UC1842/3/4/5 UC2842/3/4/5 UC3842/3/4/5 Current Mode PWM Controller FEATURES DESCRIPTION * Optimized For Off-line And DC To DC Converters * Low Start Up Current (<1mA) * Automatic Feed Forward Compensation * Pulse-by-pulse Current Limiting * The UC1842/3/4/5 family of control ICs provides the necessary features to implement off-line or DC to DC fixed frequency current mode control schemes with a minimal external parts count. Internally implemented circuits include under-voltage lockout featuring start up current less than 1mA, a precision reference trimmed for accuracy at the error amp input, logic to insure latched operation, a PWM comparator which also provides current limit control, and a totem pole output stage designed to source or sink high peak current. The output stage, suitable for driving N Channel MOSFETs, is low in the off state. Enhanced Load Response Characteristics * Under-voltage Lockout With Hysteresis * Double Pulse Suppression * High Current Totem Pole Output * Internally Trimmed Bandgap Reference * 500khz Operation * Low RO Error Amp Differences between members of this family are the under-voltage lockout thresholds and maximum duty cycle ranges. The UC1842 and UC1844 have UVLO thresholds of 16V (on) and 10V (off), ideally suited to off-line applications. The corresponding thresholds for the UC1843 and UC1845 are 8.4V and 7.6V. The UC1842 and UC1843 can operate to duty cycles approaching 100%. A range of zero to 50% is obtained by the UC1844 and UC1845 by the addition of an internal toggle flip flop which blanks the output off every other clock cycle. BLOCK DIAGRAM Note 1: A/B Note 2: A = DIL-8 Pin Number. B = SO-14 and CFP-14 Pin Number. Toggle flip flop used only in 1844 and 1845. SLUS223A - APRIL 1997 - REVISED MAY 2002 UC1842/3/4/5 UC2842/3/4/5 UC3842/3/4/5 ABSOLUTE MAXIMUM RATINGS(Note 1) Supply Voltage (Low Impedance Source) . . . . . . . . . . . . . . 30V Supply Voltage (ICC < 30mA) . . . . . . . . . . . . . . . . . Self Limiting Output Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A Output Energy (Capacitive Load) . . . . . . . . . . . . . . . . . . . . 5 J Analog Inputs (Pins 2, 3). . . . . . . . . . . . . . . . . . . -0.3V to +6.3V Error Amp Output Sink Current . . . . . . . . . . . . . . . . . . . . 10 mA Power Dissipation at TA 25C (DIL-8) . . . . . . . . . . . . . . . . . 1 W Power Dissipation at TA 25C (SOIC-14) . . . . . . . . . 725 mW Storage Temperature Range . . . . . . . . . . . . . . -65C to +150C Junction Temperature Range . . . . . . . . . . . . . -55C to +150C Lead Temperature (soldering, 10 seconds) . . . . . . . . . . . 300C Note 1: All voltages are with respect to Pin 5. All currents are positive into the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of packages. CONNECTION DIAGRAMS DIL-8, SOIC-8 (TOP VIEW) N or J Package, D8 Package PLCC-20 (TOP VIEW) Q Package PACKAGE PIN FUNCTION FUNCTION PIN 1 N/C COMP 2 N/C 3 N/C 4 VFB 5 N/C 6 ISENSE 7 N/C 8 N/C 9 RT/CT 10 N/C 11 PWR GND 12 GROUND 13 N/C 14 OUTPUT 15 N/C 16 VC 17 VCC 18 N/C 19 VREF 20 SOIC-14, CFP-14. (TOP VIEW) D or W Package DISSIPATION RATING TABLE Package W TA 25C Power Rating 700 mW TA 70C Power Rating 452 mW Derating Factor Above TA 25C 5.5 mW/C 2 TA 85C Power Rating 370 mW TA 125C Power Rating 150 mW UC1842/3/4/5 UC2842/3/4/5 UC3842/3/4/5 ELECTRICAL CHARACTERISTICS: PARAMETER Unless otherwise stated, these specifications apply for -55C TA 125C for the UC184X; -40C TA 85C for the UC284X; 0C TA 70C for the 384X; VCC = 15V (Note 5); RT = 10k; CT = 3.3nF, TA=TJ. UC1842/3/4/5 UC2842/3/4/5 TEST CONDITIONS UC3842/3/4/5 UNITS MIN TYP MAX MIN TYP MAX 4.95 5.00 5.05 4.90 5.00 5.10 V Reference Section Output Voltage TJ = 25C, IO = 1mA Line Regulation 12 VIN 25V 6 20 6 20 mV Load Regulation 1 I0 20mA 6 25 6 25 mV Temp. Stability (Note 2) (Note 7) 0.2 0.4 Total Output Variation Line, Load, Temp. (Note 2) 4.9 5.1 0.2 0.4 mV/C 5.18 V 5 25 mV 4.82 Output Noise Voltage 10Hz f 10kHz, TJ = 25C (Note2) 50 Long