‘! \ . .
r 1
I I ,1 i ::
“,
“1 .,& i” , :.,i %,~,,>V<,,L > a>“_
4
_j : **
Xl
I *k .. ,., *t *.; :, ;: a; y <.~ E ~,* ‘:, T <’ ‘;i‘<“: $ a* I Ri <;
‘-\ ‘,,’
._“_ I’
Characteristic-All Types Test Conditions Symbol Min Typ Max Unit
Reverse Bre*down Voltage IR =10 pAdc Bn 60 70 Vdc w’
Reverse Voltage Le~age Current VR =55 Vdc, TA =25°C IR 0.02 pAdc
VR =55 Vdc, TA =150°C 20
Series hductmce f=250 MHz, Lx1/16~) LS 5~*2;.+
Case Capacitance f=1MHz, L%1/16’) cc 0.25 f:,&:
,,*,.‘$.,~..
,:i>
Diode Capacitance Temperature ‘),;,l+..!,s.
~!:~J\~.?:,{
Coefficient VR=4VdC, f=l MHz TCC 200 ~w$:b,p”:~ PP4°c
,:~::~,,:4..+y,<;’
v,...<, ..(,
IDevice
I1N5139
1N5139A
1N5140
1N5140A
1N5141
1N5141A
1N5142
1N5142A
1N5143
1N5143A
1N5144
1N5144A
1N5145
1N5145A
1N5146
1N5146A
-
1N5147
1N5147A
1N5148
1N5148A
1.
2.
3.
4.
5.
Cr, Diode Capacitance Q, Figure of Merit .:
VR=4Vdc, f=l MHz VR =4Vdc, VR =4Vd; f=1w~e..
.\,.yJ/>,&,
pF f=50 MHz ‘“~-~.>...~.
:,.‘.!.Ji>,:.,,,
10.8 12.0 13.2 300 .. ~;~$ 0.38 0.41
11.4 12.0 12.6 300 .&$;,, 0.38 0.41
13.5 15.0 16.5 25Q:,.,,,. ‘h<.: 0.38 0.41
14.3 15.0 15.7 .zf~ ‘$ 0.38 0.41
.’<1.,,:.*,,\N~
16.2 18.0 19.8 ..,,,.:,,:,\~ 0.38 0.41
17.1 18.0 18.9 $~+\..,>..
,$ 0.38 0.41
19.8 22.0 24.2 ,,)$ 200 0.43 0.45
20.9 22.0 23.1 .~~. .200
.,,,:>l.,;$, 0.43 0.45
Min Typ
2.7 2.9
2.7 2.9
2.8 3.0
2.8 3.0
2.8 3.0
2.8 3.0
2.8 3.0
2.8 3.0
2.8 3.0
2.8 3.0
3.2 3.4
3.2 3.4
*
3.2 3.4
3.2 3.4
3.2 3.4
3.2 3.4
3.2 3.4
3.2 3.4
3.2 3.4
3.2 3.4
1s,SERIES lNDUCTA~’~ ‘“ tance bridge at the specified frequency and substituting in
LSis measured on’k,”~tied package at 250 MHz using an the following equations:
$
impedance bri ~.$~,oonton Radio Model 250A RX Meter). 2rfc
L=lead Ienst i;. “’$ Q=T
~:.. .1+
.~,,:’’~;:;,,} (Boonton Electronics Model 33AS8).
Cc, CA$Fi\~&fTANCE 6. a, DIODE CAPACITANCE REVERSE VOLTAGE SLOPE
cc i~,~~s$ted on an open package at 1MHz using aca- The diode capacitance, CT (as measured at VR =4Vdc,
pa@#t’~~~&’’bridge (Boonton Electronics Model 75A or
.RqtiJ$5Y&nt). f=1MHz) is compared to CT(as measured at V, =60 Vdc,
:;~?~.....:*J f=1MHz) by the following equation which defines a.
