© Semiconductor Components Industries, LLC, 2016
August, 2016 − Rev. 7
1Publication Order Number:
MC10EP16/D
MC10EP16, MC100EP16
3.3 V / 5 V ECL Differential
Receiver/Driver
Description
The EP16 is a world−class differential receiver/driver. The device is
functionally equivalent to the EL16 and LVEL16 devices with higher
performance capabilities. With output transition times significantly
faster than the EL16 and LVEL16, the EP16 is ideally suited for
interfacing with high frequency sources.
The VBB pin, an internally generated voltage supply, is available to
this device only. For single-ended input conditions, the unused
differential input is connected to VBB as a switching reference voltage.
VBB may also rebias AC coupled inputs. When used, decouple VBB
and VCC via a 0.01 mF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, VBB should be left open.
Under open input conditions (pulled to VEE) internal input clamps
will force the Q output LOW.
The 100 Series contains temperature compensation.
Features
•220 ps Typical Propagation Delay
•Maximum Frequency = > 4 GHz Typical
•PECL Mode Operating Range:
VCC = 3.0 V to 5.5 V with VEE = 0 V
•NECL Mode Operating Range:
VCC = 0 V with VEE = −3.0 V to −5.5 V
•Open Input Default State
•Safety Clamp on Inputs
•Q Output Will Default LOW with Inputs Open or at VEE
•VBB Output
•These Devices are Pb-Free, Halogen Free and are RoHS Compliant
SOIC−8 NB
D SUFFIX
CASE 751−07
MARKING DIAGRAMS*
TSSOP−8
DT SUFFIX
CASE 948R−02
ALYWG
G
HP16
ALYWG
G
KP16
1
8
1
8
1
8
www.onsemi.com
*For additional marking information, refer to
Application Note AND8002/D.
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
ORDERING INFORMATION
1
8
HEP16
ALYW
G
1
8
KEP16
ALYW
G
1
8
DFN8
MN SUFFIX
CASE 506AA
(Note: Microdot may be in either location)
SOIC−8 NB TSSOP−8 DFN8
5L MG
G
14
3B MG
G
14
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G= Pb-Free Package
H = MC10
K = MC100
5L = MC10
3B = MC100
M= Date Code
MC10EP16, MC100EP16
www.onsemi.com
2
1
2
3
45
6
7
8
Q
VEE
VCC
Figure 1. 8−Lead Pinout (Top View) and Logic Diagram
D
Q
D
VBB
NC
D*, D** ECL Data Inputs
Q, Q ECL Data Outputs
VBB Reference Voltage Output
VCC Positive Supply
VEE Negative Supply
NC No Connect
Table 1. PIN DESCRIPTION
* Pins will default LOW when left open.
** Pins will default to VCC/2 when left open.
PIN FUNCTION
EP (DFN8 only) Thermal exposed pad
must be connected to a sufficient ther-
mal conduit. Electrically connect to the
most negative supply (GND) or leave
unconnected, floating open.
