2005-2013 Microchip Technology Inc. DS21981B-page 1
MCP2030
Device Features:
• Three input pins for analog input signals
• High input detection sensitivity (3 mVPP, typical)
• High modulation depth sensitivity (as low as 8%)
• Three output selections:
- Demodulated data
- Carrier clock
- RSSI
• Input carrier frequency: 125 kHz, typical
• Input data rate: 10 Kbps, maximum
• 8 internal Configuration registers
• Bidirect ion al trans ponder com munic ati on
(LF talk back)
• Programmab l e antenna tuning capacita nce
(up to 63 pF, 1 pF/step)
• Programmable output enable filter
• Low standby current: 4 A (with 3 channels
enabled), typical
• Low operating current: 13 A (with 3 channels
enabled), typical
• Serial Peripheral Interface (SPI™) with external
devices
• Supports Battery Back-Up mode and batteryless
operation with external circuits
• Industri al and Ext end ed Temperatur e Range :
-40°C to +85°C (industrial)
Typical Applicat ions:
• Automotive industry applications:
- Passive Keyless Entry (PKE) transponder
- Remote door locks and gate openers
- Engine immobilizer
- LF initiator sensor for tire pressure monitoring
systems
• Security Industry applic ations:
- Long range access control transponder
- Parking lot entry transponder
- Hands-free apartment door access
- Asset control and management
Description:
The MCP2030 is a stand-alone Analog Front-End
(AFE) de vice fo r Low-Freq uency ( LF) sensi ng and bidi-
rectional communication applications. The device has
eight internal Configuration registers which are
readable and programmable, except the read-only
STATUS register, by an external device.
The device has three low-frequency input channels.
Each input channel can be individually enabled or dis-
abled. The device can detect an input signal with ampli-
tude as low as ~1 mVPP and can demodulate an
amplitude-modulated input signal with as low as 8%
modula tion dept h. The devi ce can al so transmit data b y
clamping and unclamping the input LC antenna
voltage.
The device can output demodulated data, carrier clock
or RSSI current depending on the register setting. The
demodulated data and carrier clock outputs are avail-
able on the LF DAT A pin, while the RSSI output is avai l-
able on the RSSI pin. The RSSI current output is
linearly proportional to the input signal strength.
The device has programmable internal tuning capaci-
tors for each input channel. The user can program
these capacitors up to 63 pF, 1 pF per step. These
internal tuning capacitors can be used effectively for
fine-tuning of the external LC resonant circuit.
The devic e is optimized for very low current consump-
tion and has various battery-saving low-power modes
(Sleep, Standby, Active). The device can also be oper-
ated in Ba ttery Back -up and Batteryl ess modes using a
few external components.
This device is available in 14-pin PDIP, SOIC, and
TSSOP packages. This device is also used as the AFE
in the PIC16F639.
Package Types:
1
2
3
4
5
6
7
14
13
12
9
11
10
8
NCLCCOM
LCX
VSS
LFDATA/
VDD
LCZ
LCY
VSS
CS
SCLK/ALERT
RSSINC
VDD
CCLK/SDIO
MCP2030
PDIP, SOIC, TSSOP
Three-Chan nel Analog Front-End Device
MCP2030
DS21981B-page 2 2005-2013 Microchip Technology Inc.
NOTES:
2005-2013 Microchip Technology Inc. DS21981B-page 3
MCP2030
1.0 ELECTRICAL SPECIFICATIONS
Absolute Maxim um Ratings(†)
Ambient temperature under bias...................-40°C to +125°C
Storage temperature ..................... .. ..... .... .. .. -65°C to +150°C
Voltage on VDD with respect to VSS ............... -0.3V to +6.5V
Voltage on all ot her pins with
respe ct to VSS ...................................... -0.3V to (VDD + 0.3V)
Maximum current out of VSS pin ...................... ...........300 mA
Maximum current into VDD pin....................................250 mA
Maximum LC Input Voltage
(LCX, LCY, LCZ) loaded, with device................. .......10.0 VPP
Maximum LC Input Voltage
(LCX, LCY, LCZ) unloaded, without device.............700.0 VPP
Maximum Input Current (rms) into device
per LC Channel.............................................................10 mA
Human Body ESD rating... ...... ...... ............. ...... ..2000 (min.) V
Machine Model ESD rating ..................................200 (min.) V
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
DC Characteristics
Electrical Specifications: Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C
LC Signal Input Sinusoidal 300 mVPP
Carrier Frequency 125 kHz
LCCOM connected to VSS
Parameters Sym. Min. Typ† Max. Units Conditions
Supply Voltage VDD 2.0 3.0 3.6 V
VDD Start Voltage to ensure internal
Power-on Reset signal VPOR ——1.8V
Modulation Transistor-on Resistance RM—50100VDD = 3.0V
Active Current (detecting signal)
1 LC Input Channel Receiving Signal
3 LC Input Channel Receiving Signals
IACT —
—10
13 —
18 A
A
CS = VDD
Input = Continuous Wave (CW);
Amplitude = 300 mVPP.
All channels enabled.
Standby Current (wait to detect signal)
1 LC Input Channel Enabled
2 LC Input Channels Enabled
3 LC Input Channels Enabled
ISTDBY —
—
—
2
3
4
5
6
7
A
A
A
CS = VDD; ALERT = VDD
Sleep Current ISLEEP —0.2 1ACS = VDD; AL E RT = VDD
Analog Input Leakage Current
LCX, LCY, LCZ
LCCOM
IAIL —
——
—1
1A
AVDD = 3.6V, VSS VIN 1V with respect to
ground. Internal tuning capacitors are switched
off, tested in Sleep mode.
Digital Input Low Voltage VIL VSS — 0.3 VDD V SCLK, SDI, CS
Digital Input High Voltage VIH 0.8 VDD —V
DD V SCLK, SDI, CS
Digital Input Leakage Current (No te 1)
SDI
SCLK, CS
IIL —
——
—1
1A
A
VDD = 3.6V
VSS VPIN VDD
VPIN VDD
Digital Output Low Vo ltage
ALERT, LFDATA/SDIO VOL ——V
SS +0.4 V Analog Front-End section
IOL = 1.0 mA, VDD = 2.0V
Digital Output High Vo ltage
ALERT, L FDATA /SDIO VOH VDD - 0.5 — — V IOH = -400 A, VDD = 2.0V
Digital Input Pull-Up Resistor
CS, SCLK RPU 50 200 350 kVDD = 3.6V
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, +25C unless otherwise stated. These parameters are for design guidance only and are not tested.
Note 1: Negative current is defined as curre nt sourc ed by the pin.
MCP2030
DS21981B-page 4 2005-2013 Microchip Technology Inc.
AC Characteristics
Electrical Specifications: Standard Operating Conditions (unless otherwise stated)
Supply Voltage 2.0V VDD 3.6V
Operating temperature -40°C TA +85°C
LCCOM connected to VSS
LC Signal Input Sinusoidal 300 mVPP
Carrier Frequency 125 kHz
LCCOM connected to VSS
Parameters Sym. Min. Typ† Max. Units Conditions
Input Sensitivity VSENSE 13.0 6mV
PP VDD = 3.0V
Output enable filter disabled
AGCSIG = 0; MODMIN = 00
(33% modulation depth setting)
Input = Continu ous Wave (CW)
Output = Logic level transition from
low-to-high at sensitivity level for CW input.
Coil de-Q’ing Voltage -
RF Limit er (RFLM) must be active VDE_Q 3— 5 VV
DD = 3.0V, Force IIN = 5 A (worst case )
RF Limit er Turn-on Resi stan ce
(LCX, LCY, LCZ) RFLM — 300 700 VDD = 2.0V, VIN = 8 VDC
Sensitivity Reduction SADJ —
—0
-30 —
—dB
dB
VDD = 3.0V
No sensitivity reduction selected
Max. reduction selected
Monotonic increment in attenuation value
from setting = 0000 to 1111 by design
Minimum Modulation Depth
60% setting
33% setting
14% setting
8%
VIN_MOD —
—
—
60
33
14
8
84
49
26
%
%
%
%
VDD = 3.0V
See Section 5.21 “Minimum Modulation
Depth Requirement for Input Signal”.
See Modulation Depth Definition in
Figure 5-5.
Carrier frequency FCARRIER —125 — kHz
Input modulation frequency FMOD — — 10 kHz Input data rate with NR Z data format.
VDD = 3.0V
Minimum modulation depth setting = 33%
Input conditions:
Amplitude = 300 mVPP
Modulation depth = 100%
LCX Tuning Capacitor CTUNX —
44
0
59
—
82
pF
pF
VDD = 3.0V,
Config. Reg. 1, bits <6:1> Setting = 000000
63 pF ±30%
Config. Reg. 1, bits <6:1> Setting = 111111
63 steps, approx. 1 pF/step
Monotonic increment in capacitor value from
setting = 000000 to 111111 by design
LCY Tuning Capacitor CTUNY —
44
0
59
—
82
pF
pF
VDD = 3.0V,
Config. Reg. 2, bits <6:1> Setting = 000000
63 pF ±30%
Config. Reg. 2, bits <6:1> Setting = 111111
63 steps, approx. 1 pF/step
Monotonic increment in capacitor value from
setting = 000000 to 111111 by design
LCZ Tuning Capacitor CTUNZ —
44
0
59
—
82
pF
pF
VDD = 3.0V,
Config. Reg. 3, bits<6:1> Setting = 000000
63 pF ±30%
Config. Reg. 3, bits<6:1> Setting = 111111
63 steps, approx. 1 pF/step
Monotonic increment in capacitor value from
setting = 000000 to 111111 by design
Q of Internal Tuning Capacitors Q_C 50 * — —
Demodulator Charge Time
(delay time of demodulated output to rise) TDR —50 — sV
DD = 3.0V
Minimum modulation depth setting = 33%
Input conditions:
Amplitude = 300 mVPP
Modulation depth = 100%
* Parameter is characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.
Note 1: Required output enable filter high time must account for input path analog delays (= TOEH - TDR + TDF).
2: Required output enable filter low time mu st account for input path analog delays (= TOEL + TDR - TDF).
2005-2013 Microchip Technology Inc. DS21981B-page 5
MCP2030
Demodulator Discharge Time (delay time
of demodul ate d output to fal l) TDF —50 — sV
DD = 3.0V
MOD depth setting = 33%
Input conditions:
Amplitude = 300 mVPP
Modulation depth = 100%
Rise time of LFD ATA TRLFDATA —0.5 — sV
DD 3.0V. T ime is measured from 10% to
90% of amplitude
Fall time of LFDATA TFLFDATA —0.5 — sV
DD 3.0V
Time is measured from 10% to 90% of
amplitude
AGC stabilization time
(TAG C + TPAGC)TSTAB 4—— ms
AGC initialization time TAGC —3.5 — ms
High time after AGC initialization time TPAGC —62.5 — s
Gap time after AGC stabilization time TGAP 200 — — s
Time element of pulse TE100 — — s Minimum pulse width
Time from exiting Sleep or POR to being
ready to receive signal TRDY ——50*ms
Minimum time AGC level must be held
after receiving AGC Preserve command TPRES 5*— — ms AGC level must not change more than 10%
during TPRES.
Internal RC oscillator frequency FOSC 27 32 35.5 kHz Internal clock trimmed at 32 kHz during test
Inactivity timer time- out TINACT 13.5 16 17.75 ms 512 cycles of RC oscillator @ FOSC
Alarm timer time-out TALARM 27 32 35.5 ms 1024 cycles of RC oscillator @ FOSC
LC Pin Input Resistance for
LCX, LCY, LCZ pins RIN — 800* — kLCCOM grounded, VDD = 3V,
FCARRIER = 125 kHz.
LC P in Input Parasitic Capac itance for
LCX, LCY, LCZ pins CIN —24* — pF
LCCOM grounded, VDD = 3V,
FCARRIER = 125 kHz.
Minimu m output enable filter high time
OEH (Bits Config0<8:7>)
01 = 1ms
10 = 2ms
11 = 4ms
00 = Filter Disabled
TOEH
32 (~1 ms)
64 (~2 ms)
128 (~4 ms)
—
—
—
—
—
—
—
—
—
clock
count
RC oscillator = FOSC (see FOSC specification
for variations).
