F0094V - OSRAM GmbH - Datasheet.Live

F 0094U

F 0094V

GaAs-Infrarot-Lumineszenzdiode (950 nm, 300 µm Kantenlänge)

GaAs Infrared Light Emitting Di ode (950 nm, 12 mil)

Vorläufige Daten / Preliminary data

2002-02-04 1

Wesentliche Merkmale

• Typ. Gesamtleistung: 15 mW @ 100 mA im

TOPLED® Gehäuse

•Chipgröße 300 x 300 µm2

•GaAs-LED mit sehr hohem Wirkungsgrad

•Gute Linearität (Ie = f [IF]) bei hohen Strömen

•Gleichstrom- oder Impulsbetrieb möglich

•Hohe Zuverlässigkeit

•Hohe Impulsbelastbarkeit

Anwendungen

•Miniaturlichtschranken für Gleich- und

Wechsellichtbetrieb, Lochstreifenleser

•Industrieelektronik

•„Messen/Steuern/Regeln“

•Automobiltechnik

•Sensorik

•Alarm- und Sicherungssysteme

•IR-Freiraumübertragung

Typ

Type Bestellnummer

Ordering Code Gehäuse

Package

F 0094U on request Infrarot emittierender Chip, Oberseite Anodenanschluß,

Oberfläche aufgerauht

Infrared emitting die, top side anode connection, surface

frosted

F 0094V Q67220-C1268 Infrarot emittierender Chip, Oberseite Anodenanschluß

Infrared emitting die, top side anode connection

Features

•Typ. total radiant power: 15 mW @ 100 mA in

TOPLED® package

•Chip size 300 x 300 µm2

•Very highly efficient GaAs LED

•Good linearity (Ie = f [IF]) at high currents

•DC or pulsed operations are possible

•High reliability

•High pulse handling capability

Applications

•Miniature photointerrupters

•Industrial electronics

•Drive and control circuits

•Automotive technology

•Sensor technology

•Alarm and safety equipment

•IR free air transmission

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F 0094U, F 0094V

Elektrische Werte (gemessen auf TO18-Bodenplatte ohne Verguss, TA = 25 °C)

Electrical values (measured on TO18 header without resin, TA = 25 °C)

Bezeichnung

Parameter Symbol

Symbol Wert1)

Value1) Einheit

Unit

min. typ. max.

Wellenlänge der Strahlung

Wavelength at peak emission

IF = 10 mA

λpeak 950 nm

Spektrale Bandbreite bei 50% von Imax,

IF = 10 mA

Spectral bandwidth at 50% of Imax

∆λ 55 nm

Sperrspannung

Reverse voltage

IR = 10 µA,

VR530 V

Schaltzeiten, Ie von 10% a uf 90% und von 90% auf

10%, bei IF = 100 mA, RL = 50 Ω

Switching t imes, Ie from 10% to 90% and from

90% to 10%, IF = 100 mA, RL = 50 Ω

tr, tf0.5/0.4 µs

Durchlaβspannung

Forward voltage

IF = 100 mA, tp = 20 ms

IF = 1 A, tp = 100 µsVF1.35

3.0 1.5 V

Gesamtstrahlungsfluβ4)

Total radiant flux4)

IF = 100 mA, tp = 20 ms

F 0094U

F 0094V

Φe

4.8

4.2 8

7mW

Temperaturkoeffizient2) von λ

Temperature coefficient2) of λ

IF = 100 mA;

TCλ0.3 nm/K

Temperaturkoeffizient2) von VF

Temperature coefficient2) of VF

IF = 100 mA;

TCV-1.5 mV/K

F 0094U, F 0094V

2002-02-04 3

Mechanische Werte

Mechanical values

Bezeichnung

Parameter Symbol

Symbol Wert1)

Value1) Einheit

Unit

min. typ. max.

