PROTECTION PRODUCTS
1www.semtech.com
PROTECTION PRODUCTS - MicroClampTM
uClamp3305P
Low Voltage TVS
for ESD Protection
Description Features
Circuit Diagram Package
Revision 02/15/2008
The μClampTM series of TVS arrays are designed to
protect sensitive electronics from damage or latch-up
due to ESD, lightning, and other voltage-induced
transient events. Each device will protect up to four
lines operating at 3.3 volts.
The μClampTM3305P is a solid-state device designed
specifically for transient suppression. It is constructed
using Semtech’s proprietary EPD process technology.
The EPD process provides low standoff voltages with
significant reductions in leakage currents and capaci-
tance over traditional pn junction processes. They offer
desirable characteristics for board level protection
including fast response time, low clamping voltage and
no device degradation.
The μClamp3305P may be used to meet the immunity
requirements of IEC 61000-4-2, level 4 (±15kV air,
±8kV contact discharge). It is packaged in an ultra
small SLP1616P6 package with a low profile of only
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPdAu. The small
package makes it ideal for use in portable electronics
such as cell phones, digital still cameras, and notebook
computers.
Applications
Mechanical Characteristics
Cellular handsets and accessories
Notebooks and handhelds
MP3 Players
Digital cameras
Portable instrumentation
PDA’s
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Small package for use in portable electronics
Protects five I/O lines
Working voltage: 3.3V
Low leakage current
Low operating and clamping voltages
Solid-state silicon-avalanche technology
SLP1616P6 package
RoHS/WEEE Compliant
Nominal Dimensions: 1.6 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead Finish: NiPdAu
Marking : Orientation Mark and Marking Code
Packaging : Tape and Reel
6 Pin SLP package (Bottom Side View)
1.6 x 1.6 x 0.58mm (Nominal)
Device Schematic
Center Tab (GND)
13456
0.6
1.6
1.6
1
0.5
6
2© 2008 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3305P
Absolute Maximum Rating
Electrical Characteristics (T=25oC)
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© 2008 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3305P
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
0
10
20
30
40
50
60
70
80
90
100
110
0 25 50 75 100 125 150
Ambient Temperature - TA (oC)
% of Rated Power or IPP
Power Derating Curve
Clamping Voltage vs. Peak Pulse Current
Normalized Capacitance vs. Reverse Voltage ESD Clamping
(8kV Contact per IEC 61000-4-2)
0.01
0.1
1
0.1 1 10 100 1000
Pulse Duration - tp (µs)
Peak Pulse Power - PPP (kW)
Forward Voltage vs. Forward Current
0
1
2
3
4
5
6
7
8
0123456
Forward Current - IF (A)
Forward Voltage - VF (V)
Waveform
Parameters:
tr = 8μs
td = 20μs
0
0.2
0.4
0.6
0.8
1
1.2
0 0.5 1 1.5 2 2.5 3 3.5
Reverse Volt age - VR (V)
CJ(VR) / CJ(VR=0)
f = 1 MHz
Line-Ground
Line-Line
0
2
4
6
8
10
0123456
Peak Pulse Current - IPP (A)
Clamping Voltage - VC (V)
Waveform
Parameters:
tr = 8μs
td = 20μs
4© 2008 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3305P
Insertion Loss S21 - LtoL (I/O to I/O) Insertion Loss S21 -LtoG (I/O to Pin 2)
2 3 4
1
START
. 030 MHz 3
STOP 000
. 000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: -3.0155 dB
260 MHz
2: -7.4637 dB
900 MHz
3: -9.2053dB
1.8 GHz
4: -9.9280 dB
2.5 GHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB 1
GHz
100
MHz 3
GHz
10
MHz
1
MHz
2 3 4
1
START
. 030 MHz 3
STOP 000
. 000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: -3.0041 dB
532 MHz
2: -4.0655 dB
900 MHz
3: -6.1405dB
1.8 GHz
4: -8.0944 dB
2.5 GHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB 1
GHz
100
MHz 3
GHz
10
MHz
1
MHz
Crosstalk S21 (I/O to Pin 4)
START
. 030 MHz 3
STOP 000
. 000 000 MHz
CH1 S21 LOG 20 dB / REF 0 dB
5
© 2008 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3305P
Device Connection Options
The μClamp3305P is designed to protect 5 signal lines
with an operating voltage of 0 to 3.3V. It will present a
high impedance to the protected line up to 3.3 volts. It
will “turn on” when the line voltage exceeds 3.5 volts.