Term Stability TA = 125C, 1000Hrs. (Note 2) 5 25 -30 -100 -180 -30 -100 -180 mA 47 52 57 47 52 57 kHz 0.2 1 0.2 1 % Output Short Circuit V 50 Oscillator Section Initial Accuracy TJ = 25C (Note 6) Voltage Stability 12 VCC 25V Temp. Stability TMIN TA TMAX (Note 2) Amplitude VPIN 4 peak to peak (Note 2) 5 5 % 1.7 1.7 V Error Amp Section VPIN 1 = 2.5V Input Voltage 2.45 Input Bias Current AVOL 2 VO 4V 65 2.50 2.55 -0.3 -1 2.42 90 65 2.50 2.58 V -0.3 -2 A 90 dB Unity Gain Bandwidth (Note 2) TJ = 25C 0.7 1 0.7 1 MHz PSRR 12 VCC 25V 60 70 60 70 dB Output Sink Current VPIN 2 = 2.7V, VPIN 1 = 1.1V Output Source Current VPIN 2 = 2.3V, VPIN 1 = 5V VOUT High VPIN 2 = 2.3V, RL = 15k to ground VOUT Low VPIN 2 = 2.7V, RL = 15k to Pin 8 2 6 2 6 mA -0.5 -0.8 -0.5 -0.8 mA 5 6 5 6 V 0.7 1.1 0.7 1.1 V Current Sense Section Gain (Notes 3 and 4) 2.85 3 3.15 2.85 3 3.15 V/V Maximum Input Signal VPIN 1 = 5V (Note 3) 0.9 1 1.1 0.9 1 1.1 V PSRR 12 VCC 25V (Note 3) (Note 2) Input Bias Current Delay to Output Note 2: Note 3: Note 4: Note 5: Note 6: Note 7: VPIN 3 = 0 to 2V (Note 2) 70 70 dB -2 -10 -2 -10 A 150 300 150 300 ns These parameters, although guaranteed, are not 100% tested in production. Parameter measured at trip point of latch with VPIN 2 = 0. Gain defined as VPIN 1 A= , 0 VPIN 3 0.8V VPIN 3 Adjust VCC above the start threshold before setting at 15V. Output frequency equals oscillator frequency for the UC1842 and UC1843. Output frequency is one half oscillator frequency for the UC1844 and UC1845. Temperature stability, sometimes referred to as average temperature coefficient, is described by the equation: V (max ) - VREF (min) Temp Stability = REF TJ (max ) - TJ (min) VREF (max) and VREF (min) are the maximum and minimum reference voltages measured over the appropriate temperature range. Note that the extremes in voltage do not necessarily occur at the extremes in temperature. 3 UC1842/3/4/5 UC2842/3/4/5 UC3842/3/4/5 ELECTRICAL CHARACTERISTICS: PARAMETER Unless otherwise stated, these specifications apply for -55C TA 125C for the UC184X; -40C TA 85C for the UC284X; 0C TA 70C for the 384X; VCC = 15V (Note 5); RT = 10k; CT = 3.3nF, TA=TJ. UC1842/3/4/5 UC2842/3/4/5 TEST CONDITION MIN UC3842/3/4/5 TYP MAX 0.1 0.4 1.5 2.2 MIN UNITS TYP MAX 0.1 0.4 1.5 2.2 Output Section Output Low Level ISINK = 20mA ISINK = 200mA Output High Level ISOURCE = 20mA 13 13.5 ISOURCE = 200mA 12 13.5 13 13.5 12 13.5 V V V V Rise Time TJ = 25C, CL = 1nF (Note 2) 50 150 50 150 ns Fall Time TJ = 25C, CL = 1nF (Note 2) 50 150 50 150 ns 14.5 16 17.5 V Under-voltage Lockout Section Start Threshold Min. Operating Voltage After Turn On X842/4 15 16 17 X843/5 7.8 8.4 9.0 7.8 8.4 9.0 V X842/4 9 10 11 8.5 10 11.5 V X843/5 7.0 7.6 8.2 7.0 7.6 8.2 V PWM Section Maximum Duty Cycle X842/3 95 97 100 95 97 100 % X844/5 46 48 50 47 48 50 % 0 % 0.5 1 mA 11 17 mA Minimum Duty Cycle 0 Total Standby Current Start-Up Current Operating Supply Current VPIN 2 = VPIN 3 = 0V 0.5 1 11 17 VCC Zener Voltage ICC = 25mA 30 34 Note 2: These parameters, although guaranteed, are not 100% tested in production. Note 3: Parameter measured at trip point of latch with VPIN 2 = 0 . VPIN 1 Note 4: Gain defined as: A = ; 0 VPIN 3 0.8V . VPIN 3 Note 5: Adjust VCC above the start threshold before setting at 15V. Note 6: Output frequency equals oscillator frequency for the UC1842 and UC1843. Output frequency is one half oscillator frequency for the UC1844 and UC1845. ERROR AMP CONFIGURATION Error Amp can Source or Sink up to 0.5mA 4 30 34 V UC1842/3/4/5 UC2842/3/4/5 UC3842/3/4/5 UNDER-VOLTAGE LOCKOUT During under-voltage lock-out, the output driver is biased to sink minor amounts of current. Pin 6 should be shunted to ground with a bleeder resistor to prevent activating the power switch with extraneous leakage currents. CURRENT SENSE CIRCUIT Peak Current (IS) is Determined By The Formula 1.0V ISMAX RS A small RC filter may be required to suppress switch transients. OSCILLATOR SECTION 5 UC1842/3/4/5 