TFP410
TI PanelBus DIGITAL TRANSMITTER
SLDS145B OCTOBER 2001 REVISED MAY 2011
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DDigital Visual Interface (DVI) Compliant1
DSupports Pixel Rates Up to 165 MHz
(Including 1080p and WUXGA at 60Hz)
DUniversal Graphics Controller Interface
12-Bit, Dual-Edge and 24-Bit,
Single-Edge Input Modes
Adjustable 1.1 V to 1.8 V and Standard
3.3 V CMOS Input Signal Levels
Fully Differential and Single-Ended Input
Clocking Modes
Standard Intel 12-Bit Digital Video Port
Compatible as on Intel 81x Chipsets
DEnhanced PLL Noise Immunity
On-Chip Regulators and Bypass
Capacitors for Reducing System Costs
DEnhanced Jitter Performance
No HSYNC Jitter Anomaly
Negligible Data-Dependent Jitter
DProgrammable Using I2C Serial Interface
DMonitor Detection Through Hot-Plug and
Receiver Detection
DSingle 3.3-V Supply Operation
D64-Pin TQFP Using TI’s PowerPAD
Package
DTI’s Advanced 0.18 μm EPIC-5 CMOS
Process Technology
DPin Compatible With SiI164 DVI Transmitter
description
The TFP410 is a Texas Instruments PanelBus flat panel display product, part of a comprehensive family of
end-to-end DVI 1.0-compliant solutions, targeted at the PC and consumer electronics industry.
The TFP410 provides a universal interface to allow a glue-less connection to most commonly available graphics
controllers. Some of the advantages of this universal interface include selectable bus widths, adjustable signal
levels, and differential and single-ended clocking. The adjustable 1.1-V to 1.8-V digital interface provides a
low-EMI, high-speed bus that connects seamlessly with 12-bit or 24-bit interfaces. The DVI interface supports
flat panel display resolutions up to UXGA at 165 MHz in 24-bit true color pixel format.
The TFP410 combines PanelBus circuit innovation with TI’s advanced 0.18 μm EPIC-5 CMOS process
technology and TI’s ultralow ground inductance PowerPAD package. The result is a compact 64-pin TQFP
package providing a reliable, low-current, low-noise, high-speed digital interface solution.
This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These
circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C,
Method 3015; however, it is advised that precautions be taken to avoid application of any voltage higher than maximum-rated
voltages to these high-impedance circuits. During storage or handling, the device leads should be shorted together or the device
should be placed in conductive foam. In a circuit, unused inputs should always be connected to an appropriated logic voltage level,
preferably either VCC or ground. Specific guidelines for handling devices of this type are contained in the publication Guidelines for
Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments.
Copyright © 2002 2011, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Footnote:
1. The digital visual interface (DVI) specification is an industry standard developed by the digital display working group (DDWG) for high-speed
digital connection to digital displays and has been adopted by industry-leading PC and consumer electronics manufacturers. The TFP410
is compliant to the DVI Revision 1.0 specification.
PanelBus, PowerPAD, and EPIC-5 are trademarks of Texas Instruments.
VESA is a trademark of Video Electronics Standards Association.
Intel is a trademark of Intel Corporation.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TFP410
TI PanelBus DIGITAL TRANSMITTER
SLDS145B OCTOBER 2001 REVISED MAY 2011
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
pin assignments
12 3
TGND
TX2+
TX2
TVDD
TX1+
TX1
TGND
TX0+
TX0
TVDD
TXC+
TXC
TGND
TFADJ
PVDD
PGND
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
4
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
NC
DATA11
DATA10
DATA9
DATA8
DATA7
DATA6
IDCK
IDCK+
DATA5
DATA4
DATA3
DATA2
DATA1
DATA0
DGND 5678
47 46 45 44 4348 42 40 39 3841
910111213
37 36 35 34 33
14 15 16
PAP PACKAGE
(TOP VIEW)
DGND
DATA12
DATA13
DATA14
DATA15
DATA16
DATA17
DATA18
DATA19
DATA20
DATA21
DATA22
DATA23
DKEN
RESERVED
DVDD
DVDD
DE
VREF
HSYNC
VSYNC
CTL3/A3/DK3
CTL2/A2/DK2
CTL1/A1/DK1
EDGE/HTPLG
PD
MSEN/PO1
DVDD
ISEL/RST
DSEL/SDA
BSEL/SCL
DGND
TFP410
TI PanelBus DIGITAL TRANSMITTER
SLDS145B OCTOBER 2001 REVISED MAY 2011
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
functional block diagram
12/24 Bit
I/F
Data
Format
Universal Input T.M.D.S. Transmitter
Serializer
Serializer
Serializer
Control
I2C Slave I/F
For DDC 1.8-V Regulators
With Bypass
Capacitors
PLL
TX2±
TX1±
TX0±
TXC±
TFADJ
IDCK±
DATA[23:0]
DE
VSYNC
HSYNC
EDGE/HTPLG
MSEN
PD
ISEL/RST
BSEL/SCL
DSEL/SDA
VREF
Encoder
Encoder
Encoder
CTL/A/DK[3:1]
DKEN
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME NO. I/O DESCRIPTION
Input
DATA[23:12] 3647 I The upper 12 bits of the 24-bit pixel bus
In 24-bit, single-edge input mode (BSEL = high), this bus inputs the top half of the 24-bit pixel bus.
In 12-bit, dual-edge input mode (BSEL = low), these bits are not used to input pixel data. In this mode,
the state of DATA[23:16] is input to the I2C register CFG. This allows 8 bits of user configuration data to
be read by the graphics controller through the I2C interface (see the I2C register descriptions section).
Note: All unused data inputs should be tied to GND or VDD.
DATA[11:0] 5055,
5863
IThe lower 12 bits of the 24-bit pixel bus/12-bit pixel bus input
In 24-bit, single-edge input mode (BSEL = high), this bus inputs the bottom half of the 24-bit pixel bus.
In 12-bit, dual-edge input mode (BSEL = low), this bus inputs 1/2 a pixel (12 bits) at every latch edge
(both rising and falling) of the clock.
IDCK
IDCK+
56
57
IDifferential clock input. The TFP410 supports both single-ended and fully differential clock input
modes. In the single-ended clock input mode, the IDCK+ input (pin 57) should be connected to the
single-ended clock source and the IDCK input (pin 56) should be tied to GND. In the differential clock
input mode, the TFP410 uses the crossover point between the IDCK+ and IDCK signals as the timing
reference for latching incoming data DATA[23:0], DE, HSYNC, & VSYNC. The differential clock input
mode is only available in the low signal swing mode.