Table 2. ATTRIBUTES
Characteristics Value
Internal Input Pulldown Resistor 75 kW
Internal Input Pullup Resistor 37.5kW
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 4 kV
> 200 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb-Free Pkg
SOIC−8 NB
TSSOP−8
DFN8
Level 1
Level 3
Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Transistor Count 167 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
MC10EP16, MC100EP16
www.onsemi.com
3
Table 3. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
VCC PECL Mode Power Supply VEE = 0 V 6 V
VEE NECL Mode Power Supply VCC = 0 V −6 V
VIPECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI ≤ VCC
VI ≥ VEE
6
−6
V
Iout Output Current Continuous
Surge
50
100
mA
IBB VBB Sink/Source ±0.5 mA
TAOperating Temperature Range −40 to +85 °C
Tstg Storage Temperature Range −65 to +150 °C
qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm
500 lfpm
SOIC−8 NB
SOIC−8 NB
190
130
°C/W
qJC Thermal Resistance (Junction-to-Case) Standard Board SOIC−8 NB 41 to 44 °C/W
qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
qJC Thermal Resistance (Junction-to-Case) Standard Board TSSOP−841 to 44 °C/W
qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
Tsol Wave Solder (Pb-Free) 265 °C
qJC Thermal Resistance (Junction-to-Case) (Note 2) DFN8 35 to 40 °C/W
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
2. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
Table 4. 10EP DC CHARACTERISTICS, PECL (VCC = 3.3 V, VEE = 0 V (Note 1))
−40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
IEE Power Supply Current 20 24 31 20 24 31 20 24 32 mA
VOH Output HIGH Voltage (Note 2) 2165 2290 2415 2230 2355 2480 2290 2415 2540 mV
VOL Output LOW Voltage (Note 2) 1365 1490 1615 1430 1555 1680 1490 1615 1740 mV
VIH Input HIGH Voltage (Single-Ended) 2090 2415 2155 2480 2215 2540 mV
VIL Input LOW Voltage (Single-Ended) 1365 1690 1430 1755 1490 1815 mV
VBB Output Voltage Reference 1790 1890 1990 1855 1955 2055 1915 2015 2115 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 3)
2.0 3.3 2.0 3.3 2.0 3.3 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current
D
D
0.5
−150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V.
2. All loading with 50 W to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
MC10EP16, MC100EP16
www.onsemi.com
4
Table 5. 10EP DC CHARACTERISTICS, PECL (VCC = 5.0 V, VEE = 0 V (Note 1))
−40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
IEE Power Supply Current 20 24 31 20 24 31 20 24 32 mA
VOH Output HIGH Voltage (Note 2) 3865 3990 4115 3930 4055 4180 3990 4115 4240 mV
VOL Output LOW Voltage (Note 2) 3065 3190 3315 3130 3255 3380 3190 3315 3440 mV
VIH Input HIGH Voltage (Single-Ended) 3790 4115 3855 4180 3915 4240 mV
VIL Input LOW Voltage (Single-Ended) 3065 3390 3130 3455 3190 3515 mV
VBB Output Voltage Reference 3490 3590 3690 3555 3655 3755 3615 3715 3815 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 3)
2.0 5.0 2.0 5.0 2.0 5.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current
D
D
0.5
−150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V.
2. All loading with 50 W to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 6. 10EP DC CHARACTERISTICS, NECL (VCC = 0 V; VEE = −5.5 V to −3.0 V (Note 1))
−40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
IEE Power Supply Current 20 24 31 20 24 31 20 24 32 mA
VOH Output HIGH Voltage (Note 2) −1135 −1010 −885 −1070 −945 −820 −1010 −885 −760 mV
VOL Output LOW Voltage (Note 2) −1935 −1810 −1685 −1870 −1745 −1620 −1810 −1685 −1560 mV
VIH Input HIGH Voltage (Single-Ended) −1210 −885 −1145 −820 −1085 −760 mV
VIL Input LOW Voltage (Single-Ended) −1935 −1610 −1870 −1545 −1810 −1485 mV
VBB Output Voltage Reference −1510 −1410 −1310 −1445 −1345 −1245 −1385 −1285 −1185 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 3)
VEE + 2.0 0.0 VEE + 2.0 0.0 VEE + 2.0 0.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current
D
D
0.5
−150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC.
2. All loading with 50 W to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
MC10EP16, MC100EP16
www.onsemi.com
5
Table 7. 100EP DC CHARACTERISTICS, PECL (VCC = 3.3 V, VEE = 0 V (Note 1))
−40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
IEE Power Supply Current 17 25 36 17 25 36 22 26 38 mA
VOH Output HIGH Voltage (Note 2) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mV
VOL Output LOW Voltage (Note 2) 1355 1480 1605 1355 1480 1605 1355 1480 1605 mV
VIH Input HIGH Voltage (Single-Ended) 2075 2420 2075 2420 2075 2420 mV
VIL Input LOW Voltage (Single-Ended) 1355 1675 1355 1675 1355 1675 mV
VBB Output Voltage Reference 1775 1875 1975 1775 1875 1975 1775 1875 1975 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 3)
2.0 3.3 2.0 3.3 2.0 3.3 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current
D
D
0.5
−150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V.
