ATA5575M2250-DDB - Atmel - Datasheet.Live

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Features

●Contactless power supply

●Contactless read/write data transmission

●Radio frequency fRF from 100kHz to 150kHz

●128-bit EEPROM user memory: 16 Bytes (8 Bits each)

●8-bit configuration memory

●High Q-antenna tolerance due to built-in options

●Applications

●Animal ID, waste management, industrial identification

●ISO/IEC 11784/785 compatibility

●FDX-A

●FDX-B

●On-chip trimmed antenna capacitor

●330pF ±3%

●250pF ±3%

●Mega pads 200µm x 400µm

●Mega pads 200µm x 400µm with 25µm gold bumps for direct coil bonding

●Other options:

●Direct access mode

●OTP functionality

ATA5575M2

Read/Write LF RFID IDIC 100kHz to 150kHz

DATASHEET

ATA5575M2 [DATASHEET]

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1. Description

The Atmel® ATA5575M2 is a contactless read/write identification IC (IDIC®) for applications in the 100-kHz to 150-kHz

frequency band. A single coil connected to the chip serves as the IC's power supply and bi-directional communication

interface. This antenna coil together with the chip form a transponder or tag.

The on-chip 128-bit User EEPROM (16 bytes with 8 bits each) can be read and written byte-wise from a base station

(reader). Data is transmitted from the IDIC (uplink) using load modulation. This is achieved by damping the RF field with a

resistive load between the two terminals Coil 1 and Coil 2. The IC receives and decodes serial base station commands

(downlink), which are encoded as 100% amplitude-modulated (OOK) pulse-interval-encoded bit streams.

The Atmel ATA5575M2 is an EEPROM-based circuit. It is optimized for maximum read range. Programming is also possible

but the write range is limited.

The typical animal ID application conforming to ISO11784/85 is read-only and operates at 134.2kHz. The Atmel ATA5575M2

thus has to be locked after programming the animal-specific code.

2. System Block Diagram

Figure 2-1. RFID System Using Atmel ATA5575M2 Tag

3. Atmel ATA5575M2 - Functional Blocks

Figure 3-1. Block Diagram

Data

Reader

Base station

Atmel ATA5575

Power

Transponder

Coil interface

Controller

Memory

(136-bit EEPROM)

Modulator

Analog front end

Data-rate

generator

Write

decoder

POR

Coil 2

Coil 1

Controller

Test logic HV generator

Input register

Mode register

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4. Analog Front End (AFE)

The AFE includes all circuits which are connected directly to the coil terminals. The AFE generates the IC power supply and

handles bi-directional data communication with the reader. The AFE consists of the following blocks:

●Rectifier to generate a DC supply voltage from the AC coil voltage

●Clock extractor

●Switchable load between Coil 1 and Coil 2 for data transmission from tag to the reader

●Field-gap detector for data transmission from the base station to the tag

●ESD protection circuitry

4.1 Data Rate Generator

The data rate of the Atmel ATA5575M2 is programmable to operate at RF/50 (FDX-A mode) and RF/32 (FDX-B mode).

4.2 Write Decoder

The write decoder detects the write gaps and verifies the validity of the data stream according to the Atmel® downlink

protocol (pulse-interval encoding).

4.3 HV Generator

This on-chip charge pump circuit generates the high voltage required for programming the EEPROM.

4.4 DC Supply

Power is supplied externally to the IDIC via the two coil connections. The IC rectifies and regulates this RF source and uses

it to generate its supply voltage.

4.5 Power-On Reset (POR)

The power-on reset circuit blocks the voltage supply to the IDIC until an acceptable voltage threshold has been reached.

This, in turn, triggers the default initialization delay sequence. During this configuration period of 98 field clocks, the

ATA5575M2 is initialized with the configuration data stored in EEPROM byte 16.

4.6 Clock Extraction

The clock extraction circuit uses the external RF signal as its internal clock source.

4.7 Controller

The control logic module executes the following functions:

●Load mode register with configuration data from EEPROM byte 16 after power-on and during reading

●Controls each EEPROM memory read/write access and handles data protection

●Handle downlink command decoding, detecting protocol violations and error conditions

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4.8 Mode Register

The mode register maintains a readable shadow copy of the configuration data held in byte 16 of the EEPROM. It is

continually refreshed during read mode and (re-)loaded after every POR event or reset command. Depending on the

version, upon leaving the Atmel® factory site, the configuration data is pre-programmed according to Table 10-1 on page 18

and Table 10-4 on page 20.