DE 2 I Data enable. As defined in DVI 1.0 specification, the DE signal allows the transmitter to encode pixel
data or control data on any given input clock cycle. During active video (DE = high), the transmitter
encodes pixel data, DATA[23:0]. During the blanking interval (DE = low), the transmitter encodes
HSYNC, VSYNC and CTL[3:1].
HSYNC 4 I Horizontal sync input
VSYNC 5 I Vertical sync input
TFP410
TI PanelBus DIGITAL TRANSMITTER
SLDS145B OCTOBER 2001 REVISED MAY 2011
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Terminal Functions (Continued)
TERMINAL
I/O
DESCRIPTION
NAME NO. I/O DESCRIPTION
CTL3/A3/DK3
CTL2/A2/DK2
CTL1/A1/DK1
6
7
8
IThe operation of these three multifunction inputs depends on the settings of the ISEL (pin 13) and
DKEN (pin 35) inputs. All three inputs support 3.3-V CMOS signal levels and contain weak pulldown
resistors so that if left unconnected they default to all low.
When the I2C bus is disabled (ISEL = low) and the de-skew mode is disabled (DKEN = low), these three
inputs become the control inputs, CTL[3:1], which can be used to send additional information across
the DVI link during the blanking interval (DE = low). The CTL3 input is reserved for HDCP compliant DVI
TXs (TFP510) and the CTL[2:1] inputs are reserved for future use.
When the I2C bus is disabled (ISEL = low) and the de-skew mode is enabled (DKEN = high), these
three inputs become the de-skew inputs DK[3:1], used to adjust the setup and hold times of the pixel
data inputs DATA[23:0], relative to the clock input IDCK±.
When the I2C bus is enabled (ISEL = high), these three inputs become the 3 LSBs of the I2C slave
address, A[3:1].
Configuration/Programming
MSEN/PO1 11 O Monitor sense/programmable output 1. The operation of this pin depends on whether the I2C interface
is enabled or disabled. This pin has an open-drain output and is only 3.3-V tolerant. An external 5-kΩ
pullup resistor connected to VDD is required on this pin.
When I2C is disabled (ISEL = low), a low level indicates a powered on receiver is detected at the
differential outputs. A high level indicates a powered on receiver is not detected. This function is only
valid in dc-coupled systems.
When I2C is enabled (ISEL = high), this output is programmable through the I2C interface (see the I2C
register descriptions section).
ISEL/RST 13 I I2C interface select/I2C RESET (active low, asynchronous)
If ISEL is high, then the I2C interface is active. Default values for the I2C registers can be found in the
I2C register descriptions section.
If ISEL is low, then I2C is disabled and the chip configuration is specified by the configuration pins
(BSEL, DSEL, EDGE, VREF) and state pins (PD, DKEN).
If ISEL is brought low and then back high, the I2C state machine is reset. The register values are
changed to their default values and are not preserved from before the reset.
BSEL/SCL 15 I Input bus select/I2C clock input. The operation of this pin depends on whether the I2C interface is
enabled or disabled. This pin is only 3.3-V tolerant.
When I2C is disabled (ISEL = low), a high level selects 24-bit input, single-edge input mode. A low level
selects 12-bit input, dual-edge input mode.
When I2C is enabled (ISEL = high), this pin functions as the I2C clock input (see the I2C register
descriptions section). In this configuration, this pin has an open-drain output that requires an external
5-kΩ pullup resistor connected to VDD.
DSEL/SDA 14 I/O DSEL/I2C data. The operation of this pin depends on whether the I2C interface is enabled or disabled.
This pin is only 3.3-V tolerant.
When I2C is disabled (ISEL = low), this pin is used with BSEL and VREF to select the single-ended or
differential input clock mode (see the universal graphics controller interface modes section).
When I2C is enabled (ISEL = high), this pin functions as the I2C bidirectional data line. In this
configuration, this pin has an open-drain output that requires an external 5-kΩ pullup resistor
connected to VDD.
EDGE/HTPLG 9 I Edge select/hot plug input. The operation of this pin depends on whether the I2C interface is enabled or
disabled. This input is 3.3-V tolerant only.
When I2C is disabled (ISEL = low), a high level selects the primary latch to occur on the rising edge of
the input clock IDCK+. A low level selects the primary latch to occur on the falling edge of the input clock
IDCK+. This is the case for both single-ended and differential input clock modes.
When I2C is enabled (ISEL = high), this pin is used to monitor the hot plug detect signal (see the DVI or
VESA P&D and DFP standards). When used for hot-plug detection, this pin requires a series 1-KΩ
resistor.
TFP410
TI PanelBus DIGITAL TRANSMITTER
SLDS145B OCTOBER 2001 REVISED MAY 2011
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Terminal Functions (Continued)
TERMINAL
I/O
DESCRIPTION
NAME NO. I/O DESCRIPTION
DKEN 35 I Data de-skew enable. The de-skew function can be enabled either through I2C or by this pin when I2C
is disabled. When de-skew is enabled, the input clock to data setup/hold time can be adjusted in
discrete trim increments. The amount of trim per increment is defined by t(STEP).
When I2C is disabled (ISEL = low), a high level enables de-skew with the trim increment determined by
pins DK[3:1] (see the data de-skew section). A low level disables de-skew and the default trim setting is
used.
When I2C is enabled (ISEL = high), the value of DKEN and the trim increment are selected through I2C.
In this configuration, the DKEN pin should be tied to either GND or VDD to avoid a floating input.
VREF 3 I Input reference voltage. Selects the swing range of the digital data inputs (DATA[23:0], DE, HSYNC,
VSYNC, and IDCK±).
For high-swing 3.3-V input signal levels, VREF should be tied to VDD.
For low-swing input signal levels, VREF should be set to half of the maximum input voltage level. See
the recommended operating conditions section for the allowable range for VREF
.
The desired VREF voltage level is typically derived using a simple voltage-divider circuit.
PD 10 I Power down (active low). In the powerdown state, only the digital I/O buffers and I2C interface remain
active.
When I2C is disabled (ISEL = low), a high level selects the normal operating mode. A low level selects
the powerdown mode.
When I2C is enabled (ISEL = high), the power-down state is selected through I2C. In this configuration,
the PD pin should be tied to GND.
Note: The default register value for PD is low, so the device is in powerdown mode when I2C is first
enabled or after an I2C RESET.
Reserved
RESERVED 34 In This pin is reserved and must be tied to GND for normal operation.
DVI Differential Signal Output Pins
TX0+
TX0
25
24
OChannel 0 DVI differential output pair. TX0± transmits the 8-bit blue pixel data during active video and
HSYNC and VSYNC during the blanking interval.
TX1+
TX1
28
27
OChannel 1 DVI differential output pair. TX1± transmits the 8-bit green pixel data during active video and
CTL[1] during the blanking interval.
