ARM Reference Board
Application Note Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA 1 EB_ARMAT91_XXAXX_B
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 ©2010 InvenSense, Inc. All rights reserved.
Website: http//www.invensense.com
InvenSense ARM Reference Board
Application Note
A printed copy of this document is NOT UNDER
REVISION CONTROL unless it is dated and stamped
in red ink as, “REVISION CONTROLLED COPY.”
ARM Reference Board
Application Note Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA 2 EB_ARMAT91_XXAXX_B
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 ©2010 InvenSense, Inc. All rights reserved.
Website: http//www.invensense.com
1. Revision History
Date Revision Description
05/26/2010 1.0 Initial release
06/23/2010 1.1 Updated BOM, added mechanical drawings for select
components, added firmware revision note.
08/11/2010 1.2 Updated firmware revision in Section 10.
ARM Reference Board
Application Note Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA 3 EB_ARMAT91_XXAXX_B
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 ©2010 InvenSense, Inc. All rights reserved.
Website: http//www.invensense.com
CONTENTS
1.REVISION HISTORY ....................................................................................................................................... 2
2.PURPOSE ..................................................................................................................................................... 4
3.USAGE ......................................................................................................................................................... 4
4.OTHER DOCUMENTS ..................................................................................................................................... 4
5.SCHEMATIC .................................................................................................................................................. 5
6.BOARD PHOTO ............................................................................................................................................. 6
7.COMPONENT LAYER SILK SCREEN ................................................................................................................. 7
8.TABLE 1. BILL OF MATERIALS (PARTS STUFFING LIST) .................................................................................... 8
9.MECHANICAL DRAWINGS FOR SELECTED BOM ITEMS .................................................................................... 9
10.PROGRAMMING THE ARM AT91 MCU ......................................................................................................... 11
ARM Reference Board
Application Note Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA 4 EB_ARMAT91_XXAXX_B
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 ©2010 InvenSense, Inc. All rights reserved.
Website: http//www.invensense.com
2. Purpose
This document describes the hardware and circuitry of the RB_ARMAT91_XXAXX_A reference board (also
known as InvenSense ARM board).
3. Usage
This reference board provides a bridge function between InvenSense evaluation boards and a PC. It
connects to a PC via USB and to InvenSense evaluation boards via SPI or I2C. The figure below sho ws the
ARM board connecting an IMU-3000 evaluation board to a Windows PC. (Note that the ARM board is used
as a general-purpose bridge and can also be used with other InvenSense EVBs, including the ITG-3xxx and
MPU-3xxx family of devices.) The ARM processor on the reference board is not meant to be reprogrammed
by the user. It contains all code necessary to be used in conjunction InvenSense evaluation boards. Note
that separate demonstration softwa re m ay accompany the individual evaluation boards with which this
device connects.
Figure 1. Example of ARM Board Used as Bridge between PC and IMU-3000 Evaluation Board. Note that
