3M™ Bonding Film AF111 is an epoxy, thermoset film adhesive developed for
structural bonding of metals and high-strength plastic materials (epoxy and phenolic).
Bonding Film AF111 must be stored at or belo w 40°F (4°C) before use.
Product Description
3
Bonding Film
AF111 for Electronics Applications
Technical Data March, 2004
Physical Pr operties
Bef or e Cure
Bonding Film AF111
Base Resin Epoxy
Thickness 10 mil (0.25 mm)
Tack Moderate
Color Off-White
Construction
K ey Featur es • Moderate tack • High metal OLS and peel adhesion
• Thick 10 mil caliper • High flo w
• 250°F (121°C) cure
Note: The follo wing technical information and data should be considered repr esentati v e
or typical only and should not be used for specification purposes.
Physical Pr operties
After Cure Bonding Film AF111
Tensile (psi) 7200
Elongation (%) 10
Modulus (psi) 150,000
1.9 mil red polyethylene liner
10 mil tacky adhesive
6 mil brown paper liner
Suggested Use
Procedure Room Temperature Work Life – 3M™ Bonding Film AF111 has a room
temperature work life of 4 weeks. Work life is defined as the time at room
temperature that the product will still yield the performance data summarized in
this data sheet if bonds are made and tested per instructions.
Shelf Life – (usable life) of Bonding Film AF111 is:
4 weeks @ 70°F (21°C)
6 months @ 40°F (4°C)
12 months @ 0°F (-18°C)
Cure Conditions – The suggested curing condition for Bonding Film AF111 is 60
minutes at 250°F (121°C). The adhesive may be cured either under pressure or in a
vacuum bag. Alternate suggested cure cycles are shown below.
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During cure, pressure is required to keep parts in alignment and in intimate contact.
A minimum of 20 psi is suggested, but higher psi is acceptable if resultant flow
during cure is not excessive.
Bondline Thickness – Unless otherwise specified, the bondline thickness used to
generate the data in this data sheet was 10 mils. Since Bonding Film AF111 will
flow when heated to its curing temperature (… and the higher the cure temperature,
the more the flow…), it may be necessary to insert mechanical spacers (i.e., beads,
wires, stops, etc.) in the bondline to maintain this thickness.
Cold Storage Removal – Important: During storage, Bonding Film AF111 should
be wrapped/sealed in a polyethylene (or similar) wrap/bag. When removing the
wrapped roll or sheets from cold storage, especially if stored belo w 32°F (0°C),
ample time should be gi ven before handling or overwrap removal to allo w for the
roll/sheets to acclimate to room temperature for two reasons:
1) to prevent moisture from condensing on the adhesi ve surface; and
2) to pre vent cracking of the adhesi ve as it is brittle when cold.
Surface Preparation Prior to Bonding – A thoroughly cleaned, dry, grease-free
surface is essential for maximum performance. Cleaning methods which will
produce a break-free water film on metal surfaces are generally satisfactory.
Bondline Time
Temperature (in minutes)
235°F (113°C) 90
250°F (121°C) 60
275°F (135°C) 40
300°F (149°C) 35
325°F (163°C) 20
350°F (177°C) 10
400°F (204°C) 5
3
Bonding Film
AF111 for Electronics Applications
Substrate 3M™ Bonding Film AF111 OLS
Al (etched) 5300 psi
Al (sanded, solvent wiped) 3500 psi
Al (scour pad abraded, solvent wiped) 3250 psi
Al (solvent wiped) 3100 psi
CRS (scour pad abraded, solvent wiped) 2450 psi
Stainless Steel (solvent wiped) 450 psi
FR-4 (solvent wiped) 1150 psi
LCP (solvent wiped) 300 psi
Polyimide Film 1750 psi
Polyester Film 1075 psi
Black E-coat 1150 psi
Phenolic Board 1100 psi
Ultem®1000 650 psi
PEN Plastic 450 psi
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Suggested Use
Procedure
(continued)
A pplication of Film to Substrate:
A. Cut a portion of film sufficient for the assembly from the stock roll with
protecti ve liner in place. Note earlier comment to bring adhesi ve to room
temperature before use.
B. Remove one liner and place the exposed adhesive against the substrate using the
remaining liner as a protecti ve cover.
C. Position film and rub out all air between the adhesive and the substrate. Use of a
rubber roller will facilitate this process.
D. Remove second protective liner.
E. Complete assembly and cure, being careful to avoid trapping air.
Typical Overlap Shear
(OLS) Adhesions to
Various Substrates
Note: The follo wing technical information and data should be considered repr esentati v e
or typical only and should not be used for specification purposes.
