
GaAs Flip Chip PIN
Rev. V9
MA4GP907
4
4
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DC-0007455
4
Cleanliness
This device should be handled in a clean
environment. The chip is resistant to solvents and
may be cleaned using approved industry standard
practices and chemicals.
Static Sensitivity
Gallium Arsenide PIN diodes are ESD sensitive and
can be damaged by static electricity. Proper ESD
handling techniques should be used in a static-free
environment. These devices are rated Class 0 HBM
per MIL-STD-883, method 3015.7.
General Handling
The die has a polymer layer which provides scratch
protection for the junction area and the anode air
bridge. Die can be handled with plastic tweezers or
picked and placed with a #27 tip vacuum pencil.
Assembly Requirements
Electrically Conductive Silver Epoxy:
The MA4GP907 is designed to be inserted onto hard
or soft substrates with the junction/pad side down. It
can be mounted onto a silk-screened circuit using
electrically conductive silver epoxy which is approxi-
mately 1 - 2 mils thick and cured at approximately
90°C to 150°C per manufacturer’s schedule. For
extended cure times, >30 minutes, temperatures
must be kept below 200°C.
Solder Die Attached:
The MA4GP907 and the MA4AGP907 (AlGaAs) PIN
diode, which both employ the same contact pad
metalization scheme (T-W-Au), must use a solder
that contains <30% Sn by weight for a reliable die
attach to a circuit. An example is a eutectic
80Au/20Sn.
Tin rich solders (>30% Sn by weight) are not
recommended as they will scavenge the gold on the
contact pads, exposing the tungsten metalization
beneath and creating a poor solder connection.
Note:
For an AlGaAs solderable PIN diode version (with
Cu-Ni-Au contact pads) where both 60Sn/40Pb (non
RoHS) and 96Sn/4Ag (RoHS) type solders can be
used, please refer to MACOM’s MAPD-000907-
14020.