ASCTB124E 201912
Panasonic Corporation 2019
FEATURES
High-speed switching
High insulation
DIP type: 5,000 Vrms, SOP type: 2,500 Vrms,
SSOP type: 1,500 Vrms
Extensive product lineup
Products include SSOP, SOP4-pin and DIP6-pin.
Photovoltaic MOSFET drivers of wide variation
Photovoltaic MOSFET Driver
TYPICAL APPLICATIONS
Power supply (Vcc) for electronic circuits
Driving MOSFET
Note: Please contact our sales representative for automotive applications of PhotoMOS.
2 3
1 4
ｰ
+
ｰ
+
2
3
16
4
2.65 4.45
1.8
4.34.42
(Unit: mm)
Control circuit
Control circuit
6.4
3.6
8.8
6.4
3.9
8.8
TYPES
Output rating
Package
Part No. Packing quantity
Drop-out
voltage
(Typ.)
Short circuit
current
(Typ.)
Through hole
terminal Surface mount terminal
Tube Tape and reel
Tube packing
style
Tube packing
style
Tape and reel
packing style X, Y
*
1
Tape and reel
packing style Z, W
*
2
8
.
7
V
14
μA DIP
6
-pin APV
1122
APV
1122
A APV
1122
AX APV
1122
AZ
1
-tube:
50
pcs.
Outer carton
:
500
pcs.
1
-reel:
1
,
000
pcs.
Outer carton
:
1
,
000
pcs.
8
.
7
V
14
μA
SOP
4
-pin
*
3
-APV
1121
SAPV
1121
SX APV
1121
SZ
1
-tube:
100
pcs.
Outer carton
:
2
,
000
pcs.
1
-reel:
1
,
000
pcs.
Outer carton
:
1
,
000
pcs.
8
.
2
V
8
μA -APV
2121
SAPV
2121
SX APV
2121
SZ
8
.
2
V
8
μA SSOP*
4
- - APV
2111
VY APV
2111
VW -
1
-reel:
3
,
500
pcs.
Outer carton
:
3
,
500
pcs.
*1. SOP type is picked from 1/2-pin side, SSOP type is picked from 1/4-pin side.
*2. SOP type is picked from 3/4-pin side, SSOP type is picked from 2/3-pin side.
*3. For space reasons, the two initial letters of the part number “AP”, package (SOP) indicator “S” and the packing style indicator “X” or “Z” are not marked on the device.
(Ex. the label for product number APV1121SX is V1121.)
*4. Tape and reel package is the standard packing style. Packing quantity of 1,000 pieces is possible. Please contact our sales o󰀩ce.
For space reasons, the two initial letters of the part number “AP”, package (SSOP) indicator “V” and the packing style are not marked on the device.
(Ex. the label for product number APV2111VY is V2111.)
Absolute maximum ratings (Ambient temperature: 25°C)
Item Symbol APV
1122
(A) APV
1121
SAPV
2121
SAPV
2111
V Remarks
Input
LED forward current IF
50
mA
LED reverse voltage VR
5
V
Peak forward current IFP
1
A f =
100
Hz,
Duty Ratio =
0
.
1
%
Power dissipation Pin
75
mW
I/O isolation voltage Viso
5
,
000
Vrms
2
,
500
Vrms
2
,
500
Vrms
1
,
500
Vrms
Ambient temperature (Operating) Topr –
40
to +
85
°C (Avoid icing and
condensation)
Ambient temperature (Storage) Tstg –
40
to +
100
°C
RATING
industrial.panasonic.com/ac/e/
2019.12
ー 1 ー
Photovoltaic MOSFET Driver
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/ ASCTB124E 201912
Panasonic Corporation 2019
Ton Toff
5V
1V
Input
Output
*
3
.Turn o󰀨 time
Recommended operating conditions (Ambient temperature: 25°C)
Please use under recommended operating conditions to obtain expected characteristics.
Item Symbol Min. Max. Unit
LED current IF
10 30
mA
Electrical characteristics (Ambient temperature: 25°C)
Item Symbol APV
1122
(A) APV
1121
SAPV
2121
SAPV
2111
V Condition
Input
LED operate
current
Typical IFon
0
.
6
mA
0
.
85
mA VOC =
5
V
Maximum
3
mA
LED turn o󰀨
current
Minimum IFo󰀨
0
.
2
mA VOC =
1
V
Typical
0
.
5
mA
0
.
75
mA
LED dropout
voltage
Typical VF
1
.
15
V IF =
10
mA
Maximum
1
.
5
V
Output
Drop-out voltage*
1
Minimum VOC
6
V
5
V IF =
10
mA
Typical
8
.
7
V
8
.
2
V
Short circuit
current*
2
Minimum ISC
5
μA
3
μA IF =
10
mA
Typical
14
μA
8
μA
Transfer characteristics
Turn on time*
3
Typical Ton
0
.
4
ms
0
.
8
ms IF =
10
mA
CL =
1
,
000
pF
Turn o󰀨 time*
3
Typical To󰀨
0
.
1
ms IF =
10
mA
CL =
1
,
000
pF
I/O capacitance Typical Ciso
0
.
8
pF f =
1
MHz
VB =
0
V
Maximum
1
.
