ASMT-Rx45-xxxxx
0.45mm Leadframe-Based Surface Mount ChipLED
Data Sheet
CAUTION: ASMT-Rx45 LEDs are Class 1C ESD sensitive per JESD22-A114C.01. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Description
Avagos ultra-thin ASMT-Rx45 ChipLEDs were developed
based on the industrial standard ChipLED 0603 platform
which requires less board space. These ChipLEDs provide
a wide viewing angle of 130 degrees to improve visibility
in bright sunlight.
In addition to the high-brightness and compact size,
Avagos ASMT-Rx45 ChipLEDs provide two signicant
advantages in the production environment: They can
be easily soldered using IR solder reow process, and
the package is qualied to a Joint Electronic Device En-
gineering Council (JEDEC) moisture sensitive level (MSL)
rating of 2a. For manufacturers, this rating means that
these ChipLEDs can be kept in the open air (30 degrees
C, 60 percent relative humidity) for up to four weeks after
being removed from its sealed package without the need
to remove absorbed moisture.
Avagos ultra-thin Leadframe ChipLED available in Red,
Orange, Yellow Green and Amber colors, the ASMT-Rx45
series is ideal for use by lighting designers developing
backlighting for dashboards and entertainment consoles
in automobiles, backlighting of industrial switches and
buttons, and small pixel indoor signs.
Features
Industrial 0603 platform – 1.6 x 0.8 x 0.45mm
Automotive qualied
Super wide 145 deg viewing angle
JEDEC MSL 2a.
Robust Operating Temperature from - 40 to +100°C
Junction Temperature Tj = 110°C
Available in 4000 parts per reel
RoHS & IR Reow compatible
Applications
Interior Automotive
Navigation backlighting
Audio panel backlighting
Push Button backlighting
Oce Automation, home appliances, industrial
equipment
Front panel backlighting
Push Button backlighting
LCD backlighting
Switches backlighting
Navigation backlighting
2
Package Dimensions
0.8
0.45
1.1
0.6
1.6
LED Die
Resin
Lead
Frame
Cathode
Side
0.4
Part Numbering System
A S M T - R X1 45 - X2 X3 X4 X5 X6
Packaging Option
Color Bin Selection
Max. Intensity Bin
Min. Intensity Bin
LED Chip Color
NOTES:
1. All Dimensions in millimeters.
2. Tolerance is ± 0.1mm unless otherwise specied.
Device Selection Guide
Part Number
Min. Iv
(mcd)
Typ. Iv
(mcd)
Test Current
(mA) Colors Dice Technology Package Description
ASMT-RR45-AQ902 90.0 120.0 20 Red AlInGaP Untinted, Diused
ASMT-RJ45-AQ502 71.5 130.0 20 Orange AlInGaP Untinted, Diused
ASMT-RF45-AN002 28.0 60.0 20 Yellow Green AlInGaP Untinted, Diused
ASMT-RA45-AP932 57.0 90.0 20 Amber AlInGaP Untinted, Diused
Notes:
1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED
package.
2. Tolerance: ±15%
3
Absolute Maximum Ratings at TA = 25°C
Parameter ASMT-Rx45 Units
DC Forward Current [1] 20 mA
Power Dissipation 48 mW
Reverse Voltage (IR = 100mA) 5 V
LED Junction Temperature 110 °C
Operating Temperature Range -40 to +100 °C
Storage Temperature Range -40 to +100 °C
Notes:
1. Applies when single LED is lit up.
Electrical Characteristics at TA = 25°C
Part Number
Forward Voltage, VF (Volts) [1]
@ IF = 20mA
Reverse Breakdown
VR (Volts) @ IR = 100mA
Thermal Resistance
RθJ-PIN (°C/W)
Min. Typ. Max. Min. Typical
ASMT-RR45-AQ902 1.6 2.0 2.4 5 246
ASMT-RJ45-AQ502 1.6 2.0 2.4 5 246
ASMT-RF45-AN002 1.6 2.0 2.4 5 246
ASMT-RA45-AP932 1.6 2.0 2.4 5 246
Notes:
1. VF Tolerance: ±0.1V
Optical Characteristics at TA = 25°C
Part Number Color
Peak Wavelength
λpeak (nm)
Dominant Wavelength
λd [2] (nm)
Viewing Angle
2θ1/2[3] (Degrees)
Typical Typical Typical
ASMT-RR45-AQ902 Red 636 622 145
ASMT-RJ45-AQ502 Orange 612 605 145
ASMT-RF45-AN002 Yellow Green 574 573 145
ASMT-RA45-AP932 Amber 593 591 145
Notes:
1. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
2. θ1/2 is the o-axis angle where the luminous intensity is ½ the peak intensity.
4
Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage.
Figure 3. Luminous intensity vs. forward current. Figure 4. Maximum forward current vs. ambient temperature.
Derated based on TJMAX = 110°C, RqJA = 465°C/W
Figure 5. Radiation pattern. Figure 6. Recommended soldering land pattern.
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specied.
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
0 5 10 15 20 25 30
IF - FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
RELATIVE INTENSITY
0
5
10
15
20
25
0 20 40 60 80 100 120
AMBIENT TEMPERATURE - °C
MAX. FORWARD CURRENT - mA
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
380 430 480 530 580 630 680 730 780
WAVELENGTH-nm
RELATIVE INTENSITY
YELLOW
GREEN
AMBER ORANGE
RED
1
10
100
0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50
VF - FORWARD VOLTAGE - V
IF - FORWARD CURRENT - mA
RED
AMBER/
ORANGE YELLOW
GREEN
5
Figure 8. Tape Dimensions.
