Features
• High brightness
• Small size
• Industrial standard footprint
• Diffused optics
• Top emitting or right angle
emitting
• Compatible with IR soldering
• Compatible for use with light
piping
• Available in 8 mm tape on
7" diameter reel
• Reel sealed in zip locked moisture
barrier bags
Applications
• LCD backlighting
• Push button backlighting
• Front panel indicator
• Symbol indicator
• Microdisplays
• Small message panel signage
Description
These small chip-type LEDs utilize
high efficient and high brightness
InGaN material to deliver
competitively priced high
performance blue and green. These
520 nm green and 470 nm blue are
unique hues which provide color
differentiation to a product.
These ChipLEDs come in either top
emitting packages (HSMx-C130,
C150, C170, C177, C190, C191,
C197), in side emitting packages
(HSMx-C110, C120) or in a reverse
mount package (C265). The side
emitting package is especially
suitable for LCD backlighting
application. The top emitting
packages, with their wide viewing
angle, are suitable for direct
backlighting application or being
used with light pipes. In order to
facilitate pick and place operation,
these ChipLEDs are shipped in
tape and reel with 4000 units per
reel for HSMx-C120, C130, C170,
C177, C190, C191 and C197
packages, and 3000 units per reel
for HSMx-C110, C150 and C265
packages. All packages are
compatible with IR soldering and
binned by both color and intensity.
Agilent HSMx-C1xx
High Performance Chip LED
Data Sheet
HSMQ-C110/120/150/170/177/190/191/197/265,
HSMR-C110/120/130/150/170/177/190/191/197/265
CAUTION: HSMQ-C1xx and HSMR-C1xx are Class 1 ESD sensitive per MIL-STD-1686. Please observe
appropriate precautions during handling and processing. Refer to Agilent Technologies Application Note
AN-1142 for additional details.
2
Package Dimensions
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
2.0 (0.079 )
0.3 (0.012)
0.4 ± 0.15
(0.016 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.8 (0.031)
0.4 ± 0.15
(0.016 ± 0.006)
1.4
(0.055)
0.62 (0.024)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.25 (0.049)
HSMx-C170
CATHODE LINE
HSMx-C190
1.6
(0.063 )
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.8 (0.031)
0.3 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
0.4 (0.016)
LED DIE
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
0.7 (0.028) MIN.
CATHODE LINE
HSMx-C191
1.6
(0.063 )
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.6 (0.023)
0.3 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
0.4 (0.016)
LED DIE
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
CATHODE LINE
0.7 (0.028) MIN.
3.2 (0.126 )
0.5 (0.020)
0.8 (0.031)
POLARITY
CATHODE
LINE
1.5 (0.059)
LED DIE
CLEAR
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.0 (0.039)
1.0 (0.039)
2.6 (0.102 )
1.6 (0.063 )
CATHODE LINE
3.2 (0.126 )
HSMx-C110
3
Package Dimensions, continued
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
HSMx-C150
3.2 (0.126 )
0.5 (0.020)
0.50 ± 0.20
(0.020 ± 0.008)
0.6 (0.024)
POLARITY
CATHODE
MARK
1.1 (0.043)
0.50 ± 0.20
(0.020 ± 0.008)
2.0 (0.079)
0.8 (0.031)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.6 (0.063)
CATHODE LINE
CATHODE MARK
LED DIE
1.25
(0.049)
0.62
(0.025)
2.00 (0.079)
DIFFUSED EPOXY
PC BOARD
0.40 (0.016)
0.16 (0.006)
POLARITY
0.40 ± 0.15
(0.016 ± 0.006)
SOLDERING
TERMINAL
1.10 (0.043) MIN.
0.40 ± 0.15
(0.016 ± 0.006)
CATHODE LINE
HSMx-C177
0.80
(0.031) 1.60
(0.063) POLARITY
0.70 (0.028) MIN.
