REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED 08-10-31 R. HEBER 11-06-14 C. SAFFLE Add device type 02 and RHA designator "R" requirements. Make changes to 1.2.2, 1.4, and Table I. Make a change to case outline X pin 32 under Figure 2. Add paragraphs 1.5, 4.4.4.1, and Table IIB. A Delete AVCC, DVCC, and tCMIN tests as specified under Table I. - ro Add device type 03 tested at low dose rate. Make change to paragraphs 1.2.2, 1.4, and 1.5. Make changes to footnotes 1/, 2/, and 3/ as specified under Table I. Make change to Table IIB and paragraph 4.4.4.1. -rrp B C Add single event latchup (SEL) testing information for device types 02 and 03. Add paragraph 1.4.1. Delete device class M references. - ro 13-06-18 C. SAFFLE D Add note under Figure 2 terminal connections. - ro 15-12-10 C. SAFFLE REV SHEET REV D D SHEET 15 16 REV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY DAN WONNELL STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil CHECKED BY RAYMOND MONNIN APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A RAYMOND MONNIN DRAWING APPROVAL DATE 04-10-25 REVISION LEVEL D MICROCIRCUIT, DIGITAL-LINEAR, A/D CONVERTER, 14-BIT, 80 MSPS, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-04230 1 OF 16 5962-E110-16 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 R 04230 Federal stock class designator \ RHA designator (see 1.2.1) 02 V X C Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Operating temperature Circuit function 01 AD6645 -35C TC +85C A/D converter, 14-bit, 80 MSPS 02 AD6645 -55C TA +125C 03 AD6645 -55C TA +125C Radiation hardened A/D converter, 14-bit, 80 MSPS Radiation hardened A/D converter, 14-bit, 80 MSPS 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Descriptive designator Terminals See figure 1 52 Package style Quad flat pack with non-conductive tie bars 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04230 A REVISION LEVEL D SHEET 2 1.3 Absolute maximum ratings. 1/ Analog supply voltage (AVCC) .................................................................................................. 0 V dc to 7 V dc Digital supply voltage (DVCC) ................................................................................................... Analog input voltage ................................................................................................................. Analog input current ................................................................................................................. Digital input voltage .................................................................................................................. Digital output current ................................................................................................................ Junction temperature (TJ) ......................................................................................................... Lead temperature (soldering, 10 seconds) ............................................................................... Storage temperature range ...................................................................................................... Thermal resistance, junction-to-case (JC) ............................................................................... 0 V dc to 7 V dc 0 V dc to AVCC 25 mA 0 V dc to AVCC 4 mA +175C +300C -65C to +150C 7.2C/W 1.4 Recommended operating conditions. Analog supply voltage (AVCC) .................................................................................................. 4.75 V dc to 5.25 V dc Digital supply voltage (DVCC) ................................................................................................... 3.0 V dc to 3.6 V dc Case operating temperature range (TC) for device type 01 ...................................................... -35C to +85C Ambient operating temperature range (TA) for device types 02 and 03 ................................... -55C to +125C 1.4.1 Operating performance characteristics. AC performance: TA = +25C, AVCC = 5 V, DVCC = 3.3 V, fC = 82 MSPS, fIN = 175 MHz. Signal to noise ratio (SNR) at -1 dBFS ................................................................................. Signal to noise and distortion (SINAD) at -1 dBFS ............................................................... Worst case second or third harmonic (2nd to 3rd) at -1 dBFS .............................................. Worst case fourth or higher harmonic (4th plus) at -1 dBFS ................................................. 