July 2010 Doc ID 5617 Rev 8 1/10
10
SMCJ
Transil™
Features
Peak pulse power:
1500 W (10/1000 μs)
10 kW (8/20 μs)
Stand off voltage range: from 5 V to 188 V
Unidirectional and bidirectional types
Low leakage current:
–0.2 μA at 25 °C
–1 μA at 85 °C
Operating Tjmax
: 150 °C
High power capability at Tjmax
:
1250 W (10/1000 µs)
JEDEC registered package outline
Complies with the following standards
IEC 61000-4-2 level 4
15 kV (air discharge)
8 kV (contact discharge)
IEC 61000-4-5
MIL STD 883G, method 3015-7 Class 3B
25 kV HBM (human body model)
Resin meets UL 94, V0
MIL-STD-750, method 2026 solderability
EIA STD RS-481 and IEC 60286-3 packing
IPC 7531 footprint
Description
The SMCJ Transil series has been designed to
protect sensitive equipment against electrostatic
discharges according to IEC 61000-4-2, and
MIL STD 883, method 3015, and electrical over
stress according to IEC 61000-4-4 and 5. These
devices are more generally used against surges
below 1500 W (10/1000 μs).
The Planar technology makes it compatible with
high-end equipment and SMPS where low
leakage current and high junction temperature are
required to provide reliability and stability over
time.
SMCJ are packaged in SMC (SMC footprint in
accordance with IPC 7531 standard).
TM: Transil is a trademark of STMicroelectroniocs
K
A
Unidirectional Bidirectional
SMC
(JEDEC DO-214AB)
www.st.com
Characteristics SMCJ
2/10 Doc ID 5617 Rev 8
1 Characteristics
Figure 1. Electrical characteristics - definitions
Figure 2. Pulse definition for electrical characteristics
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
PPP Peak pulse power dissipation (1) Tj initial = Tamb 1500 W
Tstg Storage temperature range -65 to +150 ° C
TjOperating junction temperature range -55 to +150 ° C
TLMaximum lead temperature for soldering during 10 s. 260 ° C
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Table 2. Thermal resistances
Symbol Parameter Value Unit
Rth(j-l) Junction to leads 15 ° C/W
Rth(j-a) Junction to ambient on printed circuit on recommended pad layout 90 ° C/W
V
CL
V
BR
V
RM
I
RM
I
R
I
PP
V
I
I
RM
I
R
I
PP
V
RM
V
BR
V
CL
V
CL
V
BR
V
RM
I
RM
I
R
I
PP
V
I
I
RM
I
R
I
PP
V
RM
V
BR
V
CL
V
CL
V
BR
V
RM
I
RM
I
R
I
PP
V
I
I
F
V
F
V
CL
V
BR
V
RM
I
RM
I
R
I
PP
V
I
I
F
V
F
Unidirectional
Bidirectional
Symbol Parameter
V Stand-off voltage
V Breakdown voltage
V Clamping voltage
I Leakage current @ V
I Peak pulse current
T Voltage temperature coefficient
V Forward voltage drop
R Dynamic resistance
RM
BR
CL
RM RM
PP
F
D
α
Repetitive pulse current
tr= rise time (µs)
tp= pulse duration time (µs)
trtp
SMCJ Characteristics
Doc ID 5617 Rev 8 3/10
Table 3. Electrical characteristics - parameter values (Tamb = 25 °C)
Order code
IRM max@VRM VBR @IR(1)
1. Pulse test : tp < 50 ms
VCL @IPP
10/1000 µs
RD (2)
10/1000 µs
2. To calculate maximum clamping voltage at other surge level,use the following formula: VCLmax = VCL - RD x (IPP - IPPappli)
where IPPappli is the surge current in the application
VCL @IPP
8/20 µs
RD (2)
8/20 µs αT (3)
3. To calculate VBR or VCL versus junction temperature, use the following formulas:
VBR @ TJ = VBR @ 25°C x (1 + αT x (TJ – 25))
VCL @ TJ = VCL @ 25°C x (1 + αT x (TJ – 25))
25 °C 85 °C min typ max max max
µA V V mA V A(4)
