BD6933FM-ME2 - ROHM SEMICONDUCTOR

Datashee

t

1/11 TSZ02201-0RCR1GZ00030-1-2

www.rohm.co.jp

TSZ22111・14・001

Reference voltage

output block

Current source

EARTH LEAKAGE CURRENT DETECTOR

EARTH LEAKAGE

CURRENT DETECTOR IC

BD9584F

●General Description

BD9584F integrates leakage detector and amplifier.

Especially, it is suitable for high sensitivity and a high-

speed operation use, and since the operating temperature

range is wide, it ca n be used fo r va ri ous uses.

●Features

■ Small temperature fluctuation and high input

sensitivity

■ Wide operating temperature range

●Applications

■ Earth leakage circuit breaker

■ Earth leakage circuit relay

●Key Specifications

■ Operating supply voltage range： 8V to 20V

■ Operating temperature range：－20°C to ＋90°C

■ Supply current： 250μA(typ.)

■ Trip voltage： 6.4mV to 12.0mV

■ Output current ability(Ta=－20℃)： 250μA(min.)

●Packages W(Typ.) x D(Typ.) x H(Max.)

SOP8 5.00mm x 6.20mm x 1.71mm

●Typical Application Circuit Example

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

Datasheet

2/11

BD9584F

TSZ02201-0RCR1GZ00030-1-2

www.rohm.co.jp

TSZ22111・15・001

SOP8

(TOP VIEW)

1 2 3 4

8 7 6 5

INGND TRC1VR

VS OS NR TRC2

1234

8765

VCC

Ctrl Latch

Block

Reset

Ctrl

●Pin Configurations ●Block Diagrams

●Pin Descriptions

Pin No. Symbol Function

1 GND Ground

2 IN Input

3 VR Reference voltage

4 TRC1 Capacitor con nection for negative side detection

5 TRC2 Capacitor con nection for positive side detection

6 NR Capacitor connection for false signal detection

7 OS Output

8 VS Power supply

●Absolute Maximum Ratings

(Ta=25℃)

Parameter Symbol Rating Unit

Supply current *1 IS 12.5 mA

Supply voltage VS 36 V

Input terminal voltage VVR/IN 25 V

TRC1/TRC2/NR/OS terminal voltage VTRC1/TRC2/NR/OS 8 V

Power dissipation Pd 680

*2 mW

Storage temper ature Tstg －55 to ＋150 ℃

*1 The power-supply voltage is limited by the internal clamping circuit.

*2 To use at temperature above Ta＝25℃ reduce 5.5mW/℃. Mounted on a glass epoxy PCB (70mm×70mm×1.6mm)

●Recommended Operating Ratings

Parameter Symbol Limits Unit

Supply voltage VS 8 to 20 V

Operating temperature Topr －20 to ＋90 ℃

Datasheet

3/11

BD9584F

TSZ02201-0RCR1GZ00030-1-2

www.rohm.co.jp

TSZ22111・15・001

100Ω

●Electrical Characteristics

(Unless otherwise specified, VS=12V, GND=0V, Ta=25℃)

Parameter Symbol

Temperature

Range Limits Unit Conditions

Min. Typ. Max.