TX2+
TX2
31
30
OChannel 2 DVI differential output pair. TX2± transmits the 8-bit red pixel data during active video and
CTL[3:2] during the blanking interval.
TXC+
TXC
22
21
ODVI differential output clock.
TFADJ 19 I Full-scale adjust. This pin controls the amplitude of the DVI output voltage swing, determined by the
value of the pullup resistor RTFADJ connected to TVDD.
Power and Ground Pins
DVDD 1, 12, 33 Power Digital power supply. Must be set to 3.3 V nominal.
PVDD 18 Power PLL power supply. Must be set to 3.3 V nominal.
TVDD 23, 29 Power Transmitter differential output driver power supply. Must be set to 3.3 V nominal.
DGND 16, 48, 64 Ground Digital ground
PGND 17 Ground PLL ground
TGND 20, 26, 32 Ground Transmitter differential output driver ground
NC 49 NC No connection required. If connected, tie high.
TFP410
TI PanelBus DIGITAL TRANSMITTER
SLDS145B OCTOBER 2001 REVISED MAY 2011
6POST OFFICE BOX 655303 DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage range, DVDD, PVDD, TVDD 0.5 V to 4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, logic/analog signals 0.5 V to 4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External DVI single-ended termination resistance, RT 0 Ω to open circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External TFADJ resistance, RTFADJ 300 Ω to open circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, TSTG –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case temperature for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD protection, DVI pins 4 kV Human body model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD protection, all other pins 2 kV Human body model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JEDEC latch-up (EIA/JESD78) 100 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
recommended operating conditions
MIN NOM MAX UNIT
Supply voltage, VDD (DVDD, PVDD, TVDD) 3.0 3.3 3.6 V
Input reference voltage V
Low-swing mode 0.55 VDDQ/20.9 V
Input reference voltage, VREF High-swing mode DVDD V
DVI termination supply voltage, AVDD (see Note 1) DVI receiver 3.14 3.3 3.46 V
DVI Single-ended termination resistance, RT (see Note 2) DVI receiver 45 50 55 Ω
TFADJ resistor for DVI-compliant V(SWING) range, R(TFADJ) 400 mV = V(SWING) = 600 mV 505 510 515 Ω
Operating free-air temperature range, TA0 25 70 °C
VDDQ defines the maximum low-level input voltage, it is not an actual input voltage.
NOTES: 1. AVDD is the termination supply voltage of the DVI link.
2. RT is the single-ended termination resistance at the receiver end of the DVI link.
TFP410
TI PanelBus DIGITAL TRANSMITTER
SLDS145B OCTOBER 2001 REVISED MAY 2011
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
dc specifications
PARAMETERS TEST CONDITIONS MIN TYP MAX UNIT
V
High level input voltage (CMOS input)
VREF = DVDD 0.7 VDD
V
VIH High-level input voltage (CMOS input) 0.5 V VREF 0.95 V VREF + 0.2 V
V
Low level input voltage (CMOS input)
VREF = DVDD 0.3VDD
V
VIL Low-level input voltage (CMOS input) 0.5 V VREF 0.95 V VREF 0.2 V
VOH High-level digital output voltage (open-drain output) VDD = 3 V, IOH = 20 μA 2.4 V
VOL Low-level digital output voltage (open-drain output) VDD = 3.6 V, IOL = 4 mA 0.4 V
IIH High-level input current VI = 3.6 V ±25 μA
IIL Low-level input current VI = 0 ±25 μA
VHDVI single-ended high-level output voltage AVDD 0.01 AVDD + 0.01 V
VLDVI single-ended low-level output voltage AVDD = 3.3 V ± 5%,
R 50 Ω ± 10%
AVDD 0.6 AVDD 0.4 V
VSWING DVI single-ended output swing voltage RT
= 50 Ω ± 10%,
R
TFADJ
=
5
1
0
Ω ± 1
%
400 600 mVP-P
VOFF DVI single-ended standby/off output voltage
R
TFADJ
=
510 Ω ± 1%
AVDD 0.01 AVDD + 0.01 V
IPD Power-down current (see Note 3) 200 500 μA
IIDD Normal power supply current Worst case pattern200 250 mA
RT is the single-ended termination resistance at the receiver end of the DVI link.
Black and white checkerboard pattern, each checker is one pixel wide.
NOTE 3: Assumes all inputs to the transmitter are not toggling.
ac specifications
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
f(IDCK) IDCK frequency 25 165 MHz
t(pixel) Pixel time period (see Note 4) 6.06 40 ns
t(IDCK) IDCK duty cycle 30% 70%
t(ijit) IDCK clock jitter tolerance 2 ns
trDVI output rise time (20-80%) (see Note5) 75 240 ps
tfDVI output fall time (20-80%) (see Note 5) 75 240 ps
tsk(D) DVI output intra-pair + to differential skew (see Note 6) f
(
IDCK
)
= 165 MHz 50 ps
tsk(CC) DVI output inter-pair or channel-to-channel skew (see Note 6)
f(IDCK) 165 MHz
1.2 ns
tojit DVI output clock jitter, max. (see Note 7) 150 ps
tsu(IDF) Data, DE, VSYNC, HSYNC setup time to IDCK+ falling edge Single edge
(BSEL 1 DSEL 0
1.2 ns
th(IDF) Data, DE, VSYNC, HSYNC hold time to IDCK+ falling edge
(BSEL=1, DSEL=0,
DKEN=0, EDGE=0) 1.3 ns
tsu(IDR) Data, DE, VSYNC, HSYNC setup time to IDCK+ rising edge Single edge
(BSEL 1 DSEL 0
1.2 ns
th(IDR) Data, DE, VSYNC, HSYNC hold time to IDCK+ rising edge
(BSEL=1, DSEL=0,
DKEN=0, EDGE=1) 1.3 ns
tsu(ID)
Data, DE, VSYNC, HSYNC setup time to IDCK+ falling/rising
edge
Dual edge
(BSEL=0, DSEL=1,
DKEN=0)
0.9 ns
th(ID)
Data, DE, VSYNC, HSYNC hold time to IDCK+ falling/rising
edge
Dual edge (BSEL=0,
DSEL=1, DKEN=0) 1 ns
t(STEP) De-skew trim increment DKEN = 1 350 ps
NOTES: 4. t(pixel) is the pixel time defined as the period of the TXC output clock. The period of IDCK is equal to t(pixel).
