Revision of July 2017
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Part Number Current
Rating (A)
Voltage
Rating (VDC)
Interrupting
Ratings
Nominal Cold
DCR(Ω)1
Nominal I2t
(A2s)2 Marking
(Optional)3
F0603HI1000V032T 1.0 32
50 A at rated
voltage
0.210 0.08 E
F0603HI1500V032T 1.5 32 0.101 0.11 G
F0603HI2000V032T 2.0 32 0.057 0.24 I
F0603HI2500V032T 2.5 32 0.042 0.56 J
F0603HI3000V032T 3.0 32 0.030 0.72 K
F0603HI3500V032T 3.5 32 0.022 1.10 L
F0603HI4000V032T 4.0 32 0.018 2.08 M
F0603HI4500V032T 4.5 32 0.014 2.63 T
F0603HI5000V032T 5.0 32 0.013 3.25 N
F0603HI6000V032T 6.0 32 0.010 4.00 O
80 A at rated
voltage
F0603HI7000V032T 7.0 32 0.008 5.00 P
F0603HI8000V032T 8.0 32 0.006 7.00 R
Patent numbers “US6,034,589”, “US6,602,766”, “US7,268,661
B2”, “ZL00134544.3”, “ZL02114719.1”, “ZL200410104280.7”,
“ZL201020551360.8”, “ZL201010299185.2”,
“ZL201220030614.0”, “ZL201210020693.1”.
SolidMatrix® Surface Mount Fuses
HI Series (High Inrush), 0603 Size
Features:
Clearing Time Characteristics:
Agency Approval:
Recognized Under the Components Program of UL.
File Number: E232989.
Patents:
Ordering Information:
High inrush current withstanding capability
Ceramic Monolithic structure
Silver fusing element and silver termination with nickel and
tin plating
Symmetrical design with marking on both sides (optional)
Operating temperature range: -55°C to +125°C (with de-
rating)
Shape and Dimensions:
Unit Inch mm
L 0.063 ± 0.006 1.60 ± 0.15
W 0.031 ± 0.006 0.80 ± 0.15
T 0.031 ± 0.006 0.80 ± 0.15
B 0.014 ± 0.006 0.36 ± 0.15
1. Measured at ≤ 10% rated current and 25oC ambient. 2. Melting I2t at 1000% of current rating. 3. Green Marking Character Code.
W
T
B
L
% of Current Rating Clearing time at 25°C
100% 4 hours min.
200% 1 second min. 60 seconds max.
1000% (1-5A) 0.0002 seconds min. 0.02 seconds max.
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Revision of July 2017
0.001
0.01
0.1
1
10
100
110 100 1000
Pre-arcing Time (s)
Current (A)
SolidMatrix® Surface Mount Fuses
HI Series (High Inrush), 0603 Size
Average Pre-arcing Time Curves:
1.0 A
1.5 A
2.0 A
2.5 A
3.0 A
3.5 A
4.0 A
4.5 A
5.0 A
6.0 A
7.0 A
8.0 A
Revision of July 2017
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0.01
0.1
1
10
100
1000
10000
0.001 0.01 0.1 1 10 100
I2t (A2s)
Time (s)
SolidMatrix® Surface Mount Fuses
HI Series (High Inrush), 0603 Size
Average I2t vs. t Curves:
8.0 A
7.0 A
6.0 A
5.0 A
4.5 A
4.0 A
3.5 A
3.0 A
2.5 A
2.0 A
1.5 A
1.0 A
Revision of July 2017
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AirMatrix® Surface Mount Fuses
AF2 1.00 V125 T M
(1) (2) (3) (4) (5)
(1) Series Code: AF2
(2) Current Rating Code: 1.00—1.00A
(3) Voltage Rating Code: V125—125VDC
(4) Package Code: T - Tape & Reel, B - Bulk
(5) Marking Code: M - With Marking
Product Identification:
AF 1206 F 2.00 T M
(1) (2) (3) (4) (5) (6)
(1) Series Code: AF—AF Series, MF—MF Series
(2) Size Code: Standard EIA Chip Sizes
(3) Time/Current Characteristic: F
(4) Current Rating: 2.00—2.00A
(5) Package Code: T - Tape & Reel, B - Bulk
(6) Marking Code: M - With Marking
Recommended Land Pattern:
AF2 AF1206 MF2410 MF1210
Inch mm Inch mm Inch mm Inch mm
L 0.338 8.60 0.173 4.40 0.338 8.60 0.170 4.40
G 0.118 3.00 0.059 1.50 0.118 3.00 0.070 1.70
H 0.124 3.15 0.071 1.80 0.110 2.80 0.110 2.70
Chip Size Parts on 7 inch (178 mm) Reel
2410 (6125) 2,000
1210 (3225) 2,500
1206 (3216) 3,500
Packaging:
The maximum ambient temperature shall not exceed 35°C . Storage temperatures higher than 35°C could result in the deformation
of packaging materials.
