable
Pull-up
Disable
VERY
WEAK
PFET
ESD
Figure 33: Digital I/O with Pull Up Circuit
PIN
VDD
STRONG
PFET
STRONG
NFET
Data
From
circuit
TTL
To
circuit
Output
Disable
VERY
WEAK
NFET
Pull-down
Enable
ESD
Figure 34: Digital I/O with Pull Down Circuit
DS_1217F_002 73S1217F Data Sheet
PIN
TTL
To
circuit
ESD
Figure 35: Digital Input Circuit
PIN
VDD
STRONG
PFET
STRONG
NFET
Data
From
circuit
TTL
To
circuit
Output
Disable
Pull-up
Disable
ESD
VERY
WEAK
PFET
VERY
WEAK
NFET
Pull-down
Enable
ESD
Figure 36: OFF_REQ Interface Circuit
Rev. 1.2 129
73S1217F Data Sheet DS_1217F_002
130 Rev. 1.2
PIN
VDD
STRONG
PFET
STRONG
NFET
Data
From
circuit
TTL
To
circuit
Output
Disable
Pull-up
Disable
100k
OHM
ESD
Figure 37: Keypad Row Circuit
PIN
VDD
MEDIUM
PFET
STRONG
NFET
Data
From
circuit
TTL
To
circuit
Output
Disable
ESD
1200
OHMS
Figure 38: Keypad Column Circuit
DS_1217F_002 73S1217F Data Sheet
PIN
VDD
STRONG
PFET
STRONG
NFET
Data
From
circuit
TTL
To
circuit
Pullup
Disable
0, 2, 4,
10mA
Current Value
Control
ESD
Figure 39: LED Circuit
PIN
Vih>0.7*VDD
To Circuit
Logic
R= 20kΩ
This buffer has a
special input
threshold:
ESD
Figure 40: Test and Security Pin Circuit
Rev. 1.2 131
73S1217F Data Sheet DS_1217F_002
132 Rev. 1.2
PIN
To
Comparator
Input
ESD
Figure 41: Analog Input Circuit
PIN
VCC
STRONG
PFET
STRONG
NFET
From
circuit
ESD
ESD
Figure 42: Smart Card Output Circuit
DS_1217F_002 73S1217F Data Sheet
125ns
DELAY
IO
PIN
VCC
STRONG
PFET
STRONG
NFET
RL=11K
From
circuit
CMOS
To
circuit
ESD
ESD
Figure 43: Smart Card I/O Circuit
PIN
TTL
To
circuit
VERY
WEAK
NFET
Pull-down
Enable
ESD
ESD
VDD
Figure 44: PRES Input Circuit
Rev. 1.2 133
73S1217F Data Sheet DS_1217F_002
134 Rev. 1.2
DP
DM
TTL TTL
IN_P
IN_N
DP_IN
DM_IN
RCV_IN
RP_ENb
DP_OUT
DM_OUT ZOUT=
20Ω
ZOUT=
20Ω
OUTPUT ENABLEb
OUTPUT ENABLEb
1500 Ω
VDD
ESD
ESD
VDD
VDD
Figure 45: USB Circuit
PIN To Circuit
Logic
R= 24kΩ
ESD
VPC
Figure 46: ON_OFF Input Circuit
DS_1217F_002 73S1217F Data Sheet
4.1 Package Pin Designation (68-Pin QFN)
CAUTION: Use handling procedures necessary
for a static sensitive component
TERIDIAN
73S1217F
COL4
USR1
ROW3
USR3
USR4
USR5
VDD
DM
DP
GND
ROW2
USR6
ROW1
ROW0
USR7
TBUS0
TEST
VP
VBUS
CLK
GND
RST
VCC
AUX2
AUX1
IO
PRES
ON_OFF
VBAT
LIN
GND
VDD
SEC
SCL
SDA
X32OUT
X32IN
GND
XI2IN
X12OUT
COL0
COL1
COL2
ANA_IN
COL3
RXD
TXD
INT3
SIO
TBUS1
SCLK
TBUS2
RXTX
GND
TBUS3
VDD
TCLK
ERST
ROW5
ROW4
USR0
ISBR
RESET
USR2
INT2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
OFF_REQ
VPC
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
LED0
Figure 47: 73S1217F Pinout Figure 47: 73S1217F Pinout
Rev. 1.2 135
73S1217F Data Sheet DS_1217F_002
136 Rev. 1.2
4.2 Packaging Information .2 Packaging Information
68-Pin QFN Package Outline 68-Pin QFN Package Outline
Notes: 6.3mm x 6.3mm exposed pad area must remain UNCONNECTED (clear of PCB traces or
vias). Controlling dimensions are in mm.