2. All loading with 50 W to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 8. 100EP DC CHARACTERISTICS, PECL (VCC = 5.0 V, VEE = 0 V (Note 1))
−40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
IEE Power Supply Current 17 25 36 17 25 36 22 26 38 mA
VOH Output HIGH Voltage (Note 2) 3855 3980 4105 3855 3980 4105 3855 3980 4105 mV
VOL Output LOW Voltage (Note 2) 3055 3180 3305 3055 3180 3305 3055 3180 3305 mV
VIH Input HIGH Voltage (Single-Ended) 3775 4120 3775 4120 3775 4120 mV
VIL Input LOW Voltage (Single-Ended) 3055 3375 3055 3375 3055 3375 mV
VBB Output Voltage Reference 3475 3575 3675 3475 3575 3675 3475 3575 3675 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note3)
2.0 5.0 2.0 5.0 2.0 5.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current
D
D
0.5
−150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V.
2. All loading with 50 W to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
MC10EP16, MC100EP16
www.onsemi.com
6
Table 9. 100EP DC CHARACTERISTICS, NECL (VCC = 0 V; VEE = −5.5 V to −3.0 V (Note 1))
−40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
IEE Power Supply Current 17 25 36 17 25 36 22 26 38 mA
VOH Output HIGH Voltage (Note 2) −1145 −1020 −895 −1145 −1020 −895 −1145 −1020 −895 mV
VOL Output LOW Voltage (Note 2) −1945 −1820 −1695 −1945 −1820 −1695 −1945 −1820 −1695 mV
VIH Input HIGH Voltage (Single-Ended) −1225 −880 −1225 −880 −1225 −880 mV
VIL Input LOW Voltage (Single-Ended) −1945 −1625 −1945 −1625 −1945 −1625 mV
VBB Output Voltage Reference −1525 −1425 −1325 −1525 −1425 −1325 −1525 −1425 −1325 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 3)
VEE + 2.0 0.0 VEE + 2.0 0.0 VEE + 2.0 0.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current
D
D
0.5
−150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC.
2. All loading with 50 W to VCC −2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 10. AC CHARACTERISTICS (VCC = 0 V; VEE = −3.0 V to −5.5 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 1))
−40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
fmax Maximum Frequency (Figure 2) > 4 > 4 > 4 GHz
tPLH,
tPHL
Propagation Delay to
Output Differential
150 220 280 150 220 280 160 240 300 ps
tSKEW Duty Cycle Skew (Note 2) 5.0 20 5.0 20 5.0 20 ps
tJITTER Cycle-to-Cycle Jitter (Figure 2) 0.2 < 1 0.2 < 1 0.2 < 1 ps
VPP Input Voltage Swing
(Differential Configuration)
150 800 1200 150 800 1200 150 800 1200 mV
tr
tf
Output Rise/Fall Times
Q, Q (20%−80%) 70 120 170 80 130 180 100 150 200
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V.
2. Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays
are measured from the cross point of the inputs to the cross point of the outputs.