• OLS values given in psi (pounds per square inch). ASTM D1002.
• Al (aluminum), CRS (cold rolled steel), FR-4 (printed circuit board substrate), LCP (liquid
crystal polymer), and PEN (polyethylene naphthalate).
• Solvent wiped (MEK, alcohol)*; 3M™ Scotch-Brite™ Scour Pad (green) abr aded; sanded
(600 grit sandpaper).
• OLS bonds were 1" x 0.5" and tested at 0.2"/minute .
• Bonds were cured 60 minutes (+ 7 minutes r amp time) at 250°F (121°C).
• The polyimide and polyester films w ere o verbonded to CRS using 3M™ Scotch-Weld™
Epo xy Adhesive DP-190.
*Note: When using solvents, extinguish all ignition sources and follow the
manufacturer’s precautions and directions for use.
3
Bonding Film
AF111 for Electronics Applications
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Typical P eel Adhesion
to Various Substrates Note: The follo wing technical information and data should be considered repr esentati v e
or typical only and should not be used for specification purposes.
Substrate 3M™ Bonding Film AF111 Peel
Al (etched) 38 piw
Al (sanded, solvent wiped) 36 piw
Al (scour pad abraded, solvent wiped) 36 piw
Al (solvent wiped) 36 piw
CRS (scour pad abraded, solvent wiped) 35 piw
Stainless Steel (solvent wiped) 3 piw
FR-4 (solvent wiped) 33 piw
LCP (solvent wiped) 3.5 piw
Polyimide Film 20 piw
Polyester Film 3 piw
Black E-coat 34 piw
Phenolic Board 19 piw
Ultem®1000 26 piw
PEN Plastic 14 piw
Borosilicate Glass 1 piw
• 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate .
• Peel rate 2”/minute.
• Peel values given in piw (pounds per inch width). ASTM D1876.
• Al (aluminum), CRS (cold rolled steel), FR-4 (printed circuit board substrate), LCP (liquid
crystal polymer), and PEN (polyethylene naphthalate).
• Solvent wiped (MEK, alcohol)*; 3M™ Scotch-Brite™ Scour Pad (green) abr aded; sanded
(600 grit sandpaper).
• Bonds were cured 60 minutes (+ 7 minutes r amp time) at 250°F (121°C).
• The polyimide and polyester films w ere o verbonded to CRS using 3M™ Scotch-Weld™
Epo xy Adhesive DP-190.
*Note: When using solvents, extinguish all ignition sources and follow the
manufacturer’s precautions and directions for use.
3
Bonding Film
AF111 for Electronics Applications
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Adhesion Retention
Values After
Envir onmental Aging Aging P arameters 3M™ Bonding Film AF111 Peel*
30 da ys at room temperature (control) 33 piw
30 da ys at 160°F (71°C) oven 33 piw
30 da ys at 120°F (49°C)/100% RH 32 piw
30 da ys immersion in distilled water 35 piw
Hot/cold cycling 33 piw
* P eel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels w ere
cured 60 minutes + 7 minutes (r amp time) at 250°F (121°C) and peeled at 2"/min ute speed.
• Hot/cold cycle was 17 hours at 120°F (49°C) and 5 hours at -5°F (-21°C) with one hour at
room temperature between temper ature changes.
Aging P arameters Bonding Film AF111
Isoprop yl Alcohol No Attack
Meth yl Ethyl Ketone No Attack
Heptane No Attack
3M™ Citrus Base Cleaner No Attack
• Samples were cured according to data sheet instructions [60 minutes at 250°F (121°C)]
and immersed in test solvents.
• After 60 days, samples were removed, dried, and examined for s welling and surface attack.
Note: The follo wing technical information and data should be considered repr esentati v e
or typical only and should not be used for specification purposes.
Aging P arameters Bonding Film AF111 OLS*
30 da ys at room temperature (control) 2300 psi
30 da ys at 160°F (71°C) oven 2600 psi
30 da ys at 120°F (49°C)/100% RH 1200 psii
30 da ys immersion in distilled water 1600 psi
Hot/cold cycling 2400 psi
* OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded
CRS to CRS, cured 60 min utes + 7 minutes (ramp time) at 250°F (121°C) and tested at
0.2"/minute speed.
• Hot/cold cycle was 17 hours at 120°F (49°C) and 5 hours at -5°F (-21°C) with one hour at
room temperature between temper ature changes.