UC2842/3/4/5 ERROR AMPLIFIER OPEN-LOOP FREQUENCY RESPONSE OUTPUT SATURATION CHARACTERISTICS OPEN-LOOP LABORATORY FIXTURE High peak currents associated with capacitive loads necessitate careful grounding techniques. Timing and bypass capacitors should be connected close to pin 5 in a single point ground. The transistor and 5k potentiometer are used to sample the oscillator waveform and apply an adjustable ramp to pin 3. SHUT DOWN TECHNIQUES Shutdown of the UC1842 can be accomplished by two methods; either raise pin 3 above 1V or pull pin 1 below a voltage two diode drops above ground. Either method causes the output of the PWM comparator to be high (refer to block diagram). The PWM latch is reset dominant so that the output will remain low until the next clock cycle after the shutdown condition at pin 1 and/or 3 is removed. In one example, an externally latched shutdown may be accomplished by adding an SCR which will be reset by cycling VCC below the lower UVLO threshold. At this point the reference turns off, allowing the SCR to reset. 6 UC1842/3/4/5 UC2842/3/4/5 UC3842/3/4/5 OFFLINE FLYBACK REGULATOR Power Supply Specifications 1. Input Voltages 5VAC to 130VA (50 Hz/60Hz) 2. Line Isolation 3750V 3. Switching Frequency 40kHz 5. Output Voltage: A. +5V, 5%; 1A to 4A load Ripple voltage: 50mV P-P Max B. +12V, 3%; 0.1A to 0.3A load Ripple voltage: 100mV P-P Max C. -12V ,3%; 0.1A to 0.3A load Ripple voltage: 100mV P-P Max 4. Efficiency at Full Load 70% SLOPE COMPENSATION A fraction of the oscillator ramp can be resistively summed with the current sense signal to provide slope compensation for converters requiring duty cycles over 50%. 7 PACKAGE OPTION ADDENDUM www.ti.com 19-Jul-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-8670401PA ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC 5962-8670401VPA ACTIVE CDIP JG 8 1 TBD Call TI Level-NC-NC-NC 5962-8670401VXA ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 5962-8670401XA ACTIVE LCCC FK 20 1 TBD 5962-8670402PA ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC 5962-8670402VPA ACTIVE CDIP JG 8 1 TBD Call TI Level-NC-NC-NC 5962-8670402VXA ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 5962-8670402XA ACTIVE LCCC FK 20 1 TBD POST-PLATE Level-NC-NC-NC POST-PLATE Level-NC-NC-NC 5962-8670403PA ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC 5962-8670403VPA ACTIVE CDIP JG 8 1 TBD Call TI Level-NC-NC-NC 5962-8670403VXA ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 5962-8670403XA ACTIVE LCCC FK 20 1 TBD 5962-8670404PA ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC 5962-8670404VPA ACTIVE CDIP JG 8 1 TBD Call TI Level-NC-NC-NC 5962-8670404VXA ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 5962-8670404XA ACTIVE LCCC FK 20 1 TBD POST-PLATE Level-NC-NC-NC POST-PLATE Level-NC-NC-NC UC1842J ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC UC1842J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC UC1842JQMLV ACTIVE CDIP JG 8 UC1842L883B ACTIVE LCCC FK 20 1 TBD UC1842W ACTIVE CFP W 14 1 TBD A42 SNPB Level-NC-NC-NC TBD Call TI Call TI POST-PLATE Level-NC-NC-NC UC1843J ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC UC1843J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC UC1843JQMLV ACTIVE CDIP JG 8 TBD Call TI Call TI UC1843L ACTIVE LCCC FK 20 1 TBD POST-PLATE Level-NC-NC-NC UC1843L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE Level-NC-NC-NC UC1843LQMLV ACTIVE LCCC FK 20 UC1843W ACTIVE CFP W 14 UC1844J ACTIVE CDIP JG 8 UC1844J883B ACTIVE CDIP JG 8 UC1844JQMLV ACTIVE CDIP JG 8 UC1844L ACTIVE LCCC FK 20 1 TBD POST-PLATE Level-NC-NC-NC UC1844L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE Level-NC-NC-NC UC1844LQMLV ACTIVE LCCC FK 20 TBD Call TI UC1844W ACTIVE CFP W 14 1 TBD A42 SNPB Level-NC-NC-NC UC1845J ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC UC1845J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC UC1845JQMLV ACTIVE CDIP JG 8 UC1845L ACTIVE LCCC FK 20 1 TBD POST-PLATE