5
pF
Initial I/O isolation
resistance Minimum Riso
1
,
000
MΩ
500
V DC
*1.Drop-out voltage measurement circuit
APV
1122
(A) APV
1121
S, APV
2121
S, APV
2111
V
V
IF=10mA 1
2
3
6
4
RV=10MΩRV=10MΩ
IF=10mA 1
2
4
3
V
*2.Short circuit current measurement circuit
APV
1122
(A) APV
1121
S, APV
2121
S, APV
2111
V
1
2
3
6
4
RI=100Ω
IF=10mA
IRI=100Ω
IF=10mA 1
2
4
3
I
*3.Turn on/Turn o󰀨 time measurement circuit
APV
1122
(A) APV
1121
S, APV
2121
S, APV
2111
V
IF=10mA 1
2
3 4
VOUT
CL
CL=1000pF
IF=10mA 1
2 3
CL=1000pF
VOUT
CL
ー 2 ー
Photovoltaic MOSFET Driver
Panasonic Corporation Electromechanical Control Business Division
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Panasonic Corporation 2019
REFERENCE DATA
1. Drop-out voltage vs. ambient temperature
characteristics
-40
4
8
6
10
12
14
-20 0 20 40 60 8085
APV1122
APV1121S
APV2121S
APV2111V
Ambient temperature (°C)
Drop-out voltage (V)
Input current: 10 mA
2. Short circuit current vs. ambient
temperature characteristics
-40
0
10
5
15
20
25
-20 0 20 40 60 8085
APV1122
APV1121S
APV2121S
APV2111V
Short circuit current (μA)
Ambient temperature (°C)
Input current: 10 mA
3. LED operate current vs. ambient
temperature characteristics
-40
0
1.0
0.5
1.5
2.0
2.5
3.0
-20 0 20 40 60 80 85
APV1122
APV1121S
APV2121S
APV2111V
Ambient temperature (°C)
LED operate current (mA)
Drop-out voltage: 5 V
4. LED turn o󰀨 current vs. ambient
temperature characteristics
-40
0
0.5
1.0
1.5
2.0
-20 0 20 40 60 8085
APV1122
APV1121S
APV2121S
APV2111V
Ambient temperature (°C)
LED turn off current (mA)
Drop-out voltage: 1 V
5. LED dropout voltage vs. ambient
temperature characteristics
50 ｍA
30 ｍA
20 ｍA
10 ｍA
-40
1.0
1.1
1.2
1.3
1.4
1.5
-20 0 20 40 60 80 100
Ambient temperature (°C)
LED dropout voltage (V)
LED forward current: 10 to 50 mA
6. Turn on time vs. ambient temperature
characteristics
-40
0
1.0
0.5
1.5
2.0
-20 0 20 40 60
8085
APV1122
APV1121S
APV2121S
APV2111V
Ambient temperature (°C)
Turn on time (ms)
LED forward current: 10 mA
Load capacity: 1,000 pF; output voltage: 5 V
7. Turn o󰀨 time vs. ambient temperature
characteristics
-40
0
0.1
0.2
0.3
0.4
0.5
-20 0 20 40 60 8085
APV1122
APV1121S
APV2121S
APV2111V
Ambient temperature (°C)
Turn off time (ms)
LED forward current: 10 mA
Load capacity: 1,000 pF; output voltage: 1 V
8. Turn on time vs. LED forward current
characteristics
0
0
1.0
0.5
1.5
2.0
10 20 30 40 6050
APV1122
APV1121S
APV2121S
APV2111V
LED forward current (mA)
Turn on time (ms)
Load capacity: 1,000 pF; output voltage: 5 V
9. Turn o󰀨 time vs. LED forward current
characteristics
0
0
0.15
0.10
0.05
0.20
0.25
0.30
10 20 30 40 6050
APV1122
APV1121S
APV2121S
APV2111V
LED forward current (mA)
Turn off time (ms)
Load capacity: 1,000 pF; output voltage: 1 V
ー 3 ー
Photovoltaic MOSFET Driver
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/ ASCTB124E 201912
Panasonic Corporation 2019
0.47
2.542.54
3.9±0.2
8.8±0.05
0.47
1.25
1.25
1.25
Max.10°
Max.10
°
3.4
0.47
6.4±0.05
3
7.62±0.05
Terminal thickness: t = 0.25
General tolerance: ±0.1
3.4
0.2+0.2
1.25
2.54
1.25
0.47
1.25
0.47 0.47
2.54
6.4±0.05
8.8±0.05
1
7.6
3.4
Max.10°
Terminal thickness: t = 0.25
General tolerance: ±0.1
2.54
7.62
2.54
5.08
6.4
5-0.8 dia.