Viewed from the pin input:
(Note 1)
Minimu m output enable filter low t ime
OEL (Bits Config0<6:5>)
00 = 1ms
01 = 1ms
10 = 2ms
11 = 4ms
TOEL
32 (~1 ms)
32 (~1 ms)
64 (~2 ms)
128 (~4 ms)
—
—
—
—
—
—
—
—
clock
count
RC oscillator = FOSC
Viewed from the pin input:
(Note 2)
Maximum output enable filter period
OEH OEL TOEH TOEL
01 00 = 1 ms 1 ms (Filter 1)
01 01 = 1 ms 1 ms (Filter 1)
01 10 = 1 ms 2 ms (Filter 2)
01 11 = 1 ms 4 ms (Filter 3)
TOET
—
—
—
—
—
—
—
—
96 (~3 ms)
96 (~3 ms)
128 (~4 ms)
192 (~6 ms)
clock
count
RC oscillator = FOSC
10 00 = 2 ms 1 ms (Filter 4)
10 01 = 2 ms 1 ms (Filter 4)
10 10 = 2 ms 2 ms (Filter 5)
10 11 = 2 ms 4 ms (Filter 6)
—
—
—
—
—
—
—
—
128 (~4 ms)
128 (~4 ms)
160 (~5 ms)
250 (~8 ms)
11 00 = 4 ms 1 ms (Filter 7)
11 01 = 4 ms 1 ms (Filter 7)
11 10 = 4 ms 2 ms (Filter 8)
11 11 = 4 ms 4 ms (Filter 9)
—
—
—
—
—
—
—
—
192 (~6 ms)
192 (~6 ms)
256 (~8 ms)
320 (~10 ms)
00 XX = Filter Disabled — — — LFDATA output appears as long as input
signal level is greater than VSENSE.
AC Characteristics (Continued)
Electrical Specifications: Standard Operating Conditions (unless otherwise stated)
Supply Voltage 2.0V VDD 3.6V
Operating temperature -40°C TA +85°C
LCCOM connected to VSS
LC Signal Input Sinusoidal 300 mVPP
Carrier Frequency 125 kHz
LCCOM connected to VSS
Parameters Sym. Min. Typ† Max. Units Conditions
* Parameter is characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.
Note 1: Required output enable filter high time must account for input path analog delays (= TOEH - TDR + TDF).
2: Required output enable filter low time mu st account for input path analog delays (= TOEL + TDR - TDF).
MCP2030
DS21981B-page 6 2005-2013 Microchip Technology Inc.
RSSI current output IRSSI —
6
—
0.65
12
100
2
20.3
—
A
A
A
VIN = 37 mVPP
VIN = 370 mVPP
VDD = 3.0V, VIN = 0 to 4 VPP
Linearly increases with input signal ampli-
tude.
Tested at VIN = 37 mVPP, 100 m VPP, and
370 mVPP at +25ºC.
RSSI current linearity ILRRSSI -15 — 15 % Tested at room temperature only (see
Equation 5-1 and Figure 5-7 for test method).
AC Characteristics (Continued)
Electrical Specifications: Standard Operating Conditions (unless otherwise stated)
Supply Voltage 2.0V VDD 3.6V
Operating temperature -40°C TA +85°C
LCCOM connected to VSS
LC Signal Input Sinusoidal 300 mVPP
Carrier Frequency 125 kHz
LCCOM connected to VSS
Parameters Sym. Min. Typ† Max. Units Conditions
* Parameter is characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.
Note 1: Required output enable filter high time must account for input path analog delays (= TOEH - TDR + TDF).
2: Required output enable filter low time mu st account for input path analog delays (= TOEL + TDR - TDF).
SPI Ti ming
Electrical Specifications: Standard Operating Conditions (unless otherwise stated)
Supply Voltage 2.0V VDD 3.6V
Operating temperature -40°C TA +85°C
LC Signal Input Sinusoidal 300 mVPP
Carrier Frequency 125 kHz
LCCOM connected to VSS
Parameters Sym. Min. Typ† Max. Units Conditions
SCLK Frequency FSCLK —— 3MHz
CS fall to first SCLK edge setup time TCSSC 100 — — ns
SDI setup time TSU 30 — — ns
SDI hold time THD 50 — — ns
SCLK high time THI 150 — — ns
SCLK low time TLO 150 — — ns
SDO setup time TDO ——150ns
SCLK last edge to CS rise setup time TSCCS 100 — — ns
CS high time TCSH 500 — — ns
CS rise to SCLK edge setup time TCS1 50 — — ns
SCLK edge to CS fall setup time TCS0 50 — — ns SCLK edge when CS is high
Rise time of SPI data
(SPI Read command) TRSPI —10—nsV
DD 3.0V. Time is measured from 10% to
90% of ampli tude
Fall time of SPI data
(SPI Read command) TFSPI —10—nsV
DD 3.0V. Time is measured from 90% to
10% of ampli tude
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.
2005-2013 Microchip Technology Inc. DS21981B-page 7
MCP2030
2.0 TYPICAL PERFORMANCE CURVES
FIGURE 2-1: Typi cal Standby Curren t. FIGURE 2-2: Typical Active Current.
Note: The g r ap hs and t ables provid ed fol lowing this note are a statistical s ummary based on a l im ite d number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Standby Current (3 Channels Enabled)
0
1
2
3
4
5
6
2 V 3 V 3.6 V
VDD (V)
Current Draw (A)
Standby Current (2 Channels Enabled)
0
0.5
1
1.5
2
2.5
3
3.5
4
2 V 3 V 3.6 V
VDD (V)
Current Draw (A)
Stand by Current ( 1 Channel E nabled)
0
0.5
1
1.5
2
2.5
2 V 3 V 3.6 V
VDD (V)
Current Draw (A)
+85C
+25C
-40C
+85C
+25C
-40C
+85C
+25C
-40C
Active Current (3 Channels E nab led)
0
2
4
6
8
10
12
14
16
2 V 3 V 3.6 V
VDD (V)
Current Draw (A)
Active Current (1 Channel Enabled)
0
1
2
3
4
5
6
7
8
9
2 V 3 V 3.6 V
VDD (V)
Current Draw (A)
Active Current (2 Channels E nabled)
0
2
4
6
8
10
12
2 V 3 V 3.6 V
VDD (V)
Current Draw (A)
+85C
+25C
-40C
+85C
+25C
-40C
+85C
+25C
-40C
MCP2030
DS21981B-page 8 2005-2013 Microchip Technology Inc.
FIGURE 2-3: Oscillator Frequency vs.
Temperature, VDD = 3.6V and 2.0V.
FIGURE 2-4: Oscillator Frequency
Histograms vs. Temperature, VDD = 2V.
FIGURE 2-5: Oscillator Frequency
Histograms vs. Temperature at VDD = 3V.
FIGURE 2-6: De-Q’ed Voltage vs.
Unloaded Coil Voltage.
FIGURE 2-7: Modulation Transistor-on
Resistance (+25°C).
FIGURE 2-8: Channel Sensitivity vs.
Bandwidth.
29
30
31
32
33
34
35
-50 -25 0 25 50 75 100 125
Temperature (°C)
Oscillator Frequency (kHz.)
Osc. Freq. @ VDD = 3.6V
Osc. Freq. @ VDD = 2.0V
0.0%
5.0%
10.0%
15.0%
20.0%
25.0%
30.0%
35.0%
40.0%
45.0%
50.0%
27
28
29
30
31
32
33
34
35
Oscillator Frequency (kHz.)
Percent age of Occur e nce s (%)
-40C
25C
85C
VDD = 2.0V
0.0%
5.0%
10.0%
15.0%
20.0%
25.0%
30.0%
35.0%
40.0%
45.0%
50.0%
27
28
29
30
31
32
33
34
35
Oscillator Frequency (kHz.)
Percentage of Occurences (%)
-40C
25C
85C
VDD = 3.6V
0
2
4
6
8
10
12
0 200 400 600 800
Unloaded Coil Voltage (VPP)
De-Q'e d (Loaded) Coil Voltage
(VPP)
0
10
20
30
40
50
60
70
80
0246
VDD (V)
Ohms
Ch. X
Ch. Y
Ch. Z
0
5
10
15
20
25
0 200 400 600
Fre que nc y (k Hz)
2005-2013 Microchip Technology Inc. DS21981B-page 9
MCP2030
FIGURE 2-9: T ypical RSSI Output Current
vs. Input Signal Strength.
FIGURE 2-10: Typica l Tu ned Capacitance
Value vs. Configuration Register Bit Setting
(VDD = 3V, Temperature = +25°C.
FIGURE 2-11: Typical Tuned Capacitance
Value vs. Configuration Register Bit Setting
(VDD = 3V,Temperature = -40°C.
FIGURE 2-12: Typical Tuned Capacitance
Value vs. Configuration Register Bit Setting
(VDD = 3V,Temperature = +85°C.
0
20
40
60
80
100
120
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
RSSI (µA)
-40°C
+85°C +25°C
0
10
20
30
40
50
60
70
0 20406080
Bit Setting (Steps)
Capacitance (pF)
Ch. X
Ch. Y
Ch. Z
0
10
20
30
40
50
60
70
0 20406080
Bit Setting (steps)
Capacitance (pF)
Ch. X
Ch. Y
Ch. Z
0
10
20
30
40
50
60
70
0 20406080
Bit Setting (Steps)
Capacit ance (pF )
Ch. X
Ch. Y
Ch. Z
MCP2030
DS21981B-page 10 2005-2013 Microchip Technology Inc.
FIGURE 2-13: Examples of RSSI Output
Current Variations Between Channel to Channel
and Device to Device at Room Temperature.
FIGURE 2-14: Example of Typical TDR
Changes over Temperature.
Input Signal Condition: Amplitude = 300 mVPP,
Modulation Depth = 100 %.
FIGURE 2-15: Example of Typical TDF
Changes over Temperature.
Input Signal Condition: Amplitude = 300 mVPP,
Modulation Depth = 100 %.
0
10
20
30
40
50
60
70
80
02468
Input Voltage (V)
RSSI Current (A)
Ch-X
Ch-Y
Ch-Z
0
10
20
30
40
50
60
70
80
02468
Input Voltage (V)
RSSI Current (A)
Ch-X
Ch-Y
Ch-Z
Device (a)
Device (b)
Device (c)
Note: Equal amplitude is applied to each channel.
0
10
20
30
40
50
60
70
80
02468
Input Voltag e (V)
Current (A)
Ch-X
Ch-Y
Ch-Z
0
10
20
30
40
50
60
70
80
90
100
85C 25C -20C -40C
Temperature (°C)
TDR (µs)
8%
14%
33%
60%
0
10
20
30
40
50
60
85C 25C -20C -40C
Temperature (°C)
TDF (µs)
8%
14%
33%
60%
2005-2013 Microchip Technology Inc. DS21981B-page 11
MCP2030
2.1 Performance Plots
FIGURE 2-16: Input Sensitivity Example.
(a) Sensitivity = 1.06 mVPP
(b) Sensitivity = 3 mVPP
Demodulated output
Input signal
Demodulated output
Input signal
MCP2030
DS21981B-page 12 2005-2013 Microchip Technology Inc.
FIGURE 2-17: Typical AGC Initialization Time at Room Temperature (VDD = 3V).
Note: Ch2 is the input and Ch1 is the output (demodu lated data appears after AGC Initialization time (TAGC)).
Output Enable Filter is disabled.
2005-2013 Microchip Technology Inc. DS21981B-page 13
MCP2030
FIGURE 2-18: ALERT Output Example: With No Parity Error and no 32 ms Alarm Timer Time-out.
Note: Ch3 is the input with correct Output Enable Filter timing.
Ch1 is the demodulated LFDATA output.
Ch2 is the ALERT pin output. It shows that the ALE RT output pin maintains logic high if the input signal
meets the programmed filter timing requirement.
MCP2030
DS21981B-page 14 2005-2013 Microchip Technology Inc.
FIGURE 2-19: ALERT Output Example: With 32 ms Alarm Timer Timed out.
Note: The 32 ms Alarm Timer is enabled only if the O utpu t Enable Filter is enabled.
Ch3 is the input s i gnal with incorrect Output Enable Filter timing.
Ch1 is the demodulated LFDATA output. No output since the input filter is not matched.
Ch2 is the ALERT output.
The output shows that the logic level changes after 32 ms from the AGC initialization time (TAGC) if the input
signal does not meet the programmed filter timing requirement.
2005-2013 Microchip Technology Inc. DS21981B-page 15
MCP2030
FIGURE 2-20: Examples of Soft Inactivity Timer Timed out: This output is available only if the Output
Enable Filter is disabled.
(b) Input (Ch 2):
Input has no
(a) Output (Ch 1):
Device repeats
Soft Reset after
16 ms inactivity
timer has timed out
Note: Ch 2 is the input without modulation (i.e., noise)
Ch 1 is the output at the LFDATA pin due to the 16 ms Soft Inactivity Timer timed out. Note the 3.5 ms AGC
initialization time after the Soft Reset.
The cases shown above apply when the Output Filter is disabled.
modulation
MCP2030
DS21981B-page 16 2005-2013 Microchip Technology Inc.
FIGURE 2-21: Examples of Clamp-On and Clamp-Off Commands and Changes in Coil Voltage.