4.9 Modulator

The modulator encodes the serialized EEPROM data for transmission to a tag reader or base station. Two types of encoding

are implemented: Differential Biphase and FSK.

4.10 Memory

The memory is a 136-bit EEPROM arranged in 17 bytes of 8 bits each. Programming takes place on a byte basis meaning a

complete byte is programmed with a single command.

Byte 16 contains the mode/configuration data which is otherwise not transmitted during regular-read operations.

A special combination of bits in byte 16 (see Table 5-1 on page 5) locks the whole memory. Once locked, the memory

(including byte 16 itself) is not reprogrammable through the RF field again.

Figure 4-1. Memory Map

1………………....…………….8

Configuration data Byte 16

User data Byte 15

User data Byte 14

User data Byte 13

User data Byte 12

User data Byte 11

User data Byte 10

User data Byte 9

User data Byte 8

User data Byte 7

User data Byte 6

User data Byte 5

User data Byte 4

User data Byte 3

User data Byte 2

User data Byte 1

User data Byte 0

8 bits

Not transmitted

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5. Operating the Atmel ATA5575M2

5.1 Configuration

The Atmel® ATA5575M2 is mainly designed for ISO11784/11785 applications. It supports FDX-A and FDX-B mode (see also

Figure 7-1 on page 14 for the structure of a FDX-B telegram typically used for animal ID applications). The configuration

In delivery state the default configuration is memory reprogrammable, read user data in diff. biphase RF/32 and ID length

128 bit which leads to the byte value '00001001b'.

5.1.1 Lock-bits

The lock bits of the Configuration register are the bits 1 to 5 of the configuration byte and are able to prevent the whole

memory of the Atmel ATA5575M2 from reprogramming.

As long as the lock bits are set to '00000b' the memory is alterable and the device can be programmed by the customer. In

this case the Atmel ATA5575M2 sends out dummy data (all digits set to '0' in the programmed modulation scheme; see

Section 5.3.3 “Dummy Data” on page 7) after Reset.

If the lock bits are set to '00001b' the memory is still alterable but in difference to the first option the Atmel ATA5575M2 sends

out the programmed user data in the modulation scheme defined with bit 7.

By setting the lock bits to '01101b' the whole memory is locked and cannot be altered. After Reset the Atmel ATA5575M2

enters regular-read mode and sends out the programmed user data in the configured way.

All other combinations of bit 1 - bit 5 are not defined and may lead to malfunction of the IC.

Table 5-1. Atmel ATA5575M2: Byte 16 Configuration Register Mapping

12345678

ID Length

0 64 bits (96 bits for FSK2 RF/50 coding (2))

1128 bits 1)

Modulation

0 Differential bi-phase RF/32 (1)

1 FSK2 RF/50 (2)

Fixed ‘0’

Lock-bits

00001Memory reprogrammable

01101Memory locked

- otherwise - unassigned

Bit 6 must always be at '0', otherwise a malfunction will appear

Notes: 1. Setting for ISO 11785 FDX-B

2. Setting for ISO 11785 FDX-A

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5.1.2 Modulation

The modulator consists of data encoders for the following types of modulation.

5.1.3 ID Length

The Atmel® ATA5575M2 offers settings for different ID lengths. If bit 8 of byte 16 is set to '1', the ID length is 128 bits.

Depending on the modulation scheme, resetting bit 8 of byte 16 to '0' leads either to the ID length of 64 bit with differential bi-

phase coding or to the ID length of 96 bit with FSK2 coding respectively.

5.2 Animal ID and Traceability

During Atmel’s production process the Atmel ATA5575M2 will be pre-configuered in the ISO11784/11785 FDX-B mode and

a unique ID (UID) will be stored in the user memory. The unique ID consists of Atmel’s production information like lot

number, wafer number, and die-on-wafer number. With these data each chip can be traced and concurrently each chip has

its own unique ID for identification purposes(1).

For ISO11784/11785 FDX-B telegrams please refer to Section 7. “Examples for Programming the ATA5575M2” on page 14.

Section 10.2 “ATA5575M2 Configuration on Delivery” on page 18 describes how the unique ID is formed based on Atmel

production information.

Note: 1. Please note that this traceability data is only for production control and does not conform with any ISO, national

or other regulations.