CATHODE LINE
0.30 ± 0.15
(0.012 ± 0.006)
DIFFUSED EPOXY
PC BOARD
0.40 (0.016)
0.16 (0.006)
SOLDERING
TERMINAL
0.40
(0.016)
CATHODE MARK
LED DIE
HSMx-C197
1.6 (0.063)
0.5 (0.020)
POLARITY
CATHODE MARK
1.0 (0.039)
3 – 0.3 (0.012)
1.2 (0.047)
0.3 (0.012)
LED DIE
CLEAR EPOXY
PC BOARD
SOLDERING
TERMINAL
0.6 (0.024)
CATHODE LINE
HSMx-C120
4
Absolute Maximum Ratings at TA = 25˚C
HSMQ-Cxxx
Parameter HSMR-Cxxx Units
DC Forward Current [1] 20 mA
Power Dissipation 78 mW
Reverse Voltage (IR = 100 µA) 5 V
LED Junction Temperature 95 ˚C
Operating Temperature Range –30 to +85 ˚C
Storage Temperature Range –40 to +85 ˚C
Soldering Temperature See reflow soldering profile (Figures 11 & 12)
Device Selection Guide
Package Dimension (mm) [1], [2] InGaN Green InGaN Blue Package Description
3.2(L) x 1.0(W) x 1.5(H) HSMQ-C110 HSMR-C110 Untinted, Non-diffused
1.6(L) x 0.6(W) x 1.0(H) HSMQ-C120 HSMR-C120 Untinted, Non-diffused
1.6(L) x 0.8(W) x 0.35(H) – HSMR-C130 Untinted, Diffused
3.2(L) x 1.6(W) x 1.1(H) HSMQ-C150 HSMR-C150 Untinted, Diffused
2.0(L) x 1.25(W) x 0.8(H) HSMQ-C170 HSMR-C170 Untinted, Diffused
2.0(L) x 1.25(W) x 0.4(H) HSMQ-C177 HSMR-C177 Untinted, Diffused
1.6(L) x 0.8(W) x 0.8(H) HSMQ-C190 HSMR-C190 Untinted, Diffused
1.6(L) x 0.8(W) x 0.6(H) HSMQ-C191 HSMR-C191 Untinted, Diffused
1.6(L) x 0.8(W) x 0.4(H) HSMQ-C197 HSMR-C197 Untinted, Diffused
3.4(L) x 1.25(W) x 1.1(H) HSMQ-C265 HSMR-C265 Untinted, Non-diffused
Notes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted.
Note: 1. Derate linearly as shown in Figure 4.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Package Dimensions, continued
1.6
(0.063)
0.12 (0.005)
0.3 ± 0.15
(0.012 ± 0.006)
0.23 (0.009)
CATHODE
MARK
0.35 (0.014)
0.3 ± 0.15
(0.012 ± 0.006)
1.15
(0.045)
LED DIE
DIFFUSED EPOXY
PCB BOARD
0.8 (0.031)
CATHODE LINE
0.7 (0.028) MIN.

POLARITY
(0.625)
SOLDERING
TERMINAL
HSMx-C130
3.4 (0.134)
0.3 (0.012)
0.50 ± 0.15
(0.020 ± 0.006)
1.1 (0.043)
POLARITY
CATHODE
MARK (ETCHED)
1.1 (0.043)
0.50 ± 0.15
(0.020 ± 0.006)
1.2
(0.047)
1.25 (0.049)
LED DIE
UNDIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
GREEN SOLDER MASK
CATHODE LINE
HSMx-C265
5
Optical Characteristics at TA = 25˚C
Luminous Color, Viewing Luminous
Intensity Peak Dominant Angle Efficacy
IV (mcd) Wavelength Wavelength 2 θ1/2 ηV
@ 20 mA[1] λpeak (nm) λd[2] (nm) Degrees[3] (lm/w)
Part Number Color Min. Typ. Typ. Typ. Typ. Typ.
HSMQ-C110 Green 45 150 520 527 130 500
HSMQ-C120 Green 45 145 520 527 155 500
HSMQ-C150/170/190/191 Green 45 145 520 527 140 500
HSMQ-C177/197 Green 45 145 520 527 130 500
HSMQ-C265 Green 45 140 520 527 150 500
HSMR-C110 Blue 18 60 469 473 130 88
HSMR-C120 Blue 18 55 469 473 155 88
HSMR-C130 Blue 18 55 469 473 145 88
HSMR-C150/170/190/191 Blue 18 55 469 473 140 88
HSMR-C177/197 Blue 18 55 469 473 130 88
HSMR-C265 Blue 18 45 469 473 150 88
Notes:
1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package.