,i>,,..,,...,\
&;tiODE CAPACITANCE log C,(4) log CT(60)
a= 10~ 60 10~ 4
(C, =CC +CJ). C, is measured at 1MHz using acapaci-
tance bridge (Boon ton Electronics Model 75A or
equivalent).
TR,TUNING RATIO
TR is the ratio of C, measured at 4Vdc divided by CTmeas-
ured at 60 Vdc.
Q, FIGURE OF MERIT
Qis calculated by taking the Gand Creadings of an admit-
Note that aC, versus vR-law is a;sumed as shown in the
following equation where CC is included.
7. TCC, DIODE CAPACITANCE TEMPERATURE COEFFICIENT
TCC is guaranteed by comparing CT at V, =4Vdc, f=
1MHz, T. =–65° Cwith CT at VR =4Vdc, f=1MHz,
T. =+85°C in the following equation which defines TCC:
TCC =C,(+85°C) C,(–65” C) 1. 106
85 +65 C,(25° C)
MOTOROLA Semiconductor Products Inc. @00000000 00000000
100
70
50
1
1,020
1.010
0.960
FIGURE 1 DIODE CAPACITANCEversusREVERSEVOLTAGE
1.0 3.0 5.0 7.0 10 30 5060
VR,REVERSEVOLTAGE(VOLTS)
FIGURE 3– NORMALIZED DIODE CAPACITANCE
versusJUNCTION TEMPERATURE
40
32
a
o 10 –20 –30 –40
VR,
REVERSEVOLTAGE(VOLTS)
)00000000 00000000
@
-50 –60
10000
7000
5000
3000
~
2
k
~1000
~700
m
u- 500
300
100
140
FIGURE 2 FIGURE OF MERITversusREVERSEVOLTAGE
1 1 1 [1I1
III[1 ITA = 25°C
f=50 MHz
I
,1 1
I1[
*WE 4- NORMALIZED FIGURE OF MERIT
,,.:,y:w’:~isus JUNCTION TEMPERATURE
M070ROLA
?= 50MHz
70 II1
–65 –50 –25 o+25 +50 +75 +85
2000
1000
700
500
300
100
T,,JUNCTIONTEMPERATURE(°C)
FIGURE 6 FIGURE OF MERITversusFREQUENCY
10 30 50 70 100
f,FREQUENCY(MHz)
Semiconductor Products Inc.
EPICAP VOLTAGE VARIABLE CAPACITANCE DIODE DEVICE CONSIDERATIONS
A. EPICAP NETWORK PRESENTATION FIGURE 7d
The equivalent circuit in Figure 7shows the voltage capaci- Cc)l
tance and parasitic elements of an EPICAP diode. For design
purposes at all but very high and very low frequencies, Ls, RJ, )1
and CC can be neglected. The simplified equivalent circuit of
Figure 8represents the diode under these conditions. CJ {:.?
71
Definitions: R,
CJ Voltage Variable Junction Capacitance
RS Series Resistance (semiconductor bulk, contact,
and lead resistance) ~,1~
Cc Case Capacitance ,,$,
FIGURE 8
LSSeries Inductance
RJ Voltage Variable Junction Resistance (negligible c,
above 100 kHz) oVI ~,:.\..?,.:.K:.
B. EPICAP CAPACITANCE VS REVERSEBIAS VOLTAGE CT= CC+CJ :xd>y,b “’*
J* (1)
..:.,:\:.
The most important design characteristic of an EPICAP C,= CC+ c“ ~‘{[,~”,{ (2)
diode is the C, versus VRvariation as shown in equations 1and (1 +$$$:$’”
2. Since the designer is primarily interested in the slope of CT C.= C, at VR =O
versus VR, the CC, CO, o, and Ycharacteristics have been en- ‘*,‘:,.. V, =Reverse Bias
. ,.“$?.
compassed by the simplified equation 3. Min/max limits on @=Contact Potent~*~W*.y o’~6vOlt ~ = CJ slope, ~z0.5
a(as defined in Note 6) can be guaranteed over aspecified
V~ range. c,= ~>$,; ’’”” (3)
sv&$4, .,?
