CMOS linear image sensor
Digital output, built-in 8/10-bit A/D converter,
single power supply operation
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S10077
1
Analytical instruments
Pixel pitch: 14 μm
Pixel height: 50 μmPosition detection
Image reading
1024 pixels
Single power supply operation: 3.3 to 5 V
8-bit/10-bit switchable ADC
Low power consumption
On-chip charge ampli er with excellent input/output
characteristics
Simultaneous all-pixel integration and variable inte-
gration time function
Built-in timing generator allows operation with only
start and clock pulse inputs.
Video data rate: 1 MHz max.
Spectral response range: 400 to 1000 nm
Digital output
Absolute maximum ratings
Structure
Parameter Symbol Condition Value Unit
Supply voltage Vdd Ta=25 °C -0.3 to +6 V
A/D mode selection voltage Vsel Ta=25 °C -0.3 to +6 V
Clock pulse voltage V(CLK) Ta=25 °C -0.3 to +6 V
Start pulse voltage V(ST) Ta=25 °C -0.3 to +6 V
Operating temperature*1Topr -5 to +50 °C
Storage temperature*1Tstg -10 to +60 °C
*1: No condensation
Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the
product within the absolute maximum ratings.
Parameter Speci cation Unit
Number of pixels 1024 -
Pixel pitch 14 μm
Pixel height 50 μm
Photosensitive area length 14.336 mm
Package LCP (liquid crystal polymer) -
Window material Tempax -
The S10077 is a CMOS linear image sensor designed for image input applications. The signal processing circuit has a charge
ampli er with excellent input/output characteristics. The circuit also includes a 8-bit/10-bit A/D converter.
Features Applications
CMOS linear image sensor S10077
2
Recommended terminal voltage
Electrical characteristics (Ta=25 °C)
Electrical and optical characteristics (Ta=25 °C)
Parameter Symbol Min. Typ. Max. Unit
Supply voltage Vdd 3.3 5 5.25 V
AD mode selection voltage 8-bit Vsel 0 - 0.4 V
10-bit Vdd - 0.25 Vdd Vdd + 0.25 V
Clock pulse voltage High level V(CLK) Vdd - 0.25 Vdd Vdd + 0.25 V
Low level 0 - 0.4 V
Start pulse voltage High level V(ST) Vdd - 0.25 Vdd Vdd + 0.25 V
Low level 0 - 0.4 V
Parameter Symbol Min. Typ. Max. Unit
Clock pulse frequency 8-bit f(CLK) 1 M - 12 M Hz
10-bit 1 M - 6 M
Video data rate VR - f(CLK)/12 - Hz
Digital output rise time (10 to 90%)
CL=10 pF*2
tr --30
ns
CL=30 pF*2--60
Digital output fall time (90 to 10%)
CL=10 pF*2
tf --30
ns
CL=30 pF*2--60
Current
consumoption
Vdd=3.3 V 8-bit*3
l
-12-
mA
10-bit*4-10-
Vdd=5 V 8-bit*3-16-
10-bit*4-14-
*2: CL=Load capacitance of digital output terminal
*3: f(CLK)=12 MHz
*4: f(CLK)=6 MHz
Parameter Symbol Min. Typ. Max. Unit
Spectral response range λ400 to 1000 nm
Peak sensitivity wavelength λp- 700 - nm
Photosensitivity*5R-30-V/lx · s
Dark output*6
Vdd=3.3 V 8-bit*7
Dd
- 0.04 0.6
digit
10-bit*8- 0.16 2.4
Vdd=5 V 8-bit*7- 0.03 0.6
10-bit*8- 0.12 2.4
Saturation output*9
Vdd=3.3 V 8-bit*7
Dsat
255 - -
digit
10-bit*81023 - -
