3 Bonding Film AF111 for Electronics Applications Technical Data Product Description March, 2004 3MTM Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic). Bonding Film AF111 must be stored at or below 40F (4C) before use. Key Features * Moderate tack * Thick 10 mil caliper * 250F (121C) cure * High metal OLS and peel adhesion * High flow Physical Properties Before Cure Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Bonding Film AF111 Base Resin Epoxy Thickness 10 mil (0.25 mm) Tack Moderate Color Off-White Construction 1.9 mil red polyethylene liner 10 mil tacky adhesive 6 mil brown paper liner Physical Properties After Cure Bonding Film AF111 Tensile (psi) 7200 Elongation (%) 10 Modulus (psi) 150,000 3 Bonding Film AF111 for Electronics Applications Suggested Use Procedure Room Temperature Work Life - 3MTM Bonding Film AF111 has a room temperature work life of 4 weeks. Work life is defined as the time at room temperature that the product will still yield the performance data summarized in this data sheet if bonds are made and tested per instructions. Shelf Life - (usable life) of Bonding Film AF111 is: 4 weeks @ 70F (21C) 6 months @ 40F (4C) 12 months @ 0F (-18C) Cure Conditions - The suggested curing condition for Bonding Film AF111 is 60 minutes at 250F (121C). The adhesive may be cured either under pressure or in a vacuum bag. Alternate suggested cure cycles are shown below. Bondline Temperature Time (in minutes) 235F (113C) 90 250F (121C) 60 275F (135C) 40 300F (149C) 35 325F (163C) 20 350F (177C) 10 400F (204C) 5 During cure, pressure is required to keep parts in alignment and in intimate contact. A minimum of 20 psi is suggested, but higher psi is acceptable if resultant flow during cure is not excessive. Bondline Thickness - Unless otherwise specified, the bondline thickness used to generate the data in this data sheet was 10 mils. Since Bonding Film AF111 will flow when heated to its curing temperature (... and the higher the cure temperature, the more the flow...), it may be necessary to insert mechanical spacers (i.e., beads, wires, stops, etc.) in the bondline to maintain this thickness. Cold Storage Removal - Important: During storage, Bonding Film AF111 should be wrapped/sealed in a polyethylene (or similar) wrap/bag. When removing the wrapped roll or sheets from cold storage, especially if stored below 32F (0C), ample time should be given before handling or overwrap removal to allow for the roll/sheets to acclimate to room temperature for two reasons: 1) to prevent moisture from condensing on the adhesive surface; and 2) to prevent cracking of the adhesive as it is brittle when cold. Surface Preparation Prior to Bonding - A thoroughly cleaned, dry, grease-free surface is essential for maximum performance. Cleaning methods which will produce a break-free water film on metal surfaces are generally satisfactory. -2- 3 Bonding Film AF111 for Electronics Applications Suggested Use Procedure (continued) Application of Film to Substrate: A. Cut a portion of film sufficient for the assembly from the stock roll with protective liner in place. Note earlier comment to bring adhesive to room temperature before use. B. Remove one liner and place the exposed adhesive against the substrate using the remaining liner as a protective cover. C. Position film and rub out all air between the adhesive and the substrate. Use of a rubber roller will facilitate this process. D. Remove second protective liner. E. Complete assembly and cure, being careful to avoid trapping air. Typical Overlap Shear (OLS) Adhesions to Various Substrates Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Substrate 3MTM Bonding Film AF111 OLS Al (etched) 5300 psi Al (sanded, solvent wiped) 3500 psi Al (scour pad abraded, solvent wiped) 3250 psi Al (solvent wiped) 3100 psi CRS (scour pad abraded, solvent wiped) 2450 psi Stainless Steel (solvent wiped) 450 psi FR-4 (solvent wiped) 1150 psi LCP (solvent wiped) 300 psi Polyimide Film 1750 psi Polyester Film 1075 psi Black E-coat 1150 psi Phenolic Board 1100 psi Ultem 1000 650 psi PEN Plastic 450 psi (R) * OLS values given