The maximum relative humidity recommended for storage is 75%. High humidity with high temperature can accelerate the oxidation
of the solder plating on the termination and reduce the solderability of the components.
Sealed vacuum foil bags with desiccant should only be opened prior to use.
The products should not be stored in areas where harmful gases containing sulfur or chlorine are present.
Storage:
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Revision of July 2017
Reliability Test Test Condition and Requirement Test Reference
Reflow & Bend 3 reflows at 245°C followed by a 2 mm bend, 20% DCR change
max. (10% for ≤ 1 A), no mechanical damage
Refer to
AEM QIQ034 ,QIQ048
Solderability 245°C, 5 seconds, new solder coverage 90% minimum MIL-STD-202
Method 208
Soldering Heat Resistance 260°C, 10 seconds, 20% DCR change max. (10% for ≤ 1 A),
new solder coverage 75% minimum
MIL-STD-202
Method 210
Life 25°C, 2000 hours, 80% rated current (75% for < 1 A), voltage
drop change≤ ±20% Refer to AEM QIQ106
Thermal Shock -65°C to +125°C, 100 cycles, 10% DCR change max., no
mechanical damage MIL-STD-202
Method 107
Mechanical Vibration 5 – 3000 Hz, 0.4 inch double amplitude or 30 G peak, 10% DCR
change max., no mechanical damage MIL-STD-202
Method 204
Mechanical Shock 1500 G, 0.5 milliseconds, half-sine shocks, 10% DCR change
max., no mechanical damage MIL-STD-202
Method 213
Salt Spray 5% salt solution, 48 hour exposure, 10% DCR change max., no
excessive corrosion MIL-STD-202
Method 101
Moisture Resistance 10 cycles, 15% DCR change max., no excessive corrosion MIL-STD-202
Method 106
AirMatrix® Surface Mount Fuses
Environmental Tests:
Fuse Selection and Temperature De-rating Guideline:
The ambient temperature affects the current carrying
capacity of fuses. When a fuse is operating at a
temperature higher than 25oC, the fuse shall be “de-
rated”.
To select a fuse from the catalog, the following rule
may be followed:
Catalog Fuse Current Rating = Nominal Operating
Current / 0.75 / % De-rating at the maximum operating
temperature.
Example: At maximum operating temperature of 65oC,
% De-rating is 90%. The nominal operating current is 4
A. The current rating for fuse selected from the catalog
shall be:
4 / 0.75 / 90% = 5.9 or 6.3 A.
Temperature Effect On Current Rating
50
55
60
65
70
75
80
85
90
95
100
105
110
-55 -35 -15 5 25 45 65 85 105 125
% De-rating
Revision of July 2017
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AirMatrix® Surface Mount Fuses
Soldering Temperature Profile:
Profile Feature Pb-Free
Assembly
Preheat/Soak
Temperature Min (Tsmin)
Temperature Max(Tsmax)
Time(ts) from (Tsmin to Tsmax)
150°C
200°C
60~120 seconds
Ramp-uprate (TL to Tp) 3°C/second
max.
Liquidous temperature(TL)
Time(tL) maintained above TL 217°C
60~150 seconds
Peak package body temperature (Tp) 260°C
Time (tp)*within 5°C of the specified
classification temperature (Tc) 30 seconds *
Ramp-down rate (Tp to TL) 6°C/second
max.
Time 25°C to peak temperature 8 minutes max.
* Tolerance for peak profile temperature (Tp) is defined as
a supplier minimum and a user maximum
* Recommended Temperature Profile for Reflow Soldering
* Recommended Temperature Profile for Wave Soldering
Disclaimer:
Specifications are subject to change without notice. AEM products are designed for specific applications and should not be used for any purpose
(including, without limitation, automotive, aerospace, medical, life-saving applications, or any other application which requires especially high reliability
for the prevention of such defect as may directly cause damage to the third party’s life, body or property) not expressly set forth in applicable AEM
product documentation. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification
is suitable for use in a particular application. Warranties granted by AEM shall be deemed void for products used for any purpose not expressly set
forth in applicable AEM product documentation. AEM shall not be liable for any claims or damages arising out of products used in applications not
expressly intended by AEM as set forth in applicable AEM product documentation. The sale and use of AEM products is subject to AEM terms and
conditions of sale. Please refer to AEM’s website for updated catalog and terms and conditions of sale.