Notes: 6.3mm x 6.3mm exposed pad area must remain UNCONNECTED (clear of PCB traces or
vias). Controlling dimensions are in mm.
TOP VIEWTOP VIEW
SEATING
PLANE
12°
SIDE VIEW
68
1
2
3
8.00
7.75
8.00
7.75
0.00/0.05
0.2
0.85
0.65
TERMINAL TIP
FOR ODD TERMINAL/SIDE
L
C
CC
0.40
SCALE: NONE
SECTION "C-C"
0.20
0.15/0.25
0.00/0.05
BOTTOM VIEW
68
PIN#1 ID
R0.20
0.45
8.00
8.00
6.30
6.15/6.45
0.42
0.24/0.60
0.42
0.24/0.60
6.40
6.40
6.30
6.15/6.45
1
2
3
Figure 48: 73S1217F 68 QFN Mechanical Drawing
DS_1217F_002 73S1217F Data Sheet
5 Ordering Information
Table 116 lists the order numbers and packaging marks used to identify 73S1217F products.
Table 116: Order Numbers and Packaging Marks
Part Description Order Number Packaging Mark
73S1217F 68-Pin QFN, Lead Free 73S1217F-68IM/F 73S1217F68IM
73S1217F 68-Pin QFN, Lead Free, Tape and Reel 73S1217F-IMR/F 73S1217F68IM
6 Related Documentation
The following 73S1217F documents are available from Teridian Semiconductor Corporation:
73S1217F Data Sheet (this document)
73S1217F Development Board Quick Start Guide
73S1217F Software Development Kit Quick Start Guide
73S1217F Evaluation Board User’s Guide
73S12xxF Software User’s Guide
73S12xxF Synchronous Card Design Application Note
7 Contact Information
For more information about Teridian Semiconductor products or to check the availability of the 73S1217F,
contact us at:
6440 Oak Canyon Road
Suite 100
Irvine, CA 92618-5201
Telephone: (714) 508-8800
FAX: (714) 508-8878
Email: scr.support@teridian.com
For a complete list of worldwide sales offices, go to http://www.teridian.com.
Rev. 1.2 137
73S1217F Data Sheet DS_1217F_002
138 Rev. 1.2
Revision History
Revision Date Description
1.0 5/15/2007 First publication.
1.1 11/7/2007 On page 2, changed bullet from “ISO-7816 UART 9600 to 115kbps for
protocols T=0, T=1” to “ISO-7816 UART for protocols T=0, T=1”.
In Table 1, removed NC, pin 44 row.
In Section 1.4, changed description to remove pre-boot and 32-cycle
references.
In Section 1.4, changed the second bullet “Page zero of flash memory, the
preferred location for the user’s preboot code, may not be page-erased by
either MPT or ICE. Page zero may only be erased with global flash erase.
Note that global flash erase erases XRAM whether the SECURE bit is set
or not.” to “Page zero of flash memory may not be page-erased by either
MPU or ICE. Page zero may only be erased with global flash erase. Note
that global flash erase erases XRAM whether the SECURE bit is set or
not.”
In Section 1.7.1, changed “Mcount is configured in the MCLKCtl register
must be bound between a value of 1 to 7. The possible crystal or external
clock are shown in Table 12.“ to “Mcount is configured in the MCLKCtl
register must be bound between a value of 1 to 7. The possible crystal or
external clock frequencies for getting MCLK = 96MHz are shown in Table
11.”
In Section 1.7.4, added “Depending on the state of the ON/OFF circuitry
and power applied to the VBUS input, the 73S1217F will go into either
standby mode or power “OFF” mode. If system power is provided by,
VBUS or the ON/OFF circuitry is in the “ON” state, the MPU core will
placed into standby mode.”
In the BRCON description, changed “If BSEL = 1, the baud rate is derived
using timer 1.” to “If BSEL = 0, the baud rate is derived using timer 1.”
In Section 1.7.15, removed the following from the emulator port
description: “The signals of the emulator port have weak pull-ups. Adding
resistor footprints for signals E_RST, E_TCLK and E_RXTX on the PCB is
recommended. If necessary, adding 10KΩ pull-up resistors on E_TCLK
and E_RXTX and a 3KΩ on E_RST will help the emulator operate
normally if a problem arises.”
