DATA SHEE
T
CURRENT SENSOR - LOW
TCR
PF series
5%, 2%, 1%, 0.5%
sizes 0603/0805/1206/2010/2512/4527
RoHS compliant & Halogen free
Product specification – March 26, 2012 V.0 Supersedes Date of Mar. 06, 2003
Chip Resistor Surface Mount
w
ww.yageo.com
Mar. 26, 2012 V.0
Product specification
2
12
SERIES
PF
0603/0805/1206/2010/2512/4527
SCOPE
This specification describes PF
series current sensor - low TCR
with lead-free terminations made by
metal foil with ceramic substrate.
APPLICATIONS
Consumer goods
Computer
Telecom / Datacom
Industrial / Power supply
Automotive
Alternative Energy
FEATURES
Halogen-free Epoxy
RoHS compliant
- Products with lead-free
terminations meet RoHS
requirements
- Pb-glass contained in electrodes,
resistor element and glass are
exempted by RoHS
Reduce environmentally
hazardous wastes
High component and equipment
reliability
None forbidden-materials used in
products/production
Low resistances applied to
current sensing
Low inductance 0.5nH ~ 5nH
GLOBAL PART NUMBER
PF XXXX X X X XX XXXX Z
(1) (2) (3) (4) (5) (6) (7)
(1) SIZE
0603 / 0805 / 1206 / 2010 / 2512 / 4527
(2) TOLERANCE
D = ±0.5% F = ±1% G = ±2% J = ±5%
(3) PACKAGING TYPE
R = Paper taping reel
K = Embossed taping reel
(4) TEMPERATURE COEFFICIENT OF RESISTANCE
E = ±50 ppm/°C
M = ±75 ppm/°C
(5) TAPING REEL
07 / 7W / 7T / 47 / 57= 7 inch dia. Reel and specific rated power.
Detailed power rating are shown in the Table 2.
(6) RESISTANCE VALUE
1 m to 910 m
There are 3~5 digits indicated the resistance value. Letter R is decimal point.
Detailed coding rules of resistance are shown in the table of “Resistance rule of
global part number”.
(7) DEFAULT CODE
Letter Z is the system default code for ordering only.
(Note)
ORDERING EXAMPLE
The ordering code of a PF2512
1W chip resistor, value 0.005 X
with ±1% tolerance, supplied in 7-
inch tape reel is:
PF2512FKM070R005Z.
Resistance rule of global part
number
Resistance code rule
Example
0RXXX
(1 to 910 m)
0R001 = 1 m
0R1 = 100 m
0R91 = 910 m
NOTE
1. All our RSMD products are RoHS compliant. "LFP" of the internal 2D reel label mentions
"Lead-Free Process"
ORDERING INFORMATION
-
GLOBAL PART NUMBER
Global
part numbers are identified by the series, size, tolerance, packing
type, temperature coefficient, taping reel and resistance value.
Chip Resistor Surface Mount
w
ww.yageo.com
Mar. 26, 2012 V.0
Product specification
3
12
SERIES
PF
0603/0805/1206/2010/2512/4527
MARKING
PF0603
2 digits
PF0805
3 digits
PF1206 / PF2010 / PF2512 / PF4527
4 digits
The “R” is used as a decimal point; the other 3 digits are significant
Fig. 2 Value = 10 m
ynsc113
Fig. 3 Value = 33 m
ynsc114
CONSTRUCTION
The resistors are constructed using outstanding TCR level material, which makes Yageo PF resistors excellent
for current sensing application in battery charger circuit & DC-DC converter.
The composition of the resistive material is adjusted to give the approximate required resistance and is
covered with a protective coating. Marking is printed on the top side of the resistor.
Finally, the three external terminations (Cu / Ni / matte Tin) are added, as shown in Fig. 4.