5.3 Tag-to-reader Communication (Uplink)

Immediately after entering the reader field, generating the internal supply voltage and the analog POR, in the delivery state

the tag cycles its data stored in EEPROM by load modulation according to the configuration setting. This resistive load

modulation can be detected at the reader device.

5.3.1 Regular-read Mode

In regular-read mode data from the memory is transmitted in series, starting with byte 0, bit 1, up to the last byte, bit 8. Last

byte is defined in bit 8 of byte 16, ID Length. When the last bit of the last byte (defined by ID length) has been read, data

transmission restarts with byte 0, bit 1.

The device enters regular-read mode in delivery state (lock bits set to '00001b' or set to '01101b'; please refer to Section

5.1.1 “Lock-bits” on page 5).

Last byte is 15, when ID Length = 1 (128 bit).

For differential bi-phase modulation, the last byte is 7 when ID Length = 0 (64 bits) is chosen.

For FSK2 RF/50 modulation, the last byte is 11 when ID length = 0 (96 bits) is chosen.

Every time the Atmel ATA5575M2 enters regular or byte read mode, the first bit transmitted is a logical '0'. The data stream

starts with bit 1 of byte 0 or bit 1 of the addressed byte.

Table 5-2. Atmel ATA5575M2: Types of Modulation

Symbol Direct Data Output Encoding

FSK2 RF/50 FSK/10 – FSK/8 0 = RF/10 1 = RF/8

Differential bi-phase Transition at each bit start

0 creates an additional mid-bit change

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Figure 5-1. Examples of Different ID Length Settings

5.3.2 Byte-read Mode

With the direct access command, only the addressed byte is read repetitively. This mode is called byte-read mode. Direct

access is entered by transmitting the opcode ('10'), a single 0 bit, and the requested 5-bit byte address.

5.3.3 Dummy Data

The dummy data are a predefined bit sequence of all bits set to value '0'. This sequence is read out instead of the data

stored in the user memory if the lock bits are set to '00000b'.

5.4 Reader-to-tag Communication (Downlink)

Data is transmitted to the tag by interrupting the RF field with short field gaps (on-off keying) according to the Atmel®

ATA5577 fixed-bit-length protocol (downlink mode). The duration of these field gaps is, for example, 100µs. The time

between two gaps encodes the 0/1 information to be transmitted (pulse interval encoding). The time between two gaps is

nominally 25 field clocks for a 0 and 58 field clocks for a 1. When there is no gap for more than 64 field clocks after a

previous gap, the Atmel ATA5575M2 exits the downlink mode. The tag starts with the command execution if the correct

number of bits were received. If an error condition occurs, the Atmel ATA5575M2 does not continue command execution

and enters read mode depending on the setting of the lock bits.

The initial gap is referred to as the start gap. This triggers reader-to-tag communication. The start gap may need to be longer

than subsequent gaps - so-called write gaps - in order to be detected reliably.

A start gap is accepted at any time after the mode register has been loaded (≥1ms).

Figure 5-2. Start of Reader-to-tag Communication (Downlink)

Loading byte 16

Byte 6 Byte 7 Byte 1Byte 0Byte 0

ID Length = ‘0’

with diff. Bi-phase

coding

ID Length = ‘0’

with FSK2 coding Loading byte 16

Byte 10 Byte 11 Byte 1Byte 0Byte 0

Loading byte 16

Byte 14 Byte 15 Byte 1Byte 0Byte 0

ID Length = ‘1’

Write modeRead mode

gap

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All absolute times assume TC = 1/fC = 8µs (fC = 125kHz)

5.4.1 Downlink Data Protocol

The Atmel® ATA5575M2 expects to receive a dual bit opcode as a part of a reader command sequence. There are three

valid opcodes and overall five different commands (please refer to Figure 5-4 on page 9):

●The RESET opcode '00' starts an initialization cycle

●A single '10' opcode (Read ID) leads to reading the ID out of the EEPROM memory. This is suitable to check the

programmed user data if the memory is not locked already. The opcode '10' precedes all downlink operations for

writing data into the EEPROM

●The opcode '11' reads the upper bytes when ID length (bit 8 of byte 16) is set to '0'

If ID length is set to '1' opcode '11' is the same than opcode '10'

●The Write Byte requires the opcode '10', a '0' bit, 8 data bits and the 5-bit address (16 bits total)

●For Direct access, the opcode '10', a '0' bit and a 5-bit address (8 bits total), is required

Note: The data bits are read in the same order as written.