Tolerance: ±0.1
2.54
2.54
1.5
8.3
1.9
Tolerance: ±0.1
4.4±0.2
4.3±0.2
2±0.2
2.54
0.1
0.4
6.8±0.4
0.50.5
0.4
Terminal thickness: t = 0.15
General tolerance: ±0.1
1.2
0.8
2.54
6
Tolerance: ±0.1
10. Drop-out voltage vs. LED forward current
characteristics
0
0
10
8
6
4
2
10 20 30 40 50
APV1122
APV1121S
APV2121S
APV2111V
LED forward current (mA)
Drop-out voltage (V)
11. Short circuit current vs. LED forward
current characteristics
1
1
10
100
10 100
APV1122
APV1121S
APV2121S
APV2111V
LED forward current (mA)
Short circuit current (μA)
CAD Through hole terminal type
External dimensions
DIMENSIONS CAD The CAD data of the products with a “CAD” mark can be downloaded from our Website. Unit: mm
PC board pattern
(BOTTOM VIEW)
Recommended mounting pad
(TOP VIEW)
Surface mount terminal type
External dimensions
CAD
DIP6pin
SOP4pin
CAD External dimensions Recommended mounting pad
(TOP VIEW)
ー 4 ー
Photovoltaic MOSFET Driver
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/ ASCTB124E 201912
Panasonic Corporation 2019
4.45
0.2
（4.85）
0.20.4 0.4
1.27
2.65
1.8
Terminal thickness: t = 0.15
General tolerance: ±0.1
0.7
0.9
4.35
1.27
Tolerance: ±0.1
SCHEMATIC AND WIRING DIAGRAMS
Schematic
Output
conguration
Load
type Connection Wiring diagram
2
3
16
4
－
＋
Control circuit
*
1
Form A - -
1
2
34
6
IF
E1
4
6＋
－
VL (AC, DC) VL (DC)
External
MOSFET External
MOSFET
Load Load
－
＋
2 3
1 4
Control circuit
IF
E1
1
23
4
3
4＋
－
VL (AC, DC) VL (DC)
External
MOSFET External
MOSFET
Load Load
*Terminal 3 cannot be used, since it is in the internal circuit of the device.
SAFETY STANDARDS
Part No.
UL (Recognized) CSA (Certied)
Remarks
File No.
(Standard No.) Contact rating File No.
(Standard No.) Contact rating
Photovoltaic
MOSFET driver
APV
2111
V
(SSOP)
E191218
(UL
1577
)
-
(Certied by C-UL)
APV
2121
S
(SOP) -
VDE approved
(Nr. 40036199)
APV
1121
S
(SOP) -
APV
1122
(DIP
6
)-
Note: For the latest information on compliance with safety standards, please refer to our website.
Please refer to "the latest product specications"
when designing your product.
•Requests to customers:
https://industrial.panasonic.com/ac/e/salespolicies/
SSOP
CAD External dimensions Recommended mounting pad
(TOP VIEW)
ー 5 ー
Panasonic Corporation Electromechanical Control Business Division
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PhotoMOS® Cautions for Use
SAFETY WARNINGS
Do not use the product under conditions that exceed the range
of its specications. It may cause overheating, smoke, or re.
Do not touch the recharging unit while the power is on. There
is a danger of electrical shock. Be sure to turn o󰀨 the power
when performing mounting, maintenance, or repair operations
on the device (including connecting parts such as the terminal
board and socket).
Check the wiring diagrams in the catalog and be sure to
connect the terminals correctly. If the device is energized
with short circuit or any wrong connection, it may cause
unexpected malfunction, abnormal heat or re.
Derating design
Derating is a signicant factor for reliable design and product life.
Even if the conditions of use (temperature, current, voltage, etc.) of
the product are within the absolute maximum ratings, reliability may
be lowered remarkably when continuously used in high load
conditions (high temperature, high humidity, high current, high
voltage, etc.) Therefore, please derate su󰀩ciently below the
absolute maximum ratings and evaluate the device in the actual
condition.
Moreover, regardless of the application, if malfunctioning can be
expected to pose high risk to human life or to property, or if products
are used in equipment otherwise requiring high operational safety, in
addition to designing double circuits, that is, incorporating features
such as a protection circuit or a redundant circuit, safety testing
should also be carried out.
Applying stress that exceeds the absolute maximum
rating
If the voltage or current value for any of the terminals exceeds the
absolute maximum rating, internal elements will deteriorate because
of the overvoltage or overcurrent. In extreme cases, wiring may
melt, or silicon P/N junctions may be destroyed.
Therefore, the circuit should be designed in such a way that the load
never exceed the absolute maximum ratings, even momentarily.
Input voltage (for Voltage-sensitive type)
For rising and dropping ratio of input voltage(dv/dt), maintain Min.
100mV/ms.
Oscillation circuit and control circuit (for TSON)
The oscillation circuit and control circuit of product may be destroyed
by external noise, surge, static electricity and so on.
For noise e󰀨ect to peripheral circuits when oscillation circuit
operates, please implement safety measures on the system before
use by verifying operation under the actual design.
Deterioration and destruction caused by discharge of
static electricity (for TSON/RF C×R3/RF C×R5/RF
C×R10)
This phenomenon is generally called static electricity destruction,
and occurs when static electricity generated by various factors is
discharged while the PhotoMOS® terminals are in contact, producing
internal destruction of the element.
To prevent problems from static electricity, the following precautions
and measures should be taken when using your device.
1) Employees handling PhotoMOS® should wear anti-static clothing
and should be grounded through protective resistance of 500kΩ
to 1MΩ.
2) A conductive metal sheet should be placed over the worktable.
Measuring instruments and jigs should be grounded.
3) When using soldering irons, either use irons with low leakage
current, or ground the tip of the soldering iron. (Use of low-voltage
soldering irons is also recommended.)
4) Devices and equipment used in assembly should also be
grounded.
5) When packing printed circuit boards and equipment, avoid using
high-polymer materials such as foam styrene, plastic, and other
materials which carry an electrostatic charge.
6) When storing or transporting PhotoMOS®, the environment should
not be conducive to generating static electricity (for instance, the
humidity should be between 45% and 60%), and PhotoMOS®
should be protected using conductive packing materials.