Level-NC-NC-NC UC1845L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE Level-NC-NC-NC UC1845LQMLV ACTIVE LCCC FK 20 UC1845W ACTIVE CFP W 14 TBD Call TI 1 TBD A42 SNPB Level-NC-NC-NC 1 TBD A42 SNPB Level-NC-NC-NC 1 TBD A42 SNPB Level-NC-NC-NC TBD TBD 1 Addendum-Page 1 Call TI Call TI TBD Call TI TBD A42 SNPB Call TI Call TI Call TI Call TI Call TI Level-NC-NC-NC PACKAGE OPTION ADDENDUM www.ti.com 19-Jul-2005 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UC2842D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2842D8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2842D8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2842DR ACTIVE SOIC D 14 UC2842DTR ACTIVE SOIC D 14 TBD 2500 Green (RoHS & no Sb/Br) Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI CU NIPDAU Level-2-260C-1 YEAR UC2842DW ACTIVE SOIC DW 16 40 TBD CU NIPDAU Level-1-220C-UNLIM UC2842DWTR ACTIVE SOIC DW 16 2000 TBD CU NIPDAU Level-1-220C-UNLIM UC2842J OBSOLETE CDIP JG 8 TBD Call TI UC2842N ACTIVE PDIP P 8 50 TBD CU NIPDAU Call TI Level-NA-NA-NA UC2842P OBSOLETE PDIP P 8 TBD Call TI UC2843D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2843D8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2843D8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2843D8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2843DR OBSOLETE SOIC D 14 UC2843DTR ACTIVE SOIC D 14 UC2843J OBSOLETE CDIP JG 8 UC2843N ACTIVE PDIP P 8 UC2844D ACTIVE SOIC D 14 UC2844D8 ACTIVE SOIC D 8 UC2844D8TR ACTIVE SOIC D UC2844DTR ACTIVE SOIC UC2844N ACTIVE UC2845D TBD 2500 Green (RoHS & no Sb/Br) Call TI CU NIPDAU Call TI Call TI Level-2-260C-1 YEAR TBD Call TI Call TI 50 TBD CU NIPDAU Level-NA-NA-NA 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PDIP P 8 50 TBD CU NIPDAU Level-NA-NA-NA ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2845D8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845D8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845DTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2845J OBSOLETE CDIP JG 8 TBD Call TI UC2845N ACTIVE PDIP P 8 50 TBD CU NIPDAU Level-NA-NA-NA UC3842D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3842D8 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR Addendum-Page 2 Call TI PACKAGE OPTION ADDENDUM www.ti.com 19-Jul-2005 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UC3842D8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3842DTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3842J ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC UC3842N ACTIVE PDIP P 8 50 TBD CU NIPDAU Level-NA-NA-NA UC3842P OBSOLETE PDIP P 8 TBD Call TI UC3843D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3843D8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3843D8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3843DTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) (1) Call TI UC3843J ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC UC3843N ACTIVE PDIP P 8 50 TBD CU NIPDAU Level-NA-NA-NA UC3843P OBSOLETE PDIP P 8 TBD Call TI Call TI UC3843QTR OBSOLETE PLCC FN 20 TBD Call TI Call TI UC3844D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3844D8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3844D8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3844DTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3844J ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC UC3844N ACTIVE PDIP P 8 50 TBD CU NIPDAU Level-NA-NA-NA UC3844P OBSOLETE PDIP P 8 TBD Call TI UC3845D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3845D8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3845D8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3845DG4 ACTIVE SOIC D 14 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3845DTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3845DTRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 50 Call TI UC3845J ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC UC3845N ACTIVE PDIP P 8 50 TBD CU NIPDAU