HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6332
Issued Date : 1995.05.18
Revised Date : 2002. 04.11
Page No. : 1/3
HMPSA27 HSMC Product Specification
HMPSA27
NPN SILICON TRANSISTOR
Description
The HMPSA27 is designed for darlington amplifier high current gain
collector current to 500mA.
Absolute Maximum Ratings
• Maximum Temperatures
Storage Te mper ature............................................................................................ -55 ~ +150 °C
Junction Temper ature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 60 V
VCES Collector to Emitter Voltage ...................................................................................... 60 V
VEBO Collector to Emitter Voltage...................................................................................... 10 V
IC Collector Current........................................................................................................ 500 mA
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 60 - - V IC=100uA, IE=0
BVCES 60 - - V IC=100uA, VBE=0
BVEBO 10 - - V IE=10uA, IC=0
ICBO - - 100 nA VCB=50V, IE=0
IEBO - - 100 nA VEB=10V, IC=0
ICES - - 500 nA VCE=50V
*VCE(sat) - - 1.5 V IC=100mA, IB=0.1mA
VBE(on) - - 2 V VCE=5V, IC=100mA
*hFE1 10K - - VCE=5V, IC=10mA
*hFE2 10K - - VCE=5V, IC=100mA
*Pulse Test: Pulse Width ≤380us, Dut y Cycle≤2%
TO-92
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6332
Issued Date : 1995.05.18
Revised Date : 2002. 04.11
Page No. : 2/3
HMPSA27 HSMC Product Specification
Characteristics Curve
Current Gai n & Collect or Current
10000
100000
10 100 1000
Collector Curren t-I
C
(mA)
hFE
25oC75oC
125oC
hFE @ VCE=5V
Satur ati on Voltage & Collector Current
100
1000
10000
1 10 100 1000
Coll e c tor Cur r e nt-I
C
(mA)
Saturation Voltage (mV)
25oC
75oC
125oC
VCE(sat) @ I C=1000IB
ON Voltage & Collector Current
100
1000
10000
1 10 100 1000
Collector Curren t-I
C
(mA)
O N Voltage (mV)
25oC
75oC
125oC
VBE(ON) @ VCE=5V
Safe Oper atin g Ar ea
1
10
100
1000
10000
1 10 100
Forward Voltag e- V
CE
(V)
Collector Current-I
C
(mA)
P
T
=1ms
P
T
=100ms
P
T
=1s
Capa ci tance & Reverse-Biased Volta ge
1
10
0.1 1 10 100
R everse- Biased Voltage (V)
Capacitanc e (pF)
Cob
PD-Ta
0
100
200
300
400
500
600
700
0 50 100 150 200
Amb ien t T em per a t ure-Ta (
o
C)
Power Dissipat ion- PD (m W)
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6332
Issued Date : 1995.05.18
Revised Date : 2002. 04.11
Page No. : 3/3
HMPSA27 HSMC Product Specification
TO-92 Dimension
*: Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max. DIM Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56 α1-*5°-*5°
E - *0.0500 - *1.27 α2-*2°-*2°
F 0.1323 0.1480 3.36 3.76 α3-*2°-*2°
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controll i ng dimensi on: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any questi on with packi ng specifi cation or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 All oy; solder pl ating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its produc ts without not ic e.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any cons equence of cust om er product design, infringement of patents, or applicat ion assistance.
Head Office And Factory:
• Head Office (Hi-Sincerit y Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industri al Pa rk Hsi n-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
31
A
D
B
C
Iα1
E
F
α2
α3
G
H
2
Style: Pin 1.Emitter 2.Base 3.Collector
3-Lead TO-92 Plastic Package
HSMC Packa
g
e Code:
A
Marking:
HS
2A7
Date Code Control Code
PM