Figure 5-3. Complete Write Sequence

Table 5-3. Downlink Data Decoding Scheme

Parameter Remark Symbol Min. Typ. Max. Unit

Start gap Sgap 815 50 TC

Write gap Wgap 810 20 TC

Write data coding

(gap separation)

0 data d018 25 33 TC

1 data d150 58 65 TC

Note: All absolute times are given under the assumption TC = 1/fC = 8µs (fC = 125kHz)

Write mode Read modeRead mode

ProgrammingByte addressByte data

Start gap

Configuration

POR

Opcode

‘0’

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5.5 Programming

When all necessary information has been received by the ATA5575M2, programming may proceed. There is a clock delay

between the end of the writing sequence and the start of programming.

Typical programming time is 5.6ms. This cycle includes a data verification read to grant secure and correct programming.

After programming is successfully executed, the ATA5575M2 enters byte-read mode, transmitting the byte just programmed.

If the command sequence is validated, the new data is programmed into the EEPROM memory.

Each programming cycle consists of four consecutive steps: erase byte, erase verification (data = 0), programming,

programming verification (corresponding data bits = 1).

Figure 5-5. Coil Voltage after Programming a Byte

Figure 5-4. ATA5575M2 Command Formats

Write byte 1001 Data 8 4 Addr 0

Direct access 1004 Addr 0

Read ID 1 0

Read upper bytes 1 1

Reset command 0 0

Read programmed

memory byte Read ID Read ID5.6ms

(Regular read mode)(Byte read mode)Programming and

data verification

Write data to tag

VCoil 1 - Coil 2

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6. Error Handling

Several error conditions can be detected to ensure that only valid bits are programmed into the EEPROM. There are two

error types which result into two different actions.

6.1 Errors During Command Sequence

The following detectable errors could occur when sending a command sequence to the Atmel® ATA5575M2:

●The wrong number of field clocks between two gaps (i.e., not a valid 1 or 0 pulse stream)

●The number of bits received in the command sequence is incorrect

6.2 Errors Before/During Programming of EEPROM

If the command sequence was received successfully, the following errors may still prevent programming:

●The lock bits of the memory are already set

●If the memory is locked, programming is not possible. The Atmel ATA5575M2 enters byte-read mode, continuously

transmitting the currently addressed byte.

●If a data verification error is detected after programming of an executed data byte, the tag will stop modulation

(modulation defeat) until a new command is transmitted.

Table 6-1. Bit Counts of Command Sequences

Command Number of Bits

Write byte 16

Direct access 8

Read ID 2

Read upper bytes 2

Reset command 2

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Figure 6-1. Atmel ATA5575M2 Functional Diagram

Byte-read mode

Program and verify

Write

Check Write protection

Check Number of bits

Command decode

Start

gap

Write

OP(1p)

Reset

Modulation

defeat

fail data = unchanged

Gap

Command mode

Read ID

Set-up modes

Power-on reset

Regular-read mode /

Read dummy data

okData verification failed data = new

Read ID

Read upper bytes

OP (00)

Gap

OP(10) Read ID

OP(11) Read upper bytes

OP(10) Direct access

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Figure 6-2. Example of Differential Bi-phase Coding with Data Rate RF/32

Data rate =

64 Field Clocks (FC)

16 FC

Data stream

RF-field

Modulator signal

Bi-phase coded

16 FC

00110

111

116 17

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Figure 6-3. Example of FSK2 Coding with Data Rate RF/50, Subcarrier f0= RF/10, f1=RF/8

100110

10 18

Data rate =

50 Field Clocks (FC)

Data stream

RF-field

= RF/10,

f1 = RF/8

Modulator signal

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7. Examples for Programming the ATA5575M2

Animal ID is a typical application with ISO11784/11785. The following describes the data structure of an FDX-B telegram

and a flow for programming ATA5575M2 using sample data.

Figure 7-1. ATA5575M2: Structure of the ISO 11785 FDX-B Telegram

Notes:

●Except for the header, every 8 bits are followed by one control bit (1), to prevent the header from recurring.

●All data is transmitted LSB first.

●Country codes are defined in ISO 3166

●The bits reserved for future use (RFU) are all set to 0.

●If the data block flag is not set, the trailer bits are all set to 0.

