SCLS099F − DECEMBER 1982 − REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DWide Operating Voltage Range of 2 V to 6 V
DOutputs Can Drive Up To 10 LSTTL Loads
DLow Power Consumption, 40-µA Max ICC
DTypical tpd = 13 ns
D±4-mA Output Drive at 5 V
DLow Input Current of 1 µA Max
description/ordering information
The ’HC112 devices contain two independent J-K
negative-edge-triggered flip-flops. A low level at
the preset (PRE) or clear (CLR) inputs sets or
resets the outputs, regardless of the levels of the
other inputs. When PRE and CLR are inactive
(high), data at the J and K inputs meeting the
setup time requirements are transferred to the
outputs on the negative-going edge of the clock
(CLK) pulse. Clock triggering occurs at a voltage
level and is not directly related to the fall time of the
CLK pulse. Following the hold-time interval, data
at the J and K inputs may be changed without
affecting the levels at the outputs. These versatile
flip-flops perform as toggle flip-flops by tying J and
K high.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP − N Tube of 25 SN74HC112N SN74HC112N
−40°C to 85°C
Tube of 40 SN74HC112D
−40°C to 85°CSOIC − D Reel of 2500 SN74HC112DR HC112
SOIC − D
Reel of 250 SN74HC112DT
HC112
CDIP − J Tube of 25 SNJ54HC112J SNJ54HC112J
−55°C to 125°CCFP − W Tube of 150 SNJ54HC112W SNJ54HC112W
−55 C to 125 C
LCCC − FK Tube of 55 SNJ54HC112FK SNJ54HC112FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
f
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
3212019
910111213
4
5
6
7
8
18
17
16
15
14
2CLR
2CLK
NC
2K
2J
1J
1PRE
NC
1Q
1Q
1K
1CLK
NC
2Q V
1CLR
2Q
GND
NC
SN54HC112 . . . FK PACKAGE
(TOP VIEW)
CC
NC − No internal connection
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1CLK
1K
1J
1PRE
1Q
1Q
2Q
GND
VCC
1CLR
2CLR
2CLK
2K
2J
2PRE
2Q
SN54HC112 ...J OR W PACKAGE
SN74HC112 ...D OR N PACKAGE
(TOP VIEW)
2PRE
Copyright 2003, Texas Instruments Incorporated
!"#$ % &'!!($ #% )'*+&#$ ,#$(-
!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($%
%$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',(
$(%$2 #++ )#!#"($(!%-
)!,'&$% &")+#$ $ 3454 #++ )#!#"($(!% #!( $(%$(,
'+(%% $.(!0%( $(,- #++ $.(! )!,'&$% )!,'&$
)!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%-
SCLS099F − DECEMBER 1982 − REVISED SEPTEMBER 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLE
INPUTS OUTPUTS
PRE CLR CLK J K Q Q
L H X X X H L
HLXXXLH
LLXXXH
†H†
H H ↓LLQ
0Q0
H H ↓HLHL
H H ↓LHLH
H H ↓H H Toggle
H H H X X Q0Q0
†This configuration is nonstable; that is, it does not persist
when either PRE or CLR returns to its inactive (high) level.
logic diagram, each flip-flop (positive logic)
PRE
CLK
J
CLR
Q
Q
C
C
C
C
K
TG TG
TG TG
C
C
C
C
C
C
SCLS099F − DECEMBER 1982 − REVISED SEPTEMBER 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HC112 SN74HC112
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 2 5 6 2 5 6 V
VCC = 2 V 1.5 1.5
V
IH
High-level input voltage VCC = 4.5 V 3.15 3.15 V
VIH
High-level input voltage
VCC = 6 V 4.2 4.2
V
VCC = 2 V 0.5 0.5
V
IL
Low-level input voltage VCC = 4.5 V 1.35 1.35 V
VIL
Low-level input voltage
VCC = 6 V 1.8 1.8
V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
VCC = 2 V 1000 1000
t
t
‡Input transition (rise and fall) time VCC = 4.5 V 500 500 ns
tt‡
Input transition (rise and fall) time
VCC = 6 V 400 400
ns
TAOperating free-air temperature −55 125 −40 85 °C
‡If this device is used in the threshold region (from VILmax = 0.5 V to VIHmin = 1.5 V), there is a potential to go into the wrong state from induced
grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device; however, functionally,
the CLK inputs are not ensured while in the shift, count, or toggle operating modes.