the ARM board is used as a general-purpose bridge and can also be used with other Inv enSense EVBs,
including the ITG-3xxx and MPU-3xxx family of devices.
4. Other Documents
Since the ARM board is meant to bridge between InvenSense evaluation boards and a PC, this document
should be used in conjun ction with the documents related to the particular board that is bein g use d with the
ARM Board.
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
PWR On
H/W
Reset
for
Debug
JTAG
User Header
(Female)
UART
for
Debug
3V3@0.6A
Reserved
DC 5V
@1A
D
GS
I2C
Invensense
1197 Borregas Ave
11
Sunnyvale, CA 94089
www.invensense.com
Phone: 408-988-7339
Fax: 408-988-8104
Title
Size Document Number
Rev
Date: Sheet of
TDI
JTAGSEL
RXD
ERASE
AD3
USB_D+
PLL_RC
XOUT
XIN
TXD
REG_1V8
A1V8_PLL
USB_DM
USB_DP
TDO
TMS
TCK
NRST
TST
TST
ERASE
PA2
AD7
AD6
AD5
AD4
AD0
PA17_TEMP
PA11_/SPI_CS
PA30_INT2PA6_HPS
PA20_INT1
RTCK
TCK
PA1
PA7_D_IO
JTAGSEL
ADC_VREF
PA19
PA18
PA3
PA24
PA21
PA23
PA4
PA22
USB_D-
AD7
PA21PA18
PA19
AD6
PA22
AD4
PA23
AD5
TDI
A1V8_PLL
TMS
TDO
PA4_SCL
PA24
PA0
NRST
PA13_MOSI
PA14_CLK
PA12_MISO
USB_DP_PUP
VBUS_DET
PA3
ARM_3V0
ARM_3V0
USB_5V
USB_5V
ARM_3V0
ARM_3V0
ARM_3V0
ARM_3V0
USB_5V
ARM_3V0
1
1
1
1
1
1 1
1
1
1
1
1
1
1
1
1
1
1
1
ARM_3V0
1
USB_5V ARM_3V0
1
ARM_3V0
ARM_3V0
1
1
1
ARM_3V0
ARM_3V0
ARM_3V0
ARM_3V0
ARM_3V0
USB_5V
1
USB_5V
ARM_3V0
ARM_3V0
BP5
0.1uF
L4
BEAD/0603
L0603
JP14
JP2P1_8X1_3S
L3
USB CHOKE DLW21HN900SQ2L
4
1
3
2
R9
0/0402
U1
AT91SAM7S256
64S.5\470
2
17
46
24
12
60
10
5
8
61
16
3
57
9
63
56
6
62
13
55
4
59
18
7
1
45
58
64
54
33
49
51
53
50
39
48
47
44
43
38
41
42
52
32
34
35
36
37
31
30
29
28
27
22
21
20
19
11
14
15
23
25
26
40
GND
GND
GND
VDDCORE
VDDCORE
GND
AD1/ PA18/ PGMD6
AD6
VDD_OUT
XOUT
AD3/ PA20/ PGMD8
AD4
DP
AD0/ PA17/ PGMD5
PLLRC
DM
AD7
PGMCK/XIN
AD2/ PA19/ PMGD7
ERASE
AD5
VDD_FLASH
VDDIO
VDD_IN
ADC_VREF
VDDIO
VDDIO
VDDPLL
VDDCORE
TDI
TDO
TMS
TCK
JTAG_SEL
RST
PGMEN0/PA0
PGMEN1/PA1
PGMEN2/PA2
PA3
PA28
PA29
PA30
PA31
PGMNVALID/PA7
PGMNOE/PA6
PGMNRDY/PA5
PGMNCMD/PA4
PA27
PGMM0/PA8
PGMM1/PA9
PGMM2/PA10
PGMM3/PA11
PA12
PA13
PA14
PA15
PA16
PA21
PA22
PA23
PA24
PA25
PA26
TEST MODE
R13
100/0603
R3
1.5K/0402
BP11
0.1uF
C10
1000pF/0402
R11
1K/0603
GS
D
Q1
DNS_P-MOS SI2301ADS/SOT23
SOT23GSD
G
SD
CON2
DNS_DC-JACK
1
3
2
C7
15PF/0402
1 2
LED2
LED_RED_0805
AC
R49
0R/0402
Y1
Crystal 18.432MHz@50ppm, SMD5032
1
2
3
4
BP12
0.1uF
SW1
PUSH SW
TSW2P7_1X6_6
2
3
1
4
C5
10uF/0603
R51
0R/0402
JP13
JP2P1_8X1_3S
C12
DNS_10pF/0402
C1
10uF/0603
CON1
miniUSB-A
5
4
3
1
2
6
7
8
9
GND
ID
DP
VBUS
DM
NC3
NC4
NC2
NC1
U2
SOT235
YB1231ST25X330
1 5
2
3 4
Vin OUT
GND
EN NC
BP13
0.1uF
RP1
10Kx4/0603
12
4
6
8
3
5
7
JP2
HEADER 10x1, Female, 180D, 2.0mm
1
2
3
4
5
6
7
8
9
10
H2
JP1
WAFER 4, 2.0mm , 90D
1
2
3
4
R5
22/0402
BP15
0.1uF
LED1
LED_GRN_0805
AC
R2
33K/0402
JP5
DNS_HEADER 3X2, Male, 180D, 2.0mmx2.0mm
2
4
6
1
3
5
BP14
0.1uF
C9
10uF/0603
H1
R15
100K/1%/0402
L1
BEAD/0603
L0603
M2
R50
0R/0402
JP9
HEADER 3
1
2
3
BP4
0.1uF
SW2
PUSH SW
TSW2P7_1X6_6
2
3
1
4
H4
R45
2K/0402
TP1
TEST-POINT
1
JP3
DNS_WAFER 4, 2.0mm , 90D
1
2
3
4
C3
10uF/0603
C13
DNS_10pF/0402
JP7
HEADER 10X2, Female, 90D, 2.54mmx2.54mm
1
3
5
7
9
11
13
15
17
19
2
4
6
8
10
12
14
16
18
20
JP6
DNS_HEADER 2, 100mil
1
2
C6
33pF/0402
1 2
R12
1.5K/0402
C8
15PF/0402
1 2
L2
BEAD/0603
L0603
R7
330K/0402
BP6
0.1uF
BP1
0.1uF
R10
100K/1%/0402
BP10
0.1uF
BP3
0.1uF
R4
22/0402
BP7
0.1uF
C2
100pF/0402
1 2
C4
10uF/0603
R46
2K/0402
BP16
0.1uF
JP8
DNS_HEADER 6X2, Male, 180D, 2.0mmx2.0mm
2
4
6
8
10
12
1
3
5
7
9
11
R6
330K/0402
BP8
0.1uF
R14
1M/0603
H3
BP2
0.1uF
R16
DNS_0/0402
C14
10uF/0603
JP4
HEADER 3X2, Male, 180D, 2.0mmx2.0mm
2
4
6
1
3
5
R8
510/0402
R1
22K/0402
M1
C11
0.01uF/25V/0402
BP9
0.1uF
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, CA 94089, USA 5
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 ©2010 InvenSense, Inc. All rights reserved.