4. Surge capability given for both directions for unidirectional and bidirectional types.
ΩVA
(4) mΩ10-4/ °C
SMCJ5.0A/CA 500 2000 5.0 6.4 6.74 10 9.2 171 0.012 13.4 746 8.5 5.7
SMCJ6.0A/CA 500 2000 6.0 6.7 7.05 10 10.3 152 0.019 13.7 730 8.6 5.9
SMCJ6.5A/CA 250 1000 6.5 7.2 7.58 10 11.2 140 0.023 14.5 690 9.5 6.1
SMCJ8.5A/CA 10 50 8.5 9.4 9.9 1 14.4 105 0.038 19.5 512 18 7.3
SMCJ10A/CA 0.2 1 10 11.1 11.7 1 17 92 0.051 21.7 461 20 7.8
SMCJ12A/CA 0.2 1 12 13.3 14 1 19.9 79 0.066 25.3 394 27 8.3
SMCJ13A/CA 0.2 1 13 14.4 15.2 1 21.5 73 0.076 27.2 368 31 8.4
SMCJ15A/CA 0.2 1 15 16.7 17.6 1 24.4 64 0.092 32.5 308 46 8.8
SMCJ18A/CA 0.2 1 18 20.0 21.1 1 29.2 53 0.133 39.3 254 68 9.2
SMCJ20A/CA 0.2 1 20 22.2 23.4 1 32.4 48 0.163 42.8 234 78 9.4
SMCJ22A/CA 0.2 1 22 24.4 25.7 1 35.5 44 0.194 48.3 207 103 9.6
SMCJ24A/CA 0.2 1 24 26.7 28.1 1 38.9 40 0.235 50 200 102 9.6
SMCJ26A/CA 0.2 1 26 28.9 30.4 1 42.1 37 0.275 53.5 187 115 9.7
SMCJ28A/CA 0.2 1 28 31.1 32.7 1 45.4 34 0.325 59 169 146 9.8
SMCJ30A/CA 0.2 1 30 33.3 35.1 1 48.4 32 0.361 64.3 156 176 9.9
SMCJ33A/CA 0.2 1 33 36.7 38.6 1 53.3 29 0.440 69.7 143 204 10.0
SMCJ40A/CA 0.2 1 40 44.4 46.7 1 64.5 24 0.644 84 119 294 10.1
SMCJ48A/CA 0.2 1 48 53.3 56.1 1 77.4 20 0.925 100 100 411 10.3
SMCJ58A/CA 0.2 1 58 64.4 67.8 1 93.6 16 1.40 121 83 600 10.4
SMCJ70A/CA 0.2 1 70 77.8 81.9 1 113 13.9 1.94 146 69 870 10.5
SMCJ85A/CA 0.2 1 85 94 99 1 137 11.5 2.87 178 56 1322 10.6
SMCJ100A/CA 0.2 1 100 111 117 1 162 9.7 4.04 212 47 1897 10.7
SMCJ130A/CA 0.2 1 130 144 152 1 209 7.5 6.59 265 38 2774 10.8
SMCJ154A/CA 0.2 1 154 171 180 1 246 6.1 9.34 317 31.5 4063 10.8
SMCJ170A/CA 0.2 1 170 189 199 1 275 5.7 11.6 353 28 5145 10.8
SMCJ188A/CA 0.2 1 188 209 220 1 328 4.6 21.1 388 26 6038 10.8
Characteristics SMCJ
4/10 Doc ID 5617 Rev 8
Figure 5. Clamping voltage versus peak pulse current (exponential waveform, maximum values)
Figure 3. Peak pulse power dissipation
versus initial junction temperature
Figure 4. Peak pulse power versus
exponential pulse duration
(Tj initial = 25 °C)
0
500
1000
1500
2000
0 25 50 75 100 125 150 175
Ppp (W)
Tj(°C)
0.1
1.0
10.0
100.0
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01
P
PP
(kW)
Tjinitial = 25 °C
tP(ms)
IPP(A)
0.1
1.0
10.0
100.0
1000.0
1 10 100 1000
10/1000 µs
Tjinitial=25 °C
8/20 µs
10 ms
SMCJ5.0A
SMCJ12A
SMCJ24A
SMCJ40A
SMCJ85A
SMCJ188A
VCL(V)
SMCJ Characteristics
Doc ID 5617 Rev 8 5/10
Figure 6. Junction capacitance versus
reverse applied voltage for
unidirectional types (typical values)
Figure 7. Junction capacitance versus
reverse applied voltage for
bidirectional types (typical values)
0.01
0.10
1.00
10.00
1 10 100 1000
C(nF)
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
SMCJ5.0A
SMCJ12A
SMCJ24A
SMCJ40A
SMCJ85A
SMCJ188A
VR(V)
0.01
0.10
1.00
10.00
1 10 100 1000
C(nF)
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
SMCJ5.0CA
SMCJ12CA
SMCJ24CA
SMCJ40CA
SMCJ85CA
SMCJ188CA
V
R
(V)
Figure 8. Peak forward voltage drop
versus peak forward current
(typical values)
Figure 9. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each lead
Figure 11. Leakage current versus junction
temperature (typical values)
I
FM
(A)
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.5 1.0 1.5 2.0 2.5 3.0
Tj=25 °C
Tj=125 °C
VFM(V)
0.01
0.10
1.00
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
Z
th(j-a)
/R
th(j-a)
tP(s)
Recommended pad layout
PCB FR4, copper thickness = 35 µm
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
SCU(cm²)
PCB FR4, copper thickness = 35 µm
I
R
(nA)
1.0E+00
1.0E+01
1.0E+02
1.0E+03
1.0E+04
25 50 75 100 125 150
VR=VRM
VRM 10 V
VR=VRM
VRM <10V
Tj(°C)
Ordering information scheme SMCJ
6/10 Doc ID 5617 Rev 8
2 Ordering information scheme
Figure 12. Ordering information scheme
SM C J 85 CA - TR
Surface mount
Peak pulse power
C = 1500 W Transil in SMC
Stand off voltage
85 = 85 V
Type
A = Unidirectinal
CA = Bidirectional
Delivery mode
TR = Tape and reel
SMCJ Package information
Doc ID 5617 Rev 8 7/10
3 Package information
Case: JEDEC DO-214AB molded plastic over planar junction
Terminals: solder plated, solderable per MIL-STD-750, Method 2026
Polarity: for unidirectional types the band indicates cathode
Flammability: epoxy is rated UL94V-0
RoHS package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 4. SMC dimensions
Ref.
dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 2.90 3.2 0.114 0.126
c 0.15 0.41 0.006 0.016
E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
D 5.55 6.25 0.218 0.246
L 0.75 1.60 0.030 0.063
Figure 13. Footprint dimensions mm
(inches)
Figure 14. Marking layout(1)
1. Marking layout can vary according to assembly location.
E
CLE2
E1
D
A1
A2
b
8.19
1.545.111.54
(0.061) (0.201)
(0.322)
(0.124)
(0.061)
3.14
y w w
e
z
x x x
e: ECOPACK compliance
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
Cathode bar ( unidirectional devices only )
Package information SMCJ
8/10 Doc ID 5617 Rev 8
Table 5. Marking
Order code Marking Order code Marking
SMCJ5.0A-TR FUA SMCJ5.0CA-TR FBA
SMCJ6.0A-TR FUB SMCJ6.0CA-TR FBB
SMCJ6.5A-TR FUC SMCJ6.5CA-TR FBC
SMCJ8.5A-TR FUD SMCJ8.5CA-TR FBD
SMCJ10A-TR FUF SMCJ10CA-TR FBF
SMCJ12A-TR FUH SMCJ12CA-TR FBH
SMCJ13A-TR FUI SMCJ13CA-TR FBI
SMCJ15A-TR FUJ SMCJ15CA-TR FBJ
SMCJ18A-TR FUL SMCJ18CA-TR FBL
SMCJ20A-TR FUM SMCJ20CA-TR FBM
SMCJ22A-TR FUN SMCJ22CA-TR FBN
SMCJ24A-TR FUO SMCJ24CA-TR FBO
SMCJ26A-TR FUP SMCJ26CA-TR FBP
SMCJ28A-TR FUQ SMCJ28CA-TR FBQ
SMCJ30A-TR FUR SMCJ30CA-TR FBR
SMCJ33A-TR FUS SMCJ33CA-TR FBS
SMCJ40A-TR FUU SMCJ40CA-TR FBU
SMCJ48A-TR FUW SMCJ48CA-TR FBW
SMCJ58A-TR FUZ SMCJ58CA-TR FBZ
SMCJ70A-TR GUB SMCJ70CA-TR GBB
SMCJ85A-TR GUE SMCJ85CA-TR GBE
SMCJ100A-TR GUG SMCJ100CA-TR GBG
SMCJ130A-TR GUI SMCJ130CA-TR GBI
SMCJ154A-TR GUL SMCJ154CA-TR GBL
SMCJ170A-TR GUM SMCJ170CA-TR GBM
SMCJ188A-TR GUN SMCJ188CA-TR GBN
SMCJ Ordering information
Doc ID 5617 Rev 8 9/10
4 Ordering information
Table 6. Ordering information
5 Revision history
02-Jul
Order code Marking Package Weight Base qty Delivery mode
SMCJxxxA/CA-TR(1)
1. Where xxx is nominal value of VBR and A or CA indicates unidirectional or bidirectional version. See
Table 3 for list of available devices and their order codes
See Table 5 on page 8 SMC 0.25 g 2500 Tape and reel
Table 7. Document revision history
Date Revision Changes
August-1999 5A Previous update.
14-May-2009 6 Reformatted to current standards. Updated ECOPACK
statement.
17-Sep-2009 7 Document updated for low leakage current.
12-Jul-2010 8 Changed timescale in Figure 9.
SMCJ
10/10 Doc ID 5617 Rev 8
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2010 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com