●CRC is performed on the 64-bit identification code without the control bits. The generator polynomial is

P(x) = x16 +x

12 +x

5+ 1. Reverse CRC-CCITT (0x 8 408) is used. The data stream is LSB first.

Example data for programming Atmel ATA5575M2 in FDX-B mode:

●Animal flag: 1

●RFU: 0

●Data block flag: 0

●Country code: 999

●Unique number: 123456789

●Trailer: 0

Header Identification Code CRC Trailer

11 8 x (8+1) 2 x (8+1) 3 x (8+1)Bits

1 ... ... ...11 12 8320... ... 84 101 102 128

11b fixed

00000000001

LSB MSB

MSB LSB

Animal Flag

RFU 7b RFU 7b Country Code 8b

Data Block Flag

Country Code

Unique

Number 6b Unique Number 8b Unique Number 8b Unique Number 8b Unique Number 8b

83 1220

RFU 14b Country Code 10b Unique Number 38b

Control bit '1'

64b Identification Code

+8b

16b CRC

+2b

24b Trailer all '0'

+3b

Control bit '1'

Bit No.

Bit No. ... ...

LSB MSB

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Table 7-1. Atmel ATA5575M2: Programming with FDX-B Example Data

Base Station Atmel ATA5575M2

Field on for t = 5ms POR and regular-read mode

Command 00 Reset

Command 10 0 0000 1001 10000 Programming byte 16 with ‘09h’ (FDX-B mode,

memory reprogrammable)

Command 10 0 0000 0000 00000 Programming byte 0 with ‘00h’

Command 10 0 0011 0101 00001 Programming byte 1 with ‘35h’

Command 10 0 0001 1011 00010 Programming byte 2 with ‘1Bh’

Command 10 0 0011 1110 00011 Programming byte 3 with ‘3Eh’

Command 10 0 1101 0111 00100 Programming byte 4 with ‘D7h’

Command 10 0 1000 0010 00101 Programming byte 5 with ‘82h’

Command 10 0 0000 0111 00110 Programming byte 6 with ‘07h’

Command 10 0 1001 1111 00111 Programming byte 7 with ‘9Fh’

Command 10 0 1000 0000 01000 Programming byte 8 with ‘80h’

Command 10 0 0100 0000 01001 Programming byte 9 with ‘40h’

Command 10 0 0110 1110 01010 Programming byte 10 with ‘6Eh’

Command 10 0 1001 1000 01011 Programming byte 11 with ‘98h’

Command 10 0 1010 1000 01100 Programming byte 12 with ‘A8h’

Command 10 0 0000 0100 01101 Programming byte 13 with ‘04h’

Command 10 0 0000 0010 01110 Programming byte 14 with ‘02h’

Command 10 0 0000 0001 01111 Programming byte 15 with ‘01h’

Command 10 Read ID

Field on for t = 50ms

Read and verify FDX-B data Send FDX-B data

Command 10 0 0110 1001 10000 Programming byte 16 with ‘69h’

(FDX-B mode, memory locked)

Command 00 Reset

Field on for t = 50ms

Read and verify FDX-B data Send FDX-B data

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8. Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating

only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this

specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Parameters Symbol Value Unit

Maximum DC current into Coil1/Coil2 Icoil 20 mA

Maximum AC current into Coil1/Coil2

f = 125kHz Icoil p 20 mA

Power dissipation (dice) (free-air condition, time of

application: 1s) Ptot 100 mW

Electrostatic discharge maximum to ANSI/ESD-STM5.1-2001

standard (HBM) Vmax 2000 V

Operating ambient temperature range Tamb –40 to +85 °C

Storage temperature range Tstg –40 to +150 °C

Note: For data retention please refer to Section 9. “Electrical Characteristics” on page 16.