Coil Voltage
Clock Pulses
Clamp On
Coil Voltage
Clock Pulses
Clamp Off
Command
Command
LCX
SCLK
SDI
LCX
SCLK
SDI
2005-2013 Microchip Technology Inc. DS21981B-page 17
MCP2030
FIGURE 2-22: Example of Minimum Modulation Depth Setting: Modulation Depth of Input Signal =
77%, Minimum Modulation Depth (MODMIN) Setting = 60%.
FIGURE 2-23: Example of Minimum Modulation Depth Setting: Modulation Depth of Input
Signal = 56%, Minimum Modulation Depth (MODMIN) Setting = 60%.
Demodulated output
Input signal with 77%
modulation depth
Demodulated output
Input signal with 56%
modulation depth
Note: There is no demodulated output since the modulation depth of the input signal is lower than the minimum
modulation depth setting. The device will have demodulated output if the Minimum Modulation Depth option
is set to 8%, 14%, or 33%.
MCP2030
DS21981B-page 18 2005-2013 Microchip Technology Inc.
FIGURE 2-24: Example of Minimum Modulation Depth Setting: Modulation Depth of Input Signal =
42%, Minimum Modulation Depth (MODMIN) Setting = 33%.
FIGURE 2-25: Example of Minimum Modulation Depth Setting: Modulation Depth of Input Signal =
14%, Minimum Modulation Depth (MODMIN) Setting = 14%.
Demodulated output
Input signal with 42%
modulation depth
Demodulated output
Input signal with 14%
modulation depth
2005-2013 Microchip Technology Inc. DS21981B-page 19
MCP2030
FIGURE 2-26: Examples of Output Enable Filters 1 through 3 (Wake-up Filters) and Demodulated
Outputs.
Filter 1
Output Enable
Filter T iming of
Input Signal
Configuration
Bit Se ttings
OEH OEL
TOEH = 1 ms
TOEL = 1 ms
TOET = 3 ms
01
or01
00
01
Filter 2
Output Enable
Filter Timing of
Input Signal
Configuration
Bit Settings
OEH OEL
TOEH = 1 ms
TOEL = 2 ms
TOET = 4 ms 01 10
Filter 3
Output Enable
Filter Timing of
Input Signal
Configuration Bit
Settings
OEH OEL
TOEH = 1 ms
TOEL = 4 ms
TOET = 6 ms 01 11
MCP2030
DS21981B-page 20 2005-2013 Microchip Technology Inc.
FIGURE 2-27: Examples of Output Enable Filters 4 through 6 (Wake-up Filters) and Demodulated
Outputs.
Filter 4
Output Enable
Filter Timing of
Input Signal
Configuration Bit
Settings
OEH OEL
TOEH = 2 ms
TOEL = 1 ms
TOET = 4 ms
10
or10
00
01
Filter 5
Output Enable
Filter Timing of
Input Signal
Configuration Bit
Settings
OEH OEL
TOEH = 2 ms
TOEL = 2 ms
TOET = 5 ms 10 10
Filter 6
Output Enable
Filter Timing of
Input Signal
Configuration
Bit Settings
OEH OEL
TOEH = 2 ms
TOEL = 4 ms
TOET = 8 ms 10 11
2005-2013 Microchip Technology Inc. DS21981B-page 21
MCP2030
FIGURE 2-28: Examples of Output Enable Filters 7 through 9 (Wake-up Filters) and Demodulated
Outputs.
Filter 7
Output Enable
Filter Timing of
Input Signal
Configuration Bit
Settings
OEH OEL
TOEH = 4 ms
TOEL = 1 ms
TOET = 6 ms
11
or11
00
01
Filter 8
Output Enable
Filter Timing of
Input Signal
Configuration
Bit Settings
OEH OEL
TOEH = 4 ms
TOEL = 2 ms
TOET = 8 ms 11 10
Filter 9
Output Enable
Filter Timing of
Input Signal
Configuration Bit
Settings
OEH OEL
TOEH = 4 ms
TOEL = 4 ms
TOET = 10 ms 11 11
MCP2030
DS21981B-page 22 2005-2013 Microchip Technology Inc.
FIGURE 2-29: Input Signal and Demodulated Output When the Output Enable Filter is Disabled.
FIGURE 2-30: Input Signal and Demodulator Output When Output Enable Filter is Enabled and Input
Meets Filter Timing Requirements.
Input Signal
LFDATA
Note: Demodulated output is available immediately after AGC initialization.
Output
Input Signal
LFDATA
Note: Demodulated output is available only if the incoming signal meets the enable filter tim ing criteria that is defined in the
Configuration Register 0 (Register 5-1). If the criteria is met, the output is available after the low timing (TOEL) of the
Enable Filter.
Output
2005-2013 Microchip Technology Inc. DS21981B-page 23
MCP2030
FIGURE 2-31: No Demodulator Output When Output Enable Filter is Enabled But Input Does Not
Meet Filter Timing Requirements.
Input Signal
No LFDATA
Output
MCP2030
DS21981B-page 24 2005-2013 Microchip Technology Inc.
FIGURE 2-32: Carrier Clock Output Examples.
(a) Carrier Clock Output with Carr ier /1 Option
Carrier Clock Output
Carrier Input
(b) Carrier Cloc k Output with Carrier/4 Option
Carrier Input
Carrier Clock Output
2005-2013 Microchip Technology Inc. DS21981B-page 25
MCP2030
3.0 PIN DESCRIPT IONS
3.1 Supply Voltage (VDD, VSS)
The VDD pin i s the power supply p in fo r th e a na log an d
digital circuitry within the MCP2030. This pin requires
an approp riate bypass ca pacitor of 0.1 µF. The vol t ag e
on this pin shou ld be maint ained in the 2.0V -3.6V range
for specified operation.
The VSS pin is the ground pin and the current return
path for both analog and digital circuitry of the
MCP2030. If an analog ground plane is available, it is
recommended that this device be tied to the analog
ground plane of the PCB.
3.2 Chip Select (CS)
The CS pin needs to stay high when the device is
receiving input signals. Leaving the CS pin low will
place the device in the SPI Programming mode .
The CS pin is an ope n colle ct or outpu t. This p in has an
internal pull-up resistor to ensure that no spurious SPI
communication occurs between power-up and pin
configuration of the MCU.
3.3 SPI Clock Input (SC LK/ALERT)
This pi n bec omes the SPI clo ck inpu t (SCLK) when C S
is low, and becomes the ALERT output when CS is
high.
The ALER T pin is an open collector output. This pin has
an internal pull-up resistor to ensure that no spurious
SPI communication occurs between power-up and pin
configuration of the MCU.
3.4 Received Signal Str ength
Indicator (RSSI)
This pin becomes the Received Signal S trength Indicator
(RSSI ) ou tput curre nt si nk wh en the R SSI outp ut op tion
is se lect ed.
TABLE 3-1: PIN FUNCTION TABLES
Pin No. Symbol I/O/P Function
1V
SS P Ground Pin.
2CSIChip Select Digital Input Pin.
3 SCLK/ALERT I/O Clock input for the modified 3-wire SPI interface.
ALERT output: This pin goes low if there is a parity error in the
Configuration register or the 32 ms alarm timer is timed out.
4 RSSI O Received Si gn al Strength In di ca to r (RSSI) current output.
5 NC N/A No Connect.
6 LFDATA/CCLK/SDIO I/O Demo dulated data output.
Carrier clock outpu t.
Serial input or output data for the modified 3-wire SPI interface.
7V
DD P Positive Supply Voltage Pin.
8V
DD P Positive Supply Voltage Pin.
9 LCZ I Input pin for external LC antennas.
10 LCY I Input pin for external LC antennas.
11 LCX I Input pin for external LC antennas.
12 NC N/A No Connect.
13 LCCOM I Common reference input for the external LC antennas.
14 VSS P Ground Pin.
Type Identification: I = Input; O = Output; P = Power
MCP2030
DS21981B-page 26 2005-2013 Microchip Technology Inc.
3.5 Demodulated Dat a Output (LFDATA)
Carrier Clock Output (CCLK)
SPI Data I/O (SDIO)
When the CS pin is high, this pin is an output pin for
demodu lated d at a or carrier clock depen ding o n outp ut
type selection. When carrier clock output (CCLK) is
selected, the LFDATA output is a square pulse of the
input carr ier c lock and is availa ble as s oon as the AGC
stabilization time (TSTAB) is completed.
When the CS pin is low, this pin becom es the SPI da t a
input and output (SDIO).
3.6 LC Input (LCX, LCY, LCZ)
These pins are the input pins for the external LC
resonant antenna circuits. The antenna circuits are
connected between the LC pin and the LCCOM pin.
3.7 LC Common Reference (LCCOM)
This pin is the common reference input pin for the
external LC resonant ci rcuit.
2005-2013 Microchip Technology Inc. DS21981B-page 27
MCP2030
4.0 APPLICATION INFORMATION
The MCP2030 is a stand-alone 3-channel analog
front-end device for low frequency (LF) sensing and
bidirectional transponder applications. By connecting
three orthogonally placed LC resonant antennas to
the LC input pins, it can detect signals from all
directions (x, y and z).
The device draws more current when all channels are
enabled as compared to a single channel; therefore, it
is recommended to disable any unused channels by
setting Configuration Register 0 (Register 5-1).
The device’s high input sensitivity (as low as 1 mVPP)
and ability to detect weakly modulated (as low as 8%)
input signals with its low power feature set, makes the
device suitable for various applications such as a low-
cost hands-free Passive Keyless Entry (PKE)
transponder, an LF Initiator sensor for Tire Pressure
Monitoring Systems (TPMS) and long-range access
control applications in the automotive and security
industries.
4.1 Battery Back-up and Batteryless
Operation
The device supports both battery back-up and
batteryless operation by the addition of external
components, allowing the device to be partially or
completely powered from the field.
Figu re 4- 1 shows an example of the ext ernal circuit fo r
the battery back-up.
FIGURE 4-1: External Circuit Example for LF Field Powering and Battery Back-up Mode.
Note: Voltage on LCCOM combined with coil
input voltage must not exceed the maxi-
mum LC input voltage.
LCX
LCY
LCZ
VBAT
DBLOCK CPOOL
DFLAT1
RLIM
LCCOM
CCOM
Air Coil
DFLAT2
CZ
CY
CX
VDD
RCOM
DLIM LX
LY
LZ
Legend: CCOM = LCCOM charging capacitor.
CPOOL = Pool capacitor (or battery back-up capacitor), charges in field and powers device.
DBLOCK = Battery protection from reverse charge.
Schottky for low forward bias drop.
DFLAT = Field rectifier diodes.
DLIM = Voltage limiting diode, may be required to limit VDD voltage when in strong fields.
RCOM = LCCOM discharge path.
RLIM = Current limiting resistor, required for air coil in strong fields.
MCP2030
DS21981B-page 28 2005-2013 Microchip Technology Inc.
4.2 Application Examples
Figure 4-2 shows an example of an external circuit for
a bidirec tio nal co mmuni catio n transp onder ap plica tio n.
Each LC input pin is connected to an external LC
resonant circuit. To achieve the best performance, the
resonant frequency of the LC circuit needs to be
matched to the detecting carrier frequency of interest.
The resonant frequency is given by the following
equation:
In t ypical 125 kHz appli cations, th e L value is a few mH,
and the C value is a few hundred pF, for example,
L = 4.9 mH, and C = 331 pF.
The reso na nt frequ ency can b e fine -tuned by pro gram-
ming the in ter nal tuning capacitors.
The output of the MCP2030 is fed into the external
MCU. The external MCU can send dat a by clampi ng on
and clamping off the MCP2030 coil voltages using an
SPI command, or via a UHF transmitter.
The RSSI output of the MCP2030 can be digitized by
the MCU firmware. Users can also consider using a
MCU that has an internal analog-to-digital converter
(ADC) such as the PIC16F684 or a stand-alone ADC
device.
Figu re 4 - 3 s h ows a n ex am pl e of a ha nd s- f re e P as si ve
Keyless Entry (PKE) system. The base station unit
transmits an LF command. The MCP2030 detects the
base station command and feeds the detected output
to the external MCU (PIC16F636). If the command is
correct, the MCU responds via an external UHF
transmitter or by using the LF talk-back modulators of
the MCP2030 device.
Figure 4-4 shows an example when the device is used
for a tire pressure monitoring sensor application. The
device detects the LF Initiator com mands and transmits
the tire pres sure data to the b ase station via an external
UHF transmitter.
FIGURE 4-2: Example of External Circuits for Bidirectional Communication T ransponder Applications.
fo1
2LC
------------------
=
NC
LCCOM
LCX
VSS
LFDATA/CCLK/SDIO
VDD
LCZ
LCY
VSS
CS
SCLK/ALERT
RSSI
NC
VDD
PIC16F636/684 To ADC
+3V
air-core
coil ferrite-core
coil
ferrite-core coil
MCP2030
+3V
RF Circuitry
(UHF TX)
315/434 MHz
SW1
SW2
SW3
SW4
CL
CLCL
2005-2013 Microchip Technology Inc. DS21981B-page 29
MCP2030
FIGURE 4-3: Example of Bidirectional Hand-free Passive Keyless Entry (PKE) System.