5. Rise and fall times are measured as the time between 20% and 80% of signal amplitude.
6. Measured differentially at the 50% crossing point using the IDCK+ input clock as a trigger.
7. Relative to input clock (IDCK).
TFP410
TI PanelBus DIGITAL TRANSMITTER
SLDS145B OCTOBER 2001 REVISED MAY 2011
8POST OFFICE BOX 655303 DALLAS, TEXAS 75265
timing diagrams
trtf
80% VOD
20% VOD
DVI
Outputs
Figure 1. Rise and Fall Time for DVI Outputs
th(IDF)
tsu(IDF) th(IDR)
tsu(IDR)
VIH
VIL
IDCK+
DATA[23:0], DE,
HSYNC, VSYNC
IDCK
Figure 2. Control and Single-Edge-Data Setup/Hold Time to IDCK±
tsu(ID) th(ID)
VIH
VIL
IDCK+
DATA[23:0], DE,
HSYNC, VSYNC
th(ID)
tsu(ID)
Figure 3. Dual Edge Data Setup/Hold Times to IDCK+
tsk(D)
50%
TX+
TX
Figure 4. Analog Output Intra-Pair ± Differential Skew
tsk(CC)
50%
50%
TXN
TXM
Figure 5. Analog Output Channel-to-Channel Skew
TFP410
TI PanelBus DIGITAL TRANSMITTER
SLDS145B OCTOBER 2001 REVISED MAY 2011
9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
functional description
The TFP410 is a DVI-compliant digital transmitter that is used in digital host monitor systems to T.M.D.S. encode
and serialize RGB pixel data streams. TFP410 supports resolutions from VGA to WUXGA (and 1080p) and can
be controlled in two ways: 1) configuration and state pins or 2) the programmable I2C serial interface (see the
terminal functions section).
The host in a digital display system, usually a PC or consumer electronics device, contains a DVI-compatible
transmitter such as the TI TFP410 that receives 24-bit pixel data along with appropriate control signals. The
TFP410 encodes the signals into a high speed, low voltage, differential serial bit stream optimized for
transmission over a twisted-pair cable to a display device. The display device, usually a flat-panel monitor,
requires a DVI compatible receiver like the TI TFP401 to decode the serial bit stream back to the same 24-bit
pixel data and control signals that originated at the host. This decoded data can then be applied directly to the
flat panel drive circuitry to produce an image on the display. Since the host and display can be separated by
distances up to 5 meters or more, serial transmission of the pixel data is preferred (see the T.M.D.S. pixel data
and control signal encoding, pixel data and control signal encoding, universal graphics contoller interface
voltage signal levels, and universal graphics controller interface clock inputs sections).
The TFP410 integrates a high-speed digital interface, a T.M.D.S. encoder, and three differential T.M.D.S.
drivers. Data is driven to the TFP410 encoder across 12 or 24 data lines, along with differential clock pair and
sync signals. The flexibility of the TFP410 allows for multiple clock and data formats that enhance system
performance.
The TFP410 also has enhanced PLL noise immunity, an enhancement accomplished with on-chip regulators
and bypass capacitors.
The TFP410 is versatile and highly programmable to provide maximum flexibility for the user. An I2C host
interface is provided to allow enhanced configurations in addition to power-on default settings programmed by
pin-strapping resistors.
The TFP410 offers monitor detection through receiver detection, or hot-plug detection when I2C is enabled. The
monitor detection feature allows the user enhanced flexibility when attaching to digital displays or receivers (see
terminal functions, hot-plug/unplug, and register descriptions sections).
The TFP410 has a data de-skew feature allowing the users to de-skew the input data with respect to the IDCK±
(see the data de-skew feature section).
TFP410
TI PanelBus DIGITAL TRANSMITTER
SLDS145B OCTOBER 2001 REVISED MAY 2011
10 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
T.M.D.S. pixel data and control signal encoding
For transition minimized differential signaling (T.M.D.S.), only one of two possible T.M.D.S. characters for a
given pixel is transmitted at a given time. The transmitter keeps a running count of the number of ones and zeros
previously sent and transmits the character that minimizes the number of transitions and approximates a dc
balance of the transmission line. Three T.M.D.S. channels are used to transmit RGB pixel data during the active
video interval (DE = High). These same three channels are also used to transmit HSYNC, VSYNC, and three
user definable control signals, CTL[3:1], during the inactive display or blanking interval (DE = Low). The
following table maps the transmitted output data to the appropriate T.M.D.S. output channel in a DVI-compliant
system.
INPUT PINS
(VALID FOR DE = High) T.M.D.S. OUTPUT CHANNEL TRANSMITTED PIXEL DATA
ACTIVE DISPLAY (DE = High)
DATA[23:16] Channel 2 (TX2 ±) Red[7:0]
DATA[15:8] Channel 1 (TX1 ±) Green[7:0]
DATA[7:0] Channel 0 (TX0 ±) Blue[7:0]
INPUT PINS
(VALID FOR DE = Low) T.M.D.S. OUTPUT CHANNEL TRANSMITTED CONTROL DATA
BLANKING INTERVAL (DE = Low)
CTL3, CTL2 (see Note 8) Channel 2 (TX2 ±) CTL[3:2]
CTL1 (See Note 8) Channel 1 (TX1 ±) CTL[1]
HSYNC, VSYNC Channel 0 (TX0 ±)HSYNC, VSYNC
NOTE 8: The TFP410 encodes and transfers the CTL[3:1] inputs during the vertical blanking interval. The CTL3 input is reserved for HDCP
compliant DVI TXs and the CTL[2:1] inputs are reserved for future use. When DE = high, CTL and SYNC pins must be held
constant.
universal graphics controller interface voltage signal levels
The universal graphics controller interface can operate in the following two distinct voltage modes:
DThe high-swing mode where standard 3.3-V CMOS signaling levels are used.
DThe low-swing mode where adjustable 1.1-V to 1.8-V signaling levels are used.
To select the high-swing mode, the VREF input pin must be tied to the 3.3-V power supply.
To select the low-swing mode, the VREF must be 0.55 to 0.95 V.
In the low-swing mode, VREF is used to set the midpoint of the adjustable signaling levels. The allowable range
of values for VREF is from 0.55 V to 0.9 V. The typical approach is to provide this from off chip by using a simple
voltage-divider circuit. The minimum allowable input signal swing in the low-swing mode is VREF ±0.2 V. In
low-swing mode, the VREF input is common to all differential input receivers.
universal graphics controller interface clock inputs
The universal graphics controller interface of the TFP410 supports both fully differential and single-ended clock
input modes. In the differential clock input mode, the universal graphics controller interface uses the crossover
point between the IDCK+ and IDCK signals as the timing reference for latching incoming data (DATA[23:0],
DE, HSYNC, and VSYNC). Differential clock inputs provide greater common-mode noise rejection. The
differential clock input mode is only available in the low-swing mode. In the single-ended clock input mode, the
IDCK+ input (Pin 57) should be connected to the single-ended clock source and the IDCK input (Pin 56) should
be tied to GND.