Unused terminals
The No. 3 terminal is used with the circuit inside the device.
Therefore, do not connect it to the external circuitry with either
connection method A, B or C. (1 Form A 6-pin type)
Short across terminals
Do not short circuit between terminals when device is energized,
since there is possibility of breaking of the internal IC.
Surge voltages at the input
If reverse surge voltages are present at the input terminals, connect
a diode in reverse parallel across the input terminals and keep the
reverse voltages below the reverse breakdown voltage.
Typical circuits are below shown.
1) 6-pin
1
2
3
6
5
4
2) Power type
3
21
4
PhotoMOS® Cautions for Use
ASCTB65E 202002
ー 6 ー
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
PhotoMOS® Cautions for Use
Panasonic Corporation 2020
Recommended LED forward current or recommended
input voltage
Design in accordance with the recommended operating conditions
for each product.
Since these conditions are a󰀨ected by the operating environment,
ensure conformance with all relevant specications.
LED forward current vs. Ambient temperature
characteristics
Please keep the LED forward current to within the range given
below.
0
20
40
100
80
60
0204060
8085 100
-40 -20
Ambient temperature (°C)
LED forward current (mA)
Ripple in the input power supply
If ripple is present in the input power supply, observe the following:
1) For LED forward current at Emin, please maintain the value
mentioned at “■Recommended LED forward current.”
2) Please make sure the LED forward current for Emax. is no higher
than 50 mA.
3) Please maintain the input voltage at least 4V for Emin. (GU, RF
and Power voltage-sensitive type).
4) Please make sure the input voltage for Emax. is no higher than 6V
(GU and RF voltage-sensitive type).
5) Please make sure the input voltage for Emax. is no higher than 30V
(Power voltage-sensitive type).
Emin. Emax.
6) Please maintain the input voltage at least 3V for Emin. (for TSON)
7) Please make sure the input voltage for Emax. is no higher than 5.5V.
(for TSON)
8) Please keep amplitude voltage of ripple within ±0.5V. (for TSON)
within ±0.5 V
Set voltageSet voltage
within ±0.5 V
Output spike voltages
1) If an inductive load generates spike voltages which exceed the
absolute maximum rating, the spike voltage shall be limited.
Representative circuit examples of AC/DC dual use type are
shown below. There are the same with DC only type.
(1) 6-pin
1
2
3 4
1
2
3 4
5
5
6
6
Load
Load
Clamp diode is
connected in parallel
with the load.
CR snubber is
connected in parallel
with the load.
(2) Power type
1234
1234
1234
Clamp diode is
connected in parallel
with the load.
Load
Load
Load
CR snubber is
connected in parallel
with the load.
A varistor is
connected in parallel
with PhotoMOS
®
(3) TSON
1
2
4
3
1
2
4
3
Load
Load
Clamp diode is
connected in parallel
with the load.
CR snubber is
connected in parallel
with the load.
2) When Clamp diode or CR Snubber is used in the circuit, the spike
voltages from the load are limited. But the longer wire may
become the inductance and cause the spike voltage. Keep the
wire as short as possible.
ASCTB65E 202002
ー 7 ー
PhotoMOS® Cautions for Use
Panasonic Corporation 2020
Reverse voltages at the input (for TSON)
If reverse voltages are present at the input terminals, for example,
connect a schottky barrier diode in reverse parallel across the input
terminals and keep the reverse voltages below the reverse
breakdown voltage. Typical circuit is shown below.
1
2
4
3
Continual DC bias (AQV259 and AQV258)
If a continual DC bias will be applied between the input and output,
the breakdown voltage of the switching element MOSFET on the
output side may degrade. Therefore, be sure to test the product
under actual conditions. Example of circuits that will cause
degradation of breakdown voltage of MOSFET is given below.
IFIL
1
2
3
6
5
4
E
Load
Cleaning solvents compatibility
Cleaning the solder ux should use the immersion washing with an
organic solvent. If you have to use ultrasonic cleaning, please adopt
the following conditions and check that there are no problems in the
actual usage.
• Frequency: 27 to 29kHz
• Ultrasonic output: No greater than 0.25W/cm2*
• Cleaning time: 30s or less
• Cleanser used: Asahiklin AK-225
• Others: Float PCB and the device in the cleaning solvent to
prevent from contacting the ultrasonic vibrator
* Applies to unit area ultrasonic output for ultrasonic baths
Notes for mounting
1) When di󰀨erent kinds of packages are mounted on PC boad,
temperature rise at soldering lead is highly dependent on
package size. Therefore, please set the lower temperature
soldering condition than the conditions of item “■Soldering”, and
conrm the temperature condition of actual usage before
soldering.
2) When soldering condition exceeds our recommendation, the
PhotoMOS® characteristics may be adversely a󰀨ected. It may
occur package crack or bonding wire breaking because of
thermal expansion unconformity and resin strength reduction.
Please contact our sales o󰀩ce about the propriety of the
condition.
3) Please conrm the heat stress by using actual board because it
may be changed by board condition or manufacturing process
condition.
4) Solder creepage, wettability, or soldering strength will be a󰀨ected
by the soldering condition or used soldering type. Please check
them under the actual production condition in detail.
5) Please apply coating when the device returns to a room
temperature.
