5962-9223304MEA(IDT) - e2v Aerospace & Defense

REVISIONS

LTR DESCRIPTION DATE (YR-MO-DA) APPROVED

Update the boilerplate to current requirements as specified in MIL-PRF-38535.

Editorial changes throughout. – jak

06-12-06

Thomas M. Hess

REV

SHEET

REV

SHEET

REV STATUS REV A A A A A A A A A A A A A A

OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14

PMIC N/A PREPARED BY

Joseph A. Kerby

STANDARD

MICROCIRCUIT

DRAWING

CHECKED BY

Thomas J. Ricciuti

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

APPROVED BY

Joseph A. DuPay

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

DRAWING APPROVAL DATE

93-06-29

MICROCIRCUIT, DIGITAL, FAST CMOS,

1-OF-8 DECODER WITH ENABLE, TTL

COMPATIBLE INPUTS AND LIMITED OUTPUT

VOLTAGE SWING, MONOLITHIC SILICON

AMSC N/A

REVISION LEVEL

SIZE

CAGE CODE

67268

5962-92233

SHEET

1 OF

DSCC FORM 2233

APR 97 5962-E635-06

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-92233

DEFENSE SUPPLY CENTER COLUMBUS

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REVISION LEVEL

SHEET 2

DSCC FORM 2234

APR 97

1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes M and Q)

and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or

Identifying Number (PIN). When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

1.2 PIN. The PIN is as shown in the following example:

5962 - 92233 01 M E A

Federal

stock class

designator

RHA

designator

(see 1.2.1)

Device

type

(see 1.2.2)

Device

class

designator

Case

outline

(see 1.2.4)

Lead

finish

(see 1.2.5)

\ / (see 1.2.3)

Drawing number

1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels

and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix

A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

1.2.2 Device type(s). The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function

01, 02 54FCT138T 1-of-8 decoder with enable, TTL compatible inputs

and limited output voltage swing

03, 04 54FCT138AT 1-of-8 decoder with enable, TTL compatible inputs

and limited output voltage swing

05, 06 54FCT138CT 1-of-8 decoder with enable, TTL compatible inputs

and limited output voltage swing

1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as

follows:

Device class Device requirements documentation

M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-

JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A

Q or V Certification and qualification to MIL-PRF-38535

1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style

E GDIP1-T16 or CDIP2-T16 16 Dual-in-line

F GDFP2-F16 or CDFP3-F16 16 Flat pack

2 CQCC1-N20 20 Square leadless chip carrier

1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,

appendix A for device class M.

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APR 97

1.3 Absolute maximum ratings. 1/ 2/ 3/

Supply voltage range (VCC) ........................................................................... -0.5 V dc to +7.0 V dc

DC input voltage range (VIN) ......................................................................... -0.5 V dc to VCC + 0.5 V dc 4/

DC output voltage range (VOUT) .................................................................... -0.5 V dc to VCC + 0.5 V dc 4/

DC input clamp current (IIK) (VIN = -0.5 V).................................................... -20 mA

DC output clamp current (IOK) (VOUT = -0.5 V and +7.0 V) ............................ ±20 mA

DC output source current (per output) (IOH) .................................................. -30 mA

DC output sink current (per output) (IOL) ....................................................... +70 mA

DC VCC current (ICC) ..................................................................................... ±252 mA

DC GND current (IGND) ................................................................................. +572 mA

Storage temperature range (TSTG) ................................................................ -65°C to +150°C

Case temperature range under bias (TBIAS) .................................................. -65°C to +135°C

Maximum power dissipation (PD) .................................................................. 500 mW

Lead temperature (soldering, 10 seconds).................................................... +300°C

Thermal resistance, junction-to-case (θJC) .................................................... See MIL-STD-1835

Junction temperature (TJ) ............................................................................. +175°C

1.4 Recommended operating conditions 2/ 3/

Supply voltage range (VCC) ........................................................................... +4.5 V dc to +5.5 V dc

Input voltage range (VIN) ............................................................................... 0.0 V to VCC

Output voltage range (VOUT).......................................................................... 0.0 V to VCC

Maximum low level input voltage (VIL)........................................................... 0.8 V

Minimum high level input voltage (VIH).......................................................... 2.0 V

Case operating temperature range (TC) ........................................................ -55°C to +125°C

Maximum input rise or fall rate (tr, tf):

(from VIN = 0.3 V to 2.7 V, 2.7 V to 0.3 V) .................................................. 5 ns/V

Maximum high level output current (IOH):

Devices 01, 03, and 05 ............................................................................... -12 mA

Devices 02, 04, and 06 ............................................................................... -6 mA

Maximum low level output current (IOL) ......................................................... 32 mA

1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade performance and affect reliability.