The universal graphics controller interface of the TFP410 provides selectable 12-bit dual-edge, and 24-bit
single-edge, input clocking modes. In the 12-bit dual-edge , the 12-bit data is latched on each edge of the input
clock. In the 24-bit single-edge mode, the 24-bit data is latched on the rising edge of the input clock when
EDGE = 1 and the falling edge of the input clock when EDGE = 0.
DKEN and DK[3:1] allow the user to compensate the skew between IDCK± and the pixel data and control
signals. See the description of the CTL_3_MODE register for details.
TFP410
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universal graphics controller interface modes
Table 1 is a tabular representation of the different modes for the universal graphics controller interface. The
12-bit mode is selected when BSEL=0 and the 24-bit mode when BSEL=1. The 12-bit mode uses dual-edge
clocking and the 24-bit mode uses single-edge clocking. The EDGE input is used to control the latching edge
in 24-bit mode, or the primary latching edge in 12-bit mode. When EDGE=1, the data input is latched on the rising
edge of the input clock; and when EDGE=0, the data input is latched on the falling edge of the input clock. A
fully differential input clock is available only in the low-swing mode. Single-ended clocking is not recommended
in the low-swing mode as this decreases common-mode noise rejection.
Note that BSEL, DSEL, and EDGE are determined by register CTL_1_MODE when I2C is enabled (ISEL=1)
and by input pins when I2C is disabled (ISEL=0).
Table 1. Universal Graphics Controller Interface Options (Tabular Representation)
VREF BSEL EDGE DSEL BUS WIDTH LATCH MODE CLOCK EDGE CLOCK MODE
0.55 V 0.9 V 0 0 0 12-bit Dual-edge Falling Differential (see Note 9 and 10)
0.55 V 0.9 V 0 0 1 12-bit Dual-edge Falling Single-ended
0.55 V – 0.9 V 0 1 0 12-bit Dual-edge Rising Differential (see Note 9 and 10)
0.55 V 0.9 V 0 1 1 12-bit Dual-edge Rising Single-ended
0.55 V – 0.9 V 1 0 0 24-bit Single-edge Falling Single-ended
0.55 V – 0.9 V 1 0 1 24-bit Single-edge Falling Differential (see Note 9 and 11)
0.55 V – 0.9 V 1 1 0 24-bit Single-edge Rising Single-ended
0.55 V – 0.9 V 1 1 1 24-bit Single-edge Rising Differential (see Note 9 and 11)
DVDD 0 0 X 12-bit Dual-edge Falling Single-ended (see Note 12)
DVDD 0 1 X 12-bit Dual-edge Rising Single-ended (see Note 12)
DVDD 1 0 X 24-bit Single-edge Falling Single-ended (see Note 12)
DVDD 1 1 X 24-bit Single-edge Rising Single-ended (see Note 12)
NOTES: 9. The differential clock input mode is only available in the low signal swing mode (i.e., VREF p 0.9 V).
10. The TFP410 does not support a 12-bit dual-clock, single-edge input clocking mode.
11. The TFP410 does not support a 24-bit single-clock, dual-edge input clocking mode.
12. In the high-swing mode (VREF = DVDD), DSEL is a don’t care; therefore, the device is always in the single-ended latch mode.
TFP410
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universal graphics controller interface modes (continued)
P0L P0H P1L P1HPN1LPNLPNHPN+1L
DSEL=1
EDGE=0
DSEL=1
EDGE=1
DSEL=0
EDGE=0
DSEL=0
EDGE=1
Single-Ended
Clock Input
Mode
Differential
Clock Input
Mode (Low
Swing Only)
DE
D[11:0]
IDCK+
IDCK+
{(IDCK+) (IDCK)}
{(IDCK+) (IDCK)}
First Latch Edge
12-Bit, Dual-Edge Input Mode (BSEL = 0)
L = Low Half Pixel
H = High Half Pixel
Figure 6. Universal Graphics Controller Interface Options for 12-Bit Mode (Graphical Representation)
P0P1PN-1 PN
DSEL=0
EDGE=0
DSEL=0
EDGE=1
DSEL=1
EDGE=0
DSEL=1
EDGE=1
Single-Ended
Clock Input
Mode
Differential
Clock Input
Mode (Low
Swing Only)
DE
D[23:0]
IDCK+
IDCK+
{(IDCK+) (IDCK)}
{(IDCK+) (IDCK)}
First Latch Edge
24-Bit, Single-Edge Input Mode (BSEL = 1)
Figure 7. Universal Graphics Controller Interface Options for 24-Bit Mode (Graphical Representation)
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12-bit mode data mapping
PIN
P0 P1 P2
PIN
NAME
P0L P0H P1L P1H P2L P2H
NAME
LOW HIGH LOW HIGH LOW HIGH
D11 G0[3] R0[7] G1[3] R1[7] G2[3] R2[7]
D10 G0[2] R0[6] G1[2] R1[6] G2[2] R2[6]
D9 G0[1] R0[5] G1[1] R1[5] G2[1] R2[5]
D8 G0[0] R0[4] G1[0] R1[4] G2[0] R2[4]
D7 B0[7] R0[3] B1[7] R1[3] B2[7] R2[3]
D6 B0[6] R0[2] B1[6] R1[2] B2[6] R2[2]
D5 B0[5] R0[1] B1[5] R1[1] B2[5] R2[1]
D4 B0[4] R0[0] B1[4] R1[0] B2[4] R2[0]
D3 B0[3] G0[7] B1[3] G1[7] B2[3] G2[7]
D2 B0[2] G0[6] B1[2] G1[6] B2[2] G2[6]
D1 B0[1] G0[5] B1[1] G1[5] B2[1] G2[5]
D0 B0[0] G0[4] B1[0] G1[4] B2[0] G2[4]
24-bit mode data mapping
PIN NAME P0 P1 P2 PIN NAME P0 P1 P2
D23 R0[7] R1[7] R2[7] D11 G0[3] G1[3] G2[3]
D22 R0[6] R1[6] R2[6] D10 G0[2] G1[2] G2[2]
D21 R0[5] R1[5] R2[5] D9 G0[1] G1[1] G2[1]
D20 R0[4] R1[4] R2[4] D8 G0[0] G1[0] G2[0]
D19 R0[3] R1[3] R2[3] D7 B0[7] B1[7] B2[7]
D18 R0[2] R1[2] R2[2] D6 B0[6] B1[6] B2[6]
D17 R0[1] R1[1] R2[1] D5 B0[5] B1[5] B2[5]
D16 R0[0] R1[0] R2[0] D4 B0[4] B1[4] B2[4]
D15 G0[7] G1[7] G2[7] D3 B0[3] B1[3] B2[3]
D14 G0[6] G1[6] G2[6] D2 B0[2] B1[2] B2[2]
D13 G0[5] G1[5] G2[5] D1 B0[1] B1[1] B2[1]
D12 G0[4] G1[4] G2[4] D0 B0[0] B1[0] B2[0]
TFP410
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data de-skew feature
The de-skew feature allows adjustment of the input setup/hold time. Specifically, the input data DATA[23:0] can
be latched slightly before or after the latching edge of the clock IDCK± depending on the amount of de-skew
desired. When de-skew enable (DKEN) is enabled, the amount of de-skew is programmable by setting the three
bits DK[3:1]. When disabled, a default de-skew setting is used. To allow maximum flexibility and ease of use,
DKEN and DK[3:1] are accessed directly through configuration pins when I2C is disabled, or through registers
of the same name when I2C is enabled. When using I2C mode, the DKEN pin should be tied to ground to avoid
a floating input.