71 dB 70 dB -78 dBc -91 dBc 1.5 Radiation features: Maximum total dose available (dose rate = 50 - 300 rads(Si)/s): Device type 02 ...................................................................................................................... 100 krads(Si) 2/ Maximum total dose available (dose rate 10 mrads(Si)/s): Device type 03 ...................................................................................................................... 50 krads(Si) 3/ Single event phenomenon (SEP): No single event latchup (SEL) occurs at effective linear energy transfer (LET) (see 4.4.4.2): 2 Device types 02 and 03: ....................................................................................................... 80 MeV-cm /mg 4/ ______ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, condition A. 3/ For device type 03, radiation end point limits for the noted parameters are guaranteed for the conditions specified in MIL-STD-883, method 1019, condition D. 4/ Limits are characterized at initial qualification and after any design or process changes that may affect the SEP characteristics, but are not production lot tested unless specified by the customer through the purchase order or contract. For more information on single event effect (SEE) test results, customers are requested to contact the manufacturer. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04230 A REVISION LEVEL D SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. ASTM INTERNATIONAL (ASTM) ASTM F1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of semiconductor Devices. (Copies of these documents are available online at http://www.astm.org or from ASTM International, 100 Barr Harbor Drive, P.O. Box C700, West Conshohocken, PA, 19428-2959). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04230 A REVISION LEVEL D SHEET 4 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Timing waveforms. The timing waveforms shall be as specified on figure 3. 3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the full case operating temperature range for device type 01 and ambient operating temperature range for device types 02 and 03. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuits delivered to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04230 A REVISION LEVEL D SHEET 5 TABLE IA. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ 3/ AVCC = 5 V, DVCC = 3.3 V, fc = 80 MSPS Group A subgroups Device type unless otherwise specified Resolution RES Offset error OE Gain error Min 4/ 5/ Digital supply current Power consumption IDVCC Max All 14 1, 2, 3 All -10 +10 M,D,P,L,R 1 02 -10 +10 M,D,P,L 1 03 -10 +10 1, 2, 3 01 -10 +10 1 02, 03 -10 +10 -14 +14 2,3 IAVCC Unit 1, 2, 3 AE Analog supply current Limits Bits M,D,P,L,R 1 02 -10 +10 M,D,P,L 1 03 -10 +10 1, 2, 3 All 320 M,D,P,L,R 1 02 320 M,D,P,L 1 03 320 1, 2, 3 All 45 M,D,P,L,R 1 02 45 M,D,P,L 1 03 45 1.75 AVCC = 5.0 V DVCC = 3.3 V mV %FS mA mA PD 4/ 1, 2, 3 All Differential input voltage VDIFF 5/ 1, 2, 3 01 0.4 Vp-p Output voltage, logic "1" VOH 1, 2, 3 01 2.85 V 02, 03 2.8 DVCC = 3.3 V, IOH = 0 5/ DVCC = 3.3 V, IOH = 0 4/ Output voltage, logic "0" VOL 1, 2, 3 DVCC = 3.3 V, IOL = 0 5/ DVCC = 3.3 V, IOL = 0 4/ No missing codes 4/ 4,5,6 01 0.5 02, 03 0.5 02, 03 0 W V 0 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04230 A REVISION LEVEL D SHEET 6 TABLE IA. Electrical performance characteristics - continued. Test Symbol Conditions 1/ 2/ 3/ AVCC = 5 V, DVCC = 3.3 V, fc = 80 MSPS Group A subgroups Device type unless otherwise specified Differential non-linearity DNL 6/ 4,5 02, 03 6 Signal to noise ratio (SNR) at -1 dBFS SNR 70.1 MHz 30 MHz 70 MHz Signal to noise ratio and distortion (SINAD) at -1 dBFS SINAD 30 MHz 70 MHz Spurious free dynamic range (SFDR) at -1 dBFS SFDR Worst case second or third harmonic at -1 dBFS 2nd or 30 MHz Worst case fourth or higher harmonic at -1 dBFS 4 th 30 MHz 2.0 4 03 -1 1.5 4, 5, 6 01 68.5 4/ 6/ LSB dB 67 4,5 02, 03 72 6 70.5 4,5 71.5 6 70 4, 5, 6 01 68 4/ 6/ dB 65 4,5 4/ 6/ 4/ 6/ 02, 03 71.5 