SMT inductors SIMID series, SIMID 1210-H Series/Type: B82422H Date: August 2013 a~i~=pUEEi EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. EPCOS AG is a TDK Group Company. SMT inductors, SIMID series B82422H SIMID 1210-H Size 1210 (EIA) or 3225 (IEC) Rated inductance 1 ... 680 H Rated current 61 ... 1150 mA Construction Ferrite drum core Laser-welded winding Flame-retardant molding Features Temperature range up to +150 C Very high current handling capability Qualified to AEC-Q200 Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020D RoHS-compatible Applications Filtering of supply voltages, coupling, decoupling DC/DC converters, switch-mode power supplies Automotive electronics (e.g. single wire bus systems) Telecommunications Consumer and data processing equipment Industrial electronics Terminals Base material CuSn6 Layer composition Cu, Ag, Sn (lead-free)1) Electro-plated Marking Marking on component: Manufacturer and letter "H", L value (in PH), tolerance of L value (coded), date of manufacture (YWWD) Minimum data on reel: Manufacturer, ordering code, L value, quantity, date of packing Delivery mode and packing units 8-mm blister tape, wound on 180-mm or 330-mm reel Packing units: 180-mm reel: 2000 pcs./reel 330-mm reel: 7500 pcs./reel 1) Ni-barrier-plated terminals on request (B82422H*50). Please read Cautions and warnings and Important notes at the end of this document. 2 07/13 SMT inductors, SIMID series B82422H SIMID 1210-H Dimensional drawing and layout recommendation 1.90.1 1) A 0.60.2 1) B C D B IND0053-6 2.20.2 0.45 min.1) 3.20.2 0.15 max. A B C D 2.7 1.15 2.1 4.4 2.50.2 Marking 1) Soldering area Dimensions in mm IND0496-P-E Taping and packing Reel <_ 2.8 40.1 _0 8.4 +1.5 1.0+0.2 _0 12.75 +0.15 _2 330 +0 80.3 20.05 _2 180 +0 1.5+0.1 <_ 4.2 Component 14.4 max. 3.50.05 40.1 1.750.1 Blister tape 621.5 IND0592-V Direction of unreeling IND0557-F-E Dimensions in mm Please read Cautions and warnings and Important notes at the end of this document. 3 07/13 SMT inductors, SIMID series B82422H SIMID 1210-H Technical data and measuring conditions Rated inductance LR Measured with impedance analyzer Agilent 4294A and test fixture Agilent 16034H at frequency fL, RMS voltage 0.1 V, +20 C Q factor Qmin Measured with impedance analyzer Agilent 4294A and test fixture Agilent 16034H at frequency fL, RMS voltage 0.1 V, +20 C Rated temperature TR +105 qC Rated current IR Maximum permissible DC with inductance decrease 'L/L0 d 10% and temperature increase of d 45 K at rated temperature Self-resonance frequency fres,min Measured with impedance analyzer Agilent 4294A / E4991A at +20 C DC resistance Rmax Measured with Burster Resitomat 2329 at +20 qC Solderability (lead-free) Sn95.5Ag3.8Cu0.7: +(245 r5) C, (5 r0.3) s Wetting of soldering area t 90% (based on IEC 60068-2-58) Resistance to soldering heat +260 qC, 40 s (as referenced in JEDEC J-STD 020D) Climatic category 55/150/56 (to IEC 60068-1) Storage conditions Mounted: -55C ... +150 C Packaged: -25 C ... +40 C, d 75% RH Weight Approx. 50 mg Please read Cautions and warnings and Important notes at the end of this document. 4 07/13 SMT inductors, SIMID series B82422H SIMID 1210-H Characteristics and ordering codes Tolerance LR PH fL Qmin MHz 1.0 r5% 1.5 r10% IR Rmax fres,min MHz mA : MHz Ordering code 1)2) ( 180-mm reel) 7.96 10 2.52 1150 0.10 150 B82422H1102+000 7.96 10 2.52 900 0.14 110 B82422H1152+000 2.2 7.96 10 2.52 800 0.16 90 B82422H1222+000 3.3 7.96 10 2.52 770 0.18 70 B82422H1332+000 4.7 7.96 10 2.52 700 0.25 46 B82422H1472+000 6.8 7.96 10 2.52 570 0.35 35 B82422H1682+000 10 2.52 12 2.52 500 0.46 30 B82422H1103+000 15 2.52 12 2.52 390 0.72 26 B82422H1153+000 22 2.52 12 2.52 330 1.0 21 B82422H1223+000 33 2.52 15 2.52 280 1.4 15 B82422H1333+000 47 2.52 15 2.52 230 2.1 12 B82422H1473+000 68 2.52 15 2.52 180 3.4 10 B82422H1683+000 ^ J fQ ^ K 100 0.796 20 0.796 150 4.8 8.0 B82422H1104+000 150 0.796 20 0.796 120 7.5 6.0 B82422H1154+000 220 0.796 20 0.796 100 10.9 5.5 B82422H1224+000 330 0.796 20 0.796 90 13.0 4.5 B82422H1334+000 470 0.796 20 0.796 76 20.0 3.5 B82422H1474+000 680 0.796 20 0.796 61 31.0 3.0 B82422H1684+000 Intermediate values and closer tolerances on request. Higher currents possible at temperatures <TR on request. Sample kit available. Ordering code: B82422X002 For more information refer to chapter "Sample kits". 