2/ Unless otherwise noted, all voltages are referenced to GND.

3/ The limits for the parameters specified shall apply over the full specified VCC range and case temperature range of

-55°C to +125°C.

4/ For VCC ≥ 6.5 V, the upper limit on the range is limited to 7.0 V.

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REVISION LEVEL

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DSCC FORM 2234

APR 97

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from

the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level C devices and as specified

herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Truth table. The truth table shall be as specified on figure 2.

3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3.

3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full

case operating temperature range. Test conditions for these specified characteristics and limits are as specified in table I.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are defined in table I.

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3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer

has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be

marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be

in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a

QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a

certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in

MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of

supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of

MIL-PRF-38535 and herein or for device class M the requirements of MIL-PRF-38535, appendix A and herein.

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for

device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.

3.8 Notification of change for device class M. For device class M notification to DSCC-VA of change of product (see 6.2

herein) involving devices acquired to this drawing is required for any change that affects this drawing.

3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the

option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made

available onshore at the option of the reviewer.

3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in

microcircuit group number 39 (see MIL-PRF-38535, appendix A).

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APR 97

TABLE I. Electrical performance characteristics.

Test and

MIL-STD-883

test method 1/

Symbol

Device

type

VCC

Group A

subgroups

Limits 3/

Unit

Conditions 2/

-55°C ≤ TC ≤ +125°C

4.5 V ≤ VCC ≤ 5.5 V

unless otherwise specified

Min Max

01, 03,

3.0 VCC - 0.5 VOH1

For all inputs affecting

output under test,

VIN = VIH or VIL

VIL = 0.8 V

VIH = 2.0 V

For all other inputs,

VIN = VCC or GND

IOH = -300 μA

02, 04,

4.5 V

2.7 VCC - 0.5

IOH =

-12 mA

01, 03,

2.4 VCC - 0.5

IOH =

-6 mA

2.4 VCC - 0.5

High level output voltage

3006

VOH2 For all inputs affecting

output under test,

VIN = VIH or VIL

VIL = 0.8 V

VIH = 2.0 V

For all other inputs,

VIN = VCC or GND

IOH =

-12 mA

02, 04,

4.5 V

1, 2, 3

2.0 VCC - 0.5

VOL1

For all inputs affecting

output under test,

VIN = VIH or VIL

VIL = 0.8 V

VIH = 2.0 V

For all other inputs,

VIN = VCC or GND

IOL = 300 μA

All 4.5 V 0.20

Low level output voltage

3007

VOL2 For all inputs affecting

output under test,

VIN = VIH or VIL

VIL = 0.8 V

VIH = 2.0 V

For all other inputs,

VIN = VCC or GND

IOL = 32 mA

All 4.5 V

1, 2, 3

0.55

For input under test, IIN = -15 mA 01, 03,

05 -1.3 Negative input clamp

voltage

3022

VIC-

For input under test, IIN = -18 mA 02, 04,

4.5 V 1, 2, 3

-1.2

1 0.1 01, 03,

05 2, 3 1.0

1, 2 1.0

High level input current

3010

IIH For input under test, VIN = VCC

For all other inputs,

VIN = VCC or GND 02, 04,

5.5 V

3 5.0

μA

1 -0.1 01, 03,

05 2, 3 -1.0

1, 2 -1.0

Low level input current

3009

IIL For input under test, VIN = GND

For all other inputs,

VIN = VCC or GND 02, 04,

5.5 V

3 -5.0

μA

See footnotes at end of table.

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REVISION LEVEL

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DSCC FORM 2234

APR 97

TABLE I. Electrical performance characteristics – Continued.

Test and

MIL-STD-883

test method 1/

Symbol

Device

type

VCC

Group A

subgroups

Limits 3/

Unit

Conditions 2/

-55°C ≤ TC ≤ +125°C

4.5 V ≤ VCC ≤ 5.5 V

unless otherwise specified

Min Max

Input capacitance

3012

CIN

See 4.3.1b

TC = +25°C

All GND 4 10 pF

Output capacitance

3012

COUT

See 4.3.1b All GND 4 12 pF

Short circuit output current

3005 IOS

For all inputs, VIN = VCC or GND

VOUT = GND

All 5.5 V

1, 2, 3 -60 -225 mA

01, 03,

0.25 Dynamic power supply

current

ICCD

4/ 7/

Outputs open

02, 04,

5.5 V 4, 5, 6

0.30

mA/

MHz•

Bit

Quiescent power supply

current delta (TTL input

levels)