in psi (pounds per square inch). ASTM D1002. * Al (aluminum), CRS (cold rolled steel), FR-4 (printed circuit board substrate), LCP (liquid crystal polymer), and PEN (polyethylene naphthalate). * Solvent wiped (MEK, alcohol)*; 3MTM Scotch-BriteTM Scour Pad (green) abraded; sanded (600 grit sandpaper). * OLS bonds were 1" x 0.5" and tested at 0.2"/minute. * Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250F (121C). * The polyimide and polyester films were overbonded to CRS using 3MTM Scotch-WeldTM Epoxy Adhesive DP-190. *Note: When using solvents, extinguish all ignition sources and follow the manufacturer's precautions and directions for use. -3- 3 Bonding Film AF111 for Electronics Applications Typical Peel Adhesion to Various Substrates Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Substrate 3MTM Bonding Film AF111 Peel Al (etched) 38 piw Al (sanded, solvent wiped) 36 piw Al (scour pad abraded, solvent wiped) 36 piw Al (solvent wiped) 36 piw CRS (scour pad abraded, solvent wiped) 35 piw Stainless Steel (solvent wiped) 3 piw FR-4 (solvent wiped) 33 piw LCP (solvent wiped) 3.5 piw Polyimide Film 20 piw Polyester Film 3 piw Black E-coat 34 piw Phenolic Board 19 piw Ultem(R) 1000 26 piw PEN Plastic 14 piw Borosilicate Glass 1 piw * 90 peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate. * Peel rate 2"/minute. * Peel values given in piw (pounds per inch width). ASTM D1876. * Al (aluminum), CRS (cold rolled steel), FR-4 (printed circuit board substrate), LCP (liquid crystal polymer), and PEN (polyethylene naphthalate). * Solvent wiped (MEK, alcohol)*; 3MTM Scotch-BriteTM Scour Pad (green) abraded; sanded (600 grit sandpaper). * Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250F (121C). * The polyimide and polyester films were overbonded to CRS using 3MTM Scotch-WeldTM Epoxy Adhesive DP-190. *Note: When using solvents, extinguish all ignition sources and follow the manufacturer's precautions and directions for use. -4- 3 Bonding Film AF111 for Electronics Applications Adhesion Retention Values After Environmental Aging Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Aging Parameters 3MTM Bonding Film AF111 Peel* 30 days at room temperature (control) 33 piw 30 days at 160F (71C) oven 33 piw 30 days at 120F (49C)/100% RH 32 piw 30 days immersion in distilled water 35 piw Hot/cold cycling 33 piw * Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 250F (121C) and peeled at 2"/minute speed. * Hot/cold cycle was 17 hours at 120F (49C) and 5 hours at -5F (-21C) with one hour at room temperature between temperature changes. Aging Parameters Bonding Film AF111 OLS* 30 days at room temperature (control) 2300 psi 30 days at 160F (71C) oven 2600 psi 30 days at 120F (49C)/100% RH 1200 psii 30 days immersion in distilled water 1600 psi Hot/cold cycling 2400 psi * OLS (overlap shear) bonds consisted of 3MTM Scotch-BriteTM Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 250F (121C) and tested at 0.2"/minute speed. * Hot/cold cycle was 17 hours at 120F (49C) and 5 hours at -5F (-21C) with one hour at room temperature between temperature changes. Solvent Resistance of Cured Films After 60 Days Immersion at RT Aging Parameters Bonding Film AF111 Isopropyl Alcohol No Attack Methyl Ethyl Ketone No Attack Heptane No Attack 3MTM Citrus Base Cleaner No Attack * Samples were cured according to data sheet instructions [60 minutes at 250F (121C)] and immersed in test solvents. * After 60 days, samples were removed, dried, and examined for swelling and surface attack. -5- 3 Bonding Film AF111 for Electronics Applications Overlap Shear and Peel Adhesion Tested at Various Temperatures Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Test Temperature 3MTM Bonding Film AF111 OLS -67F (-55C) 2700 psi 75F (24C) 2300 psi 180F (82C) 2700 psi 250F (121C) 2250 psi Test Temperature Bonding Film AF111 Peel -67F (-55C) 25 piw 75F (24C) 33 piw 180F (82C) 33 piw 250F (121C) 20 piw * OLS bonds were 0.5" x 1" (CRS, 3MTM Scotch-BriteTM Scour Pad [green] abraded, solvent wiped). * Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board. * Both OLS and peel