9. Electrical Characteristics

Tamb = +25°C; fcoil = 125kHz; unless otherwise specified

No. Parameters Test Conditions Symbol Min. Typ. Max. Unit Type*

1RF frequency range fRF 100 125 150 kHz

2.1

Supply current (without

current consumed by the

external LC tank circuit)

Tamb = 25°C (1) IDD 1.5 3µA T

2.2 Read – full temperature

range 2 5 µA Q

2.3 Programming – full

temperature range 25 µA Q

3.1 Coil voltage (AC supply)

Read mode and write

command 2) Vcoil pp 6 Vclamp V Q

3.2 Program EEPROM(2) 16 Vclamp V Q

4Start-up time Vcoil pp = 6V tstartup 1.1 ms Q

5.1 Clamp 3mA current into Coil1/2 Vpp 15 18 21 V T

5.2 20mA current into Coil1/2 Vpp 17 20 24 V T

6.1

Modulation parameters

3mA current into Coil1/2

and modulation ON Vpp 2 3 4 V T

6.2 20mA current into Coil1/2

and modulation ON Vpp 4.5 58.5 V T

6.3 Thermal stability of

modulation parameter Vp/Tamb –1 mV/°C Q

*) Type means: T: directly or indirectly tested during production; Q: guaranteed based on initial product qualification data

Notes: 1. IDD measurement setup: EEPROM programmed to 00 ... 000 (erase all); chip in modulation defeat.

2. Current into Coil1/Coil2 is limited to 10mA.

3. Since the EEPROM performance is influenced by assembly processes, Atmel cannot confirm the parameters for -DDW

(tested die on unsawn wafer) delivery.

4. See Section 10. “Ordering Information” on page 18.

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7.1 Clock detection level Vcoil pp = 8V Vclkdet 400 550 750 mV T

7.2 Gap detection level Vcoil pp = 8V Vgapdet med 400 550 750 mV T

8Programming time

From last command gap

to re-enter read mode

(64 + 648 internal clocks)

Tprog 55.7 6ms T

9Endurance Erase all/Write all(3) ncycle 100000 Cycles Q

10.1

Data retention

Top = 55°C(3) tretention 10 20 50 Years Q

10.2 Top = 150°C(3) tretention 96 hrs T

10.3 Top = 250°C(3) tretention 24 hrs Q

11.1 Resonance capacitor Mask option(4)

Vcoil pp = 1V Cr

320 330 340 pF T

11.2 242 250 258

9. Electrical Characteristics (Continued)

Tamb = +25°C; fcoil = 125kHz; unless otherwise specified

No. Parameters Test Conditions Symbol Min. Typ. Max. Unit Type*

*) Type means: T: directly or indirectly tested during production; Q: guaranteed based on initial product qualification data

Notes: 1. IDD measurement setup: EEPROM programmed to 00 ... 000 (erase all); chip in modulation defeat.

2. Current into Coil1/Coil2 is limited to 10mA.

3. Since the EEPROM performance is influenced by assembly processes, Atmel cannot confirm the parameters for -DDW

(tested die on unsawn wafer) delivery.

4. See Section 10. “Ordering Information” on page 18.

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10. Ordering Information

10.1 Available Order Codes

Atmel ATA5575M2330-DDB

Atmel ATA5575M2330-DBB

Atmel ATA5575M2330-DBQ

New order codes will be created by customer request if order quantities exceed 250k pieces.

10.2 ATA5575M2 Configuration on Delivery

On delivery Atmel’s production information is stored in EEPROM with the FDX-B data structure as described in Figure 7-1 on

page 14.

The user data contains Atmel’s lot and production information as described in Table 10-2. With 38 bits, 12 decimals in the

range from 0 to 274 877 906 943 can be formed. The following Atmel production information is stored within these 12

decimal places.

ATA5575M2 ccc -xxx Package Drawing

DDB 6” sawn wafer on foil with ring, thickness 150µm

(approx. 6mil) Figure 11-1 on page 21

DBB 6” sawn wafer on foil with ring and gold bumps 25µm,

thickness 150µm (approx. 6mil) Figure 11-2 on page 22

DBQ Die in blister tape with gold bumps 25µm,

thickness 280µm Figure 11-3 on page 23

On-chip Capacity Value in pF

250 (planned)

330

33A DBB 6” sawn wafer on foil 25µm, thickness 280µm (11mil) Figure 11-4 on page 24

Table 10-1. ATA5575M2: Configuration on Delivery

Byte Address Value Comment

User data byte 0 to byte 15 0b 0 0000 to 0b 0 1111 Variable data Unique ID within a FDX-B telegram

Configuration (byte 16) 0b 1 0000 0x 09 Send FDX-B telegram with user data

byte 0 to byte 15

Table 10-2. Atmel ATA5575M2: Meaning of the Digits of Unique Number in Delivery State