The device is unidirectional and may be used on lines
where the signal polarity is above ground.
Pin 1,3,4,5,6 are connected to I/O signals. The center
tab is connected to system ground. Pin 2 should be left
open or not connected. All signal lines and ground
should be made with the lowest impedance and
inductance path as possible. This will improve signal
quality of the lines and keep the clamping voltage as low
as possible during a fast transient.
Due to the “snap-back” characteristics of the low
voltage TVS, it is not recommended that the I/O line be
directly connected to a DC source greater than snap-
back votlage (VSB) as the device can latch on.
EPD TVS Characteristics
These devices are constructed using Semtech’s
proprietary EPD technology. The structure of the EPD
TVS is vastly different from the traditional pn-junction
devices. At voltages below 5V, high leakage current
and junction capacitance render conventional ava-
lanche technology impractical for most applications.
However, by utilizing the EPD technology, these devices
can effectively operate at 3.3V while maintaining
excellent electrical characteristics.
The EPD TVS employs a complex nppn structure in
contrast to the pn structure normally found in tradi-
tional silicon-avalanche TVS diodes. The EPD mecha-
nism is achieved by engineering the center region of
the device such that the reverse biased junction does
not avalanche, but will “punch-through” to a conduct-
ing state. This structure results in a device with supe-
rior DC electrical parameters at low voltages while
maintaining the capability to absorb high transient
currents.
Applications Information
Figure 1 - Circuit Diagram
IPP
ISB
IPT
IR
V
RWM VV PT VC
VF
IF
SB
Figure 3 - EPD TVS IV Characteristic Curve
Figure 2 - Layout Example
Center Tab (GND)
13456
PROTECTION PRODUCTS
6www.semtech.com
PROTECTION PRODUCTS - MicroClampTM
uClamp3305P
Low Voltage TVS
for ESD Protection
Figure 3 - μClamp3305P Spice Model
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Applications Information - Spice Model
7
© 2008 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3305P
Outline Drawing - SLP1616P6
Land Pattern - SLP1616P6
bxN
E/2
LxN
E1
D1
A2
A
E
D
1.701.50
.067.059
1.50 1.70.067.059
INCHES
.020 BSC
b.008
bbb
aaa
N
D1
L
e
D
.010
.041
DIM
A1
A2
A
MIN
0.00
.020
0.30
0.20.012 0.25
.010
0.40
1.30
0.25
1.05
.004
.003
6
.013
.063
.047
.016
.051
0.08
0.10
6
0.33
1.60
1.20
0.50 BSC
MILLIMETERS
MAX
0.05
0.65
DIMENSIONS
MIN
0.00
NOM
(.005)
.023
.001
MAX
.002
.026
NOM
0.50
0.03
(0.13)
0.58
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
NOTES:
2.
1.
E1 .010 .016 .020 0.25 0.40 0.50
1.60.063E
AB
A1
SEATING
PLANE
C
aaa C
12
N
e
PIN 1
INDICATOR
(LASER MARK)
bbb C A B
D/2
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
1.
FUNCTIONAL PERFORMANCE OF THE DEVICE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD3.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
NOTES:
2.
DIM
X
Y
P
G
C
MILLIMETERSINCHES
1.52
.012
.025
.035
.020
.060
0.30
0.63
0.50
0.89
DIMENSIONS
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2.15.085Z
.018H 0.45
X
Z
P
Y
G(C)
H
K
K.051 1.30
8© 2008 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3305P
Marking Ordering Information
MicroClamp, uClamp and μClamp are marks of Semtech
Corporation
Tape and Reel Specification
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mm8 mm2.4
)561.(
mm1.0+5.1
mm0.0-
500.+95.0(
)000.-
mm8.0
50.0±
)130.(
01.±057.1
mm
)400.±960.(
50.0±5.3
mm
)200.±831.(
mm4.2
)490.(
1.0±0.4
mm
-00.±751.(
)4
1.0±0.4
mm
-00.±751.(
)4
-m50.0±0.2
m
)20
0.±970.(
mm4.0
)610.(
mm0.8
mm3.0+
mm1.0-
)210.±213.(
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
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W = Week
3305P
YW
Device Orientation in Tape
(Pin 1 upper left towards sprocket holes)
0A0B0K
mm01.0-/+87.1mm01.0-/+87.1mm01.0-/+96.0