Figure 9. Reeling Orientation.
Figure 7a. Recommended reow soldering prole. Figure 7b. Recommended Pb-free reow soldering prole.
Notes:
For detail information on reow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED
Indicator Components.
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
217ºC
200ºC
60 - 120 SEC.
3ºC/SEC. MAX.
(Acc. to J-STD-020C)
150ºC
255 - 260ºC
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
6ºC/SEC. MAX.
3ºC/SEC. MAX.
1.50
[0.059]
4.00
[0.157]
4.00
[0.157]
1.75
[0.069]
DIM. C
[SEE TABLE 1]
DIM. A
[SEE TABLE]
DIM. B
[SEE TABLE]
3.50 +/- 0.05
[0.14 +/- 0.002]
8.00 +/- 0.30
[0.315 +/- 0.012]
USER FEED
DIRECTION
COVER TAPE
CARRIER TAPE
0.254 +/- 0.02
[0.01 +/- 0.001]
Diam. 0.60 +/- 0.05
6
Intensity Bin Select (X3X4)
Individual reel will contain parts from one half bin only
X3Min IV Bin
X4
0 Full Distribution
2 2 half bins starting from X31
3 3 half bins starting from X31
4 4 half bins starting from X31
5 5 half bins starting from X31
6 2 half bins starting from X32
7 3 half bins starting from X32
8 4 half bins starting from X32
9 5 half bins starting from X32
Light Intensity (IV) Bin Limits
Bin ID
Intensity (mcd)
Min. Max.
A1 0.11 0.14
A2 0.14 0.18
B1 0.18 0.23
B2 0.23 0.29
C1 0.29 0.36
C2 0.36 0.45
D1 0.45 0.57
D2 0.57 0.72
E1 0.72 0.90
E2 0.90 1.10
F1 1.10 1.41
F2 1.41 1.80
G1 1.80 2.24
G2 2.24 2.80
H1 2.80 3.55
H2 3.55 4.50
J1 4.50 5.70
J2 5.70 7.20
K1 7.20 9.00
K2 9.00 11.20
L1 11.20 14.20
L2 14.20 18.00
M1 18.00 22.50
M2 22.50 28.00
N1 28.00 36.00
N2 36.00 45.00
P1 45.00 57.00
P2 57.00 71.50
Q1 71.50 90.00
Q2 90.00 113.00
R1 113.00 142.00
R2 142.00 180.00
S1 180.00 227.00
S2 227.00 285.00
Tolerance: ±15%
7
Color Bin Select (X5)
Individual reel will contain parts from one full bin only.
X5
0 Full Distribution
Z A and B only
Y B and C only
W C and D only
V D and E only
U E and F only
T F and G only
S G and H only
Q A, B and C only
P B, C and D only
N C, D and E only
M D, E and F only
L E, F and G only
K F, G and H only
J Special Color Bin
1 A, B, C and D only
2 E, F, G and H only
3 B, C, D and E only
4 C, D, E and F only
5 A, B, C, D and E only
6 B, C, D, E, and F only
Packaging Option (X6)
Option Test Current Package Type Reel Size
2 20 mA Top Mount 7 Inch
H 2 mA Top Mount 7 Inch
K 5 mA Top Mount 7 Inch
Forward Voltage (VF) Bin Limits
Bin ID
Forward Voltage (V)
Minimum Maximum
1 1.60 1.80
2 1.80 2.00
3 2.00 2.20
4 2.20 2.40
Tolerance: ±0.1V
Color Bin Limits
Yellow Green Color Bin
Bin ID
Dominant Wavelength (nm)
Min. Max.
E 564.5 567.5
F 567.5 570.5
G 570.5 573.5
H 573.5 576.5
Yellow/Amber Color Bin
Bin ID
Dominant Wavelength (nm)
Min. Max.
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
F 594.5 597.0
Orange Color Bin
Bin ID
Dominant Wavelength (nm)
Min Max
A 597.0 600.0
B 600.0 603.0
C 603.0 606.0
D 606.0 609.0
E 609.0 612.0
Red Color Bin
Bin ID
Dominant Wavelength (nm)
Min. Max.
Full Distribution 620.0 635.0
Tolerance: ±1nm
Moisture Sensitivity
This product is qualied as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for details.
A. Storage before use
Unopen moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has
exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reow the LEDs per the
original MSL rating.
It is not recommended to open the MBB prior to assembly (e.g. for IQC).
B. Control after opening the MBB
The humidity indicator card (HIC) shall be read immediately upon opening of MBB.
The LEDs must be kept at <30°C/60%RH at all time and all high temperature related process including soldering,
curing or rework need to be completed within 672 hours.
C. Control for unnished reel
For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be
stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their oor life of
672 hours.
E. Baking is required if:
“10%” or “15%” HIC indicator turns pink.
The LEDs are exposed to condition of >30°C/60% RH at any time.
The LEDs oor life exceeded 672 hours.
Recommended baking condition: 60±5°C for 20 hours.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
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Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved.
AV02-0378EN - December 23, 2008