© 2019 Kingbright. All Rights Reserved. Spec No: DSAO4457 / 1201009103 Rev No: V.6B Date: 10/22/2019 Page 1 / 5
PACKAGE DIMENSIONS
SELECTION GUIDE
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
3. Luminous intensity value is traceable to CIE127-2007 standards.
AAAF3529LSEEZGKQBKS
3.5 x 2.8 mm Surface Mount SMD Chip LED
RECOMMENDED SOLDERING PATTERN
(units : mm; tolerance : ± 0.1)
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.008") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to
change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
DESCRIPTIONS
The Hyper Red source color devices are made with
AlGaInP on GaAs substrate Light Emitting Diode
The Green source color devices are made with InGaN
on Sapphire Light Emitting Diode
The Blue source color devices are made with InGaN
Light Emitting Diode
Electrostatic discharge and power surge could
damage the LEDs
It is recommended to use a wrist band or
anti-electrostatic glove when handling the LEDs
All devices, equipments and machineries must be
electrically grounded
FEATURES
Outstanding material efficiency
Low power consumption
Can produce any color in visible spectrum, including
white light
Suitable for all SMD assembly and solder process
Available on tape and reel
Package: 2000pcs / reel
Moisture sensitivity level: 3
RoHS compliant
APPLICATIONS
Backlight
Status indicator
Home and smart appliances
Wearable and portable devices
Healthcare applications
ATTENTION
Observe precautions for handling
electrostatic discharge sensitive devices
Part Number Emitting Color
(Material) Lens Type
Iv (mcd) @ 2mA [2] Viewing Angle [1]
Min. Typ. 2θ1/2
AAAF3529LSEEZGKQBKS
■ Hyper Red
(AlGaInP)
Water Clear
10 20
■ Green (InGaN) 80 180
■ Blue (InGaN) 12 30
130°
© 2019 Kingbright. All Rights Reserved. Spec No: DSAO4457 / 1201009103 Rev No: V.6B Date: 10/22/2019 Page 2 / 5
ABSOLUTE MAXIMUM RATINGS at TA=25°C
ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C
AAAF3529LSEEZGKQBKS
Parameter Symbol Emitting Color
Value
Unit
Typ. Max.
Wavelength at Peak Emission IF = 2mA λpeak
Hyper Red
Green
Blue
630
515
460
- nm
Dominant Wavelength IF = 2mA λdom [1]
Hyper Red
Green
Blue
621
525
465
- nm
Spectral Bandwidth at 50% Φ REL MAX
IF = 2mA Δλ Hyper Red
Green
Blue
20
35
25
- nm
Capacitance C
Hyper Red
Green
Blue
25
45
100
- pF
Forward Voltage IF = 2mA VF [2]
Hyper Red
Green
Blue
1.8
2.65
2.65
2.1
3.1
3.1
V
Reverse Current (VR = 5V) IR
Hyper Red
Green
Blue
-
10
50
50
µA
Temperature Coefficient of λpeak
IF = 2mA, -10°C ≤ T ≤ 85°C TCλpeak
Hyper Red
Green
Blue
0.13
0.05
0.04
- nm/°C
Temperature Coefficient of λdom
IF = 2mA, -10°C ≤ T ≤ 85°C TCλdom
Hyper Red
Green
Blue
0.06
0.03
0.03
- nm/°C
Temperature Coefficient of VF
IF = 2mA, -10°C ≤ T ≤ 85°C TCV
Hyper Red
Green
Blue
-1.9
-2.9
-2.9
- mV/°C
Parameter Symbol Value
Unit
Hyper Red Green Blue
Power Dissipation PD mW
Reverse Voltage VR 5 5 5 V
Junction Temperature Tj 115 115 115 °C
Operating Temperature Top -40 to +85 °C
Storage Temperature Tstg -40 to +85 °C
DC Forward Current IF 50 30 30 mA
Peak Forward Current IFM [1] 195 150 150 mA
Electrostatic Discharge Threshold (HBM) - 3000 450 250 V
Thermal Resistance (Junction / Ambient) Rth JA [2] 300 360 380 °C/W
Thermal Resistance (Junction / Solder point) Rth JS [2] 160 250 250 °C/W
125 123 120
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd: ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
Notes:
1. 1/10 Duty Cycle , 0.1ms Pulse Width .