2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristics at TA = 25˚C
Forward Voltage Reverse Breakdown Capacitance C Thermal
VF (Volts) VR (Volts) (pF), VF = 0, Resistance
@ IF = 20 mA @ IR = 100 µA f = 1 MHz RθJ–PIN (˚C/W)
Part Number Typ. Max. Min. Typ. Typ.
HSMQ-C110/C150 3.4 3.9 5 140 450
HSMR-C110/C150 3.4 3.9 5 140 450
HSMQ-C120 3.4 3.9 5 100 450
HSMR-C120/C130 3.4 3.9 5 100 450
HSMQ-C170/C190/C191 3.4 3.9 5 110 300
HSMR-C170/C190/C191 3.4 3.9 5 110 300
HSMQ-C177/C197 3.4 3.9 5 110 350
HSMR-C177/C197 3.4 3.9 5 110 350
HSMQ-C265 3.4 3.9 5 65 300
HSMR-C265 3.4 3.9 5 65 300
VF Tolerance: ±0.1 V
Blue Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 460.0 465.0
B 465.0 470.0
C 470.0 475.0
D 475.0 480.0
Note:
1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent
representative for information on currently available bins.
Color Bin Limits[1]
InGaN Green Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 515.0 520.0
B 520.0 525.0
C 525.0 530.0
D 530.0 535.0
Tolerance: ±1 nm Tolerance: ±1 nm
6
Figure 1. Relative intensity vs. wavelength.
Light Intensity (Iv) Bin Limits[1]
Intensity (mcd) Intensity (mcd)
Bin ID Min. Max. Bin ID Min. Max.
A 0.11 0.18 N 28.50 45.00
B 0.18 0.29 P 45.00 71.50
C 0.29 0.45 Q 71.50 112.50
D 0.45 0.72 R 112.50 180.00
E 0.72 1.10 S 180.00 285.00
F 1.10 1.80 T 285.00 450.00
G 1.80 2.80 U 450.00 715.00
H 2.80 4.50 V 715.00 1125.00
J 4.50 7.20 W 1125.00 1800.00
K 7.20 11.20 X 1800.00 2850.00
L 11.20 18.00 Y 2850.00 4500.00
M 18.00 28.50
Tolerance: ±15%
Note:
1. Bin categories are established for classification of products. Products may not be available in all
categories. Please contact your Agilent representative for information on currently available bins.
Figure 2. Forward current vs. forward voltage. Figure 3. Luminous intensity vs. forward
current.
Figure 4. Maximum forward current vs.
ambient temperature.
100
10
1
0.12.0 2.5 3.0 3.5 4.0
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
GREENBLUE
05 15
I
F
– FORWARD CURRENT – mA
0
0.4
1.0
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
20
0.6
0.2
0.8
10 25
1.2
GREEN
BLUE
WAVELENGTH – nm
RELATIVE INTENSITY – %
100
50
0600 700
BLUE GREEN
500400
90
80
70
60
40
30
20
10
0
020 60 80 90
5
IF MAX – MAXIMUM FORWARD CURRENT – mA
TA – AMBIENT TEMPERATURE – °C
40
15
10
20
RθJ-A = 600°C/W
RθJ-A = 500°C/W
25
10 30 50 70
7
Figure 5. Relative intensity vs. angle for HSMx-C110.
Figure 6. Relative intensity vs. angle for HSMx-C120.
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
20
40
-70 -50 -30 30 50 70 90-90 -10 10
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
20
40
-70 -50 -30 30 50 70 90-90 -10 10
100
90
80
70
60
50
40
30
20
10
0
RELATIVE INTENSITY
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
100
90
80
70
60
50
40
30
20
10
0
RELATIVE INTENSITY
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
8
Figure 9. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150.