Input wiring pattern
1) With AQY* or AQW* series avoid installing the input (LED side)
wiring pattern to the bottom side of the package if you require the
specied I/O isolation voltage (Viso) after mounting the PC board.
Since part of the frame on the output side is exposed, it may
cause uctuations in the I/O isolation voltage.
(Output terminal side)(Output terminal side)
(Input terminal side)
(Input terminal side)
Input wiring
pattern
Input wiring
pattern
May not allow the prescribed I/O withstand
voltage (Viso) to be achieved
Portion of output side frame
Portion of output side frame
* Excluding reinforced insulation products and SSOP, SON, and TSON packages
2) Exposed terminals are electrically connected to internal elements.
Be aware that contact with external circuits may cause
deterioration of insulation between input and output, leading to
destruction of internal elements.
3) If installed in proximity to other device, take care to avoid short
circuits between device, which may occur if exposed frames of
adjacent device come too close.
ASCTB65E 202002
ー 8 ー
Panasonic Corporation Electromechanical Control Business Division
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PhotoMOS® Cautions for Use
Panasonic Corporation 2020
About the exposed terminals on the sides of the
package (for VSSOP)
For VSSOP type, as shown in the following gure, part of the input
and output frames are exposed on the sides of the package. Due to
this, please be keep in mind the cautions listed below.
1) Take care to avoid short circuits between exposed terminals,
which may cause insulation deterioration between input and
output, leading to destruction of internal elements.
2) Since the exposed terminals are connected electrically to the
internal element, please refer to the item “■Deterioration and
destruction caused by discharge of static electricity”, and
implement su󰀩cient measures to control static electricity.
3) When installing the devices in the vicinity, please keep in mind
that if the exposed frames of adjacent devices get too close, a
short between devices may occur.
Part of frame on output side
Part of frame on input side
Adjacent mounting
When several PhotoMOS® are mounted closely each other or
heat-generating components are mounted close to the PhotoMOS®,
the abnormal heating may occur. This abnormal heat may be
caused by the internal element when energized or thermal
interference between the devices. The degree of temperature rise
depends on the mounting layout of the devices and usage condition,
therefore please be sure to use PhotoMOS® with reduced load
current after testing under the worst condition of the actual usage.
Transportation and storage
1) Extreme vibration during transport may deform the lead or
damage the PhotoMOS® characteristics. Please handle the outer
and inner boxes with care.
2) Inadequate storage condition may degrade soldering,
appearance, and characteristics. The following storage conditions
are recommended:
• Temperature: 0 to 45°C
• Humidity: Max. 70%RH
• Atmosphere: No harmful gasses such as sulfurous acid gas,
minimal dust.
3) Storage before TSON, VSSOP, SON, SSOP, or SOP processing
In case the heat stress of soldering is applied to the PhotoMOS®
which absorbs moisture inside of its package, the evaporation of
the moisture increases the pressure inside the package and it
may cause the package blister or crack. This device is sensitive
to moisture and it is packed in the sealed moisture-proof package.
Please make sure the following condition after unsealing.
* Please use the device immediately after unsealing.
(Within 30 days at 0 to 30°C and Max. 70%RH)
* If the device will be kept for a long time after unsealing, please
store in the another moisture-proof package containing silica gel.
(Please use within 90 days.)
Water condensation
Water condensation occurs when the ambient temperature changes
suddenly from a high temperature to low temperature at high
humidity, or the device is suddenly transferred from a low ambient
temperature to a high temperature and humidity. Condensation
causes the failures such as insulation deterioration. Panasonic
Corporation does not guarantee the failures caused by water
condensation. The heat conduction by the equipment the
PhotoMOS® is mounted may accelerate the water condensation.
Please conrm that there is no condensation in the worst condition
of the actual usage. (Special attention should be paid when high
temperature heating parts are close to the PhotoMOS®.)
Soldering
1) Example of surface-mount terminal recommended conditions
(1) IR (Infrared reow) soldering method
In case of automatic soldering, following conditions should be
observed. (recommended condition reow: Max. 2 times,
measurement point: soldering lead)
t3
T3
T2
T1
t2
t1
T1 = 150 to 180°C
T2 = 230°C
T3 = 240 to 250°C*
t1 = 60 to 120 s
t2 = Within 30 s
t3 = Within 10 s
*240 to 245°C for SON, VSSOP
and TSON package
(2) Other soldering methods
Other soldering methods (VPS, hot-air, hot plate, laser
heating, pulse heater, etc.) a󰀨ect the PhotoMOS®
characteristics di󰀨erently, please evaluate the device under
the actual usage.
(3) Manual soldering method
Temperature: 350 to 400°C, within 3s, electrical power 30 to
60W
2) Example of through hole terminal recommended conditions
(1) DWS soldering method
In case of automatic soldering, following conditions should be
observed. (recommended condition number of times: Max. 1
time, measurement point: soldering lead *1)
t
3
t
2
t1
T1
T2T1 = 120°C
T2 = Max. 260°C
t1 = within 60 s
t2+t3 = within 5 s
*1 Solder temperature: Max. 260°C
(2) Other soldering method (recommended condition: 1 time)
Preheating: Max. 120°C, within 120s, measurement point:
soldering lead
Soldering: Max. 260°C, within 10s, measurement area:
soldering temperature
(3) Manual soldering method
Temperature: 350 to 400°C, within 3s, electrical power 30 to
60W
ASCTB65E 202002
ー 9 ー
PhotoMOS® Cautions for Use
Panasonic Corporation 2020
Packing format
1) Tape and reel
Tape dimensions Dimensions of tape reel
TSON
4
-pin
(
1
) When picked from
1
/
2
-pin side: Part No. AQY
2
C
1
R*PX (Shown above)
(
2
) When picked from
3
/
4
-pin side: Part No. AQY
2
C
1
R*PZ
13±1.51.2±0.5
2±0.5
21±0.8
13±0.5dia.