bonds were made and tested in similar fashion described in previous sections. -6- 3 Bonding Film AF111 for Electronics Applications Electrical Properties Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Test Thermal Properties Method 3MTM Bonding Film AF111 Dielectric Constant ASTM D-150 4.2 @ 1 kilohertz 4.0 @ 10 kilohertz 3.9 @ 100 kilohertz Dissipation Factor ASTM D-150 .005 @ 1 kilohertz .007 @ 10 kilohertz .011 @ 100 kilohertz Dielectric Breakdown Strength ASTM D-149 650 volts/mil (10 mil) Volume Resistivity ASTM D-257 4.1 x 1016 ohm-cm (10 mil) Test Bonding Film AF111 Weight Loss by TGA (Thermal gravametric analysis) @ 10C/min. 1% wt loss @ 196C 5% wt loss @ 329C 10% wt loss @ 364C Coefficient of Thermal Expansion by TMA (units / unit / C @ 10C/min.) Tg (glass transition temperature) by TMA @ 10C/min. Tg by DSC @ 5C/min. 28 x 10-6 (-60 to 40C)* 67 x 10-6 (-60 to 110C)** onset @ 107C* midpoint @ 118C* midpoint @ 114C** * 1st heat values ** 2nd heat values -7- 3 Bonding Film AF111 for Electronics Applications Storage Requirements 40F (4C) / 6 months from date of shipment from 3M. 0F (-18C) / 12 months from date of shipment from 3M. Cleanup Uncured 3MTM Bonding Film AF111 can be removed using acetone, MEK or 3MTM Citrus Base Cleaner.* *Note: When using solvents, extinguish all ignition sources and follow the manufacturer's precautions and directions for use. Precautionary Information Refer to Product Label and Material Safety Data Sheet for Health and Safety Information before using this product. For additional health and safety information, call 1-800-364-3577 or (651) 737-6501. For Additional Information To request additional product information or to arrange for sales assistance, call toll free 1-800-251-8634. Address correspondence to: 3M Electronics Markets Materials Division, Building 21-1W-10, 900 Bush Avenue, St. Paul, MN 55144-1000. Our fax number is 651-733-9175. In Canada, phone: 1-800-364-3577. In Puerto Rico, phone: 1-787-750-3000. In Mexico, phone: 52-70-04-00. Product Use All statements, technical information and recommendations contained in this document are based upon tests or experience that 3M believes are reliable. However, many factors beyond 3M's control can affect the use and performance of a 3M product in a particular application, including the conditions under which the product is used and the time and environmental conditions in which the product is expected to perform. Since these factors are uniquely within the user's knowledge and control, it is essential that the user evaluate the 3M product to determine whether it is fit for a particular purpose and suitable for the user's method of application. Warranty and Limited Remedy The 3M product will be free from defects in material and manufacture for a period of one (1) year from the date of manufacture. 3M MAKES NO OTHER WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR ANY IMPLIED WARRANTY ARISING OUT OF A COURSE OF DEALING, CUSTOM, OR USAGE OF TRADE. User is responsible for determining whether the 3M product is fit for a particular purpose and suitable for user's method of application. If the 3M product is defective within the warranty period stated above, YOUR EXCLUSIVE REMEDY AND 3M'S SOLE OBLIGATION SHALL BE, AT 3M'S OPTION, TO REPLACE OR REPAIR THE 3M PRODUCT OR REFUND THE PURCHASE PRICE OF THE 3M PRODUCT. Limitation of Liability Except where prohibited by law, 3M and seller will not be liable for any loss or damage arising from the 3M product, whether direct, indirect, special, incidental or consequential, regardless of the legal theory asserted, including warranty, contract, negligence or strict liability. ISO 9001 This Electronics Markets Materials Division product was manufactured under a 3M quality system registered to ISO 9001 standards. 3 Industrial Business Electronics Markets Materials Division 3M Center, Building 21-1W-10, 900 Bush Avenue St. Paul, MN 55144-1000 www.3M.com/electronicmaterials Recycled Paper 40% pre-consumer 10% post-consumer -8- Ultem is a registered trademark of General Electric. Printed in U.S.A. (c)3M 2004 78-6900-9996-1 (3/04)