1) Replace the + by the code letter for the required inductance tolerance. For reel size 330 mm the last digit has to be an 8. Example: B82422H1102M008 2) For Ni-barrier-plated terminals replace the last two digits "00" by "50" (reel 180 mm) or "58" (reel 330 mm). Please read Cautions and warnings and Important notes at the end of this document. 5 07/13 SMT inductors, SIMID series B82422H SIMID 1210-H Impedance |Z| versus frequency f measured with impedance analyzer Agilent E4991A, typical values at +20 C Inductance L versus DC load current IDC measured with LCR meter Agilent 4285A, typical values at +20 C Q factor versus frequency f measured with impedance analyzer Agilent 4294A, typical values at +20 C Current derating Iop/IR versus ambient temperature TA (rated temperature TR = +105 C) IND0498-R-E 1.2 Iop IR B82422H 1.0 0.8 0.6 0.4 0.2 0 6 0 07/13 20 40 60 80 100 120 C 160 TA Cautions and warnings Please note the recommendations in our Inductors data book (latest edition) and in the data sheets. - Particular attention should be paid to the derating curves given there. - The soldering conditions should also be observed. Temperatures quoted in relation to wave soldering refer to the pin, not the housing. If the components are to be washed varnished it is necessary to check whether the washing varnish agent that is used has a negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation. Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. The following points must be observed if the components are potted in customer applications: - Many potting materials shrink as they harden. They therefore exert a pressure on the plastic housing or core. This pressure can have a deleterious effect on electrical properties, and in extreme cases can damage the core or plastic housing mechanically. - It is necessary to check whether the potting material used attacks or destroys the wire insulation, plastics or glue. - The effect of the potting material can change the high-frequency behaviour of the components. Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to breakage of the core. Even for customer-specific products, conclusive validation of the component in the circuit can only be carried out by the customer. Please read Cautions and warnings and Important notes at the end of this document. 7 07/13 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the "General Terms of Delivery for Products and Services in the Electrical Industry" published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CeraLink, CeraPlas, CSMP, CSSP, CTVS, DeltaCap, DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. 8 07/13 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: EPCOS / TDK: B82422H1332J000 B82422H1472J000 B82422H1682J000 B82422H1103J000 B82422H1153J000 B82422H1223J000 B82422H1333J000 B82422H1473J000 B82422H1683J000 B82422H1104J000 B82422H1154J000 B82422H1224J000 B82422H1334J000 B82422H1474J000 B82422H1684J000 B82422H1102K B82422H1103K B82422H1104K B82422H1152K B82422H1153K B82422H1154K B82422H1222K B82422H1223K B82422H1224K B82422H1332K B82422H1333K B82422H1334K B82422H1472K B82422H1473K B82422H1474K B82422H1682K B82422H1683K B82422H1684K B82422H1274J B82422H1272K B82422H1392K B82422H1393K B82422H1274K B82422H1562K B82422H1182K B82422H1122K B82422H1332K8 B82422H1822K B82422H1154K000 B82422H1683K000 B82422H1562K000 B82422H1182K000 B82422H1822K000 B82422H1332K008 B82422H1392K000 B82422H1272K000 B82422H1393K000 B82422H1122K000