Vdd=5 V 8-bit*7255 - -
10-bit*81023 - -
Readout noise
Vdd=3.3 V 8-bit*7
Nr
-0.72
digit
10-bit*8- 2.8 8
Vdd=5 V 8-bit*7-0.72
10-bit*8- 2.8 8
Offset output
Vdd=3.3 V 8-bit*7
Do
11 29 41
digit
10-bit*844 116 164
Vdd=5 V 8-bit*771927
10-bit*828 76 108
Photoresponse nonuniformity*5 *10 PRNU - - ±10 %
*5: Measured with a tungsten lamp of 2856 K
*6: Integration time Ts=10 s
*7: f(CLK)=12 MHz
*8: f(CLK)=6 MHz
*9: Absolute value with respect to 0 digit
*10: Photoresponse nonuniformity (PRNU) is the output nonuniformity that occurs when the entire photosensitive area is uniformly
illuminated by light which is 50% of the saturation exposure level. PRNU is measured using 1022 pixels excluding the pixels at both
ends, and is de ned as follows:
PRNU= ΔX/X × 100 (%)
X: average output of all pixels, ΔX: difference between X and maximum or minimum output
CMOS linear image sensor S10077
Spectral response (typical example)
Wavelength (nm)
Relative sensitivity (%)
(Ta=25 °C)
400 600 800 1000
0
100
80
60
40
20
1200
KMPDB0266EB
3
Parameter Symbol Speci cation Unit
Digital output format - Serial output -
Resolution*11 8-bit mode RESO 8bit
10-bit mode 10
Conversion voltage range*12 Vdd=3.3 V -0 to 2.2 V
Vdd=5 V 0 to 3.3
*11: Vsel=0 V (8-bit mode), Vdd (10-bit mode)
*12: Digital output is available from MSB as serial output.
8-bit mode: D7 to D0
10-bit mode: D9 to D0
A/D converter speci cations (Ta=25 °C)
CMOS linear image sensor S10077
Timing Chart
CLK
ST
tf(CLK) tr(CLK)
tf(ST) tr(ST)
thp(ST)
tlp(ST)
tpi(ST)
KMPDC0224EB
4
Parameter Symbol Min. Typ. Max. Unit
Start pulse interval tpi(ST) 12339/f(CLK) - 120000/f(CLK) s
Start pulse low period tlp(ST) 45/f(CLK) - - s
Start pulse high period*13 thp(ST) 6000/f(CLK) - - s
Start pulse rise and fall times tr(ST), tf(ST) 0 20 30 ns
Clock pulse duty - 40 50 60 %
Clock pulse rise and fall times tr(CLK), tf(CLK) 0 20 30 ns
*13: Signal charge integration time equals the high period of start pulse + 7 CLK cycles.
The shift register operation starts at the fall of CLK pulse immediately after ST pulse sets to low.
Integration time can be changed by changing the high-to-low ratio of ST pulses.
CMOS linear image sensor S10077
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KMPDC0225EB
012345 10
7
15 20 25
34.5
33 45 57
41.5 46.5 53.5
22
AO1
34
33
34 42
D7 D0 46 54
D7 D0
45 5721
AO2
46
AO3 AO4
30 35 40 45 50 55
CLK
ST
EOS
AO
Trig(A)
DO
Trig(D)
EOC
tlp(ST)
thp(ST)
tpi(ST)
DO1 DO2
12322
12281.5 12286.5 12293.5 12298.5 12305.5 12310.5 12317.5
12285 12297 12309 12320
12286
AO1023
12297
12282
D0 12286
D7 12294
D0 12298
D7 12306
D0 12310
D7 12318
D0
12285
CLK
ST
EOS
AO
Trig(A)
DO
Trig(D)
EOC
thp(ST)
tpi(ST)
12298
AO1024
DO1022 DO1023 DO1024
Note: When using analog output AO, read the AO output at the falling edge of Trig(A).
When using digital output DO, read the DO output at the falling edge of Trig(D).