3005

ΔICC

For input under test,

VIN = VCC – 2.1 V

For all other inputs,

VIN = VCC or GND

All 5.5 V 1, 2, 3 2.0 mA

Quiescent power supply

current output high

3005

ICCH E1 = E2 = GND, E3 = VCC

For all other inputs,

VIN = VCC or GND

All 5.5 V 1, 2, 3 1.5 mA

Quiescent power supply

current output low

3005

ICCL E1 = E2 = GND, E3 = VCC

For all other inputs,

VIN = VCC or GND

All 5.5 V 1, 2, 3 1.5 mA

01, 03,

4.0 For

switching

inputs

VIN = VCC

or GND

02, 04,

4.5

01, 03,

5.0

Total power supply

current

ICCT

9/ Outputs open

E1, E2, or E3

toggling

One bit toggling

fi = 10 MHz

50% duty cycle

For nonswitching

inputs VIN = VCC or

GND

For

switching

inputs

VIN = 3.4 V

or GND

02, 04,

5.5 V 4, 5, 6

5.5

All 4.5 V 7, 8 L H Functional tests 10/ VIL = 0.8 V

VIH = 2.0 V

Verify output VO

See 4.3.1c

All 5.5 V 7, 8 L H

01, 02 1.5 12.0

03, 04 1.5 7.8

Propagation delay time,

Am to On

3003

tPLH1,

tPHL1

11/ 05, 06

4.5 V 9, 10, 11

1.5 6.0

01, 02 1.5 12.5 ns

03, 04 1.5 8.0

Propagation delay time,

E1 or E2 to On

3003

tPLH2,

tPHL2

11/ 05, 06

4.5 V 9, 10, 11

1.5 6.1

01, 02 1.5 12.5

03, 04 1.5 8.0

Propagation delay time,

E3 to On

3003

tPLH3,

tPHL3

11/

CL = 50 pF minimum

RL = 500Ω

See figure 4

05, 06

4.5 V 9, 10, 11

1.5 6.1

See footnotes on next sheet.

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TABLE I. Electrical performance characteristics - Continued.

1/ For tests not listed in the referenced MIL-STD-883 (e.g. ΔICC), utilize the general test procedure under the conditions listed

herein.

2/ Each input/output, as applicable shall be tested at the specified temperature for the specified limits to the tests in table I

herein. Output terminals not designated shall be high level logic, low level logic, or open, except for all ICC and ΔICC tests,

the output terminal(s) shall be open. When performing these tests, the current meter shall be placed in the circuit such that

all current flows through the meter

3/ For negative and positive voltage and current values, the sign designates the potential difference in reference to GND and

the direction of current flow, respectively; and the absolute value of the magnitude, not the sign, is relative to the minimum

and maximum limits, as applicable, listed herein. All devices shall meet or exceed the limits specified in table I at

4.5 V ≤ VCC ≤ 5.5 V.

4/ This parameter is guaranteed, if not tested, to the limits specified in table I.

5/ This test is required only for group A testing, see 4.4.1 herein.

6/ Not more than one output should be shorted at a time. The duration of the short circuit test should not exceed on second.

7/ ICCD may be verified by the following equation:

CCD = ICCT – ICC - DHNTΔICC

fCP/2 +fiNi

Where, ICCT, (ICC or ICCH in table I), and ΔICC shall be the measured values of these parameters, for the device under test,

when tested as described in table I, herein. The values for DH, NT, fCP, fi, Ni shall be as listed in the test conditions column

for ICCT in table I, herein.

8/ This test may be performed either one input at a time (preferred method) or with all input pins simultaneously at

IN = VCC – 2.1 V (alternate method). Classes Q and V shall use the preferred method. When the test is performed using

the alternate test method , the maximum limit is equal to the number of inputs at a high TTL input level times 2.0 mA and the

preferred method and limits are guaranteed.

9/ ICCT is calculated as follows:

CCT = ICC = DHNTΔICC + ICCD(fCP/2+fiNi)

Where:

CC = Quiescent supply current (any ICCL or ICCH)

H = Duty cycle for TTL inputs at 3.4 V

T = Number of TTL inputs at 3.4 V

ΔICC = Quiescent supply current delta, TTL inputs at 3.4 V

CCD = Dynamic power supply current caused by an input transition pair (HLH or LHL)

CP = Clock frequency for registered devices (fCP = 0 for nonregistered devices)

i = Input frequency

i = Number of inputs at fi

10/ Tests shall be performed in sequence, attributes data only. Functional tests shall include the truth table and other logic

patterns used for fault detection. The test vectors used to verify the truth table shall, at a minimum, test all functions of each

input and output. All possible input to output logic patterns per function shall be guaranteed, if not tested, to the truth table

in figure 2, herein. Functional tests shall be performed in sequence as approved by the qualifying activity on qualified

devices. H ≥ 1.5 V, L < 1.5 V.