Figure 7. Relative intensity vs. angle for HSMx-C177 and C197.
Figure 8. Relative intensity vs. angle for HSMx-C130.
Figure 10. Relative intensity vs. angle for HSMx-C265.
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
9
Figure 12. Recommended Pb-free reflow soldering profile.
Figure 13. Recommended soldering pattern for HSMx-C110. Figure 14. Recommended soldering pattern for HSMx-C170/177.
5.0 (0.200)
1.0 (0.039)
1.5
(0.059) 1.5
(0.059)
2.0
(0.079)
0.9 (0.035)
0.2 (0.008)
0.9 (0.035)
CENTERING
BOARD
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
Figure 16. Recommended soldering pattern for HSMx-C150.
1.5 (0.059)
1.5
(0.059) 1.5
(0.059)
2.0
(0.079)
Figure 15. Recommended soldering pattern
for HSMx-C130/190/191/197.
0.8 (0.031)
0.8
(0.031) 0.7
(0.028)
0.8
(0.031)
Figure 17. Recommended soldering pattern for HSMx-C120. Figure 18. Recommended soldering pattern for HSMx-C265.
0.7 (0.028)
0.8
(0.031) 0.8
(0.031)
1.2
(0.047)
0.4 (0.016)
0.15 (0.006)
0.4 (0.016)
CENTERING
BOARD
1.25 (0.049)
1.4
(0.055) 2.3
(0.091) 1.4
(0.055)
2.2 (0.087) DIA. PCB HOLE
217 °C
MAX. 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
100 - 150 °C
255 °C (+5/-0)
60 to 150 SEC.
10 to 20 SEC.
TIME
TEMPERATURE
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 11. Recommended reflow soldering profile.
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
3°C/SEC. MAX.
10
Figure 19. Reeling orientation.
Figure 20. Reel dimensions.
CATHODE SIDE
USER FEED DIRECTION
PRINTED LABEL
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
6
PS






178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020) 5.0 ± 0.5
(0.197 ± 0.020)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
11
Figure 21. Tape dimensions.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).





8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1) 0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157) 1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004) DIM. B
± 0.10 (0.004)PART NUMBER DIM. C
± 0.10 (0.004)


HSMx-C110/120
POSITION IN
CARRIER TAPE
DIM. B
(SEE TABLE 1)
DIM. A
(SEE TABLE 1)
R 1.0 ± 0.05
(0.039 ± 0.002)
FOR HSMx-C110
1.20 (0.047)
0.80 (0.031)
1.27 (0.050)
0.95 (0.037)
0.70 (0.028)
0.87 (0.034)
0.85 (0.033)
0.60 (0.024)
0.23 ± 0.05
(0.009 ± 0.002)
FOR HSMR-C130
R 0.5 ± 0.05
(0.020 ± 0.002)
FOR HSMx-C120
HSMx-C110 SERIES
HSMx-C120 SERIES
HSMx-C150 SERIES
HSMx-C170 SERIES
HSMx-C177 SERIES
HSMx-C190 SERIES
HSMx-C191 SERIES
HSMx-C197 SERIES
3.40 (0.134)
1.90 (0.075)
3.50 (0.138)
2.30 (0.091)
2.25 (0.089)
1.80 (0.071)
1.85 (0.073)
1.75 (0.069)
1.70 (0.067)
1.15 (0.045)
1.88 (0.074)
1.45 (0.057)
1.32 (0.052)
0.95 (0.037)
0.88 (0.035)
0.95 (0.037)



8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1) 0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157) 1.50 (0.059)
HSMx-C265 SERIES  3.70 (0.146) 1.45 (0.057) 1.30 (0.051)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004) DIM. B
± 0.10 (0.004)PART NUMBER DIM. C
± 0.10 (0.004)
Figure 22. Tape leader and trailer dimensions.
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Storage Condition:
5 to 30°C @ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been open for
more than 1 week
Baking recommended condition:
60 ± 5°C for 20 hours.
END START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR 
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Obsoletes 5988-4832EN
April 22, 2004
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