SFH 4510
SFH 4515
GaAs-IR-Lumineszenzdioden (950 nm) in SMR® Gehäuse
GaAs Infrared Emitters (950 nm) in SMR® Package
Lead (Pb) Free Product - RoHS Compliant
SFH 4510 SFH 4515
2009-08-21 1
Wesentliche Merkmale
• GaAs-LED mit sehr hohem Wirkungsgrad
•SMR
® (Surface Mount Radial) Gehäuse
• Für Oberflächenmontage geeignet
• Gehäusegleich mit Fotodiode SFH 2500/
SFH 2505
• Hohe Zuverlässigkeit
• UL Version erhältlich
• Gute spektrale Anpassung an
Si-Fotoempfänger
Anwendungen
• IR-Fernsteuerungen
• Rauchmelder
• Sensorik
• Diskrete Lichtschranken
• Diskrete Optokoppler
Typ
Type Bestellnummer
Ordering Code Gehäuse
Package
SFH 4510 Q65110A2630 5-mm-SMR®-Gehäuse (T 1 3/4), schwarzes Epoxy-
Gießharz, Anschlüsse (SFH 4510 gebogen, SFH 4515
gerade) im 2.54-mm-Raster (1/10’’),
Kathodenkennzeichnung: siehe Maßzeichnung.
5 mm SMR® package (T 1 3/4), black-colored epoxy resin,
solder tabs (SFH 4510 bent, SFH 4515 straight) lead
spacing 2.54 mm (1/10’’), cathode marking: see package
outline.
SFH 4510 E9548 (UL) Q65110A5375
SFH 4515 Q65110A2633
Features
• Very highly efficient GaAs-LED
•SMR
® (Surface Mount Radial) package
• Suitable for surface mounting (SMT)
• Same package as photodiode SFH 2500/
SFH 2505
• High reliability
• UL version available
• Spectral match with silicon photodetectors
Applications
• IR remote controls
• Smoke detectors
• Sensor technol ogy
• Discrete interrupters
• Discrete optocouplers
2009-08-21 2
SFH 4510, SFH 4515
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range Top; Tstg – 40 … + 100 °C
Sperrspannung
Reverse voltage VR5 V
Durchlassstrom
Forward current IF (DC) 100 mA
Stoßstrom, tp = 10 μs, D = 0
Surge current IFSM 3 A
Verlustleistung
Power dissipation Ptot 150 mW
Wärmewiderstand Sperrschicht - Umgebung bei
Montage auf FR4 Platine, Padgröße je 20 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 20 mm2 each
RthJA 300 K/W
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA
λpeak 950 nm
Spektrale Bandbreite bei 50% von Ιmax
Spectral bandwidth at 50% of Ιmax
IF = 100 mA
Δλ 55 nm
Abstrahlwinkel
Half angle ϕ± 14 Grad
deg.
Aktive Chipfläche
Active chip area A0.09 mm2
Abmessungen der aktiven Chipfläche
Dimension of the active chip area L × B
L × W0.3 × 0.3 mm²
Schaltzeiten, Ie von 10% auf 90% und von 90% auf
10%, bei IF = 100 mA, RL = 50 Ω
Switching times, Ιe from 10% to 90% and from 90%
to 10%, IF = 100 mA, RL = 50 Ω
tr, tf0.5 μs
SFH 4510, SFH 4515
2009-08-21 3
Kapazität
Capacitance
VR = 0 V, f = 1 MHz
Co25 pF
Durchlassspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 μs
VF
VF
1.30 (≤ 1.5)
2.30 (≤ 2.8)
V
V
Sperrstrom
Reverse current
VR = 5 V
IR0.01 (≤ 1) μA
Gesamtstrahlungsfluss
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe22 mW
Temperaturkoeffizient von Ie bzw. Φe, IF = 100 mA
Temperature coefficient of Ie or Φe, IF = 100 mA TCI– 0.5 %/K
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA TCV– 2 mV/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA TCλ0.3 nm/K
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
2009-08-21 4
SFH 4510, SFH 4515
Strahlstärke Ie in Achsrichtung
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter Symbol Werte
Values Einheit
Unit
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie typ
Ie min
50
≥ 25 mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 μs
Ie typ 450 mW/sr
SFH 4510, SFH 4515
2009-08-21 5
Relative Spectral Emission
Irel = f (λ)
Forward Current
IF = f (VF), single pu lse, tp = 20 μs
Radiation Characteristics Ιrel = f (ϕ)
OHRD1938
λ
rel
Ι
0880 920 960 1000
nm
1060
20
40
60
80
%
100
10
OHR01554
F
V
-3
-2
10
-1
10
0
10
1
10
0123456V8
A
Ι
F
OHF00265
02040 60 80 100 1200.40.60.81.0
100
90
80
70
60
50
0
10203040
0
0.2
0.4
0.6
0.8
1.0
Radiant Intensity
Single pulse, tp = 20 μs
Permissible Pulse Handling
Capability IF = f (τ), TA = 25 °C,
duty cycle D = parameter
Ιe
Ιe 100 mA = f (IF)
OHR01551
10
-3
Ι
F
-2
10
10
-1
10
0
10
1
10
2
Ι
e 100 mA
e
Ι
-2
10
-1
10
0
10
1
10A
A
t
OHR00860
p
-5
10
10
2
Ι
F
10
3
10
4
5
DC
0.2
0.5
0.1
0.005
0.01
0.02
0.05
t
p
T
Ι
F
t
p
T
D=
5
mA
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10s
D=
Max. Permissible Forward Current
IF = f (TA)
OHF01534
0
I
F
T
0
25
50
75
100
125
mA
10 20 30 40 50 60 70 80 ˚C 100
2009-08-21 6
SFH 4510, SFH 4515
Maßzeichnung
Package Outlines
Maße in mm (inch) / Dimensions in mm (inch).