In Section 1.7.17.1, added 230000 to the baud rate selections in bullet 7.
In the VccCtl description, added “The VDDFLT bit (if enabled) will provide
an emergency deactivation of the internal smart card slot. See the VDD
Fault Detect Function section for more detail.”
Changed last sentence of the DETTS bit description from “TS is decoded
prior to the FIFO and is stored in the receive FIFO,” to “TS is decoded
before being stored in the receive FIFO.”
In Ordering Information, removed the leaded part numbers.
1.2 12/16/2008
In Table 1, added more description to the VCC, VPC, VDD, SCL, SDA,
SEC, TEST and PRES pins.
In Section 1.3.2, changed “FLSH_ERASE” to “ERASE” and
“FLSH_PGADR” to “PGADDR”. Added “The PGADDR register denotes
the page address for page erase. The page size is 512 (200h) bytes and
there are 128 pages within the flash memory. The PGADDR denotes the
upper seven bits of the flash memory address such that bit 7:1 of the
PGADDR corresponds to bit 15:9 of the flash memory address. Bit 0 of
the PGADDR is not used and is ignored.” In the description of the
DS_1217F_002 73S1217F Data Sheet
PGADDR register, added “Note: the page address is shifted left by one bit
(see detailed description above).”
In Table 3, changed “FLSHCRL” to “FLSHCTL”.
In Table 5, removed the PREBOOT bit description.
In Table 5, moved the TRIMPCtl bit description to FUSECtl and moved the
FUSECtl bit description to TRIMPCtl.
In Table 6, changed “PGADR” to “PGADDR”.
In Table 7, added PGADDR.
In Table 8, changed the reset value for RTCCtl from “0x81” to “0x00”.
Added the RTCTrim0 and ACOMP registers. Deleted the OMP, VRCtl,
LEDCal and LOCKCtl registers.
In Table 11, removed Mcount entries 7, 8, 9 and 10.
In Figure 4, removed CPUCLK.
In Table 22, corrected the descriptions for TCON.2 and TCON.0.
In the Miscellaneous Control Register 1 (MISCtl1) description, added two
paragraphs about MPU clock rates of 12MHz or greater, changing the
MPU clock rate or the number of wait states.
Changed the register address for ATRMsB from FE21 to FE1F.
In Section 1.7.17.5, deleted “The ETU clock is held in reset condition until
the activation sequence begins (either by VCCOK=1 or VCCTMR timeout)
and will go high ½ the ETU period thereafter.”
In Section 1.7.17.5, added “Synchronous card operation is broken down
into three primary types. These are commonly referred to as 2-wire, 3-
wire and I2C synchronous cards. Each card type requires different control
and timing and therefore requires different algorithms to access. Teridian
has created an application note to provide detailed algorithms for each
card type. Refer to the application note titled 73S12xxF Synchronous
Card Design Application Note.”
In Table 85 and Table 114, changed the SYCKST bit to I2CMODE.
Replaced Figure 23, Figure 24, and Figure 25 with new timing diagrams.
In Table 114, replaced SYCKST (STXCtl, bit 7) with I2CMODE and
SCISYN (SPrtcol, bit 7) with I2CMODE.
In Figure 27 and Figure 28, replaced the schematics with new schematics.
In Section 3.4, changed the Fxtal Min value from 4 to 6.
Added Section 6, Related Documentation.
Added Section 7, Contact Information.
Formatted the document per new standard. Added section numbering.
Rev. 1.2 139
73S1217F Data Sheet DS_1217F_002
140 Rev. 1.2
© 2008 Teridian Semiconductor Corporation. All rights reserved.
Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.
Windows is a registered trademark of Microsoft Corporation.
Signum Systems is a trademark of Signum Systems Corporation.
All other trademarks are the property of their respective owners.
Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly
contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms
and Conditions. The company assumes no responsibility for any errors which may appear in this
document, reserves the right to change devices or specifications detailed herein at any time without
notice and does not make any commitment to update the information contained herein. Accordingly, the
reader is cautioned to verify that this document is current by comparing it to the latest version on
http://www.teridian.com or by checking with your sales representative.
Teridian Semiconductor Corp., 6440 Oak Canyon, Suite 100, Irvine, CA 92618
TEL (714) 508-8800, FAX (714) 508-8877, http://www.teridian.com
