TVS8151, TVS8181 15 V and 18 V Unidirectional Transient Voltage Suppressors Features * Unidirectional High Voltage ESD Protection * Provides ESD Protection to IEC61000-4-2 Level 4: * * * www.onsemi.com 30 kV Contact Discharge IEC 61000-4-5 (lighting) High Voltage Zener Diode Protects Supply Rail up to 100 A (8/20 ms) These Devices are Pb-Free and are RoHS Compliant UDFN-6 D4 SUFFIX CASE 517CS APPLICATION DIAGRAM Vcc (1) BLOCK DIAGRAM Cathode Anode GND (6) MARKING DIAGRAM DAP** GND (5) 1 Ax M G **Die Attach Pad on back of package (connect to ground) Ax M G = Specific Device Code x = 5 or 8 = Date Code = Pb-Free Package ORDERING INFORMATION Device Package Shipping TVS8151MUTBG UDFN-6 (Pb-Free) 3000/Tape & Reel TVS8181MUTBG UDFN-6 (Pb-Free) 3000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2016 October, 2016 - Rev. 0 1 Publication Order Number: TVS8151/D TVS8151, TVS8181 PACKAGE / PINOUT DIAGRAMS Table 1. PIN DESCRIPTIONS 4-Channel, 6-Lead, UDFN-8 Package Pin Name Type 1 VCC HV VDD 2 N/C No Connect 3 N/C No Connect 4 N/C No Connect 5 GND Ground 6 GND Ground Top View (Pins Down View) Description 6 5 HV ESD Channel XX M Pin 1 Marking 6 1 2 3 4 I Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR IF Working Peak Reverse Voltage VC VBR VRWM Maximum Reverse Leakage Current @ VRWM VBR IT 5 6-Lead UDFN ELECTRICAL CHARACTERISTICS Symbol Bottom View (Pins Up View) 1 2 3 4 V IR VF IT Breakdown Voltage @ IT Test Current QVBR Maximum Temperature Coefficient of VBR IPP IF Forward Current VF Forward Voltage @ IF Uni-Directional TVS SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units Operating Temperature Range -55 to +125 C Storage Temperature Range -65 to +150 C Peak Current (tp = 8/20 ms) TVS8151 100 A Peak Current (tp = 8/20 ms) TVS8181 119 A Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ELECTRICAL CHARACTERISTICS Device Name Device Marking VC @ IPP (Note 3) Breakdown Voltage VRWM (V) (Note 1) IR @ VRWM A) Max Max Min Nom Max VBR V (Note 2) (8 x 20 ms) @ IT (mA) VC (V) IPP (A) Max TVS8151 A5 15 1 16 17.5 18.5 1 27 100 TVS8181 A8 18 1 20 22.5 23.5 1 28 30 70 100 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. A transient suppressor is normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the DC or continuous peak operating voltage level. 2. VBR measured at pulse test current IT at an ambient temperature of 25C. 3. Surge current waveform per Figure 1. www.onsemi.com 2 TVS8151, TVS8181 Ipp - PEAK PULSE CURRENT - %Ipp TYPICAL CHARACTERISTICS tr = rise time to peak value [8 ms] tf = decay time to half value [20 ms] Peak Value 100 Half Value 50 0 0 tr tf TIME (ms) Figure 1. IEC61000-4-5 8/20 s Pulse Waveform www.onsemi.com 3 TVS8151, TVS8181 PACKAGE DIMENSIONS UDFN6, 1.8x2, 0.4P CASE 517CS ISSUE O D PIN ONE REFERENCE CC CC EE A B III III III EXPOSED Cu NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINALS AND IS MEASURED BETWEEN 0.15 AND 0.30mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MOLD CMPD DETAIL B ALTERNATE CONSTRUCTION E 0.10 C 2X 0.10 C 2X L L TOP VIEW DIM A A1 A3 b D D2 E E2 e e1 e2 L L1 L1 DETAIL B A3 0.05 C DETAIL A ALTERNATE CONSTRUCTIONS A 6X 0.05 C NOTE 4 A1 C SIDE VIEW SEATING PLANE 0.10 C DETAIL A 2X e/2 RECOMMENDED MOUNTING FOOTPRINT* e D2 1 6X 4 1 2X 4 E2 b 0.07 C A B 0.05 C 0.95 NOTE 3 2X 6X L MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.125 REF 0.15 0.25 1.80 BSC 0.35 0.55 2.00 BSC 0.74 0.94 0.40 BSC 0.80 BSC 0.95 BSC 0.20 0.40 0.15 --- 0.40 PITCH 0.55 6X 0.48 0.10 C 6 5 e1/2 6 PACKAGE OUTLINE 5 2X 0.94 2.20 e2 e1 BOTTOM VIEW SUPPLEMENTAL BOTTOM VIEW 6X 0.25 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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