6 70 4,5 71 6 69.5 4, 5, 6 01 76 4/ 6/ dBc 67 4 4/ 6/ 4/ 6/ 4/ 6/ 02, 03 82 5 80 6 79 4 82 5 80 6 79 4,5 4/ 6/ plus 70 MHz -1 M,D,P,L 3rd 70 MHz 1.5 1.5 4/ 6/ 150.1 MHz -1 -1 4/ 6/ 70.1 MHz Max 02 4/ 6/ 150.1 MHz Min 4 4/ 6/ 70.1 MHz Unit M,D,P,L,R 4/ 6/ 150.1 MHz Limits 02, 03 dB 84 6 80 4,5 84 6 80 dB See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04230 A REVISION LEVEL D SHEET 7 TABLE IA. Electrical performance characteristics - continued. Test Symbol Conditions 1/ 2/ 3/ AVCC = 5 V, DVCC = 3.3 V, fc = 80 MSPS Limits Group A subgroups Device type Unit unless otherwise specified Two tone intermodulation distortion (IMD) rejection IMDR At -7 dBFS, F1, F2 4/ 6/ 7/ ENCODE pulse width HIGH tENCH ENCODE pulse width LOW tENCL Min Max 4, 5, 6 01 75.5 dBc 4/ 5/ 8/ 9, 10, 11 All 5.625 ns 4/ 5/ 8/ 9, 10, 11 All 5.625 ns 4/ 5/ 9, 10, 11 All 1.0 3.1 ns Encode rising to dataready falling tDR Encode rising to dataready rising tE_DR 50% duty cycle 4/ 5/ 9, 10, 11 All 7.3 9.4 ns ENCODE to DATA falling low tE_FL 4/ 5/ 9, 10, 11 All 2.4 7.0 ns ENCODE to DATA rising low tE_RL 4/ 5/ 9, 10, 11 All 1.4 4.7 ns ENCODE to DATA delay (hold time) tH_E 4/ 5/ 9, 10, 11 All 1.4 4.7 ns ENCODE to DATA delay (setup time) tS_E 4/ 5/ 9, 10, 11 All tENC- tENC- tE_FL(MAX) tE_FL(MIN) 5.3 10.0 50% duty cycle 4/ 5/ ns Dataready to DATA delay (hold time) tH_DR 50% duty cycle 4/ 5/ 9/ 9, 10, 11 All 6.6 7.9 ns Dataready to DATA delay (setup time) tS_DR 50% duty cycle 4/ 5/ 9/ 9, 10, 11 All 2.1 5.1 ns 1/ For device type 01; -35C TC +85C. For device types 02 and 03; -55C TA +125C. 2/ Device type 02 supplied to this drawing has been characterized through all levels M, D, P, L, R of irradiation. Device type 03 supplied to this drawing has been characterized through all levels M, D, P, L of irradiation. However, device type 02 is only tested at the "R" level and device type 03 is only tested at the "L" level. Pre and Post irradiation values are identical unless otherwise specified in Table I. When performing post irradiation electrical measurements for any RHA level, TA = +25C. 3/ For device type 02, this part may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A for device type 02 and condition D for device type 03. Device type 03, has been tested at low dose rate. 4/ Not tested post irradiation. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04230 A REVISION LEVEL D SHEET 8 TABLE IA. Electrical performance characteristics - continued. 5/ Parameter tested as part of device initial characterization and after design and process changes. 6/ All AC parameters tested by driving ENCODE and ENCODE differentially. 7/ F1 = 70.1 MHz, F2 = 72.1 MHz. 8/ Parameter is a function of tENCL and tENCH. 9/ Dataready to DATA delay (tH_DR and tS_DR) is dependent on tENC and duty cycle. TABLE IB. SEP test limits. 1/ Device types SEP Temperature Bias VS Linear energy transfer (LET) 02 and 03 No SEL +125C +5.25 V and 3.6 V Effective 2 LET 80 MeV-cm /mg 1/ For single event phenomenon (SEP) test conditions, see 4.4.4.2 herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04230 A REVISION LEVEL D SHEET 9 Case outline X Symbol A A1 A2 A3 b B/C B1 / C1 D/E D1 / E1 e L L1 Inches Millimeters Min Max .099 .131 .090 .120 .063 .077 .019 .031 0.015 BSC .495 .505 .395 .405 1.440 1.460 .575 .585 .040 BSC 1.090 1.110 .590 .610 Min Max 2.155 3.327 2.286 3.048 1.600 1.956 0.483 0.787 0.381 BSC 12.573 12.827 10.033 10.287 36.576 37.084 14.605 14.859 1.016 BSC 27.686 28.194 14.986 15.494 NOTES: 1. The U.S. Government preferred system of measurement is the metric S.I. system. However, since this item was originally designed using inch-pound units of measurements, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. 2. Dimensions B1/C1 identify the exposed heat sink. FIGURE 1. Case outline. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04230 A REVISION LEVEL D SHEET 10 Device types All Device types All Case outline X Case outline X Terminal number Terminal symbol Terminal number Terminal symbol 1 DVCC 27 GND 2 GND 28 AVCC 3 VREF 29 GND 4 GND 30 AVCC 5 ENC 31 Do not connect 6 ENC 32 Do not connect 7 GND 33 DVCC 8 AVCC 34 GND 9 AVCC 35 DMID 10 GND 36 D0 (LSB) 11 AIN 37 D1 12 AIN 38 D2 13 GND 39 D3 14 AVCC 40 D4 15 GND 41 D5 16 AVCC 42 GND 17 GND 43 DVCC 18 AVCC 44 D6 19 GND 45 D7 20 C1 46 D8 21 GND 47 D9 22 AVCC 48 D10 23 GND 49 D11 24 C2 50 D12 25 GND 51 D13 (MSB) 26 AVCC 52 DRY Note: It is required that the exposed paddle be soldered to GND plane to achieve the best electrical and thermal performance. Lid is internally tied to GND via package. FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04230 A REVISION LEVEL D SHEET 11 NOTE: Normally, tA = -500 ps. FIGURE 3. Timing waveforms. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04230 A REVISION LEVEL D SHEET 12 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. 4.2.1 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections, and as specified herein. 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 7 and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04230 A REVISION LEVEL D SHEET 13 TABLE IIA. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-PRF-38535, table III) Device class Q Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Device class V 1 1 1,2,3,4,5,6, 1/ 9,10,11 1,2,3,4,5,6,9, 10,11 1 1,2,3,4,5,6, 1/ 2/ 9,10,11 1,2,3,4,5,6,9,10,11 1 1 1,4 1,4 1 2/ 1/ PDA applies to subgroup 1. 2/ Delta limits as specified in table IIB shall be computed with reference to the previous interim electrical parameters. Delta parameters are excluded from PDA. TABLE IIB. 240 hour burn-in and group C end-point electrical parameters. TA = +25C. Parameter Device type 240 hour delta limits Group C Delta limits Units IAVCC 02, 03 6 6 mA IDVCC 02, 03 2 2 mA OE 02, 03 4 4 mV STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04230 A REVISION LEVEL D SHEET 14 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table IA at TA = +25C 5C, after exposure, to the subgroups specified in table IIA herein. 4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883 method 1019, condition A for device type 01, condition D for device type 02, and as specified herein. 4.4.4.2 Single event phenomena (SEP). When specified in the purchase order or contract, SEP testing shall be performed on class V devices. SEP testing shall be performed on the Standard Evaluation Circuit (SEC) or alternate SEP test vehicle as approved by the qualifying activity at initial qualification and after any design or process changes which may affect the upset or latchup characteristics. Test four devices with zero failures. ASTM F1192 may be used as a guideline when performing SEP testing. The test conditions for SEP are as follows: a. The ion beam angle of incidence shall be between normal to the die surface and 60 to the normal, inclusive (i.e. 0 angle 60). No shadowing of the ion beam due to fixturing or package related effects is allowed. b. The fluence shall be 10 ions/cm . c. The flux shall be between 10 and 10 ions/cm /s. d. The particle range shall be 20 microns in silicon. e. The test temperature shall be +125C and the maximum rated operating temperature 10C for single event latchup testing. f. Bias conditions shall be AVCC = 5.25 V and VCC = 3.6 V for latchup measurements. g. For SEP test limits, see Table IB herein. 7 2 2 5 2 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04230 A REVISION LEVEL D SHEET 15 6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in MIL-HDBK-103 and QML-38535. The vendors listed in MIL-HDBK-103 and QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime-VA and have agreed to this drawing. 6.7 Additional information. When applicable, a copy of the following additional data shall be maintained and available from the device manufacturer: a. RHA test conditions (SEP). b. Occurrence of latchup (SEL). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04230 A REVISION LEVEL D SHEET 16 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 15-12-10 Approved sources of supply for SMD 5962-04230 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-0423001QXC 24355 AD6645ASQ/QMLQ 5962R0423002VXC 24355 AD6645ASQ/QMLR 5962L0423003VXC 24355 AD6645ASQ/QMLL 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 24355 Vendor name and address Analog Devices Route 1 Industrial Park P.O. Box 9106 Norwood, MA 02062 Point of contact: 7910 Triad Center Drive Greensboro, NC 27409-9605 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Analog Devices Inc.: 5962-0423001QXC AD6645-MIL/PCB 5962R0423002VXC 5962L0423003VXC