The input setup/hold time can be varied with respect to the input clock by an amount t(CD) given by the formula:
t(CD) = (DK[3:1] – 4) × t(STEP)
Where:
t(STEP) is the adjustment increment amount
DK[3:1] is a number from 0 to 7 represented as a 3-bit binary number
t(CD) is the cumulative de-skew amount
(DK[3:1]-4) is simply a multiplier in the range {-4,-3,-2,-1, 0, 1, 2, 3} for t(STEP). Therefore, data can be latched
in increments from 4 times the value of t(STEP) before the latching edge of the clock to 3 times the value of t(STEP)
after the latching edge. Note that the input clock is not changed, only the time when data is latched with respect
to the clock.
t(CD)
000
4 × t(STEP)
100
0
Default Falling
111
3 × t(STEP)
000
4 × t(STEP)
100
0
Default Rising
111
3 × t(STEP)
DATA[23:0]
IDCK±
DK[3:1]
t(CD)
t(CD) t(CD) t(CD)
Figure 8. A Graphical Representation of the De-Skew Function
hot plug/unplug (auto connect/disconnect detection)
TFP410 supports hot plug/unplug (auto connect/disconnect detection) for the DVI link. The receiver sense input
(RSEN) bit indicates if a DVI receiver is connected to TXC+ and TXC-. The HTPLG bit reflects the current state
of the HTPLG pin connected to the monitor via the DVI connector. When I2C is disabled (ISEL=0), the RSEN
value is available on the MSEN pin. When I2C is enabled, the connection status of the DVI link and HTPLG sense
pins are provided by the CTL_2_MODE register. The MSEL bits of the CTL_2_MODE register can be used to
program the MSEN to output the HTPLG value, the RSEN value, an interrupt, or be disabled.
The source of the interrupt event is selected by TSEL in the CTL_2_MODE register. An interrupt is generated
by a change in status of the selected signal. The interrupt status is indicated in the MDI bit of CTL_2_MODE
and can be output via the MSEN pin. The interrupt continues to be asserted until a 1 is written to the MDI bit,
resetting the bit back to 0. Writing 0 to the MDI bit has no effect.
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device configuration and I2C RESET description
The TFP410 device configuration can be programmed by several different methods to allow maximum flexibility
for the user’s application. Device configuration is controlled depending on the state of the ISEL/RST pin,
configuration pins (BSEL, DSEL, EDGE, VREF) and state pins (PD, DKEN). I2C bus select and I2C RESET
(active low) are shared functions on the ISEL/RST pin, which operates asynchronously.
Holding ISEL/RST low causes the device configuration to be set by the configuration pins (BSEL, DSEL, EDGE,
and VREF) and state pins (PD, DKEN). The I2C bus is disabled.
Holding ISEL/RST high causes the chip configuration to be set based on the configuration bits (BSEL, DSEL,
EDGE) and state bits (PD, DKEN) in the I2C registers. The I2C bus is enabled.
Momentarily bringing ISEL/RST low and then back high while the device is operating in normal or power-down
mode will RESET the I2C registers to their default values. The device configuration will be changed to the default
power-up state with I2C enabled. After power up, the device must be reset. It is suggested that this pin be tied
to the system reset signal, which is low during power up and is then asserted high after all the power supplies
are fully functional.
DE generator
The TFP410 contains a DE generator that can be used to generate an internal DE signal when the original data
source does not provide one. There are several I2C programmable values that control the DE generator (see
Figure 9). DE_GEN in the DE_CTL register enables this function. When enabled, the DE pin is ignored.
DE_TOP and DE_LIN are line counts used to control the number of lines after VSYNC goes active that DE is
enabled, and the total number of lines that DE remains active, respectively. The polarity of VSYNC must be set
by VS_POL in the DE_CTL register.
DE_DLY and DE_CNT are pixel counts used to control the number of pixels after HSYNC goes active that DE
is enabled, and the total number of pixels that DE remains active, respectively. The polarity of HSYNC must be
set by HS_POL in the DE_CTL register.
The TFP410 also counts the total number of HSYNC pulses between VSYNC pulses, and the total number of
pixels between HSYNC pulses. These values, the total vertical and horizontal resolutions, are available in
V_RES and H_RES, respectively. These values are available at all times, whether or not the DE generator is
enabled.
TFP410
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DE generator (continued)
Actual Display Area
DE_CNT
DE_LIN
Full Vertical Frame
DE_TOP
V_RES
H_RES
DE_DLY
Figure 9. DE Generator Register Functions
register map
The TFP410 is a standard I2C slave device. All the registers can be written and read through the I2C interface
(unless otherwise specified). The TFP410 slave machine supports only byte read and write cycles. Page mode
is not supported. The 8-bit binary address of the I2C machine is 0111 A3A2A1X, where A[3:1] are pin
programmable or set to 000 by default. The I2C base address of the TFP410 is dependent on A[3:1] (pins 6,
7 and 8 respectively) as shown below.
A[3:1] WRITE ADDRESS
(Hex)
READ ADDRESS
(Hex)
000 70 71
001 72 73
010 74 75
011 76 77
100 78 79
101 7A 7B
110 7C 7D
111 7E 7F
TFP410
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register map (continued)
REGISTER RW SUB-
ADDRESS BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0
VEN_ID R 00 VEN_ID[7:0]
R 01 VEN_ID[15:8]
DEV_ID R 02 DEV_ID[7:0]
R 03 DEV_ID[15:8]
REV_ID R 04 REV_ID[7:0]
RESERVED R 05-07 Reserved
CTL_1_MODE RW 08 RSVD TDIS VEN HEN DSEL BSEL EDGE PD
CTL_2_MODE RW 09 VLOW MSEL TSEL RSEN HTPLG MDI
CTL_3_MODE RW 0A DK DKEN CTL RSVD
CFG RW 0B CFG
RESERVED RW 0C-31 Reserved
DE_DLY RW 32 DE_DLY[7:0]
DE_CTL RW 33 RSVD DE_GEN VS_POL HS_POL RSVD DE_DLY[8]
DE_TOP RW 34 RSVD DE_DLY[6:0]
RESERVED RW 35 Reserved
DE_CNT RW 36 DE_CNT[7:0]
RW 37 Reserved DE_CNT[10:8]
DE_LIN RW 38 DE_LIN[7:0]
RW 39 Reserved DE_LIN[10:8]
H_RES R 3A H_RES[7:0]
R 3B Reserved H_RES[10:8]
V_RES R 3C V_RES[7:0]
R 3D Reserved V_RES[10:8]
RESERVED R 3EFF
register descriptions
VEN_ID Sub-Address = 0100 Read Only Default = 0x014C
7 6 5 4 3 2 1 0
VEN_ID[7:0]
VEN_ID[15:8]
These read-only registers contain the 16-bit Texas Instruments vendor ID. VEN_ID is hardwired to 0x014C.
