HCC/HCF4009UB
HCC/HCF4010B
September 1988
HEX BUFFER/CONVERTERS
EY
(Plastic Package)
DESCRIPTION
ORDER CODES :
HCCXXXXBF HCFXXXXBM1
HCFXXXXBEY HCFXXXXBC1
F
(CeramicPackage)
M1
(MicroPackage) C1
(Chip Carrier)
PIN CONNECTIONS
The HCC4009UB/4010B (extended temperature
range) and the HCF4009UB/4010B (intermediate
temperature range) are monolithic integrated cir-
cuits available in 16-lead dual in line plastic or ce-
ramic packages and plastic micropackage.
The HCC/HCF4009UB/4010B are inverting and
.CMOS TO DTL/TTL HEX CONVERTER
.HIGH-TO-LOWLEVELLOGIC CONVERSION
.MULTIPLEXER: 1-TO-6 OR 6-TO-1
.HIGH”SINK” AND ”SOURCE” CURRENT CA-
PABILITY
.5V, 10V AND 15V PARAMETRIC RATINGS
.MAXIMUM INPUT CURRENT OF 100 µAAT
18V OVER FULL
.PACKAGE AND TEMPERATURE RANGE;
100nA AT 18V AND 25oC
.100% TESTED FOR QUIESCENT CURRENT
AT 20V
.MEETSALLREQUIREMENTSOFJEDECTEN-
TATIVE STANDARD N. 13A, ” STANDARD
SPECIFICATIONS FOR DESCRIPTION OF B
SERIESCMOS DEVICES ”
4009UB–INVERTING TYPE
4010B–NON INVERTING TYPE non-inverting Hex Buffer/Converters, respectively.
Both devices can be used asCMOS toTTL or DTL
logic-level converters, as current ”sink” or ”source”
drivers or as multiplexer (1 to 6).
4049UB and 4050B are prefered replacements for
4009UB and 4010B, respectively, in buffer applica-
tions.
4009UB 4010B
1/13
SCHEMATIC DIAGRAM: COS/MOS TO DTL OR TTL CONVERTER (1 of 6 identical units)
ABSOLUTE MAXIMUM RATING
Symbol Parameter Value Unit
VDD * Supply Voltage: HCC Types
HCF Types -0.5 to +20
-0.5 to +18 V
V
ViInput Voltage -0.5 to VDD + 0.5 V
IIDC Input Current (any one input) ±10 mA
Ptot Total Power Dissipation (per package)
Dissipation per Output Transistor
for Top = Full Package Temperature Range
200
100
mW
mW
Top Operating Temperature: HCC Types
HCF Types -55 to +125
-40 to +85
oC
oC
Tstg Storage Temperature -65 to +150 oC
Stressesabove those listedunder ”Absolute Maximum Ratings” maycause permanent damage tothedevice. This isastressratingonly and functional
operation ofthe device at these or any other conditions above thoseindicated in theoperational sections of thisspecification isnotimplied.Exposure
to absolute maximumratingconditions forexternal periods may affect device reliability.
* All voltage values are referred to VSS pinvoltage.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Value Unit
VDD Supply Voltage: HCC Types
HCF Types 3to18
3to15 V
V
V
IInput Voltage 0 to VDD V
Top Operating Temperature: HCC Types
HCF Types -55 to +125
-40 to +85
oC
oC
Connect VCC to DTL or TTLsupply and VDD toCOS/MOS supply
4009UB 4010B
HCC/HCF4009UB HCC/HCF4010B
2/13
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Symbol Parameter Test Conditios Value Unit
VI
(V) VO
(V) |IO|
(µA) VDD
(V) TLOW *25
o
CT
HIGH *
Min. Max. Min. Typ. Max. Min. Max.