\~,\.t
,i,;:\;2:1-
.Jt’.,.
,,* *J;:..
.$/:,
,?i~~e.),,,
.,!),l.,
,~\*\..%*,, \.
JJ: -1>,\
,.~,
..,, ‘$\:
\\$:\,i.;:.:.l,,!:>
J,.r,,
,$\i,y,*?$,\,t,*;,.
‘,:$.,
~1.?,
,,+$
C. EPICAP CAPACITANCE VS FREQUENCY
Variations in EPICAP effective capacitance, as a function of
operating frequency, can be derived from asimplified equiv-
alent circuit similar to that of Figure 7, but neglecting RS and
R,. The admittance expression for such acircuit is given in
equation 4. Examination of equation 4yields the following
information:
At low frequencies, C,. =CJ; at very high freque~~~es
(f= m) C.q -cc. . .,i,
..
As frequency is increased from 1MHz, C., incre~&2$@n%~
it is maximum at W2 =1/LsCJ: and as WZ is incraa&~%6m
1/LsC, toward infinity, C.; increases from ave~:~~~~e ca-
pacitance (inductance) toward C., =Cc, apositi%.c~,@~tan ce.
Very simple calculations for C., at highe~$~.$~~%mcles indi-
cate the problems encountered when cap%~~-surements
~~~ <LsC,, small
are made above 1MHz. As uapproach esi.w. %.{
variations in Ls cause extreme variat~~%~~:,~easured diode
capacitance. ,.. ~~\
%<
,+:~,+:,:,,
.,~t.,~,.iy
..;:....
y=j.C.q =Jwc.+1 T~LsCJ (4)
0. EPICAP FIGURE OF MERIT (~h@WtiTOFF FREQUENCY (f..)
The efficiency of EPIC& re%se to an input frequency is
related to the Figure of ,~~@tof the device as defined in equa-
tion 5. For very low f&@~FR@ies, equation 6applies whereas
at high frequencie~~~fi,e~d” Rj can be neglected, equation 5
may be rewritten i~$dw familiar form of equation 7.
Another usefd~<~&&meter for EPICAP devices is the cutoff
frequency (f.:~:~lk is merely that frequency at which Qis
equal to l..~~u~~on 8gives this relationship.
,:,$> *J
.....
,,..,,...,:\., ~?,.>,:.t!:,
E. H~~%$lW GENERATION USING EPICAPS
,<:\*s\,+l.,,,,.:-::,
gf@9~flt harmonic generation is possible with Motorola
EPl@PS because of their high cutoff frequency and break-
down voltage. Since EPICAP junction capacitance varies in-
versely with the square root of the breakdown voltage,
harmonic generator performance can be accurately predicted
from various idealized models. Equation 9gives the level of
maximum input power for the EPICAP and equation 10 gives
the relationshi~s governing EPICAP circuit efficiency. In these
Q=%
Rsa~ (5)
Q,, =UCJRJ2
RJ +Rs(l +W2CJ2RJ2) (6)
Q,, = ~ (7)
wRsC.*
f.. =Qf.., = ~ (8)
2RRSCBYR
p,~,,) ~M(BV, +o)z f,.
I“ Rs E(9)
M(x2) =0.0285 ;M(x3) =0.0241; M(x4) =0.196
Eff=l– N~ (lo)
co
N(x2) =20.8; N(x3) =34.8; N(x4) =62.5
equations, adequate heat =inking has been assumed. Mand Nare Constants
@
@WOTOROLAINC.,1972
MOTOROLA Semiconductor Products Inc.
OOX 20S12 PHOENIX, ARIZONA 85036 ASUBSIDIARY OF MOTOROLA INC.
,,0”-1,,1,,,. ,, ,,, 7-s5 Im,k,A, ,,,,,0 c,,,,, 1,000 0s,5,,