DEV_ID Sub-Address = 0302 Read Only Default = 0x0410
76 5 4 3 2 1 0
DEV_ID[7:0]
DEV_ID[15:8]
These read-only registers contain the 16-bit device ID for the TFP410. DEV_ID is hardwired to 0x0410.
REV_ID Sub-Address = 04 Read Only Default = 0x00
7 6 5 4 3 2 1 0
REV_ID[7:0]
This read-only register contains the revision ID.
TFP410
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register descriptions (continued)
RESERVED Sub-Address = 0705 Read Only Default = 0x641400
7 6 5 4 3 2 1 0
RESERVED[7:0]
RESERVED[7:0]
RESERVED[15:8]
CTL_1_MODE Sub-Address = 08 Read/Write Default = 0xFE
7 6 5 4 3 2 1 0
RSVD TDIS VEN HEN DSEL BSEL EDGE PD
PD: This read/write register contains the power-down mode.
0: Power down (default after RESET)
1: Normal operation
EDGE: This read/write register contains the edge select mode.
0: Input data latches to the falling edge of IDCK+
1: Input data latches to the rising edge of IDCK+
BSEL: This read/write register contains the input bus select mode.
0: 12-bit operation with dual-edge clock
1: 24-bit operation with single-edge clock
DSEL:This read/write register is used in combination with BSEL and VREF to select the single-ended or differential
input clock mode. In the high-swing mode, DSEL is a don’t care since IDCK is always single-ended.
HEN: This read/write register contains the horizontal sync enable mode.
0: HSYNC input is transmitted as a fixed low
1: HSYNC input is transmitted in its original state
VEN: This read/write register contains the vertical sync enable mode.
0: VSYNC input is transmitted as a fixed low
1: VSYNC input is transmitted in its original state
TDIS: This read/write register contains the T.M.D.S. disable mode.
0: T.M.D.S. circuitry enable state is determined by PD.
1: T.M.D.S. circuitry is disabled.
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register descriptions (continued)
CTL_2_MODE Sub-Address = 09 Read/Write Default = 0x00
76 5 4 3 2 1 0
VLOW MSEL[3:1] TSEL RSEN HTPLG MDI
MDI: This read/write register contains the monitor detect interrupt mode.
0: Detected logic level change in detection signal (to clear, write one to this bit)
1: Logic level remains the same
HTPLG: This read only register contains the hot plug detection input logic state.
0: Logic level detected on the EDGE/HTPLG pin (pin 9)
1: High level detected on the EDGE/HTPLG pin (pin 9)
RSEN: This read only register contains the receiver sense input logic state, which is valid only for dc-coupled systems.
0: A powered-on receiver is not detected
1: A powered-on receiver is detected (i.e. connected to the DVI transmitter outputs)
TSEL: This read/write register contains the interrupt generation source select.
0: Interrupt bit (MDI) is generated by monitoring RSEN
1: Interrupt bit (MDI) is generated by monitoring HTPLG
MSEL: This read/write register contains the source select of the monitor sense output pin.
000: Disabled. MSEN output high
001: Outputs the MDI bit (interrupt)
010: Outputs the RSEN bit (receiver detect)
011: Outputs the HTPLG bit (hot plug detect)
VLOW: This read only register indicates the VREF input level.
0: This bit is a logic level (0) if the VREF analog input selects high-swing inputs
1: This bit is a logic level (1) if the VREF analog input selects low-swing inputs
CTL_3_MODE Sub-Address = 0A Read/Write Default = 0x80
7 6 5 4 3 2 1 0
DK[3:1] DKEN CTL[3:1] RSVD
CTL[3:1]:This read/write register contains the values of the three CTL[3:1] bits that are output on the DVI port during
the blanking interval.
DKEN: This read/write register controls the data de-skew enable.
0: Data de-skew is disabled, the values in DK[3:1] are not used
1: Data de-skew is enabled, the de-skew setting is controlled through DK[3:1]
DK[3:1]: This read/write register contains the de-skew setting, each increment adjusts the skew by t(STEP).
000: Step 1 (minimum setup/maximum hold)
001: Step 2
010: Step 3
011: Step 4
100: Step 5 (default)
101: Step 6
110: Step 7
111: Step 8 (maximum setup/minimum hold)
TFP410
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register descriptions (continued)
CFG Sub-Address = 0B Read Only
76 5 4 3 2 1 0
CFG[7:0] (D[23:16])
This read-only register contains the state of the inputs D[23:16]. These pins can be used to provide the user with
selectable configuration data through the I2C bus.
RESERVED Sub-Address = 0E0C Read/Write Default = 0x97D0A9
7 6 5 4 3 2 1 0
RESERVED
RESERVED
RESERVED
These read/write registers have no effect on TFP410 operation.
DE_DLY Sub-Address = 32 Read/Write Default = 0x00
7 6 5 4 3 2 1 0
DE_DLY[7:0]
This read/write register defines the number of pixels after HSYNC goes active that DE is generated, when the DE
generator is enabled.
DE_CTL Sub-Address = 33 Read/Write Default = 0x00
76 5 4 3 2 1 0
Reserved DE_GEN VS_POL HS_POL Reserved DE_DLY[8]
DE_DLY[8]: This read/write register contains the top bit of DE_DLY.
HS_POL: This read/write register sets the HSYNC polarity.
0: HSYNC is considered active low.
1: HSYNC is considered active high.
Pixel counts are reset on the HSYNC active edge.
VS_POL: This read/write register sets the VSYNC polarity.
0: VSYNC is considered active low.
1: VSYNC is considered active high.
Line counts are reset on the VSYNC active edge.
DE_GEN: This read/write register enables the internal DE generator.
0: DE generator is disabled. Signal required on DE pin
1: DE generator is enabled. DE pin is ignored.