FIGURE 4-4: Example of Tire Pressure Monitoring Sensor Applications.
LED
UHF
Transmitter
LED
UHF
Receiver
LF
Transmitter/
Receiver
Microcontroller
(MCU)
LF Command
(125kHz)
Response
(125kHz)
Response
(UHF)
Encrypted
Codes
Base Station PKE Transponder
Ant. X
Ant. Y
Ant. Z
MCU
(PIC16F636)
MCP2030
(3D Stand Alone
Analog Front-End)
RF Receiver
MCU
LF Initiator
RF Transmitter
MCP2030
Tire
Pressure
Sensor
UHF response with
tire pressure data
125 kHz Initiator
command
Note 1: The LF initiator sends LF commands to request the tire pressure data.
2: The MCP2030 picks up the LF commands and the MCU transmits the tire pressure data
via an external UHF transmitter.
MCU
MCP2030
DS21981B-page 30 2005-2013 Microchip Technology Inc.
NOTES:
2005-2013 Microchip Technology Inc. DS21981B-page 31
MCP2030
5.0 FUNCTIONAL DESCRIPTION
AND THEORY OF DEVICE
OPERATION
The MCP2030 contains th ree analog input chann els for
signal detection and LF talk-back. This section
provides the function description of the device.
Each analog input channel has internal tuning
capacitors, sensitivity control circuits, an input signal
strength limiter and an LF talk-back modulation
transistor. An Automatic Gain Control (AGC) loop is
used for all three input channel gains. The output of
each channel is OR’d and fed into a demodulator. The
digital output is passed to the LFDATA pin. Figure 5-1
shows the block diagram of the device and Figure 5-2
shows the input signal path.
There are a tot al of eig ht Confi guratio n regis ter s. Six of
them are used for device operation options, one for
column parity bits and one for status indication of
device operatio n. Each regi ster has 9 bits in cluding on e
row parity bit. These registers are readable and
writable by SPI commands except for the STATUS
register, which is read-only.
The device’s features are dynamically controllable by
programming the Configuration registers.
5.1 RF Limiter
The RF Limiter limits LC pin input voltage by de-Q’ing
the external LC resonant antenna circuit. The limiter
begins de-Q’ing the external LC antenna when the
input voltage exceeds VDE_Q, progressively de-Q’ing
harder to reduce the antenna input voltage.
The signal levels from all 3 channels are combined
such that the limiter attenuates all 3 channels
uniformly, in respect to the channel with the strongest
signal.
5.2 Modulation Circuit
The modulation circuit consists of a modulation
transistor (FET), internal tuning cap acitors and external
LC antenna components. The modulation transistor
and the internal tuning capacitors are connected
between the LC input pin and LCCOM pin. Each LC
input has its own modulation transistor.
When the modulation transistor turns on, its low Turn-
on Resistance (RM) clamps the induced LC antenna
voltage. The coil voltage is minimized when the
modulation transistor turns-on and maximized when
the modulation transistor turns-off. The modulation
transistor’s low turn-on resistance (RM) results in a high
modulation depth.
The LF talk-back is achieved by turning on and off the
modulati on transistor.
The modulation data comes from the external micro-
controller section via the digital SPI as “Clamp On”,
“Clamp Off” commands. Only those inputs that are
enabled will execute the Clamp command. A basic
block diagram of the modulation circuit is shown in
Figure 5-1 and Figure 5-2.
The modulation FET is also shorted momentarily after
Soft Reset and Inactivity timer ti me-out.
5.3 Tuning Capacitor
Each channel has internal tuning capacitors for external
antenna tuning. The capacitor values are programmed
by the C onfiguration registers up to 63 pF, 1 pF per step.
5.4 Variable Attenuator
The variable attenuator is used to attenuate, via AGC
control, the input signal voltage to avoid saturating the
amplifiers and demodulators.
5.5 Sensitivity Control
The sensitivity of each channel can be reduced by the
channel’s Configuration register sensitivity setting.
This is used to desensitize the channel from optimum.
5.6 AGC Control
The AGC controls the variable attenuator to limit the
internal signal voltage to avoid saturation of internal
amplifiers and demodulators (Refer to Section 5.4
“Variable Attenua tor”).
The signal levels from all 3 channels are combined
such that the AGC attenuates all 3 channels uniformly
in respec t to the channel with the strongest signal.
Note: The user can control the tuning capaci-
tor by programming the Configuration
registers. See Register 5-2 through
Register 5-4 for details.
Note: The variable attenuator function is
accomplished by the device itself. The
user cannot control its function.
Note: The user can desensitize the channel
sensitivity by programming the
Configuration registers. See Register 5-5
and Register 5-6 for details.
Note: The AG C contro l fu nction is acco mplis hed
by the device itself. The user cannot
control its function.
MCP2030
DS21981B-page 32 2005-2013 Microchip Technology Inc.
5.7 Fixed Gain Amplifiers 1 and 2
FGA1 and FGA2 provides a maximum two-stage gain
of 40 dB.
5.8 Auto-Channel Selection
The auto-channel selection feature is enabled if the
Auto-Channel Select bit AUTOCHSEL<8> in Configu-
ration Register 5 (Register 5-6) is set, and disabled if
the bit is cleared. When this feature is active (i.e.,
AUTOCHSE <8> = 1), the control circuit checks the
demodulator output of each input channel immediately
after the AGC settling time (TSTAB). If th e output is hig h,
it allows this channel to pass data, otherwise it is
blocked.
The status of this operation is monitored by STATUS
Register 7 bits <8:6> (Register 5- 8). These bits indicate
the current status of the channel selection activity, and
automatically updates for every Soft Reset period. The
auto-channel selection function resets after each Soft
Reset (or after Inactivity timer time-out). Therefore, the
blocked channels are re-enabled af ter So f t Reset.
This feature can make the output signal cleaner by
blocking any channel that was not high at the end of
TAGC. This function works only for demodulated data
output, and is not applied for carrier clock or RSSI
output.
5.9 Carrier Clock Detector
The Carrier Clock Detector senses the input carrier
cycles. The output of the detector switches digitally at
the signal carrier frequency. Carrier clock output is
ava ilable wh en the outp ut is sele cted by th e DATOUT
bit in Con figuration Register 1 (Register 5-2).
5.10 Demodulator
The Demodulator consists of a full-wave rectifier, low
pass filter, peak detector and Data Slicer that detects
the envelope of the input signal.
5.11 Data Slicer
The Data Slicer consists of a reference generator and
comparator. The Data Slicer compares the input with
the reference voltage. The reference voltage comes
from the minimum modulation depth requirement
setting and input peak voltage. The data from all 3
channels are OR’d together and sent to the output
enable filter.
5.12 Output Enable Filter
The Output Enable Filter enables the LFDATA output
once th e inco ming sign al meet s th e wake-up seque nce
requirements (see Section 5.15 “Configurable
Output Enable Filter”).
5.13 Received Signal S trength
Indicator (RSSI)
The RSSI provides a current which is proportional to
the input signal amplitude (see Section 5.30.3
“Received Signal Strength Indicator (RSSI)
Output”).
5.14 Analog Front-End Timers
The device has an internal 32 kHz RC oscillator. The
oscillator is used in several timers:
• Inactivity timer
• Alarm timer
•Pulse width timer
• Per iod timer
• AGC settling timer
5.14.1 RC OSCILLATOR
The RC oscillator generates a 32 kHz internal clock.
Note: The user cannot control the gain of these
two amplifiers.
2005-2013 Microchip Technology Inc. DS21981B-page 33
MCP2030
5.14.2 INACTIVITY TIMER
The Inactivity Timer is used to automatically return the
device to Standby m ode, i f the re is n o input signa l. Th e
time-ou t period is approximately 16 ms (TINACT), based
on the 32 kHz internal clock.
The purpose of the Inactivity Timer is to minimize
current draw by automatically returning to the lower
current Standby mode, if there is no input signal for
approximate ly 16 ms.
The time r is reset when:
• An amplitude change in LF input signal, either
high-to-low or low-to-high
•CS
pin is low (any SPI command)
• Timer-related Soft Reset
The timer starts after AGC initialization time (TAGC).
The timer causes a Soft Reset when:
• A previously received input signal does not
change either high-to-low or low-to-high for
TINACT
The Soft Reset returns the device to Standby mode
where most of the analog circuits, such as the AGC,
demodulator and RC oscillator , are powered down. This
return s the device to the lo wer Standby Current mo de .
5.14.3 ALARM TIMER
The Alarm Timer is used to notify the external MCU that
the d evi ce is rece ivin g an i nput sign al that d oes not p ass
the output enable filter requirement. The time-out p eriod
is approximately 32 ms (TALARM) in the presence of
continuing noise.
The Alarm Timer time-out occurs if there is an input
signal for longer than 32 ms that does not meet the
output enable filter requirements. The Alarm Timer
time-out causes:
a) The ALERT pin to go low.
b) The ALARM bit to set in the Status
STAT US Register 7 (Register 5-8).
The external MCU is informed of the Alarm timer time-
out by monitoring the ALERT pin. If the Alarm timer
time-out occurs, the external MCU can take
appropriate actions such as lowering channel
sensitivity or disabling channels. If the noise source is
ignored, the device can return to a lower standby
current draw state.
The timer is reset when the:
•CS
pin is low (any SPI command).
• Ou tput enable filte r is disabled.
• LFDATA pin is enabled (signal passed output
enable filter).
The timer starts after the AGC initialization time.
The time r causes a low outp ut on the AL ERT pin when:
• Output enable filter is enabled and modulated
input signal is present for TALARM, but does not
pass the output enable filter requirement.
5.14.4 PULSE WIDTH TIMER
The Pulse Width Timer is used to verify that the
received output enable sequence meets both the
minimum TOEH and minimum TOEL requirements.
5.14.5 PERIOD TIMER
The Period Timer is used to verify that the received
output enable sequence meets the maximum TOET
requirement.
5.14.6 AGC INITIA LIZATI ON TIMER (TAGC)
This timer is used to keep the output enable filter in
Reset while the AGC settles on the input signal. The
time-out period is approximately 3.5 ms. At the end of
this time (TAGC), the input should remain high (TPAGC),
otherwise the counting is aborted and a Soft Reset is
issued. See Figure 5-4 for details.
Note: The Alarm timer is disabled if the output
enable filter is disabled.
Note 1: The device needs continuous and
uninterrupted high input signal during
AGC initialization time (TAGC). Any
absence of signal during this time may
reset the timer and a new input signal is
needed for AGC settling time, or may
result in improper AGC gain settings
which wi ll produce invalid output.
2: The rest of the device section wakes up
if any of these input channels receive
the AGC settling time correctly. STATUS
Register 7 bits <4:2> (Register 5-8) indi-
cate which input channels have waken
up the device first. Valid input signal on
multiple input pins can cause more than
one channel's indicator bit to be set.
MCP2030
DS21981B-page 34 2005-2013 Microchip Technology Inc.
FIGURE 5-1: Functional Block Diagram.
Configuration
To Tuning Cap X
To Tuning Cap Y
To Tuning Cap Z
To Modulation
VSST
LCX
LCY
LCZ
LCCOM
Transistors
Registers
VDDT
To Sensitivity Z
To Sensitivity Y
To Sensitivity X
Modulation
Depth
AGC Preserve
LCCOM
Detector
Detector
Detector
CS LFDATA/SCLK/ALERT
External MCU
Command Decoder/Controller
Mod Tune X
Output Enable
RF
Lim
LCCOM
Mod T une Y
RF
Lim
Mod Tu ne Z
RF
Lim
32 kHZ
Oscillator
B
A
A
A
AGC
AGC
AGC
Sensitivity
Control X
Sensitivity
Control Y
Sensitivity
Control Z
Filter
AGC
Timer
RSSI CCLK/SDIO
÷ 64
÷ 64
÷ 64
Watchdog
WAKEX
WAKEZ
WAKEY
2005-2013 Microchip Technology Inc. DS21981B-page 35
MCP2030
FIGURE 5-2: Input Signal Path.
A
A
RF
Limiter MOD
FET Capacitor
Tuning Var
Atten
FGA1 FGA2
Full-Wave
LFDATA
X
Y
Z
LCX/
LCY/
LCZ
LCCOM
Carrier
>4V
PP
WAKEZ
WAKEY
CLKDIV
DATOUT
AGC
Feedback
Peak
REF GEN
0.1V
X
Y
ZB
AGCACT
AGCSIG
Demodulator
Decode
AGC
Registers
Configuration
Sens.