60±3dia.
180±3dia.
*Quality of material: Polystyrene (PS)
VSSOP
4
-pin
(
1
) When picked from
1
and
4
-pin side: Part No. AQY*TY (Shown above)
(
2
) When picked from
2
and
3
-pin side: Part No. AQY*TW
21±0.8
13±0.514±1.52±0.5
2±0.5
80±1
80±1dia.
250 ±2dia.
dia.
dia.
*Quality of material: Paper
SON
4
-pin
(
1
) When picked from
1
and
4
-pin side: Part No. AQY*MY (Shown above)
(
2
) When picked from
2
and
3
-pin side: Part No. AQY*MW
SSOP
4
-pin
(
1
) When picked from
1
and
4
-pin side: Part No. AQY*V Y, APV
2111
VY (Shown above)
(
2
) When picked from
2
and
3
-pin side: Part No. AQY*VW, APV
2111
VW
SOP
4
-pin
(
1
) When picked from
1
/
2
-pin side: Part No. AQY*SX, APV**
21
SX (Shown above)
(
2
) When picked from
3
/
4
-pin side: Part No. AQY*SZ, APV**
21
SZ
Note: “ * ” indicates characters of number or alphabet.
1.2
±0.3
0.2±0.05
2.4±0.2
2.2±0.2
2±0.1
4
1.5+0.5
-0
1.05
4±0.1
5.5±0.1
12±0.3
1.75±0.1
±0.1
±0.1dia.
dia.
Direction of picking
Device mounted
on tape
Tractor feed holes
±0.1
1.75
4.0±0.1
1.5
0.4±0.05
3.3±0.31
2.4±0.2
8±0.12±0.1
±0.1
5.5
±0.3
12.0
±0.2
2.5
±0.1
+0.5
ｰ
0
dia.
dia.
Direction of picking
Device mounted
on tape
Tractor feed holes
0.3±0.05
2±0.3
±0.2
3.6
2.8±0.24±0.1
4±0.1
1.5±0.1
±0.1
1.75
±0.1
5.5
±0.3
12
2±0.1
dia.
1.5
+0.5
ｰ
0dia.
Direction of picking
Device mounted
on tape
Tractor feed holes
0.3±0.05
2.7±0.34.0±0.1
3.0±0.14.0±0.1
±0.1
1.75
±0.3
12.0
±0.1
5.5
±0.2
5.1
1.50 +0.5
ｰ0
1.5+0.1
ｰ0dia.
dia.
Direction of picking
Device mounted
on tape
Tractor feed holes
1.55±0.1
7.2
±0.1
4
±0.1
2±0.1
12
±0.1
0.3±0.05
2.8
±0.3
12±0.3
5.5
±0.11.75±0.1
4.7
±0.1
dia.
1.55±0.05
dia.
Direction of picking
Device mounted on tape
Tractor feed holes
ASCTB65E 202002
ー 10 ー
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
PhotoMOS® Cautions for Use
Panasonic Corporation 2020
Tape dimensions Dimensions of tape reel
SOP
6
-pin
(
1
) When picked from
1
/
2
/
3
-pin side: Part No. AQV*SX (Shown above)
(
2
) When picked from
4
/
5
/
6
-pin side: Part No. AQV*SZ
21±0.8
13±0.514±1.52±0.5
2±0.5
80±1
80±1dia.
250 ±2dia.
dia.
dia.
*Quality of material: Paper
SOP
8
-pin
(
1
) When picked from
1
/
2
/
3
/
4
-pin side: Part No. AQW*SX (Shown above)
(
2
) When picked from
5
/
6
/
7
/
8
-pin side: Part No. AQW*SZ
21±0.8
13±0.517.5±1.52±1
2±0.5
80±1
dia.
dia.
80±1dia.
250±2dia.
*Quality of material: Paper
SOP
16
-pin
(
1
) When picked from
1
/
2
/
3
/
4
/
5
/
6
/
7
/
8
-pin side: Part No. AQS*SX (Shown above)
(
2
) When picked from
9
/
10
/
11
/
12
/
13
/
14
/
15
/
16
-pin side: Part No. AQS*SZ
DIP
4
-pin
Surface mount
terminal
(
1
) When picked from
1
/
2
-pin side: Part No. AQY*HAX, AQY
210
HLAX (Shown above)
(
2
) When picked from
3
/
4
-pin side: Part No. AQY*HAZ, AQY
210
HLAZ
21
±0.8
13±0.513.5±2.02±0.5
2±0.5
80±1
dia.
80±1dia.
300±2dia.
dia.
*Quality of material: Paper
DIP
6
-pin
Surface mount
terminal
(
1
) When picked from
1
/
2
/
3
-pin side: Part No. AQV*AX (Shown above)
(
2
) When picked from
4
/
5
/
6
-pin side: Part No. AQV*AZ
21±0.8
13±0.517.5±22±0.5
2±0.5
80 ±1
80±1
dia.
dia.
dia.