DE_TOP Sub-Address = 34 Read/Write Default = 0x00
76 5 4 3 2 1 0
DE_TOP[7:0]
This read/write register defines the number of pixels after VSYNC goes active that DE is generated, when the DE
generator is enabled.
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register descriptions (continued)
DE_CNT Sub-Address = 3736 Read/Write Default = 0x0000
76 5 4 3 2 1 0
DE_CNT[7:0]
Reserved DE_CNT[10:8]
These read/write registers define the width of the active display, in pixels, when the DE generator is enabled.
DE_LIN Sub-Address = 3938 Read/Write Default = 0x0000
7 6 5 4 3 2 1 0
DE_LIN[7:0]
Reserved DE_LIN[10:8]
These read/write registers define the height of the active display, in lines, when the DE generator is enabled.
H_RES Sub-Address = 3B3A Read Only
76 5 4 3 2 1 0
H_RES[7:0]
Reserved H_RES[10:8]
These read-only registers return the number of pixels between consecutive HSYNC pulses.
V_RES Sub-Address = 3D3C Read Only
7 6 5 4 3 2 1 0
V_RES[7:0]
Reserved V_RES[10:8]
These read-only registers return the number of lines between consecutive VSYNC pulses.
I2C interface
The I2C interface is used to access the internal TFP410 registers. This two-pin interface consists of the SCL
clock line and the SDA serial data line. The basic I2C access cycles are shown in Figure 10 and Figure 11.
Start Condition (S) Stop Condition (P)
SDA
SCL
Figure 10. I2C Start and Stop Conditions
The basic access write cycle consists of the following:
1. A start condition
2. A slave address cycle
3. A sub-address cycle
4. Any number of data cycles
5. A stop condition
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I2C interface (continued)
The basic access read cycle consists of the following:
1. A start condition
2. A slave write address cycle
3. A sub-address cycle
4. A restart condition
5. A slave read address cycle
6. Any number of data cycles
7. A stop condition
The start and stop conditions are shown in Figure 10. The high to low transition of SDA while SCL is high defines
the start condition. The low to high transition of SDA while SCL is high defines the stop condition. Each cycle,
data or address, consists of 8 bits of serial data followed by one acknowledge bit generated by the receiving
device. Thus, each data/address cycle contains 9 bits as shown in Figure 11.
SCL
1 2 3 4 5 6 7 8 9
SDA
1 2 3 4 5 6 7 8 9 2 3 4 5 6 71
Slave Address Sub-Address Data Stop
89
Figure 11. I2C Access Cycles
Following a start condition, each I2C device decodes the slave address. The TFP410 responds with an
acknowledge by pulling the SDA line low during the ninth clock cycle if it decodes the address as its address.
During subsequent sub-address and data cycles, the TFP410 responds with acknowledge as shown in
Figure 12. The sub-address is auto-incremented after each data cycle.
The transmitting device must not drive the SDA signal during the acknowledge cycle so that the receiving device
may drive the SDA signal low. The master indicates a not acknowledge condition (/A) by keeping the SDA signal
high just before it asserts the stop condition (P). This sequence terminates a read cycle as shown in Figure 13.
The slave address consists of 7 bits of address along with 1 bit of read/write information (read = 1, write = 0)
as shown below in Figures 11 and 12. For the TFP410, the selectable slave addresses (including the R/W bit)
using A[3:1]are 0x70, 0x72, 0x74, 0x76, 0x78, 0x7A, 0x7C, and 0x7E for write cycles and 0x71, 0x73, 0x75,
0x77, 0x79, 0x7B, 0x7D, and 0x7F for read cycles.
SSlave Address W A Sub-Address A Data A Data A P
Where:
From Master A Acknowledge
From Slave S Start condition
P Stop Condition
Figure 12. I2C Write Cycle
TFP410
TI PanelBus DIGITAL TRANSMITTER
SLDS145B OCTOBER 2001 REVISED MAY 2011
23
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
I2C interface (continued)
SSlave Address W A Sub-Address A Sr Slave Address R A Data A Data /A P
Where:
From Master A Acknowledge
From Slave S Start condition
/A Not acknowledge (SDA high) P Stop Condition
R Read Condition = 1 Sr Restart Condition
W Write Condition = 0
Figure 13. I2C Read Cycle
TI PowerPAD 64-pin TQFP package
The TFP410 is available in TI’s thermally enhanced 64-pin TQFP PowerPAD package. The PowerPAD package
is a 10mm × 10mm × 1,0 mm TQFP outline with 0,5 mm lead-pitch. The PowerPAD package has a specially
designed die mount pad that offers improved thermal capability over typical TQFP packages of the same outline.
The TI 64-pin TQFP PowerPAD package offers a backside solder plane that connects directly to the die mount
pad for enhanced thermal conduction. For thermal considerations, soldering the backside of the TFP410 to the
application board is not required since the device power dissipation is well within the package capability when
not soldered.
Soldering the backside of the device to the PCB ground plane is recommended for electrical considerations.
Because the die pad is electrically connected to the chip substrate and hence chip ground, connecting the back
side of the PowerPAD package to a PCG ground plane provides a low-inductance, low-impedance connection
to help improve EMI, ground bounce, and power supply noise performance.
Table 2 contains the thermal properties of the TI 64-pin TQFP PowerPAD package. The 64-pin TQFP
non-PowerPAD package is included only for reference.
Table 2. TI 64-Pin TQFP (10 × 10 × 1,0 mm)/0,5 mm Lead-Pitch
PARAMETER WITHOUT
PowerPAD
PowerPAD
NOT CONNECTED TO
PCB THERMAL PLANE
PowerPAD
CONNECTED TO PCB
THERMAL PLANE
(see Note 13)
RθJA
Thermal resistance, junction-to-ambient
(see Notes 13 and 14) 75.83°C/W 42.20°C/W 21.47°C/W
RθJC Thermal resistance, junction-to-case (see Notes 13 and 14) 7.80°/W 0.38°C/W 0.38°C/W
PD
Power handling capabilities of package (see Notes 13, 14,
and 15) 0.92 W 1.66 W 3.26 W
NOTES: 13. Specified with the PowerPAD bond pad on the backside of the package soldered to a 2-oz. Cu plate PCB thermal plane.
14. Airflow is at 0 LFM (no airflow)
15. Specified at 150°C junction temperature and 80°C ambient temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 6-May-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TFP410PAP ACTIVE HTQFP PAP 64 160 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
TFP410PAPG4 ACTIVE HTQFP PAP 64 160 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TFP410 :
Enhanced Product: TFP410-EP
NOTE: Qualified Version Definitions:
PACKAGE OPTION ADDENDUM
www.ti.com 6-May-2011
Addendum-Page 2
Enhanced Product - Supports Defense, Aerospace and Medical Applications
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