MC10EP16, MC100EP16
www.onsemi.com
7
0
100
200
300
400
500
600
700
800
0 1000 2000 3000 4000 5000 6000
Figure 2. Fmax/Jitter
FREQUENCY (MHz)
1
2
3
4
5
6
7
8
(JITTER)
Measured
Simulated
ÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ
VOUTpp (mV)
JITTEROUT ps (RMS)
É
É
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
QD
Q D
Zo = 50 W
Zo = 50 W
50 W50 W
VTT
VTT = VCC − 2.0 V
MC10EP16, MC100EP16
www.onsemi.com
8
ORDERING INFORMATION
Device Package Shipping†
MC10EP16DG SOIC−8 NB
(Pb-Free)
98 Units / Tube
MC10EP16DR2G SOIC−8 NB
(Pb-Free)
2500 / Tape & Reel
MC10EP16DTG TSSOP−8
(Pb-Free)
100 Units / Tube
MC10EP16DTR2G TSSOP−8
(Pb-Free)
2500 / Tape & Reel
MC100EP16DG SOIC−8 NB
(Pb-Free)
98 Units / Tube
MC100EP16DR2G SOIC−8 NB
(Pb-Free)
2500 / Tape & Reel
MC100EP16DTG TSSOP−8
(Pb-Free)
100 Units / Tube
MC100EP16DTR2G TSSOP−8
(Pb-Free)
2500 / Tape & Reel
MC100EP16MNR4G DFN8
(Pb-Free)
1000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D −ECL Clock Distribution Techniques
AN1406/D −Designing with PECL (ECL at +5.0 V)
AN1503/D −ECLinPSt I/O SPiCE Modeling Kit
AN1504/D −Metastability and the ECLinPS Family
AN1568/D −Interfacing Between LVDS and ECL
AN1672/D −The ECL Translator Guide
AND8001/D −Odd Number Counters Design
AND8002/D −Marking and Date Codes
AND8020/D −Termination of ECL Logic Devices
AND8066/D −Interfacing with ECLinPS
AND8090/D −AC Characteristics of ECL Devices
MC10EP16, MC100EP16
www.onsemi.com
9
PACKAGE DIMENSIONS
SOIC−8 NB
D SUFFIX
CASE 751−07
ISSUE AK
SEATING
PLANE
1
4
58
N
J
X 45 _
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
BS
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) ZSXS
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC10EP16, MC100EP16
www.onsemi.com
10
PACKAGE DIMENSIONS
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A2.90 3.10 0.114 0.122
B2.90 3.10 0.114 0.122
C0.80 1.10 0.031 0.043
D0.05 0.15 0.002 0.006
F0.40 0.70 0.016 0.028
G0.65 BSC 0.026 BSC
L4.90 BSC 0.193 BSC
M0 6 0 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT
EXCEED 0.25 (0.010) PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE -W-.
____
SEATING
PLANE
PIN 1
14
85
DETAIL E
B
C
D
A
G
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
8x REFK
IDENT
K0.25 0.40 0.010 0.016
TSSOP−8
DT SUFFIX
CASE 948R−02
ISSUE A
MC10EP16, MC100EP16
www.onsemi.com
11
PACKAGE DIMENSIONS
ÇÇ
ÇÇ
DFN8 2x2, 0.5 P
MN SUFFIX
CASE 506AA
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
D
E
B
C0.10
PIN ONE
2X
REFERENCE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
L
(A3)
D2
E2
C
C0.10
C0.10
C0.08
NOTE 4 A1 SEATING
PLANE
e/2
e
8X
K
NOTE 3
b
8X
0.10 C
0.05 C
ABB
DIM MIN MAX
MILLIMETERS
A0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b0.20 0.30
D2.00 BSC
D2 1.10 1.30
E2.00 BSC
E2 0.70 0.90
e0.50 BSC
K
L0.25 0.35
14
85
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.30
0.50
0.50
8X
DIMENSIONS: MILLIMETERS
0.30 PITCH
8X
1
PACKAGE
OUTLINE
RECOMMENDED
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
L
DETAIL B
DETAIL A
L1 −−− 0.10
0.30 REF
0.90
1.30
ÉÉ
ÉÉ
ÇÇ
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
ÉÉ
ÇÇ
ÇÇ
A1
A3
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
MC10EP16/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