ILQuiescent
Current HCC
Types
0/5 5 1 0.02 1 30
µA
0/10 10 2 0.02 2 60
0/15 15 4 0.02 4 120
0/20 20 20 0.04 20 600
HCF
Types
0/5 5 4 0.02 4 30
0/10 10 8 0.02 8 60
0/15 15 16 0.02 16 120
VOH Output High
Voltage 0/5 5 4.95 4.95 4.95 V
0/10 10 9.95 9.95 9.95
0/15 15 14.95 14.95 14.95
VOL Output Low
Voltage 5/0 5 0.05 0.05 0.05 V
10/0 10 0.05 0.05 0.05
15/0 15 0.05 0.05 0.05
VIH Input High
Voltage (4009UB) 0.5 5 4 4 4 V
11088 8
1.5 15 12.5 12.5 12.5
VIH Input High
Voltage (4010B) 4.5 5 3.5 3.5 3.5 V
91077 7
13.5 15 11 11 11
VIL Input Low
Voltage (4009UB) 4.5 5 1 1 1 V
9102 22
13.5 15 2.5 2.5 2.5
VIL Input Low
Voltage (4010B) 0.5 5 1.5 1.5 1.5 V
1103 33
1.5 15 4 4 4
IOH Output
Drive
Current HCC
Types
0/5 2.5 5 -1 -0.8 -1.6 -0.58
mA
0/5 4.6 5 -0.25 -0.2 -0.4 -0.15
0/10 9.5 10 -0.55 -0.45 -0.9 -0.33
0/15 13.5 15 -1.65 -1.5 -3 -1.1
HCF
Types
0/5 2.5 5 -0.9 -0.8 -1.6 -0.65
0/5 4.6 5 -0.23 -0.2 -0.4 -0.18
0/10 9.5 10 -0.5 -0.45 -0.9 -0.38
0/15 13.5 15 -1.6 -1.5 -3 -1.25
IOL Output
Sink
Current
HCC
Types
0/5 0.4 5 3.75 3 4 2.1
mA
0/10 0.5 10 10 8 10 5.6
0/15 1.5 15 30 24 36 16
HCF
Types
0/5 0.4 5 3.6 3 4 2.4
0/10 0.5 10 0.96 8 10 6.4
0/15 1.5 15 40 24 36 1.9
IIH,I
IL Input Leakage
Current 0/18 18 ±0.1 ±10-5 ±0.1 ±1µA
CIInput
Capacitance 4009UB Any Input 15 22.6
4010B 5 7.5 pF
*T
LOW =-55o
CforHCC device: -40 oC forHCF device.
*T
HIGH =+125oCforHCC device: +85 oC for HCF device.
The Noise Margin for both ”1” and”0” level is: 1Vmin.withVDD =5 V, 2 V min. with VDD =10 V, 2.5 V min. withVDD =15V
HCC/HCF4009UB HCC/HCF4010B
3/13
DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb =25o
C, CL=50pF,R
L= 200 KΩ,
typical temperature coefficent for all VDD values is 03 %/oC, all input rise and fall times= 20 ns)
Symbol Parameter Test Conditions Value Unit
VDD (V) VI(V) VCC (V) Min. Typ. Max.