11/ AC limits at VCC = 5.5 V are equal to the limits at VCC = 4.5 V and guaranteed by testing at VCC = 4.5 V. Minimum

propagation delay time limits for VCC = 4.5 V and 5.5 V are guaranteed if not tested to the limits specified in table I, herein.

For AC tests, all paths must be tested.

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Device types

01, 02, 03, 04, 05, 06

Case outlines

E and F

Terminal number

Terminal symbol

GND

VCC

- - -

GND

VCC

NC = No connection

Terminal description

Terminal symbol Description

A0, A1, A2 Address inputs

E1, E2 Enable inputs (active low)

E3 Enable input (active high)

On (n = 0 to 7) Outputs (active low)

FIGURE 1. Terminal connections.

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Inputs Outputs

E1 E2 E3 A0 A1 A2 O0 O1 O2 O3 O4 O5 O6 O7

H X X X X X H H H H H H H H

X H X X X X H H H H H H H H

X X L X X X H H H H H H H H

L L H L L L L H H H H H H H

L L H H L L

H L H H H H H H

L L H L H L H H L H H H H H

L L H H H L

H H H L H H H H

L L H L L H

H H H H L H H H

L L H H L H

H H H H H L H H

L L H L H H

H H H H H H L H

L L H H H H

H H H H H H H L

L = Low voltage level

H = High voltage level

X = Irrelevant

FIGURE 2. Truth table.

FIGURE 3. Logic diagram.

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NOTES:

1. CL = 50 pF or equivalent (includes test jig and probe capacitance).

2. RL = 500Ω or equivalent. RT = 50Ω or equivalent.

3. Input signal from pulse generator: VIN = 0.0 V to 3.0 V; PRR ≤ 10 MHz; duty cycle = 50 percent;

r ≤ 2.5 ns, tf ≤ 2.5 ns; tr and tf shall be measured from 0.3 V to 2.7 V, and from 2.7 V to 0.3 V, respectively.

4. Timing parameters shall be tested at a minimum input frequency of 1 MHz.

5. The outputs are measured one at a time with one transition per measurement.

FIGURE 4. Switching waveforms and test circuit.

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4. VERIFICATION

4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with

MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan

shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be

in accordance with MIL-PRF-38535, appendix A.

4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted

on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in

accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.

4.2.1 Additional criteria for device class M.

a. Burn-in test, method 1015 of MIL-STD-883.

(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision

level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in

method 1015 of MIL-STD-883.

(2) TA = +125°C, minimum.

b. Interim and final electrical test parameters shall be as specified in table II herein.

4.2.2 Additional criteria for device classes Q and V.

a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the

device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained

under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance

with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit

shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified

in method 1015 of MIL-STD-883.

b. Interim and final electrical test parameters shall be as specified in table II herein.

c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in

MIL-PRF-38535, appendix B.

4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in

accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for

groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).

4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with

MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for

device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed

for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections

(see 4.4.1 through 4.4.4).

4.4.1 Group A inspection.

a. Tests shall be as specified in table II herein.

b. CIN and COUT shall be measured only for initial qualification and after process or design changes which may affect

capacitance. CIN and COUT shall be measured between the designated terminal and GND at a frequency of 1 MHz.

For CIN and COUT, test all applicable pins on five devices with zero failures.

c. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table in figure 2 herein. The test

vectors used to verify the truth table shall, at a minimum, test all functions of each input and output. All possible input

to output logic patterns per function shall be guaranteed, if not tested, to the truth table in figure 2, herein. For device

classes Q and V, subgroups 7 and 8 shall include verifying the functionality of the device.

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-92233

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

SHEET 13

DSCC FORM 2234

APR 97

4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein.

4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:

a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level

control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify

the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method

1005 of MIL-STD-883.

b. TA = +125°C, minimum.

c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.

4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test

temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with

MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB

in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test

circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in

method 1005 of MIL-STD-883.

4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.

4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness

assured (see 3.5 herein).

a. End-point electrical parameters shall be as specified in table II herein.

b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as

specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to

radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All

device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at

A = +25°C ±5°C, after exposure, to the subgroups specified in table II herein.

TABLE II. Electrical test requirements.