Control
Legend:
FGA = Fixed Gain Amplifier
FWR = Full-wave Rectifier
LPF = Low-pass Filter
PD = Peak Detector
00
Detector
+
–
+
–
+
–
0.4V
Data Slicer
MOD Depth Control
Output Enable
Filter
10
Amplifier
Rectifier Low-Pass
Filter Detector
Auto-Channel
Selector
32 kHz
Clock/AGC
/1 OR /4
C
CHX
CHY
CHZ ACT
AUTOCHSEL
LFDATA
01
10
11
RSSI GEN
C
Timer
÷ 64
RSSI
DETZ
DETY
DETX
WAKEX
MCP2030
DS21981B-page 36 2005-2013 Microchip Technology Inc.
5.15 Configurable Output Enable Filt er
The purpose of this filter is to enable the LFDATA out-
put and wake the external microcontroller only after
receivi ng a spe cific se quence o f puls es on the LC input
pins. Therefore, it prevents waking up the external
microc ontroll er due to no ise or unwa nted inp ut sign als.
The circuit compares the timing of the demodulated
header waveform with a pre-defined value, and
enables the demodulated LFDATA output when a
match occu rs.
The output enable filter consists of a high (TOEH) and
low duration (TOEL) of a pulse immediately after the
AGC settling gap time. The selection of high and low
times further implies a max period time. The output
enable high and low times are determined by SPI
programming. Figure 5-3 and Figure 5-4 show the
output enabl e filter waveforms.
There should be no missing cycles during TOEH.
Missing cycles may result in failing the output enable
condition.
FIGURE 5-3: Output Enable Filter Timing.
Data Packet
t TOEH t TOEL
Required Output Enable Sequence
LFDATA output is enabled
on this rising edge
t TOET
Demodulator
Output TGAP
Device Wake-up
Start bit
AGC
(TAGC + TPAGC)
TSTAB
and AGC Stabilization Gap Pulse
2005-2013 Microchip Technology Inc. DS21981B-page 37
MCP2030
FIGURE 5-4: Output Enable Filter Timing Example (Detailed).
LF Coil Input
Demodulated LFDATA Output
Low
Standby
Mode
Current
Filter is passed and
LFDATA is enabled
Gap
TPAGC
Legend: TAGC = AGC initialization ti me
TPAGC = High time after TAGC
TSTAB = AGC stabilization time (TAGC + TPAGC)
TE= Time element of pulse (minimum pulse width)
TGAP = AGC stabili zation gap
TOEH = Minimum output enable filter high tim e
TOEL = Minimum output enable filter low time
TOET = Maximum output enable filter period
3.5 ms
Filter
starts
TGAP
Start bit for data
(need
TSTAB
t TOEH
t TOEL
t TOET
t 2T
E
(AFE Stabilization)
“high”) Pulse
TAGC
(AGC initializ ation time)
MCP2030
DS21981B-page 38 2005-2013 Microchip Technology Inc.
TABLE 5-1: OUTPUT ENABLE FILTER
TIMING
TOEH is measured from the rising edge of the
demodulator output to the first falling edge. The pulse
width must fall within TOEH t TOET.
TOEL is measured from the falling edge of the
demodu lator output to the ris ing edge of the ne xt pulse.
The pulse width must fall within TOEL t TOET.
TOET is measured from rising edge to the next rising
edge (i.e., the sum of TOEH and TOEL). The sum of TOEH
and TOEL must be t TOET. If the Configuration Register
0 (Regis ter 5-1), OEH<8:7> is set to ‘00’, then the fil ter
is disabled. See Figure 2-30 for this case.
The filter will reset, requiring a complete new successive
high and low period to enable LFDATA, under the
following conditions.
• The received hi gh is not greater t han the
configured minimum TOEH value.
• During TOEH, a loss of s ignal for longe r than 56 s
causes a filter Reset.
• The received low is not greater than the
configured minimum TOEL value.
• The received sequence exceeds the maximum
TOET value:
-T
OEH + TOEL > TOET
-or T
OEH > TOET
-or T
OEL > TOET
• A Soft Reset SPI command is received.
If the fil ter reset s due to a long high-time (T OEH > T OET),
the high-pulse timer will not begin timing again until
after a gap of TE and another low-to-high transition
occurs on the demodulator output.
Disabling the output enable filter disables the TOEH and
TOEL requirement and the device passes all detected
data. See Figure 2-30, Figure 2-31 and Figure 2-32 for
examples.
When v iewed f rom an a pplicati on perspe ctive, f rom th e
pin input, the actual output enable filter timing must
factor in the analog delays in the input path (such as
demodulator charge and discharge times).
•T
OEH - TDR + TDF
•T
OEL + TDR - TDF
The output enable filter starts immediately after TGAP,
the gap after AGC stabilization period.
5.16 Input Sensitivity Control
The device has typical input sensitivity of 3 mVPP. This
means any input signal with amplitude greater than 3
mVPP can be detected. The internal AGC loop regu-
lates the detecting signal amplitude when the input
level is greater than approximately 20 mVPP. This
signal ampli tude i s cal led “AGC -active level ”. The AG C
loop reg ulates the inpu t v oltage so that the input signa l
amplitude range will be kept within the linear range of
the detection circuits without saturation. The AGC
Acti ve Sta t us bit ( AGC ACT < 5> ) i n STATUS R e g is t er 7
(Register 5-8) is se t if th e AGC l oop reg ulates th e inp ut
voltage.
Table 5-2 shows the input sensitivity comparison when
the AGCSIG option is us ed. When AGCSIG option bit is
set, the demodulated output is available only when the
AGC loop is active (see Table 5-1). The channel input
sensitivity can be reduced by setting the appropriate
Configuration registers. Configuration Register 3
(Register 5-4), Configuration Register 4 (Register 5-5)
and Configuration Register 5 (Register 5-6) have the
option to reduce each channel gain from 0 dB to
approximately -30 dB.
OEH
<1:0> OEL
<1:0> TOEH
(ms) TOEL
(ms) TOET
(ms)
01 00 113
01 01 113
01 10 124
01 11 146
10 00 214
10 01 214
10 10 225
10 11 248
11 00 416
11 01 416
11 10 428
11 11 4410
00 XX Filter Disabled
Note 1: The timing values of TOEH and TOEL are
minimum and TOET is maximu m at room
temperature and VDD = 3.0V, 32 kHz
oscillator.
2005-2013 Microchip Technology Inc. DS21981B-page 39
MCP2030
TABLE 5-2: INPUT SENSITIVITY VS. MODULATED SIGNAL STRENGTH SETTING (AGCSIG <7>)
5.17 Input Channels (Enable/Disable)
Each channel can be individually enabled or disabled
by programm ing bits in Configuration Register 0<3:1>
(Register 5-1).
The purpos e o f having an option to dis abl e a p a rtic ul ar
channel is to minimize current draw by powering down
as much circuitry as possible, if the channel is not
needed for o peratio n. The exact circu it s disa ble d when
an input is disabled are amplifiers, detector, full-wave
rectifier , data slicer, and modu lati on FET. Howev er, the
RF input limiter remains active to protect the silicon
from excessive antenna input voltages.
5.18 AGC Amplifier
The circuit automatically amplifies input signal voltage
levels to an acceptable level for the data slicer. Fast
attack and slow release by nature, the AGC tracks the
carrier signal level and not the mo dulated data bits.
The AGC inherently tracks the strongest of the three
antenna input signals. The AGC requires an AGC
initialization time (TAGC).
The AGC will attempt to regulate a channel’s peak
signal volt age into the data s licer to a desired regu lated
AGC voltage – reducing the input path’s gain as the
signal lev el attempts to in cre ase above regula ted AG C
voltage, and allowing full amplification on signal levels
below th e regulated AGC voltage.
The AGC has two modes of operation:
1. During the AGC initialization time (TAGC), the
AGC time constant is fast, allowing a reasonably
short acquisition time of the continuous input
signal.
2. After TAGC, the AGC switches to a slower time
constant for data slicing.
Also, the AGC is fro zen when the input sig nal enve lope
is low. The AGC tracks only high envelope levels.
5.19 AGC Preserve
The AGC preserve featu re is used to preserve the AGC
value during the AGC initialization time (TAGC) and
apply the value to the data slicing circuit for the follow-
ing dat a stream s instead of using a new tracki ng valu e.
This feature is useful to demodulate the input signal
correctly when the input has random amplitude varia-
tions at a given time period. This feature is enabled
when the device receives an AGC Preserve On com-
mand and disabled if it receives an AGC Preserve Off
command. Once the AGC Preserve On command is
received, the device acquires a new AGC value during
each AGC initialization time and preserves the value
until a Soft Reset o r an A GC Pre se rve Off comman d i s
issued. Therefore, it does not need to issue another
AGC Preserve On command. An AGC Preserve Off
command is needed to disable the AGC preserve
feature (see Section 5.31.2.5 “AGC Preserve On
Command” and Section 5.31.2.6 “AGC Preserve Off
Command” for AGC Preserve comman ds).
AGCSIG<7>
(Config. Register 5) Description Input
Sensitivity
(Typical)
0Option Disabled – Detect any input signal level (demodulated data and
carrier clock). 3.0 mVPP
1Option Enabled – No output until AGC Status = 1 (i.e., VPEAK 20 mVPP)
(demodulated data and carrier clock).
• Provides the best signal to noise ratio.
20 mVPP
MCP2030
DS21981B-page 40 2005-2013 Microchip Technology Inc.
5.20 Soft Reset
The Soft Reset is issued in the following events:
a) After Power-on Reset (POR),
b) After Inactivity timer time-out,
c) If an “Abort” occurs,
d) After receiving SPI Soft Reset command.
The “Abort” occurs if there is no positive signal
detected at the end of the AGC initialization period
(TAGC). The Soft Reset initializes internal circuits and
brings the device into a low current Standby mode
operatio n. The internal circuits that are initializ ed by the
Soft Reset include:
• Output Enab le Fil ter
•AGC circuits
• Demodulator
• 32 kHz Internal Oscillator
The Soft Reset has no effect on the Configuration register
setup, except for some of the AFE STATUS Register 7
bits. (Register 5-8).
The circuit initialization takes one internal clock cycle
(1/32 kHz = 31.25 s). During the initialization, the
modulation transistors between each input and
LCCOM pins are turned-on to discharge any internal/
external parasitic charges. The modulation transistors
are turned-off immediately after the initialization time.
The Sof t Reset i s executed in Active mo de only. It is n ot
valid in Standby mode.
5.21 Minimum Modulation Depth
Requirement for Input Signal
The device demodulates the modulated input signal if
the modulation depth of the input signal is greater than
the minimum requirement that is programmed in
Configuration Register 5 (Register 5-6). Figure 5-5
shows the definition of the modulation depth and
examples. MO DMIN<6:5> of the C onfigu ration R egister
5 offer four options. They are 60%, 33%, 14% and 6%.
The default setting is 33%.
The purpose of this feature is to enhance the
demodulation integrity of the input signal. The 6%
setting is the bes t cho ice for t he in put si gna l with w ea k
modulation depth, which is typically observed near the
high-voltage base station antenna and also at far-
distance from the base station antenna. It gives the
best demodula tio n sensit ivi ty, but is very sus ceptib le to
noise sp ikes that can resul t in a bit dete ction error. The
60% setti ng can redu ce the bit errors ca use d by no is e,
but gives the least demodulation sensitivity. See
Table 5-3 for minimum modulation depth requirement
settings.
TABLE 5-3: SETTING FOR MINIMUM
MODULATION DEPTH
REQUIREMENT
MODMIN Bits
(Config. Register 5) Modulation Depth
Bit 6 Bit 5
00 33% (default)
01 60%
10 14%
11 8%
2005-2013 Microchip Technology Inc. DS21981B-page 41
MCP2030
FIGURE 5-5: Modulation Depth Examples.
(a) Modulation Depth Definition
(b) Input signal vs. minimum modulation depth setting vs. LFDATA output
BA
A - B
A + B X 100%
Modulation Depth (%) = 10 - 7
10 + 7 X 100% = 17.64%
Amplitude 10 mVPP
7 mVPP
Amplitude
Modulation Depth (%) =
t
t
Demodulated LFDATA Output when MODMIN Setting = 14%
Demodulated LFDATA Output if MODMIN Setting = 33%
Input signal with modulatio n depth = 17 .64%
Coil Input Strength
Amplitude
0
(LFDATA output = not toggled)
t
t
(LFDATA output = toggled)
Input Signal
Input Signal
MCP2030
DS21981B-page 42 2005-2013 Microchip Technology Inc.
5.22 Low-Current Sleep Mode
The device can stay at an ultra low-current mode
(Sleep mode) when it receives a Sleep command via
the Serial Peripheral Interface (SPI). All circuits includ-
ing the RF Limiter, except the minimum circuitry
required to retain register memory and SPI capability,
will be powered down to minimize the current draw.
Power-on Reset or any SPI command, other than the
Sleep command, is required to wake the device from
Sleep.
5.23 Low-Current Standby Mode
The device is in Standby mode when no input signal is
present on the input pins, but is powered and ready to
receive any incoming signals.