Level-NA-NA-NA UC3845NG4 ACTIVE PDIP P 8 50 TBD CU NIPDAU Level-NA-NA-NA UC3845P OBSOLETE PDIP P 8 TBD Call TI The marketing status values are defined as follows: Addendum-Page 3 Call TI PACKAGE OPTION ADDENDUM www.ti.com 19-Jul-2005 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 MECHANICAL DATA MCER001A - JANUARY 1995 - REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0-15 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MPDI001A - JANUARY 1995 - REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gage Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.430 (10,92) MAX 0.010 (0,25) M 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MPLC004A - OCTOBER 1994 FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER 20 PIN SHOWN Seating Plane 0.004 (0,10) 0.180 (4,57) MAX 0.120 (3,05) 0.090 (2,29) D D1 0.020 (0,51) MIN 3 1 19 0.032 (0,81) 0.026 (0,66) 4 E 18 D2 / E2 E1 D2 / E2 8 14 0.021 (0,53) 0.013 (0,33) 0.007 (0,18) M 0.050 (1,27) 9 13 0.008 (0,20) NOM D/E D2 / E2 D1 / E1 NO. OF PINS ** MIN MAX MIN MAX MIN MAX 20 0.385 (9,78) 0.395 (10,03) 0.350 (8,89) 0.356 (9,04) 0.141 (3,58) 0.169 (4,29) 28 0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58) 0.191 (4,85) 0.219 (5,56) 44 0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66) 0.291 (7,39) 0.319 (8,10) 52 0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20) 0.341 (8,66) 0.369 (9,37) 68 0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91) 84 1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45) 4040005 / B 03/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-018 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 PACKAGE OPTION ADDENDUM www.ti.com 12-Sep-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-8670401PA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type 5962-8670401VPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type 5962-8670401VXA ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type 5962-8670401XA ACTIVE LCCC FK 20 1 TBD 5962-8670402PA ACTIVE CDIP JG 8 1 TBD 5962-8670402VPA ACTIVE CDIP JG 8 1 5962-8670402VXA ACTIVE LCCC FK 20 1 5962-8670402XA ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type TBD A42 N / A for Pkg Type TBD Call TI N / A for Pkg Type POST-PLATE N / A for Pkg Type 5962-8670403PA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type 5962-8670403VPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type 5962-8670403VXA ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type 5962-8670403XA ACTIVE LCCC FK 20 1 TBD 5962-8670404PA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type 5962-8670404VPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type 5962-8670404VXA ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type 5962-8670404XA ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type POST-PLATE N / A for Pkg Type UC1842J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UC1842J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UC1842JQMLV ACTIVE CDIP JG 8 UC1842L883B ACTIVE LCCC FK 20 1 TBD UC1842W ACTIVE CFP W 14 1 TBD A42 SNPB N / A for Pkg Type TBD Call TI Call TI POST-PLATE N / A for Pkg Type UC1843J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UC1843J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UC1843JQMLV ACTIVE CDIP JG 8 TBD Call TI Call TI UC1843L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type UC1843L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type UC1843LQMLV ACTIVE LCCC FK 20 UC1843W ACTIVE CFP W 14 UC1844J ACTIVE CDIP JG 8 UC1844J883B ACTIVE CDIP JG 8 UC1844JQMLV ACTIVE CDIP JG 8 UC1844L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type UC1844L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type UC1844LQMLV ACTIVE LCCC FK 20 TBD Call TI UC1844W ACTIVE CFP W 14 1 TBD A42 SNPB N / A for Pkg Type UC1845J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UC1845J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UC1845JQMLV ACTIVE CDIP JG 8 UC1845L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type