Walsin Technology Corporation
Page 6 of 7 WR12-08-06-04W Ver.16 Dec.-2009
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C, Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.
TEST PROCEDURE / TEST METHOD REQUIREMENT
DC resistance
Clause 4.5
JIS C 5202 5.1 / IEC 60115-1 4.5
DC resistance values measured at the test voltages specified below :
<10Ω@0.1V,<100Ω@0.3V,<1KΩ@1.0V,<10KΩ@3V,<100KΩ@10V,
<1MΩ@25V, <10MΩ@30V
Within the specified tolerance
Temperature Coefficient
of Resistance(T.C.R)
Clause 4.8
Natural resistance change per change in degree centigrade.
( )
6
121
12 10×
−
ttR RR
(ppm/°C) t
1
: 20°C+5°C-1°C
R
1
: Resistance at reference temperature
R
2
: Resistance at test temperature
Refer to
“QUICK REFERENCE DATA”
Short time overload
(S.T.O.L)
Clause 4.13
Permanent resistance change after a 5sec application of a voltage
2.5xU
R
or max. overload voltage, whichever is less.
∆R/R max. ±(2%+0.10Ω)
Resistance to soldering
heat(R.S.H)
IEC 60068-2-58:2004
Un-mounted chips completely immersed for 10
±
1second in a SAC solder
bath at 255
℃±
5
º
C
Δ
R/R max.
±
(1%+0.05
Ω
)
no visible damage
Solderability
IEC 60068-2-58:2004
Un-mounted chips completely immersed for 3±0.3 second in a SAC
solder bath at 245
℃
±5
℃
95% coverage min., good tinning and
no visible damage
Temperature cycling
Clause 4.19
30 minutes at -55°C±3°C, 2~3 minutes at 20°C+5°C-1°C, 30 minutes at
+155°C±3°C, 2~3 minutes at 20°C+5°C-1°C, total 5 continuous cycles
∆R/R max. ±(1%+0.05Ω)
Damp heat (Humidity
loaded in steady state)
Clause 4.24
1000 +48/-0 hours, loaded with RCWV or Vmax in humidity chamber
controller at 40°C±2°C and 90~95% relative humidity, 1.5hours on and
0.5 hours off
10Ω≤R : ∆R/R max. ±(3%+0.10Ω)
R<10Ω, R≥1MΩ :
∆R/R max. ±(5%+0.10Ω)
Load Life (Endurance)
Clause 4.25
1000+48/-0 hours; loaded with RCWV or V
max
in chamber controller
70
±
2
º
C, 1.5 hours on and 0.5 hours off
Ditto
Bending strength
Clause 4.33
Resistors mounted on a 90mm glass epoxy resin PCB(FR4), bending
once for 10sec : 3mm (only 0402: 5mm)
No visual damaged,
∆R/R max. ±(1%+0.05Ω)
Adhesion
Clause 4.32
Pressurizing force: 5N, Test time: 10
±
1sec. No remarkable damage or removal of
the terminations
Insulation Resistance
JISC5201-1:1998
Clause 4.6
Apply the maximum overload voltage (DC) for 1minute R
≧
10G
Ω
Dielectric Withstand
Voltage
JISC5201-1:1998
Clause 4.7
Apply the maximum overload voltage (AC) for 1 minute No breakdown or flashover