8-bit mode
In the neighborhood of start pixel
In the neighborhood of last pixel
CMOS linear image sensor S10077
KMPDC0226EB
10-bit mode
012345 10
7
15 20 25
34.5 43.5 46.5 55.5
33 45 57
22
AO1
34
33
34 44 46 56
D9 D0 D9 D0
45 5721
AO2
46
AO3 AO4
30 35 40 45 50 55
CLK
ST
EOS
AO
Trig(A)
DO
Trig(D)
EOC
tlp(ST)
thp(ST)
tpi(ST)
DO1 DO2
12322
12283.5 12286.5 12295.5 12298.5 12307.5 12310.5 12319.5
12285 12297 12309 12320
12297
12284
D0 12286
D9 12296
D0 12298
D9 12308
D0 12310
D9 12320
D0
12285
12286 12298
CLK
ST
EOS
AO
Trig(A)
DO
Trig(D)
EOC
thp(ST)
tpi(ST)
AO1023 AO1024
DO1022 DO1023 DO1024
In the neighborhood of start pixel
In the neighborhood of last pixel
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CMOS linear image sensor S10077
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Dimensional outline (unit: mm)
Photosensitive area
14.336
41.6 ± 0.2
2.54 0.51
27.94
7.168 ± 0.3
9.1 ± 0.1
4.23 ± 0.4
Photosensitive
area 50 µm
1
24
12
13
Photosensitive
surface
1 ch
a’
a
6.83 ± 0.2
10.2 ± 0.5
10.02 ± 0.3
3.0
4.0 ± 0.5
1.4 ± 0.2*2
1.35 ± 0.2*1
0.5 ± 0.05*3
0.2
Tolerance unless otherwise noted: ±0.1
*1: Distance from window upper surface
to photosensitive surface
*2: Distance from package bottom
to photosensitive surface
*3: Glass thickness
Direction of scan
a-a’ cross section
Pin no. Symbol I/O Discription Pin no. Symbol I/O Discription
1 NC No connection 13 NC No connection
2 D.Trig O Trigger signal for digital output 14 NC No connection
3 DO O Digital output 15 NC No connection
4 A.Trig O Trigger signal for analog output 16 EOS O End of scan signal
5 AO O Analog output 17 EOC O Digital conversion end signal
6 NC No connection 18 NC No connection
7 NC No connection 19 Vsel I A/D mode selection voltage
8 Vdd I Supply voltage 20 Vss I GND
9 Vss I GND 21 Vdd I Supply voltage
10 NC No connection 22 CLK I Clock signal
11 NC No connection 23 ST I Start signal
12 NC No connection 24 NC No connection
Note: Leave the “NC” terminals open and do not connect them to GND.
When using the analog output terminal, connect a buffer ampli er for impedance conversion to it so as to minimize the current
ow. As the buffer ampli er, use a high input impedance operational ampli er with JFET or CMOS input.
Pin connections
KMPDA0202EE
Cat. No. KMPD1088E07 Jul. 2013 DN
www.hamamatsu.com
HAMAMATSU PHOTONICS K.K., Solid State Division
1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184
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China: Hamamatsu Photonics (China) Co., Ltd.: 1201 Tower B, Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86) 10-6586-6006, Fax: (86) 10-6586-2866
Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the
information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always
contact us for the delivery specification sheet to check the latest specifications.
T
ype numbers of products listed in the delivery specification sheets or supplied as samples may have a suffix "(X)" which means preliminary specifications or
a suffix "(Z)" which means developmental specifications.
T
he product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that
one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product
use.
Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission.
Information described in this material is current as of July, 2013.
CMOS linear image sensor S10077
8
Precautions
(1) Electrostatic countermeasures
This device has a built-in protection circuit against static electrical charges. However, to prevent destroying the device with electro-
static charges, take countermeasures such as grounding yourself, the workbench and tools to prevent static discharges. Also protect
this device from surge voltages which might be caused by peripheral equipment.
(2) Incident window
If dust or dirt gets on the light incident window, it will show up as black blemishes on the image. When cleaning, avoid rubbing the
window surface with dry cloth or dry cotton swab, since doing so may generate static electricity. Use soft cloth, paper or a cotton
swab moistened with alcohol to wipe dust and dirt off the window surface. Then blow compressed air onto the window surface so
that no spot or stain remains.
(3) Soldering
To prevent damaging the device during soldering, take precautions to prevent excessive soldering temperatures and times. Solder-
ing should be performed within 5 seconds at a soldering temperature below 260 °C.
Related information
Notice
Image sensors/Precautions
Precautions
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