W
L
I
1
H
marking layer
protective coat
resistive layer
ceramic substrate
end termination
YNSC11
5
Fig. 4 Chip resistor outlines
O
Ou
ut
tl
li
in
ne
es
s
For dimensions, please refer to Table 1
Fig. 1 Value = 10 mΩ
ynsc112
Chip Resistor Surface Mount
w
ww.yageo.com
Mar. 26, 2012 V.0
Product specification
4
12
SERIES
PF
0603/0805/1206/2010/2512/4527
TYPE RESISTANCE RANGE L (mm) W (mm)
H (mm) I
1
(mm)
PF0603
5 mΩ R < 100 mΩ 1.60 ±0.20 0.80 ±0.20
0.60 ±0.15 0.30 ±0.15
4 mΩ 2.00±0.20 1.25±0.20
0.60 ±0.15 0.70±0.15
5 mΩ 2.00±0.20 1.25±0.20
0.60±0.15 0.63±0.15
6 mΩ R 7 mΩ 2.00±0.20 1.25±0.20
0.60±0.15 0.55±0.15
PF0805
8 mΩ R < 100 mΩ 2.00±0.20 1.25±0.20
0.60±0.15 0.40±0.15
3 mΩ 3.20±0.20 1.60±0.20
0.60±0.15 1.30±0.20
4 mΩ 3.20±0.20 1.60±0.20
0.60±0.15 1.20±0.20
5 mΩ R 8 mΩ 3.20±0.20 1.60±0.20
0.60±0.15 1.15±0.20
PF1206
9 mΩ R < 100 mΩ 3.20±0.20 1.60±0.20
0.60±0.15 0.58±0.20
5 mΩ R 9 mΩ 5.00±0.20 2.50±0.20
0.60±0.15 1.50±0.20
PF2010
10 mΩ R < 100 mΩ 5.00±0.20 2.50±0.20
0.60±0.15 0.60±0.20
1 mΩ 6.30±0.20 3.10±0.20
0.60±0.15 2.93±0.20
2 mΩ 6.30±0.20 3.10±0.20
0.60±0.15 2.70±0.20
3m Ω 6.30±0.20 3.10±0.20
0.60±0.15 2.50±0.20
4m Ω 6.30±0.20 3.10±0.20
0.60±0.15 2.15±0.20
5 mΩ 6.30±0.20 3.10±0.20
0.60±0.15 1.95±0.20
6 mΩ R 8 mΩ 6.30±0.20 3.10±0.20
0.60±0.15 1.90±0.20
PF2512
9 mΩ R < 100 mΩ 6.30±0.20 3.10±0.20
0.60±0.15 0.95±0.20
5 mΩ 11.50±0.20 7.00±0.20
0.60±0.15 2.90±0.20
PF4527
6 mΩ R <1 Ω 11.50±0.20 7.00±0.20
0.60±0.15 2.60±0.20
Note:
1. For relevant physical dimensions, please refer to construction outlines.
2. Please contact with sales offices, distributors and representatives in your region before ordering.
DIMENSION
Ta ble 1 For outlines, please refer to Fig. 4
Chip Resistor Surface Mount
w
ww.yageo.com
Mar. 26, 2012 V.0
Product specification
5
12
SERIES
PF
0603/0805/1206/2010/2512/4527
POWER RATING
(1)
SERIES SIZE 07 7W 7T 47 57
TOLERANCE
RESISTANCE RANGE
TEMPERATURE COEFFICIENT
OF RESISTANCE
0603
1/10W 1/5W 1/3W 2/5W 1/2W
5 mΩ≦ R < 100 mΩ
0805
1/8W 1/4W 1/3W 1/2W --- 4 mΩ R < 100 mΩ
1206
1/4W 1/2W --- --- --- 3 mΩ R < 100 mΩ
2010
1W 2W --- --- --- 5 mΩ R < 100 mΩ
1W 2W --- --- --- 1 mΩ R < 100 mΩ
2512
--- --- 3W --- --- 1 mΩ R 50 mΩ
PF
4527
2W 3W 5W --- ---
±0.5%
±1%
±2%
±5%
5 mΩ R < 1Ω
±50 ppm/°C
±75 ppm/°C
Note: 1. Global part number (code 10 - 11)