5.24 Low-Current Active Mode
The device is in Low-Current Active mode when an
input signal is present on any input pin and internal
circuitry is switching with the received data.
5.25 Error Detection of Configuration
Register Data
The Configuration registers are volatile memory.
Therefore, the contents of the registers can be cor-
rupted or cleared by any electrical incidence such as
battery di sc on nec t. To ensure dat a inte gri t y, the devic e
has an error detection mechanism using row and col-
umn parity bits of the Configuration register memory
map. The bit 0 of e ac h reg is ter i s a ro w parity bit whic h
is calculated ov er the eight Configuration bits (from bit
1 to b it 8). The Col umn Pari ty Reg ister ( Configu ration
Register 6) holds column parity bits; each bit is calcu-
lated over the respective columns (Configuration regis-
ters 0 to 5) of the Configuration bits. The STATUS
register is not inc luded for t he colum n parity bit calcul a-
tion. Parity is to be odd. The parity bit set or cleared
makes an odd number of set bits. The user needs to
calculate the row and column parity bits using the
contents of the registers and program them. During
operation, the device continuously calculates the row
and column parity bits of the configuration memory
map. If a parity error occurs, the device lowers the
SCLK/ALERT pin (interrupting the microcontroller
section) indicating the configuration memory has been
corrupted or unloaded and needs to be reprogrammed.
At an initial condition after a Power-on Reset, the
values of the registers are all clear (default condition).
Therefore, the device will issue the parity bit error by
lowering the SCLK/ALERT p in. If the us er repr ogra ms
the registers with the correct parity bits, the SCLK/
ALERT pin will be toggled to logic high level
immediately.
The parity bit errors do not change or affect any
functional operation.
Table 5-4 sh ows an exam ple of the register va lues an d
corresp onding parity bits.
TABLE 5-4: CONFIGURATION REGISTER PARITY BIT EXAMPLE
Register Name Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
(Row Parity)
Conf iguration Register 0 10101000 0
Conf iguration Register 1 00000000 1
Conf iguration Register 2 00000000 1
Conf iguration Register 3 00000000 1
Conf iguration Register 4 00000000 1
Conf iguration Register 5 10000000 0
Conf iguration Register 6
(Column Parity Register) 11010111 1
2005-2013 Microchip Technology Inc. DS21981B-page 43
MCP2030
5.26 Factory Cali bration
The dev ice is cal ibrated du ring probe test to reduc e the
device-to-device variation in standby current, internal
timing and sensitivity, as well as channel-to-channel
sensitivity variation.
5.27 De-Q’ing of Antenna Circuit
When the transponder is close to the base station, the
transponder coil may develop coil voltage higher than
VDE_Q. This condition is called “near field”. The device
detects the strong near field signal through the AGC
control, and de-Q’ing the antenna circuit to reduce the
input signal amplitude.
5.28 Demodulator
The demodulator recovers the modulation data from
the received signal, containing carrier plus data, by
appropriate envelope detection. The demodulator has
a fast rise (charge) time (TDR) and a fall time (TDF)
appropriate to an envelope of input signal (see
Secti on 1 .0 “E lect r ical Spec ific at io n s” for TDR and
TDF specifications). The demodulator contains the
full-wave rectifier, low-pass filter, peak detector and
data slicer.
FIGURE 5-6: Demodulator Charge and Discharge.
5.29 Power-On Reset
This circuit remains in a Reset state until a sufficient
supply voltage i s applied. Th e Reset release s when the
supply is sufficient for correct device operation,
nominally VPOR.
The C onfigu ration regis ters a re all cleared on a Pow er-
on Re se t. A s the C onf i gu ra t io n reg i ster s a re pr o tec t ed
by odd row and column parity, the ALERT pin will be
pulled down – indicating to the ext erna l m ic roc ontroller
section that the configuration memory is cleared and
requires new programming.
5.30 LFDATA Output Selection
The LFDATA output can be configured to pass the
Demodulator output, Received Signal Strength Indi-
cator (RSSI) output, or Carrier Clock (CCLK). See
Configuration Register 1 (Register 5-2) for more
details.
5.30.1 DEMODULATOR OUTPUT
The demodulator output is the default configuration of
the output selection. This is the output of an envelope
detection circuit. See Figure 5-6 for the demodulator
output.
For a clea n dat a outp ut or to s ave op erating power, the
input c hannels can b e in div id ual ly enabled or di sab led.
If more than one channel is enabled, the output is the
sum of each output of all enabled channels. There will
be no valid output if all three channels are disabled.
When th e demod ulated output is select ed, th e output is
available in two different conditions depending on how
the options of Configuration Register 0 (Register 5-1)
are set: Output Enable Filter is disabled or enabled.
See Section 2.0 “Typical Performance Curves” for
various demodulated data output.
Related Configuration register bits:
• Configuration Register 1 (Register 5-2),
DATOUT <8:7>:
bit 8 bit 7
00: Demodulator Output
01: Carrier Clock Output
10: RSSI Output
01: RSSI Output
• Configuration Register 0 (Register 5-1): all bits
Full-wave Rectifier output
Input at LC input pins
Demodulated LFDATA output
TDR TDF
MCP2030
DS21981B-page 44 2005-2013 Microchip Technology Inc.
5.30.2 CARRIER CLOCK OUTPUT
When t h e c ar ri e r c loc k o ut p ut is s elec t ed , t he LF D ATA
output is a square pulse of the input carrier clock and
available as soon as the AGC stabilization time (TAGC)
is completed. There are two Configuration register
options for the carrier clock output: (a) clock divide-by
one or (b) clock divide-by four, depending on bit
DATOUT<7> of Configuration Register 2 (Register 5-
3). The carrier clock output is available immediately
after the AGC settling time. The Output Enable Filter,
AGCSIG, and MODMIN options are applicable for the
carrier clock output in the same way as the demodu-
lated output. The input channel can be individually
enabled or disabled for the output. If more than one
channel is enabled, the output is the sum of each out-
put of all ena bled channels . Therefore, the carrier cl ock
output waveform is not as precise as when only one
channel is enabled. It is recommended to enable one
channel only if a precise output waveform is desired.
There will be no valid output if all three channels are
disabled. See Figure 2-32 for carrier clock output
examples.
Related Configuration register bits:
• Configuration Register 1 (Register 5-2),
DATOUT <8:7>:
bit 8 bit 7
00: Demodulato r Output
01: Carrier Clock Output
10: RSSI Output
11: RSSI Output
• Configuration Register 2 (Register 5-3), CLK-
DIV<7>:
0: Carrier Clock/1
1: Carrier Clock/4
• Configuration Register 0 (Register 5-1): all bits
are affected
• Configuration Register 5 (Register 5-6)
5.30.3 RECEIVED SIGNAL S TRENGTH
INDICATOR (RSSI) OUTPUT
An analog current output is available at the RSSI pin
when the Received Signal Strength Indicator (RSSI)
output is selected by the Configuration register. The
analog c urren t i s lin early pr opor tiona l to th e in put sign al
strength.
All timers in the circuit, such as inactivity timer, alarm
timer, and AGC initialization time, are disabled during
the RSSI mode. Therefore, the RSSI output is not
affected by the AGC stabilization time, and available
immediately when the RSSI option is selected. The
device enters Acti ve mode im mediately w hen the RSSI
output is selected.
When the d ev ic e rec eive s an SPI c om mand d urin g th e
RSSI output, the RSSI mode is temporary disabled
until the SPI communication is completed. It returns to
the RSSI mode again after the SPI communication is
completed. The RSSI mode is held until another
output type is selected (CS low turns off the RSSI
signal). To obtain the RSSI out put for a partic ular in put
channel, or to save operating power, the input channel
can be individually enabled or disabled. If more than
one channel is enabled, the RSSI output is from the
strongest signal channel. There will be no valid output
if all three channels are disabled.
The RSSI output current is linearly proportional to the
input signal strength. There are variations between
channel to channel and device to device. See
Figure 2-13 for examples. The linearity (ILRRSSI) of
the RSSI output current is tested by sampling the
outputs for three input points: 37 mVPP, 100 mVPP,
and 370 mVPP. The RSSI output current for 100 mVPP
of input signal is compared with the expected output
current obtained from the line that is connecting the
two endpoints (37 mVPP and 370 mVPP). Equation 5-1
and Figure 5-7 show the details for the RSSI linearity
specification.
EQUATION 5-1: RSSI LINEARITY
SPECIFICATION
FIGURE 5-7: RSSI Linearity Test
Example.
ILRRSSI(%) =
Deviat i on at 10 0 mVPP of Input Signal
IRSSI for 37 0 m VPP of I npu t Signal
where,
Deviation at 100 mVPP of Input Signa l =
[IRSSI meas ured - IRSSI expected] at 100 mVPP of input
signal.
IRSSI expected = RSSI current obtained from the line
that is connecting two endpoints (RSSI output currents
for 37 m V PP and 370 mVPP of i npu ts).
x 100%
RSSI Output C ur r e nt [A]
y
x
37 mVPP 100 mVPP 370 mVPP
y = a+bx
= Measured
= Expected
dd = Deviation
Inpu t Signal Amplitud e
2005-2013 Microchip Technology Inc. DS21981B-page 45
MCP2030
Related Configuration register bits:
• Configuration Register 1 (Register 5-2),
DATOUT<8:7>:
bit 8 bit 7
00: Demodu late d Output
01: Carrier Clock Output
10: RSSI Output
11: RSSI Output
• Configuration Register 2 (Register 5-3),
RSSIFET<8>:
0: Pull-Down MOSFET of f
1: Pull-Down MO SFET on.
• Configuration Register 0 (Register 5-1): all bits
are affected.
FIGURE 5-8: RSSI Output Path.
Note: The pull-down MOSFET option is valid
only when the RSSI output is selected.
The MOSFET is not controllable by users
when demodulated or carrier clock output
option is selected.
RSSI Output Cur ren t
Generator
VDD
(controlled by Config. 2, bit 8)
RSSI Pull-down MOSFET
Curr ent Out put
LFDATA/CCLK Pin
RSSIFET(1)
Off
if RSSI active
RSSI Pin
Note 1: The RSSIFET is used to discharge any external
capacitor that is connected at the LFDATA pin.
MCP2030
DS21981B-page 46 2005-2013 Microchip Technology Inc.
5.30.3.1 ANALOG-TO-DIGITAL DATA
CONVERSION OF RSSI SIGNAL
The RSSI output is an analog current. It needs an
external Analog-to-Digital (ADC) data conversion
device for digitized output. The ADC data conversion
can be accomplished by using a stand-alone external
ADC device, an external MCU that has internal ADC
features , or an external MCU that has no ADC features
but instead uses firmware. The RSSIFET is used to
discharge any external charge on the LFDATA pin in
the RSSI Output mode. The MOSFET can be turned on
or off with bit RSSIFET<8> of Configuration Register 2
(Register 5-3). When it is turned on, the internal
MOSFET provides a discharge path for the external
capacitor that is connected at the LFDATA pin. This
MOSFET opti on is valid on ly if RSSI outp ut is sele cte d
and not controllable by users for demodulated or carrier
clock output options.
See separate appl ication notes for various external ADC
implement a tion method s for this devi ce.
See Figure 5-8 for RSSI output path.
5.31 Configuration Registers
5.31.1 SPI COMMUNICATION
The SPI communication is used to read from or write to
the Confi gu ratio n reg isters and to send comma nd-o nl y
messages. Three pins are used for SPI
communication: CS, SCLK/ALERT, and LFDA T A /RSSI/
CCLK/SDIO. Figure 5-9, Figure 5-10 and Figure 5-11
show examples of the SPI communication sequences.
When these pins are connected to the external MCU
I/O pins, the following are needed:
CS
• Pin is permanently an input with an internal pull-up.
SCLK/ALERT
• Pin is an open collector output when CS is high.
An inter nal pull- up resistor exists to ens ure no
spurious SPI communication between powering
and the MCU configuring its pins. This pin
becomes the SPI clock input when CS is low.
LFDATA/CCLK/SDIO
• Pin is a digital output (LF DATA) so long as CS is
high. During SPI communication, the pin is the
SPI data input (SDI) unless performing a register
Read, where it will be the SPI data outp ut (SDO).
FIGURE 5-9: Power-Up Sequence.
CS
SCLK/ALERT
LFDATA/CCLK/SDIO
ALERT
LFDATA
(output)
(open collect or
CS pulled high by
internal pull-up
MCU pin is input.
MCU pin is input. MCU pin is input.
MCU pin output
Driving CS high
output)
SCLK pulled high
by internal pull-up
2005-2013 Microchip Technology Inc. DS21981B-page 47
MCP2030
FIGURE 5-10: SPI Write Sequence.