Supply Current(Standby) IS 25℃ - 250 340 μA

Trip Voltage VT －20℃ to

+90℃ 6.4 9.2 12.0 mV CTRC=0.047μF

OS HIGH Voltage VOSH 25℃ 3 - - V IOS=250μF, VS=8V to 20V

OS LOW Voltage VOSL 25℃ - - 200 mV IOS=－100μF, VS=8V to 20V

OS Source Current IOS 25℃ 250 - - μA VOS=0.8V

IN Input Bias Current IIN 25℃ - 100 - nA VVR=VIN

VR Voltage VVR 25℃ 2.1 2.4 2.7 V VS=8V to 20V

NR Source Current INRSO 25℃ 6.9 9.9 12.9 μA VNR=2.7V, VVR=VIN

NR Threshold V olt age VTHNR 25℃ 2.1 2.4 2.7 V

TW3 Pulse Width TW3 25℃ 53.7 80.0 129.1 ms CNR=0.33μF

TRC1 Source Current IRC1SO 25℃ 35.9 51.3 66.7 μA VTRC1=2.0V,

ΔVIN=VIN－VVR=－0.3V

TRC1 Threshold Volt age VTH1 25℃ 2.1 2.4 2.7 V

TW1 Pulse Width TW1 25℃ 1.48 2.20 3.53 ms CTRC=0.047μF

TRC2 Source Current IRC2SO 25℃ 35.9 51.3 66.7 μA VTRC2=2.0V,

ΔVIN=VIN－VVR=+0.3V

TRC2 Threshold Volt age VTH2 25℃ 2.1 2.4 2.7 V

TW2 Pulse Width TW2 25℃ 1.48 2.20 3.53 ms CTRC=0.047μF

VS Clamp Voltage VSM 25℃ 27.8 29.4 31.0 V IS=10.5mA

●Test circuits

Datasheet

4/11

BD9584F

TSZ02201-0RCR1GZ00030-1-2

www.rohm.co.jp

TSZ22111・15・001

100Ω

TW1

VT－

VT＋

VTH1=VVR

VTH2=VVR

VTHNR=VVR

TW3

TW2

TW1 TW1

VTH1

VTHNR

VT－

VT＋

●Timing Chart

*3 TRC2=GND *4 TRC1=GND

Input voltage

between IN and VR

ΔVIN(IN-VR)

TRC1 terminal voltage

VTRC1

TRC2 terminal voltage

VTRC2

NR terminal voltage

VNR

OS terminal voltage

VOS

＜Negative side detection mode *3＞＜Positive side detection mode *4＞

ΔVIN(IN-VR)

VTRC1

VTRC2

VNR

VOS

Datasheet

5/11

BD9584F

TSZ02201-0RCR1GZ00030-1-2

www.rohm.co.jp

TSZ22111・15・001

0

50

100

150

200

250

300

0 5 10 15 20 25 30

SUPPLY VOLTAGE [V]

SUPPLY CURRENT [uA]

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

0 25 50 75 100 125 150

AMBIENT TEMPERATURE [℃]

POW ER DISSIPATIO N [W ]

90

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0 5 10 15 20

SUPPLY VOLTAGE [V]

VR TERM IN AL VO LTAGE [V]

0

10

20

30

40

50

60

0 5 10 15 20

SUPPLY VOLTAGE [V]

TRC1/2 SOURCE CURRENT [uA]

●Typical Performance Curves(refer ence data)

Figure 3

VR terminal voltage

- Supply voltage

Figure 4

TRC1/2 terminal source current

- Supply voltage

25℃ 90℃

-20℃

Figure 1

Derating curve Figure 2

Supply current - Supply voltage

25℃

90℃

-20℃

25℃

90℃

-20℃

Datasheet

6/11

BD9584F

TSZ02201-0RCR1GZ00030-1-2

www.rohm.co.jp

TSZ22111・15・001

0

100

200

300

400

0 5 10 15 20

SUPPLY VOLTAGE [V]

OS SOURCE CURRENT [uA]

0

100

200

300

400

500

0 5 10 15 20

SUPPLY VOLTAGE [V]

TRC1/2 SINK CURRENT [uA]

0

100

200

300

400

0 5 10 15 20

SUPPLY VOLTAGE [V]

OS SINK CURRENT [uA]

-40

-30

-20

-10

0

10

20

30

40

-60 -40 -20 0 20 40 60 80 100 120

AMBIENT TEMPERATURE [℃]

RATE OF VO LTAGE FLUCTUATIO N [% ]

Figure 5

Trip voltage fluctuation rate

- Ambient temperature

Figure 6

OS terminal source current - Supply voltage

Figure 7

TRC1/2 terminal source current - Supply voltage F igure 8

OS terminal sink current - Supply voltage

25℃

90℃

-20℃

25℃

90℃

-20℃

25℃

-20℃

90℃

Datasheet

7/11

BD9584F

TSZ02201-0RCR1GZ00030-1-2

www.rohm.co.jp

TSZ22111・15・001

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

0 25 50 75 100 125 150

AMBIENT TEMPERATURE [℃]

POWER DISSIPATION [W ]

90

●Power Dissipation

Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is he ated

when it consumed po wer, and the temperature of IC chip becomes higher than am bient temperature. The temperature that

can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.

Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal

resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum

value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead

frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called

thermal resistance, represented by the s ymbol θja℃/W. The temperature of IC ins ide the package can be estimated by this

thermal resistance. Fig.9(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient

temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated b y the equation belo w

θja = (Tj - Ta) / Pd ℃/W ・・・・・ (Ⅰ)

Derating curve in Fig.9(b) indicates po wer that can be cons umed by IC with reference to ambient temperature. Power that

can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal

resistance θja. Thermal resistance θja depends on chip size, po wer consumption, package, ambient temperature, package

condition, wind velocity, etc even when the same of package is us ed. Thermal reduction curve indicates a reference value

measured at a specified condition. Fig.10(a) shows a derating curve for an example of BD9584F.