2. Please contact with sales offices, distributors and representatives in your region before ordering.
ELECTRICAL CHARACTERISTICS
Ta b l e 2
MRA632
70 100
55 50
Tamb (°C)
(%Prated)
0
0
50
100
155
Pmax
Fig. 5
Maximum dissipation (P
max
) in percentage of rated power
as a function of the operating ambient temperature (T
amb
)
FUNCTIONAL DESCRIPTION
O
OP
PE
ER
RA
AT
TI
IN
NG
G
T
TE
EM
MP
PE
ER
RA
AT
TU
UR
RE
E
R
RA
AN
NG
GE
E
Range: –55°C to +155°C
P
PO
OW
WE
ER
R
R
RA
AT
TI
IN
NG
G
Standard rated power at 70°C:
PF0603 = 1/10W
PF0805 = 1/8W
PF1206 = 1/4W
PF2010 = 1/2W
PF2512 = 1W
PF4527 = 2W
For detail power value, please refer to Table 2.
RATED VOLTAGE
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by
the following formula:
V = (P X R)
Where
V = Continuous rated DC or
AC (rms) working voltage (V)
P = Rated power (W)
R = Resistance value (X)
Chip Resistor Surface Mount
w
ww.yageo.com
Mar. 26, 2012 V.0
Product specification
6
12
SERIES
PF
0603/0805/1206/2010/2512/4527
PACKING STYLE AND P
A
CKAGING QUANTITY
Table 3 Packing style and packaging quantity
PACKING STYLE REEL DIMENSION PF0603
PF0805
PF1206
PF2010 PF2512
PF4527
Paper taping reel (R)
7" (178 mm) 5,000
5,000
---
--- ---
---
Embossed taping reel (K)