Solvent Resistance of
Cured Films After 60
Days Immersion at RT
3
Bonding Film
AF111 for Electronics Applications
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Overlap Shear and P eel
Adhesion Tested at
Various Temperatur es Test Temperature 3M™ Bonding Film AF111 OLS
-67°F (-55°C) 2700 psi
75°F (24°C) 2300 psi
180°F (82°C) 2700 psi
250°F (121°C) 2250 psi
Test Temperature Bonding Film AF111 P eel
-67°F (-55°C) 25 piw
75°F (24°C) 33 piw
180°F (82°C) 33 piw
250°F (121°C) 20 piw
• OLS bonds were 0.5" x 1" (CRS , 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent
wiped).
• Peel bonds were 0.5" wide , 10 mil etched aluminum strips bonded to 0.047" FR-4 board.
• Both OLS and peel bonds were made and tested in similar fashion described in previous
sections.
Note: The follo wing technical information and data should be considered repr esentati v e
or typical only and should not be used for specification purposes.
3
Bonding Film
AF111 for Electronics Applications
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Electrical Properties Note: The follo wing technical information and data should be considered repr esentati v e
or typical only and should not be used for specification purposes.
*1
st heat values
** 2nd heat values
Test Method 3M™ Bonding Film AF111
Dielectric Constant ASTM D-150 4.2 @ 1 kilohertz
4.0 @ 10 kilohertz
3.9 @ 100 kilohertz
Dissipation Factor ASTM D-150 .005 @ 1 kilohertz
.007 @ 10 kilohertz
.011 @ 100 kilohertz
Dielectric Breakdown Strength ASTM D-149 650 volts/mil (10 mil)
Volume Resistivity ASTM D-257 4.1 x 1016 ohm-cm (10 mil)
Test Bonding Film AF111
Weight Loss 1% wt loss @ 196°C
by TGA (Thermal gravametric analysis) @ 10°C/min. 5% wt loss @ 329°C
10% wt loss @ 364°C
Coefficient of Thermal Expansion 28 x 10-6 (-60 to 40°C)*
by TMA (units/unit/°C @ 10°C/min.) 67 x 10-6 (-60 to 110°C)**
Tg (glass transition temperature) by TMA @ 10°C/min. onset @ 107°C*
Tg by DSC @ 5°C/min. midpoint @ 118°C*
midpoint @ 114°C**
Thermal Properties
3
Bonding Film
AF111 for Electronics Applications
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Ultem is a registered trademark of
General Electric.
Printed in U.S .A.
©3M 2004 78-6900-9996-1 (3/04)
Recycled Paper
40% pr e-consumer
10% post-consumer
Uncured 3M™ Bonding Film AF111 can be remov ed using acetone, MEK or 3M™
Citrus Base Cleaner.*
*Note: When using solvents, extinguish all ignition sources and follo w the
manufacturer’s precautions and directions for use.
Cleanup
40°F (4°C) / 6 months from date of shipment from 3M.
0°F (-18°C) / 12 months from date of shipment from 3M.
Storage Requirements
3
Bonding Film
AF111 for Electronics Applications
3
Industrial Business
Electronics Markets Materials Di vision
3M Center, Building 21-1W-10, 900 Bush Avenue
St. Paul, MN 55144-1000
www.3M.com/electronicmaterials
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tests or experience that 3M believes are reliable. However, many factors beyond 3M’s control can affect
the use and performance of a 3M product in a particular application, including the conditions under
which the product is used and the time and environmental conditions in which the product is expected to
perform. Since these factors are uniquely within the user’s knowledge and control, it is essential that the
user evaluate the 3M product to determine whether it is fit for a particular purpose and suitable for the
user’s method of application.
Product Use
The 3M product will be free from defects in material and manufacture for a period of one (1) year from the
date of manufacture. 3M MAKES NO OTHER WARRANTIES, EXPRESS OR IMPLIED, INCLUDING,
BUT NOT LIMITED TO , ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A
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warranty period stated above, YOUR EXCLUSIVE REMEDY AND 3M’S SOLE OBLIGATION SHALL BE,
AT 3M’S OPTION, TO REPLACE OR REPAIR THE 3M PRODUCT OR REFUND THE PURCHASE
PRICE OF THE 3M PRODUCT.
Warranty and
Limited Remedy
To request additional product information or to arrange for sales assistance, call toll free 1-800-251-8634.
Address correspondence to: 3M Electronics Markets Materials Division, Building 21-1W-10, 900 Bush
Avenue, St. P aul, MN 55144-1000. Our fax number is 651-733-9175. In Canada, phone: 1-800-364-3577.
In Puerto Rico , phone: 1-787-750-3000. In Mexico, phone: 52-70-04-00.
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This Electronics Markets Materials Division product was manufactured under a 3M quality system registered to ISO 9001 standards.
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Precautionary
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