SFH 4510
GEOY6968
3.9 (0.154)
4.5 (0.177)
Cathode/
7.1 (0.280)
7.7 (0.303)
2.54 (0.100)
spacing
13.1 (0.516)
14.7 (0.579)
5.5 (0.217)
7.5 (0.295)
1.95 (0.077)
2.05 (0.081)
R((3.2) (0.126))
5.4 (0.213)
6.0 (0.236)
((3.2) (0.126))
2.7 (0.106)
2.4 (0.094)
4.4 (0.173)
4.8 (0.189)
((R2.8 (0.110))
(-0.004...0.008)
3.7 (0.146)
3.3 (0.130)
2.8 (0.110)
2.4 (0.094)
4.5 (0.177)
3.9 (0.154)
Chip position
Collector
-0.1...0.2
GEOY6969
3.9 (0.154)
4.5 (0.177)
7.1 (0.280)
7.7 (0.303)
2.54 (0.100)
spacing
14.7 (0.579)
15.5 (0.610)
7.4 (0.291)
8.0 (0.315) ((3.2) (0.126))
5.4 (0.213)
6.0 (0.236)
((3.2) (0.126))
2.7 (0.106)
2.4 (0.094)
4.4 (0.173)
4.8 (0.189)
((R2.8 (0.110))
R2.05 (0.081)
1.95 (0.077)
Cathode/
4.5 (0.177)
3.9 (0.154)
Chip position
(-0.006...0.006)
Collector
-0.15...0.15
SFH 4515
SFH 4510, SFH 4515
2009-08-21 7
Empfohlenes Lötpaddesign
Recommended Solder Pad
Maße in mm (inch) / Dimensions in mm (inch).
SFH 4510
OHFY2449
5.3 (0.209)
1.3 (0.051)
2.54 (0.100)
7 (0.276)
3 (0.118)
Lötpad
Cu-Fläche > 20 mm
Cu-area > 20 mm22
Paddesign for
verbesserte Wärmeableitung
improved heat dissipation
Padgeometrie für
Lötstopplack
Solder resist
Bauteil positioniert
Component Location on Pad
SFH 4515
OHF02450
5.9 (0.232)
1.3 (0.051)
2.54 (0.100)
7 (0.276)
3 (0.118)
Cu-Fläche > 20 mm
Cu-area > 20 mm2
Paddesign for
verbesserte Wärmeableitung
improved heat dissipation
Padgeometrie für
Lötstopplack
Solder resist
Component Location on Pad
Bauteil positioniert
Aussparung 4.85 (0.191)
5.2 (0.205)
Lötpad (1 (0.039))
1.5 (0.059)
2
±0.05 (0.002)
2009-08-21 8
SFH 4510, SFH 4515
Lötbedingungen Vorbehandlung nach JEDEC Level 3
Soldering Conditions Preconditioning acc. to JEDEC Level 3
Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)
Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)
Published by
OSRAM Opto Semiconductors GmbH
Leibnizstrasse 4, D-93055 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assure d characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question plea se contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written app roval of OSRAM OS.
1 A critical componen t is a component usedin a life-support device or syste m whose failure can reasonably be expected
to cause the failure of that life-support devic e or system, or to a ffect its safety or e ffectiveness of that device or system.
2 Life support devices or systems are inte nded (a) to be implanted in the human body, or (b) to support and /or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
OHLA0687
0
0
T
t
˚C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50 100 150 200 250 300
Ramp Down
6 K/s (max)
3 K/s (max)
25 ˚C
30 s max
260 ˚C
+0 ˚C
-5 ˚C
245 ˚C
±5 ˚C
240 ˚C
255 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
235 ˚C
-0 ˚C
+5 ˚C
Minimum Solder Profile
10 s min
min. condition for IR Reflow Soldering:
solder point temperature ≥ 235 °C for at least 10 sec.