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SCLS099F − DECEMBER 1982 − REVISED SEPTEMBER 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C SN54HC112 SN74HC112
UNIT
PARAMETER
TEST CONDITIONS
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 1.9 1.998 1.9 1.9
I
OH
= −20 µA4.5 V 4.4 4.499 4.4 4.4
V
OH
V
I
= V
IH
or V
IL
IOH = −20 µA
6 V 5.9 5.999 5.9 5.9 V
VOH
VI = VIH or VIL
IOH = −4 mA 4.5 V 3.98 4.3 3.7 3.84
V
IOH = −5.2 mA 6 V 5.48 5.8 5.2 5.34
2 V 0.002 0.1 0.1 0.1
I
OL
= 20 µA4.5 V 0.001 0.1 0.1 0.1
V
OL
V
I
= V
IH
or V
IL
IOL = 20 µA
6 V 0.001 0.1 0.1 0.1 V
VOL
VI = VIH or VIL
IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33
V
IOL = 5.2 mA 6 V 0.15 0.26 0.4 0.33
IIVI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA
ICC VI = VCC or 0, IO = 0 6 V 4 80 40 µA
Ci2 V to 6 V 3 10 10 10 pF
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
VCC
TA = 25°C SN54HC112 SN74HC112
UNIT
V
CC MIN MAX MIN MAX MIN MAX
UNIT
2 V 5 3.4 4
f
clock
Clock frequency 4.5 V 25 17 20 MHz
fclock
Clock frequency
6 V 29 20 24
MHz
2 V 100 150 125
PRE or CLR low 4.5 V 20 30 25
tw
Pulse duration
PRE or CLR low
6 V 17 25 21
ns
twPulse duration 2 V 100 150 125 ns
CLK high or low 4.5 V 20 30 25
CLK high or low
6 V 17 25 21
2 V 100 150 125
Data (J, K) 4.5 V 20 30 25
tsu
Setup time before CLK↓
Data (J, K)
6 V 17 25 21
ns
tsu Setup time before CLK↓2 V 100 150 125 ns
PRE or CLR inactive 4.5 V 20 30 25
PRE or CLR inactive
6 V 17 25 21
2 V 0 0 0
t
h
Hold time, data after CLK↓4.5 V 0 0 0 ns
th
Hold time, data after CLK↓
6 V 0 0 0
ns
SCLS099F − DECEMBER 1982 − REVISED SEPTEMBER 2003
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HC112 SN74HC112
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 5 10 3.4 4
f
max
4.5 V 25 50 17 20 MHz
fmax
6 V 29 60 20 24
MHz
2 V 54 165 245 205
PRE or CLR Q or Q 4.5 V 16 33 49 41
tpd
PRE or CLR
Q or Q
6 V 13 28 42 35
ns
tpd 2 V 56 125 185 155 ns
CLK Q or Q 4.5 V 16 25 37 31
CLK
Q or Q
6 V 13 21 31 26
2 V 29 75 110 95
t
t
Q or Q 4.5 V 9 15 22 19 ns
tt
Q or Q
6 V 8 13 19 16
ns
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load 35 pF
SCLS099F − DECEMBER 1982 − REVISED SEPTEMBER 2003
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PULSE DURATIONS
th
tsu
50%
50%50% 10%10% 90% 90%
VCC
VCC
0 V
0 V
trtf
Reference
Input
Data
Input
50%
High-Level
Pulse 50%
V
CC
0 V
50% 50%
VCC
0 V
tw
Low-Level
Pulse
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%50% 10%10% 90% 90%
VC
C
VO
H
VO
L
0 V
trtf
Input
In-Phase
Output
50%
tPLH tPHL
50% 50%
10% 10% 90%90% VO
H
VO
L
tr
tf
tPHL tPLH
Out-of-Phase
Output
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the followin
g
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. For clock inputs, fmax is measured when the input duty cycle is 50%.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLH and tPHL are the same as tpd.
Test
Point
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
84088012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
8408801EA ACTIVE CDIP J 16 1 TBD Call TI Call TI
8408801FA ACTIVE CFP W 16 1 TBD Call TI Call TI
JM38510/65305BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
M38510/65305BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN54HC112J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN74HC112D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC112DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC112DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC112DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC112DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC112DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC112DT ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC112DTE4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC112DTG4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC112N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74HC112N3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74HC112NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SNJ54HC112FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54HC112J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SNJ54HC112W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 2
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC112, SN74HC112 :
•Catalog: SN74HC112
•Military: SN54HC112
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HC112DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC112DR SOIC D 16 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