Test requirements

Subgroups

(in accordance with

MIL-STD-883,

method 5005, table I)

Subgroups

(in accordance with

MIL-PRF-38535, table III)

Device

class M

Device

class Q

Device

class V

Interim electrical

parameters (see 4.2)

- - -

Final electrical

parameters (see 4.2)

1/ 1, 2, 3, 4, 5, 6, 7,

8, 9, 10, 11

1/ 1, 2, 3, 4,

5, 6, 7, 8, 9,

10, 11

2/ 1, 2, 3, 4, 5, 6,

7, 8, 9, 10, 11

Group A test

requirements (see 4.4)

1, 2, 3, 4, 5, 6, 7,

8, 9, 10, 11

1, 2, 3, 4, 5, 6,

7, 8, 9, 10, 11

1, 2, 3, 4, 5, 6, 7,

8, 9, 10, 11

Group C end-point electrical

parameters (see 4.4)

1, 2, 3, 4, 5, 6

Group D end-point electrical

parameters (see 4.4)

1, 2, 3

Group E end-point electrical

parameters (see 4.4)

1, 4, 7, 9

1/ PDA applies to subgroup 1.

2/ PDA applies to subgroups 1 and 7.

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-92233

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

SHEET 14

DSCC FORM 2234

APR 97

4.5 Methods of inspection. Methods of inspection shall be specified as follows:

4.5.1 Voltage and current. Unless otherwise specified, all voltages given are referenced to the microcircuit GND terminal.

Currents given are conventional current and positive when flowing into the referenced terminal.

5. PACKAGING

5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes

Q and V or MIL-PRF-38535, appendix A for device class M.

6. NOTES

6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications

(original equipment), design applications, and logistics purposes.

6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-

prepared specification or drawing.

6.1.2 Substitutability. Device class Q devices will replace device class M devices.

6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for

the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.

6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system

application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users

and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic

devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.

6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone

(614) 692-0547.

6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in

MIL-PRF-38535 and MIL-HDBK-1331.

6.6 Sources of supply.

6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.

The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to

this drawing.

6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.

The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been

submitted to and accepted by DSCC-VA.

STANDARD MICROCIRCUIT DRAWING BULLETIN

DATE: 06-12-06

Approved sources of supply for SMD 5962-92233 are listed below for immediate acquisition information only and shall

be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised

to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate

of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next

dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of

supply at http://www.dscc.dla.mil/Programs/Smcr/.

Standard

microcircuit drawing

PIN 1/

Vendor

CAGE

number

Vendor

similar

PIN 2/

5962-9223301MEA 3/ 54FCT138T

5962-9223301M2A 3/ 54FCT138T

5962-9223302MEA 01295

0C7V7

CY54FCT138TDMB

IDT54FCT138TDB

5962-9223302MFA 0C7V7 IDT54FCT138TEB

5962-9223302M2A 01295

0C7V7

CY54FCT138TLMB

IDT54FCT138TLB

5962-9223303MEA 3/ 54FCT138AT

5962-9223303M2A 3/ 54FCT138AT

5962-9223304M2A 0C7V7 IDT54FCT138ATLB

5962-9223304MEA 0C7V7 IDT54FCT138ATDB

5962-9223304MFA 0C7V7 IDT54FCT138ATEB

5962-9223305M2A 3/ 54FCT138CT

5962-9223305MEA 3/ 54FCT138CT

5962-9223306M2A 01295

0C7V7

CY54FCT138CTLMB

IDT54FCT138CTLB

5962-9223306MEA 01295

0C7V7

CY54FCT138CTDMB

IDT54FCT138CTDB

5962-9223306MFA 0C7V7 IDT54FCT138CTEB

1/ The lead finish shown for each PIN representing

a hermetic package is the most readily available

from the manufacturer listed for that part. If the

desired lead finish is not listed, contact the vendor

to determine its availability.

2/ Caution. Do not use this number for item

acquisition. Items acquired to this number may not

satisfy the performance requirements of this drawing.

3/ Not available from an approved source of supply.

1 of 2

STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued.

Vendor CAGE Vendor name

number and address

01295 Texas Instruments Inc.

Semiconductor Group

8505 Forest Ln.

P.O. Box 660199

Dallas, TX 75243

Point of contact: U.S. Highway 75 South

P.O. Box 84, M/S 853

Sherman, TX 75090-9493

0C7V7 QP Semiconductor

2945 Oakmead Village Court

Santa Clara, CA 95051

The information contained herein is disseminated for convenience only and the

Government assumes no liability whatsoever for any inaccuracies in the

information bulletin.

2 of 2