CS
SCLK/ALERT
LFDATA/CCLK/SDIO
TSU THD
TCSSC TSCCS
THI TLO
1/FSCLK
TCS1
TCSH
TCS0
ALERT
LFDATA SDI
(output) (input)
(output)
SCLK
(input) ALERT
(output)
Driven low by MCU
Driven low by MCU
LFDATA
(output)
MCU pin to Input
MCU pin to Input
Driven low by MCU
16 Clocks for Write Command, Address and Data
MCU pin to Output
MCU pin still Input
1
2
3
4
5
6
7
MCU SPI Write Details:
1. Drive the open collector ALERT output low.
• to ensure no false clocks occur when CS drops
2. Drop CS.
• SCLK/ALERT becomes SCLK input
• LFDATA/CCLK/SDIO becomes SDI input
3. Change LFDATA/CCLK/SDIO connected pin to output.
• driving SPI data
4. Clock in 16-bit SPI Write sequence – command, address, data and parity bit.
• command, address, data and parity bit
5. Change LFDATA/CCLK/SDIO connected pin to input.
6. Raise CS to complete the SPI Write.
7. Change SCLK/ALE RT back to input.
LSbMSb
MCP2030
DS21981B-page 48 2005-2013 Microchip Technology Inc.
FIGURE 5-11: SPI Read Sequence.
CS
LFDATA/RSSI/
CCLK/SDIO
Driven low by MCU
T
SU
T
HD
T
SCCS
T
HI
T
LO
1/F
SCLK
T
CS1
T
CSH
T
CS0
SDI
(input)
SCLK
(input) ALERT
(output)
LFDATA
(output)
MCU pin to Input
MCU pin to Input
Driven low by MCU
MCU pin to Output
16 Clocks for Read Command, T
CSSC
T
CSSC
T
CS
1
T
CSH
T
CS0
SDO
SCLK
(input) ALERT
(output)
LFDATA
(output)
MCU pin to Input
Driven low by MCU
16 Clocks for Read Result
(output)
SCLK/ALERT
ALERT
LFDATA
(output)
(output)
Driven low by MCU
MCU pin still Input
1
2
3
4
5
67
8
9
10
T
DO
MSb LSb
T
CSSC
Address and Dummy Data
MCU SPI Read Details:
1. Drive the open collector ALERT output low.
• To ensure no false clocks occur when CS drops.
2. Drop CS
• SCLK/ALERT becomes SCLK input.
• LFDATA/CCLK/SDIO becomes SDI input.
3. Change LFDATA/CCLK/SDIO connected pin to output.
• Driving SPI data.
4. Clock in 16-bit SPI Read sequence.
• Command, address and dummy data.
5. Change LFDATA/CCLK/SDIO connected pin to input.
6. Raise CS to complete the SPI Read entry of command and address.
7. Drop CS.
•AFE SCLK/ALERT becomes SCLK input.
• LFDATA/CCLK/SDIO becomes SDO output.
8. Clock out 16-bit SPI R ead result.
• First seven bits clocked-out are dummy bits.
• Next eight bits are the Configuration register data.
• The last bit is the Configuration register row parity bit.
9. Raise CS to complete the SPI Read.
10. Change SCLK/ALERT back to input.
Note: The TCSH is considered as one clock. Therefore, the
Configuration register data appears at 6th clock after TCSH.
2005-2013 Microchip Technology Inc. DS21981B-page 49
MCP2030
5.31.2 COMMAND DECODER/
CONTROLLER
The circuit executes 8 SPI commands from the external
MCU. The command structure is:
Command (3 bits) + Configuration Address (4 bits) +
Data Byte and Row Parity Bit with the Most Significant
bit first. Table 5-5 shows the available SPI commands.
The device operates in SPI mode 0,0. In mode 0,0 the
clock idles in the low state (Figure 5-12). SDI data is
loaded into the device on the rising edge of SCLK and
SDO data is clocked out on the falling edge of SCLK.
There must be multiples of 16 clocks (SCLK) while CS
is low or commands will abort.
TABLE 5-5: SPI COMMANDS
Command Address Data Row
Parity Description
Command only – Address and Data are “Don’t Care”, but need to be clocked in regardless.
000 XXXX XXXX XXXX X Clamp on – enable modulation circuit
001 XXXX XXXX XXXX X Clamp off – disable modulation circuit
010 XXXX XXXX XXXX X Enter Sleep mode (any other command wakes th e AFE)
011 XXXX XXXX XXXX X AGC Pre ser ve On – to temp orarily prese rve the c urrent AG C level
100 XXXX XXXX XXXX X AGC Preserve Off – AGC again tracks strongest input signal
101 XXXX XXXX XXXX X Soft Reset – resets various circuit blocks
Read Command – Data will be read from the specified register address.
110 0000 Config Byte 0 P General – options that may change during normal operation
0001 Config Byte 1 P LCX antenna tuning and LFDATA output format
0010 Config Byte 2 P LCY antenna tuning
0011 Config Byte 3 P LCZ antenna tuning
0100 Config Byte 4 P LCX and LCY sensitivity reduction
0101 Config Byte 5 P LCZ sensitivity reduction and modulation depth
0110 Column Parity P Column parity byte for Config Byte 0 -> Config Byte 5
0111 Status X Status – pari ty error, which input is active, etc.
Write Command – Data will be written to the specified register address.
111 0000 Config Byte 0 P Output enable filter, channel enable/disable, etc.
0001 Config Byte 1 P LCX antenna tuning and LFDATA output type
0010 Config Byte 2 P LCY antenna tuning
0011 Config Byte 3 P LCZ antenna tuning
0100 Config Byte 4 P LCX and LCY sensitivity reduction
0101 Config Byte 5 P LCZ sensitivity reduction and modulation depth
0110 Column Parity P Column parity byte for Config Byte 0 -> Config Byte 5
0111 Not Used X Register is readable, but not writable
Note: ‘P’ denotes the row parity bit (odd parity) for the respective data byte.
MCP2030
DS21981B-page 50 2005-2013 Microchip Technology Inc.
FIGURE 5-12: Detailed SPI Timing (AFE).
5.31.2.1 Clamp On Comman d
This command results in activating (turning on) the
modulation transistors of all enab led channels; channels
enabled in Configuration Regis ter 0 (Register 5-1).
5.31.2.2 Clamp Off Command
This command results in deactivating (turning off) the
modulation transistors of all channels.
5.31.2.3 Sleep Command
This command places the device in Sleep mode –
minimizing current draw by disabling all but the
essential circuitry. Any other command wakes the
device from Sleep (e.g., Clamp Off command).
5.31.2.4 Soft Reset Command
The device issues a Soft Reset when it receives an
external Soft Rese t comma nd. The e xterna l Sof t Reset
comma nd is typic ally used to end a SPI comm unication
sequence or to initialize the device for the next signal
detection sequence, etc. See Section 5.20 “Soft
Reset” for more details on Soft Reset.
If a Soft Reset command is sent during a “Clamp-on”
condition, the device still keeps the “Clamp-on” condi-
tion after the Soft Reset execution. The Soft Reset is
executed in Active mode only, not in Standby mode.
The SPI Sof t Res et command is igno red if the d evice i s
not in Active mode.
5.31.2.5 AGC Preserve On Command
This command results in preserving the AGC level
during ea ch AGC ini tializ ation t ime an d ap ply th e valu e
to the data slicing circuit for the following data stream.
The prese rved AGC val ue is reset by a Sof t Rese t, and
a new AGC value is acquired and preserved when it
starts a new AGC initialization time. This feature is
disabled by an AGC Preserve Off command (see
Section 5.19 “AGC Pr eserve”).
5.31.2.6 AGC Preserve Off Command
This co mm and disables t he AGC preserve fe ature and
returns to the normal AGC track ing mode, fas t trackin g
during AGC settling time and slow tracking after that
(see Section 5.19 “AGC Preserve”).
5.31.3 READ/WRITE COMMANDS FOR
CONFIGURATION REGISTERS
The device includes 8 Configuration registers, includ-
ing a Column Parity register and STATUS register. All
registers are readable and writable via SPI, except the
STATUS register, which is read-only. Bit 0 of each
register is a row p ari ty bi t (except for STATUS Regist er
7) that makes the register contents an odd number.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
bit 2
CS
SCLK
SDIO
Command Data Byte
bit 0
bit 8
bit 1
Address Row
Parity Bit
bit 0
bit 3
MSb LSb
bit 0
2005-2013 Microchip Technology Inc. DS21981B-page 51
MCP2030
TABLE 5-6: CONFIGURATION REGISTERS SUMMARY
REGISTER 5-1: CONFIGURATION REGISTER 0 (ADDRESS: 0000)
Register Name Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Configuration Register 0 OEH OEL ALRTIND LCZEN LCYEN LCXEN R0PAR
Configuration Register 1 DATOUT Channel X Tuning Capacitor R1PAR
Configuration Register 2 RSSIFET CLKDIV Channel Y Tuning Capacitor R2PAR
Configuration Register 3 Unimplemented Channel Z Tuning Capacitor R3PAR
Configuration Register 4 Channel X Sensitivity Control Channel Y Sensitivity Control R 4PAR
Configuration Register 5 AUTOCHSEL AGCSIG MODMIN MODM IN Channel Z Sensitivity Control R5PAR
Column Parity Register 6 Column Parity Bits R6PAR
STATUS Register 7 Ac tive Channel Indicators AGCACT Wake-up Channel Indicators ALARM PEI
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
OEH1 OEH0 OEL1 OEL0 ALRTIND LCZEN LCYEN LCXEN R0PAR
bit 8 bit 0
bit 8-7 OEH<1:0>: Output Enable Filter High Time (TOEH) bit
00 = Output Enable Filter disabled (no wake-up sequence required, passes all signal to LFDATA)
01 =1ms
10 =2ms
11 =4ms
bit 6-5 OEL<1:0>: Output Enable Filter Low Time (TOEL) bit
00 =1ms
01 =1ms
10 =2ms
11 =4ms
bit 4 ALRTIND: ALERT bit, output triggered by:
1 = Parity error and/or expired Alarm timer (receiving noise, see Section 5.14.3 “Alarm Timer”)
0 = Parity error
bit 3 LCZEN: LCZ Enable bit
1 = Disabled
0 = Enabled
bit 2 LCYEN: LCY Enable bit
1 = Disabled
0 = Enabled
bit 1 LCXEN: LCX Enable bit
1 = Disabled
0 = Enabled
bit 0 R0PAR: Register 0 Parity bit – set/cleared so the 9-bit register contains odd parity – an odd number of
set bits
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is c leared x = Bit is unknown
MCP2030
DS21981B-page 52 2005-2013 Microchip Technology Inc.
REGISTER 5-2: CONFIGURATION REGISTER 1 (ADDRESS: 0001)
REGISTER 5-3: CONFIGURATION REGISTER 2 (ADDRESS: 0010)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DATOUT
1DATOUT
0LCXTUN5 LCXTUN4 LCXTUN3 LCXTUN2 LCXTUN1 LCXTUN0 R1PAR
bit 8 bit 0
bit 8-7 DATOUT<1:0>: LFDATA Output type bit
00 =Demodulated output
01 =Carrier clock output
10 =RSSI output
11 =RSSI output
bit 6-1 LCXTUN<5:0>: LCX Tuning Capacitance bit
000000 = +0 pF (Default)
:
111111 = +63 pF
bit 0 R1PAR: Register 1 Parity Bit – set/cleared so the 9-bit register contains odd parity – an odd number of set bits
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RSSIFET CLKDIV LCYTUN5 LCYTUN4 LCYTUN3 LCYTUN2 LCYTUN1 LCYTUN0 R2PAR
bit 8 bit 0
bit 8 RSSIFET: Pull-down MOSFET on LFDATA pad bit (controllable by user in the RSSI mode only)
1 = Pull-down RSSI MOSFET on
0 = Pull-down RSSI MOSFET off
bit 7 C LKDIV: Carrier Clock Divide-by bit
1 = Carrier clock/4
0 = Carrier clock/1
bit 6-1 LCYTUN<5:0>: LCY Tuning Capacitance bit
000000 = +0 pF (Default)
:
111111 = +63 pF
bit 0 R2PAR: Register 2 Parity bit – set/cleared so the 9-bit register contains odd parity – an odd number of set bits
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Va lue at POR ‘ 1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
2005-2013 Microchip Technology Inc. DS21981B-page 53
MCP2030
REGISTER 5-4: CONFIGURATION REGISTER 3 (ADDRESS: 0011)
REGISTER 5-5: CONFIGURATION REGISTER 4 (ADDRESS: 0100)
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— LCZTUN5 LCZTUN4 LCZTUN3 LCZTUN2 LCZTUN1 LCZTUN0 R3PAR
bit 8 bit 0
bit 8-7 Unimplemented: Read as ‘0’
bit 6-1 LCZTUN<5:0>: LCZ Tuning Capacitance bit
000000 = +0 pF (Default)
:
111111 = +63 pF
bit 0 R3PAR: Register 3 Parity Bit – set/cleared so the 9-bit register contains odd p arity – an odd number of set bits
Legend:
R = Readable bit W = Writ able bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LCXSEN3 LCXSEN2 LCXSEN1 LCXSEN0 LCYSEN3 LCYSEN2 LCYSEN1 LCYSEN0 R4PAR
bit 8 bit 0
bit 8-5 LCXSEN<3:0>(1): Typical LCX Sensitivity Reduction bit
0000 = -0 dB (Default)
0001 = -2 dB
0010 = -4 dB
0011 = -6 dB
0100 = -8 dB
0101 = -10 dB
0110 = -12 dB
0111 = -14 dB
1000 = -16 dB
1001 = -18 dB
1010 = -20 dB
1011 = -22 dB
1100 = -24 dB
1101 = -26 dB
1110 = -28 dB
1111 = -30 dB
bit 4-1 LCYSEN<3:0>(1): Typical LCY Sensit ivity Reduction bit
0000 = -0 dB (Default)
:
1111 = -30 dB
bit 0 R4PAR: Register 4 Parity bit – set/cleared so the 9-bit register contains odd parity – an odd number of set bits
Note 1: Assured monotonic increment (or decrement) by design.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
MCP2030
DS21981B-page 54 2005-2013 Microchip Technology Inc.
