MURF1620CTG - ON Semiconductor

April, 2006 − Rev. 5

1Publication Order Number:

MURF1620CT/D

MURF1620CT

Preferred Device

SWITCHMODEt

Power Rectifier

These state−of−the−art devices are designed for use in switching

power supplies, inverters and as free wheeling diodes.

Features

•Ultrafast 35 Nanosecond Recovery Times

•150°C Operating Junction Temperature

•Epoxy Meets UL 94 V−0 @ 0.125 in

•High Temperature Glass Passivated Junction

•Low Leakage Specified @ 150°C Case Temperature

•Current Derating @ Both Case and Ambient Temperatures

•Electrically Isolated. No Isolation Hardware Required.

•UL Recognized File #E69369 (Note 1)

•Pb−Free Package is Available*

Mechanical Characteristics:

•Case: Epoxy, Molded

•Weight: 1.9 Grams (Approximately)

•Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

•Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds

MAXIMUM RATINGS (Per Leg)

Rating Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

200 V

Average Rectified Forward Current

Total Device, (Rated VR), TC = 150°C

Total Device

IF(AV) 8

Peak Repetitive Forward Current

(Rated VR, Square Wave, 20 kHz),

TC = 150°C

IFM 16 A

Non−repetitive Peak Surge Current

(Surge applied at rated load conditions

halfwave, single phase, 60 Hz)

IFSM 100 A

Operating Junction and Storage Temperature TJ, Tstg −65 to +150 °C

RMS Isolation Voltage

(t = 1 second, R.H. ≤ 30%, TA = 25°C)

(Note 2) Per Figure 3

Per Figure 4 (Note 1)

Per Figure 5

Viso1

Viso2

Viso3

4500

3500

1500

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

1. UL Recognized mounting method is per Figure 4

2. Proper strike and creepage distance must be provided.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Device Package Shipping

ORDERING INFORMATION

MURF1620CT TO−220

ISOLATED TO−220

CASE 221D

STYLE 3

50 Units/Rail

ULTRAFAST RECTIFIER

16 AMPERES, 200 VOLTS

Preferred devices are recommended choices for future use

and best overall value.

MARKING

DIAGRAM

A = Assembly Location

Y = Year

WW = Work Week

U1620 = Device Code

G = Pb−Free Package

AKA = Diode Polarity

http://onsemi.com

MURF1620CTG TO−220

(Pb−Free)

50 Units/Rail

AYWW

U1620G

A K A

MURF1620CT

http://onsemi.com

THERMAL CHARACTERISTICS (Per Leg)

Rating Symbol Value Unit

Maximum Thermal Resistance, Junction−to−Case RqJC 4.2 °C/W

Lead Temperature for Soldering Purposes: 1/8″ from the Case for 5 seconds TL260 °C

ELECTRICAL CHARACTERISTICS (Per Leg)

Characteristic Symbol Value Unit

Maximum Instantaneous Forward Voltage (Note 3)

(iF = 8.0 A, TC = 150°C)

(iF = 8.0 A, TC = 25°C)

vF0.895

0.975

Maximum Instantaneous Reverse Current (Note 3)

(Rated DC Voltage, TC = 150°C)

(Rated DC Voltage, TC = 25°C)

iR250

5.0

Maximum Reverse Recovery Time

(IF = 1.0 A, di/dt = 50 A/ms)

(IF = 0.5 A, iR = 1.0 A, IREC = 0.25 A)

trr 35

3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.

VR, REVERSE VOLTAGE (VOLTS)

IR, REVERSE CURRENT (A)m

0.01

0.04

0.1

0.4

1.0

2.0

100

400

1.0 k

20016012080400

100

, INSTANTANEOUS FORWARD CURRENT (AMPS)

5.0

2.0

1.0

0.1

0.2 0.4 0.6 0.8 1.0 1.2

vF, INSTANTANEOUS VOLTAGE (VOLTS)

Figure 1. Typical Forward Voltage, Per Leg

0.3

TJ = 100°C25°C

20 60 100 140 180

TJ = 100°C

25°C

10 k

Figure 2. Typical Reverse Current, Per Leg*

MURF1620CT

http://onsemi.com

TEST CONDITIONS FOR ISOLATION TESTS*

MOUNTED

FULLY ISOLATED PACK-

AGE

LEADS

HEATSINK

0.110, MIN

Figure 3. Clip Mounting Position

for Isolation Test Number 1

* Measurement made between leads and heatsink with all leads shorted together.

CLIP

MOUNTED

FULLY ISOLATED PACK-

AGE

LEADS

HEATSINK

CLIP 0.099″ MIN

MOUNTED

FULLY ISOLATED PACK-

AGE

LEADS

HEATSINK

0.099″ MIN

Figure 4. Clip Mounting Position

for Isolation Test Number 2

Figure 5. Screw Mounting Position

for Isolation Test Number 3

MOUNTING INFORMATION**

4−40 SCREW

PLAIN WASHER

HEATSINK

COMPRESSION WASHER

NUT

CLIP

HEATSINK

Figure 6. Typical Mounting Techniques

6a. Screw−Mounted 6b. Clip−Mounted

Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting

technique, a screw torque of 6 to 8 in .lbs is sufficient to provide maximum power dissipation capability. The compression

washer helps to maintain a constant pressure on the package over time and during large temperature excursions.

Destructive laboratory tests show that using a hex head 4−40 screw, without washers, and applying a torque in excess of 20

in .lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.

Additional tests on slotted 4−40 screws indicate that the screw slot fails between 15 to 20 in .lbs without adversely affecting

the package. However, in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does

not recommend exceeding 10 in .lbs of mounting torque under any mounting conditions.

**For more information about mounting power semiconductors see Application Note AN1040.

MURF1620CT

http://onsemi.com

PACKAGE DIMENSIONS

STYLE 3:

PIN 1. ANODE

2. CATHODE

3. ANODE

DIM

MIN MAX MIN MAX

MILLIMETERS

0.625 0.635 15.88 16.12

INCHES

B0.408 0.418 10.37 10.63

C0.180 0.190 4.57 4.83

D0.026 0.031 0.65 0.78

F0.116 0.119 2.95 3.02

G0.100 BSC 2.54 BSC

H0.125 0.135 3.18 3.43

J0.018 0.025 0.45 0.63

K0.530 0.540 13.47 13.73

L0.048 0.053 1.23 1.36

N0.200 BSC 5.08 BSC

Q0.124 0.128 3.15 3.25

R0.099 0.103 2.51 2.62

S0.101 0.113 2.57 2.87

U0.238 0.258 6.06 6.56

−B−

−Y−

3 PL

123

0.25 (0.010) Y

SEATING

PLANE

−T−

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH

3. 221D−01 THRU 221D−02 OBSOLETE, NEW

STANDARD 221D−03.

TO−220 FULLPAK TRANSISTOR

CASE 221D−03

ISSUE G

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Japan: ON Semiconductor, Japan Customer Focus Center

2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051

Phone: 81−3−5773−3850

MURF1620CT/D

SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 61312, Phoenix, Arizona 85082−1312 USA

Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada

Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: http://onsemi.com

Order Literature: http://www.onsemi.com/litorder

For additional information, please contact your

local Sales Representative.