Derating curve slope UNIT

BD9584F 5.5 mW/℃

When using the unit above Ta=25℃, subtract the value above per degree℃

Permissible dissipation is a value when FR4 glass epoxy board 70mm×70mm×1.6mm

(cooper foil area below 3%) is mounted.

(a) Thermal resistance (b) Derating curve

Figure 9. Thermal resistance and derating

(a) BD9584F

θja=(Tj-Ta)/P ℃/W

Figure 10. Derating curve

周囲温度 Ta [℃]

チップ表面温度 Tj [℃]

消費電力 P [ W]

Ambient temperature

Chip sur face te m perature

Power dissipation Pd[W]

0 50 75 100 125 15025

P1

P2

Pd (m ax)

LSIの消費電力 [W]

θ' ja2

θ' ja1 Tj ' ( ma x)

θja2 < θja1

周囲温度 Ta [℃]

θ ja2

θ ja1 Tj ( max)

Ambient temperature

Power dissipation of LSI

Datasheet

8/11

BD9584F

TSZ02201-0RCR1GZ00030-1-2

www.rohm.co.jp

TSZ22111・15・001

●I/O equivalence circuit

Datasheet

9/11

BD9584F

TSZ02201-0RCR1GZ00030-1-2

www.rohm.co.jp

TSZ22111・15・001

●Operational Notes

1) Absolute maximum ratings

Absolute maximum ratings are the values which indicate the limits, within which the given voltage range can be safely

charged to the terminal. However, it does not guar antee the circuit operation.

2) Power dissipation Pd

Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristi cs due to a rise in

chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation

(Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating

curves for more information.

3) Terminal short-circuits

When the output and power supply terminals are shorted, excessive output current may flow, resulting in undue heat

generation and, subsequ ently, destruction.

4) Ground terminal voltage

All time, Ground terminal voltage should keep lowest voltage.

In addition, please confirm whether there is not reall y a terminal bec oming the vo ltage that is lower than GND including a

transitional phenomenon.

5) Operation in a strong electromagnetic fiel d

Operation in a strong electromagnetic field may cause malf unctions.

6) Short-circuit between pins and erroneous mounting

Incorrect mounting may damage the IC. In additio n, the presenc e of foreign particles betwe en the outputs, the output and

the power supply, or the output and GND may result in IC destruction.

7) IC handing

Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical

characteristics due to piezo resistance effects.

8) Board inspection

Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every

process is recommended. In addition, when attaching and detaching the jig during the inspec tion phase, ensure that the

power is turned off before inspection and removal. Furthermore, please take measures against ESD in the assembly

process as well as during transportation and storage.

Status of this document

The Japanese version of this docum ent is formal specification. A customer may use this translation v ersion only for a reference

to help reading the formal version.

If there are any differences in translation version of this docum ent formal version takes priority.

Datasheet

10/11

BD9584F

TSZ02201-0RCR1GZ00030-1-2

www.rohm.co.jp

TSZ22111・15・001

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

()

Direction of feed

Reel 1pin

(Unit : mm)

SOP8

0.9±0.15

0.3MIN

4

°

+

6

°

−

4

°

0.17 +0.1

-

0.05

0.595

6

43

8

2

5

1

7

5.0±0.2

6.2±0.3

4.4±0.2

(MAX 5.35 include BURR)

1.27

0.11

0.42±0.1

1.5±0.1

S

0.1 S

●Ordering Information

B D 9 5 8 4 F E 2

Part Numbe

r

Package

F: SOP8 Packaging and forming specification

E2: Embossed tape and reel

(SOP8)

●Physical Dimension Tape and Reel Information

●Marking Diagrams

SOP8

(TOP VIEW)

9584 LOT Number

１PIN MARK

Datasheet

11/11

BD9584F

TSZ02201-0RCR1GZ00030-1-2

www.rohm.co.jp

TSZ22111・15・001

●Revision History

Date Revision Changes

2012.10.30 001

New Release

Datasheet

Notice - GE Rev.002

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Datasheet

Notice - GE Rev.002

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or

concerning such information.