Decimal 11 10, 9 8 7 6 5, 4, 3, 2 1, 0

Denotation Header CID ICR Y Q NNNN Wafer#

Range [dec] 1 (fixed) 1-99 0-9 0-9 1-4 0-9999 1-25

For example 104 0 9 1 0164 12

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Notes:

●First decimal Header is always fixed at ‘1’

●CID denotes the chip ID and is set to ‘4’ for Atmel® ATA5575M2

●ICR stands for the revision and/or foundry version of the IC

●YQNNNN gives the Atmel lot information

●Y: alphanumeric 0, …, 9

●Q: Characters F, G, H and J - are transformed to 1, …, 4

●NNNN: Alphanumeric consecutive number 0, …, 9999

●Wafer# describes a lot's wafer numbers; alphanumeric 1, …, 25

The Unique Number will then calculated to:

Unique Number = Header × 1011 + CID × 109 + ICR × 108 + Y × 107 + Q × 106 + NNNN × 102 + Wafer#

For the example given in Table 10-2 on page 18 the Unique Number is 104 091 016 412

With the 24 trailer bits 8 decimals in the range 0 to 16 777 216 can be established. The following Atmel production

information is stored within these 8 decimal places.

Notes:

●The first 3 decimals of the Header are always fixed: '111'

●Die on wafer (DW): Consecutive number of die on wafer: 1 to 99 999

The Trailer is then calculated to:

Trailer = Header × 105 + DW

With the example given in Table 10-3 the Trailer is 11 109 127

Table 10-3. Atmel ATA5575M2: Meaning of the Digits of Trailer Bits in Delivery State

Decimal 7, 6, 5 4, 3, 2, 1, 0

Denotation Header Die-on-wafer no. (DW)

Range [dec] 111 (fixed) 0 to 99 999

For example 111 09 127

ATA5575M2 [DATASHEET]

9217F–RFID–12/14

10.2.1 ATA5575M2 Example for Memory Content on Delivery

The following describes an example of the memory content after Atmel’®s production.

●CID: 4

●ICR: '00b'

●Lot number: 9F0164

●Wafer number: 12

●Die on wafer: 9.127

Unique Number = 1 × 1011 + 4 × 109 + 0 × 108 + 9 × 107 + 1 × 106 + 0164 × 102 +

12 = 104 091 016 412

Trailer = 111 × 105 + 9,127 = 11 109 127

With the sample data above the FDX-B telegram fields are:

●Animal flag ( 1 bit) = ‘1b’ fixed

●RFU (14 bit) = ’00 0000 0000 0000b’ fixed

●Data block flag (1 bit) = ‘0b’ fixed

●Country code (10 bit) = 999 (= '11 1110 0111b') fixed

●Unique number (38 bit) = 104 091 016 412

●CRC (16 bit) = 39 505

●Trailer (24 bit) = 11 109 127

Table 10-4. ATA5575M2: Example of Memory Content on Delivery

Byte# 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Meaning Header

Header/

Unique

Number

Unique

number

Unique

number

Unique

number

Unique

number

Unique

number/

Country

Code

Country

code

Data

Block

Flag/

RFU

RFU/

Animal

Flag/

CRC

CRC CRC/

Trailer Trailer Trailer Trailer Confi-

guration

Value

[hex] 00 27 73 BB 94 F2 37 9F 80 40 71 55 9F 07 07 2B 09

ATA5575M2 [DATASHEET]

9217F–RFID–12/14

11. Package Information

Figure 11-1. 6” Wafer on Foil with Ring

Package Drawing Contact:

packagedrawings@atmel.com

GPC DRAWING NO.

REV. TITLE

9.920-6716.01-4 3

01/18/11

Dimensions

ATA5575MYxxxC-DDB

1330

250

330

2250

Option

xxx

20:1

Die Dimensions

Dimensions in mm

specifications

according to DIN

technical drawings

Orientation on frame

Ø 227.7

212

Ø194.5

Ø150

212

87.5

86.5

Wafer ATA5575MYxxx-DDB

6" Wafer frame, plastic

thickness 2.5mm

UV Tape Adwill D176

Label:

Qty:

Wafer no:

Lot no:

Prod: ATA5575MYxxx-DDB

59.5 63.6

AØ3

0.15±0.012

0.966

0.402

0.4

(0.08)

0.326

0.04 × 45°

(0.08) 0.21

0.2

0.946

C2 C1

ATA5575M2 [DATASHEET]

9217F–RFID–12/14

Figure 11-2. 6” Wafer on Foil with Ring and Gold Bumps 25µm

Package Drawing Contact:

packagedrawings@atmel.com

GPC DRAWING NO.