UC1845L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type UC1845LQMLV ACTIVE LCCC FK 20 UC1845W ACTIVE CFP W 14 TBD Call TI 1 TBD A42 SNPB N / A for Pkg Type 1 TBD A42 SNPB N / A for Pkg Type 1 TBD A42 SNPB N / A for Pkg Type TBD TBD 1 Addendum-Page 1 Call TI Call TI TBD Call TI TBD A42 SNPB Call TI Call TI Call TI Call TI Call TI N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 12-Sep-2006 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UC2842D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2842D8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2842D8G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2842D8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2842D8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Lead/Ball Finish Call TI MSL Peak Temp (3) UC2842DR ACTIVE SOIC D 14 UC2842DTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Call TI Level-1-260C-UNLIM UC2842DTRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2842DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2842DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2842DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2842DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2842J OBSOLETE CDIP JG 8 TBD Call TI UC2842N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU Call TI N / A for Pkg Type UC2842NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC2842P OBSOLETE PDIP P 8 TBD Call TI UC2843D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2843D8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2843D8G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2843D8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2843D8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2843DG4 ACTIVE SOIC D 14 CU NIPDAU Level-1-260C-UNLIM 50 Green (RoHS & no Sb/Br) TBD Call TI Call TI UC2843DR OBSOLETE SOIC D 14 UC2843DTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Call TI Level-1-260C-UNLIM UC2843DTRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2843J OBSOLETE CDIP JG 8 UC2843N ACTIVE PDIP P 8 UC2843NG4 ACTIVE PDIP P 8 TBD Call TI 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type Addendum-Page 2 Call TI PACKAGE OPTION ADDENDUM www.ti.com 12-Sep-2006 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UC2844D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844D8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844D8G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844D8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844D8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844DG4 ACTIVE SOIC D 14 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844DTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844DTRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC2844NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC2845D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845D8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845D8G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845D8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845D8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845DG4 ACTIVE SOIC D 14 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845DTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845DTRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845J OBSOLETE CDIP JG 8 UC2845N ACTIVE PDIP P 8 UC2845NG4 ACTIVE PDIP P UC3842D ACTIVE SOIC UC3842D8 ACTIVE UC3842D8G4 50 50 Lead/Ball Finish MSL Peak Temp (3) TBD Call TI 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3842D8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3842D8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 3 Call TI PACKAGE OPTION ADDENDUM www.ti.com 12-Sep-2006 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UC3842DG4 ACTIVE SOIC D 14 UC3842DTR ACTIVE SOIC D UC3842DTRG4 ACTIVE SOIC 50 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3842J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UC3842N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3842NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3842P