300±2dia.
*Quality of material: Paper
Note: “ * ” indicates characters of number or alphabet.
1.55±0.1
7.2
±0.1
4
±0.1
2±0.1
12
±0.1
0.3
±0.05
2.8
±0.3
12±0.3
5.5
±0.11.75±0.1
6.9
±0.1
dia.
1.55±0.05
dia.
Direction of picking
Device mounted on tape
Tractor feed holes
7.5
±0.1
4
±0.1
2±0.1
12
±0.1
0.3
±0.05
2.8
±0.3
16±0.3
7.5
±0.11.75±0.1
10.15
±0.1
1.55±0.1
dia.
1.55±0.05
dia.
Direction of picking
Device mounted
on tape
Tractor feed holes
1.55±0.1
7.5
±0.1
4
±0.1
2±0.1
12
±0.1
0.3
±0.05
2.8
±0.3
16±0.3
7.5
±0.11.75±0.1
11.15
±0.1
dia.
1.55±0.05
dia.
Direction of picking
Device mounted
on tape
Tractor feed holes
1.5
1.55±0.1
10.2
±0.1
4
±0.1
2±0.1
12
±0.1
0.3
±0.05
4.2
±0.3
12±0.3
5.5
±0.1
1.75±0.1
5.25
±0.1
+0.1
ｰ
0dia.
dia.
Direction of picking
Device mounted on tape
Tractor feed holes
1.6±0.1
10.1
±0.1
4
±0.1
2±0.1
12
±0.1
0.3
±0.05
4.5
±0.3
16±0.3
7
.5
±0.11.75±0.1
9.2
±0.1
1.5+0.1
ｰ
0dia.
dia.
Direction of picking
Device mounted on tape
Tractor feed holes
ASCTB65E 202002
ー 11 ー
PhotoMOS® Cautions for Use
Panasonic Corporation 2020
Tape dimensions Dimensions of tape reel
DIP
8
-pin
Surface mount
terminal
(Basic insulation
type)
(
1
) When picked from
1
/
2
/
3
/
4
-pin side: Part No. AQW*AX (Shown above)
(
2
) When picked from
5
/
6
/
7
/
8
-pin side: Part No. AQW*AZ
21±0.8
13±0.517.5±22±0.5
2±0.5
80 ±1
80±1
dia.
dia.
dia.
300±2dia.
*Quality of material: Paper
DIP
8
-pin
Surface mount
terminal
(Reinforced
insulation type
(
1
) When picked from
1
/
2
/
3
/
4
-pin side: Part No. AQW*EHAX,
AQW
210
HLAX (Shown above)
(
2
) When picked from
5
/
6
/
7
/
8
-pin side: Part No. AQW*EHAZ, AQW
210
HLAZ
Power-DIP
4
-pin
SMD
(
1
) When picked from
1
/
2
-pin side: Part No. AQY*AX (Shown above)
(
2
) When picked from
3
/
4
-pin side: Part No. AQY*AZ
21±0.8
13±0.525.5±21.7±0.8
2±0.5
100±1
dia.
dia.
100±1
dia.
330±2dia.
*Quality of material: Paper
DIP
6
-pin
Surface mount
terminal
(Photovoltaic
MOSFET driver)
(
1
) When picked from
1
/
2
/
3
-pin side: Part No. APV
1122
AX (Shown above)
(
2
) When picked from
4
/
6
-pin side: Part No. APV
1122
AZ
21±0.8
13±0.517.5±22±0.5
2±0.5
80 ±1
80±1
dia.
dia.
dia.
300±2dia.
*Quality of material: Paper
Note: “ * ” indicates characters of number or alphabet.
1.55±0.1
10.1
±0.1
4
±0.1
2±0.1
12
±0.1
0.3
±0.05
±0.3
16±0.3
7
.5
±0.11.75±0.1
10.2
±0.1
4.5
1.5+0.1
ｰ
0dia.
dia.
Direction of picking
Device mounted on tape
Tractor feed holes
1.5
1.55±0.1
10.2
±0.1
4
±0.1
2±0.1
12
±0.1
0.3
±0.05
4.2
±0.3
16±0.3
7.5
±0.11.75±0.1
10.3
±0.1
+0.1
ｰ
0
dia.
dia.
Direction of picking
Device mounted on tape
Tractor feed holes
1.5
1.6±0.1
10.1
±0.1
4
±0.1
2±0.1
12
±0.1
0.3
±0.05
4.5
±0.3
16±0.3
7.5
±0.11.75±0.1
9.2
±0.1
+0.1
ｰ
0
dia.
dia.
Direction of picking
Device mounted on tape
Tractor feed holes
1.55
1.55
4.0
±0.1
16.0±0.12.0±0.1±0.1
12.6
±0.1
1.75
±0.1
9.7±0.1
11.5±0.1
24.0±0.3
0.3
±0.05
4.5
±0.3
+0.05
ｰ
0.05
dia.
dia.
Direction of picking
Device mounted
on tape
Tractor feed holes
2) Tube
Devices are packaged in a tube so that 1-pin is on the stopper B
side. Observe correct orientation when mounting them on PC
boards.