REV. TITLE

9.920-6716.02-4 3

01/18/11

Dimensions

ATA5575MYxxx-DBB

20:1

Die Dimensions

Dimensions in mm

specifications

according to DIN

technical drawings

Orientation on frame

Ø 227.7

212

Ø194.5

Ø150

212

87.5

86.5

Wafer ATA5575MYxxx-DBB

6" Wafer frame, plastic

thickness 2.5mm

UV Tape Adwill D176

Label:

Qty:

Wafer no:

Lot no:

Prod: ATA5575MYxxx-DBB

59.5 63.6

AØ3

0.966

0.402

0.4

(0.08)

0.326

0.04 × 45°

(0.08) 0.21

0.2

0.946

C2 C1

0.155±0.014

0.025±0.005

0.15±0.012

0.175±0.017

(Au bump)

0.005±0.002

(BCB coating)

1 330

250

330

2 250

Option

xxx

ATA5575M2 [DATASHEET]

9217F–RFID–12/14

Figure 11-3. Die in Blister Tape with Gold Bumps 25µm

Package Drawing Contact:

packagedrawings@atmel.com

GPC DRAWING NO.

REV. TITLE

9.800-5108.01-4 2

04/03/12

Dimensions

ATA5575MYxxx-DBQ

specifications

according to DIN

technical drawings

20:1

Die Dimensions

C2 C1

(BCB coating)

0.285±0.0135

0.005±0.0015

(Au bump)

0.025±0.005

0.305±0.017

0.28±0.012

8.4

reel Ø330

Ø1.55

(0.08)

0.946

0.21

0.2

41.2

0.47

0.25

(0.08)

0.4

3.5

1.2

0.402

0.966

0.326

0.04 × 45°

’’X’’

Label acc. ’’Packaging and Packing Spec.’’

cover tape

carrier tape

Specification Tape and reel

Dimensions in mm

Packing acc. IEC 60286-3

1 330

250

330

2 250

Option

xxx

ATA5575M2 [DATASHEET]

9217F–RFID–12/14

Figure 11-4. 6” Sawn Wafer on Foil 25µm

Package Drawing Contact:

packagedrawings@atmel.com

GPC DRAWING NO.

REV. TITLE

9.920-6716.03-4 1

12/02/14

Chip Dimensions

ATA5575MYxxx-DDB

Dimensions in mm

specifications

according to DIN

technical drawings

20:1

Die Dimensions

Orientation on frame

(0.08)

212

87.5

86.5

0.4

0.966

0.402

Wafer ATA5575MYxxx-DBB

6" Wafer frame, plastic

thickness 2.5mm

UV Tape Adwill D176

Label:

Qty:

Wafer no:

Lot no:

Prod: ATA5575MYxxx-DBB

Ø 227.7

Ø 150

Ø 194.5

Ø3

0.946

0.21

0.326

59.5 63.6

212

0.04x45°

0.2

(0.08)

0.285±0.0135

0.025±0.005

0.28±0.012

0.305±0.017

0.005±0.0015

(BCB coating)

(Au bump)

33A

Option

xxx

Option

ATA5575M2 [DATASHEET]

9217F–RFID–12/14

12. Revision History

Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this

document.

Revision No. History

9217F-RFID-12/14 • Section 10 “Ordering Information” on page 18 updated

• Figure 11-4 “6” sawn wafer on foil 25µm” on page 24 added

9217E-RFID-06/14 • Put datasheet in the latest template

9217D-RFID-04/13 • Section 10 “Ordering Information” on page 18 updated

• Section 11 “Package Information” on page 23 updated

9217C-RFID-12/11 • Set datasheet from Preliminary to Standard

9217B-RFID-05/11

• Section 1 “Description” on page 1 changed

• Section 4 “Analog Front End (AFE) on pages 3 to 4 changed

• Section 5 “Operating the Atmel ATA5575M2” on pages 5 to 9 changed

• Section 6.2 Errors Before/During Programming of EEPROM” on page 11 changed

• Section 8 “Absolute Maximum Ratings” on page 16 changed

• Section 9 “Electrical Characteristics” on page 16 changed

• Section 10.2 “Atmel ATA5575M2 Configuration on Delivery” on pages 18 to 19 changed

XXX

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