REGISTER 5-6: CONFIGURATION REGISTER 5 (ADDRESS: 0101)
REGISTER 5-7: COLUMN PARITY REGISTER 6 (ADDRESS: 0110)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
AUTOCHSEL AGCSIG MODMIN1 MODMIN0 LCZSEN3 LCZSEN2 LCZSEN1 LCZSEN0 R5PAR
bit 8 bit 0
bit 8 AUTOCHSEL: Auto-Channel Select bit
1 = Enabled – Device selects channel(s) that has demodulator output “high” at the end of TAGC; or otherwise,
blocks the channel(s).
0 = Disabled – Device follows channel enable/disable bits defined in Register 0
bit 7 AGCSIG: Demodulator Output Enable bit, after the AGC loop is active
1 = Enabled – No output until AGC is regulating at around 20 mVPP at input pins. T he AGC A ctive Status bit
is set when the AGC begins regulating.
0 = Disabled – The device passes signal of any level it is capable of detecting
bit 6-5 MODMIN<1:0>: Minimum Modulation Depth bit
00 =33%
01 =60%
10 =14%
11 =8%
bit 4-1 LCZSEN<3:0>(1): LCZ Sensitivity Reduction bit
0000 = -0 dB (Default)
:
1111 = -30 dB
bit 0 R5PAR: Register 5 Parity bit – set/cleared so the 9-bit register contains odd pa rity – an odd number of set bits
Note 1: Assured monotonic increment (or decrement) by design.
Legend:
R = Readable bit W = Writab le bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
COLPAR7 COLPAR6 COLPAR5 COLPAR4 COLPAR3 COLPAR2 COLPAR1 COLPAR0 R6PAR
bit 8 bit 0
bit 8 COLPAR7: Set/Cleared so that this 8th parity bit + the sum of the Config. register row parity bits contain an odd
number of set bits.
bit 7 COLPAR6: Set/Cleared such that this 7th par ity bit + th e sum of the 7th bits in Config. registers 0 thr ough 5 cont ain
an odd number of set bits.
bit 6 COLPAR5: Set/Cleared such that this 6th par ity bit + th e sum of the 6th bits in Config. registers 0 thr ough 5 cont ain
an odd number of set bits.
bit 5 COLPAR4: Set/Cleared such that this 5th par ity bit + th e sum of the 5th bits in Config. registers 0 thr ough 5 cont ain
an odd number of set bits.
bit 4 COLPAR3: Set/Cleared such that this 4th par ity bit + th e sum of the 4th bits in Config. registers 0 thr ough 5 cont ain
an odd number of set bits.
bit 3 COLPAR2: Set/Cleare d such that this 3r d parity bit + the sum of the 3r d bits in Config. regis ters 0 through 5 contain
an odd number of set bits.
bit 2 COLPAR1: Set/Cleared such that this 2nd parity bit + the sum of the 2nd bits in Config. registers 0 through 5 contain
an odd number of set bits.
bit 1 COLPAR0: Set/Cleared s uch that this 1st p arity bit + the sum of the 1st bit s in Config. registers 0 through 5 contai n
an odd number of set bits.
bit 0 R6PAR: Regi ster 6 Parity bit – set/clear ed so the 9-bit register contains odd parity – an odd number of set bits
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
2005-2013 Microchip Technology Inc. DS21981B-page 55
MCP2030
REGISTER 5-8: STATUS REGISTER 7 (ADDRESS: 0111)
See Table 5-7 for th e bit conditions o f the AFE ST A TU S
register after various SPI commands and the AFE
Power-on Reset.
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
CHZACT CHYACT CHXACT AGCACT WAKEZ WAKEY WAKEX ALARM PEI
bit 8 bit 0
bit 8 CHZACT: Channel Z Active(1) bit (cleared via Soft Reset)
1 = Channel Z is passing data after TAGC
0 = Channel Z is not passing data after TAGC
bit 7 CHYACT: Channel Y Active(1) bit (cleared via Soft Reset)
1 = Channel Y is passing data after T AGC
0 = Channel Y is not passing data after TAGC
bit 6 CHXACT: Channel X Active(1) bit (cleared via Soft Reset)
1 = Channel X is passing data after T AGC
0 = Channel X is not passing data after TAGC
bit 5 AGCACT: AGC Active Status bit (real time, cleared via Soft Reset)
1 = AGC is active (Input signal is strong). AGC is active when input signal level is approximately > 20 mVPP
range.
0 = AGC is inactive (Input signal is weak)
bit 4 WAKEZ: Wake-up Channel Z Indicator Status bit (cleared via Soft Reset)
1 = Channel Z caused a device wake-up (pas sed 64 clock counter)
0 = Channel Z did not cause a device wake-up
bit 3 WAKEY: Wake-up Channel Y Indicator Status bit (cleared via Soft Reset)
1 = Channel Y caused a device wake-up (passed 64 clock counter)
0 = Channel Y did not cause a device wake-up
bit 2 WAKEX: Wake-up Channel X Indicator St atus bit (cleared via Soft Reset)
1 = Channel X caused a device wake-up (passed 64 clock counter)
0 = Channel X did not cause a device wake-up
bit 1 ALARM: Indicates whether an Alarm timer time-out has occu rred (cleared via read “STATUS Register
command”)
1 = The Alarm timer time-out has occurred. It may cause the ALERT output to go low depending on the st ate
of bit 4 of the Configuration register 0
0 = The Alarm timer is not timed out
bit 0 PEI: Parity Error Indicator bit – indicates whether a Configuration register parity error has occurred (real time)
1 = A parity error has occurred and caused the ALERT output to go low
0 = A parity error has not occurred
Note 1: Bit is high whenever channel is passing data. Bit is low in Standby mode.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is c leared x = Bit is unknown
MCP2030
DS21981B-page 56 2005-2013 Microchip Technology Inc.
TABLE 5-7: STATUS REGISTER BIT CONDITION
(AFTER POWER-ON RESET AND VARIOUS SPI COMMANDS)
Condition Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
CHZACT CHYACT CHXACT AGCACT WAKEZ WAKEY WAKEX ALARM PEI
POR 0 0 0 0 00001
Read Command
(STATUS Register only) u u u u uuu0u
Sleep Comm and u u u u uuuuu
Soft R eset Execute d(1) 0 0 0 0 000uu
Legend: u = unchanged
Note 1: See Section 5.20 “Soft Reset” and Section 5.31.2.4 “Soft Reset Command” for the condition of Soft
Reset execution.
2005-2013 Microchip Technology Inc. DS21981B-page 57
MCP2030
6.0 PACKAGING INFORMATION
6.1 Package Marking Informat ion
14-Lead PDIP
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
Example
MCP2030-I/P
0510017
14-Lead SOIC
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
Example
MCP2030ISL
0510017
14-Lead TSSOP
XXXXXXXX
YYWW
NNN
Example
2030I
0510
017
3
e
3
e
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanu meric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the fu ll Mic rochip part nu mber ca nnot be m arked o n one lin e, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
MCP2030
DS21981B-page 58 2005-2013 Microchip Technology Inc.
14-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)
E1
n
D
1
2
eB
E
c
A
A1
B
B1
L
A2
p
Units INCHES* MILLIMETERS
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n14 14
Pitch p.100 2.54
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26
Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60
Overall Length D .740 .750 .760 18.80 19.05 19.30
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness c.008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top 51015 51015
51015 51015
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005
§ Significant Characteristic
Note: For the most cu rr e nt pac ka ge dr aw i ngs, p le ase se e t he Mi c ro c hi p Pa ck ag ing Specifica t i on lo ca t ed
at http://www.microchip .com/packaging
2005-2013 Microchip Technology Inc. DS21981B-page 59
MCP2030
14-Lead Plasti c Small Outline (SL) – Narrow, 150 mil Body (SOIC)
Foot A ngle 048048
1512015120
Mold Draft Angle Bottom 1512015120
Mold Draft Angle Top 0.510.420.36.020.017.014BLead Width 0.250.230.20.010.009.008
c
Lead Thickness
1.270.840.41.050.033.016LFoot Length 0.510.380.25.020.015.010hChamfer Distance 8.818.698.56.347.342.337DOverall Length 3.993.903.81.157.154.150
E1
Molded Pa ckag e Width 6.205.995.79.244.236.228EOverall Width 0.250.180.10.010.007.004A1Standoff § 1.551.421.32.061.056.052A2Molded Pa ckag e Thick ness 1.751.551.35.069.061.053AOverall Height 1.27.050
p
Pitch 1414
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
2
1
D
p
n
B
E
E1
h
L
c
45
A2
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-065
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com /p a ckagi ng
MCP2030
DS21981B-page 60 2005-2013 Microchip Technology Inc.
14-Lead Plastic Thin Shrink Small Outl ine (ST) – 4.4 mm Body (TSSOP)
840840
Foot A ngle
10501050
Mold Draft Angle Bottom 10501050
Mold Draft Angle Top 0.300.250.19.012.010.007BLead Width 0.200.150.09.008.006.004
c
Lead Thickness
0.700.600.50.028.024.020LFoot Length 5.105.004.90.201.197.193DMolded Package Length 4.504.404.30.177.173.169E1Molded Pa ckag e Width 6.506.386.25.256.251.246EOverall Width 0.150.100.05.006.004.002A1Standoff § 0.950.900.85.037.035.033A2M ol d ed Packag e Thick ness 1.10.043AOverall Height 0.65.026
p
Pitch 1414
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERS*INCHESUnits
L
c
2
1
D
n
B
p
E1
E
A2A1
A
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2005-2013 Microchip Technology Inc. DS21981B-page 61
MCP2030
APPENDIX A: REVISION HISTORY
Revision B (January 2013)
Added a note to each package outline drawing.
Revision A (November 2005)
• Original Release of this Document.
MCP2030
DS21981B-page 62 2005-2013 Microchip Technology Inc.
NOTES:
2005-2013 Microchip Technology Inc. DS21981B-page 63
MCP2030
PRODUCT IDENTIFICATION SYSTEM
To order or obtain inf orm ation, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX XXX
PatternPackageTemperature
Range
Device
Device: MCP2030: Standard VDD range
MCP2030T: (Tape and Reel)
Temperature Range: I= -40C to +85C
Package: P = PDIP (300 mil, 14-pin)
SL = SOIC (Gull wing, 150 mil body, 14-pin)
ST = TSSOP (4.4 mm, 14-pin)
Examples:
a) MCP2030-I/P: Industrial Temp.,
14LD PDIP.
b) MCP2030-I/SL: Industrial Temp.,
14LD SOIC.
c) MCP2030-I/ST: Industrial Temp.,
14LD TSSOP.
MCP2030
DS21981B-page 64 2005-2013 Microchip Technology Inc.
NOTES:
2005-2013 Microchip Technology Inc. DS21981B-page 65
Information contained in this publication regarding device
applications a nd the lik e is p ro vided on ly for your convenien ce
and may be supers eded by updates. It is y our res po ns i bil it y to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTA RT, PI C32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip T echnology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONIT OR, FanSense, HI-TIDE, In-Circuit Serial
Programm ing, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PI CC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2005-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620769232
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their par ticular Mic rochip Data Sheet.
• Microchip believes that its f amily of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS21981B-page 66 2005-2013 Microchip Technology Inc.
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasc a , IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los A n ge les
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Cop e nha gen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-14 4-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Ma drid
Tel: 34-91-708-08-90
Fax: 34-91-708-08 -91
UK - Wokingham
Tel: 44-118-921- 5869
Fax: 44-118-921-5820
Worldwide Sales and Service
11/29/12