(PD type)
Stopper B Stopper A
(DIP type)
Stopper A Stopper B
(SOP type)
Stopper B (green) Stopper A (gray)
(Power type)
Green
Stopper B
Gray
Stopper A
ASCTB65E 202002
ー 12 ー
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
PhotoMOS® Cautions for Use
Panasonic Corporation 2020
Current limit function (output current control)
1) Current limit function aims to increase resistance to surges when
the switch is turned on. Before using this function, connect the
varistor to the output as shown in the gure below.
1
2
4
3
* Set the varistor voltage to 150 V or less.
Varistor Surge: 10×160μs 1.6kV
2) The current limit function capability can be lost if used longer than
the specied time. Be sure to set the output loss to the Max. rate.
Short circuit protection circuit
The short circuit protection circuit is designed to protect circuits from
excess current. Therefore, surge current may be detected as current
overload in which case the output current will be cut and the o󰀨
state maintained. For this reason, please include the inrush current
in the load current and keep it below the maximum load current.
Also, in order to maintain stability of internal IC operation, maintain
an input current of at least 5 mA (Latch type), 10 mA (Non Latch
type).
Photovoltaic MOSFET driver cautions for use
When two external MOSFETs are connected with a common source
terminal, oscillation may occur when operation is restored.
Therefore, please insert a 100 to 1,000 Ω resistor between the gate
terminal of the rst MOSFET and the gate terminal of the second
MOSFET.
A typical example of this is given in the circuit below.
1
2
34
6
Input LED current (for Standard type)
For rising and dropping ratio of input LED current (di/dt), maintain
Min. 100 μA/s.
Input voltage (for Power voltage-sensitive type)
For rising and dropping ratio of input voltage (dv/dt), maintain Min.
100 mV/s.
1) Power photoMOS® (1 Form A)
Absolute maximum rating Recommended
load voltage
Load voltage Load current
DC
type
AQZ
102 60
V DC
4
.
0
A DC
5
,
12
,
24
V DC
AQZ
105 100
V DC
2
.
6
A DC
48
V DC
AQZ
107 200
V DC
1
.
3
A DC
100
V DC
AQZ
104 400
V DC
0
.
7
A DC
200
V DC
AC/
DC
type
AQZ
202
Peak AC, DC
60
V Peak AC, DC
3
.
0
A
12
V AC
5
,
12
,
24
V DC
AQZ
205
Peak AC, DC
100
V Peak AC, DC
2
.
0
A
24
V AC
48
V DC
AQZ
207
Peak AC, DC
200
V Peak AC, DC
1
.
0
A
48
V AC
100
V DC
AQZ
204
Peak AC, DC
400
V Peak AC, DC
0
.
5
A
120
V AC
200
V DC
2) Power photoMOS® (1 Form B)
Absolute maximum rating Recommended
load voltage
Load voltage Load current
AC/
DC
type
AQZ
404
Peak AC, DC
400
V Peak AC, DC
0
.
5
A
100
V AC
200
V DC
3) Power photoMOS® Voltage-sensitive type (1 Form A)
Absolute maximum rating Recommended
load voltage
Load voltage Load current
DC
type
AQZ
102
D
60
V DC
3
.
6
A DC
5
,
12
,
24
V DC
AQZ
105
D
100
V DC
2
.
3
A DC
48
V DC
AQZ
107
D
200
V DC
1
.
1
A DC
100
V DC
AQZ
104
D
400
V DC
0
.
6
A DC
200
V DC
AC/
DC
type
AQZ
202
D
Peak AC, DC
60
V Peak AC, DC
2
.
7
A
12
V AC
5
,
12
,
24
V DC
AQZ
205
D
Peak AC, DC
100
V Peak AC, DC
1
.
8
A
24
V AC
48
V DC
AQZ
207
D
Peak AC, DC
200
V Peak AC, DC
0
.
9
A
48
V AC
100
V DC
AQZ
204
D
Peak AC, DC
400
V
Peak AC, DC
0
.
45
A
120
V AC
200
V DC
4) Power photoMOS® High Capacity type (1 Form A)
Absolute maximum rating Recommended
load voltage
Load voltage Load current
DC
type
AQZ
192 60
V DC
10
A DC
5
,
12
,
24
V DC
AQZ
197 200
V DC
5
A DC
100
V DC
AC/
DC
type
AQZ
202
G
Peak AC, DC
60
V
Peak AC, DC
6
A
12
V AC
5
,
12
,
24
V DC
AQZ
205
G
Peak AC, DC
100
V
Peak AC, DC
4
A
24
V AC
48
V DC
AQZ
207
G
Peak AC, DC
200
V
Peak AC, DC
2
A
48
V AC
100
V DC
AQZ
206
G
2
Peak AC, DC
600
V
Peak AC, DC
1
A
120
,
240
V AC
200
,
400
V DC
Adjacent mounting (for Power type)
1) When devices are mounted close together with the heat-
generated devices, ambient temperature may rise abnormally.
Mounting layout and ventilation should be considered.
2) When many devices are mounted close together, load current
should be reduced. (Refer to the data of “Load current in adjacent
mounting vs. Ambient temperature characteristics.”)
Recommended load voltage
As a guide in selecting PhotoMOS®, please refer to the following
table.
ASCTB65E 202002
ー 13 ー
Please contact ..........
Electromechanical Control Business Division
industral.panasonic.com/ac/e/
Specifications are subject to change without notice.
1006, Oaza Kadoma, Kadoma-shi, Osaka 571-8506, Japan
©Panasonic Corporation 2020
ASCTB124E 202002