7" (178 mm) ---
---
4,000
4,000 4,000
2,000
MBG251
E
FW
P2
P0
P1
D0
B0
A0
T
cover tape
Fig. 6 Paper Tape
PAPER TAPE
Table 4 Dimensions of paper tape for relevant chip resistors size
SYMBOL Unit: mm
SIZE
A
0
B
0
W E F P
0
P
1
P
2
ØD
0
T
PF0603
1.20±0.15 1.90±0.15
8.00±0.30 1.75±0.10
3.50±0.10
4.00±0.10
4.00±0.10
2.00±0.10 1.50±0.10
0.55±0.15
PF0805
1.60±0.15 2.30±0.15
8.00±0.30 1.75±0.10
3.50±0.10
4.00±0.10
4.00±0.10
2.00±0.10 1.50±0.10
0.85±0.15
Chip Resistor Surface Mount
w
ww.yageo.com
Mar. 26, 2012 V.0
Product specification
7
12
SERIES
PF
0603/0805/1206/2010/2512/4527
MBG516_b
E
FW
P2
P0
D0
B0
A0D1
P1
direction of unreeling
cover tape
T
Fig. 7 Embossed Tape
EMBOSSED TAPE
Table 5 Dimensions of embossed tape for relevant chip resistors size
SYMBOL Unit: mm
SIZE
A
0
B
0
W E F P
0
P
1
P
2
ØD
0
ØD
1
T
PF1206
1.82±0.15 3.53±0.15 8.00±0.30 1.75±0.10
3.50±0.10
4.00±0.10
4.00±0.10
2.00±0.10 1.50±0.10 1.50±0.10
0.85±0.15
PF2010
3.00±0.15 5.60±0.15 12.10±0.30 1.75±0.10
5.50±0.10
4.00±0.10
4.00±0.10
2.00±0.10 1.50±0.10 1.50±0.10
0.80±0.15
PF2512
3.40±0.15 6.70±0.15 12.10±0.30 1.75±0.10
5.50±0.10
4.00±0.10
4.00±0.10
2.00±0.10 1.50±0.10 1.50±0.10
0.80±0.15
PF4527
7.50±0.15 12.0±0.15 24.00±0.30 1.75±0.10
11.50±0.10
4.00±0.10
8.00±0.10
2.00±0.10 1.50±0.10 1.50±0.10
0.90±0.15
Chip Resistor Surface Mount
w
ww.yageo.com
Mar. 26, 2012 V.0
Product specification
8
12
SERIES
PF
0603/0805/1206/2010/2512/4527
NC
DA
W1
W2
HBK039_a
Fig. 8 Reel
REEL SPECIFICATION
REEL SIZE SYMBOL Unit: mm
SIZE
QUANTITY
PER REEL 8 mm TAPE WIDE 12 mm TAPE WIDE
A N C D W
1
W
2 MAX.
PF0603
5000 7" (Ø178 mm) --
180.0+0/-3
60.0+1/-0
13.0±0.2 21.0±0.8 8.4 +1/-0
12.4
PF0805
5000 7" (Ø178 mm) --
180.0+0/-3
60.0+1/-0
13.0±0.2 21.0±0.8 8.4 +1/-0
12.4
PF1206
4000 7" (Ø178 mm) --
180.0+0/-3
60.0+1/-0
13.0±0.2 21.0±0.8 8.4 +1/-0
12.4
PF2010
4000 -- 7" (Ø178 mm)
180.0+0/-3
60.0+1/-0
13.0±0.2 21.0±0.8 12.3 +1/-0
18.4
PF2512
4000 -- 7" (Ø178 mm)
180.0+0/-3
60.0+1/-0
13.0±0.2 21.0±0.8 12.3 +1/-0
18.4
PF4527
2000 -- 7" (Ø178 mm)
180.0+0/-3
60.0+1/-0
13.0±0.2 21.0±0.8 24.0 +1/-0
26.5
T
ab
l
e
6
Dim
e
n
s
i
o
n
s
o
f r
ee
l
spec
ifi
cat
i
o
n f
o
r r
e
l
eva
n
t
c
hi
p
r
es
i
sto
r
s
s
iz
e
LEADER
/
TRAILER
TA P E
S
PE
C
IFI
C
AT I
O
N
CCB325
empty compartments
with cover tape
(min. 200 mm)
cover tape only
leader 350 mm
trailer (max. 260 mm)
trailer end
leader end
Fig.9 Leader/Trailer Tape
Chip Resistor Surface Mount
w
ww.yageo.com
Mar. 26, 2012 V.0
Product specification
9
12
SERIES
PF
0603/0805/1206/2010/2512/4527
FOOTPRINT AND SOLDERING PROFILES
For recommended footprint and soldering profiles, please refer to data sheet “Chip resistors mounting”.
SCR022
B
A
C
D
preferred direction during
wave soldering
solder land /
solder paste
pattern
Fig. 10 Single resistor chips recommended dimensions of footprints
FOOTPRINT
Unit: mm
SIZE RESISTANCE RANGE
A
B
C D
PF0603
5 mΩ R < 100 mΩ 2.10 0.60 0.75 0.92
4 mΩ 2.70 0.40 2.30 1.44
5 mΩ 5.00 0.50 2.25 1.44
6 mΩ R 7 mΩ 4.80 0.60 2.10 1.44
PF0805
8 mΩ R < 100 mΩ 5.00 0.80 2.10 1.44
3 mΩ 6.20 0.40 2.90 1.84
4 mΩ 6.20 0.50 2.85 1.84
5 mΩ R 8 mΩ 6.20 0.60 2.80 1.84
PF1206
9 mΩ R < 100 mΩ 6.20 1.20 2.50 1.84
5 mΩ R 9 mΩ 8.00 1.40 3.30 2.88
PF2010