tPLH Propagation Delay Time
(4009UB) 5 5 5 70 140
ns
10 10 10 40 80
10 10 5 35 70
15 15 15 30 60
15 15 5 30 60
tPLH Propagation Delay Time
(4010B) 5 5 5 100 200
ns
10 10 10 50 100
10 10 5 50 100
15 15 15 35 70
15 15 5 35 70
tPHL Propagation Delay Time
(4009UB) 555 3060
ns
10 10 10 20 40
10 10 5 15 30
15 15 15 15 30
15 15 5 10 20
tPHL Propagation Delay Time
(4010B) 5 5 5 65 130
ns
10 10 10 35 70
10 10 5 30 70
15 15 15 25 50
15 15 5 20 40
tTLH Transition Time 5 5 5 150 350 ns
10 10 10 75 150
15 15 15 55 110
tTHL Transition Time 5 5 5 35 70 ns
10 10 10 20 40
15 15 15 15 30
Minimum and Maximum Voltage Transfer Char-
acteristics for 4009UB Typical Voltage Transfer Characteristics As a
Function of Temperature for 4009UB
HCC/HCF4009UB HCC/HCF4010B
4/13
Minimum and Maximum Voltage Transfer Char-
acteristics for 4010B
Minimum and Maximum Voltage Transfer Char-
acteristics for 4010B
Typical Output Los (sink) Current Characteristics
Minimum and Maximum Voltage Transfer Char-
acteristics for 4010B
Typical Voltage Transfer Characteristics As a
Function ot Temperature for 4010B
Minimum output Low (sink) Current Charac-
teristics
HCC/HCF4009UB HCC/HCF4010B
5/13
Typical Output High (source) Current Charac-
teristics
Typical Low to High Propagation Delay Time vs
Load Capacitance for 4009UB
Typical Low to High Propagation Delay Time vs
Load Capacitance for 4010B
Minimum output High (source) Current Charac-
teristics
Typical High to Low Propagation Delay Time vs
Load Capacitance for 4009UB
typical High to Low Propagation Delay Time vs
Load Capacitance for 4010B
HCC/HCF4009UB HCC/HCF4010B
6/13
Typical Low to High Transition Time vs Load Ca-
pacitance Typical High to Low Transition Time vs Load Ca-
pacitance
Typical Dissipation Characteristics
HCC/HCF4009UB HCC/HCF4010B
7/13
QuiescentDevice Current. Noise Immunity.
Input Leakage Current.
TEST CIRCUITS
HCC/HCF4009UB HCC/HCF4010B
8/13
Plastic DIP16 (0.25) MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787
E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
P001C
HCC/HCF4009UB HCC/HCF4010B
9/13
Ceramic DIP16/1 MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 20 0.787
B 7 0.276
D 3.3 0.130
E 0.38 0.015
e3 17.78 0.700
F 2.29 2.79 0.090 0.110
G 0.4 0.55 0.016 0.022
H 1.17 1.52 0.046 0.060
L 0.22 0.31 0.009 0.012
M 0.51 1.27 0.020 0.050
N 10.3 0.406
P 7.8 8.05 0.307 0.317
Q 5.08 0.200
P053D
HCC/HCF4009UB HCC/HCF4010B
10/13
SO16 (Narrow) MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.068
a1 0.1 0.2 0.004 0.007
a2 1.65 0.064
b 0.35 0.46 0.013 0.018
b1 0.19 0.25 0.007 0.010
C 0.5 0.019
c1 45°(typ.)
D 9.8 10 0.385 0.393
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 8.89 0.350
F 3.8 4.0 0.149 0.157
G 4.6 5.3 0.181 0.208
L 0.5 1.27 0.019 0.050
M 0.62 0.024
S8°(max.)
P013H
HCC/HCF4009UB HCC/HCF4010B
11/13
PLCC20 MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 9.78 10.03 0.385 0.395
B 8.89 9.04 0.350 0.356
D 4.2 4.57 0.165 0.180
d1 2.54 0.100
d2 0.56 0.022
E 7.37 8.38 0.290 0.330
e 1.27 0.050
e3 5.08 0.200
F 0.38 0.015
G 0.101 0.004
M 1.27 0.050
M1 1.14 0.045
P027A
HCC/HCF4009UB HCC/HCF4010B
12/13
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronicsassumes no responsability for the
consequences of use of such information nor for any infringementof patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwiseunderany patent or patent rights ofSGS-THOMSON Microelectronics. Specificationsmentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronicsproductsare notauthorizedforuse ascritical componentsin life supportdevices orsystemswithout express
written approval of SGS-THOMSON Microelectonics.
1994 SGS-THOMSON Microelectronics - All RightsReserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands -
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HCC/HCF4009UB HCC/HCF4010B
13/13