OBSOLETE PDIP P 8 TBD Call TI UC3843D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3843D8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3843D8G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3843D8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3843D8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3843DG4 ACTIVE SOIC D 14 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3843DTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3843DTRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 50 Call TI UC3843J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UC3843N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3843NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3843P OBSOLETE PDIP P 8 TBD Call TI Call TI UC3843QTR OBSOLETE PLCC FN 20 TBD Call TI Call TI UC3844D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3844D8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3844D8G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3844D8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3844D8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3844DG4 ACTIVE SOIC D 14 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3844DTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3844DTRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 4 PACKAGE OPTION ADDENDUM www.ti.com 12-Sep-2006 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) UC3844J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UC3844N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3844NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3844P OBSOLETE PDIP P 8 TBD Call TI UC3845D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3845D8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3845D8G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3845D8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3845D8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3845DG4 ACTIVE SOIC D 14 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3845DTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3845DTRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3845J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type UC3845N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3845NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3845P OBSOLETE PDIP P 8 TBD Call TI 50 Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the Addendum-Page 5 PACKAGE OPTION ADDENDUM www.ti.com 12-Sep-2006 accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 6 MECHANICAL DATA MCER001A - JANUARY 1995 - REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0-15 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MPDI001A - JANUARY 1995 - REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gage Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.430 (10,92) MAX 0.010 (0,25) M 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MPLC004A - OCTOBER 1994 FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER 20 PIN SHOWN Seating Plane 0.004 (0,10) 0.180 (4,57) MAX 0.120 (3,05) 0.090 (2,29) D D1 0.020 (0,51) MIN 3 1 19 0.032 (0,81) 0.026 (0,66) 4 E 18 D2 / E2 E1 D2 / E2 8 14 0.021 (0,53) 0.013 (0,33) 0.007 (0,18) M 0.050 (1,27) 9 13 0.008 (0,20) NOM D/E D2 / E2 D1 / E1 NO. OF PINS ** MIN MAX MIN MAX MIN MAX 20 0.385 (9,78) 0.395 (10,03) 0.350 (8,89) 0.356 (9,04) 0.141 (3,58) 0.169 (4,29) 28 0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58) 0.191 (4,85) 0.219 (5,56) 44 0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66) 0.291 (7,39) 0.319 (8,10) 52 0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20) 0.341 (8,66) 0.369 (9,37) 68 0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91) 84 1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45) 4040005 / B 03/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. 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