Chipkantenlänge (x-Richtun g)

Length of chip edge (x-direction) Lx0.28 0.3 0.32 mm

Chipkantenlänge (y-Richtun g)

Length of chip edge (y-direction) Ly0.28 0.3 0.32 mm

Durchmesser des Wafers

Diameter of the wafer D76.2 mm

Chiphöhe

Die height H170 185 200 µm

Bondpaddurchmesser

Diameter of bondpad d135 µm

Bezeichnung

Parameter Wert

Value

Vorderseitenmetallisierung

Metallization frontside Aluminium

Aluminum

Rückseitenmetallisierung

Metallization backside Goldlegierung

Gold alloy

Trennverfahren

Dicing Sägen

Sawing

Verbindung Chip - Träger

Die bonding Kleben

Epoxy bonding

F 0094U, F 0094V

2002-02-04 4

Grenzwerte3) (TA = 25 °C)

Maximum Ratings3) (TA = 25°C)

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Maximaler Betriebstemperaturbereich

Maximum operating temperature range Top - 40...+100 °C

Maximaler Lagertemperaturbereich

Maximum storage temperatur range Tstg - 40...+100 °C

Maximaler Durchlaßstrom

Maximum forward current IF100 mA

Maximaler Stoßstrom

maximum surge current

tp = 10 µs, D = 0.005

IS3A

Maximale Sperrschichttemperatur

Maximum junction temperature Tj125 °C

F 0094U, F 0094V

2002-02-04 5

Relati ve Sp ectral Emissi on2) Irel = f (λ),

TA = 25 °C

Forwa rd Current2) ,IF = f (VF),

single pu ls e, tp = 20 µs, TA = 25 °C

Radiant Intensity2)

Single pulse, tp = 20 µs, TA = 25 °C

Permissible Pulse Handling Capability2) IF = f (tP)

duty cycle D = paramet er, TA = 25 °C

OHR01938

rel

0880 920 960 1000

1060

100

OHR01554

-3

-2

-1

0123456V8

Ιe

Ιe 100 mA = f (IF)

OHR00864

-1

10 10

-2 -1

10 A 10

mA)(100

OHR00865

-5

10 2

10 3

10 4

0.2

0.5

0.1

0.005

0.01

0.02

0.05

-4

10 -3

10 -2

10 -1

10 0

10 1

10 2

10s

ττ

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F 0094U, F 0094V

Maßzeichnung

Chip Outlines

Maße werden als typische1) Wer te wie folgt angegeben: mm (inch) / Dimen sions are specified as typical1) values as

follows: mm (inch).

GMOY6080

0.185 (0.0073)

0.135 (0.0053)

p-contact

n-contact

0.3 (0.0118)

F 0094U, F 0094V

2002-02-04 7

Published by OSRAM Opto Semiconductors GmbH

Wernerwerkstrasse 2, D-93049 Regensburg

Attention please!

The inform ation gen erally descri bes the type of compone nt and shall not be considered as assured ch aracteristic s or

detaile d sp ec if ic at ion.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substa nc es . For information on the types in question pleas e c ont ac t our s ales organizatio n.

Packing

Please use the recyc ling operat ors known t o you. We can also help y ou – get in touch wit h your near est sales offic e.

By agreement we will take packing material back, if it is sorted. You will have to bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Com pon en ts used in life- su pport devices or system s mu st be expressl y au thorized b y us for su ch p ur p o se!

Critical components5), may only be used in life-support devices or systems6) with the express written approval of

OSRAM OS.

1) Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information.

This is not a spe cified value. For final e lectrical te sting a spot check with sufficient st atistical accura cy is carr ied out.

Minimum and maximum values( refered to as min. and max.) refer to the limits of the sample measurement.

2) Based on data measured in OSRAM Opto Semiconductor’s TOPLED® pa c ka ge. T hey represent typical1) data.

3) Maximum ratings are strongly package dependent and may differ between different packages. The values given

represent the chip in an OSRAM OS TO PLED® package and are only valid for this package.

4) Value is refe renc ed to the vendor’s measure m ent sys t em (correlati on t o cu stom er product( s) is requ ired).

5)A critical component is a component used in a life-support device or system whose failure can reasonably be expected

to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.

6)Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain

and sust ain human life. If th ey fail , it is rea so nable to assum e th at the health of the user m ay be endange red.