Website: http://www.invensense.com
ARM Reference Board
Application Note
Rev 1.2; 08/11/2010
ARM Reference Board
Application Note Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA 6 EB_ARMAT91_XXAXX_B
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 ©2010 InvenSense, Inc. All rights reserved.
Website: http//www.invensense.com
6. Board Photo
Figure 3. Component-layer board photo
ARM Reference Board
Application Note Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA 7 EB_ARMAT91_XXAXX_B
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 ©2010 InvenSense, Inc. All rights reserved.
Website: http//www.invensense.com
7. Component Layer Silk Screen
Figure 4. Component-layer silk screen
ARM Reference Board
Application Note Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA 8 EB_ARMAT91_XXAXX_B
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 ©2010 InvenSense, Inc. All rights reserved.
Website: http//www.invensense.com
8. Table 1. Bill of Materials (Parts Stuffing List)
ItemQuantityReferencePartPCBFootprint
116BP1,BP2,BP3,BP4,BP5,BP6,BP7,BP8,BP9,
BP10,BP11,BP12,BP13,BP14,BP15,BP160.1uFC0402
21CON1miniUSB‐AUSB\MINI
31CON2(DONOTSTUFF)DCJack
46C1,C3,C4,C5,C9,C1410uF/0603C0603
51C2100pF/0402C0402
61C633pF/0402C0402
72C7,C815PF/0402C0402
81C101000pF/0402C0402
91C110.01uF/25V/0402C0402
101C12(DONOTSTUFF)10pF/0402
111C13(DONOTSTUFF)10pF/0402
121JP1WAFER4,80mil,ANGLEJ79\4SA90
131JP2HEADER10,80mil,Angle,FemaleJ79\10S
141JP3(DONOTSTUFF)HEADER4,80mil
151JP4HEADER3X2,80milJ79\6D
161JP5(DONOTSTUFF)HEADER3x2,2mmx2mm,Male
171JP6(DONOTSTUFF)HEADER2,100mil
181JP7HEADER10X2,100mil,FemaleJ100\20DF
191JP8(DONOTSTUFF)HEADER6X2,2mmx2mm,Male
201JP9HEADER3J79\3S
211LED1LED_GRN_0805LED0805AC
221LED2LED_RED_0805LED0805AC
233L1,L2,L4BEAD/0603L0603
241L3CHOKECM3216W900HCH4P1_25X2_05S
251Q1(DONOTSTUFF)P‐FETSI2301ADS/SOT23
261RP110Kx4/RP4A0603RN8P06SN
271R122K/0402R0402
281R233K/0402R0402
292R3,R121.5K/0402R0402
302R4,R533/0402R0402
312R6,R7330K/0402R0402
321R8510/0402R0402
334R9,R49,R50,R510/0402R0402
341R16(DONOTSTUFF)0/0402
352R10,R15100K/1%/0402R0402
361R111K/0603R0603
371R13100/0603R0603
381R141M/0603R0603
392R45,R462K/0402R0402
401SW1(DONOTSTUFF)PUSHSWTSW2P7_1X6_6
411SW2(DONOTSTUFF)PUSHSWTSW2P7_1X6_6
421U1ARM
AT91SAM7S6464S.5\470
431U23V3LDO
YB1231ST25X330SOT235
441Y1Crystal18.432MHz@50ppm,SMD5032SX‐5032
451BlankPrintedCircuitBoardGerber_ARM_EVB.rar
461FirmwareforARMV1.1.1FirmwareforARMMCU
ARM Reference Board
Application Note Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA 9 EB_ARMAT91_XXAXX_B
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 ©2010 InvenSense, Inc. All rights reserved.
Website: http//www.invensense.com
9. Mechanical Drawings for Selected BOM Items
Figure 5. BOM Item #12, JP1 Drawing
ARM Reference Board
Application Note Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA 10 EB_ARMAT91_XXAXX_B
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 ©2010 InvenSense, Inc. All rights reserved.
Website: http//www.invensense.com
Figure 6. BOM Item #20, JP9 Drawing (3-Pin Header)
Figure 7. BOM Item #24, L3 Drawing
ARM Reference Board
Application Note Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA 11 EB_ARMAT91_XXAXX_B
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 ©2010 InvenSense, Inc. All rights reserved.
Website: http//www.invensense.com
10. Programming the ARM AT91 MCU
The firmware for the InvenSense ARM Board mu st be factory programmed using the JTAG port JP2 with
Atmel’s programming tool and software. The current firmware revision is V1.1.2EVB. For upgrading boards
that have an older firmware revision, the ARM MCU may only be programmed by InvenSense or its
designated representatives .
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or
other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its
circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information
and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of
products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property
rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of
InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies.
InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or any other weapons or life
threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant
equipment, disaster pr evention and crime prev enti on equipment.
©2010 InvenSense, Inc. All rights reserved.