2. Rth
JA, Rth
JS Results from mounting on PC board FR4 (pad size≥16 mm2 per pad).
3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
© 2019 Kingbright. All Rights Reserved. Spec No: DSAO4457 / 1201009103 Rev No: V.6B Date: 10/22/2019 Page 3 / 5
AAAF3529LSEEZGKQBKS
TECHNICAL DATA
0%
20%
40%
60%
80%
100%
350 400 450 500 550 600 650 700 750 800
T
a
= 25 °C
Blue Green Red
Wavelength (nm)
Relative Intensity (a. u.)
RELATIVE INTENSITY vs. WAVELENGTH
0.5 0.50.0
-90°
-75°
-60°
-45°
-30°
-15°
75°
60°
45°
30°
0° 15°
90°
1.0 1.0
T
a
= 25 °C
SPATIAL DISTRIBUTION
0
2
4
6
8
10
2.0 2.2 2.4 2.6 2.8 3.0 3.2
T
a
= 25 °C
Forward voltage (V)
Forward current (mA)
0.0
1.0
2.0
3.0
4.0
5.0
0246810
T
a
= 25 °C
Forward current (mA)
Luminous intensity normalised
at 2 mA
0
10
20
30
40
50
-40-20 0 20406080100
Ambient temperature (°C)
Permissible forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
-40-20 0 20406080100
Ambient temperature (°C)
Luminous intensity normalised
at T a = 25 °C
BLUE
Forward Current vs.
Forward Voltage
Luminous Intensity vs.
Forward Current
Forward Current Derating Curve Luminous Intensity vs.
Ambient Temperature
GREEN
0
2
4
6
8
10
2.0 2.4 2.8 3.2 3.6 4.0
Ta = 25 °C
Forward voltage (V)
Forward current (mA)
0.0
1.0
2.0
3.0
4.0
5.0
0246810
Ta = 25 °C
Forward current (mA)
Luminous intensity normalised
at 2 mA
0
10
20
30
40
50
-40-20 0 20406080100
Ambient temperature (°C)
Permissible forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
-40-20 0 20406080100
Ambient temperature (°C)
Luminous intensity normalised
at T a = 25 °C
Forward Current vs.
Forward Voltage
Luminous Intensity vs.
Forward Current
Forward Current Derating Curve Luminous Intensity vs.
Ambient Temperature
HYPER RED
0
2
4
6
8
10
1.5 1.7 1.9 2.1 2.3 2.5
T
a
= 25 °C
Forward voltage (V)
Forward current (mA)
0.0
1.0
2.0
3.0
4.0
5.0
0246810
T
a
= 25 °C
Forward current (mA)
Luminous intensity normalised
at 2 mA
0
10
20
30
40
50
60
-40-20 0 20406080100
Ambient temperature (°C)
Permissible forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
-40-200 20406080100
Ambient temperature (°C)
Luminous intensity normalised
at T a = 25 °C
Forward Current vs.
Forward Voltage
Luminous Intensity vs.
Forward Current
Forward Current Derating Curve Luminous Intensity vs.
Ambient Temperature
© 2019 Kingbright. All Rights Reserved. Spec No: DSAO4457 / 1201009103 Rev No: V.6B Date: 10/22/2019 Page 4 / 5
AAAF3529LSEEZGKQBKS
TAPE SPECIFICATIONS (units : mm)
REEL DIMENSION (units : mm)
REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS
Notes:
1. Don't cause stress to the LEDs while it is exposed to high temperature.
2. The maximum number of reflow soldering passes is 2 times.
3. Reflow soldering is recommended. Other soldering methods are not recommended as they might
cause damage to the product.
PACKING & LABEL SPECIFICATIONS
© 2019 Kingbright. All Rights Reserved. Spec No: DSAO4457 / 1201009103 Rev No: V.6B Date: 10/22/2019 Page 5 / 5
AAAF3529LSEEZGKQBKS
PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes
HANDLING PRECAUTIONS
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is
more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone
encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED.
2. Do not directly touch or handle the silicone lens
surface. It may damage the internal circuitry.
1. Handle the component along the
side surfaces by using forceps or
appropriate tools.
3. Do not stack together assembled
PCBs containing exposed LEDs.
Impact may scratch the silicone lens
or damage the internal circuitry.
4-1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4-2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4-3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure
precise pickup and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver
plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such
substances.