10 mΩ R < 100 mΩ 8.00 2.70 2.65 2.88
1 mΩ 9.30 0.40 4.45 3.57
2 mΩ 9.30 0.60 4.35 3.57
3 mΩ R 4 mΩ 9.30 0.90 4.20 3.57
5 mΩ R 8 mΩ 9.30 1.60 3.85 3.57
PF2512
9 mΩ R < 100 mΩ 9.30 3.10 3.10 3.57
5 mΩ 14.50 4.00 5.25 8.05
PF4527
6 mΩ R <1 Ω 14.50 4.40 5.05 8.05
Ta b l e 7 Footprint dimensions
Chip Resistor Surface Mount
w
ww.yageo.com
Mar. 26, 2012 V.0
Product specification
10
12
SERIES
PF
0603/0805/1206/2010/2512/4527
TESTS AND REQUIREMENTS
TEST TEST METHOD PROCEDURE REQUIREMENTS
Life/
Operational Life/
Endurance
MIL-STD-202G-method 108A
IEC 60115-1 4.25.1
JIS C 5202-7.10
1,000 hours at 70±5 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
±(1%+0.0005 )
High
Temperature
Exposure/
Endurance at
Upper Category
Temperature
MIL-STD-202G-method 108A
IEC 60115-1 4.25.3
JIS C 5202-7.11
1,000 hours at maximum operating temperature
depending on specification, unpowered
No direct impingement of forced air to the parts
Tolerances: 155±3 °C
±(1%+0.0005 )
Moisture
Resistance
MIL-STD-202G-method 106F
IEC 60115-1 4.24.2
Each temperature / humidity cycle is defined at 8
hours (method 106F), 3 cycles / 24 hours for 10d
with 25 °C / 65 °C 95% R.H, without steps 7a &
7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after
test conclusion
±(0.5%+0.0005 )
Thermal Shock
MIL-STD-202G-method 107G -55/+155 °C
Note: Number of cycles required is 300. Devices
unmounted
Maximum transfer time is 20 seconds. Dwell time
is 15 minutes. Air – Air
±(0.5%+0.0005 )
Short Time
Overload
MIL-R-55342D-para 4.7.5
IEC60115-1 4.13
5 times of rated power for 5 seconds at room
temperature
±(0.5%+0.0005 )
No visible damage
Board Flex/
Bending
IEC60115-1 4.33
Device mounted on PCB test board as described,
only 1 board bending required
Bending for 0603/0805: 3 mm
1206/2512/4527: 2 mm
Holding time: minimum 60 seconds
±(1%+0.05 )
No visible damage
Table 8 Test condition, procedure and requirements
Chip Resistor Surface Mount
w
ww.yageo.com
Mar. 26, 2012 V.0
Product specification
11
12
SERIES
PF
0603/0805/1206/2010/2512/4527
TEST TEST METHOD PROCEDURE REQUIREMENTS
Solderability
- Wetting
IPC/JEDECJ-STD-002B test B
IEC 60068-2-58
Electrical Test not required
Magnification 50X
SMD conditions:
1
st
step: method B, aging 4 hours at 155 °C
dry heat
2
nd
step: leadfree solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
Well tinned (95% covered)
No visible damage
- Leaching
IPC/JEDECJ-STD-002B test D
IEC 60068-2-58
Leadfree solder, 260 °C, 30 seconds
immersion time
No visible damage
- Resistance to
Soldering Heat
MIL-STD-202G-method 210F
IEC 60068-2-58
Condition B, no pre-heat of samples
Leadfree solder, 260 °C, 10 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
±(0.5%+0.0005 )
No visible damage
Chip Resistor Surface Mount
w
ww.yageo.com
Mar. 26, 2012 V.0
Product specification
12
12
SERIES
PF
0603/0805/1206/2010/2512/4527
“ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products itself are unchanged. Any
product change will be announced by PCN.”
REVISION HISTORY
REVISION DATE CHANGE NOTIFICATION DESCRIPTION
Version 0 Mar. 26, 2012 - - New datasheet for current sensor - low TCR PF series sizes of
0603/0805/1206/2010/2512/4527, 0.5%, 1%, 2% and 5% with lead-free
terminations